WO2013159713A1 - Method for preparing silicon dioxide block layer for group i-iii-iv compound solar cell - Google Patents
Method for preparing silicon dioxide block layer for group i-iii-iv compound solar cell Download PDFInfo
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- WO2013159713A1 WO2013159713A1 PCT/CN2013/074695 CN2013074695W WO2013159713A1 WO 2013159713 A1 WO2013159713 A1 WO 2013159713A1 CN 2013074695 W CN2013074695 W CN 2013074695W WO 2013159713 A1 WO2013159713 A1 WO 2013159713A1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 33
- 150000001875 compounds Chemical class 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 20
- 235000012239 silicon dioxide Nutrition 0.000 title claims abstract description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 22
- 230000032683 aging Effects 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 89
- 230000004888 barrier function Effects 0.000 claims description 40
- 239000012298 atmosphere Substances 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 15
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 14
- -1 alkyl orthosilicate Chemical compound 0.000 claims description 13
- 108010025899 gelatin film Proteins 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical group CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 125000005842 heteroatom Chemical group 0.000 abstract description 7
- ZFSFDELZPURLKD-UHFFFAOYSA-N azanium;hydroxide;hydrate Chemical compound N.O.O ZFSFDELZPURLKD-UHFFFAOYSA-N 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 2
- 238000007171 acid catalysis Methods 0.000 abstract 1
- 238000010923 batch production Methods 0.000 abstract 1
- 238000003892 spreading Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 18
- 239000000499 gel Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 12
- 239000011148 porous material Substances 0.000 description 9
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000017 hydrogel Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000011240 wet gel Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005516 deep trap Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
- C09D1/02—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/213—SiO2
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/425—Coatings comprising at least one inhomogeneous layer consisting of a porous layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/113—Deposition methods from solutions or suspensions by sol-gel processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the invention belongs to the field of solar cells, and particularly relates to a method for preparing a silicon dioxide barrier layer for a solar energy battery of a group I-III-IV compound.
- I-III-VI compound solar cells are deposited on sodium-containing glass at a temperature of about 550 °C.
- the efficiency of copper indium gallium selenide (CIGS) solar cells using glass substrates was recorded as 19.9%.
- the I-III-VI compound solar cell prepared on the flexible substrate usually uses stainless steel as the substrate, mainly because the stainless steel is resistant to high temperature and can be heated to above 1000 ° C; and its expansion coefficient and expansion of CIGS battery material. The ratio is similar, which ensures better adhesion between the substrate and the battery, and higher efficiency.
- a barrier layer must be added to it, one can prevent each series battery from being turned on by the substrate;
- the hetero atoms such as Fe and Cr enter the absorption layer by thermal diffusion.
- the diffusion of heteroatoms such as Fe in a stainless steel substrate has a large influence on the performance of the semiconductor device.
- a small amount (less than 6.65%) of Fe doping can form Fe Cu (FeInSe 2 ), Fe ln (CuFeSe 2 ) and other substitution defects in CIGS, and the deep level defect Fe Cu existing in the battery film will be effective.
- the composite center increases the in-body recombination of the battery absorption layer, greatly reduces carrier mobility and lifetime, and reduces battery efficiency.
- the materials mainly used as the barrier layer are SiO x and ⁇ 1 2 0 3 , and the overall performance of SiO x is superior in terms of cost and barrier efficiency. Since the thickness of the barrier layer is limited (generally 3 ⁇ ), there will always be a considerable amount of hetero atoms such as Fe diffusing into the absorption layer, which lowers the battery efficiency. Therefore, the highest efficiency of the CIGS battery based on stainless steel is 17.4% compared to glass. There is still a gap in the efficiency of the substrate's CIGS battery record of 19.9%.
- the invention provides a method for preparing a silica barrier layer for a group I-III-IV compound solar cell with better barrier effect, which comprises the following steps:
- the acid catalyzed solution of the alkyl orthosilicate is placed for 0.5-6 h, and then a NH 4 OH solution is added, or an aqueous solution of NH 4 OH and an alcohol are added to obtain a silica sol, wherein the alkyl orthosilicate, the alcohol, the H 2 0
- the molar ratio of the acid to the acid is 1: (3 ⁇ 9): (1 - 6): (0.001 - 0.1), and the molar ratio of NH 4 OH to acid is 1: 1 ⁇ 4: 1 ;
- the medium after coating the silica sol is continuously aged in an alcohol atmosphere for 5 to 75 minutes, and then immersed in Aging in an alcohol solution to obtain an aged gel film;
- the aged gel film is heated and dried at a heating rate of 10 to 180 ° C / s, and is heated to 150 to 500 ° C for 10 to 75 minutes to obtain a silica barrier layer for the I-III-IV compound solar cell.
- the preparation method of the silica barrier layer for the solar cell of the group I-III-IV compound of the invention has simple process equipment and low process temperature, and can effectively control the microstructure of the film.
- the silicon dioxide barrier layer is compared with the same thickness of the silicon dioxide barrier layer, and the diffusion path is increased due to the presence of the pores, and the cross-sectional area is decreased, thereby increasing the barrier efficiency of the barrier layer, making the absorption layer of the I-III-IV compound solar cell difficult. Under the influence of substrate hetero atom diffusion.
- Figure 1 is a schematic view showing the structure of a silicon dioxide barrier layer for a Group I-III-IV compound solar cell according to an embodiment of the present invention
- Fig. 2 is a scanning electron micrograph of a silicon dioxide barrier layer for a group I-III-IV compound solar cell prepared in Example 1 of the present invention.
- the embodiment of the present invention is achieved by providing a method for preparing a silicon dioxide barrier layer for a group I-III-IV compound solar cell, which comprises the following steps:
- S01 preparing an acid-catalyzed solution of an alkyl orthosilicate containing a molar ratio of 1: (1 to 5): (0.5 - 3): (0.001 - 0.1) of an alkyl orthosilicate, an alcohol, H 2
- the molar ratio of 0 to acid and acid is in the range of acid : ⁇ , wherein the alcohol is, for example, preferably isopropanol, and the acid is, for example, preferably HCl;
- S05 The aged gel film is heated and dried at a heating rate of 10 to 180 ° C / s, and the temperature is raised to 150 to 500 ° C for 10 to 75 minutes to obtain silicon dioxide for the I-III-IV compound solar cell. Barrier layer.
- the alkyl orthosilicate is preferably methyl orthosilicate and/or tetraethyl orthosilicate.
- the alcohol has a significant inhibitory effect on the hydrolysis and polycondensation process of the silicon source, and preferably uses isopropanol, which has a low boiling point and a high viscosity, and the effect is better than other alcohols.
- step S02 the molar ratio of NH 4 OH to acid, such as HC1, is 1:1 to 4:1.
