WO2013146638A1 - Electrical connection structure between conductor and conductor - Google Patents

Electrical connection structure between conductor and conductor Download PDF

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Publication number
WO2013146638A1
WO2013146638A1 PCT/JP2013/058501 JP2013058501W WO2013146638A1 WO 2013146638 A1 WO2013146638 A1 WO 2013146638A1 JP 2013058501 W JP2013058501 W JP 2013058501W WO 2013146638 A1 WO2013146638 A1 WO 2013146638A1
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Prior art keywords
conductor
compression
compression portion
experimental example
electrical connection
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PCT/JP2013/058501
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French (fr)
Japanese (ja)
Inventor
宮本　賢次
小野　純一
智也 太田
拓次 大塚
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
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Publication of WO2013146638A1 publication Critical patent/WO2013146638A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes

Definitions

  • the present invention relates to an electrical connection structure between conductors.
  • Patent Document 1 a structure described in Patent Document 1 is known as a structure for electrically connecting conductors to each other.
  • This electrical connection structure is formed on the surface of a conductor by applying ultrasonic vibration to a plurality of bundled conductors (corresponding to the strands of Patent Document 1), and an oxide film having a relatively large electrical resistance. Etc., and the metal surfaces exposed by peeling off the coating come into contact with each other. As a result, a plurality of conductors are electrically connected.
  • the present invention has been completed based on the above circumstances, and an object of the present invention is to provide an electrical connection structure between a conductor and a simplified manufacturing process.
  • the present invention is an electrical connection structure between a conductor, a first conductor, a second conductor overlaid on the first conductor, and at least one of the first conductor and the second conductor, A low compression portion that is compressed toward the other of the first conductor and the second conductor, and a high compression portion that is formed adjacent to the low compression portion and is compressed more than the low compression portion.
  • (Cross-sectional area of the conductor after compression / cross-sectional area of the conductor before compression) ⁇ 100 (%)
  • the compression ratio of the low compression portion is set to be larger than 50%
  • the compression rate of the high compression part is set to be smaller than 50%.
  • the first conductor and the second conductor strongly rub against each other in the region between the low compression portion and the high compression portion formed adjacent to the low compression portion.
  • the oxide film formed on the surface of the first conductor and the oxide film formed on the surface of the second conductor are peeled off, and the metal surfaces of the first conductor and the second conductor are exposed. When the metal surfaces come into contact with each other, the electrical resistance between the first conductor and the second conductor can be reduced.
  • first conductor and the second conductor can be electrically connected by a simple method of overlapping the first conductor and the second conductor and compressing one of them toward the other.
  • the compression ratio of the high compression part is preferably set to 35% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere at least partially, the electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
  • the compression ratio of the high compression part is preferably set to 25% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere and metal-bond, an electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
  • the compression ratio of the high compression part is preferably set to 20% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere firmly and are metal-bonded, the electrical resistance between a 1st conductor and a 2nd conductor can be made small reliably. .
  • the first conductor and the second conductor is aluminum or an aluminum alloy
  • an oxide film is easily formed on the surface of aluminum, which is particularly effective.
  • both the first conductor and the second conductor are aluminum or an aluminum alloy, an oxide film is easily formed on the aluminum surface, which is particularly effective.
  • the low compression portion and the high compression portion are formed on both the first conductor and the second conductor. According to said aspect, the electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
  • the manufacturing process can be simplified for the electrical connection structure between the conductors.
  • FIG. 1 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view showing a state in which the first conductor and the second conductor are overlapped.
  • FIG. 3 is a plan view showing a state in which the first conductor and the second conductor are overlapped.
  • FIG. 4 is a cross-sectional view showing a state before pressure-processing the superimposed first conductor and second conductor from above and below with the lower mold and the upper mold.
  • FIG. 5 is a cross-sectional view showing a state where the superimposed first conductor and second conductor are pressed from above and below with the lower mold and the upper mold.
  • FIG. 1 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view showing a state in which the first conductor and the second conductor
  • FIG. 6 is a cross-sectional view showing a state in which the superimposed first conductor and second conductor are pressed from above and below with the lower mold and the upper mold in Experimental Example 8.
  • FIG. 7 is a graph showing the relationship between compressibility and tensile strength.
  • FIG. 8 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 1.
  • FIG. 9 is an SEM photograph at 200 ⁇ magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 1.
  • FIG. 10 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 2.
  • FIG. 8 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 1.
  • FIG. 11 is an SEM photograph at a magnification of 200 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 2.
  • FIG. 12 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 3.
  • FIG. 13 is an SEM photograph at 200 ⁇ magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 3.
  • FIG. 14 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 4.
  • FIG. 15 is an SEM photograph at 200 ⁇ magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 4.
  • FIG. 16 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 5.
  • FIG. 17 is an SEM photograph of 200 times magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 5.
  • FIG. 18 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 6.
  • FIG. 19 is an SEM photograph at 200 ⁇ magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 6.
  • FIG. 20 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 7.
  • FIG. 21 is a SEM photograph at 200 ⁇ magnification showing the electrical connection portion between the first conductor and the second conductor according to Experimental Example 7.
  • FIG. 22 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 8.
  • FIG. 23 is an SEM photograph of 200 times magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 8.
  • FIG. 24 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 2 of the present invention.
  • FIG. 25 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 3 of the present invention.
  • FIG. 26 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 4 of the present invention.
  • Embodiment 1 of the present invention will be described with reference to FIGS.
  • the first conductor 10 and the second conductor 11 which are made of metal and have a plate shape are electrically connected in a state where they are overlapped with each other.
  • the first conductor 10 and the second conductor 11 are made of aluminum or an aluminum alloy.
  • the first conductor 10 and the second conductor 11 are formed in a plate shape having a rectangular cross-sectional shape.
  • a second conductor 11 is overlaid on the first conductor 10 located on the lower side in FIG.
  • the metal constituting the first conductor 10 and the metal constituting the second conductor 11 may be the same or different.
  • the metal composing the first conductor 10 or the second conductor 11 is appropriately selected from an arbitrary metal such as aluminum, copper, iron, titanium, tin, zinc, nickel, or an alloy containing at least one of these as required. You can choose.
  • a low compression portion 12 compressed on the second conductor 11 side (upward) is formed on the lower surface of the first conductor 10. Near the center of the low compression portion 12, a high compression portion 13 that is adjacent to the low compression portion 12 and is compressed more than the low compression portion 12 is formed.
  • a low compression portion 12 is formed on the upper surface of the second conductor 11 on the first conductor 10 side (downward). Near the center of the low compression portion 12, a high compression portion 13 that is adjacent to the low compression portion 12 and is compressed more than the low compression portion 12 is formed.
  • the compression ratio is defined as (cross-sectional area of the conductor after compression / cross-sectional area of the conductor before compression) ⁇ 100 (%).
  • the compression rate of the low compression part 12 is larger than 50%. By setting it to be larger than 50%, it is possible to reduce damage given by the compression of the first conductor 10 and the second conductor 11.
  • the compression rate of the high compression section 13 is preferably smaller than 50%.
  • the compression ratio By setting the compression ratio to be smaller than 50%, the electrical resistance between the first conductor 10 and the second conductor 11 can be reduced. This is due to the following reason. That is, when the first conductor 10 and the second conductor 11 are compressed, the first conductor 10 and the second conductor 11 are deformed so as to flow in the compressed region. At this time, the first conductor 10 and the second conductor 11 rub against each other strongly between the low compression portion 12 and the high compression portion 13 formed adjacent to the low compression portion 12. Then, the oxide film formed on the surface of the first conductor 10 and the oxide film formed on the surface of the second conductor 11 are rubbed and peeled off.
  • the metal surface which comprises the 1st conductor 10 is exposed, and the metal surface which comprises the 2nd conductor 11 is exposed. And the electrical resistance of the 1st conductor 10 and the 2nd conductor 11 is reduced when the metal surface of the 1st conductor 10 and the metal surface of the 2nd conductor 11 contact.
  • the compression ratio of the high compression section 13 is 35% or less.
  • the first conductor 10 and the second conductor 11 are at least partially adhered in the region between the low compression portion 12 and the high compression portion 13. Thereby, the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
  • the compression rate of the high compression part 13 is particularly preferably 25% or less.
