WO2013105616A1 - 外観が良好な太陽電池モジュール及びその製造方法 - Google Patents
外観が良好な太陽電池モジュール及びその製造方法 Download PDFInfo
- Publication number
- WO2013105616A1 WO2013105616A1 PCT/JP2013/050339 JP2013050339W WO2013105616A1 WO 2013105616 A1 WO2013105616 A1 WO 2013105616A1 JP 2013050339 W JP2013050339 W JP 2013050339W WO 2013105616 A1 WO2013105616 A1 WO 2013105616A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealing material
- solar cell
- cell module
- temperature
- backsheet
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title description 75
- 239000003566 sealing material Substances 0.000 claims abstract description 220
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 229920000098 polyolefin Polymers 0.000 claims description 59
- 239000011342 resin composition Substances 0.000 claims description 54
- 238000003860 storage Methods 0.000 claims description 29
- 239000004711 α-olefin Substances 0.000 claims description 28
- 229920001577 copolymer Polymers 0.000 claims description 26
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 25
- 239000005977 Ethylene Substances 0.000 claims description 25
- 239000008393 encapsulating agent Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 abstract description 37
- 238000010030 laminating Methods 0.000 abstract description 21
- 230000006835 compression Effects 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 2
- 230000010355 oscillation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 133
- 239000012790 adhesive layer Substances 0.000 description 64
- 229920005989 resin Polymers 0.000 description 41
- 239000011347 resin Substances 0.000 description 41
- -1 polyethylene Polymers 0.000 description 36
- 239000013078 crystal Substances 0.000 description 34
- 239000000463 material Substances 0.000 description 32
- 238000002844 melting Methods 0.000 description 32
- 230000008018 melting Effects 0.000 description 32
- 229920000139 polyethylene terephthalate Polymers 0.000 description 30
- 239000005020 polyethylene terephthalate Substances 0.000 description 30
- 239000000654 additive Substances 0.000 description 21
- 230000001681 protective effect Effects 0.000 description 21
- 238000001125 extrusion Methods 0.000 description 20
- 239000005038 ethylene vinyl acetate Substances 0.000 description 19
- 239000011521 glass Substances 0.000 description 19
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 19
- 230000000996 additive effect Effects 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 16
- 239000000178 monomer Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 15
- 239000010408 film Substances 0.000 description 14
- 239000004697 Polyetherimide Substances 0.000 description 12
- 229920001601 polyetherimide Polymers 0.000 description 12
- 229920013716 polyethylene resin Polymers 0.000 description 12
- 239000006087 Silane Coupling Agent Substances 0.000 description 11
- 239000003963 antioxidant agent Substances 0.000 description 11
- 235000006708 antioxidants Nutrition 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 229920002620 polyvinyl fluoride Polymers 0.000 description 11
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 11
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 11
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 11
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 10
- 239000004743 Polypropylene Substances 0.000 description 9
- 230000007062 hydrolysis Effects 0.000 description 9
- 238000006460 hydrolysis reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 229920001155 polypropylene Polymers 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 8
- 229920005604 random copolymer Polymers 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 229920001400 block copolymer Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 7
- 238000009472 formulation Methods 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- 229920001225 polyester resin Polymers 0.000 description 7
- 239000004645 polyester resin Substances 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 230000008929 regeneration Effects 0.000 description 6
- 238000011069 regeneration method Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000004049 embossing Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 5
- 239000004700 high-density polyethylene Substances 0.000 description 5
- 229920000554 ionomer Polymers 0.000 description 5
- 239000004611 light stabiliser Substances 0.000 description 5
- 229920001684 low density polyethylene Polymers 0.000 description 5
- 239000004702 low-density polyethylene Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 239000002033 PVDF binder Substances 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical compound C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 4