- acid such as HC1
- the solubility of the silica colloidal particles is increased, and at the same time, the protonated surface charge of the particles is increased, thereby delaying the agglomeration and gelation processes.
- the high pH gel system can produce high porosity, large pore size and high surface area silica barrier layers.
- Off and H 2 0 in the silica sol precursor increase the hardness of the pore walls in the silica barrier layer.
- the molar ratio of NH 4 OH to HCl is from 1.8:1 to 2.2:1.
- the coating may be carried out by any coating method commonly used in the art, such as immersion pulling, spin coating, screen printing, and blade coating, etc., and the coating thickness is required according to the requirements of the I-III-IV compound solar cell device. Control, such as 3 ⁇ .
- step S04 after the silica sol is gelled, it needs to undergo aging for a certain period of time to make the hydrogel hard.
- Gelling and aging can be done at room temperature. In the aging process, the phenomenon of separation of the gel and the moisture layer often occurs, and the phenomenon that the hydrogel produces the detachment phenomenon is usually completed.
- the silica sol is converted into a gel, the hydroxyl group-bearing silica molecular group in the hydrogel skeleton interacts (ie, the surface ⁇ Si-OH group interaction, condensation dehydration and formation of Si-0-Si bond, increase The strength of the skeleton) is further condensed and brought closer, thereby reducing the space in the grid structure and extruding the water contained therein.
- the aging in the present invention is aging in an isopropyl alcohol atmosphere, and immersed in an isopropyl alcohol solution for aging for 1 to 3 days, shortening the aging time and improving the aging effect.
- Step S05 is specifically: drying the aged gel film under nitrogen or an inert gas atmosphere at a heating rate of 10 to 180 ° C / s, and heating to 150 to 500 ° C for 10 to 75 minutes.
- the pore structure of the silica gel is formed due to evaporation of water.
- the skeleton in the hydrogel due to evaporation of water, creates channels that form capillaries.
- the water in the capillary evaporates and overflows, causing the capillary wall to be subjected to the enormous pressure generated by the evaporation of water and continuously close to shrink the gel skeleton due to the solvated particles of the gel network constituting the capillary wall.
- the gel will crack or pulverize during the drying process.
- the outer gel loses water first than the inner gel. Due to the limitation of mass transfer rate, the outer layer moisture concentration is lower than the inner layer concentration. The loss of water shrinkage of the outer gel causes the outer gel to be squeezed into the inner gel whose volume has not changed, causing cracks and deformation. Therefore, controlling the appropriate heating rate can avoid cracking and deformation.
- the temperature increase rate is from 20 ° C to 30 ° C / s.
- the conditions for the heating and drying process are closely related to the aforementioned acid-base environment, water content and aging conditions.
- the I-III-IV compound solar cell solar cell is also used.
- the barrier layer is annealed.
- the annealing treatment can make the structure of the silicon dioxide barrier layer more dense.
- the annealing treatment refers to placing the silicon dioxide barrier layer of the I-III-IV compound solar cell into an electric resistance furnace, a tube furnace, a muffle furnace, a rapid heat treatment furnace or other heating furnace at 250 to 800°. Annealing under C for a duration of 10 min ⁇ 3 h.
- the silicon-blocking layer of the I-III-IV compound solar cell is annealed in a mixed gas atmosphere of nitrogen or an inert gas and hydrogen for a duration of 0.5 min to 1 h, wherein nitrogen or The volume ratio of inert gas to hydrogen is 4:1 to 49:1.
- the method for preparing a silicon dioxide barrier layer for a group I-III-IV compound solar cell according to an embodiment of the present invention has a porous structure having a porous structure, and a porous structure is obtained from a schematic diagram of the porous barrier structure (Fig. 1). It can increase the diffusion path of heteroatoms, reduce the diffusion area, increase the barrier effect without increasing the thickness of the barrier layer, reduce the hetero atom concentration, and minimize its influence on energy conversion efficiency.
- the viscosity of the alkyl orthosilicate, the pH of the system, the drying temperature and the speed all affect the effect of the barrier layer.
- Example 1 The use of isopropanol to prepare a silica sol facilitates the formation of a network structure of silica colloid and inhibits the polymerization rate. Moreover, the addition of isopropyl alcohol during the heat treatment prevents the silica barrier layer from being cracked by severe thermal stress.
- isopropanol to prepare a silica sol facilitates the formation of a network structure of silica colloid and inhibits the polymerization rate.
- isopropyl alcohol during the heat treatment prevents the silica barrier layer from being cracked by severe thermal stress.
- a mixture of 3 ⁇ 40, HCl and isopropanol was added dropwise to a mixture of tetraethyl orthosilicate (TEOS) and isopropanol to make TEOS: isopropanol: 3 ⁇ 40: HC1
- the molar ratio is 1:3 : 1 : 1.8X 10 -3 ;
- a mixture of 3 ⁇ 40, NH 4 OH and isopropanol is added dropwise to the above solution to make TEOS: isopropanol: 3 ⁇ 40 :
- the molar ratio of HC1:NH 4 OH is 1:3: 4: 1.8 x 10- 3 : 3.6 x 10- 3 , and a silica sol is obtained.
- a silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropyl alcohol atmosphere, and aging was continued for 15 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 1 day.
- the aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere, and the heating rate is 20 ° C / s during the heating process, and is raised to 300 ° C, and then maintained at this temperature for 30 min.
- the silica barrier layer for the I-III-IV compound solar cell as shown in Fig. 2, is a scanning electron micrograph. It can be seen that the barrier layer has a porous structure and is dense and dense.
- a silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropyl alcohol atmosphere, and aging was continued for 75 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 3 days.
- the aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere.
- the heating rate during the heating process is 10 ° C / s, rises to 500 ° C, and then remains at this temperature for 75 min.
- This was placed under a high temperature annealing treatment in a mixed atmosphere of nitrogen and hydrogen, wherein an annealing temperature was 800 ° C for 3 h to obtain a silica barrier layer for the I-III-IV compound solar cell.
- Example 3 Example 3:
- a mixture of 3 ⁇ 40, HCl and isopropanol was added under a rapid stirring of a magnetic stirrer to obtain a molar ratio of TEOS:isopropanol:3 ⁇ 40:HC1. 1:5:3: 0.1; After standing for 6 h, a mixture of H 2 0, NH 4 OH and isopropanol was added dropwise to the above solution to make TEOS: isopropanol: 3 ⁇ 40 : HC1: NH 4 OH The molar ratio is 1: 9: 3: 0.1: 0.4, and the silica sol is obtained.
- a silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropanol atmosphere, and aging was continued for 5 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 1 day.
- the aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere.
