WO2013151608A1 - Electrical connector with electrically conductive face - Google Patents

Electrical connector with electrically conductive face Download PDF

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Publication number
WO2013151608A1
WO2013151608A1 PCT/US2013/022716 US2013022716W WO2013151608A1 WO 2013151608 A1 WO2013151608 A1 WO 2013151608A1 US 2013022716 W US2013022716 W US 2013022716W WO 2013151608 A1 WO2013151608 A1 WO 2013151608A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
electrically conductive
mating
face
contact
Prior art date
Application number
PCT/US2013/022716
Other languages
French (fr)
Inventor
Alexander R. Mathews
Thomas SUNIGA
John W. Benedict
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2013151608A1 publication Critical patent/WO2013151608A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Definitions

  • An electrical connector can allow for the connection of integrated circuits on circuit boards to cables or electronic devices. Electrical signals propagate through conductors of the electrical connector as the signals pass to/from the circuit board. In some instances, electrical interconnections are not difficult to form when signal line densities are relatively low. In addition, signal integrity is much less of a concern when designing connectors for relatively slow data rate applications. However, equipment manufacturers and consumers continually desire ever higher signal line densities and faster data rates.
  • the present disclosure describes a connector, comprising: an electrically conductive face; and a plurality of electrical contacts disposed in the electrically conductive face for making electrical contact with corresponding electrical contacts in a mating face, each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face.
  • the present disclosure describes a connector for mating with a mating connector, comprising: an insulative housing comprising a mating side; an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing; and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.
  • a connector of the present disclosure can be positioned in contact with a top surface ground plane on a printed circuit board (PCB), to provide a very high quality return path (e.g., exceeding that obtained with thru-hole pins), without requiring extra via space on the PCB.
  • Advantages can include, for example, improving signal quality, allowing more space on the PCB for optimizing circuit board signal paths, reducing the maneuvering of signal paths around ground paths, and simplifying PCB design and manufacture.
  • FIG. 1 is a plan view of an exemplary embodiment of a connector of the present disclosure
  • FIGS. 2a and 2b are perspective views of an exemplary embodiment of a connector of the present disclosure
  • FIG. 2c is an exploded view of the connector of FIGS. 2a and 2b;
  • FIG. 2d is an enlarged view of a portion of FIG. 2c.
  • FIG. 1 shows an exemplary embodiment of a connector 100, having a plurality of electrical contacts 120 disposed in an electrically conductive face 105 for making electrical contact with corresponding electrical contacts (not shown) in a mating face (not shown) of, for example, a mating connector (also not shown) or a printed circuit board.
  • Electrically conductive face 105 defines a plurality of openings 130.
  • Each contact 120 is electrically isolated from face 105 by, for example, each opening 130 being larger than the size of each contact 120, without making electrical contact with the edge 135 of each corresponding opening 130.
  • Electrically conductive face 105 typically has a shape that substantially covers the mating face, allowing for maximal contact area between electrical conductive face 105 and the mating face.
  • An advantage of connector 100 having electrically conductive face 105 is that electrically conductive face 105 can provide a distributed ground for shielding and grounding connections without requiring vias and terminating tail pins.
  • very small connecting vias can be used to connect a surface pad or plane with grounding planes, ground traces, or signal traces within a printed circuit board structure, with a benefit of requiring less routing per printed circuit board layer, while maintaining multiple connection paths.
  • Electrical contacts 120 are shown in FIG. 1 as, for example, jack-type contacts, each electrical contact 120 defining a central opening 140.
  • Central opening 140 in jack-type contact is sized suitably to receive a corresponding plug-type contact (not shown) in the mating face.
  • each electrical contact 120 in connector 100 could be a plug-type contact, which may or may not define a central opening 140.
  • plurality of electrical contacts 101 comprises at least one signal contact. In some embodiments of connector 100, plurality of electrical contacts 101 comprises at least one ground contact. In some embodiments of connector 100, plurality of electrical contacts 101 comprises at least one power contact.
  • the exemplary embodiment of FIG. 1 shows 35 signal contacts.
  • connector 100 further comprises at least one ground contact disposed in electrically conductive face 105 for making contact with a corresponding ground contact (not shown) in a mating face (not shown) and making electrical contact with electrically conductive face 105.
  • electrically conductive face 105 can serve as a ground connection for portions of the mating face that come into contact with electrically conductive face 105.
  • connector 100 further comprises an insulating body for housing the plurality of electrical contacts, and a self-supporting conductive layer disposed on the insulating body.
  • the self-supporting conductive layer can include electrically conductive face 105.
  • self-supporting refers to a layer of material that can hold its shape under the force of gravity, regardless of spatial orientation.
  • electrically conductive face 105 is constructed of metal. Suitable metals include, for example, any of gold, silver, nickel, or copper.
  • electrically conductive face 105 is constructed from a resilient conforming conductive material.
  • resilient conforming conductive material is the ability to compensate for co-planarity variations between electrically conductive face 105 and the mating face.
  • Suitable resilient conforming conductive materials for constructing electrically conductive face 105 include, for example, any of those electrically conductive cushioning gaskets available from 3M Company, St.
  • the electrical conductivity of electrically conductive face 105 is equal, or substantially equal, in all directions along the conductive surface. In some embodiments, the electrical conductivity of electrically conductive face 105 is equal, or substantially equal, in all directions along the conductive surface and/or the thickness. In embodiments where electrically conductive face 105 is constructed from a resilient conforming conductive material, compression of the material may enhance its conductivity. As can be appreciated, by varying the type of resilient conforming conductive material, one can adjust the amount of pressure required to bring electrically conductive face 105 into maximal electrical contact with the mating face, and the resilient conforming material can help to compensate for small variations in the coplanarity of electrically conductive face 105 and the mating face.