- 239000002667 nucleating agent Substances 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- GVJHHUAWPYXKBD-UHFFFAOYSA-N d-alpha-tocopherol Natural products OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 3
- 238000009820 dry lamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000009823 thermal lamination Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000012685 gas phase polymerization Methods 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000012968 metallocene catalyst Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229920006030 multiblock copolymer Polymers 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920005606 polypropylene copolymer Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000012005 post-metallocene catalyst Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 150000003902 salicylic acid esters Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000001757 thermogravimetry curve Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- POLSVAXEEHDBMJ-UHFFFAOYSA-N (2-hydroxy-4-octadecoxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 POLSVAXEEHDBMJ-UHFFFAOYSA-N 0.000 description 1
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 description 1
- ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- OMWSZDODENFLSV-UHFFFAOYSA-N (5-chloro-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=C(Cl)C=C1C(=O)C1=CC=CC=C1 OMWSZDODENFLSV-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- WSOMHEOIWBKOPF-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)methyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CP2(=O)C3=CC=CC=C3C3=CC=CC=C3O2)=C1 WSOMHEOIWBKOPF-UHFFFAOYSA-N 0.000 description 1
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- MJFOVRMNLQNDDS-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-dimethylphenol Chemical compound CC1=CC(C)=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MJFOVRMNLQNDDS-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- NLWDAUDWBLSJGK-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butyl-6-methylphenol Chemical compound CC1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O NLWDAUDWBLSJGK-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- ZSSVCEUEVMALRD-UHFFFAOYSA-N 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(octyloxy)phenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(C)=CC=2)C)=NC(C=2C(=CC(C)=CC=2)C)=N1 ZSSVCEUEVMALRD-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- YLUZWKKWWSCRSR-UHFFFAOYSA-N 3,9-bis(8-methylnonoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCC(C)C)OCC21COP(OCCCCCCCC(C)C)OC2 YLUZWKKWWSCRSR-UHFFFAOYSA-N 0.000 description 1
- OUWPEHOSUWXUFV-UHFFFAOYSA-N 4-(benzotriazol-2-yl)-3-methylphenol Chemical compound CC1=CC(O)=CC=C1N1N=C2C=CC=CC2=N1 OUWPEHOSUWXUFV-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- NTFPXUXETMDZOD-UHFFFAOYSA-N CCCCCCCCCCCCCCCCCCP(O)(O1)OC11OP(CCCCCCCCCCCCCCCCCC)(O)OCC1(C)C Chemical compound CCCCCCCCCCCCCCCCCCP(O)(O1)OC11OP(CCCCCCCCCCCCCCCCCC)(O)OCC1(C)C NTFPXUXETMDZOD-UHFFFAOYSA-N 0.000 description 1
- LCRNRCXIKZEMSB-UHFFFAOYSA-N CCCCOOC(=O)C1=CC=CC=C1C(O)=O Chemical compound CCCCOOC(=O)C1=CC=CC=C1C(O)=O LCRNRCXIKZEMSB-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229930003427 Vitamin E Natural products 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- GBTKXRHCGMUSDA-UHFFFAOYSA-N [SiH3]OC(=O)CCC=C Chemical compound [SiH3]OC(=O)CCC=C GBTKXRHCGMUSDA-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- AYIGWTYMCHDVTN-UHFFFAOYSA-N [dicarboxy(ethenyl)silyl]formic acid Chemical compound OC(=O)[Si](C=C)(C(O)=O)C(O)=O AYIGWTYMCHDVTN-UHFFFAOYSA-N 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229920001222 biopolymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- NMGSDTSOSIPXTN-UHFFFAOYSA-N cyclohexa-1,2-diene Chemical compound C1CC=C=CC1 NMGSDTSOSIPXTN-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- PWOZXQOZUNMWKG-UHFFFAOYSA-N ethenyl(tripentoxy)silane Chemical compound CCCCCO[Si](OCCCCC)(OCCCCC)C=C PWOZXQOZUNMWKG-UHFFFAOYSA-N 0.000 description 1
- FEHYCIQPPPQNMI-UHFFFAOYSA-N ethenyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C=C)OC1=CC=CC=C1 FEHYCIQPPPQNMI-UHFFFAOYSA-N 0.000 description 1
