WO2013129754A1 - Method for virtualization-based control of cpu cooling, and computing apparatus for performing same - Google Patents

Method for virtualization-based control of cpu cooling, and computing apparatus for performing same Download PDF

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Publication number
WO2013129754A1
WO2013129754A1 PCT/KR2012/009080 KR2012009080W WO2013129754A1 WO 2013129754 A1 WO2013129754 A1 WO 2013129754A1 KR 2012009080 W KR2012009080 W KR 2012009080W WO 2013129754 A1 WO2013129754 A1 WO 2013129754A1
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cpu
temperature
power consumption
cooling fan
virtualization
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PCT/KR2012/009080
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French (fr)
Korean (ko)
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임성수
오진수
이호림
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국민대학교 산학협력단
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206Monitoring of events, devices or parameters that trigger a change in power modality
    • G06F1/3215Monitoring of peripheral devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44Arrangements for executing specific programs
    • G06F9/451Execution arrangements for user interfaces
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44Arrangements for executing specific programs
    • G06F9/455Emulation; Interpretation; Software simulation, e.g. virtualisation or emulation of application or operating system execution engines
    • G06F9/45504Abstract machines for programme code execution, e.g. Java virtual machine [JVM], interpreters, emulators
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to a CPU cooling control technology, and more particularly, to a virtualization-based CPU cooling control method that can reduce power consumption through efficient CPU cooling and a computing device performing the same.
  • CPU Central Processing Unit cooling
  • the CPU cooler is powered by a power source other than that provided to the CPU, and can be operated even when CPU cooling is not required.
  • a single physical device may include at least one CPU.
  • Korean Patent Laid-Open Publication No. 10-2001-0011151 uses a fast response thermoelectric module as a CAPI cooling element, so that CIF oil operates in a high output mode so that it can be quickly cooled even when the temperature rises rapidly. The method is disclosed.
  • Korean Patent Publication No. 10-2004-0052010 discloses an electronic chip cooling apparatus capable of maximizing a heat dissipation area by integrating a fan cover into a heat pipe by soldering or the like.
  • the present application is to provide a virtualization-based CPU cooling control method that can reduce power consumption through efficient CPU cooling and a computing device performing the same.
  • the present application may provide an appropriate trade off between increased performance by CPU cooling and power consumption by CPU cooler.
  • the present application is to provide a virtualization-based CPU cooling control method that can provide efficient CPU cooling through a power model in consideration of thermal effects based on regression analysis and a computing device performing the same.
  • the virtualization-based CPU cooling control method is a management virtual machine which is one of at least one virtual machine operated by a computing device including a CPU cooler implemented with at least one Central Processing Unit (CPU) and a cooling fan. Is performed in The method comprises the steps of (a) lowering the speed of a cooling fan corresponding to the particular CPU if power consumption does not occur due to thermal effects in the particular CPU; and (b) the temperature of the particular CPU is dependent on the CPU throttling temperature. Approaching a certain range includes prioritizing preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
  • CPU Central Processing Unit
  • the step (a) may further include lowering the speed of the cooling fan by a predetermined speed when the temperature of the specific CPU is lower than or equal to a first threshold temperature corresponding to a temperature at which power consumption due to the thermal effect occurs. It may include.
  • the step (b) may further include increasing the speed of the cooling fan by a predetermined speed if the temperature of the specific CPU is equal to or greater than a second threshold temperature associated with a CPU throttling temperature.
  • the second threshold temperature may correspond to a predetermined temperature or less from the CPU throttling temperature.
  • the step (b) if the temperature of the specific CPU is less than the second threshold temperature, the power consumption due to the increase of the speed of the cooling fan (hereinafter, referred to as the first power consumption) and the power consumption due to the thermal effect (hereinafter, referred to as 2 may be further included.
  • the step (b) may further include increasing the speed of the cooling fan by the predetermined speed if the first power consumption is not higher than the second power consumption.
  • the step (b) may further include maintaining a previous speed of the cooling fan if the first power consumption is higher than the second power consumption.
  • the temperature at which power consumption occurs due to the thermal effect and the CPU throttling temperature may be predetermined for the particular CPU.
  • the method may further include repeating steps (a) and (b) after a predetermined time so as to confirm the cooling effect.
  • a computing device that performs virtualization-based CPU cooling control includes a CPU cooler implemented with at least one central processing unit (CPU) and a cooling fan, and includes a management virtual machine that is one of at least one virtualization machine.
  • the computing device may be configured to (a) reduce the speed of a cooling fan corresponding to the specific CPU if power consumption does not occur due to a thermal effect on the specific CPU, and (b) the temperature of the specific CPU may be reduced to a CPU throttling temperature.
  • Approach gives priority to preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
  • a computing device may include at least one central processing unit (CPU) that runs a management virtual machine, which is one of at least one virtual machine, and at least one CPU cooler corresponding to the at least one CPU and implemented as a cooling fan.
  • the management virtual machine (a) lowers the speed of a cooling fan corresponding to the specific CPU if power consumption does not occur due to a thermal effect in the specific CPU, and (b) the temperature of the specific CPU is throttled by the CPU.
  • Access to a throttling temperature performs virtualization-based CPU cooling control that prioritizes preventing CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
  • the virtualization-based CPU cooling control method of the present application and the computing device performing the same can reduce power consumption through efficient CPU cooling.
  • the virtualization-based CPU cooling control method of the present application and a computing device performing the same may improve both power efficiency and performance of the computing device.
  • FIG. 1 is a block diagram illustrating a virtualization-based computing device in accordance with one embodiment of the disclosed technology.
  • FIG. 2 is a block diagram illustrating the management virtual machine in FIG. 1.
  • FIG. 3 is a flowchart illustrating a process of controlling CPU cooling based on virtualization by the management virtual machine of FIG. 1.
  • first and second are intended to distinguish one component from another component, and the scope of rights should not be limited by these terms.
  • first component may be named a second component, and similarly, the second component may also be named a first component.
  • an identification code (e.g., a, b, c, etc.) is used for convenience of description, and the identification code does not describe the order of the steps, and each step clearly indicates a specific order in context. Unless stated otherwise, they may occur out of the order noted. That is, each step may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the reverse order.
  • the disclosed technology can be embodied as computer readable code on a computer readable recording medium, and the computer readable recording medium includes all kinds of recording devices in which data can be read by a computer system.
  • Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like, and are also implemented in the form of a carrier wave (for example, transmission over the Internet). It also includes.
  • the computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.
  • FIG. 1 is a block diagram illustrating a virtualization-based computing device in accordance with one embodiment of the disclosed technology.
  • a virtualization-based computing device 100 includes a CPU pool 110, a memory 120, and at least one including at least one central processing unit (CPU) 112 and a CPU cooler 114. Virtual machine 130.
  • CPU central processing unit
  • the CPU pool 110 includes at least one CPU 112 and a CPU cooler 114 and corresponds to a resource allocated or returned by an operating system or the like. For example, if a particular task requires a large amount of computation, the operating system can allocate a relatively large number of CPUs to a particular task. If a particular task requires a small amount of computation, the operating system allocates a relatively small number of CPUs for a particular task. can do. Meanwhile, the CPU cooler 114 may be implemented as a cooling fan, and the speed of the cooling fan may be controlled according to the heat generated by the CPU 112. Control of such a cooling fan will be described with reference to FIGS. 2 and 3.
  • Memory 120 may be used as shared memory for communication between at least one CPU 112 or communication between at least one CPU 112 and another device, or as local memory for data storage by at least one CPU 112. have.
  • the memory 120 may be implemented as a volatile memory, a nonvolatile memory, or a combination thereof.
  • the at least one virtual machine 130 may be implemented in software operated by the computing device 100.