- the temperature rise rate during the heating process is 10 ° C / s, rises to 150 ° C, and then remains at this temperature for 10 min.
- This was placed under a high temperature annealing treatment in a mixed atmosphere of nitrogen and hydrogen, wherein an annealing temperature was 250 ° C and a time of 0.5 h to obtain a silica barrier layer for the I-III-IV compound solar cell.
- Example 4 Example 4:
- a mixture of 3 ⁇ 40, HCl and isopropanol was added dropwise to a mixture of tetraethyl orthosilicate (TEOS) and isopropanol to make TEOS: isopropanol: 3 ⁇ 40: HC1
- the molar ratio is 1:3: 1: 5xl0" 2 ;
- a mixture of H 2 0, NH 4 OH and isopropanol is added dropwise to the above solution to make TEOS: isopropanol: 3 ⁇ 40 :
- the molar ratio of HC1:NH 4 OH is 1: 6 : 2 : 2x l0 - 2 : 4x l0 - 2 , obtaining a silica sol.
- a silica sol having a certain viscosity is applied to a clean silicon wafer in an isopropanol atmosphere.
- isopropanol atmosphere Continue to aging in isopropanol atmosphere for 15 min, then immerse in isopropanol solution for 1 day.
- the aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under N 2 atmosphere, and the heating rate is increased during heating.
- the temperature is 20 ° C / s, raised to 300 ° C, and then maintained at this temperature for 30 min, to obtain a silica barrier layer for I-III-IV compound solar cells.
Abstract
A method for preparing a silicon dioxide block layer for a group I-III-IV compound solar cell comprises the following steps: preparing an acid catalysis solution, of ortho-silicic acid alkyl ester, that comprises ortho-silicic acid alkyl ester, ethanol, H2O, and acid, and adding NH4OH water solution or adding NH4OH water solution and ethanol after placement, so as to obtain silica sol; coating the silica sol on a medium, and obtaining a gel membrane after aging; heating and drying the aged gel membrane to obtain a silicon dioxide block layer for a group I-III-IV compound solar cell. The method is simple and is suitable for batch production, and the obtained silicon dioxide block layer can better block heteroatoms on a substrate of the solar cell from spreading.
Description
I-III-IV族化合物太阳能电池用二氧化硅阻隔层的制备方法 技术领域 Method for preparing silicon dioxide barrier layer for I-III-IV compound solar cell
本发明属于太阳能电池领域, 具体涉及一种 I-III-IV族化合物太阳 能电池用二氧化硅阻隔层的制备方法。 The invention belongs to the field of solar cells, and particularly relates to a method for preparing a silicon dioxide barrier layer for a solar energy battery of a group I-III-IV compound.
背景技术 Background technique
通常情况下, I-III-VI族化合物太阳能电池被沉积在含钠的玻璃上, 制备温度约为 550°C。 采用玻璃衬底的铜铟镓硒(CIGS ) 太阳能电池的 效率记录为 19.9%。 Typically, I-III-VI compound solar cells are deposited on sodium-containing glass at a temperature of about 550 °C. The efficiency of copper indium gallium selenide (CIGS) solar cells using glass substrates was recorded as 19.9%.
制备在柔性衬底上的 I-III-VI 族化合物太阳能电池通常采用不锈钢 为衬底, 主要是因为不锈钢耐高温, 可加热至 1000°C以上; 同时其在膨 胀系数方面与 CIGS 电池材料的膨胀率相近, 保证了衬底与电池有比较 好的附着力, 能够获得较高的效率。 使用不锈钢作为衬底时必须要在其 上加一层阻隔层, 一则可以防止各串联电池被衬底导通; 二则可以防止 The I-III-VI compound solar cell prepared on the flexible substrate usually uses stainless steel as the substrate, mainly because the stainless steel is resistant to high temperature and can be heated to above 1000 ° C; and its expansion coefficient and expansion of CIGS battery material. The ratio is similar, which ensures better adhesion between the substrate and the battery, and higher efficiency. When using stainless steel as the substrate, a barrier layer must be added to it, one can prevent each series battery from being turned on by the substrate;
Fe、 Cr等杂原子通过热扩散进入吸收层。 不锈钢衬底中的 Fe等杂原子 的扩散对半导体器件的性能有很大的影响。 少量(低于 6.65% )的 Fe掺 杂在 CIGS中可形成 FeCu(FeInSe2)、 Feln(CuFeSe2)等替位缺陷, 而电池薄 膜体内存在的深能级缺陷 FeCu, 会形成有效的复合中心, 增大电池吸收 层的体内复合, 大大降低载流子迁移率及寿命, 使电池效率降低。 The hetero atoms such as Fe and Cr enter the absorption layer by thermal diffusion. The diffusion of heteroatoms such as Fe in a stainless steel substrate has a large influence on the performance of the semiconductor device. A small amount (less than 6.65%) of Fe doping can form Fe Cu (FeInSe 2 ), Fe ln (CuFeSe 2 ) and other substitution defects in CIGS, and the deep level defect Fe Cu existing in the battery film will be effective. The composite center increases the in-body recombination of the battery absorption layer, greatly reduces carrier mobility and lifetime, and reduces battery efficiency.
目前主要用作阻隔层的材料有 SiOx和 Α1203 , 就成本和阻隔效率而 言 SiOx的综合性能更优。 由于阻隔层厚度有限(一般为 3μιη ) , 始终会 有相当的 Fe等杂原子扩散入吸收层, 使电池效率降低, 因此, 以不锈钢 为衬底的 CIGS电池的最高效率为 17.4% ,相比玻璃衬底的 CIGS电池的 效率记录 19.9%还有一定差距。 At present, the materials mainly used as the barrier layer are SiO x and Α1 2 0 3 , and the overall performance of SiO x is superior in terms of cost and barrier efficiency. Since the thickness of the barrier layer is limited (generally 3μιη), there will always be a considerable amount of hetero atoms such as Fe diffusing into the absorption layer, which lowers the battery efficiency. Therefore, the highest efficiency of the CIGS battery based on stainless steel is 17.4% compared to glass. There is still a gap in the efficiency of the substrate's CIGS battery record of 19.9%.