  • the first conductor 10 and the second conductor 11 are adhered and metal-bonded. Thereby, the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
  • the compression ratio of the high compression section 13 is 20% or less.
  • the compression rate is particularly preferable that the first conductor 10 and the second conductor 11 are securely adhered and metal-bonded. Thereby, the electrical resistance between the 1st conductor 10 and the 2nd conductor 11 can be made small reliably.
  • first conductor 10 and the second conductor 11 can be electrically connected to each other by a simple technique in which the first conductor 10 and the second conductor 11 are overlapped and one is compressed toward the other.
  • a projection 15 projecting downward is formed on the lower surface of the upper mold 16 located on the upper side.
  • the lower surface of the upper mold 16 has a 10 mm square shape.
  • the protrusion 15 is formed near the center of the lower surface of the upper mold 16.
  • the protrusion 15 has a square shape of 4 mm square when viewed from the lower surface.
  • the first conductor 10 and the second conductor 11 are sandwiched and compressed from above and below by the lower mold 14 and the upper mold 16. As a result, the first conductor 10 and the second conductor 11 are formed with a low compression portion 12 and a high compression portion 13 adjacent to the low compression portion 12.
  • the first conductor 10 is formed with a low compression portion 12 at a position corresponding to the upper surface of the lower mold 14, and at a position corresponding to the protrusion 15 of the lower mold 14. Is formed.
  • the second conductor 11 has a low compression portion 12 formed at a position corresponding to the lower surface of the upper mold 16 and a high compression portion 13 formed at a position corresponding to the protrusion 15 of the upper mold 16. .
  • the compressibility of the low compression portion 12 and the high compression portion 13 formed on the first conductor 10 is measured as follows. First, the thickness dimension of the first conductor 10 before compression is measured. Then, the thickness dimension of the low compression part 12 and the high compression part 13 is measured after compression. The compression ratio of the low compression portion 12 is calculated by (thickness size of the low compression portion 12 after compression / thickness size of the first conductor 10 before compression) ⁇ 100 (%). Further, the compression ratio of the high compression portion 13 is calculated by (thickness size of the high compression portion 13 after compression / thickness size of the first conductor 10 before compression) ⁇ 100 (%).
  • the compression rate according to the present embodiment does not consider the volume escaped outward of the lower mold 14 and the upper mold 16, and remains in at least the low compression part 12 or the high compression part 13, so that the first conductor Only the volume of the portion that contributes to the connection between 10 and the second conductor 11 is considered. For this reason, there is no problem even if the compression rate is calculated based on the thickness dimensions of the low compression portion 12 and the high compression portion 13.
  • the compression rate may be calculated as follows, for example. First, after observing the cross sections of the first conductor 10 and the second conductor 11 before compression with an SEM, the cross-sectional areas of the first conductor 10 and the second conductor 11 are calculated by known image analysis. Next, the cross sections of the compressed first conductor 10 and second conductor 11 are calculated by image analysis in the same manner as described above. Thereafter, the compression rate may be calculated according to the definition of the compression rate.
  • the compression ratio of the low compression section 12 was fixed at 55%, and the compression ratio of the high compression section 13 was varied. Specifically, the compression ratio of the high compression unit 13 in each experimental example is 10% in experimental example 1, 15% in experimental example 2, 20% in experimental example 3, and 25 in experimental example 4. %, 30% in Experimental Example 5, 35% in Experimental Example 6, and 50% in Experimental Example 7.
  • Example 8 As shown in FIG. 6, the first conductor 10 and the second conductor 11 stacked one above the other are compressed from above and below by a pair of molds 18 and 19.
  • the upper surface of the lower mold 18 has a 10 mm square shape.
  • the lower surface of the upper mold 19 has a square shape of 10 mm square.
  • the first conductor 10 and the second conductor 11 are sandwiched and compressed by the lower mold 18 and the upper mold 19 from above and below.
  • one compression portion 17 is formed on the first conductor 10, and one compression portion 17 is also formed on the second conductor 11.
  • the compression ratio of the compression unit 17 in Experimental Example 8 is set to 20%.
  • FIG. 6 shows the relationship between tensile strength and compressibility.
  • the compression rate of the high compression unit 13 was plotted, and for Experimental Example 8, the compression rate of the compression unit 17 was plotted.
  • Example 1 In FIG. 8, the SEM photograph which expanded the fracture
  • Example 2 In FIG. 10, the SEM photograph which expanded the fracture
  • Experimental Example 2 As in Experimental Example 1, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. For this reason, after the tensile test, the other of the first conductor 10 and the second conductor 11 was fixed and remained.
  • FIG. 11 the SEM photograph which expanded the same part by 200 time is shown. A state in which the first conductor 10 and the second conductor 11 are fixed is shown.
  • Example 3 In FIG. 12, the SEM photograph which expanded the fracture
  • Experimental Example 3 As in Experimental Example 1, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. For this reason, after the tensile test, the other of the first conductor 10 and the second conductor 11 was fixed and remained.
  • FIG. 13 the SEM photograph which expanded the same part 200 times is shown. A state in which the first conductor 10 and the second conductor 11 are fixed is shown.
  • FIG. 14 the SEM photograph which expanded the fracture
  • the tensile strength was 321.7 N
  • one of the first conductor 10 and the second conductor 11 was not firmly fixed to the extent that the other was fixed.
  • the state in which the first conductor 10 and the second conductor 11 are fixed is not shown in FIG.
  • FIG. 15 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
  • FIG. 16 the SEM photograph which expanded the fracture
  • the tensile strength was 0 N
  • FIG. 16 enlarged 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed.
  • FIG. 17 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
  • FIG. 18 the SEM photograph which expanded the fracture
  • the tensile strength was 0 N
  • FIG. 18 enlarged by 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed.
  • FIG. 19 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
  • Example 7 In FIG. 20, the SEM photograph which expanded the fracture
  • the tensile strength was 0 N
  • FIG. 20 expanded by 30 time.
  • FIG. 21 in which the same portion is enlarged 200 times does not show a state where the surface of the first conductor 10 or the second conductor 11 is rough. For this reason, in Experimental Example 7, it can be seen that the first conductor 10 and the second conductor 11 were not adhered microscopically in the region between the high compression portion 13 and the low compression portion 12. .
  • FIG. 22 the SEM photograph which expanded the fracture
  • the tensile strength was 0 N
  • FIG. 22 enlarged 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed.
  • FIG. 23 in which the same portion is enlarged 200 times does not show a state where the surface of the first conductor 10 or the second conductor 11 is rough. For this reason, in Experimental Example 8, it can be seen that the first conductor 10 and the second conductor 11 were not adhered microscopically in the compression portion 17.
  • one compression portion 17 is formed on the lower surface of the first conductor 10.
  • the low compression portion 12 is formed on the upper surface of the second conductor 11 at a position corresponding to the compression portion 17.
  • a high compression portion 13 is formed adjacent to the low compression portion 12 at a substantially central position of the low compression portion 12.
  • the first conductor 10 and the second conductor 11 rub against each other strongly in the region between the low compression portion 12 and the high compression portion 13 formed in the second conductor 11.
  • the oxide film formed on the surface of the first conductor 10 and the oxide film formed on the surface of the second conductor 11 are peeled off by rubbing.
  • the metal surface which comprises the 1st conductor 10 is exposed, and the metal surface which comprises the 2nd conductor 11 is exposed.
  • the electrical resistance of the 1st conductor 10 and the 2nd conductor 11 is reduced.
  • the low compression portion 12 is formed on the upper surface of the second conductor 11.
  • two high compression portions 13 are formed side by side in the left-right direction in FIG.
  • the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
  • the low compression portion 12 is formed on the lower surface of the first conductor 10 at a position near the tip of the first conductor 10.
  • a high compression portion 13 is formed adjacent to the low compression portion 12 at a position opposite to the tip with respect to the low compression portion 12.
  • a high compression portion 13 is formed on the upper surface of the second conductor 11 at a position near the tip of the second conductor 11.
  • a low compression portion 12 is formed adjacent to the high compression portion 13 at a position opposite to the tip.
  • the present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
  • the first conductor 10 and the second conductor 11 are plate members having a rectangular cross-sectional shape.
  • the present invention is not limited to this, and the cross-sectional shapes of the first conductor 10 and the second conductor 11 may be circular or elliptical. Alternatively, it may be a polygonal shape such as a triangular shape or a square shape, and an arbitrary shape can be appropriately selected as necessary.