  • Each of the at least one virtual machine 140 may be recognized as a separate physical device from the user's point of view, and one of the at least one virtual machine 140 corresponds to the management virtual machine 132 that controls CPU cooling. . That is, the management virtual machine 132 corresponds to one of the at least one virtual machine 140 and controls the speed of the cooling fan in the CPU cooler 120.
  • FIG. 2 is a block diagram illustrating the management virtual machine in FIG. 1.
  • the management virtual machine 132 includes a CPU monitoring module 210, a power model management module 220, a CPU cooler monitoring module 230, and a management module 240.
  • the CPU monitoring module 210 monitors the temperature occurring in the specific CPU 112a.
  • the temperature may be measured through a sensor built in the specific CPU 112a or an externally mounted sensor, and the CPU monitoring module 210 may measure the temperature generated by the specific CPU 112a through the sensor. I can recognize it.
  • the control module 220 presents an appropriate power model between increasing the performance of a particular CPU 112a by CPU cooling and power consumption by the CPU cooler 114. More specifically, the control module 220 proposes a power model capable of performing efficient CPU cooling through a power model in consideration of thermal effects based on regression analysis. To this end, the control module 220 may manage three data structures.
  • the first data structure is used to manage information relating to a first threshold temperature of each of the at least one CPU 112, and the second data structure provides information about power consumption according to a current temperature of each of the at least one CPU 112.
  • the third data structure is used to manage information on power consumption according to the speed of the cooling fan in the at least one CPU cooler 114. All of the first to third data structures may correspond to static tables, and the first threshold temperature, power consumption according to the current temperature, and power thahfifd according to the cooling fan may be predetermined for the specific CPU 112a. .
  • the cooler monitoring module 230 monitors the speed of the particular CPU cooler 114a. In one embodiment, the cooler monitoring module 230 may monitor the speed of the particular CPU cooler 114a based on the amount of power consumed by the cooling fan.
  • the management module 240 provides an interface to the management virtual machine 132 to monitor or control the CPU 112 and the CPU cooler 114. That is, the management module 240 may serve as an interface for determining the temperature of the specific CPU 112a or the speed of the specific CPU cooler 114a, and serve as an interface for controlling the speed of the specific CPU cooler 114a. Can be performed.
  • FIG. 3 is a flowchart illustrating a process of controlling CPU cooling based on virtualization by the management virtual machine of FIG. 1.
  • the control module 220 waits for a specific time (eg, 5 minutes) to confirm the CPU cooling effect (step S310).
  • a specific time eg, 5 minutes
  • the specific time may be fixed. This fixing may allow the cooling control process to be performed periodically.
  • the specific time may vary. Such a variable may be determined based on a temperature change range of the specific CPU 112a. For example, if the temperature change range is above a certain threshold (eg, 20 degrees), the control module 220 may immediately stop waiting.
  • the control module 220 may obtain the current temperature of the specific CPU 112a from the CPU monitoring module 210 (step S315).
  • the CPU monitoring module 210 may continue to measure the temperature for the at least one CPU 112 through the management module 240, and in response to the request of the control module 220, the specific CPU 112a. Can provide the current temperature for.
  • the CPU monitoring module 210 may maintain a current temperature table for each of the at least one CPU 112.
  • the CPU monitoring module 210 may provide a current temperature of the specific CPU 112a after measuring the current temperature of the specific CPU 112a according to a request of the control module 220.
  • the control module 220 determines whether the current temperature of the specific CPU 112a exceeds a temperature at which power consumption occurs due to a thermal effect in the specific CPU 112a (hereinafter, referred to as a first threshold temperature). (Step S320). That is, the control module 220 determines whether power consumption due to a thermal effect occurs in the specific CPU 112a. In one embodiment, the control module 220 may manage a first threshold temperature for each of the at least one CPU 112 and, if a current temperature of the particular CPU 112a is received, the current temperature of the particular CPU 112a. And the first threshold temperature of the specific CPU 112a may be compared.
  • the CPU monitoring module 210 may manage a first threshold temperature for each of the at least one CPU 112, and the specific CPU 112a through the management module 240. ) Can be obtained to compare the current temperature of the specific CPU 112a with the first threshold temperature of the specific CPU 112a. Next, the CPU monitoring module 210 may notify the control module 220 of such excess information if the current temperature of the specific CPU 112a exceeds the first threshold temperature of the specific CPU 112a.
  • the control module 220 supplies the CPU cooler 114a corresponding to the specific CPU 112a through the management module 240 if the current temperature of the specific CPU 112a does not exceed the first threshold temperature of the specific CPU 112a.
  • the speed of the cooling fan is lowered (step S325). In one embodiment, the control module 220 may lower the speed of the cooling fan by a predetermined speed (eg, 100 RPM).
  • the cooler monitoring module 230 monitors whether the speed of the cooling fan is lowered through the management module 240 to determine whether to change the speed of the cooling fan (step S380). In one embodiment, the cooler monitoring module 230 may determine whether to change the speed of the cooling fan based on the amount of power consumed by the cooling fan.
  • control module 220 lowers the speed of the cooling fan corresponding to the specific CPU 112a if power consumption due to a thermal effect does not occur in the specific CPU 112a.
  • the control module 220 may have a current temperature within a predetermined range below the CPU throttling temperature.
  • a second threshold temperature is determined (step S330).
  • the predetermined range may correspond to 5 degrees, and the predetermined range may be set to prevent CPU throttling from occurring.
  • CPU throttling is known as dynamic voltage scaling, and refers to a technology in which the frequency of the CPU is automatically adjusted to conserve power or reduce the amount of heat generated by the CPU.
  • the control module 220 speeds up the cooling fan in the CPU cooler 114a corresponding to the specific CPU 112a through the management module 240 when the current temperature of the specific CPU 112a is equal to or greater than the second threshold temperature (see FIG. Step S335).
  • the control module 220 may increase the speed of the cooling fan by a predetermined speed (eg, 100 RPM).
  • the cooler monitoring module 230 monitors whether the speed of the cooling fan is increased through the management module 240 to determine whether to change the speed of the cooling fan (step S380).
  • the control module 220 controls the power consumption of the specific CPU 112a and the power consumption of the specific CPU cooler 114a due to the thermal effect when the current temperature of the specific CPU 112a is less than the second threshold temperature (that is, the speed of the cooling fan).
  • the power consumption due to the increase) is measured (step S340).
  • the power consumption of the particular CPU 112a may be determined based on the current temperature measured by the CPU monitoring module 210.
  • the power consumption of the particular CPU cooler 114a may be measured by the cooler monitoring module 230.
  • the control module 220 determines whether the power consumption of the specific CPU cooler 114a is higher than the power consumption of the specific CPU 112a (step S350). If so, the control module 220 maintains the speed of the cooling fan in the specific CPU cooler 114a (step S360). If not, the control module 220 speeds up the cooling fan in the specific CPU cooler 114a (step S355).
  • the control module 220 determines that the cooling fan of the cooling fan in the specific cooler 114a if the temperature of the specific CPU 112a approaches the CPU throttling temperature within a certain range. Priority is given to preventing CPU throttling rather than preventing power consumption from speeding up.
  • step S380 determines whether the speed of the cooling fan is the maximum or minimum (step S365). If so, the control module 220 maintains the speed of the cooling fan in the specific CPU cooler 114a (step S360), otherwise, the control module 220 controls the speed of the cooling fan again (step S370). It is determined whether or not the fan speed change is successful (step S380).
  • steps S310 to S380 are repeated after a predetermined time elapsed in step S310 so as to confirm the cooling effect.