发明内容 Summary of the invention
提供一种阻隔效果更好的 I-III-IV族化合物太阳能电池用二氧化硅 阻隔层的制备方法, 其包括如下步骤: The invention provides a method for preparing a silica barrier layer for a group I-III-IV compound solar cell with better barrier effect, which comprises the following steps:
配制正硅酸烷基酯的酸催化溶液, 其中包含摩尔比为 1 : (1〜5): (0.5 ~ 3): (0.001 ~ 0.1)的正硅酸烷基酯、 醇、 H20和酸, 其中酸的摩尔比 以酸^ :艮计, 下同; An acid-catalyzed solution of an alkyl orthosilicate containing a molar ratio of 1: (1 to 5): (0.5 to 3): (0.001 to 0.1) of an alkyl orthosilicate, an alcohol, H 2 0 and Acid, wherein the molar ratio of the acid is determined by the acid ^ :艮;
将该正硅酸烷基酯的酸催化溶液放置 0.5 ~ 6h, 然后加入 NH4OH溶 液, 或者加入 NH4OH水溶液和醇, 获得硅溶胶, 其中正硅酸烷基酯、 醇、 H20和酸的摩尔比为 1 : (3 ~ 9): (1 - 6): (0.001 - 0.1) , NH4OH与酸 的摩尔比为 1 : 1 ~ 4: 1 ; The acid catalyzed solution of the alkyl orthosilicate is placed for 0.5-6 h, and then a NH 4 OH solution is added, or an aqueous solution of NH 4 OH and an alcohol are added to obtain a silica sol, wherein the alkyl orthosilicate, the alcohol, the H 2 0 The molar ratio of the acid to the acid is 1: (3 ~ 9): (1 - 6): (0.001 - 0.1), and the molar ratio of NH 4 OH to acid is 1: 1 ~ 4: 1 ;
在醇气氛中将硅溶胶涂覆在介质上; Coating the silica sol on the medium in an alcohol atmosphere;
将涂覆硅溶胶后的介质继续在醇气氛中老化 5 ~ 75min,然后浸泡在
醇溶液中老化, 获得老化的凝胶薄膜; The medium after coating the silica sol is continuously aged in an alcohol atmosphere for 5 to 75 minutes, and then immersed in Aging in an alcohol solution to obtain an aged gel film;
将老化的凝胶薄膜升温干燥,升温速率为 10 ~ 180°C/s,升温至 150 ~ 500°C后保持 10 ~ 75min, 获得 I-III-IV族化合物太阳能电池用二氧化硅 阻隔层。 The aged gel film is heated and dried at a heating rate of 10 to 180 ° C / s, and is heated to 150 to 500 ° C for 10 to 75 minutes to obtain a silica barrier layer for the I-III-IV compound solar cell.
本发明 I-III-IV族化合物太阳能电池用二氧化硅阻隔层的制备方法, 工艺设备简单, 过程温度低, 能够有效的控制薄膜的微观结构。 该二氧 化硅阻隔层对比相同厚度的二氧化硅阻隔层, 由于孔洞的存在使扩散路 径增加而截面积减少, 增加了阻隔层的阻隔效率, 使得 I-III-IV族化合 物太阳能电池吸收层不易受到衬底杂原子扩散的影响。 The preparation method of the silica barrier layer for the solar cell of the group I-III-IV compound of the invention has simple process equipment and low process temperature, and can effectively control the microstructure of the film. The silicon dioxide barrier layer is compared with the same thickness of the silicon dioxide barrier layer, and the diffusion path is increased due to the presence of the pores, and the cross-sectional area is decreased, thereby increasing the barrier efficiency of the barrier layer, making the absorption layer of the I-III-IV compound solar cell difficult. Under the influence of substrate hetero atom diffusion.
附图说明 DRAWINGS
图 1是本发明实施例的 I-III-IV族化合物太阳能电池用二氧化硅阻 隔层的结构示意图; BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a silicon dioxide barrier layer for a Group I-III-IV compound solar cell according to an embodiment of the present invention;
图 2是本发明实施例 1制备的 I-III-IV族化合物太阳能电池用二氧 化硅阻隔层的扫描电镜图。 Fig. 2 is a scanning electron micrograph of a silicon dioxide barrier layer for a group I-III-IV compound solar cell prepared in Example 1 of the present invention.
具体实施方式 detailed description
为了使本发明的目的、 技术方案及优点更加清楚明白, 以下结合附 图及实施例, 对本发明作进一步详细说明。 应当理解, 此处所描述的具 体实施例仅仅用以解释本发明, 并不用于限定本发明。 In order to make the objects, technical solutions, and advantages of the present invention more comprehensible, the present invention will be further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
本发明实施例是这样实现的, 提供一种 I-III-IV族化合物太阳能电 池用二氧化硅阻隔层的制备方法, 其包括如下步骤: The embodiment of the present invention is achieved by providing a method for preparing a silicon dioxide barrier layer for a group I-III-IV compound solar cell, which comprises the following steps:
S01 : 配制正硅酸烷基酯的酸催化溶液, 其中包含摩尔比为 1 : (1〜5): (0.5 - 3): (0.001 - 0.1) 的正硅酸烷基酯、 醇、 H20和酸, 酸的摩尔比以 酸^ :艮计, 其中醇例如优选为异丙醇, 酸例如优选为 HC1; S01 : preparing an acid-catalyzed solution of an alkyl orthosilicate containing a molar ratio of 1: (1 to 5): (0.5 - 3): (0.001 - 0.1) of an alkyl orthosilicate, an alcohol, H 2 The molar ratio of 0 to acid and acid is in the range of acid :艮, wherein the alcohol is, for example, preferably isopropanol, and the acid is, for example, preferably HCl;
S02: 将上述正硅酸烷基酯的酸催化溶液放置 0.5 ~ 6 h, 然后加入 NH4OH溶液, 或者加入 NH4OH水溶液和醇, 获得硅溶胶, 其中正硅酸 烷基酯、醇、 ¾0和酸的摩尔比为 1 : (3 ~ 9): (1 - 6): (0.001 ~ 0.1) , NH4OH 与酸的摩尔比为 1 : 1 ~ 4: 1 ; S02: placing the above acid catalyzed solution of the alkyl orthosilicate for 0.5-6 h, then adding a NH 4 OH solution, or adding an aqueous solution of NH 4 OH and an alcohol to obtain a silica sol, wherein the alkyl orthosilicate, the alcohol, The molar ratio of 3⁄40 to acid is 1: (3 ~ 9): (1 - 6): (0.001 ~ 0.1), and the molar ratio of NH 4 OH to acid is 1: 1 ~ 4: 1 ;
S03 : 在醇气氛中将硅溶胶涂覆在介质上; S03: coating a silica sol on the medium in an alcohol atmosphere;
S04: 将涂覆硅溶胶后的介质继续在醇气氛中老化 5 ~ 75 min, 然后 浸泡在醇溶液中老化, 获得老化的凝胶薄膜; S04: the medium after coating the silica sol is further aged in an alcohol atmosphere for 5 to 75 min, and then immersed in an alcohol solution to obtain an aged gel film;
S05: 将老化的凝胶薄膜升温干燥, 升温速率为 10 ~ 180°C/s , 升温 至 150 ~ 500°C后保持 10 ~ 75 min, 获得 I-III-IV族化合物太阳能电池用 二氧化硅阻隔层。 S05: The aged gel film is heated and dried at a heating rate of 10 to 180 ° C / s, and the temperature is raised to 150 to 500 ° C for 10 to 75 minutes to obtain silicon dioxide for the I-III-IV compound solar cell. Barrier layer.