  • the surface of the first conductor 10 and the second conductor 11 may be subjected to a known treatment such as polishing treatment, acid treatment, or alkali treatment.
  • the high compression part 13 should just be formed adjacent to the low compression part 12, for example, it is good also as a structure by which the several high compression part 13 is formed adjacent to one low compression part 12, Moreover, it is good also as a structure by which the several low compression part 12 is formed adjacent to the one high compression part 13, and it can be set as arbitrary forms as needed.
  • any one of a plurality (three or more) of conductors constituting the multilayer body may be the first conductor 10, and the conductor overlapping the first conductor 10 may be the second conductor 11.
  • the first conductor 10 and the second conductor 11 may have different shapes.

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  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

An electrical connection structure between a first conductor (10) and a second conductor (11) is equipped with a first conductor (10), a second conductor (11) which overlaps the first conductor (10), a low-compression section (12) positioned in the first conductor (10) and/or the second conductor (11), and compressed toward the other of the pair, and a high-compression section (13) formed next to the low-compression section (12) and compressed to a higher degree than the low-compression section (12). Therein, the compression rate of the low-compression section (12) is set higher than 50%, and the compression rate of the high-compression section (13) is set lower than 50%, given that the compression rates are defined as (cross-sectional area of conductor after compression/cross-sectional area of conductor before compression)×100(%).

Description

導体と導体との電気的接続構造Electrical connection structure between conductors
　本発明は、導体と導体との電気的接続構造に関する。 The present invention relates to an electrical connection structure between conductors.
　従来、導体と導体とを電気的に接続するための構造として、特許文献１に記載のものが知られている。この電気的接続構造は、束ねられた複数の導体（特許文献１に係る素線に相当）に超音波振動を与えることにより、導体の表面に形成されると共に電気抵抗が比較的に大きな酸化膜等の被膜を剥がし、被膜が剥がされることにより露出された金属表面同士が互いに接触するようになっている。これにより、複数の導体間が電気的に接続されるようになっている。 Conventionally, a structure described in Patent Document 1 is known as a structure for electrically connecting conductors to each other. This electrical connection structure is formed on the surface of a conductor by applying ultrasonic vibration to a plurality of bundled conductors (corresponding to the strands of Patent Document 1), and an oxide film having a relatively large electrical resistance. Etc., and the metal surfaces exposed by peeling off the coating come into contact with each other. As a result, a plurality of conductors are electrically connected.
特開２０１１－８２１２７号公報JP 2011-82127 A
　しかしながら上記の構成によると、導体に対して超音波振動を与えるための工程が必要となる。 However, according to the above configuration, a process for applying ultrasonic vibration to the conductor is required.
　本発明は上記のような事情に基づいて完成されたものであって、製造工程が簡略化された、導体と導体との電気的接続構造を提供することを目的とする。 The present invention has been completed based on the above circumstances, and an object of the present invention is to provide an electrical connection structure between a conductor and a simplified manufacturing process.
　本発明は、導体と導体との電気的接続構造であって、第１導体と、前記第１導体に重ねられた第２導体と、前記第１導体及び前記第２導体の少なくとも一方に、前記第１導体及び前記第２導体の他方に向かって圧縮された低圧縮部と、前記低圧縮部に隣接して形成されると共に前記低圧縮部よりも高圧縮された高圧縮部と、を備え、（圧縮後の導体の断面積／圧縮前の導体の断面積）×１００（％）で定義された圧縮率について、前記低圧縮部の圧縮率は５０％よりも大きく設定されており、前記高圧縮部の圧縮率は５０％よりも小さく設定されている。 The present invention is an electrical connection structure between a conductor, a first conductor, a second conductor overlaid on the first conductor, and at least one of the first conductor and the second conductor, A low compression portion that is compressed toward the other of the first conductor and the second conductor, and a high compression portion that is formed adjacent to the low compression portion and is compressed more than the low compression portion. , (Cross-sectional area of the conductor after compression / cross-sectional area of the conductor before compression) × 100 (%), the compression ratio of the low compression portion is set to be larger than 50%, The compression rate of the high compression part is set to be smaller than 50%.
　本発明によれば、低圧縮部と、この低圧縮部に隣接して形成された高圧縮部との間の領域において、第１導体と第２導体とが強くこすれ合う。これにより、第１導体の表面に形成された酸化膜と、第２導体の表面に形成された酸化膜とが剥がれて、第１導体及び第２導体の金属面が露出する。この金属面同士が互いに接触することにより、第１導体と第２導体との間の電気的抵抗を小さくすることができる。 According to the present invention, the first conductor and the second conductor strongly rub against each other in the region between the low compression portion and the high compression portion formed adjacent to the low compression portion. As a result, the oxide film formed on the surface of the first conductor and the oxide film formed on the surface of the second conductor are peeled off, and the metal surfaces of the first conductor and the second conductor are exposed. When the metal surfaces come into contact with each other, the electrical resistance between the first conductor and the second conductor can be reduced.
　また、第１導体と第２導体とを重ねて、一方を他方に向かって圧縮するという簡易な手法により第１導体と第２導体とを電気的に接続することができる。 Further, the first conductor and the second conductor can be electrically connected by a simple method of overlapping the first conductor and the second conductor and compressing one of them toward the other.
　本発明の実施態様としては以下の態様が好ましい。 The following embodiments are preferred as embodiments of the present invention.
　前記高圧縮部の圧縮率は、３５％以下に設定されていることが好ましい。上記の態様によれば、第１導体と、第２導体とが少なくとも部分的に凝着するので、第１導体と第２導体との間の電気的抵抗を更に小さくすることができる。 The compression ratio of the high compression part is preferably set to 35% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere at least partially, the electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
　前記高圧縮部の圧縮率は、２５％以下に設定されていることが好ましい。上記の態様によれば、第１導体と、第２導体とが凝着して金属結合するので、第１導体と第２導体との間の電気的抵抗を更に小さくすることができる。 The compression ratio of the high compression part is preferably set to 25% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere and metal-bond, an electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
　前記高圧縮部の圧縮率は、２０％以下に設定されていることが好ましい。上記の態様によれば、第１導体と、第２導体とが確実に凝着して金属結合するので、第１導体と第２導体との間の電気的抵抗を確実に小さくすることができる。 The compression ratio of the high compression part is preferably set to 20% or less. According to said aspect, since a 1st conductor and a 2nd conductor adhere firmly and are metal-bonded, the electrical resistance between a 1st conductor and a 2nd conductor can be made small reliably. .
　前記第１導体及び前記第２導体の少なくとも一つがアルミニウム又はアルミニウム合金である場合には、アルミニウムの表面には酸化膜が形成されやすいので、特に有効である。 When at least one of the first conductor and the second conductor is aluminum or an aluminum alloy, an oxide film is easily formed on the surface of aluminum, which is particularly effective.
　前記第１導体及び前記第２導体の双方がアルミニウム又はアルミニウム合金である場合には、アルミニウムの表面には酸化膜が形成されやすいので、特に有効である。 When both the first conductor and the second conductor are aluminum or an aluminum alloy, an oxide film is easily formed on the aluminum surface, which is particularly effective.
　前記第１導体及び前記第２導体の双方に、前記低圧縮部及び前記高圧縮部が形成されている事が好ましい。上記の態様によれば、第１導体と第２導体との間の電気的な抵抗を更に小さくすることができる。 It is preferable that the low compression portion and the high compression portion are formed on both the first conductor and the second conductor. According to said aspect, the electrical resistance between a 1st conductor and a 2nd conductor can be made still smaller.
　本発明によれば、導体と導体との電気的接続構造につき、製造工程を簡略化することができる。 According to the present invention, the manufacturing process can be simplified for the electrical connection structure between the conductors.