- NNBRCHPBPDRPIT-UHFFFAOYSA-N ethenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C=C NNBRCHPBPDRPIT-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- VYJZXBZFLIBVQA-UHFFFAOYSA-N ethenyl-tris(phenylmethoxy)silane Chemical compound C=1C=CC=CC=1CO[Si](OCC=1C=CC=CC=1)(C=C)OCC1=CC=CC=C1 VYJZXBZFLIBVQA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- WIGCFUFOHFEKBI-UHFFFAOYSA-N gamma-tocopherol Natural products CC(C)CCCC(C)CCCC(C)CCCC1CCC2C(C)C(O)C(C)C(C)C2O1 WIGCFUFOHFEKBI-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229960002479 isosorbide Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- LKTCWOYIQVKYIV-UHFFFAOYSA-N n-butyl-4-chloro-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)-1,3,5-triazin-2-amine Chemical compound N=1C=NC(Cl)=NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 LKTCWOYIQVKYIV-UHFFFAOYSA-N 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- KCRLWVVFAVLSAP-UHFFFAOYSA-N octyl dihydrogen phosphite Chemical compound CCCCCCCCOP(O)O KCRLWVVFAVLSAP-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920005633 polypropylene homopolymer resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 229920005675 propylene-butene random copolymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- CXVGEDCSTKKODG-UHFFFAOYSA-N sulisobenzone Chemical compound C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 CXVGEDCSTKKODG-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229930003799 tocopherol Natural products 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 229960001295 tocopherol Drugs 0.000 description 1
- 239000011732 tocopherol Substances 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000019165 vitamin E Nutrition 0.000 description 1
- 239000011709 vitamin E Substances 0.000 description 1
- 229940046009 vitamin E Drugs 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0617—Polyalkenes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0622—Polyvinylalcohols, polyvinylacetates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module, and more particularly, to a solar cell module that allows easy setting of laminate conditions and good appearance, and a method for manufacturing the same.
- the solar cell constitutes the central part of a photovoltaic power generation system that directly converts sunlight energy into electricity.
- a plurality of solar cell elements are wired in series and in parallel as the structure, and various packaging is performed to protect the cells, thereby forming a unit.
- the unit incorporated in this package is called a solar cell module, and the surface exposed to sunlight is generally covered with a transparent substrate (glass or resin sheet, hereinafter referred to as front sheet) as an upper protective material,
- a transparent substrate glass or resin sheet, hereinafter referred to as front sheet
- a back surface sealing sheet (hereinafter referred to as a back sheet) with a gap filled with a sealing material (sealing resin layer) made of a plastic plastic (for example, ethylene-vinyl acetate copolymer or polyethylene polymer) and the back surface as a lower protective material. It is a protected structure.
- ethylene-vinyl acetate copolymer hereinafter sometimes referred to as EVA
- PE polyethylene
- IO ionomer
- PVB polyvinyl butyral
- the sealing material includes flexibility and impact resistance for protecting the solar cell element, heat resistance when the solar cell module generates heat, and transparency for efficiently reaching the solar cell element ( The total light transmittance, etc.), durability, dimensional stability, flame retardancy, water vapor barrier properties, etc. are mainly required. Furthermore, since the sealing material is generally used after being laminated, its processability and appearance after lamination are also important.
- the lamination conditions of the solar cell module are generally set by trial and error methods in consideration of various members to be used (sealing material, back sheet, glass, wiring, cell, etc.). In addition, it takes time to set the conditions, and the cost of various members to be used may be expensive.
- a specific appearance problem in the condition setting includes a phenomenon in which a convex protrusion is generated on the back sheet surface (hereinafter, sometimes referred to as a convex phenomenon).
- a convex phenomenon in Patent Document 1, when a solar cell module is manufactured using a back sheet (back surface protection sheet for solar cell module), the back sheet contracts when performing a vacuum laminating process. It is described that the solar cell element and the lead wire (tag) connecting the elements follow the shrinkage of the back sheet, the lead wire is deformed, and the interval between the solar cell elements is changed. Has been.
- the heat shrinkage rate of the back sheet at 150 ° C. for 30 minutes is 1.0% or less, particularly 0.5% or less, particularly 0.3% to 0.00%. It is disclosed that it is preferably in the range of 1%.
- the biaxially stretched PET film has a large thermal shrinkage rate.
- the wiring (corresponding to the lead wire described in Patent Document 1) is bent or the battery (cell) is displaced in the large solar cell module process.