  • electrically conductive face 105 makes electrical contact with a mating face of a mating connector.
  • electrically conductive face 105 makes electrical contact with a mating face that is a portion of a printed circuit board.
  • FIG. 2a shows an exemplary embodiment of connector 200 for mating with a mating connector, having an insulative housing 250 that includes a first mating side 205, and electrically conductive ground layer 210 disposed on and substantially covering first mating side 205 of the insulative housing, and a plurality of signal contacts 201 disposed in the insulative housing for making electrical contact with corresponding signal contacts (not shown) in a mating connector (not shown) from first mating side 205 of the insulative housing, each signal contact 220 in the plurality of signal contacts 201 being electrically isolated from electrically conductive ground layer 210.
  • each signal contact 220 in plurality of contacts 201 is a plug-type contact.
  • each signal contact 220 in plurality of contacts 201 is a jack-type connector.
  • Electrically conductive ground layer 210 typically includes a resilient conforming conductive material.
  • electrically conductive ground layer 210 comprises carbon black.
  • electrically conductive ground layer 210 comprises other conductive microparticles including, for example, nickel particles.
  • the resilient conforming conductive material can include an elastomeric polymer. The resilient conforming conductive material typically is able to be compressed and return to its original dimensions, under normal conditions of its intended use.
  • electrically conductive ground layer has a thickness of any of about 0.3 mm, about 0.5 mm, or about 0.7 mm, and has a Z-axis resistance of less than about 0.1 ohms per 25.4 mm x 25.4 mm square, when measured between gold plated brass probes with a 1 kg load and a dwell time of 60 seconds.
  • electrically conductive ground layer 210 comprises an electrically conductive self-supporting layer.
  • Suitable examples of commercially available electrically conductive self-supporting layers include those electrically conductive cushioning gaskets available from 3M Company, St. Paul, MN, under the trade designations "ECG-7033", “ECG-7053”, “ECG-7073”, “ECG-8035”, “ECG-8055”, “ECG-8075”, and those electrically conductive pads available from 3M Company under the trade designation "3M XYZ ELECTRICALLY CONDUCTIVE ACRYLIC ECAP PADS 7830N".
  • FIG. 2b shows a second mating side 215 of connector 200, which includes a plurality of signal contacts 280.
  • Connector 200 includes a plurality of self-supporting conductive layers 270 disposed on mating face 215 between rows of signal contacts 280 and making electrical contact with shield members 260.
  • Shield members 260 include end portions 240. It will be appreciated that self- supporting conductive layers 270 can provide, for example, an optimized path to ground relative to signal trace length, and can also reduce the number of vias (and holes for vias) required for connecting the shield members to the mating connector.
  • FIG. 2c is an exploded view of connector 200, showing insulating housing 250 and mating side 205 of the insulative housing, and electrically conductive ground layer 210 that is disposed on and substantially covers mating side 205 of insulative housing 250. Also shown in FIG. 2c are signal contacts 220 that pass though openings 230 defined in electrically conductive ground layer 210. Signal contacts 220 are disposed for making electrical contact with corresponding signal contacts in a mating connector from mating side 205 of insulative housing 250, each signal contact 220 being electrically isolated from electrically conductive ground layer 210.
  • FIG. 2d is an enlarged view of a portion of FIG. 2c, showing signal contacts 220 and one or more grounding members 270.
  • mating side 205 includes an array of signal contacts 220 and grounding members 270, the grounding members 270 making electrical contact with electrically conductive ground layer 210, but being electrically isolated from signal contacts 220.
  • a connector comprising:
  • each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face.
  • Item 2 The connector of item 1, wherein the plurality of electrical contacts comprises at least one signal contact.
  • Item 3 The connector of item 1, wherein the plurality of electrical contacts comprises at least one ground contact.
  • Item 4 The connector of any preceding item, wherein the connector further comprises at least one ground contact disposed in the electrically conductive face for making electrical contact with a corresponding ground contact in a mating face and making electrical contact with the electrically conductive face.
  • Item 5 The connector of any preceding item, wherein the plurality of electrical contacts comprises at least one power contact.
  • Item 6 The connector of any preceding item, further comprising an insulating body for housing the plurality of electrical contacts, and a self-supporting conductive layer disposed on the insulating body, the self-supporting conductive layer comprising the electrically conductive face.
  • Item 7 The connector of any preceding item, wherein the mating face is the mating face of a mating connector.
  • Item 8 The connector of any of items 1 to 6, wherein the mating face is a portion of a printed circuit board.
  • a connector for mating with a mating connector comprising:
  • an insulative housing comprising a mating side
  • an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing; and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.
  • Item 10 The connector of item 9, wherein each signal contact in the plurality of signal contacts is a plug-type signal contact.
  • Item 1 The connector of item 9, wherein each signal contact in the plurality of signal contacts is a jack-type signal contact.
  • Item 12 The connector of any one of items 9 to 1 1, wherein the electrically conductive ground layer comprises carbon black.
  • Item 13 The connector of any one of items 9 to 12, wherein the electrically conductive ground layer comprises an electrically conductive self-supporting layer.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A connector including an electrically conductive face, and a plurality of electrical contacts disposed in the electrically conductive face for making electrical contact with corresponding electrical contacts in a mating face, each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face. A connector for mating with a mating connector, including an insulative housing comprising a mating side, an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing, and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.

