WO2013139304A1 - Led module structure - Google Patents

Led module structure Download PDF

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Publication number
WO2013139304A1
WO2013139304A1 PCT/CN2013/073071 CN2013073071W WO2013139304A1 WO 2013139304 A1 WO2013139304 A1 WO 2013139304A1 CN 2013073071 W CN2013073071 W CN 2013073071W WO 2013139304 A1 WO2013139304 A1 WO 2013139304A1
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WIPO (PCT)
Prior art keywords
light source
led
heat sink
array
module
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PCT/CN2013/073071
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French (fr)
Chinese (zh)
Inventor
赵玉喜
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深圳市瑞丰光电子股份有限公司
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Publication of WO2013139304A1 publication Critical patent/WO2013139304A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Definitions

  • the present invention relates to the field of light emitting diodes, and more particularly to an LED module structure.
  • LED lamps use a separate LED package structure, including optical lenses, phosphors, metal substrates, LEDs.
  • the chip and other components are fixed to the corresponding metal substrate by means of dispensing, patching, reflow soldering, etc., and then fixed on the LED lamp.
  • This type of LED structure is relatively complicated to fabricate. along with The widespread use of LED lighting technology, a single LED illuminator can not meet the needs of lighting, so multiple LED illuminators must be used together, at this time existing separate LED When the structure is used in aggregating, the assembly process is complicated, and the thermal resistance of the entire system is also relatively high.
  • the object of the present invention is to solve the defects of complicated assembly and high thermal resistance of the existing independent LED structure, and provide a novel LED. Module structure.
  • the technical solution adopted by the present invention to solve the technical problem thereof is: LED
  • the module structure includes a heat sink and a light source module, and the light source module includes at least one LED chip An array, further comprising a light source cover plate for fixing the light source module on the heat sink and a heat conductive insulating gasket for heat conduction and insulation, wherein the heat conductive insulating spacer is disposed on the heat sink and the light source Between modules.
  • the heat sink is provided with a fixing hole
  • the light source cover is provided with a connecting hole that cooperates with the fixing hole of the heat sink.
  • the light source module includes a substrate, and an LED composed of at least one LED chip integrated on the substrate An array and a package placed on the LED chip.
  • the light source cover is provided with a hollow mesh that can fix the LED array on the heat sink.
  • the hollow mesh shape is adapted to the LED array.
  • the fixing hole on the heat sink is a threaded hole
  • the connecting hole on the light source cover is a through hole, and the light source cover is fixed to the heat sink by screws.
  • the LED array is a rectangular array, and the hollow grids are arranged in a matrix.
  • the LED array is a ring array
  • the hollow grid is a ring array
  • the invention has the beneficial effects that the invention provides a novel LED
  • the module structure is composed of a light source cover plate, a light source module, a heat conductive insulating gasket and a heat sink, and has a simple structure; the light source cover plate presses the light source module on the heat sink, and the heat dissipation effect is good, and the use process is used. Screw fastening can be used.
  • This structure is simple to assemble and easy to operate. It is suitable for wide industrial use.
  • a layer of thermal insulation gasket is added between the light source module and the heat sink to reduce the whole.