- a heat fixing process of annealing the film stretched on equipment is required, which causes an increase in the cost of the film, It is described that there is a problem in cost that an inexpensive back sheet cannot be obtained (see Patent Document 2, paragraph 0007).
- a back sheet in which a polycarbonate film and a gas barrier transparent vapor deposition film are laminated has been proposed (see Patent Document 2 and Claim 1).
- An object of the present invention is to provide a solar cell module having a good appearance after lamination, a backsheet-sealing material integrated sheet, and a method for manufacturing the solar cell module.
- the present invention relates to the following [1] to [18].
- a solar cell module in which at least the back sheet (A) and the sealing material (B) are laminated, and the shrinkage stress ( ⁇ (A)) of the following back sheet (A) at the laminate setting temperature
- the ratio ( ⁇ (A) / G ′ (B)) of the shear modulus (G ′ (B)) (Pa) between (Pa) and the following sealing material (B) is 60.0 or less.
- the storage modulus (E ′) of the sealing material (B) at a vibration frequency of 10 Hz and a temperature of 20 ° C. is 1 to 100 MPa, according to any one of the above [1] to [4]
- the resin composition constituting the encapsulant (B) is an olefin polymer (X) having an MFR (JIS K7210, temperature: 190 ° C., load: 21.18 N) of less than 5 g / 10 min.
- the solar cell module according to the above [8], wherein the mixing mass ratio of the olefin polymer (X) and the olefin polymer (Y) contained is 95 to 55/5 to 45.
- MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- the MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- the sealing material (B) has at least a vibration frequency of 10 Hz in dynamic viscoelasticity measurement, a soft layer having a storage elastic modulus (E ′) at a temperature of 20 ° C. of less than 100 MPa, and a vibration frequency in dynamic viscoelasticity measurement.
- the sealing material (B) is a sealing material that is not substantially crosslinked.
- a solar cell module backsheet-sealing material-integrated sheet comprising at least a backsheet (A) and a sealing material (B), wherein: The ratio ( ⁇ (A) / G ′ (B)) between the shrinkage stress ( ⁇ (A)) (Pa) and the shear modulus (G ′ (B)) (Pa) of the sealing material (B) below is 60.
- a back sheet for a solar cell module-an encapsulant-integrated sheet characterized by being 0 or less.
- the resin composition constituting the encapsulant (B) is an olefin polymer (X) having an MFR (JIS K7210, temperature: 190 ° C., load: 21.18 N) of less than 5 g / 10 min.
- MFR JIS K7210, temperature: 190 degreeC, load: 21.18N
- Y olefin polymer which is 5 g / 10min or more.
- the solar cell module which has the favorable external appearance after lamination, a backsheet-sealing material integrated sheet, and the manufacturing method of a solar cell module can be provided. Further, by measuring the basic physical properties of the shrinkage stress of the back sheet and the shear modulus of the sealing material at the laminate setting temperature, it is possible to predict the finished appearance before actually laminating the solar cell module. Furthermore, since the lamination conditions can be set efficiently, the time required for studying the conditions and the costs of various members are suppressed, and as a result, it can be expected that the manufacturing cost of the solar cell module will be greatly reduced.
- main component is intended to allow other components to be included within a range that does not interfere with the action and effect of the resin constituting each member of the solar cell module of the present invention. is there. Further, this term does not limit the specific content, but it is 50% by mass or more, preferably 65% by mass or more, more preferably 80% by mass or more of the total components of the resin composition. It is a component that occupies a range of mass% or less.
- the solar cell module of the present invention has a shrinkage stress ( ⁇ (A)) (Pa) of the back sheet (A) and a shear elastic modulus (G ′ (B)) (Pa) of the sealing material (B) at the laminate setting temperature.
- the ratio ( ⁇ (A) / G ′ (B)) (hereinafter sometimes referred to as a convex index) is in a specific range.
- the solar cell module generally has a back sheet (A), a sealing material (B), a solar cell element, and a transparent base material (upper protective material).
- the backsheet (A) used for this invention will not be restrict
- polyester resins polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.
- fluorine resins polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA)).