Description

ELECTRICAL CONNECTOR WITH ELECTRICALLY CONDUCTIVE FACE
Background
[0001] An electrical connector can allow for the connection of integrated circuits on circuit boards to cables or electronic devices. Electrical signals propagate through conductors of the electrical connector as the signals pass to/from the circuit board. In some instances, electrical interconnections are not difficult to form when signal line densities are relatively low. In addition, signal integrity is much less of a concern when designing connectors for relatively slow data rate applications. However, equipment manufacturers and consumers continually desire ever higher signal line densities and faster data rates.
[0002] Electrical connectors with relatively high signal line densities have been developed for use with high speed circuits (e.g., circuits with transmission rate of at least 5 GHz). However, with higher signal lines densities and faster data rates, signal integrity may by undesirably influenced as a result of increased interference between circuits, for example. Available high speed interconnect solutions can be complex, utilizing precisely fabricated component designs that are sensitive to even small manufacturing variations, and thus expensive and difficult to manufacture.
Summary
[0003] In one aspect, the present disclosure describes a connector, comprising: an electrically conductive face; and a plurality of electrical contacts disposed in the electrically conductive face for making electrical contact with corresponding electrical contacts in a mating face, each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face.
[0004] In another aspect, the present disclosure describes a connector for mating with a mating connector, comprising: an insulative housing comprising a mating side; an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing; and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.
[0005] In some embodiments, a connector of the present disclosure can be positioned in contact with a top surface ground plane on a printed circuit board (PCB), to provide a very high quality return path (e.g., exceeding that obtained with thru-hole pins), without requiring extra via space on the PCB. Advantages can include, for example, improving signal quality, allowing more space on the PCB for optimizing circuit board signal paths, reducing the maneuvering of signal paths around ground paths, and simplifying PCB design and manufacture.
Brief Description of Drawings
[0006] FIG. 1 is a plan view of an exemplary embodiment of a connector of the present disclosure;
[0007] FIGS. 2a and 2b are perspective views of an exemplary embodiment of a connector of the present disclosure;
[0008] FIG. 2c is an exploded view of the connector of FIGS. 2a and 2b;
[0009] FIG. 2d is an enlarged view of a portion of FIG. 2c.
Detailed Description
[0010] Connectors of the present disclosure make electrical contact with a mating face of a mating connector. FIG. 1 shows an exemplary embodiment of a connector 100, having a plurality of electrical contacts 120 disposed in an electrically conductive face 105 for making electrical contact with corresponding electrical contacts (not shown) in a mating face (not shown) of, for example, a mating connector (also not shown) or a printed circuit board. Electrically conductive face 105 defines a plurality of openings 130. Each contact 120 is electrically isolated from face 105 by, for example, each opening 130 being larger than the size of each contact 120, without making electrical contact with the edge 135 of each corresponding opening 130.
[0011] Electrically conductive face 105 typically has a shape that substantially covers the mating face, allowing for maximal contact area between electrical conductive face 105 and the mating face. An advantage of connector 100 having electrically conductive face 105 is that electrically conductive face 105 can provide a distributed ground for shielding and grounding connections without requiring vias and terminating tail pins. In some embodiments, very small connecting vias can be used to connect a surface pad or plane with grounding planes, ground traces, or signal traces within a printed circuit board structure, with a benefit of requiring less routing per printed circuit board layer, while maintaining multiple connection paths.
[0012] Electrical contacts 120 are shown in FIG. 1 as, for example, jack-type contacts, each electrical contact 120 defining a central opening 140. Central opening 140 in jack-type contact is sized suitably to receive a corresponding plug-type contact (not shown) in the mating face. Alternatively, each electrical contact 120 in connector 100 could be a plug-type contact, which may or may not define a central opening 140.
