WO2013153771A1 - Copper-based circuit board - Google Patents

Copper-based circuit board Download PDF

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Publication number
WO2013153771A1
WO2013153771A1 PCT/JP2013/002264 JP2013002264W WO2013153771A1 WO 2013153771 A1 WO2013153771 A1 WO 2013153771A1 JP 2013002264 W JP2013002264 W JP 2013002264W WO 2013153771 A1 WO2013153771 A1 WO 2013153771A1
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WO
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Patent type
Prior art keywords
copper
circuit board
base circuit
resin
substrate
Prior art date
Application number
PCT/JP2013/002264
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French (fr)
Japanese (ja)
Inventor
茂夫 桑原
和彦 許斐
Original Assignee
日本発條株式会社
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated metal substrate or other insulated electrically conductive substrate
    • H05K1/056Insulated metal substrate or other insulated electrically conductive substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles

Abstract

Provided is a copper-based circuit board, which is capable of suppressing peeling of an insulating layer after a laminate is formed, even if the laminate is formed using a highly heat-resistant resin for a copper substrate for the applications, such as power modules, where high heat dissipation is required. A copper-based circuit board (1) having a wiring pattern (7) formed on one side surface (3a) of a copper substrate (3) with an insulating layer (5) therebetween is characterized in that: the insulating layer (5) is formed of a resin having a laminate-forming temperature of 260-400°C, at which a laminate is formed with the copper substrate (3); the copper substrate (3) is formed of a Cu-based alloy wherein a change of hardness is suppressed to a higher temperature compared with a copper substrate using pure copper; and the hardness can be maintained even if the insulating layer (5) and the copper substrate (3) are laminated at a temperature of 260-400°C, thereby maintaining flatness even in press-blanking and the like after the laminate is formed, improving assemblability of a heat sink and the like, and furthermore, maintaining durability even when used for the applications, such as power modules, under high temperature environment.

Description

Copper base circuit board

The present invention relates to copper base circuit board such as a power module.

Conventionally, the metal base circuit substrate having a wiring pattern through an insulating layer on one side of the metal substrate is known. As the metal substrate in the case of such a LED lighting, considering heat dissipation, aluminum or aluminum alloy is used.

On the other hand, in applications such as a power module, for greater heat dissipation is required, a copper substrate thermal conductivity with greater copper is desirable, also, the resin used for the insulating layer has a high heat resistance become required it.

On the other hand, the use of highly heat-resistant resin, must also be laminated to a copper substrate at a temperature above 260 ° C., the copper substrate is soft annealed using pure copper, machinability has a problem to be reduced.

Accordingly, and when the single punched copper base circuit board formed as an aggregate by a press, and the press punching, the copper substrate is deformed in drilling processability, can not be maintained flatness, heat sink assembling property is lowered etc., and further, which leads to reduction in durability early by use under high temperature environment as applications such as a power module.

Kokoku 8-4190 Patent Publication No.

A problem to be solved is, when the insulating layer using a highly heat-resistant resin on a copper substrate for applications where high heat dissipation and power module is required to laminated, can not be maintained flatness, assembling property is reduced, further, is that which leads to reduction in durability early by use under high temperature environment as applications such as a power module.

The present invention, even when the insulating layer using a highly heat-resistant resin on a copper substrate for applications where high heat dissipation and power module is required to laminated, enables maintaining the durability due flatness maintenance and use order to, a copper-base circuit board to form a wiring pattern via an insulating layer on one side of the copper substrate, the insulating layer, formed of a highly heat-resistant resin, the copper substrate, use pure copper the change in hardness to a higher temperature than the copper substrate had is suppressed Cu was formed with a copper alloy mainly, an insulating layer on one side of the copper substrate, pure copper is formed laminated at a temperature above the hot start to annealing machinability after lamination forming the copper substrate using the pure copper also, substrate flatness, maintaining high performance for variations in flatness, characterized in that to maintain the high temperature durability.

Copper Copper base circuit board of the present invention, since it is the structure, a copper substrate insulating layer of high heat-resistant resin, be formed laminated at a heating temperature of, for example, 260 ° C. ~ 400 ° C., using pure copper compared to the substrate, pure copper can be suppressed a change in hardness even more temperature begins to annealing, subsequent stamping and, also allows maintain the flatness in drilling process, such as heat sink to improve assembling property, and further, it is possible to maintain the durability in use under a high temperature environment as applications such as a power module.