  • the thermal resistance of the LED module structure improves the stability and reliability of the LED illuminator; the LED array of the present invention can be set to a rectangular matrix, a ring matrix or an arrangement shape required for any product according to product requirements.
  • FIG. 1 is a full cross-sectional view showing the structure of an LED module according to an embodiment of the present invention
  • Figure 2 is a partial enlarged view of A in Figure 1;
  • FIG. 3 is a schematic structural diagram of a light source module according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a light source cover provided by an embodiment of the present invention.
  • FIG. 1 is a full sectional view showing a structure of a novel LED module provided in the present invention
  • FIG. 2 is FIG. 1A.
  • the LED module structure of the present invention comprises a heat sink 1 and a light source module 2
  • the light source module 2 comprises an LED array composed of at least one LED chip 221 22, further comprising a light source cover plate 3 for fixing the light source module 2 on the heat sink 1 and a heat conductive insulating gasket 4 for heat conduction and insulation, wherein the heat conductive insulating spacer 4 is placed on the heat sink 1 Between the light source module 2.
  • the invention provides a novel LED module structure, which comprises a light source cover plate 3, a light source module 2, a thermal conductive insulating spacer 4 and a heat sink 1
  • the four parts are composed of four parts, and the structure is simple; wherein the light source module 2 is a module that has been packaged and can be directly applied, and at the same time, a layer of thermal insulating spacer 4 is added between the light source module 2 and the heat sink 1 to reduce the whole
  • the thermal resistance of the LED module structure improves the stability and reliability of LED luminaires.
  • the heat sink 1 is provided with a fixing hole 11
  • the light source cover 3 is provided with a fixing hole 11 with the heat sink 1 .
  • the fixing hole 11 on the heat sink 1 is a threaded hole
  • the connecting hole 31 on the light source cover 3 is a through hole
  • the light source cover 3 It is fixed to the heat sink 1 by screws.
  • the invention fixes the light source module 2 on the heat sink 1 by means of screw fastening, the light source cover 3 and the heat sink 1 Threaded holes are fitted to each other to replace traditional independent LEDs When the package is required to be reflowed, the cover plate and the heat sink are fixed.
  • This structure is simple to assemble, has high versatility, is easy to operate, and is suitable for wide application in industry.
  • FIG. 3 is a schematic structural diagram of a light source module 2 according to an embodiment of the present invention.
  • the LED array in the figure is 4 ⁇ 4 Matrix structure.
  • the light source module 2 includes a substrate 21, an LED array 22 composed of at least one LED chip 221 integrated on the substrate 21, and the LED The package on the chip 23 .
  • the LED array 22 of the present invention is formed by fixing at least one LED chip in a reflective cup of the LED holder, and the package body 23 It includes the solid crystal glue used for the solid crystal, the bonding wire and the encapsulant required for dispensing.
  • the light source cover 3 is provided with a hollow mesh 32 for fixing the LED array 22 on the heat sink 1 .
  • the cutout mesh 32 is shaped to fit the LED array 22.
  • the grid on the light source cover 3 provided by the embodiment of the present invention is 4 ⁇ 4. Rectangular array.
  • the LED array provided by the present invention is not limited to a 4 ⁇ 4 matrix structure, and the LED array may also be a ring matrix structure, and the corresponding grid 32 It should also be a ring structure (not shown).
  • the LED array 22 can be in any arranged shape, while the grid 32 and LED array on the light source cover 3 22 The shape is adapted.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