具体地, 步骤 S01中, 正硅酸烷基酯优选为正硅酸甲酯和 /或正硅酸 乙酯。 醇对硅源的水解和缩聚过程有明显的抑制作用,优选采用异丙醇, 其沸点低, 粘度高, 效果相对于其他醇更好。 Specifically, in the step S01, the alkyl orthosilicate is preferably methyl orthosilicate and/or tetraethyl orthosilicate. The alcohol has a significant inhibitory effect on the hydrolysis and polycondensation process of the silicon source, and preferably uses isopropanol, which has a low boiling point and a high viscosity, and the effect is better than other alcohols.
步骤 S02中, NH4OH与酸, 例如 HC1, 的摩尔比 1 : 1 ~ 4: 1 , 在
较高碱性的条件下, 二氧化硅胶体粒子的溶解度加剧, 同时还将导致粒 子的质子化表面电荷的增加, 从而使团聚和凝胶化过程推延。 高 pH值 凝胶体系可以制备高孔率、 大孔径及高表面积的二氧化硅阻隔层。 但是 二氧化硅溶胶先体中的 Off和 H20 可增加二氧化硅阻隔层中孔壁的硬 度。 因为其微结构中含有 Off和 H20 , 在热处理过程中, 二氧化硅阻隔 层会发生碱硅反应, 该反应使得阻隔层中的孔径和孔率发生变化, 甚至 开裂。 优选地, NH4OH与 HC1的摩尔比为 1.8: 1 ~ 2.2: 1。 In step S02, the molar ratio of NH 4 OH to acid, such as HC1, is 1:1 to 4:1. Under higher alkaline conditions, the solubility of the silica colloidal particles is increased, and at the same time, the protonated surface charge of the particles is increased, thereby delaying the agglomeration and gelation processes. The high pH gel system can produce high porosity, large pore size and high surface area silica barrier layers. However, Off and H 2 0 in the silica sol precursor increase the hardness of the pore walls in the silica barrier layer. Because of its inclusion of Off and H 2 0 in the microstructure, during the heat treatment, an alkali-silicon reaction occurs in the silica barrier layer, which causes a change in pore size and porosity in the barrier layer, and even cracking. Preferably, the molar ratio of NH 4 OH to HCl is from 1.8:1 to 2.2:1.
步骤 S03中, 涂覆可以采用本领域常用的任何涂覆方法, 如浸渍提 拉、 旋涂、 丝网印刷和刮涂等, 涂覆厚度根据 I-III-IV族化合物太阳能 电池器件的需要进行控制, 如 3 μιη。 In step S03, the coating may be carried out by any coating method commonly used in the art, such as immersion pulling, spin coating, screen printing, and blade coating, etc., and the coating thickness is required according to the requirements of the I-III-IV compound solar cell device. Control, such as 3 μιη.
步骤 S04中,硅溶胶胶凝后需经历一定时间的老化,使水凝胶变硬。 胶凝和老化在常温下即可。老化过程中常出现凝胶和水分层的离浆现象, 通常以水凝胶产生离浆现象为老化完成的标志。 硅溶胶转变为凝胶后, 水凝胶骨架中带羟基的二氧化硅分子基团因相互作用 (即表面的≡ Si-OH基相互作用, 缩合脱水并形成 Si-0-Si键, 增大了骨架的强度)会 进一步缩合和靠近, 从而缩小了网架结构中的空间, 并将其中包含的水 份挤出。 本发明中的老化是在异丙醇的气氛中老化, 并浸泡在异丙醇溶 液中老化 1 ~ 3天, 缩短了老化时间, 提高老化效果。 In step S04, after the silica sol is gelled, it needs to undergo aging for a certain period of time to make the hydrogel hard. Gelling and aging can be done at room temperature. In the aging process, the phenomenon of separation of the gel and the moisture layer often occurs, and the phenomenon that the hydrogel produces the detachment phenomenon is usually completed. After the silica sol is converted into a gel, the hydroxyl group-bearing silica molecular group in the hydrogel skeleton interacts (ie, the surface ≡ Si-OH group interaction, condensation dehydration and formation of Si-0-Si bond, increase The strength of the skeleton) is further condensed and brought closer, thereby reducing the space in the grid structure and extruding the water contained therein. The aging in the present invention is aging in an isopropyl alcohol atmosphere, and immersed in an isopropyl alcohol solution for aging for 1 to 3 days, shortening the aging time and improving the aging effect.