図１は本発明の実施形態１に係る第１導体と第２導体との電気的接続構造を示す断面図である。FIG. 1 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 1 of the present invention. 図２は第１導体と第２導体とを重ね合わせた状態を示す斜視図である。FIG. 2 is a perspective view showing a state in which the first conductor and the second conductor are overlapped. 図３は第１導体と第２導体とを重ね合わせた状態を示す平面図である。FIG. 3 is a plan view showing a state in which the first conductor and the second conductor are overlapped. 図４は重ね合わされた第１導体と第２導体を、上下から下側金型及び上側金型で加圧加工する前の状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state before pressure-processing the superimposed first conductor and second conductor from above and below with the lower mold and the upper mold. 図５は重ね合わされた第１導体と第２導体を、上下から下側金型及び上側金型で加圧加工している状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state where the superimposed first conductor and second conductor are pressed from above and below with the lower mold and the upper mold. 図６は実験例８につき、重ね合わされた第１導体と第２導体を、上下から下側金型及び上側金型で加圧加工している状態を示す断面図である。FIG. 6 is a cross-sectional view showing a state in which the superimposed first conductor and second conductor are pressed from above and below with the lower mold and the upper mold in Experimental Example 8. 図７は圧縮率と引張強度との関係を示すグラフである。FIG. 7 is a graph showing the relationship between compressibility and tensile strength. 図８は実験例１に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 8 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 1. 図９は実験例１に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 9 is an SEM photograph at 200 × magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 1. 図１０は実験例２に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 10 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 2. 図１１は実験例２に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 11 is an SEM photograph at a magnification of 200 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 2. 図１２は実験例３に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 12 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 3. 図１３は実験例３に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 13 is an SEM photograph at 200 × magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 3. 図１４は実験例４に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 14 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 4. 図１５は実験例４に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 15 is an SEM photograph at 200 × magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 4. 図１６は実験例５に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 16 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 5. 図１７は実験例５に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 17 is an SEM photograph of 200 times magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 5. 図１８は実験例６に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 18 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 6. 図１９は実験例６に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 19 is an SEM photograph at 200 × magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 6. 図２０は実験例７に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 20 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 7. 図２１は実験例７に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 21 is a SEM photograph at 200 × magnification showing the electrical connection portion between the first conductor and the second conductor according to Experimental Example 7. 図２２は実験例８に係る第１導体と第２導体との電気的接続部分を示す、倍率３０倍のＳＥＭ写真である。FIG. 22 is an SEM photograph at a magnification of 30 times showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 8. 図２３は実験例８に係る第１導体と第２導体との電気的接続部分を示す、倍率２００倍のＳＥＭ写真である。FIG. 23 is an SEM photograph of 200 times magnification showing an electrical connection portion between the first conductor and the second conductor according to Experimental Example 8. 図２４は本発明の実施形態２に係る第１導体と第２導体との電気的接続構造を示す断面図である。FIG. 24 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 2 of the present invention. 図２５は本発明の実施形態３に係る第１導体と第２導体との電気的接続構造を示す断面図である。FIG. 25 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 3 of the present invention. 図２６は本発明の実施形態４に係る第１導体と第２導体との電気的接続構造を示す断面図である。FIG. 26 is a cross-sectional view showing an electrical connection structure between a first conductor and a second conductor according to Embodiment 4 of the present invention.
　＜実施形態１＞
　本発明の実施形態１を、図１ないし図７を参照しつつ説明する。本実施形態は、金属製であって板状をなす第１導体１０及び第２導体１１が、互いに重ねられた状態で電気的に接続されている。第１導体１０及び第２導体１１は、アルミニウム又はアルミニウム合金製である。第１導体１０及び第２導体１１は、断面形状が矩形状をなす板状に形成されている。図１における下側に位置する第１導体１０の上には第２導体１１が重ねられている。 <Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. In the present embodiment, the first conductor 10 and the second conductor 11 which are made of metal and have a plate shape are electrically connected in a state where they are overlapped with each other. The first conductor 10 and the second conductor 11 are made of aluminum or an aluminum alloy. The first conductor 10 and the second conductor 11 are formed in a plate shape having a rectangular cross-sectional shape. A second conductor 11 is overlaid on the first conductor 10 located on the lower side in FIG.
　第１導体１０を構成する金属と、第２導体１１を構成する金属は、同じであってもよく、また、異なっていてもよい。第１導体１０又は第２導体１１を構成する金属は、アルミニウム、銅、鉄、チタニウム、錫、亜鉛、ニッケル等の、任意の金属又はこれらの少なくとも一種を含む合金から、必要に応じて適宜に選択することができる。 The metal constituting the first conductor 10 and the metal constituting the second conductor 11 may be the same or different. The metal composing the first conductor 10 or the second conductor 11 is appropriately selected from an arbitrary metal such as aluminum, copper, iron, titanium, tin, zinc, nickel, or an alloy containing at least one of these as required. You can choose.
　第１導体１０の下面には、第２導体１１側（上方）に圧縮された低圧縮部１２が形成されている。この低圧縮部１２の中央付近には、低圧縮部１２に隣接すると共に低圧縮部１２よりも高圧縮された高圧縮部１３が形成されている。 A low compression portion 12 compressed on the second conductor 11 side (upward) is formed on the lower surface of the first conductor 10. Near the center of the low compression portion 12, a high compression portion 13 that is adjacent to the low compression portion 12 and is compressed more than the low compression portion 12 is formed.
　また、第２導体１１の上面には、第１導体１０側（下方）に低圧縮部１２が形成されている。この低圧縮部１２の中央付近には、低圧縮部１２に隣接すると共に低圧縮部１２よりも高圧縮された高圧縮部１３が形成されている。 Also, a low compression portion 12 is formed on the upper surface of the second conductor 11 on the first conductor 10 side (downward). Near the center of the low compression portion 12, a high compression portion 13 that is adjacent to the low compression portion 12 and is compressed more than the low compression portion 12 is formed.
　圧縮率を、（圧縮後の導体の断面積／圧縮前の導体の断面積）×１００（％）と定義する。このように圧縮率を定義した場合、高圧縮とは圧縮率が小さいことを意味し、低圧縮とは圧縮率が大きいことを意味する。 The compression ratio is defined as (cross-sectional area of the conductor after compression / cross-sectional area of the conductor before compression) × 100 (%). When the compression rate is defined in this way, high compression means that the compression rate is small, and low compression means that the compression rate is large.
（作用、効果）
　続いて、歩実施形態の作用、効果について説明する。まず、低圧縮部１２の圧縮率は、５０％よりも大きいことが好ましい。５０％よりも大きく設定することにより、第１導体１０及び第２導体１１が圧縮されることにより与えられるダメージを軽減することができる。 (Function, effect)
Next, functions and effects of the walking embodiment will be described. First, it is preferable that the compression rate of the low compression part 12 is larger than 50%. By setting it to be larger than 50%, it is possible to reduce damage given by the compression of the first conductor 10 and the second conductor 11.
　高圧縮部１３の圧縮率は、５０％よりも小さいことが好ましい。圧縮率を５０％よりも小さく設定することにより、第１導体１０と第２導体１１との間の電気的抵抗を小さくすることができる。これは、以下の理由による。つまり、第１導体１０と第２導体１１とを圧縮すると、圧縮された領域において、第１導体１０及び第２導体１１が流動するように変形する。このとき、低圧縮部１２と、この低圧縮部１２に隣接して形成された高圧縮部１３との間において、第１導体１０と第２導体１１とが強くこすれ合う。すると、第１導体１０の表面に形成された酸化膜と、第２導体１１の表面に形成された酸化膜とがこすれ合うことによって剥がれる。これにより、第１導体１０を構成する金属表面が露出すると共に、第２導体１１を構成する金属表面が露出する。そして、第１導体１０の金属表面と、第２導体１１の金属表面とが接触することにより、第１導体１０と第２導体１１との電気的抵抗が低減されるようになっている。 The compression rate of the high compression section 13 is preferably smaller than 50%. By setting the compression ratio to be smaller than 50%, the electrical resistance between the first conductor 10 and the second conductor 11 can be reduced. This is due to the following reason. That is, when the first conductor 10 and the second conductor 11 are compressed, the first conductor 10 and the second conductor 11 are deformed so as to flow in the compressed region. At this time, the first conductor 10 and the second conductor 11 rub against each other strongly between the low compression portion 12 and the high compression portion 13 formed adjacent to the low compression portion 12. Then, the oxide film formed on the surface of the first conductor 10 and the oxide film formed on the surface of the second conductor 11 are rubbed and peeled off. Thereby, the metal surface which comprises the 1st conductor 10 is exposed, and the metal surface which comprises the 2nd conductor 11 is exposed. And the electrical resistance of the 1st conductor 10 and the 2nd conductor 11 is reduced when the metal surface of the 1st conductor 10 and the metal surface of the 2nd conductor 11 contact.