Provided is an LED module structure, comprising heat radiating fins (1) and a light source module (2), and further comprising a light source cover plate (3) for fixing the light source module (2) on the heat radiating fins (1) and a heat conduction and insulation gasket (4) used for heat conduction and insulation, the heat conduction and insulation gasket (4) being arranged between the heat radiating fins (1) and the light source module (2). Provided is a new-type LED module structure, being simple in structure; a light source cover plate (3) presses a light source module (2) on the heat radiating fins (1), thereby achieving a desirable heat radiating effect. In use, only fastening with screws is required, and the structure is simple to assemble and is convenient in operation, and thus is suitable for wide industrial use. A heat conduction and insulation gasket (4) is added between the light source module (2) and the heat radiating fins (1), thereby reducing the thermal resistance of the whole LED module structure, and improving the stability and reliability in the use of an LED lamp. An LED array can be arranged in a rectangular matrix, an annular matrix or any arrangement shapes required for products according to product demands.

Description

LED 模组结构 LED module structure 技术领域Technical field

本发明涉及发光二极管领域，尤其是涉及 LED 模组结构。  The present invention relates to the field of light emitting diodes, and more particularly to an LED module structure.

背景技术Background technique

目前的 LED 灯大多采用单独 LED 封装结构，包括光学透镜、荧光粉、金属基板、 LED 芯片等部件，通过点胶、贴片、回流焊接等工序将 LED 芯片封装固定在相应的金属基板上，然后固定于 LED 灯具上。这类 LED 结构制作工艺相对复杂。随着 LED 照明技术的广泛运用，单个 LED 发光体无法满足照明的需要，因此必须将多个 LED 发光体聚集在一起使用，此时现有单独 LED 结构在聚集使用时，组装加工复杂，并且整个系统的热阻也比较高。  Most of the current LED lamps use a separate LED package structure, including optical lenses, phosphors, metal substrates, LEDs. The chip and other components are fixed to the corresponding metal substrate by means of dispensing, patching, reflow soldering, etc., and then fixed on the LED lamp. This type of LED structure is relatively complicated to fabricate. along with The widespread use of LED lighting technology, a single LED illuminator can not meet the needs of lighting, so multiple LED illuminators must be used together, at this time existing separate LED When the structure is used in aggregating, the assembly process is complicated, and the thermal resistance of the entire system is also relatively high.

技术问题technical problem

本发明的目的在于解决现有独立 LED 结构制作装配复杂并且热阻高 缺点，提供一种新型的 LED 模组结构。  The object of the present invention is to solve the defects of complicated assembly and high thermal resistance of the existing independent LED structure, and provide a novel LED. Module structure.

技术解决方案Technical solution

本发明解决其技术问题采用的技术方案是： LED 模组结构，包括散热片和光源模组，所述光源模组包括至少一个 LED 芯片组成的 LED 阵列，其特征在于，还包括将所述光源模组固定于所述散热片上的光源盖板和用于导热和绝缘的导热绝缘垫片，所述导热绝缘垫片置于所述散热片与光源模组之间。 The technical solution adopted by the present invention to solve the technical problem thereof is: LED The module structure includes a heat sink and a light source module, and the light source module includes at least one LED chip An array, further comprising a light source cover plate for fixing the light source module on the heat sink and a heat conductive insulating gasket for heat conduction and insulation, wherein the heat conductive insulating spacer is disposed on the heat sink and the light source Between modules.

进一步地，所述散热片上设有固定孔，所述光源盖板上设有与所述散热片的固定孔配合的连接孔。 Further, the heat sink is provided with a fixing hole, and the light source cover is provided with a connecting hole that cooperates with the fixing hole of the heat sink.

进一步地，所述光源模组包括基板、集成在所述基板上的由至少一个 LED 芯片组成的 LED 阵列和置于所述 LED 芯片上的封装体。 Further, the light source module includes a substrate, and an LED composed of at least one LED chip integrated on the substrate An array and a package placed on the LED chip.

进一步地，所述光源盖板上设有可将所述 LED 阵列固定放置于所述散热片上的镂空网格。 Further, the light source cover is provided with a hollow mesh that can fix the LED array on the heat sink.

具体地，所述镂空网格形状与所述 LED 阵列相适配。 Specifically, the hollow mesh shape is adapted to the LED array.

进一步地，所述散热片上的固定孔为螺纹孔，所述光源盖板上的连接孔为通孔，所述光源盖板通过螺丝固定于所述散热片上。 Further, the fixing hole on the heat sink is a threaded hole, and the connecting hole on the light source cover is a through hole, and the light source cover is fixed to the heat sink by screws.

具体地，所述 LED 列阵为矩形列阵，所述镂空网格为矩阵排列。 Specifically, the LED array is a rectangular array, and the hollow grids are arranged in a matrix.

具体地，所述 LED 列阵为环形列阵，所述镂空网格为环阵排列。 Specifically, the LED array is a ring array, and the hollow grid is a ring array.