- FEP Tetrafluoroethylene-hexafluoropropylene copolymer
- ETFE ethylene-tetrafluoroethylene copolymer
- PCTFE polychlorotrifluoroethylene
- PVDF polyvinylidene fluoride
- PVF polyvinyl fluoride
- Polyolefin resins polyethylene (PE), polypropylene (PP), various ⁇ -olefin copolymers, ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), Tylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA), etc., cyclic olefin resins (COP, COC, etc.), polystyrene resins (acrylonitrile-styrene copolymer (AS), acrylonitrile) -Butadiene-styrene copolymer (ABS), acrylonitrile-styrene-acrylic rubber copolymer (ASA) and syndiotactic polystyrene (SPS)), polyamide (PA), polycarbonate (PC), polymethyl methacrylate (PMMA) , Modified polyphenylene ether (modified PPE), polyamide (PA
- a polyester resin, a polyolefin resin, and a fluorine resin are preferably used as the material for the base sheet from the viewpoints of adhesiveness to the sealing material, mechanical strength, durability, economy, and the like.
- the manufacturing method of the base sheet or the base film is not particularly limited, but representative examples include an extrusion casting method, a stretching method, an inflation method, and a casting method.
- other resin and various additives can be mixed with a base material sheet as needed for the purpose of improvement, such as handling property, durability, and light reflectivity, or economical efficiency.
- the additive include an antioxidant, an ultraviolet absorber, a weathering stabilizer, a light diffusing agent, a nucleating agent, a pigment (for example, titanium oxide, barium sulfate, and carbon black), a flame retardant, a discoloration inhibitor, Examples include decomposition inhibitors and heat radiation agents.
- embossing various treatments (corona treatment, plasma treatment, etc.) and coating (fluorine) are performed as necessary in order to improve handling properties, adhesiveness and durability. Resin coating, hydrolysis prevention coating, hard coating, etc.).
- the backsheet (A) used in the present invention has a single layer or a laminated structure, but is preferably a laminated structure in order to achieve the properties required for the backsheet in a balanced manner.
- the properties generally required for the back sheet include adhesion to the sealing material, mechanical strength, durability (weather resistance, hydrolysis resistance, etc.), light reflectivity, water vapor barrier property, difficulty. Examples include flammability, designability, economy, and appearance after lamination. In the case of a crystalline silicon solar cell module, adhesion to a sealing material, mechanical strength, durability, economy, and after lamination. The appearance of is important.
- the following laminated structure is preferably used in order to achieve these characteristics in a balanced manner.
- the notation A / B / C indicates that layers are stacked in the order of A, B, and C from the top (or from the bottom).
- Fluorine-based resin layer / adhesive layer / polyester resin layer / adhesive layer / easy-adhesive layer (sealing material side); specifically, PVF / adhesive layer / biaxially stretched PET / adhesive layer / EVA, PVF / Adhesive layer / biaxially stretched PET / adhesive layer / PE, PVF / adhesive layer / biaxially stretched PET / adhesive layer / PP, ETFE / adhesive layer / biaxially stretched PET / adhesive layer / EVA, ETFE / adhesive layer / biaxial Stretched PET / adhesive layer / PE, ETFE / adhesive layer / biaxially stretched PET / adhesive layer / PP, etc.
- Polyester resin layer / adhesive layer / polyester resin layer / adhesive layer / easy-adhesive layer (sealing material side); specifically, biaxially stretched PET (hydrolysis resistant prescription) / adhesive layer / biaxially stretched PET / Adhesive layer / EVA, biaxially stretched PET (hydrolysis resistant formulation) / adhesive layer / biaxially stretched PET / adhesive layer / PE, biaxially stretched PET (hydrolysis resistant formulation) / adhesive layer / biaxially stretched PET / adhesive Layer / PP, (surface coating) biaxially stretched PET / adhesive layer / biaxially stretched PET / adhesive layer / easily adhesive layer, etc.
- Polyester resin layer / adhesive layer / easy-adhesive layer (sealing material side); specifically, biaxially stretched PET (hydrolysis resistant formulation) / adhesive layer / EVA, biaxially stretched PET (hydrolysis resistant formulation) ) / Adhesive layer / PE, biaxially stretched PET (hydrolysis resistant formulation) / adhesive layer / PP, (surface coating) biaxially stretched PET / adhesive layer / easily adhesive layer, and the like.