　また、高圧縮部１３の圧縮率は、３５％以下であることが、より好ましい。圧縮率を３５％以下に設定することにより、低圧縮部１２と高圧縮部１３との間の領域において、第１導体１０と、第２導体１１とが少なくとも部分的に凝着する。これにより、第１導体１０と第２導体１１との間の電気的抵抗を更に小さくすることができる。 Further, it is more preferable that the compression ratio of the high compression section 13 is 35% or less. By setting the compression rate to 35% or less, the first conductor 10 and the second conductor 11 are at least partially adhered in the region between the low compression portion 12 and the high compression portion 13. Thereby, the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
　更に、高圧縮部１３の圧縮率は、２５％以下であることが、特に好ましい。圧縮率を２５％以下に設定することにより、第１導体１０と、第２導体１１とが凝着して金属結合する。これにより、第１導体１０と第２導体１１との間の電気的抵抗を更に小さくすることができる。 Furthermore, the compression rate of the high compression part 13 is particularly preferably 25% or less. By setting the compression rate to 25% or less, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. Thereby, the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
　更に、高圧縮部１３の圧縮率は、２０％以下であることが、特に好ましい。圧縮率を２０％以下に設定することにより、第１導体１０と、第２導体１１とが確実に凝着して金属結合する。これにより、第１導体１０と第２導体１１との間の電気的抵抗を確実に小さくすることができる。 Furthermore, it is particularly preferable that the compression ratio of the high compression section 13 is 20% or less. By setting the compression rate to 20% or less, the first conductor 10 and the second conductor 11 are securely adhered and metal-bonded. Thereby, the electrical resistance between the 1st conductor 10 and the 2nd conductor 11 can be made small reliably.
　また、第１導体１０と第２導体１１とを重ねて、一方を他方に向かって圧縮するという簡易な手法により第１導体１０と第２導体１１とを電気的に接続することができる。 Also, the first conductor 10 and the second conductor 11 can be electrically connected to each other by a simple technique in which the first conductor 10 and the second conductor 11 are overlapped and one is compressed toward the other.
　（実験例）
　続いて、本発明の効果を確かめるための実験を以下に説明する。図２及び図３に示すように、板状をなす第１導体１０及び第２導体１１の端部を重ねる。第１導体１０及び第２導体１１の幅寸法Ｗは１０ｍｍであり、厚さ寸法Ｔは２ｍｍである。 (Experimental example)
Subsequently, an experiment for confirming the effect of the present invention will be described below. As shown in FIG.2 and FIG.3, the edge part of the 1st conductor 10 and 2nd conductor 11 which make | form a plate shape is accumulated. The width dimension W of the first conductor 10 and the second conductor 11 is 10 mm, and the thickness dimension T is 2 mm.
　（実験例１～７）
　図４に示すように、上下に重ねられた第１導体１０及び第２導体１１を、一対の金型１４，１６によって上下から圧縮する。下側に位置する下側金型１４の上面には、上方に突出する突起１５が形成されている。下側金型１４の上面は、１０ｍｍ四方の正方形状をなしている。突起１５は、下側金型１４の上面の中央付近に形成されている。突起１５は、上面から見て、４ｍｍ四方の正方形状をなしている。 (Experimental Examples 1-7)
As shown in FIG. 4, the first conductor 10 and the second conductor 11 stacked one above the other are compressed from above and below by a pair of molds 14 and 16. On the upper surface of the lower mold 14 located on the lower side, a protrusion 15 protruding upward is formed. The upper surface of the lower mold 14 has a square shape of 10 mm square. The protrusion 15 is formed near the center of the upper surface of the lower mold 14. The protrusion 15 has a square shape of 4 mm square when viewed from above.
　一方、上側に位置する上側金型１６の下面には、下方に突出する突起１５が形成されている。上側金型１６の下面は、１０ｍｍ四方の正方形状をなしている。突起１５は、上側金型１６の下面の中央付近に形成されている。突起１５は、下面から見て、４ｍｍ四方の正方形状をなしている。 On the other hand, a projection 15 projecting downward is formed on the lower surface of the upper mold 16 located on the upper side. The lower surface of the upper mold 16 has a 10 mm square shape. The protrusion 15 is formed near the center of the lower surface of the upper mold 16. The protrusion 15 has a square shape of 4 mm square when viewed from the lower surface.
　図５に示すように、下側金型１４及び上側金型１６によって上下から第１導体１０及び第２導体１１を挟み付けて圧縮する。これにより、第１導体１０及び第２導体１１には、低圧縮部１２と、この低圧縮部１２に隣接する高圧縮部１３とが形成される。 As shown in FIG. 5, the first conductor 10 and the second conductor 11 are sandwiched and compressed from above and below by the lower mold 14 and the upper mold 16. As a result, the first conductor 10 and the second conductor 11 are formed with a low compression portion 12 and a high compression portion 13 adjacent to the low compression portion 12.
　詳細には、第１導体１０には、下側金型１４の上面に対応する位置に低圧縮部１２が形成されると共に、下側金型１４の突起１５に対応する位置に高圧縮部１３が形成される。また、第２導体１１には、上側金型１６の下面に対応する位置に低圧縮部１２が形成されると共に、上側金型１６の突起１５に対応する位置に高圧縮部１３が形成される。 Specifically, the first conductor 10 is formed with a low compression portion 12 at a position corresponding to the upper surface of the lower mold 14, and at a position corresponding to the protrusion 15 of the lower mold 14. Is formed. The second conductor 11 has a low compression portion 12 formed at a position corresponding to the lower surface of the upper mold 16 and a high compression portion 13 formed at a position corresponding to the protrusion 15 of the upper mold 16. .
　第１導体１０に形成された低圧縮部１２及び高圧縮部１３の圧縮率は、以下のようにして測定される。まず、圧縮前の第１導体１０の厚さ寸法を測定する。続いて、圧縮後において低圧縮部１２及び高圧縮部１３の厚さ寸法を測定する。低圧縮部１２の圧縮率は、（圧縮後における低圧縮部１２の厚さ寸法／圧縮前の第１導体１０の厚さ寸法）×１００（％）で算出される。また、高圧縮部１３の圧縮率は、（圧縮後における高圧縮部１３の厚さ寸法／圧縮前の第１導体１０の厚さ寸法）×１００（％）で算出される。 The compressibility of the low compression portion 12 and the high compression portion 13 formed on the first conductor 10 is measured as follows. First, the thickness dimension of the first conductor 10 before compression is measured. Then, the thickness dimension of the low compression part 12 and the high compression part 13 is measured after compression. The compression ratio of the low compression portion 12 is calculated by (thickness size of the low compression portion 12 after compression / thickness size of the first conductor 10 before compression) × 100 (%). Further, the compression ratio of the high compression portion 13 is calculated by (thickness size of the high compression portion 13 after compression / thickness size of the first conductor 10 before compression) × 100 (%).
　下側金型１４及び上側金型１６で挟み付けることにより、第１導体１０及び第２導体１１は、圧縮されると共に、下側金型１４及び上側金型１６の外方に逃げるように変形する。本実施形態に係る圧縮率は、下側金型１４及び上側金型１６の外方に逃げた体積については考慮せず、少なくとも低圧縮部１２又は高圧縮部１３に残存して、第１導体１０と第２導体１１との接続に寄与する部分の体積のみを考慮したものである。このため、低圧縮部１２及び高圧縮部１３の厚さ寸法により圧縮率を算出しても問題はない。 By being sandwiched between the lower mold 14 and the upper mold 16, the first conductor 10 and the second conductor 11 are compressed and deformed so as to escape to the outside of the lower mold 14 and the upper mold 16. To do. The compression rate according to the present embodiment does not consider the volume escaped outward of the lower mold 14 and the upper mold 16, and remains in at least the low compression part 12 or the high compression part 13, so that the first conductor Only the volume of the portion that contributes to the connection between 10 and the second conductor 11 is considered. For this reason, there is no problem even if the compression rate is calculated based on the thickness dimensions of the low compression portion 12 and the high compression portion 13.