[0013] In some embodiments of connector 100, plurality of electrical contacts 101 comprises at least one signal contact. In some embodiments of connector 100, plurality of electrical contacts 101 comprises at least one ground contact. In some embodiments of connector 100, plurality of electrical contacts 101 comprises at least one power contact. The exemplary embodiment of FIG. 1 shows 35 signal contacts.
[0014] In some embodiments of connector 100, connector 100 further comprises at least one ground contact disposed in electrically conductive face 105 for making contact with a corresponding ground contact (not shown) in a mating face (not shown) and making electrical contact with electrically conductive face 105. In this configuration, electrically conductive face 105 can serve as a ground connection for portions of the mating face that come into contact with electrically conductive face 105.
[0015] In some embodiments, connector 100 further comprises an insulating body for housing the plurality of electrical contacts, and a self-supporting conductive layer disposed on the insulating body. In such cases, the self-supporting conductive layer can include electrically conductive face 105. The term "self-supporting" refers to a layer of material that can hold its shape under the force of gravity, regardless of spatial orientation.
[0016] In some embodiments, electrically conductive face 105 is constructed of metal. Suitable metals include, for example, any of gold, silver, nickel, or copper.
[0017] In some embodiments, electrically conductive face 105 is constructed from a resilient conforming conductive material. One advantage of using resilient conforming conductive material is the ability to compensate for co-planarity variations between electrically conductive face 105 and the mating face. Suitable resilient conforming conductive materials for constructing electrically conductive face 105 include, for example, any of those electrically conductive cushioning gaskets available from 3M Company, St. Paul, MN, under the trade designations "ECG-7033", "ECG-7053", "ECG-7073", "ECG-8035", "ECG-8055", "ECG-8075", and those electrically conductive pads available from 3M Company under the trade designation "3M XYZ ELECTRICALLY CONDUCTIVE ACRYLIC ECAP PADS 7830N.
[0018] In some embodiments, the electrical conductivity of electrically conductive face 105 is equal, or substantially equal, in all directions along the conductive surface. In some embodiments, the electrical conductivity of electrically conductive face 105 is equal, or substantially equal, in all directions along the conductive surface and/or the thickness. In embodiments where electrically conductive face 105 is constructed from a resilient conforming conductive material, compression of the material may enhance its conductivity. As can be appreciated, by varying the type of resilient conforming conductive material, one can adjust the amount of pressure required to bring electrically conductive face 105 into maximal electrical contact with the mating face, and the resilient conforming material can help to compensate for small variations in the coplanarity of electrically conductive face 105 and the mating face.
[0019] In some embodiments of connector 100, electrically conductive face 105 makes electrical contact with a mating face of a mating connector. [0020] In some embodiments of connector 100, electrically conductive face 105 makes electrical contact with a mating face that is a portion of a printed circuit board.
[0021] FIG. 2a shows an exemplary embodiment of connector 200 for mating with a mating connector, having an insulative housing 250 that includes a first mating side 205, and electrically conductive ground layer 210 disposed on and substantially covering first mating side 205 of the insulative housing, and a plurality of signal contacts 201 disposed in the insulative housing for making electrical contact with corresponding signal contacts (not shown) in a mating connector (not shown) from first mating side 205 of the insulative housing, each signal contact 220 in the plurality of signal contacts 201 being electrically isolated from electrically conductive ground layer 210.
[0022] In some embodiments, each signal contact 220 in plurality of contacts 201 is a plug-type contact.
[0023] In some embodiments, each signal contact 220 in plurality of contacts 201 is a jack-type connector.
[0024] Electrically conductive ground layer 210 typically includes a resilient conforming conductive material. In some embodiments, electrically conductive ground layer 210 comprises carbon black. In some embodiments, electrically conductive ground layer 210 comprises other conductive microparticles including, for example, nickel particles. In some embodiments, the resilient conforming conductive material can include an elastomeric polymer. The resilient conforming conductive material typically is able to be compressed and return to its original dimensions, under normal conditions of its intended use.