- the adhesive layers (1) to (3) are arranged as necessary, and may be configured without an adhesive layer.
- the crystal melting peak temperature (Tm) of the easy adhesion layer is generally 80 ° C. or higher and 165 ° C. or lower.
- the crystal melting peak temperature (Tm) of the easy-adhesion layer is preferably 95 ° C. or higher from the viewpoints of adhesion to the sealing material (B), economic efficiency, and the appearance of the solar cell module.
- the upper limit is preferably 140 ° C. or lower and more preferably 125 ° C. or lower.
- the total thickness of the backsheet (A) used in the present invention is not particularly limited as long as it satisfies the convex index described later. Although it may be appropriately selected in consideration of desired performance, it is generally 50 ⁇ m or more and 600 ⁇ m or less, preferably 150 ⁇ m or more and 400 ⁇ m or less. Further, in order to satisfy the dielectric breakdown voltage of 1 kV or more, it is preferably 200 ⁇ m or more, and more preferably 250 ⁇ m or more.
- the sealing material (B) used for this invention will not be restrict
- Specific examples include encapsulants mainly composed of ethylene-vinyl acetate copolymer (EVA), polyethylene (PE), polypropylene (PP), ionomer (IO), polyvinyl butyral (PVB), and the like.
- the main component from the viewpoints of flexibility of the obtained sealing material, a small amount of fish eye (gel), a small amount of corrosive substances (such as acetic acid) in the circuit, and economical efficiency (B-1) And those shown in (B-2) are preferred, and those shown in (B-1) are particularly preferred because of their excellent low-temperature characteristics.
- (B-1) is a copolymer of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms.
- ⁇ -olefin copolymerized with ethylene includes propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 3-methyl- Examples include butene-1,4-methyl-pentene-1.
- propylene, 1-butene, 1-hexene, and 1-octene are preferably used as the ⁇ -olefin copolymerized with ethylene from the viewpoints of industrial availability, various characteristics, and economical efficiency. It is done.
- an ethylene- ⁇ -olefin random copolymer is preferably used from the viewpoint of transparency and flexibility.
- the ⁇ -olefin copolymerized with ethylene can be used alone or in combination of two or more.
- the content of ⁇ -olefin copolymerized with ethylene is not particularly limited, but the total amount in the copolymer (B-1) of ethylene and ⁇ -olefin having 3 to 20 carbon atoms. It is usually 2 mol% or more, preferably 40 mol% or less, more preferably 3 to 30 mol%, still more preferably 5 to 25 mol%, based on the body unit. Within such a range, the crystallinity is reduced by the copolymerization component, so that the transparency is improved and problems such as blocking of raw material pellets are less likely to occur.
- the kind and content of the monomer copolymerized with ethylene can be qualitatively quantitatively analyzed by a well-known method, for example, a nuclear magnetic resonance (NMR) measuring apparatus or other instrumental analyzers.
- NMR nuclear magnetic resonance
- the copolymer (B-1) of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms may contain a monomer unit based on a monomer other than the ⁇ -olefin.
- the monomer include cyclic olefins, vinyl aromatic compounds (such as styrene), polyene compounds, and the like.
- the content of the monomer units is preferably 20 mol when the total monomer units in the copolymer (B-1) of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms is 100 mol%. % Or less, more preferably 15 mol% or less.
- the three-dimensional structure, branching, branching degree distribution, molecular weight distribution and copolymerization type (random, block, etc.) of the copolymer (B-1) of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms are particularly limited.
- a copolymer having a long chain branch generally has good mechanical properties, and the melt tension (melt tension) at the time of molding a sheet increases, thereby improving the calendar moldability.
- the melt flow rate (MFR) of the copolymer (B-1) of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms used in the present invention is not particularly limited, but is usually MFR (JIS K7210). , Temperature: 190 ° C., load: 21.18 N) is about 0.5 to 100 g / 10 min, preferably 1 to 50 g / 10 min, more preferably 2 to 50 g / 10 min, still more preferably 3 to 30 g / 10 min. .