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Abstract

The method for the virtualization-based control of CPU cooling includes the steps of: (a) reducing the speed of a cooling fan corresponding to a particular CPU when said particular CPU is not consuming power due to a thermal effect; and (b) raising the speed of the cooling fan when the temperature of said particular CPU approaches a throttling temperature within a predetermined range, thereby giving priority to the prevention of CPU throttling rather than to the prevention of power consumption.

Description

가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치Virtualization-based CPU cooling control method and computing device performing the same
본 출원은 CPU 쿨링 제어 기술에 관한 것으로, 보다 상세하게는, 효율적인 CPU 쿨링을 통해서 전력 소모량을 감소시킬 수 있는 가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치에 관한 것이다.The present application relates to a CPU cooling control technology, and more particularly, to a virtualization-based CPU cooling control method that can reduce power consumption through efficient CPU cooling and a computing device performing the same.
CPU(Central Processing Unit) 쿨링은 발열로 인한 성능 저하를 방지하기 위하여 수행되는 것으로, CPU 쿨러를 사용한다. CPU 쿨러는 CPU에 제공되는 전원이 아닌 다른 전원을 통해 구동되며, CPU 쿨링이 필요없는 경우에도 동작될 수 있다.CPU (Central Processing Unit) cooling is performed to prevent performance degradation due to heat generation, and uses a CPU cooler. The CPU cooler is powered by a power source other than that provided to the CPU, and can be operated even when CPU cooling is not required.
최근 컴퓨팅 장치는 가상화를 도입하여 단일의 물리 장치상에 적어도 하나의 가상 머신을 구축하고 있다. 여기에서, 단일의 물리 장치는 적어도 하나의 CPU를 포함할 수 있다.Recently, computing devices have introduced virtualization to build at least one virtual machine on a single physical device. Here, a single physical device may include at least one CPU.
한국공개특허 제10-2001-0011151호는 응답 속도가 빠른 열전 모듈을 씨피유 냉각 소자로 활용하여 씨피유가 고출력 모드로 동작하여 온도가 급격히 상승할 경우에도 이를 신속하게 냉각시킬 수 있도록 하는 씨피유 냉각 장치 및 방법을 개시한다.Korean Patent Laid-Open Publication No. 10-2001-0011151 uses a fast response thermoelectric module as a CAPI cooling element, so that CIF oil operates in a high output mode so that it can be quickly cooled even when the temperature rises rapidly. The method is disclosed.
한국공개특허 제10-2004-0052010호는 팬 커버를 솔더링 등과 같은 방법으로 히트파이프에 일체화시킴으로써 방열면적을 극대화할 수 있는 전자칩 냉각장치를 개시한다.Korean Patent Publication No. 10-2004-0052010 discloses an electronic chip cooling apparatus capable of maximizing a heat dissipation area by integrating a fan cover into a heat pipe by soldering or the like.
본 출원은 효율적인 CPU 쿨링을 통해서 전력 소모량을 감소시킬 수 있는 가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치를 제공하고자 한다. 예를 들어, 본 출원은 CPU 쿨링에 의한 성능 증가와 CPU 쿨러에 의한 전력 소모 간의 적절한 협정(trade off)를 제공할 수 있다.The present application is to provide a virtualization-based CPU cooling control method that can reduce power consumption through efficient CPU cooling and a computing device performing the same. For example, the present application may provide an appropriate trade off between increased performance by CPU cooling and power consumption by CPU cooler.
본 출원은 회귀 분석(regression analysis) 기반의 열적 효과를 고려한 전력 모델을 통해서 효율적 CPU 쿨링을 제공할 수 있는 가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치를 제공하고자 한다.The present application is to provide a virtualization-based CPU cooling control method that can provide efficient CPU cooling through a power model in consideration of thermal effects based on regression analysis and a computing device performing the same.
실시예들 중에서, 가상화 기반의 CPU 쿨링 제어 방법은 적어도 하나의 CPU(Central Processing Unit) 및 쿨링 팬으로 구현된 CPU 쿨러를 포함하는 컴퓨팅 장치에 의하여 운영되는 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신에서 수행된다. 상기 방법은 (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추는 단계 및 (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 일정 범위 이내로 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여하는 단계를 포함한다.Among the embodiments, the virtualization-based CPU cooling control method is a management virtual machine which is one of at least one virtual machine operated by a computing device including a CPU cooler implemented with at least one Central Processing Unit (CPU) and a cooling fan. Is performed in The method comprises the steps of (a) lowering the speed of a cooling fan corresponding to the particular CPU if power consumption does not occur due to thermal effects in the particular CPU; and (b) the temperature of the particular CPU is dependent on the CPU throttling temperature. Approaching a certain range includes prioritizing preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
일 실시예에서, 상기 (a) 단계는 상기 특정 CPU의 온도가 상기 열적 효과로 인한 전력 소모가 발생하는 온도에 해당하는 제1 임계치 온도 이하이면 상기 쿨링 팬의 속도를 일정 속도만큼 낮추는 단계를 더 포함할 수 있다. In an exemplary embodiment, the step (a) may further include lowering the speed of the cooling fan by a predetermined speed when the temperature of the specific CPU is lower than or equal to a first threshold temperature corresponding to a temperature at which power consumption due to the thermal effect occurs. It may include.
상기 (b) 단계는 상기 특정 CPU의 온도가 CPU 쓰로틀링(CPU throttling) 온도와 연관된 제2 임계치 온도 이상이면 상기 쿨링 팬의 속도를 일정 속도만큼 높이는 단계를 더 포함할 수 있다. 상기 제2 임계치 온도는 상기 CPU 쓰로틀링 온도로부터 일정 온도 이하에 해당할 수 있다.The step (b) may further include increasing the speed of the cooling fan by a predetermined speed if the temperature of the specific CPU is equal to or greater than a second threshold temperature associated with a CPU throttling temperature. The second threshold temperature may correspond to a predetermined temperature or less from the CPU throttling temperature.
상기 (b) 단계는 상기 특정 CPU의 온도가 상기 제2 임계치 온도를 미만이면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모량(이하, 제1 전력 소모량)과 상기 열적 효과로 인한 전력 소모량(이하, 제2 전력 소모량)을 측정하는 단계를 더 포함할 수 있다. 상기 (b) 단계는 상기 제1 전력 소모량이 상기 제2 전력 소모량보다 높지 않다면 상기 쿨링 팬의 속도를 상기 일정 속도만큼 높이는 단계를 더 포함할 수 있다. 상기 (b) 단계는 상기 제1 전력 소모량이 상기 제2 전력 소모량보다 높다면 상기 쿨링 팬의 이전 속도를 유지하는 단계를 더 포함할 수 있다.In the step (b), if the temperature of the specific CPU is less than the second threshold temperature, the power consumption due to the increase of the speed of the cooling fan (hereinafter, referred to as the first power consumption) and the power consumption due to the thermal effect (hereinafter, referred to as 2 may be further included. The step (b) may further include increasing the speed of the cooling fan by the predetermined speed if the first power consumption is not higher than the second power consumption. The step (b) may further include maintaining a previous speed of the cooling fan if the first power consumption is higher than the second power consumption.
일 실시예에서, 상기 열적 효과로 인한 전력 소모가 발생하는 온도와 상기 CPU 쓰로틀링 온도는 상기 특정 CPU에 대하여 미리 결정될 수 있다.In one embodiment, the temperature at which power consumption occurs due to the thermal effect and the CPU throttling temperature may be predetermined for the particular CPU.
상기 방법은 쿨링 효과를 확인할 수 있도록 일정 시간 경과 후 상기 (a) 단계 및 상기 (b) 단계를 반복하는 단계를 더 포함할 수 있다.The method may further include repeating steps (a) and (b) after a predetermined time so as to confirm the cooling effect.