　また、圧縮率は例えば以下のようにして算出してもよい。まず、圧縮前の第１導体１０及び第２導体１１の断面をＳＥＭにより観察した後に、公知の画像解析により第１導体１０及び第２導体１１の断面積を算出する。次いで、圧縮後の第１導体１０及び第２導体１１の断面を上記と同様にして画像解析により算出する。その後、圧縮率の定義に従って、圧縮率を算出してもよい。 Further, the compression rate may be calculated as follows, for example. First, after observing the cross sections of the first conductor 10 and the second conductor 11 before compression with an SEM, the cross-sectional areas of the first conductor 10 and the second conductor 11 are calculated by known image analysis. Next, the cross sections of the compressed first conductor 10 and second conductor 11 are calculated by image analysis in the same manner as described above. Thereafter, the compression rate may be calculated according to the definition of the compression rate.
　実験例１～７においては、低圧縮部１２の圧縮率を５５％で一定とし、高圧縮部１３の圧縮率をそれぞれ異ならせた。具体的には、各実験例における高圧縮部１３の圧縮率は、実験例１が１０％であり、実験例２が１５％であり、実験例３が２０％であり、実験例４が２５％であり、実験例５が３０％であり、実験例６が３５％であり、実験例７が５０％とした。 In Experimental Examples 1 to 7, the compression ratio of the low compression section 12 was fixed at 55%, and the compression ratio of the high compression section 13 was varied. Specifically, the compression ratio of the high compression unit 13 in each experimental example is 10% in experimental example 1, 15% in experimental example 2, 20% in experimental example 3, and 25 in experimental example 4. %, 30% in Experimental Example 5, 35% in Experimental Example 6, and 50% in Experimental Example 7.
　（実験例８）
　図６に示すように、上下に重ねられた第１導体１０及び第２導体１１を、一対の金型１８，１９によって上下から圧縮する。下側金型１８の上面は、１０ｍｍ四方の正方形状をなしている。一方、上側金型１９の下面は、１０ｍｍ四方の正方形状をなしている。 (Experimental example 8)
As shown in FIG. 6, the first conductor 10 and the second conductor 11 stacked one above the other are compressed from above and below by a pair of molds 18 and 19. The upper surface of the lower mold 18 has a 10 mm square shape. On the other hand, the lower surface of the upper mold 19 has a square shape of 10 mm square.
　図６に示すように、下側金型１８及び上側金型１９によって上下から第１導体１０及び第２導体１１を挟み付けて圧縮する。この結果、実験例８においては、第１導体１０には１つの圧縮部１７が形成されると共に、第２導体１１にも１つの圧縮部１７が形成される。実験例８における圧縮部１７の圧縮率は、２０％に設定されている。 As shown in FIG. 6, the first conductor 10 and the second conductor 11 are sandwiched and compressed by the lower mold 18 and the upper mold 19 from above and below. As a result, in Experimental Example 8, one compression portion 17 is formed on the first conductor 10, and one compression portion 17 is also formed on the second conductor 11. The compression ratio of the compression unit 17 in Experimental Example 8 is set to 20%.
　（引張試験）
　上記の実験例１～８に係る第１導体１０及び第２導体１１に対し、引張試験を行った。上側金型１６及び下側金型１４による圧縮工程が実行された後、第１導体１０及び第２導体１１をそれぞれチャックで把持し、１００ｍｍ／分で引っ張ることにより引張試験を実行し、引張破断強度を測定した。測定機器は、島津製作所製の、オートグラフＡＧ－ＩＳとロードセルＳＬＢＬ－１ＫＮを用いた。結果を表１にまとめる。 (Tensile test)
A tensile test was performed on the first conductor 10 and the second conductor 11 according to the above experimental examples 1 to 8. After the compression process by the upper mold 16 and the lower mold 14 is performed, the first conductor 10 and the second conductor 11 are each gripped by a chuck, and a tensile test is performed by pulling at 100 mm / min. The strength was measured. As the measuring instrument, an autograph AG-IS and a load cell SLBL-1KN manufactured by Shimadzu Corporation were used. The results are summarized in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　また、図６に、引張強度と圧縮率との関係を示した。実験例１～７については高圧縮部１３の圧縮率をプロットし、実験例８については圧縮部１７の圧縮率をプロットした。 FIG. 6 shows the relationship between tensile strength and compressibility. For Experimental Examples 1 to 7, the compression rate of the high compression unit 13 was plotted, and for Experimental Example 8, the compression rate of the compression unit 17 was plotted.
　実験例１～７につき、圧縮率が３０％以上の場合には、第１導体１０と第２導体１１とは接合していなかった。このため、引張強度は０Ｎであった。一方、圧縮率が２５％以下であると、第１導体１０と第２導体１１とが凝着して、金属結合していた。このため、引張強度は３２１．７Ｎ以上であった。更に、圧縮率が２０％以下であると、第１導体１０と第２導体１１とが確実に凝着して金属結合していた。このため、引張強度は５６７．４Ｎ以上であった。詳細には、６３８．８Ｎ（実験例３）、５６７．４Ｎ（実験例２）、６３１．０Ｎ（実験例１）であった。 In Experimental Examples 1 to 7, when the compression rate was 30% or more, the first conductor 10 and the second conductor 11 were not joined. For this reason, the tensile strength was 0N. On the other hand, when the compressibility is 25% or less, the first conductor 10 and the second conductor 11 are adhered and are metal-bonded. For this reason, the tensile strength was 321.7 N or more. Furthermore, when the compressibility is 20% or less, the first conductor 10 and the second conductor 11 are securely adhered and metal-bonded. For this reason, the tensile strength was 567.4 N or more. Specifically, it was 638.8N (Experimental example 3), 567.4N (Experimental example 2), and 631.0N (Experimental example 1).
　一方、高圧縮部１３を有しない実験例８では、引張強度は０Ｎであった。すなわち、高圧縮部１３が形成されない場合には、圧縮率を２０％にしても、第１導体１０と第２導体１１とが凝着しないことが分かった。 On the other hand, in Experimental Example 8 having no high compression portion 13, the tensile strength was 0N. That is, when the high compression part 13 was not formed, even if the compression rate was 20%, it turned out that the 1st conductor 10 and the 2nd conductor 11 do not adhere.
　（ＳＥＭ観察）
　上記の実験例１～８に係る第１導体１０及び第２導体１１につき、上記の引張試験を実行した後の高圧縮部１３又は圧縮部１７をＳＥＭにより観察した。第１導体１０と第２導体１１とが凝着したか否かにつき、ＳＥＭ観察した結果を表１にまとめた。 (SEM observation)
For the first conductor 10 and the second conductor 11 according to the above experimental examples 1 to 8, the high compression portion 13 or the compression portion 17 after the above tensile test was performed was observed by SEM. Table 1 summarizes the results of SEM observation on whether or not the first conductor 10 and the second conductor 11 adhered.
　（実験例１）
　図８には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例１においては、第１導体１０と第２導体１１とは凝着して金属結合している。このため、引張試験後、第１導体１０及び第２導体１１の一方に、他方が固着して残存していた。図９には、同じ部分を２００倍に拡大したＳＥＭ写真を示す。第１導体１０と第２導体１１とが固着している状態が示されている。 (Experimental example 1)
In FIG. 8, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 1, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. For this reason, after the tensile test, the other of the first conductor 10 and the second conductor 11 was fixed and remained. In FIG. 9, the SEM photograph which expanded the same part by 200 time is shown. A state in which the first conductor 10 and the second conductor 11 are fixed is shown.
　（実験例２）
　図１０には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例２においても、実験例１と同様に、第１導体１０と第２導体１１とは凝着して金属結合している。このため、引張試験後、第１導体１０及び第２導体１１の一方に、他方が固着して残存していた。図１１には、同じ部分を２００倍に拡大したＳＥＭ写真を示す。第１導体１０と第２導体１１とが固着している状態が示されている。 (Experimental example 2)
In FIG. 10, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 2, as in Experimental Example 1, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. For this reason, after the tensile test, the other of the first conductor 10 and the second conductor 11 was fixed and remained. In FIG. 11, the SEM photograph which expanded the same part by 200 time is shown. A state in which the first conductor 10 and the second conductor 11 are fixed is shown.
　（実験例３）
　図１２には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例３においても、実験例１と同様に、第１導体１０と第２導体１１とは凝着して金属結合している。このため、引張試験後、第１導体１０及び第２導体１１の一方に、他方が固着して残存していた。図１３には、同じ部分を２００倍に拡大したＳＥＭ写真を示す。第１導体１０と第２導体１１とが固着している状態が示されている。 (Experimental example 3)
In FIG. 12, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 3, as in Experimental Example 1, the first conductor 10 and the second conductor 11 are adhered and metal-bonded. For this reason, after the tensile test, the other of the first conductor 10 and the second conductor 11 was fixed and remained. In FIG. 13, the SEM photograph which expanded the same part 200 times is shown. A state in which the first conductor 10 and the second conductor 11 are fixed is shown.