步骤 S05具体为, 将老化的凝胶薄膜在氮气或者惰性气体氛围下升 温干燥,升温速率为 10 ~ 180°C/s,升温至 150 ~ 500°C后保持 10 ~ 75 min。 在水凝胶的干燥过程中, 由于水的蒸发, 会形成硅胶的孔结构。 在干燥 过程中, 水凝胶中的骨架由于水蒸发, 产生通道, 形成毛细管。 毛细管 中的水(凹液面)在不断蒸发溢出时, 造成毛细管壁受到水蒸发溢出时产 生的巨大的压力而不断靠拢使凝胶骨架收缩, 由于组成毛细管壁的凝胶 网络的溶剂化微粒之间的排斥力的存在, 又力图维持骨架的原状, 从而 造成硅胶的孔结构的生成; 随着脱水的进行, 凝胶网络骨架不断收缩, 凝胶网络的溶剂化微粒之间的排斥力不断增大, 当毛细压力与排斥力达 到平衡时, 凝胶停止收缩, 其孔结构也就固定下来。 如果凝胶的骨架强 度较小, 骨架变形性大, 则易于得到细孔硅胶: 若骨架强度较大, 骨架 变形性小, 则易于得到粗孔硅胶。 若凝胶的弹性和强度都不足以对抗毛 细压力的作用, 则凝胶在干燥过程中将发生龟裂或粉碎。 在大块水凝胶 干燥时, 实际上是外层凝胶比内层凝胶先失水。 由于传质速度的限制, 会造成外层水分浓度比内层浓度低。 外层凝胶失水收缩会使的外层凝胶 向体积还未发生变化的内部凝胶挤压, 造成龟裂和变形。 因此, 控制合 适的升温速度能够避免龟裂和变形。优选地, 升温速度为 20°C ~ 30°C/s。 升温干燥过程的条件选择与前述的酸碱环境、 含水量以及老化条件密切 相关。 进一步, 优选地, 还将 I-III-IV族化合物太阳能电池用二氧化硅
阻隔层进行退火处理。 退火处理能够使得获得二氧化硅阻隔层结构更加 致密。 所述退火处理是指将 I-III-IV族化合物太阳能电池用二氧化硅阻 隔层放入电阻炉、 管式炉、 马弗炉、 快速热处理炉或其他加热炉具中, 在 250 ~ 800°C下作退火处理, 持续时间为 10 min ~ 3 h。 更优选地, 将 所述 I-III-IV族化合物太阳能电池用二氧化硅阻隔层在氮气或惰性气体 与氢气的混合气体气氛下进行退火处理, 持续时间 0.5 min ~ 1 h, 其中, 氮气或惰性气体与氢气的体积比为 4 : 1〜 49: 1。 Step S05 is specifically: drying the aged gel film under nitrogen or an inert gas atmosphere at a heating rate of 10 to 180 ° C / s, and heating to 150 to 500 ° C for 10 to 75 minutes. During the drying of the hydrogel, the pore structure of the silica gel is formed due to evaporation of water. During the drying process, the skeleton in the hydrogel, due to evaporation of water, creates channels that form capillaries. The water in the capillary (the liquid surface) evaporates and overflows, causing the capillary wall to be subjected to the enormous pressure generated by the evaporation of water and continuously close to shrink the gel skeleton due to the solvated particles of the gel network constituting the capillary wall. The existence of repulsive force tries to maintain the original shape of the skeleton, which leads to the formation of the pore structure of the silica gel. As the dehydration progresses, the gel network skeleton shrinks and the repulsive force between the solvated particles of the gel network increases. Large, when the capillary pressure and the repulsive force are balanced, the gel stops shrinking and the pore structure is fixed. If the skeleton strength of the gel is small and the skeleton deformability is large, it is easy to obtain a fine pore silica gel: If the skeleton strength is large and the skeleton deformability is small, the coarse pore silica gel is easily obtained. If the elasticity and strength of the gel are not sufficient to counteract the capillary pressure, the gel will crack or pulverize during the drying process. When the bulk hydrogel is dried, it is actually the outer gel that loses water first than the inner gel. Due to the limitation of mass transfer rate, the outer layer moisture concentration is lower than the inner layer concentration. The loss of water shrinkage of the outer gel causes the outer gel to be squeezed into the inner gel whose volume has not changed, causing cracks and deformation. Therefore, controlling the appropriate heating rate can avoid cracking and deformation. Preferably, the temperature increase rate is from 20 ° C to 30 ° C / s. The conditions for the heating and drying process are closely related to the aforementioned acid-base environment, water content and aging conditions. Further, preferably, the I-III-IV compound solar cell solar cell is also used. The barrier layer is annealed. The annealing treatment can make the structure of the silicon dioxide barrier layer more dense. The annealing treatment refers to placing the silicon dioxide barrier layer of the I-III-IV compound solar cell into an electric resistance furnace, a tube furnace, a muffle furnace, a rapid heat treatment furnace or other heating furnace at 250 to 800°. Annealing under C for a duration of 10 min ~ 3 h. More preferably, the silicon-blocking layer of the I-III-IV compound solar cell is annealed in a mixed gas atmosphere of nitrogen or an inert gas and hydrogen for a duration of 0.5 min to 1 h, wherein nitrogen or The volume ratio of inert gas to hydrogen is 4:1 to 49:1.
本发明实施例的 I-III-IV族化合物太阳能电池用二氧化硅阻隔层的 制备方法所制备的二氧化硅阻隔层具有多孔结构, 从多孔阻隔结构的示 意图 (图 1 ) 来看, 多孔结构能够增加杂原子的扩散路径, 减少扩散面 积, 在不增加阻隔层厚度的同时, 增加阻隔效果, 减少杂原子浓度, 最 大限度的降低其对能量转换效率的影响。 I-III-IV族化合物太阳能电池用 二氧化硅阻隔层的制备方法中, 正硅酸烷基酯的粘度、 体系的酸碱度、 干燥的温度和速度都会影响阻隔层的效果。 选用异丙醇配制二氧化硅溶 胶有利于二氧化硅胶粒形成网络结构, 抑制了聚合速率。 而且在热处理 时加入异丙醇, 能够防止二氧化硅阻隔层因剧烈的热应力而龟裂。 以下结合具体实施例对本发明的具体实现进行详细描述。 实施例 1 : The method for preparing a silicon dioxide barrier layer for a group I-III-IV compound solar cell according to an embodiment of the present invention has a porous structure having a porous structure, and a porous structure is obtained from a schematic diagram of the porous barrier structure (Fig. 1). It can increase the diffusion path of heteroatoms, reduce the diffusion area, increase the barrier effect without increasing the thickness of the barrier layer, reduce the hetero atom concentration, and minimize its influence on energy conversion efficiency. In the preparation method of the silica barrier layer for the I-III-IV compound solar cell, the viscosity of the alkyl orthosilicate, the pH of the system, the drying temperature and the speed all affect the effect of the barrier layer. The use of isopropanol to prepare a silica sol facilitates the formation of a network structure of silica colloid and inhibits the polymerization rate. Moreover, the addition of isopropyl alcohol during the heat treatment prevents the silica barrier layer from being cracked by severe thermal stress. The specific implementation of the present invention will be described in detail below with reference to specific embodiments. Example 1