실시예들 중에서, 가상화 기반의 CPU 쿨링 제어를 수행하는 컴퓨팅 장치는 적어도 하나의 CPU(Central Processing Unit) 및 쿨링 팬으로 구현된 CPU 쿨러를 포함하고, 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신을 운영하여 가상화 기반의 CPU 쿨링 제어를 수행한다. 상기 컴퓨팅 장치는 (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추고, (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여한다.In embodiments, a computing device that performs virtualization-based CPU cooling control includes a CPU cooler implemented with at least one central processing unit (CPU) and a cooling fan, and includes a management virtual machine that is one of at least one virtualization machine. Virtualization-based CPU cooling control. The computing device may be configured to (a) reduce the speed of a cooling fan corresponding to the specific CPU if power consumption does not occur due to a thermal effect on the specific CPU, and (b) the temperature of the specific CPU may be reduced to a CPU throttling temperature. Approach gives priority to preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
실시예들 중에서, 컴퓨팅 장치는 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신을 운영하는 적어도 하나의 CPU(Central Processing Unit) 및 상기 적어도 하나의 CPU에 대응하고 쿨링 팬으로 구현된 적어도 하나의 CPU 쿨러를 포함하고, 상기 관리 가상 머신은 (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추고, (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여하는 가상화 기반의 CPU 쿨링 제어를 수행한다.In embodiments, a computing device may include at least one central processing unit (CPU) that runs a management virtual machine, which is one of at least one virtual machine, and at least one CPU cooler corresponding to the at least one CPU and implemented as a cooling fan. Wherein the management virtual machine (a) lowers the speed of a cooling fan corresponding to the specific CPU if power consumption does not occur due to a thermal effect in the specific CPU, and (b) the temperature of the specific CPU is throttled by the CPU. Access to a throttling temperature performs virtualization-based CPU cooling control that prioritizes preventing CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
본 출원의 가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치는 효율적인 CPU 쿨링을 통해서 전력 소모량을 감소시킬 수 있다.The virtualization-based CPU cooling control method of the present application and the computing device performing the same can reduce power consumption through efficient CPU cooling.
본 출원의 가상화 기반의 CPU 쿨링 제어 방법 및 이를 수행하는 컴퓨팅 장치는 컴퓨팅 장치의 전력 효율과 성능을 함께 향상시킬 수 있다.The virtualization-based CPU cooling control method of the present application and a computing device performing the same may improve both power efficiency and performance of the computing device.
도 1은 개시된 기술의 일 실시예에 따른 가상화 기반의 컴퓨팅 장치를 설명하는 블록도이다.1 is a block diagram illustrating a virtualization-based computing device in accordance with one embodiment of the disclosed technology.
도 2는 도 1에 있는 관리 가상 머신을 설명하는 블록도이다.FIG. 2 is a block diagram illustrating the management virtual machine in FIG. 1.
도 3은 도 1에 있는 관리 가상 머신에 의한 가상화 기반의 CPU 쿨링 제어 과정을 설명하는 흐름도이다.3 is a flowchart illustrating a process of controlling CPU cooling based on virtualization by the management virtual machine of FIG. 1.
개시된 기술에 관한 설명은 구조적 내지 기능적 설명을 위한 실시예에 불과하므로, 개시된 기술의 권리범위는 본문에 설명된 실시예에 의하여 제한되는 것으로 해석되어서는 아니 된다. 즉, 실시예는 다양한 변경이 가능하고 여러 가지 형태를 가질 수 있으므로 개시된 기술의 권리범위는 기술적 사상을 실현할 수 있는 균등물들을 포함하는 것으로 이해되어야 한다. 또한, 개시된 기술에서 제시된 목적 또는 효과는 특정 실시예가 이를 전부 포함하여야 한다거나 그러한 효과만을 포함하여야 한다는 의미는 아니므로, 개시된 기술의 권리범위는 이에 의하여 제한되는 것으로 이해되어서는 아니 될 것이다.Description of the disclosed technology is only an embodiment for structural or functional description, the scope of the disclosed technology should not be construed as limited by the embodiments described in the text. That is, since the embodiments may be variously modified and may have various forms, the scope of the disclosed technology should be understood to include equivalents capable of realizing the technical idea. In addition, the objects or effects presented in the disclosed technology does not mean that a specific embodiment should include all or only such effects, and thus the scope of the disclosed technology should not be understood as being limited thereto.
한편, 본 출원에서 서술되는 용어의 의미는 다음과 같이 이해되어야 할 것이다.On the other hand, the meaning of the terms described in the present application should be understood as follows.
"제1", "제2" 등의 용어는 하나의 구성요소를 다른 구성요소로부터 구별하기 위한 것으로, 이들 용어들에 의해 권리범위가 한정되어서는 아니 된다. 예를 들어, 제1 구성요소는 제2 구성요소로 명명될 수 있고, 유사하게 제2 구성요소도 제1 구성요소로 명명될 수 있다.Terms such as "first" and "second" are intended to distinguish one component from another component, and the scope of rights should not be limited by these terms. For example, the first component may be named a second component, and similarly, the second component may also be named a first component.
어떤 구성요소가 다른 구성요소에 "연결되어"있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결될 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 "직접 연결되어"있다고 언급된 때에는 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다. 한편, 구성요소들 간의 관계를 설명하는 다른 표현들, 즉 "~사이에"와 "바로 ~사이에" 또는 "~에 이웃하는"과 "~에 직접 이웃하는" 등도 마찬가지로 해석되어야 한다.When a component is referred to as being "connected" to another component, it should be understood that there may be other components in between, although it may be directly connected to the other component. On the other hand, when a component is referred to as being "directly connected" to another component, it should be understood that there is no other component in between. On the other hand, other expressions describing the relationship between the components, such as "between" and "immediately between" or "neighboring to" and "directly neighboring", should be interpreted as well.
단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한 복수의 표현을 포함하는 것으로 이해되어야 하고, "포함하다"또는 "가지다" 등의 용어는 설시된 특징, 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이며, 하나 또는 그 이상의 다른 특징이나 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Singular expressions should be understood to include plural expressions unless the context clearly indicates otherwise, and terms such as "comprise" or "have" refer to features, numbers, steps, operations, components, parts, or parts thereof described. It is to be understood that the combination is intended to be present and does not exclude in advance the possibility of the presence or addition of one or more other features or numbers, steps, operations, components, parts or combinations thereof.
각 단계들에 있어 식별부호(예를 들어, a, b, c 등)는 설명의 편의를 위하여 사용되는 것으로 식별부호는 각 단계들의 순서를 설명하는 것이 아니며, 각 단계들은 문맥상 명백하게 특정 순서를 기재하지 않는 이상 명기된 순서와 다르게 일어날 수 있다. 즉, 각 단계들은 명기된 순서와 동일하게 일어날 수도 있고 실질적으로 동시에 수행될 수도 있으며 반대의 순서대로 수행될 수도 있다.In each step, an identification code (e.g., a, b, c, etc.) is used for convenience of description, and the identification code does not describe the order of the steps, and each step clearly indicates a specific order in context. Unless stated otherwise, they may occur out of the order noted. That is, each step may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the reverse order.
개시된 기술은 컴퓨터가 읽을 수 있는 기록매체에 컴퓨터가 읽을 수 있는 코드로서 구현될 수 있고, 컴퓨터가 읽을 수 있는 기록 매체는 컴퓨터 시스템에 의하여 읽혀질 수 있는 데이터가 저장되는 모든 종류의 기록 장치를 포함한다. 컴퓨터가 읽을 수 있는 기록 매체의 예로는 ROM, RAM, CD-ROM, 자기 테이프, 플로피 디스크, 광 데이터 저장 장치 등이 있으며, 또한, 캐리어 웨이브(예를 들어 인터넷을 통한 전송)의 형태로 구현되는 것도 포함한다. 또한, 컴퓨터가 읽을 수 있는 기록 매체는 네트워크로 연결된 컴퓨터 시스템에 분산되어, 분산 방식으로 컴퓨터가 읽을 수 있는 코드가 저장되고 실행될 수 있다.The disclosed technology can be embodied as computer readable code on a computer readable recording medium, and the computer readable recording medium includes all kinds of recording devices in which data can be read by a computer system. . Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like, and are also implemented in the form of a carrier wave (for example, transmission over the Internet). It also includes. The computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.