　（実験例４）
　図１４には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例４においては、引張強度が３２１．７Ｎを示したことから、第１導体１０と第２導体１１とが少なくとも部分的には固着していたことが分かる。しかし、第１導体１０及び第２導体１１の一方に、他方が固着する程度にまで強固に固着していなかったと考えられる。このため、３０倍に拡大された図１４には、第１導体１０と第２導体１１とが固着した状態は示されていなかった。しかしながら、同じ部分を２００倍に拡大した図１５には、第１導体１０又は第２導体１１の表面が非常に荒れた状態が示されている。これは、高圧縮部１３と低圧縮部１２との間の領域において、第１導体１０と第２導体１１とが微視的には凝着していることを示している。 (Experimental example 4)
In FIG. 14, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 4, since the tensile strength was 321.7 N, it can be seen that the first conductor 10 and the second conductor 11 were at least partially fixed. However, it is considered that one of the first conductor 10 and the second conductor 11 was not firmly fixed to the extent that the other was fixed. For this reason, the state in which the first conductor 10 and the second conductor 11 are fixed is not shown in FIG. However, FIG. 15 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
　（実験例５）
　図１６には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例５においては、引張強度が０Ｎであったことから、第１導体１０と第２導体１１とは巨視的には固着していなかったことが分かる。また、３０倍に拡大された図１６には、第１導体１０と第２導体１１とが固着した状態は示されていなかった。しかしながら、同じ部分を２００倍に拡大した図１７には、第１導体１０又は第２導体１１の表面が非常に荒れた状態が示されている。これは、高圧縮部１３と低圧縮部１２との間の領域において、第１導体１０と第２導体１１とが微視的には凝着していることを示している。 (Experimental example 5)
In FIG. 16, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 5, since the tensile strength was 0 N, it can be seen that the first conductor 10 and the second conductor 11 were not fixed macroscopically. Further, FIG. 16 enlarged 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed. However, FIG. 17 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
　（実験例６）
　図１８には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例６においては、引張強度が０Ｎであったことから、第１導体１０と第２導体１１とは巨視的には固着していなかったことが分かる。また、３０倍に拡大された図１８には、第１導体１０と第２導体１１とが固着した状態は示されていなかった。しかしながら、同じ部分を２００倍に拡大した図１９には、第１導体１０又は第２導体１１の表面が非常に荒れた状態が示されている。これは、高圧縮部１３と低圧縮部１２との間の領域において、第１導体１０と第２導体１１とが微視的には凝着していることを示している。 (Experimental example 6)
In FIG. 18, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 6, since the tensile strength was 0 N, it can be seen that the first conductor 10 and the second conductor 11 were not fixed macroscopically. Further, FIG. 18 enlarged by 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed. However, FIG. 19 in which the same portion is enlarged 200 times shows a state in which the surface of the first conductor 10 or the second conductor 11 is very rough. This indicates that the first conductor 10 and the second conductor 11 are microscopically adhered in the region between the high compression portion 13 and the low compression portion 12.
　（実験例７）
　図２０には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例７においては、引張強度が０Ｎであったことから、第１導体１０と第２導体１１とは巨視的には固着していなかったことが分かる。また、３０倍に拡大された図２０には、第１導体１０と第２導体１１とが固着した状態は示されていない。また、同じ部分を２００倍に拡大した図２１には、第１導体１０又は第２導体１１の表面が荒れた状態は示されていない。このため、実験例７においては、高圧縮部１３と低圧縮部１２との間の領域において、第１導体１０と第２導体１１とが微視的にも凝着していなかったことが分かる。 (Experimental example 7)
In FIG. 20, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 7, since the tensile strength was 0 N, it can be seen that the first conductor 10 and the second conductor 11 were not fixed macroscopically. Moreover, the state which the 1st conductor 10 and the 2nd conductor 11 adhered is not shown by FIG. 20 expanded by 30 time. Further, FIG. 21 in which the same portion is enlarged 200 times does not show a state where the surface of the first conductor 10 or the second conductor 11 is rough. For this reason, in Experimental Example 7, it can be seen that the first conductor 10 and the second conductor 11 were not adhered microscopically in the region between the high compression portion 13 and the low compression portion 12. .
　（実験例８）
　図２２には、第１導体１０と第２導体１１の破断部分を３０倍に拡大したＳＥＭ写真を示す。実験例８においては、引張強度が０Ｎであったことから、第１導体１０と第２導体１１とは巨視的には固着していなかったことが分かる。また、３０倍に拡大された図２２には、第１導体１０と第２導体１１とが固着した状態は示されていない。また、同じ部分を２００倍に拡大した図２３には、第１導体１０又は第２導体１１の表面が荒れた状態は示されていない。このため、実験例８においては、圧縮部１７において、第１導体１０と第２導体１１とが微視的にも凝着していなかったことが分かる。 (Experimental example 8)
In FIG. 22, the SEM photograph which expanded the fracture | rupture part of the 1st conductor 10 and the 2nd conductor 11 30 times is shown. In Experimental Example 8, since the tensile strength was 0 N, it can be seen that the first conductor 10 and the second conductor 11 were not fixed macroscopically. Further, FIG. 22 enlarged 30 times does not show a state where the first conductor 10 and the second conductor 11 are fixed. Further, FIG. 23 in which the same portion is enlarged 200 times does not show a state where the surface of the first conductor 10 or the second conductor 11 is rough. For this reason, in Experimental Example 8, it can be seen that the first conductor 10 and the second conductor 11 were not adhered microscopically in the compression portion 17.
　＜実施形態２＞
　次に、本発明の実施形態２を、図２４を参照しつつ説明する。本実施形態においては、第１導体１０の下面には、１つの圧縮部１７が形成されている。一方、第２導体１１の上面には、圧縮部１７と対応する位置に、低圧縮部１２が形成されている。この低圧縮部１２の略中央位置には、低圧縮部１２に隣接して高圧縮部１３が形成されている。 <Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. In the present embodiment, one compression portion 17 is formed on the lower surface of the first conductor 10. On the other hand, the low compression portion 12 is formed on the upper surface of the second conductor 11 at a position corresponding to the compression portion 17. A high compression portion 13 is formed adjacent to the low compression portion 12 at a substantially central position of the low compression portion 12.
　上記以外の構成については、実施形態１と略同様なので、同一部材については同一符号を付し、重複する説明を省略する。 Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.
　本実施形態においては、第２導体１１に形成された低圧縮部１２と高圧縮部１３との間の領域において、第１導体１０と第２導体１１とが強くこすれ合う。これにより、第１導体１０の表面に形成された酸化膜と、第２導体１１の表面に形成された酸化膜とがこすれ合うことによって剥がれる。これにより、第１導体１０を構成する金属表面が露出すると共に、第２導体１１を構成する金属表面が露出する。そして、第１導体１０の金属表面と、第２導体１１の金属表面とが接触することにより、第１導体１０と第２導体１１との電気的抵抗が低減される。 In the present embodiment, the first conductor 10 and the second conductor 11 rub against each other strongly in the region between the low compression portion 12 and the high compression portion 13 formed in the second conductor 11. Thus, the oxide film formed on the surface of the first conductor 10 and the oxide film formed on the surface of the second conductor 11 are peeled off by rubbing. Thereby, the metal surface which comprises the 1st conductor 10 is exposed, and the metal surface which comprises the 2nd conductor 11 is exposed. And when the metal surface of the 1st conductor 10 and the metal surface of the 2nd conductor 11 contact, the electrical resistance of the 1st conductor 10 and the 2nd conductor 11 is reduced.
　＜実施形態３＞
　次に、本発明の実施形態３を、図２５を参照しつつ説明する。本実施形態においては、第２導体１１の上面には低圧縮部１２が形成されている。この低圧縮部１２には、図２５における左右方向に並んで２つの高圧縮部１３が形成されている。 <Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIG. In the present embodiment, the low compression portion 12 is formed on the upper surface of the second conductor 11. In the low compression portion 12, two high compression portions 13 are formed side by side in the left-right direction in FIG.