在磁力搅拌器的快速搅拌下, 向正硅酸乙酯 (TEOS)与异丙醇的混合 液中滴加 ¾0、 HC1与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0: HC1的摩尔比为 1 : 3 : 1 : 1.8X 10-3; 静置 2 h后向上述溶液中滴加 ¾0、 NH4OH与异丙醇三者的混合物,使 TEOS: 异丙醇: ¾0 : HC1: NH4OH 的摩尔比为 1: 3: 4: 1.8 x 10-3: 3.6 x 10-3 , 获得硅溶胶。 在异丙醇气氛 中将具有一定粘度的硅溶胶涂在清洁的硅片上, 继续在异丙醇气氛中老 化 15 min, 然后浸泡在异丙醇溶液中老化 1天。 经老化的湿凝胶薄膜在 N2气氛下, 在快速热处理炉内快速升温干燥, 升温过程中升温速率为 20°C/s, 升至 300°C , 然后在此温度下保持 30 min, 获得 I-III-IV族化合 物太阳能电池用二氧化硅阻隔层, 图 2为其扫描电镜图, 可以看出阻隔 层具有多孔结构, 均勾且致密。 实施例 2: With a rapid stirring of a magnetic stirrer, a mixture of 3⁄40, HCl and isopropanol was added dropwise to a mixture of tetraethyl orthosilicate (TEOS) and isopropanol to make TEOS: isopropanol: 3⁄40: HC1 The molar ratio is 1:3 : 1 : 1.8X 10 -3 ; After standing for 2 h, a mixture of 3⁄40, NH 4 OH and isopropanol is added dropwise to the above solution to make TEOS: isopropanol: 3⁄40 : The molar ratio of HC1:NH 4 OH is 1:3: 4: 1.8 x 10- 3 : 3.6 x 10- 3 , and a silica sol is obtained. A silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropyl alcohol atmosphere, and aging was continued for 15 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 1 day. The aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere, and the heating rate is 20 ° C / s during the heating process, and is raised to 300 ° C, and then maintained at this temperature for 30 min. The silica barrier layer for the I-III-IV compound solar cell, as shown in Fig. 2, is a scanning electron micrograph. It can be seen that the barrier layer has a porous structure and is dense and dense. Example 2:
在磁力搅拌器的快速搅拌下, 向正硅酸甲酯与异丙醇的混合液中滴 加 ¾0、 HC1 与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0: HC1 的摩尔比为 1 : 1 : 0.5 : l x lO"3;静置 6 h后向上述溶液中滴加 ¾0、NH4OH 与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0 : HC1: NH4OH的摩
尔比为 1: 6: 6: 1 x 10-3: 3 x 10-3, 获得硅溶胶。 在异丙醇气氛中将具有 一定粘度的硅溶胶涂在清洁的硅片上,继续在异丙醇气氛中老化 75 min, 然后浸泡在异丙醇溶液中老化 3天。 经老化的湿凝胶薄膜在 N2气氛下, 在快速热处理炉内快速升温干燥, 升温过程中升温速率为 10°C/s, 升至 500°C, 然后在此温度下保持 75 min, 再将其置于氮气和氢气的混合气 氛下高温退火处理, 其中, 退火温度为 800°C, 时间为 3 h, 获得 I-III-IV 族化合物太阳能电池用二氧化硅阻隔层。 实施例 3: To a mixture of methyl orthosilicate and isopropanol, a mixture of 3⁄40, HCl and isopropanol was added under a rapid stirring of a magnetic stirrer to obtain a molar ratio of TEOS:isopropanol:3⁄40:HC1. 1 : 1 : 0.5 : lx lO"3; After standing for 6 h, a mixture of 3⁄40, NH 4 OH and isopropanol was added dropwise to the above solution to make TEOS: isopropanol: 3⁄40 : HC1: NH 4 OH Erbi is 1: 6: 6: 1 x 10- 3 : 3 x 10- 3 , to obtain a silica sol. A silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropyl alcohol atmosphere, and aging was continued for 75 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 3 days. The aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere. The heating rate during the heating process is 10 ° C / s, rises to 500 ° C, and then remains at this temperature for 75 min. This was placed under a high temperature annealing treatment in a mixed atmosphere of nitrogen and hydrogen, wherein an annealing temperature was 800 ° C for 3 h to obtain a silica barrier layer for the I-III-IV compound solar cell. Example 3:
在磁力搅拌器的快速搅拌下, 向正硅酸甲酯与异丙醇的混合液中滴 加 ¾0、 HC1 与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0: HC1 的摩尔比为 1: 5: 3: 0.1; 静置 6 h后向上述溶液中滴加 H20、 NH4OH 与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0 : HC1: NH4OH的摩 尔比为 1 : 9: 3: 0.1 : 0.4, 获得硅溶胶。 在异丙醇气氛中将具有一定粘 度的硅溶胶涂在清洁的硅片上, 继续在异丙醇气氛中老化 5 min, 然后 浸泡在异丙醇溶液中老化 1天。经老化的湿凝胶薄膜在 N2气氛下,在快 速热处理炉内快速升温干燥,升温过程中升温速率为 10°C/s,升至 150°C, 然后在此温度下保持 10 min, 再将其置于氮气和氢气的混合气氛下高温 退火处理, 其中, 退火温度为 250°C, 时间为 0.5h, 获得 I-III-IV族化合 物太阳能电池用二氧化硅阻隔层。 实施例 4: To a mixture of methyl orthosilicate and isopropanol, a mixture of 3⁄40, HCl and isopropanol was added under a rapid stirring of a magnetic stirrer to obtain a molar ratio of TEOS:isopropanol:3⁄40:HC1. 1:5:3: 0.1; After standing for 6 h, a mixture of H 2 0, NH 4 OH and isopropanol was added dropwise to the above solution to make TEOS: isopropanol: 3⁄40 : HC1: NH 4 OH The molar ratio is 1: 9: 3: 0.1: 0.4, and the silica sol is obtained. A silica sol having a certain viscosity was applied to a clean silicon wafer in an isopropanol atmosphere, and aging was continued for 5 min in an isopropanol atmosphere, followed by immersion in an isopropyl alcohol solution for 1 day. The aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under a N 2 atmosphere. The temperature rise rate during the heating process is 10 ° C / s, rises to 150 ° C, and then remains at this temperature for 10 min. This was placed under a high temperature annealing treatment in a mixed atmosphere of nitrogen and hydrogen, wherein an annealing temperature was 250 ° C and a time of 0.5 h to obtain a silica barrier layer for the I-III-IV compound solar cell. Example 4:
在磁力搅拌器的快速搅拌下, 向正硅酸乙酯 (TEOS)与异丙醇的混合 液中滴加 ¾0、 HC1与异丙醇三者的混合物, 使 TEOS: 异丙醇: ¾0: HC1的摩尔比为 1: 3: 1: 5xl0"2; 静置 2 h后向上述溶液中滴加 H20、 NH4OH与异丙醇三者的混合物,使 TEOS: 异丙醇: ¾0 : HC1: NH4OH 的摩尔比为 1 : 6 :2 :2x l0-2 :4x l0-2, 获得硅溶胶。 在异丙醇气氛中将 具有一定粘度的硅溶胶涂在清洁的硅片上,继续在异丙醇气氛中老化 15 min, 然后浸泡在异丙醇溶液中老化 1天。 经老化的湿凝胶薄膜在 N2气 氛下, 在快速热处理炉内快速升温干燥, 升温过程中升温速率为 20°C/s, 升至 300°C, 然后在此温度下保持 30 min, 获得 I-III-IV族化合物太阳能 电池用二氧化硅阻隔层。 以上所述仅为本发明的较佳实施例而已, 对于本领域的一般技术人 员, 依据本发明的思想, 可以对上述具体实施方式进行变化。
With a rapid stirring of a magnetic stirrer, a mixture of 3⁄40, HCl and isopropanol was added dropwise to a mixture of tetraethyl orthosilicate (TEOS) and isopropanol to make TEOS: isopropanol: 3⁄40: HC1 The molar ratio is 1:3: 1: 5xl0"2; After standing for 2 h, a mixture of H 2 0, NH 4 OH and isopropanol is added dropwise to the above solution to make TEOS: isopropanol: 3⁄40 : The molar ratio of HC1:NH 4 OH is 1: 6 : 2 : 2x l0 - 2 : 4x l0 - 2 , obtaining a silica sol. A silica sol having a certain viscosity is applied to a clean silicon wafer in an isopropanol atmosphere. Continue to aging in isopropanol atmosphere for 15 min, then immerse in isopropanol solution for 1 day. The aged wet gel film is rapidly heated and dried in a rapid heat treatment furnace under N 2 atmosphere, and the heating rate is increased during heating. The temperature is 20 ° C / s, raised to 300 ° C, and then maintained at this temperature for 30 min, to obtain a silica barrier layer for I-III-IV compound solar cells. The above is only a preferred embodiment of the present invention. For example, the above-described embodiments may be modified in accordance with the teachings of the present invention.