有益效果Beneficial effect

本发明的有益效果在于：本发明提供了一种新型 LED 模组结构，由光源盖板、光源模组、导热绝缘垫片和散热片四个部分组成，结构简单；光源盖板将光源模组压附在散热片上，散热效果好，使用过程中，用螺丝紧固即可，此结构组装简单，便于操作，适于广泛工业使用；在光源模组和散热片之间增加了一层导热绝缘垫片，降低整个 LED 模组结构的热阻，提高了 LED 灯具使用时的稳定性和可靠性；本发明中的 LED 阵列可以根据产品需要设置为矩形矩阵、环形矩阵或任意产品需要的排列形状。  The invention has the beneficial effects that the invention provides a novel LED The module structure is composed of a light source cover plate, a light source module, a heat conductive insulating gasket and a heat sink, and has a simple structure; the light source cover plate presses the light source module on the heat sink, and the heat dissipation effect is good, and the use process is used. Screw fastening can be used. This structure is simple to assemble and easy to operate. It is suitable for wide industrial use. A layer of thermal insulation gasket is added between the light source module and the heat sink to reduce the whole. The thermal resistance of the LED module structure improves the stability and reliability of the LED illuminator; the LED array of the present invention can be set to a rectangular matrix, a ring matrix or an arrangement shape required for any product according to product requirements.

附图说明DRAWINGS

图 1 是本发明实施例提供的 LED 模组结构 的全剖视 图； 1 is a full cross-sectional view showing the structure of an LED module according to an embodiment of the present invention;

图 2 是图 1 中 A 处的局部放大图； Figure 2 is a partial enlarged view of A in Figure 1;

图 3 是本发明实施例提供的光源模组的结构示意图； 3 is a schematic structural diagram of a light source module according to an embodiment of the present invention;

图 4 是本发明实施例提供的光源盖板的结构示意图； 4 is a schematic structural view of a light source cover provided by an embodiment of the present invention;

图中： 1- 散热片、 11- 散热片固定孔、 2- 光源模组、 21- 基板、 22-LED 阵列、 221-LED 芯片、 23- 封装体、 3- 光源盖板、 31- 盖板连接孔、 32- 盖板镂空网格、 4- 导热绝缘垫片。 In the figure: 1- heat sink, 11- heat sink fixing hole, 2-light source module, 21-substrate, 22-LED array, 221-LED chip, 23-package, 3-light source cover, 31- cover connection hole, 32- cover hollow mesh, 4-thermal insulation gasket.

本发明的实施方式Embodiments of the invention

为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。 The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

参见图 1- 图 2 ，图 1 为本发明提供的一种新型 LED 模组结构的全剖视图，图 2 为图 1A 处的局部放大图。本发明所提供的 LED 模组结构，包括散热片 1 和光源模组 2 ，所述光源模组 2 包括至少一个 LED 芯片 221 组成的 LED 阵列 22 ，还包括将所述光源模组 2 固定于所述散热片 1 上的光源盖板 3 和用于导热和绝缘的导热绝缘垫片 4 ，所述导热绝缘垫片 4 置于所述散热片 1 与光源模组 2 之间。本发明提供的一种新型 LED 模组结构中，由光源盖板 3 、光源模组 2 、导热绝缘垫片 4 和散热片 1 四个部分组成，结构简单；其中，光源模组 2 为已经封装好可直接应用的模块，同时，在光源模组 2 和散热片 1 之间增加了一层导热绝缘垫片 4 ，降低整个 LED 模组结构的热阻，提高了 LED 灯具使用时的稳定性和可靠性。 1 to 2, FIG. 1 is a full sectional view showing a structure of a novel LED module provided in the present invention, and FIG. 2 is FIG. 1A. A partial enlargement of the place. The LED module structure of the present invention comprises a heat sink 1 and a light source module 2, and the light source module 2 comprises an LED array composed of at least one LED chip 221 22, further comprising a light source cover plate 3 for fixing the light source module 2 on the heat sink 1 and a heat conductive insulating gasket 4 for heat conduction and insulation, wherein the heat conductive insulating spacer 4 is placed on the heat sink 1 Between the light source module 2. The invention provides a novel LED module structure, which comprises a light source cover plate 3, a light source module 2, a thermal conductive insulating spacer 4 and a heat sink 1 The four parts are composed of four parts, and the structure is simple; wherein the light source module 2 is a module that has been packaged and can be directly applied, and at the same time, a layer of thermal insulating spacer 4 is added between the light source module 2 and the heat sink 1 to reduce the whole The thermal resistance of the LED module structure improves the stability and reliability of LED luminaires.