[0025] In some embodiments, electrically conductive ground layer has a thickness of any of about 0.3 mm, about 0.5 mm, or about 0.7 mm, and has a Z-axis resistance of less than about 0.1 ohms per 25.4 mm x 25.4 mm square, when measured between gold plated brass probes with a 1 kg load and a dwell time of 60 seconds.
[0026] In some embodiments, electrically conductive ground layer 210 comprises an electrically conductive self-supporting layer. Suitable examples of commercially available electrically conductive self-supporting layers include those electrically conductive cushioning gaskets available from 3M Company, St. Paul, MN, under the trade designations "ECG-7033", "ECG-7053", "ECG-7073", "ECG-8035", "ECG-8055", "ECG-8075", and those electrically conductive pads available from 3M Company under the trade designation "3M XYZ ELECTRICALLY CONDUCTIVE ACRYLIC ECAP PADS 7830N".
[0027] FIG. 2b shows a second mating side 215 of connector 200, which includes a plurality of signal contacts 280. Connector 200 includes a plurality of self-supporting conductive layers 270 disposed on mating face 215 between rows of signal contacts 280 and making electrical contact with shield members 260. Shield members 260 include end portions 240. It will be appreciated that self- supporting conductive layers 270 can provide, for example, an optimized path to ground relative to signal trace length, and can also reduce the number of vias (and holes for vias) required for connecting the shield members to the mating connector.
[0028] FIG. 2c is an exploded view of connector 200, showing insulating housing 250 and mating side 205 of the insulative housing, and electrically conductive ground layer 210 that is disposed on and substantially covers mating side 205 of insulative housing 250. Also shown in FIG. 2c are signal contacts 220 that pass though openings 230 defined in electrically conductive ground layer 210. Signal contacts 220 are disposed for making electrical contact with corresponding signal contacts in a mating connector from mating side 205 of insulative housing 250, each signal contact 220 being electrically isolated from electrically conductive ground layer 210.
[0029] FIG. 2d is an enlarged view of a portion of FIG. 2c, showing signal contacts 220 and one or more grounding members 270. In typical embodiments of connector 200, mating side 205 includes an array of signal contacts 220 and grounding members 270, the grounding members 270 making electrical contact with electrically conductive ground layer 210, but being electrically isolated from signal contacts 220.
Embodiments:
Item 1. A connector, comprising:
an electrically conductive face; and
a plurality of electrical contacts disposed in the electrically conductive face for making electrical contact with corresponding electrical contacts in a mating face, each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face.
Item 2. The connector of item 1, wherein the plurality of electrical contacts comprises at least one signal contact.
Item 3. The connector of item 1, wherein the plurality of electrical contacts comprises at least one ground contact.
Item 4. The connector of any preceding item, wherein the connector further comprises at least one ground contact disposed in the electrically conductive face for making electrical contact with a corresponding ground contact in a mating face and making electrical contact with the electrically conductive face.
Item 5. The connector of any preceding item, wherein the plurality of electrical contacts comprises at least one power contact. Item 6. The connector of any preceding item, further comprising an insulating body for housing the plurality of electrical contacts, and a self-supporting conductive layer disposed on the insulating body, the self-supporting conductive layer comprising the electrically conductive face.
Item 7. The connector of any preceding item, wherein the mating face is the mating face of a mating connector.
Item 8. The connector of any of items 1 to 6, wherein the mating face is a portion of a printed circuit board.
Item 9. A connector for mating with a mating connector, comprising:
an insulative housing comprising a mating side;
an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing; and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.
Item 10. The connector of item 9, wherein each signal contact in the plurality of signal contacts is a plug-type signal contact.
Item 1 1. The connector of item 9, wherein each signal contact in the plurality of signal contacts is a jack-type signal contact.
Item 12. The connector of any one of items 9 to 1 1, wherein the electrically conductive ground layer comprises carbon black.
Item 13. The connector of any one of items 9 to 12, wherein the electrically conductive ground layer comprises an electrically conductive self-supporting layer.