It is a cross-sectional view of a copper-base circuit board. (Example 1) It is a table showing a comparison of the composition and properties of the copper substrate. (Example 1) It is a graph showing a change in hardness due to given thermal history of the substrate made of pure copper and various copper alloys. (Examples 1 to 3) Is a table showing the composition of a copper substrate. (Example 1) It is a rear view of a copper-base circuit board samples the drilling. (Example 1) It is a side view showing the state of flatness test of the copper base circuit board sample. (Example 1) It is an enlarged sectional view showing a sag of the copper base circuit board sample. (Example 1) It is a cross-sectional view of a copper-base circuit board. (Example 1) It is a cross-sectional view of a copper-base circuit board. (Example 1) It is a cross-sectional view of a copper-base circuit board. (Example 1)

Copper substrate using a highly heat-resistant resin insulating layer was laminated for applications where high heat dissipation and power module is required, flatness maintained, and the purpose of allowing maintaining the durability by using, the insulating layer 5, forming temperature for laminating the copper substrate 3 is formed of a resin to be 260 ~ 400 ° C., the copper substrate 3, the change in hardness to a higher temperature than the copper substrate using pure copper is suppressed of Cu was formed with a copper-based alloy and laminated insulating layer 5 on one side 3a of the copper substrate 3, the copper substrate using pure copper be laminated at a temperature higher than the high temperature pure copper begins to annealing machinability after formation, the substrate flatness, maintaining high performance for variations in flatness, was achieved by being able to maintain the high temperature durability.

Figure 1 is a cross-sectional view of a copper-base circuit board.

As in FIG. 1, a copper base circuit board 1 is one in which the wiring pattern 7 by a copper foil via an insulating layer 5 on one side 3a of the copper substrate 3, such as made of copper alloy is formed. The copper-base circuit board 1, for example, a plurality is manufactured as an assembly which is integrally formed, each copper base circuit board 1 is one that was separated by press cutting.

Copper base circuit board 1, in the case (not shown), an insulating resin over the press cutting portion 1a is filled from one side 3a, are sealed with a resin. Although not shown, a predetermined portion of the wiring pattern 7 is mounted circuit elements are sealed together with resin in the insulating resin.

Thickness of the copper substrate 3 of such a copper-base circuit board 1 is 0.5 mm or more 10mm or less, the thickness of the insulating layer 5 is set to 10 ~ 200 [mu] m.

The insulating layer 5 is formed at the molding temperature is 260 ° C. ~ 400 ° C. high heat resistance of the resin (e.g., a composition obtained by dispersing an insulating inorganic filler in the polyamide-imide resin). 2 illustrates the type of resin used in each example in the bottom. PAI, the polyamide-imide resin, LCP shows a liquid crystal polymer resin. Copper substrate 3 is for a change in hardness to a higher temperature than the copper substrate of pure copper is suppressed, copper alloy mainly containing Cu, such as Fe, is formed of a copper alloy which contains the P.

The insulating layer 5, as a molding temperature of 260 ° C. ~ 400 ° C. High heat-resistant resin, polyamideimide resin, in addition to the liquid crystal polymer, polyimide resin, cyanate resin, polyphenylene sulfide resin, polyether sulfone resin, fluorinated resin, polyether ether ketone resin of polyethylene terephthalate resin, and formed in one of polybutylene terephthalate resin, the thermal conductivity of 20W / mK or more insulating inorganic filler may be used a composition is dispersed as needed .

Copper substrate 3, a high heat dissipation, due to the high heat resistance, the Cu in the first embodiment mainly less than 97.0 wt% to 100 wt%, Fe, are made of copper alloy which contains the P. The metal to be contained, as described below, Fe, can also be used other than P, it can be changed as also required that content.

Figure 2 is a chart showing a comparison of the composition and properties of the copper substrate, FIG. 3 is a graph showing changes in hardness due to given thermal history of the substrate made of pure copper and various copper alloys, FIG. 4, copper table showing the composition of the substrate, FIG. 5 is a rear view of a copper-base circuit board samples the drilling, 6 is a side view showing the state of flatness test of the copper base circuit board samples, FIG. 7, a copper base it is an enlarged sectional view showing a sag of the circuit board sample.

As in Figure 2, in Example 1, for example, as the composition of the copper substrate 3, CDA alloy number - in temper symbol, Example 1-a: C19210-O, Example 1-b: C19210-1 / employing two types of 2H. Both the Cu and 99.81 to 99.925% by weight, with 0.05-0.15 wt% Fe and 0.025 to 0.04 wt% copper alloy which contains the P. It will be described later in Example 2 and 3 of FIG.