여기서 사용되는 모든 용어들은 다르게 정의되지 않는 한, 개시된 기술이 속하는 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가진다. 일반적으로 사용되는 사전에 정의되어 있는 용어들은 관련 기술의 문맥상 가지는 의미와 일치하는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한 이상적이거나 과도하게 형식적인 의미를 지니는 것으로 해석될 수 없다.All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. Generally, the terms defined in the dictionary used are to be interpreted to coincide with the meanings in the context of the related art, and should not be interpreted as having ideal or excessively formal meanings unless clearly defined in the present application.
도 1은 개시된 기술의 일 실시예에 따른 가상화 기반의 컴퓨팅 장치를 설명하는 블록도이다.1 is a block diagram illustrating a virtualization-based computing device in accordance with one embodiment of the disclosed technology.
도 1을 참조하면, 가상화 기반의 컴퓨팅 장치(100)는 적어도 하나의 CPU(Central Processing unit)(112)와 CPU 쿨러(114)를 포함하는 CPU 풀(110), 메모리(120) 및 적어도 하나의 가상 머신(130)을 포함한다.Referring to FIG. 1, a virtualization-based computing device 100 includes a CPU pool 110, a memory 120, and at least one including at least one central processing unit (CPU) 112 and a CPU cooler 114. Virtual machine 130.
CPU 풀(110)은 적어도 하나의 CPU(112)와 CPU 쿨러(114)를 포함하고, 운영체제 등에 의하여 할당 또는 반납되는 자원에 해당한다. 예를 들어, 특정 작업이 많은 연산량을 요구하면 운영체제는 특정 작업에 상대적으로 많은 수의 CPU를 할당할 수 있고, 특정 작업이 적은 연산량을 요구하면 운영체제는 특정 작업에 상대적으로 적은 수의 CPU를 할당할 수 있다. 한편, 여기에서, CPU 쿨러(114)는 쿨링 팬으로 구현되고, 해당 CPU(112)의 발열에 따라 쿨링 팬의 속도는 제어될 수 있다. 이러한 쿨링 팬의 제어는 도 2 및 도 3을 참조하여 설명한다.The CPU pool 110 includes at least one CPU 112 and a CPU cooler 114 and corresponds to a resource allocated or returned by an operating system or the like. For example, if a particular task requires a large amount of computation, the operating system can allocate a relatively large number of CPUs to a particular task. If a particular task requires a small amount of computation, the operating system allocates a relatively small number of CPUs for a particular task. can do. Meanwhile, the CPU cooler 114 may be implemented as a cooling fan, and the speed of the cooling fan may be controlled according to the heat generated by the CPU 112. Control of such a cooling fan will be described with reference to FIGS. 2 and 3.
메모리(120)는 적어도 하나의 CPU(112) 간의 통신 또는 적어도 하나의 CPU(112)와 다른 장치 간의 통신을 위한 공유 메모리 또는 적어도 하나의 CPU(112)에 의한 데이터 저장을 위한 로컬 메모리로서 사용될 수 있다. 일 실시예에서, 메모리(120)는 휘발성 메모리, 비휘발성 메모리 또는 이들의 조합으로 구현될 수 있다. Memory 120 may be used as shared memory for communication between at least one CPU 112 or communication between at least one CPU 112 and another device, or as local memory for data storage by at least one CPU 112. have. In one embodiment, the memory 120 may be implemented as a volatile memory, a nonvolatile memory, or a combination thereof.
적어도 하나의 가상 머신(130)은 컴퓨팅 장치(100)에 의하여 운영되는 소프트웨어로 구현될 수 있다. 적어도 하나의 가상 머신(140) 각각은 사용자의 입장에서 별개의 물리적인 장치로 인식될 수 있고, 적어도 하나의 가상 머신(140) 중 하나는 CPU 쿨링을 제어하는 관리 가상 머신(132)에 해당한다. 즉, 관리 가상 머신(132)는 적어도 하나의 가상 머신(140) 중 하나에 해당하고, CPU 쿨러(120)에 있는 쿨링 팬의 속도를 제어한다.The at least one virtual machine 130 may be implemented in software operated by the computing device 100. Each of the at least one virtual machine 140 may be recognized as a separate physical device from the user's point of view, and one of the at least one virtual machine 140 corresponds to the management virtual machine 132 that controls CPU cooling. . That is, the management virtual machine 132 corresponds to one of the at least one virtual machine 140 and controls the speed of the cooling fan in the CPU cooler 120.
도 2는 도 1에 있는 관리 가상 머신을 설명하는 블록도이다.FIG. 2 is a block diagram illustrating the management virtual machine in FIG. 1.
도 2를 참조하면, 관리 가상 머신(132)은 CPU 모니터링 모듈(210), 전력모델 관리모듈(220), CPU 쿨러 모니터링 모듈(230) 및 관리 모듈(240)을 포함한다.2, the management virtual machine 132 includes a CPU monitoring module 210, a power model management module 220, a CPU cooler monitoring module 230, and a management module 240.
CPU 모니터링 모듈(210)은 특정 CPU(112a)에서 발생하는 온도를 모니터링한다. 일 실시예에서, 온도는 특정 CPU(112a)에 내장된 센서 또는 외부에 장착된 센서를 통해서 측정될 수 있고, CPU 모니터링 모듈(210)은 해당 센서를 통해 특정 CPU(112a)에서 발생하는 온도를 인식할 수 있다.The CPU monitoring module 210 monitors the temperature occurring in the specific CPU 112a. In one embodiment, the temperature may be measured through a sensor built in the specific CPU 112a or an externally mounted sensor, and the CPU monitoring module 210 may measure the temperature generated by the specific CPU 112a through the sensor. I can recognize it.
제어 모듈(220)은 CPU 쿨링에 의한 특정 CPU(112a)의 성능 증가와 CPU 쿨러(114)에 의한 전력 소모 간의 적절한 전력모델을 제시한다. 보다 상세하게, 제어 모듈(220)은 회귀 분석(regression analysis) 기반의 열적 효과를 고려한 전력 모델을 통해서 효율적인 CPU 쿨링을 수행할 수 있는 전력모델을 제시한다. 이를 위하여, 제어 모듈(220)은 세 가지의 자료구조를 관리할 수 있다. 제1 자료구조는 적어도 하나의 CPU(112) 각각의 제1 임계치 온도에 관한 정보를 관리하는데 사용되고, 제2 자료구조는 적어도 하나의 CPU(112) 각각의 현재 온도에 따른 전력 소모량에 관한 정보를 관리하는데 사용되며, 제3 자료구조는 적어도 하나의 CPU 쿨러(114)에 있는 쿨링 팬의 속도에 따른 전력소모량에 관한 정보를 관리하는데 사용된다. 제1 내지 제3 자료구조들 모두는 정적인 테이블들에 해당할 수 있고, 제1 임계치 온도, 현재 온도에 따른 전력 소모량 및 쿨링 팬에 따른 전력 thahfifd은 특정 CPU(112a)에 대하여 미리 결정될 수 있다.The control module 220 presents an appropriate power model between increasing the performance of a particular CPU 112a by CPU cooling and power consumption by the CPU cooler 114. More specifically, the control module 220 proposes a power model capable of performing efficient CPU cooling through a power model in consideration of thermal effects based on regression analysis. To this end, the control module 220 may manage three data structures. The first data structure is used to manage information relating to a first threshold temperature of each of the at least one CPU 112, and the second data structure provides information about power consumption according to a current temperature of each of the at least one CPU 112. The third data structure is used to manage information on power consumption according to the speed of the cooling fan in the at least one CPU cooler 114. All of the first to third data structures may correspond to static tables, and the first threshold temperature, power consumption according to the current temperature, and power thahfifd according to the cooling fan may be predetermined for the specific CPU 112a. .