具体地，所述散热片 1 上设有固定孔 11 ，所述光源盖板 3 上设有与所述散热片 1 的固定孔 11 配合的连接孔 31 。参见图 2 ，本发明中散热片 1 上的固定孔 11 为螺纹孔，光源盖板 3 上的连接孔 31 为通孔，所述光源盖板 3 通过螺丝固定于所述散热片 1 上。本发明采用螺纹紧固的方式将光源模组 2 固定于散热片 1 上，光源盖板 3 和散热片 1 上设有相互适配的螺纹孔，取代了传统独立 LED 封装时需要通过回流焊的工序使得盖板与散热片固定的方式，此结构组装简单，通用性强，便于操作，适合工业上广泛推广。 Specifically, the heat sink 1 is provided with a fixing hole 11 , and the light source cover 3 is provided with a fixing hole 11 with the heat sink 1 . Mating connection hole 31. Referring to Fig. 2, in the present invention, the fixing hole 11 on the heat sink 1 is a threaded hole, and the connecting hole 31 on the light source cover 3 is a through hole, and the light source cover 3 It is fixed to the heat sink 1 by screws. The invention fixes the light source module 2 on the heat sink 1 by means of screw fastening, the light source cover 3 and the heat sink 1 Threaded holes are fitted to each other to replace traditional independent LEDs When the package is required to be reflowed, the cover plate and the heat sink are fixed. This structure is simple to assemble, has high versatility, is easy to operate, and is suitable for wide application in industry.

请再参见图 3 ，为本发明实施例提供的光源模组 2 的结构示意图。图中 LED 阵列为 4 × 4 矩阵结构。所述光源模组 2 包括基板 21 、集成在所述基板 21 上的由至少一个 LED 芯片 221 组成的 LED 阵列 22 和置于所述 LED 芯片上的封装体 23 。本发明的 LED 阵列 22 是由至少一个的 LED 芯片放置于 LED 支架的反射杯中固定而成，封装体 23 包括了固晶使用的固晶胶、焊线以及点胶需要的封装胶。 Please refer to FIG. 3 again, which is a schematic structural diagram of a light source module 2 according to an embodiment of the present invention. The LED array in the figure is 4 × 4 Matrix structure. The light source module 2 includes a substrate 21, an LED array 22 composed of at least one LED chip 221 integrated on the substrate 21, and the LED The package on the chip 23 . The LED array 22 of the present invention is formed by fixing at least one LED chip in a reflective cup of the LED holder, and the package body 23 It includes the solid crystal glue used for the solid crystal, the bonding wire and the encapsulant required for dispensing.

所述光源盖板 3 上设有可将所述 LED 阵列 22 固定放置于所述散热片 1 上的镂空网格 32 。所述镂空网格 32 形状与所述 LED 阵列 22 相适配。如图 4 所示的，本发明实施例提供的光源盖板 3 上的网格为 4 × 4 矩形列阵。本发明所提供的 LED 列阵不仅限于 4 × 4 矩阵结构， LED 列阵也可以为环形矩阵结构，与之相对应的网格 32 也应为环形结构（图中未示出）。或者，根据 LED 灯具产品的需要， LED 列阵 22 可以为任何排列的形状，而光源盖板 3 上的网格 32 与 LED 列阵 22 形状相适配。 The light source cover 3 is provided with a hollow mesh 32 for fixing the LED array 22 on the heat sink 1 . The cutout mesh 32 is shaped to fit the LED array 22. As shown in FIG. 4, the grid on the light source cover 3 provided by the embodiment of the present invention is 4×4. Rectangular array. The LED array provided by the present invention is not limited to a 4 × 4 matrix structure, and the LED array may also be a ring matrix structure, and the corresponding grid 32 It should also be a ring structure (not shown). Alternatively, depending on the needs of the LED luminaire product, the LED array 22 can be in any arranged shape, while the grid 32 and LED array on the light source cover 3 22 The shape is adapted.

