WO2013122099A1 - Procédé et dispositif de découpage au laser - Google Patents

Procédé et dispositif de découpage au laser Download PDF

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Publication number
WO2013122099A1
WO2013122099A1 PCT/JP2013/053383 JP2013053383W WO2013122099A1 WO 2013122099 A1 WO2013122099 A1 WO 2013122099A1 JP 2013053383 W JP2013053383 W JP 2013053383W WO 2013122099 A1 WO2013122099 A1 WO 2013122099A1
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WO
WIPO (PCT)
Prior art keywords
cutting
cutting line
laser
scrap
line
Prior art date
Application number
PCT/JP2013/053383
Other languages
English (en)
Japanese (ja)
Inventor
雅典 赤木
信一郎 北川
Original Assignee
日産自動車株式会社
オートモーティブエナジーサプライ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日産自動車株式会社, オートモーティブエナジーサプライ株式会社 filed Critical 日産自動車株式会社
Publication of WO2013122099A1 publication Critical patent/WO2013122099A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

Le procédé et le dispositif de découpage au laser de l'invention ont pour objectif de retirer de manière sûre les portions inutiles apparaissant lors d'un découpage au laser. Selon l'invention, suivant une partie (trajectoires (b, f)) de premières lignes de découpage (trajectoires (a, d, b, e, f, g, i)) selon lesquelles une forme d'article (101) est taillée à partir d'un élément sous forme de feuille, sont établies des secondes lignes de découpage (trajectoire c, h) selon lesquelles est effectuées une nouvelle irradiation au laser en une région davantage côté retrait des portions inutiles (chutes (120)) que les premières lignes de découpage. Le long des premières et des secondes lignes de découpage est irradié par un faisceau laser, et ledit objectif est ainsi atteint.
PCT/JP2013/053383 2012-02-13 2013-02-13 Procédé et dispositif de découpage au laser WO2013122099A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-028359 2012-02-13
JP2012028359A JP5997911B2 (ja) 2012-02-13 2012-02-13 レーザ切断方法およびレーザ切断装置

Publications (1)

Publication Number Publication Date
WO2013122099A1 true WO2013122099A1 (fr) 2013-08-22

Family

ID=48984208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/053383 WO2013122099A1 (fr) 2012-02-13 2013-02-13 Procédé et dispositif de découpage au laser

Country Status (2)

Country Link
JP (1) JP5997911B2 (fr)
WO (1) WO2013122099A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110640331A (zh) * 2019-08-23 2020-01-03 大族激光科技产业集团股份有限公司 一种软包电池极耳的激光切割工装及激光切割生产线
CN111312786A (zh) * 2020-02-28 2020-06-19 云谷（固安）科技有限公司 柔性显示面板及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6029351B2 (ja) * 2012-06-28 2016-11-24 日産自動車株式会社 レーザ切断方法、製品の製造装置、および製品の製造方法
WO2019000322A1 (fr) * 2017-06-29 2019-01-03 深圳市大疆创新科技有限公司 Procédé et appareil pour couper une plaque de batterie
CN107790895A (zh) * 2017-11-01 2018-03-13 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) 电极箔的切割装置及其切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09128746A (ja) * 1995-10-31 1997-05-16 Hitachi Ltd 磁気ディスクの製造方法及び製造装置
JPH11144970A (ja) * 1997-11-11 1999-05-28 Toshiba Corp 変圧器鉄心の製造方法および装置
JP2010034009A (ja) * 2008-07-31 2010-02-12 Nec Tokin Corp 積層型二次電池およびその製造方法
JP2011096620A (ja) * 2009-11-02 2011-05-12 Samsung Sdi Co Ltd 二次電池、その製造方法及び切断金型

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09128746A (ja) * 1995-10-31 1997-05-16 Hitachi Ltd 磁気ディスクの製造方法及び製造装置
JPH11144970A (ja) * 1997-11-11 1999-05-28 Toshiba Corp 変圧器鉄心の製造方法および装置
JP2010034009A (ja) * 2008-07-31 2010-02-12 Nec Tokin Corp 積層型二次電池およびその製造方法
JP2011096620A (ja) * 2009-11-02 2011-05-12 Samsung Sdi Co Ltd 二次電池、その製造方法及び切断金型

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110640331A (zh) * 2019-08-23 2020-01-03 大族激光科技产业集团股份有限公司 一种软包电池极耳的激光切割工装及激光切割生产线
CN110640331B (zh) * 2019-08-23 2021-06-01 大族激光科技产业集团股份有限公司 一种软包电池极耳的激光切割工装及激光切割生产线
CN111312786A (zh) * 2020-02-28 2020-06-19 云谷（固安）科技有限公司 柔性显示面板及其制备方法
CN111312786B (zh) * 2020-02-28 2022-11-15 云谷（固安）科技有限公司 柔性显示面板及其制备方法

Also Published As

Publication number Publication date
JP2013163213A (ja) 2013-08-22
JP5997911B2 (ja) 2016-09-28

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