Claims
1. 一种 I-III-IV 族化合物太阳能电池用二氧化硅阻隔层的制备方 法, 其特征在于, 包括如下步骤: A method for preparing a silicon dioxide barrier layer for a group I-III-IV compound solar cell, comprising the steps of:
配制正硅酸烷基酯的酸催化溶液, 其中包含摩尔比为 1 : (1〜5): (0.5 - 3): (0.001 ~ 0.1) 的正硅酸烷基酯、 醇、 H20和酸, 所述酸的摩尔 比以酸艮计, 下同; An acid-catalyzed solution of an alkyl orthosilicate containing a molar ratio of 1: (1 to 5): (0.5 - 3): (0.001 to 0.1) of an alkyl orthosilicate, an alcohol, H 2 0 and Acid, the molar ratio of the acid is based on acid hydrazine, the same below;
将所述正硅酸烷基酯的酸催化溶液放置 0.5 ~ 6 h, 然后加入 NH4OH 水溶液, 或者加入 NH4OH水溶液和醇, 获得硅溶胶, 其中正硅酸烷基 酯、 醇、 H20和酸的摩尔比为 1 : (3 ~ 9): (1 - 6): (0.001 - 0.1), NH4OH 与酸的摩尔比为 1 : 1 ~ 4: 1 ; The solution of the acid-catalyzed n-alkyl silicate placed 0.5 ~ 6 h, followed by addition of aqueous NH 4 OH or NH 4 OH was added and aqueous alcohol, to obtain a silica sol, wherein the n-alkyl silicate, alcohol, H 20 and a molar ratio of acid is 1: (3 ~ 9): (1 - 6): (0.001 - 0.1), NH 4 OH and the molar ratio of the acid is 1: 1 to 4: 1;
在醇气氛中将所述硅溶胶涂覆在介质上; Coating the silica sol on a medium in an alcohol atmosphere;
将涂覆硅溶胶后的介质继续在醇气氛中老化 5 ~ 75 min, 然后浸泡 在醇溶液中老化, 获得老化的凝胶薄膜; The medium after coating the silica sol is further aged in an alcohol atmosphere for 5 to 75 min, and then immersed in an alcohol solution to obtain an aged gel film;
将所述老化的凝胶薄膜升温干燥, 升温速率为 10 ~ 180°C/s , 升温至 150 ~ 500°C后保持 10 ~ 75 min, 获得 I-III-IV族化合物太阳能电池用二 氧化硅阻隔层。 The aged gel film is heated and dried at a heating rate of 10 to 180 ° C / s, and is heated to 150 to 500 ° C for 10 to 75 minutes to obtain a silicon dioxide for the I-III-IV compound solar cell. Barrier layer.
2. 如权利要求 1所述的制备方法,其特征在于,所述醇选择异丙醇, 和 /或, 所述酸选择 HC1。 The method according to claim 1, wherein the alcohol is selected from isopropanol, and/or the acid is selected from HC1.
3. 如权利要求 2所述的制备方法, 其特征在于, 所述正硅酸烷基酯 为正硅酸甲酯和 /或正硅酸乙酯。 The method according to claim 2, wherein the alkyl orthosilicate is methyl orthosilicate and/or ethyl orthosilicate.
4. 如权利要求 2所述的制备方法,其特征在于,所述 NH4OH与 HC1 的摩尔比为 1.8: 1 ~ 2.2: 1。 The method according to claim 2, wherein the molar ratio of NH 4 OH to HCl is 1.8:1 to 2.2:1.
5. 如权利要求 2所述的制备方法, 其特征在于, 浸泡在异丙醇溶液 中老化的时间为 1 ~ 3天。 The preparation method according to claim 2, wherein the immersion in the isopropyl alcohol solution is aging for 1 to 3 days.
6. 如权利要求 2所述的制备方法, 其特征在于, 所述老化的凝胶薄 膜升温干燥是在氮气或者惰性气体气氛下进行。 The method according to claim 2, wherein the aged gel film is subjected to elevated temperature drying under a nitrogen gas or an inert gas atmosphere.
7. 如权利要求 2 所述的制备方法, 其特征在于, 还包括对所述 I-III-IV族化合物太阳能电池用二氧化硅阻隔层进行退火处理的步骤。 7. The method according to claim 2, further comprising the step of annealing the silicon dioxide barrier layer for the Group I-III-IV compound solar cell.
8. 如权利要求 7所述的制备方法, 其特征在于, 所述退火处理的加 热温度为 250 ~ 800°C , 时间为 10 min ~ 3 h。 The preparation method according to claim 7, wherein the annealing treatment has a heating temperature of 250 to 800 ° C and a time of 10 min to 3 h.
9. 如权利要求 7所述的制备方法, 其特征在于, 所述退火处理是在 氮气或惰性气体与氢气的混合气体气氛下进行, 持续时间 0.5 min ~ 1 h, 氮气或惰性气体与氢气的体积比为 4: 1 ~ 49: 1。 The preparation method according to claim 7, wherein the annealing treatment is performed under a mixed gas atmosphere of nitrogen or an inert gas and hydrogen for a duration of 0.5 min to 1 h, nitrogen or an inert gas and hydrogen. The volume ratio is 4: 1 ~ 49: 1.
10. 如权利要求 2所述的制备方法, 其特征在于, 所述涂覆采用浸 渍提拉、 旋涂、 丝网印刷和刮涂中的至少一种方法。 The preparation method according to claim 2, wherein the coating is performed by at least one of dipping, spin coating, screen printing, and blade coating.
11. 如权利要求 2所述的制备方法, 其特征在于, 在升温干燥时, 升温速度为 20°C ~ 30°C/s。 The method according to claim 2, wherein the temperature increase rate is from 20 ° C to 30 ° C / s at elevated temperature and drying.
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