Copper substrate of Comparative Examples 1 and 2, the Cu and 99.95 wt% or more, with 0.0010 wt% O less pure copper.

Data items, base thickness, hardness (initial value), heat treatment conditions, hardness (after heat treatment), flatness after processing, variation in flatness, workpiece sag resistance, 260 ° C. (reflow furnace temperature reference) / 2 hr after heating the hardness, high-temperature durability, and a standard value of hardness.

Substrate thickness, the thickness of the copper substrate 3, hardness (initial value) before heat treatment hardness, heat treatment conditions, the copper substrate 3 is when the heating laminating an insulating layer 5.

After heating hardness, Vickers hardness, flatness after forming the copper-clad laminate with heating is a plan of the one side 3a and the other side 3b of the copper substrate 3. Flatness variation is a variation in the flatness of the plurality of copper-clad laminate was sampled. Sag resistance is generated by resistance in the sag, such as hole edge portion by Puresudare and drilling machining of the press cutting unit 1a after being detached by press cutting due punching. Hardness after 260 ° C. heating is hardness after heat treatment and the temperature of the reflow furnace used for soldering reference.

Here, the copper-clad laminate is a laminated structure of a copper substrate 3 before the wiring pattern 7 is formed and the insulating layer 5.

Comparative example 2 1, Example 1-a, was heated laminating an insulating layer on the copper substrate with a high heat-resistant resin similar to Example 1-b. The insulating layer to form a copper-clad laminated board using the polyamide-imide resin.

Comparative Example 1, as shown in FIG. 2, high laminated during the heat treatment conditions, happened the annealing Hv57 next copper substrate by heating at 350 ° C. / 30min. Thus, significantly different hardness before and after heating, can not be maintained hardness after heating, flatness after processing, worsen the variation of flatness, the workability could not be secured (the workpiece sag resistance × ). 260 ° C. Hardness after (reflow furnace temperature reference) heating is low, not even obtained the high temperature durability (×).

Comparative Example 2, which has a copper substrate to the insulating layer (compositions by dispersing insulating inorganic filler in epoxy resin) heated laminated by heating at 180 ° C. / 3 hr below 260 ° C., layered upon heat treatment conditions is low, annealing of the copper substrate did not occur. Therefore, workability can be secured (workpiece sag resistance ○). However, (such as heating in a reflow furnace) is heat-treated at 260 ° C. or higher temperature and annealing occurs changed easily become in the substrate life shortened. Also occur annealing when using the product at 260 ° C. or higher, a short life.

In contrast, Example 1-a of FIG. 2, Example 1-b is obtained by heating the laminated forming an insulating layer on the copper substrate with a high heat-resistant resin, laminated during the heat treatment conditions is high, the copper substrate the annealing did not occur. Therefore, hardly changes the hardness before and after the heating, the change is suppressed. Also it is possible to maintain the hardness after heating, can maintain the flatness after processing, small variations in flatness, workability been secured (workpiece sag resistance ○). 260 ° C. Hardness after (reflow furnace temperature reference) heating is high, resulting the high temperature durability (○).

Thus, a copper-clad laminate of Comparative Examples 1 and 2, both have resulted in low temperature durability. In contrast, Example 1-a, the copper-clad laminate of Example 1-b, sagging of the workpiece, was also ensure high performance in any of the high-temperature durability.

Further, the copper-base circuit board 1 when the resin sealing is also causes accurately performed without forcibly filling the insulating resin, product shape and dimensions, etc. suppressing a warp due to shrinkage at the time of curing of the sealant, appearance quality can be maintained.

The good adhesion at the maintenance of flatness even when mounting the heat sink on the other side 3b of the copper substrate 3, together with high heat radiation of the copper substrate 3 itself, it is possible to further improve heat dissipation.

In laminated, for example, roughening treatment of the surface of the copper substrate 3 formed of copper alloy of the a (e.g., chemical treatment) and film processing (e.g., plating) and, 260 ° C. ~ the high heat-resistant resin to form a copper-clad laminate was heated at 400 ° C..

For roughening treatment, thereby firmly perform coupling of the insulating layer 5 to the copper substrate 3, in the case of coating process, even when stacked with heating at 260 ° C. ~ 400 ° C., the metal ions from the copper substrate 3 generation is suppressed, is suppressed oxidation of the insulating layer 5, it is possible to suppress the peeling between the insulating layer 5 and the copper substrate 3.