Claims

What is claimed is:
1. A connector, comprising:
an electrically conductive face; and
a plurality of electrical contacts disposed in the electrically conductive face for making electrical contact with corresponding electrical contacts in a mating face, each electrical contact in the plurality of electrical contacts being electrically isolated from the electrically conductive face.
2. The connector of claim 1, wherein the plurality of electrical contacts comprises at least one signal contact.
3. The connector of claim 1, wherein the plurality of electrical contacts comprises at least one ground contact.
4. The connector of claim 1, wherein the connector further comprises at least one ground contact disposed in the electrically conductive face for making electrical contact with a corresponding ground contact in a mating face and making electrical contact with the electrically conductive face.
5. The connector of claim 1, wherein the plurality of electrical contacts comprises at least one power contact.
6. The connector of claim 1, further comprising an insulating body for housing the plurality of electrical contacts, and a self-supporting conductive layer disposed on the insulating body, the self- supporting conductive layer comprising the electrically conductive face.
7. The connector of claim 1, wherein the mating face is the mating face of a mating connector.
8. The connector of claim 1, wherein the mating face is a portion of a printed circuit board.
9. A connector for mating with a mating connector, comprising:
an insulative housing comprising a mating side;
an electrically conductive ground layer disposed on and substantially covering the mating side of the insulative housing; and a plurality of signal contacts disposed in the insulative housing for making electrical contact with corresponding signal contacts in a mating connector from the mating side of the insulative housing, each signal contact in the plurality of signal contacts being electrically isolated from the electrically conductive ground layer.
10. The connector of claim 9, wherein each signal contact in the plurality of signal contacts is a plug-type signal contact.
1 1. The connector of claim 9, wherein each signal contact in the plurality of signal contacts is a jack- type signal contact.
12. The connector of claim 9, wherein the electrically conductive ground layer comprises carbon black.
13. The connector of claim 9, wherein the electrically conductive ground layer comprises an electrically conductive self-supporting layer.
PCT/US2013/022716 2012-04-05 2013-01-23 Electrical connector with electrically conductive face WO2013151608A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261620532P 2012-04-05 2012-04-05
US61/620,532 2012-04-05

Publications (1)

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WO2013151608A1 true WO2013151608A1 (en) 2013-10-10

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020151218A1 (en) * 2000-12-28 2002-10-17 Intel Corporation Method of fabrication for a socket with embedded conductive structure
US20100151741A1 (en) * 2008-12-05 2010-06-17 James Lee Fedder Electrical Connector System
US8002581B1 (en) * 2010-05-28 2011-08-23 Tyco Electronics Corporation Ground interface for a connector system
US8025531B1 (en) * 2010-12-16 2011-09-27 Intel Corporation Shielded socket housing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020151218A1 (en) * 2000-12-28 2002-10-17 Intel Corporation Method of fabrication for a socket with embedded conductive structure
US20100151741A1 (en) * 2008-12-05 2010-06-17 James Lee Fedder Electrical Connector System
US8002581B1 (en) * 2010-05-28 2011-08-23 Tyco Electronics Corporation Ground interface for a connector system
US8025531B1 (en) * 2010-12-16 2011-09-27 Intel Corporation Shielded socket housing

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