以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。 The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalents, and improvements made within the spirit and scope of the present invention should be included in the scope of the present invention. Inside.

Claims (8)

LED 模组结构，包括散热片和光源模组，其特征在于，还包括将所述光源模组固定于所述散热片上的光源盖板和用于导热和绝缘的导热绝缘垫片，所述导热绝缘垫片置于所述散热片与光源模组之间。led The module structure includes a heat sink and a light source module, and further includes a light source cover plate for fixing the light source module on the heat sink and a heat conductive insulating gasket for heat conduction and insulation, the heat conductive insulation A gasket is placed between the heat sink and the light source module. 如权利要求 1 所述的 LED 模组结构，其特征在于：所述散热片上设有固定孔，所述光源盖板上设有与所述散热片的固定孔配合的连接孔。LED according to claim 1 The module structure is characterized in that: the heat sink is provided with a fixing hole, and the light source cover is provided with a connecting hole that cooperates with the fixing hole of the heat sink. 如权利要求 1 所述的 LED 模组结构，其特征在于：所述光源模组包括基板、集成在所述基板上的由至少一个 LED 芯片组成的 LED 阵列和置于所述 LED 芯片上的封装体。The LED module structure according to claim 1, wherein the light source module comprises a substrate, and at least one LED integrated on the substrate An LED array composed of chips and a package placed on the LED chip. 如权利要求 1 所述的 LED 模组结构，其特征在于：所述光源盖板上设有可将所述 LED 阵列固定放置于所述散热片上的镂空网格。The LED module structure according to claim 1, wherein said light source cover is provided with said LED The array is fixed to a hollow mesh placed on the heat sink. 如权利要求 4 所述的 LED 模组结构，其特征在于：所述镂空网格形状与所述 LED 阵列相适配。The LED module structure according to claim 4, wherein the hollow mesh shape and the LED are The array is adapted. 如权利要求 2 所述的 LED 模组结构，其特征在于：所述散热片上的固定孔为螺纹孔，所述光源盖板上的连接孔为通孔，所述光源盖板通过螺丝固定于所述散热片上。LED according to claim 2 The module structure is characterized in that: the fixing hole on the heat sink is a threaded hole, the connecting hole on the light source cover is a through hole, and the light source cover is fixed to the heat sink by screws. 如权利要求 1-6 任一项所述的 LED 模组结构，其特征在于：所述 LED 列阵为矩形列阵，所述镂空网格为矩阵排列。The LED module structure according to any one of claims 1 to 6, wherein the LED The array is a rectangular array, and the hollow grids are arranged in a matrix. 如权利要求 1-6 任一项所述的 LED 模组结构，其特征在于：所述 LED 列阵为环形列阵，所述镂空网格为环阵排列。The LED module structure according to any one of claims 1 to 6, wherein the LED The array is a circular array, and the hollow mesh is arranged in a ring array.
PCT/CN2013/073071 2012-03-23 2013-03-22 Led module structure WO2013139304A1 (en)

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Citations (4)

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CN1758436A (en) * 2004-10-09 2006-04-12 光磊科技股份有限公司 High Power LED Array Module
CN201732785U (en) * 2010-06-28 2011-02-02 深圳市瑞丰光电子股份有限公司 LED module and LED lighting fixture
CN101980387A (en) * 2010-09-07 2011-02-23 浙江西子光电科技有限公司 LED module and manufacturing process thereof
CN202534695U (en) * 2012-03-23 2012-11-14 深圳市瑞丰光电子股份有限公司 Led module structure

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Publication number Priority date Publication date Assignee Title
CN1758436A (en) * 2004-10-09 2006-04-12 光磊科技股份有限公司 High Power LED Array Module
CN201732785U (en) * 2010-06-28 2011-02-02 深圳市瑞丰光电子股份有限公司 LED module and LED lighting fixture
CN101980387A (en) * 2010-09-07 2011-02-23 浙江西子光电科技有限公司 LED module and manufacturing process thereof
CN202534695U (en) * 2012-03-23 2012-11-14 深圳市瑞丰光电子股份有限公司 Led module structure

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