쿨러 모니터링 모듈(230)은 특정 CPU 쿨러(114a)의 속도를 모니터링한다. 일 실시예에서, 쿨러 모니터링 모듈(230)은 쿨링 팬에 의하여 소모되는 전력소모량을 기초로 특정 CPU 쿨러(114a)의 속도를 모니터링할 수 있다.The cooler monitoring module 230 monitors the speed of the particular CPU cooler 114a. In one embodiment, the cooler monitoring module 230 may monitor the speed of the particular CPU cooler 114a based on the amount of power consumed by the cooling fan.
관리 모듈(240)은 CPU(112)와 CPU 쿨러(114)를 모니터링하거나 또는 제어하기 위하여 관리 가상 머신(132)에 대한 인터페이스를 제공한다. 즉, 관리 모듈(240)은 특정 CPU(112a)의 온도나 특정 CPU 쿨러(114a)의 속도를 알아내는 인터페이스의 역할을 수행할 수 있고, 특정 CPU 쿨러(114a)의 속도를 제어하는 인터페이스의 역할을 수행할 수 있다.The management module 240 provides an interface to the management virtual machine 132 to monitor or control the CPU 112 and the CPU cooler 114. That is, the management module 240 may serve as an interface for determining the temperature of the specific CPU 112a or the speed of the specific CPU cooler 114a, and serve as an interface for controlling the speed of the specific CPU cooler 114a. Can be performed.
이하, 도 3을 참조하여, 관리 가상 머신(132)에 의한 가상화 기반의 CPU 쿨링 제어 과정을 설명한다.Hereinafter, a process of controlling CPU cooling based on virtualization by the management virtual machine 132 will be described with reference to FIG. 3.
도 3은 도 1에 있는 관리 가상 머신에 의한 가상화 기반의 CPU 쿨링 제어 과정을 설명하는 흐름도이다.3 is a flowchart illustrating a process of controlling CPU cooling based on virtualization by the management virtual machine of FIG. 1.
도 3에서, 제어 모듈(220)은 CPU 쿨링 효과를 확인하기 위하여 특정 시간(예를 들어, 5분) 동안 대기한다(단계 S310). 일 실시예에서, 특정 시간은 고정될 수 있다. 이러한 고정은 쿨링 제어 과정을 주기적으로 수행되도록 할 수 있다. 다른 일 실시예에서, 특정 시간은 가변될 수 있다. 이러한 가변은 특정 CPU(112a)의 온도 변화폭을 기초로 결정될 수 있다. 예를 들어, 온도 변화폭이 특정 임계치(예를 들어, 20도) 이상이면 제어 모듈(220)은 즉각적으로 대기를 멈출 수 있다.In FIG. 3, the control module 220 waits for a specific time (eg, 5 minutes) to confirm the CPU cooling effect (step S310). In one embodiment, the specific time may be fixed. This fixing may allow the cooling control process to be performed periodically. In another embodiment, the specific time may vary. Such a variable may be determined based on a temperature change range of the specific CPU 112a. For example, if the temperature change range is above a certain threshold (eg, 20 degrees), the control module 220 may immediately stop waiting.
제어 모듈(220)은 CPU 모니터링 모듈(210)로부터 특정 CPU(112a)의 현재 온도를 얻을 수 있다(단계 S315). 일 실시예에서, CPU 모니터링 모듈(210)은 관리 모듈(240)를 통해서 적어도 하나의 CPU(112)에 대한 온도를 계속해서 측정할 수 있고, 제어 모듈(220)의 요구에 따라 특정 CPU(112a)에 대한 현재 온도를 제공할 수 있다. 여기에서, CPU 모니터링 모듈(210)은 적어도 하나의 CPU(112) 각각을 위한 현재 온도 테이블을 유지할 수 있다. 다른 일 실시예에서, CPU 모니터링 모듈(210)은 제어 모듈(220)의 요구에 따라 특정 CPU(112a)의 현재 온도를 측정한 후 특정 CPU(112a)의 현재 온도를 제공할 수 있다.The control module 220 may obtain the current temperature of the specific CPU 112a from the CPU monitoring module 210 (step S315). In one embodiment, the CPU monitoring module 210 may continue to measure the temperature for the at least one CPU 112 through the management module 240, and in response to the request of the control module 220, the specific CPU 112a. Can provide the current temperature for. Here, the CPU monitoring module 210 may maintain a current temperature table for each of the at least one CPU 112. In another embodiment, the CPU monitoring module 210 may provide a current temperature of the specific CPU 112a after measuring the current temperature of the specific CPU 112a according to a request of the control module 220.
제어 모듈(220)은 특정 CPU(112a)의 현재 온도가 특정 CPU(112a)에서 열적 효과(thermal effect)로 인한 전력 소모가 발생하는 온도(이하, 제1 임계치 온도)를 초과하는지 여부를 결정한다(단계 S320). 즉, 제어 모듈(220)은 특정 CPU(112a)에서 열적 효과로 인한 전력 소모가 발생하는지 여부를 결정한다. 일 실시예에서, 제어 모듈(220)은 적어도 하나의 CPU(112) 각각에 대한 제1 임계치 온도를 관리할 수 있고, 특정 CPU(112a)의 현재 온도가 수신되면 특정 CPU(112a)의 현재 온도와 특정 CPU(112a)의 제1 임계치 온도를 비교할 수 있다.The control module 220 determines whether the current temperature of the specific CPU 112a exceeds a temperature at which power consumption occurs due to a thermal effect in the specific CPU 112a (hereinafter, referred to as a first threshold temperature). (Step S320). That is, the control module 220 determines whether power consumption due to a thermal effect occurs in the specific CPU 112a. In one embodiment, the control module 220 may manage a first threshold temperature for each of the at least one CPU 112 and, if a current temperature of the particular CPU 112a is received, the current temperature of the particular CPU 112a. And the first threshold temperature of the specific CPU 112a may be compared.
한편, 단계 S315 및 S316과 다른 실시예로서, CPU 모니터링 모듈(210)은 적어도 하나의 CPU(112) 각각에 대한 제1 임계치 온도를 관리할 수 있고, 관리 모듈(240)를 통해서 특정 CPU(112a)의 현재 온도를 얻어서 특정 CPU(112a)의 현재 온도와 특정 CPU(112a)의 제1 임계치 온도를 비교할 수 있다. 다음으로, CPU 모니터링 모듈(210)은 특정 CPU(112a)의 현재 온도가 특정 CPU(112a)의 제1 임계치 온도를 초과하면 제어 모듈(220)에 이러한 초과 정보를 통지할 수 있다.On the other hand, as an embodiment different from steps S315 and S316, the CPU monitoring module 210 may manage a first threshold temperature for each of the at least one CPU 112, and the specific CPU 112a through the management module 240. ) Can be obtained to compare the current temperature of the specific CPU 112a with the first threshold temperature of the specific CPU 112a. Next, the CPU monitoring module 210 may notify the control module 220 of such excess information if the current temperature of the specific CPU 112a exceeds the first threshold temperature of the specific CPU 112a.