Because it can maintain 260 ° C. ~ 400 ° C. flatness of the copper substrate 3 even after laminated by heating, it is possible to further suppress the peeling between the insulating layer 5 and the copper substrate 3 from the point of.

Moreover, excellent thermal conductivity because a copper substrate 3, it is possible to enhance the heat dissipation properties, and heat resistance of the insulating layer 5 is high, the copper base circuit board which is suitable for applications in which high heat radiation such as a power module is required 1 can be obtained.

Figure 4 is a table showing the composition of a copper substrate.

The present invention embodiment can also be used copper substrate of the substrate (C15100, C15150, C19400) having a composition as shown in FIG. 4. Even in a copper substrate having such a composition, in comparison with pure copper substrate, annealing of the copper substrate is not Okoshira be heat-treated at 260 ° C. or higher, before and after heating of the hardness change above Example 1-a, performed example 1-b Similarly hardly be maintained hardness after heating, it is possible to achieve the same effect.

For the test method will be described.

5 to 7, for the copper base circuit board samples, using the same reference numerals as FIG.

Copper base circuit board sample 1 as shown in FIG. 5, punching by press on the size of the provisions copper substrate 3 side, and further, was processed in the hole 8 from the copper substrate 3 side at the two places press. It was evaluated for the copper base circuit board sample 1. The flatness in this embodiment, on the surface plate 10 as shown in FIG. 6, placed as processed copper base circuit board sample 1 a wiring pattern 7 (circuit Cu foil) is in contact with the copper surface of the substrate 3 (the upper surface anywhere set the height in the thickness direction 0 points), the height of the position of the black dots in FIG. 5 away 2mm from the center and the periphery of the sample 1 (9 points), the reference point (0 point) the difference of was measured. For Sample 1, the copper substrate 3 side is measured in the same manner also when loaded in contact with the surface plate 10.

The difference between the maximum and minimum measurement points 9 points of one side X (μm), the value of the larger of the difference Y ([mu] m) between the maximum and minimum of the other surface was flatness.

Further, the variation of flatness is the standard deviation of 9 points.

The sag resistance in this embodiment, the wiring pattern 7 (circuit Cu foil) is placed a copper base circuit board sample 1 so as to contact the surface plate 10, the cutting edge portion of the press punching than the extension of the flat reference surface of the inner the sunken amount was sagging.

Sag of less than 0.15mm and ○, and as × least 0.15mm.

Measurements of hardness, the copper or the prepared copper plate substrate used for the substrate of the thickness 2 mm, were measured by the following measuring at the center of the thickness direction of the cross section cut.

Measuring Machine: Feature Tech-made micro Vickers hardness tester FM700, measuring load 200g
The A 260 ° C. hardness after (reflow furnace temperature reference) heating 2 shows the hardness of the copper plate after heating 260 ° C. / 2 hr the substrate.

Temperature durability test, a hole of φ11mm copper substrate 3, tightened and made of SUS304 M10 bolts and nuts, and the absence of loose when repeated 260 ° C. ⇔ room temperature.

The same test was also conducted for Comparative Examples 1 and 2.

8 to 10 are cross-sectional views of a copper base circuit board according to a modification. Note that the same components as in FIG. 1 are denoted by the same reference numerals.

Copper base circuit board 1A in FIG. 8 has on both sides of the copper substrate 3 via the insulating layer 5 to form a wiring pattern 7.

Copper base circuit board 1B in FIG. 9, a two-layer substrate (lamination type). Copper base circuit board 1B is for another substrate 11 via the adhesive layer 9 on the insulating layer 5 are stacked. Substrate 11 is obtained by forming a copper wiring pattern 15 on the front and back of the glass cloth epoxy resin layer 13. Part of the wiring pattern 15 is electrically connected on the front and back sides of the glass cloth epoxy resin layer 13 by through holes.

Copper base circuit board 1C of FIG. 10 is a two-layer board (build-up specifications). Copper base circuit board 1C, the wiring pattern 19 is formed through the insulating layer 17 to cover the wiring pattern 7 on the insulating layer 5, the wiring pattern 19 is connected to the wiring pattern 7 side by the through hole.

According 8-10 copper base circuit board 1A according to a modification of, 1B, also in 1C, the Example 1-a, it is possible to achieve the same effects as in Example 1-b.