　上記以外の構成については、実施形態２と略同様なので、同一部材については同一符号を付し、重複する説明を省略する。 Since the configuration other than the above is substantially the same as that of the second embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.
　本実施形態によれば、複数の高圧縮部１３が形成されているので、第１導体１０と第２導体１１との間の電気的な抵抗を一層小さくすることができる。 According to the present embodiment, since the plurality of high compression portions 13 are formed, the electrical resistance between the first conductor 10 and the second conductor 11 can be further reduced.
　＜実施形態４＞
　次に、本発明の実施形態４を、図２６を参照しつつ説明する。本実施形態においては、第１導体１０の下面には、第１導体１０の先端寄りの位置に、低圧縮部１２が形成されている。低圧縮部１２に対して先端と反対側の位置には、低圧縮部１２に隣接して高圧縮部１３が形成されている。 <Embodiment 4>
Next, Embodiment 4 of the present invention will be described with reference to FIG. In the present embodiment, the low compression portion 12 is formed on the lower surface of the first conductor 10 at a position near the tip of the first conductor 10. A high compression portion 13 is formed adjacent to the low compression portion 12 at a position opposite to the tip with respect to the low compression portion 12.
　また、第２導体１１の上面には、第２導体１１の先端寄りの位置に、高圧縮部１３が形成されている。高圧縮部１３に対して先端と反対側の位置には、低圧縮部１２が隣接して形成されている。 Further, a high compression portion 13 is formed on the upper surface of the second conductor 11 at a position near the tip of the second conductor 11. A low compression portion 12 is formed adjacent to the high compression portion 13 at a position opposite to the tip.
　本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
　（１）第１導体１０及び第２導体１１は、断面形状が矩形状をなす板材としたが、これに限られず、第１導体１０及び第２導体１１の断面形状は、円形状、楕円形状としてもよく、また、三角形状、正方形状等の多角形状としてもよく、必要に応じて任意の形状を適宜に選択できる。 The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The first conductor 10 and the second conductor 11 are plate members having a rectangular cross-sectional shape. However, the present invention is not limited to this, and the cross-sectional shapes of the first conductor 10 and the second conductor 11 may be circular or elliptical. Alternatively, it may be a polygonal shape such as a triangular shape or a square shape, and an arbitrary shape can be appropriately selected as necessary.
　（２）第１導体１０及び第２導体１１の表面に、研磨処理、酸処理、アルカリ処理等の、公知の処理を実施してもよい。 (2) The surface of the first conductor 10 and the second conductor 11 may be subjected to a known treatment such as polishing treatment, acid treatment, or alkali treatment.
　（３）低圧縮部１２に隣接して高圧縮部１３が形成されていればよく、例えば、１つの低圧縮部１２に複数の高圧縮部１３が隣接して形成される構成としてもよく、また、１つの高圧縮部１３に複数の低圧縮部１２が隣接して形成される構成としてもよく、必要に応じて任意の形態とすることができる。 (3) The high compression part 13 should just be formed adjacent to the low compression part 12, for example, it is good also as a structure by which the several high compression part 13 is formed adjacent to one low compression part 12, Moreover, it is good also as a structure by which the several low compression part 12 is formed adjacent to the one high compression part 13, and it can be set as arbitrary forms as needed.
　（４）複数（３以上）の導体が積層された積層体を圧縮する構成としてもよい。すなわち、積層体を構成する複数（３以上）の導体のうち、任意の一つを第１導体１０とし、この第１導体１０に重なる導体を第２導体１１としてもよい。 (4) It is good also as a structure which compresses the laminated body in which the multiple (3 or more) conductor was laminated | stacked. That is, any one of a plurality (three or more) of conductors constituting the multilayer body may be the first conductor 10, and the conductor overlapping the first conductor 10 may be the second conductor 11.
　（５）第１導体１０と、第２導体１１とは、異なる形状のものを用いてもよい。 (5) The first conductor 10 and the second conductor 11 may have different shapes.
　１０：第１導体
　１１：第２導体
　１２：低圧縮部
　１３：高圧縮部 10: 1st conductor 11: 2nd conductor 12: Low compression part 13: High compression part

Claims (7)

  1. 　第１導体と、
    　前記第１導体に重ねられた第２導体と、
    　前記第１導体及び前記第２導体の少なくとも一方に、前記第１導体及び前記第２導体の他方に向かって圧縮された低圧縮部と、
    　前記低圧縮部に隣接して形成されると共に前記低圧縮部よりも高圧縮された高圧縮部と、を備え、
    　（圧縮後の導体の断面積／圧縮前の導体の断面積）×１００（％）で定義された圧縮率について、前記低圧縮部の圧縮率は５０％よりも大きく設定されており、前記高圧縮部の圧縮率は５０％よりも小さく設定されている、導体と導体との電気的接続構造。     A first conductor;
    A second conductor overlaid on the first conductor;
    A low compression portion compressed toward at least one of the first conductor and the second conductor toward the other of the first conductor and the second conductor;
    A high compression portion formed adjacent to the low compression portion and compressed higher than the low compression portion, and
    For the compression rate defined by (cross-sectional area of the conductor after compression / cross-sectional area of the conductor before compression) × 100 (%), the compression rate of the low compression portion is set to be larger than 50%, and the high An electrical connection structure between conductors, wherein the compression ratio of the compression part is set to be smaller than 50%.
  2. 　前記高圧縮部の圧縮率は、３５％以下に設定されている請求項１に記載の導体と導体との電気的接続構造。 The electrical connection structure between conductors according to claim 1, wherein the compression ratio of the high compression portion is set to 35% or less.
  3. 　前記高圧縮部の圧縮率は、２５％以下に設定されている請求項２に記載の導体と導体との電気的接続構造。 The electrical connection structure between conductors according to claim 2, wherein the compression ratio of the high compression portion is set to 25% or less.
  4. 　前記高圧縮部の圧縮率は、２０％以下に設定されている請求項３に記載の導体と導体との電気的接続構造。 The electrical connection structure between a conductor and a conductor according to claim 3, wherein the compression ratio of the high compression portion is set to 20% or less.
  5. 　前記第１導体及び前記第２導体の少なくとも一つがアルミニウム又はアルミニウム合金である請求項１ないし請求項４のいずれか一項に記載の導体と導体との電気的接続構造。 The electrical connection structure between a conductor and a conductor according to any one of claims 1 to 4, wherein at least one of the first conductor and the second conductor is aluminum or an aluminum alloy.
  6. 　前記第１導体及び前記第２導体の双方がアルミニウム又はアルミニウム合金である請求項５に記載の導体と導体との接続構造。 The connection structure between a conductor and a conductor according to claim 5, wherein both the first conductor and the second conductor are aluminum or an aluminum alloy.
  7. 　前記第１導体及び前記第２導体の双方に、前記低圧縮部及び前記高圧縮部が形成されている請求項１ないし６のいずれか一項に記載の導体と導体との電気的接続構造。 The electrical connection structure between a conductor and a conductor according to any one of claims 1 to 6, wherein the low compression portion and the high compression portion are formed on both the first conductor and the second conductor.
PCT/JP2013/058501 2012-03-28 2013-03-25 Electrical connection structure between conductor and conductor WO2013146638A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525486A (en) * 1975-06-30 1977-01-17 Gen Electric Transition member of copper vs* aluminum and method of manufacture thereof
JPS5619874A (en) * 1979-07-25 1981-02-24 Mitsubishi Electric Corp Method of connecting lead wires for semiconductor device
JP2005152916A (en) * 2003-11-21 2005-06-16 Sumiden Asahi Industries Ltd Cold pressure welding method for metal sheets
JP2006231402A (en) * 2005-01-28 2006-09-07 Nissan Motor Co Ltd Ultrasonic bonding equipment and resulting bonding structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525486A (en) * 1975-06-30 1977-01-17 Gen Electric Transition member of copper vs* aluminum and method of manufacture thereof
JPS5619874A (en) * 1979-07-25 1981-02-24 Mitsubishi Electric Corp Method of connecting lead wires for semiconductor device
JP2005152916A (en) * 2003-11-21 2005-06-16 Sumiden Asahi Industries Ltd Cold pressure welding method for metal sheets
JP2006231402A (en) * 2005-01-28 2006-09-07 Nissan Motor Co Ltd Ultrasonic bonding equipment and resulting bonding structure

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