제어 모듈(220)은 특정 CPU(112a)의 현재 온도가 특정 CPU(112a)의 제1 임계치 온도를 초과하지 않으면 관리 모듈(240)를 통해서 특정 CPU(112a)에 대응하는 CPU 쿨러(114a)에 있는 쿨링 팬의 속도를 낮춘다(단계 S325). 일 실시예에서, 제어 모듈(220)은 쿨링 팬의 속도를 일정 속도(예를 들어, 100 RPM)만큼 낮출 수 있다. 쿨러 모니터링 모듈(230)은 관리 모듈(240)를 통해서 쿨링 팬의 속도가 낮추어졌는지 여부를 모니터링하여 쿨링 팬의 속도 변경 여부를 결정한다(단계 S380). 일 실시예에서, 쿨러 모니터링 모듈(230)은 쿨링 팬에 의하여 소모되는 전력소모량을 기초로 쿨링 팬의 속도 변경 여부를 결정할 수 있다.The control module 220 supplies the CPU cooler 114a corresponding to the specific CPU 112a through the management module 240 if the current temperature of the specific CPU 112a does not exceed the first threshold temperature of the specific CPU 112a. The speed of the cooling fan is lowered (step S325). In one embodiment, the control module 220 may lower the speed of the cooling fan by a predetermined speed (eg, 100 RPM). The cooler monitoring module 230 monitors whether the speed of the cooling fan is lowered through the management module 240 to determine whether to change the speed of the cooling fan (step S380). In one embodiment, the cooler monitoring module 230 may determine whether to change the speed of the cooling fan based on the amount of power consumed by the cooling fan.
결과적으로, 상기의 단계들 S320 및 S325에서, 제어 모듈(220)은 특정 CPU(112a)에서 열적 효과로 인한 전력 소모가 발생하지 않으면 특정 CPU(112a)에 대응하는 쿨링 팬의 속도를 낮춘다.As a result, in steps S320 and S325 described above, the control module 220 lowers the speed of the cooling fan corresponding to the specific CPU 112a if power consumption due to a thermal effect does not occur in the specific CPU 112a.
제어 모듈(220)은 특정 CPU(112a)의 현재 온도가 특정 CPU(112a)의 제1 임계치 온도를 초과하면 특정 CPU(112a)의 현재 온도가 CPU 쓰로틀링(throttling) 온도에 일정 범위 이내(이하, 제2 임계치 온도)로 접근하는지 여부를 결정한다(단계 S330). 예를 들어, 일정 범위는 5도에 해당할 수 있고, 이러한 일정 범위는 CPU 쓰로틀링이 발생하는 것을 방지하기 위하여 설정될 수 있다. 여기에서, CPU 쓰로틀링은 동적 주파수 스케일링(dynamic voltage scaling)으로 알려져 있으며, 전력을 보전하거나 해당 CPU에 의하여 생성된 열량을 감소시키기 위하여 CPU의 주파수가 자동적으로 조절되는 기술을 의미한다.If the current temperature of the specific CPU 112a exceeds the first threshold temperature of the specific CPU 112a, the control module 220 may have a current temperature within a predetermined range below the CPU throttling temperature. A second threshold temperature) is determined (step S330). For example, the predetermined range may correspond to 5 degrees, and the predetermined range may be set to prevent CPU throttling from occurring. Here, CPU throttling is known as dynamic voltage scaling, and refers to a technology in which the frequency of the CPU is automatically adjusted to conserve power or reduce the amount of heat generated by the CPU.
제어 모듈(220)은 특정 CPU(112a)의 현재 온도가 제2 임계치 온도 이상이면 관리 모듈(240)를 통해서 특정 CPU(112a)에 대응하는 CPU 쿨러(114a)에 있는 쿨링 팬의 속도를 높인다(단계 S335). 일 실시예에서, 제어 모듈(220)은 쿨링 팬의 속도를 일정 속도(예를 들어, 100 RPM)만큼 높일 수 있다. 쿨러 모니터링 모듈(230)은 관리 모듈(240)를 통해서 쿨링 팬의 속도가 높아졌는지 여부를 모니터링하여 쿨링 팬의 속도 변경 여부를 결정한다(단계 S380). The control module 220 speeds up the cooling fan in the CPU cooler 114a corresponding to the specific CPU 112a through the management module 240 when the current temperature of the specific CPU 112a is equal to or greater than the second threshold temperature (see FIG. Step S335). In one embodiment, the control module 220 may increase the speed of the cooling fan by a predetermined speed (eg, 100 RPM). The cooler monitoring module 230 monitors whether the speed of the cooling fan is increased through the management module 240 to determine whether to change the speed of the cooling fan (step S380).
제어 모듈(220)은 특정 CPU(112a)의 현재 온도가 제2 임계치 온도 미만이면열적 효과로 인한 특정 CPU(112a)의 전력소모량과 특정 CPU 쿨러(114a)의 전력 소모량(즉, 쿨링 팬의 속도 높임으로 인한 전력 소모량)을 측정한다(단계 S340). 특정 CPU(112a)의 전력소모량은 CPU 모니터링 모듈(210)에 의하여 측정된 현재 온도를 기초로 결정될 수 있다. 특정 CPU 쿨러(114a)의 전력 소모량은 쿨러 모니터링 모듈(230)에 의하여 측정될 수 있다.The control module 220 controls the power consumption of the specific CPU 112a and the power consumption of the specific CPU cooler 114a due to the thermal effect when the current temperature of the specific CPU 112a is less than the second threshold temperature (that is, the speed of the cooling fan). The power consumption due to the increase) is measured (step S340). The power consumption of the particular CPU 112a may be determined based on the current temperature measured by the CPU monitoring module 210. The power consumption of the particular CPU cooler 114a may be measured by the cooler monitoring module 230.
제어 모듈(220)은 특정 CPU 쿨러(114a)의 전력 소모량이 특정 CPU(112a)의 전력소모량보다 높은지 여부를 결정한다(단계 S350). 그렇다면, 제어 모듈(220)은 특정 CPU 쿨러(114a)에 있는 쿨링 팬의 속도를 유지한다(단계 S360). 그렇지 않다면, 제어 모듈(220)은 특정 CPU 쿨러(114a)에 있는 쿨링 팬의 속도를 높인다(단계 S355).The control module 220 determines whether the power consumption of the specific CPU cooler 114a is higher than the power consumption of the specific CPU 112a (step S350). If so, the control module 220 maintains the speed of the cooling fan in the specific CPU cooler 114a (step S360). If not, the control module 220 speeds up the cooling fan in the specific CPU cooler 114a (step S355).
결과적으로, 상기의 단계들 S330, S340, S350 및 S360에서, 제어 모듈(220)은 특정 CPU(112a)의 온도가 CPU 쓰로틀링 온도에 일정 범위 이내로 접근하면 특정 쿨러(114a)에 있는 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여한다.As a result, in steps S330, S340, S350, and S360, the control module 220 determines that the cooling fan of the cooling fan in the specific cooler 114a if the temperature of the specific CPU 112a approaches the CPU throttling temperature within a certain range. Priority is given to preventing CPU throttling rather than preventing power consumption from speeding up.
한편, 단계 S380에서, 쿨링 팬의 속도 변경이 실패하면, 제어 모듈(220)은 쿨링 팬의 속도가 최대 또는 최소인지 여부를 결정한다(단계 S365). 그렇다면, 제어 모듈(220)은 특정 CPU 쿨러(114a)에 있는 쿨링 팬의 속도를 유지하고(단계 S360), 그렇지 않다면, 제어 모듈(220)은 쿨링 팬의 속도를 다시 제어하고(단계 S370) 쿨링 팬의 속도 변경이 성공하였는지 여부를 결정한다(단계 S380).On the other hand, if the speed change of the cooling fan fails in step S380, the control module 220 determines whether the speed of the cooling fan is the maximum or minimum (step S365). If so, the control module 220 maintains the speed of the cooling fan in the specific CPU cooler 114a (step S360), otherwise, the control module 220 controls the speed of the cooling fan again (step S370). It is determined whether or not the fan speed change is successful (step S380).