Copper substrate, of the Fe, P, Zr, Mg, Zn, Pb, may be made of a copper alloy containing at least one or more, in comparison with pure copper substrate in any composition, 260 ° C. ~ 400 ° C. does not occur annealing be heat-treated at a temperature of, there is little change in hardness before and after heating.

Referring to FIG. 1, a copper base circuit board 1 of this embodiment, a highly heat-resistant resin for forming the insulating layer 5, in FIG. 2, the liquid crystal polymer in place of the polyamide-imide resin used in Example 1-a using the resin, and the laminate during the heat treatment conditions and 330 ° C. / 20min. Other conditions were the same as in Example 1-b.

Also in this embodiment, does not occur annealing of the laminate during the heat treatment, was maintained Hv121 after lamination during the heat treatment. Therefore, a hardness of before and after heating the same, to maintain the hardness after heating, flatness after the processing, is suppressed variations in flatness, (sagging property ○ workpiece) that workability can be secured. 260 ° C. Hardness after (reflow furnace temperature reference) heating is also Hv121, also resulting temperature durability (○).

That is, even in the present embodiment, it is possible to achieve the same effect as the above embodiment.

Moreover, copper-base circuit board 1A according to the modification of FIGS. 8 to 10, 1B, also in 1C, can be similarly applied.

Referring to FIG. 1, a copper base circuit board 1 of this embodiment, a highly heat-resistant resin for forming the insulating layer 5, in FIG. 2, a cyanate resin in place of the polyamide-imide resin used in Example 1-a It was used to the laminated during the heat treatment conditions and 300 ° C. / 60min. Other conditions were the same as in Example 1-b.

Also in this embodiment, does not occur annealing of the laminate during the heat treatment, it became Hv122 after lamination during the heat treatment. Therefore, a substantially hardness before and after heating the same, to maintain the hardness after heating, flatness after processing, the variation of flatness is suppressed, workability can be secured (workpiece sag resistance ○) . 260 ° C. Hardness after (reflow furnace temperature reference) heating is also Hv122, also resulting temperature durability (○).

That is, even in the present embodiment, it is possible to achieve the same effect as the above embodiment.

Moreover, copper-base circuit board 1A according to the modification of FIGS. 8 to 10, 1B, also in 1C, can be similarly applied.

1, 1A, 1B, 1C copper base circuit board 1a press cutting unit 3 copper substrate 5 insulating layer 7 wiring pattern

Claims (7)

  1. On one side of a copper substrate a copper base circuit board to form a wiring pattern via an insulating layer,
    The insulating layer, formed of a highly heat-resistant resin,
    The copper substrate is formed of Cu which change in hardness to a higher temperature than the copper substrate using pure copper was suppressed in the copper alloy mainly,
    An insulating layer on one side of the copper substrate, pure copper machinability after lamination forming the copper substrate using the pure copper be formed laminated at a temperature above the hot start to annealing, the substrate flatness variation of flatness maintaining high performance for high-temperature durability can be maintained,
    Copper base circuit board, characterized in that.
  2. A copper base circuit board according to claim 1,
    Said copper substrate, of the Fe, P, Zr, Mg, Zn, Pb, and made of copper alloy containing one or more,
    Copper base circuit board, characterized in that.
  3. A copper base circuit board according to the second aspect,
    The copper substrate was formed of copper alloy with at least 97.0% by weight or more but less than 100 wt% of Cu,
    Copper base circuit board, characterized in that.
  4. A copper base circuit board of any one of claims 1 to 3,
    The insulating layer is laminated temperature of the copper substrate was formed of a resin to be 260 ~ 400 ° C.,
    Copper base circuit board, characterized in that.
  5. A copper base circuit board according to claim 4,
    The constituting the insulating layer resin is polyimide resin, polyamideimide resin, polyphenylene sulfide resin, polyether sulfone resin, fluorinated resin, polyether ether ketone resin, liquid crystal polymer, polyethylene terephthalate resin, polybutylene terephthalate resin, a cyanate resin it is either,
    Copper base circuit board, characterized in that.
  6. A copper base circuit board of any one of claims 1 to 5,
    The insulating layer, the thermal conductivity of 20W / mK or more inorganic fillers formed by using the composition is dispersed,
    Copper base circuit board, characterized in that.
  7. A copper base circuit board of any one of claims 1 to 6,
    The insulating layer has a thermal conductivity of 6 ~ 40W / mK,
    Copper base circuit board, characterized in that.
PCT/JP2013/002264 2012-04-13 2013-04-01 Copper-based circuit board WO2013153771A1 (en)

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JP2012-092327 2012-04-13

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