한편, 상기의 단계들 S310 내지 S380은 쿨링 효과를 확인할 수 있도록 단계S310에서 제시된 일정 시간 경과 후 반복된다.On the other hand, the steps S310 to S380 are repeated after a predetermined time elapsed in step S310 so as to confirm the cooling effect.
상기에서는 본 출원의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야의 숙련된 당업자는 하기의 특허 청구의 범위에 기재된 본 출원의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 출원을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although described above with reference to a preferred embodiment of the present application, those skilled in the art various modifications and changes to the present application without departing from the spirit and scope of the present application described in the claims below I can understand that you can.

Claims (11)

  1. 적어도 하나의 CPU(Central Processing Unit) 및 쿨링 팬으로 구현된 CPU 쿨러를 포함하는 컴퓨팅 장치에 의하여 운영되는 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신에서 수행되는 가상화 기반의 CPU 쿨링 제어 방법에 있어서,A virtualization-based CPU cooling control method performed in a management virtual machine which is one of at least one virtual machine operated by a computing device including a CPU cooler implemented with at least one central processing unit (CPU) and a cooling fan,
    (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추는 단계; 및(a) lowering a speed of a cooling fan corresponding to the specific CPU if power consumption due to a thermal effect does not occur in the specific CPU; And
    (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 일정 범위 이내로 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여하는 단계를 포함하는 가상화 기반의 CPU 쿨링 제어 방법.(b) if the temperature of the particular CPU approaches the CPU throttling temperature within a certain range, the priority is given to preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan. Virtualization-based CPU cooling control method comprising the steps.
  2. 제1항에 있어서, 상기 (a) 단계는The method of claim 1, wherein step (a)
    상기 특정 CPU의 온도가 상기 열적 효과로 인한 전력 소모가 발생하는 온도에 해당하는 제1 임계치 온도 이하이면 상기 쿨링 팬의 속도를 일정 속도만큼 낮추는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.Virtualization-based CPU cooling, further comprising: lowering the speed of the cooling fan by a predetermined speed when the temperature of the specific CPU is lower than a first threshold temperature corresponding to a temperature at which power consumption due to the thermal effect occurs. Control method.
  3. 제2항에 있어서, 상기 (b) 단계는The method of claim 2, wherein step (b)
    상기 특정 CPU의 온도가 CPU 쓰로틀링(CPU throttling) 온도와 연관된 제2 임계치 온도 이상이면 상기 쿨링 팬의 속도를 일정 속도만큼 높이는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.And if the temperature of the particular CPU is greater than or equal to a second threshold temperature associated with a CPU throttling temperature, increasing the speed of the cooling fan by a predetermined speed.
  4. 제3항에 있어서, 상기 제2 임계치 온도는4. The method of claim 3, wherein the second threshold temperature is
    상기 CPU 쓰로틀링 온도로부터 일정 온도 이하에 해당하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.Virtualization-based CPU cooling control method characterized in that it corresponds to a predetermined temperature or less from the CPU throttling temperature.
  5. 제3항에 있어서, 상기 (b) 단계는The method of claim 3, wherein step (b)
    상기 특정 CPU의 온도가 상기 제2 임계치 온도를 미만이면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모량(이하, 제1 전력 소모량)과 상기 열적 효과로 인한 전력 소모량(이하, 제2 전력 소모량)을 측정하는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.When the temperature of the specific CPU is less than the second threshold temperature, the power consumption due to the speed of the cooling fan (hereinafter, referred to as first power consumption) and the power consumption due to the thermal effect (hereinafter referred to as second power consumption) are measured. Virtualization-based CPU cooling control method further comprising the step of.
  6. 제5항에 있어서, 상기 (b) 단계는The method of claim 5, wherein step (b)
    상기 제1 전력 소모량이 상기 제2 전력 소모량보다 높지 않다면 상기 쿨링 팬의 속도를 상기 일정 속도만큼 높이는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.And increasing the speed of the cooling fan by the predetermined speed if the first power consumption is not higher than the second power consumption.
  7. 제6항에 있어서, 상기 (b) 단계는The method of claim 6, wherein step (b)
    상기 제1 전력 소모량이 상기 제2 전력 소모량보다 높다면 상기 쿨링 팬의 이전 속도를 유지하는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.And maintaining the transfer speed of the cooling fan if the first power consumption is higher than the second power consumption.
  8. 제1항에 있어서, 상기 열적 효과로 인한 전력 소모가 발생하는 온도와 상기 CPU 쓰로틀링 온도는The method of claim 1, wherein the temperature at which power consumption due to the thermal effect occurs and the CPU throttling temperature is
    상기 특정 CPU에 대하여 미리 결정된 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.Virtualization-based CPU cooling control method characterized in that the predetermined for the particular CPU.
  9. 제1항에 있어서,The method of claim 1,
    쿨링 효과를 확인할 수 있도록 일정 시간 경과 후 상기 (a) 단계 및 상기 (b) 단계를 반복하는 단계를 더 포함하는 것을 특징으로 하는 가상화 기반의 CPU 쿨링 제어 방법.Virtualization-based CPU cooling control method further comprises the step of repeating the step (a) and (b) after a predetermined time so that the cooling effect can be confirmed.
  10. 적어도 하나의 CPU(Central Processing Unit) 및 쿨링 팬으로 구현된 CPU 쿨러를 포함하고, 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신을 운영하여 가상화 기반의 CPU 쿨링 제어를 수행하는 컴퓨팅 장치에 있어서, 상기 컴퓨팅 장치는A computing device including a CPU cooler implemented with at least one central processing unit (CPU) and a cooling fan, and operating a management virtual machine, which is one of at least one virtualization machine, to perform virtualization-based CPU cooling control. Computing devices
    (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추고,(a) if power consumption does not occur due to thermal effects in a particular CPU, lower the speed of the cooling fan corresponding to the specific CPU;
    (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여하는 컴퓨팅 장치.(b) if the temperature of the particular CPU approaches a CPU throttling temperature, prioritizing preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
  11. 적어도 하나의 가상화 머신 중 하나인 관리 가상 머신을 운영하는 적어도 하나의 CPU(Central Processing Unit); 및At least one central processing unit (CPU) to operate a management virtual machine, which is one of the at least one virtualization machine; And
    상기 적어도 하나의 CPU에 대응하고 쿨링 팬으로 구현된 적어도 하나의 CPU 쿨러를 포함하고,At least one CPU cooler corresponding to the at least one CPU and implemented as a cooling fan,
    상기 관리 가상 머신은 (a) 특정 CPU에서 열적 효과로 인한 전력 소모가 발생하지 않으면 상기 특정 CPU에 대응하는 쿨링 팬의 속도를 낮추고, (b) 상기 특정 CPU의 온도가 CPU 쓰로틀링(throttling) 온도에 접근하면 상기 쿨링 팬의 속도 높임으로 인한 전력 소모를 방지하는 것보다 상기 CPU 쓰로틀링을 방지하는 것에 우선순위를 부여하는 가상화 기반의 CPU 쿨링 제어를 수행하는 컴퓨팅 장치.The management virtual machine (a) lowers the speed of the cooling fan corresponding to the specific CPU if the power consumption does not occur due to thermal effects in the specific CPU, and (b) the temperature of the specific CPU is the CPU throttling temperature And a virtualization-based CPU cooling control that gives priority to preventing the CPU throttling rather than preventing power consumption due to speeding up the cooling fan.
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