- the MFR may be selected in consideration of molding processability when molding a sheet, adhesion when sealing a solar cell element (cell), a wraparound condition, and the like.
- the MFR is preferably a relatively low value, specifically about 0.5 to 5 g / 10 min from the handling property when the sheet is peeled off from the molding roll.
- the MFR is preferably 1 to 50 g / 10 min, more preferably 2 to 50 g / 10 min, still more preferably 3 to 30 g / 10 min from the viewpoint of reducing the extrusion load and increasing the extrusion amount. It is. Further, from the viewpoint of adhesion and ease of wraparound when sealing a solar cell element (cell), the MFR is preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min.
- the method for producing a copolymer (B-1) of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms used in the present invention is not particularly limited, and a known method using a known olefin polymerization catalyst.
- a polymerization method can be employed. For example, a slurry polymerization method, a solution polymerization method, a gas phase polymerization method, etc. using a multi-site catalyst typified by a Ziegler-Natta type catalyst, a single site catalyst typified by a metallocene catalyst or a post metallocene catalyst, etc. And a bulk polymerization method using a radical initiator.
- a polymerization method using a single-site catalyst capable of polymerizing a raw material having a low molecular weight component and a narrow molecular weight distribution is preferable from the viewpoints of easy granulation after pelletization and prevention of blocking of raw material pellets. is there.
- the heat of crystal fusion measured at a heating rate of 10 ° C./min in the differential scanning calorimetry of the copolymer of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms used in the present invention is 0 to 70 J. / G is preferable. Within such a range, flexibility and transparency (total light transmittance) of the obtained sealing material are secured, which is preferable. Further, considering the difficulty of blocking the raw material pellets in a high temperature state such as summer, the heat of crystal melting is preferably 5 to 70 J / g, more preferably 10 to 65 J / g.
- general-purpose high-density polyethylene is about 170 to 220 J / g
- low-density polyethylene resin LDPE
- linear low-density polyethylene LLDPE
- the heat of crystal fusion can be measured at a heating rate of 10 ° C./min according to JIS K7122 using a differential scanning calorimeter.
- copolymer of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms (B-1) used in the present invention include trade names “Engage” and “Engage” manufactured by Dow Chemical Co., Ltd. “Affinity”, “Infuse”, trade name “Exact” manufactured by ExxonMobil Co., Ltd., trade names “TAFMERHH”, “Tuffmer” manufactured by Mitsui Chemicals, Inc. A (TAFMER A) ”,“ TAFMER P ”, LG Chemical's trade name“ LUCENE ”, Nippon Polyethylene's trade name“ Kernel ”, and the like can be exemplified. .
- (B-2) (B-2) is a copolymer of propylene and another monomer copolymerizable with the propylene, or a homopolymer of propylene.
- these copolymerization forms random, block, etc.
- branching, branching degree distribution and three-dimensional structure are not particularly limited, and can be a polymer having an isotactic, atactic, syndiotactic or mixed structure. .
- Examples of other copolymerizable monomers include ⁇ -olefins having 4 to 12 carbon atoms such as ethylene, 1-butene, 1-hexene, 4-methyl-pentene-1, 1-octene, and divinylbenzene, 1, Examples include dienes such as 4-cyclohexadiene, dicyclopentadiene, cyclooctadiene, and ethylidene norbornene.
- ethylene and 1-butene are preferably used as the ⁇ -olefin copolymerized with propylene from the viewpoints of industrial availability, various characteristics, and economical efficiency.
- a propylene- ⁇ -olefin random copolymer is preferably used from the viewpoint of transparency and flexibility.
- the monomer copolymerized with propylene can be used alone or in combination of two or more.
- the content of other monomers copolymerizable with propylene is not particularly limited, but is usually 2 mol% or more with respect to all monomer units in (B-2), The amount is preferably 40 mol% or less, more preferably 3 to 30 mol%, still more preferably 5 to 25 mol%. Within such a range, the crystallinity is reduced by the copolymerization component, so that the transparency is improved and problems such as blocking of raw material pellets are less likely to occur.
- the kind and content of the other monomer copolymerizable with propylene can be qualitatively quantitatively analyzed by a known method, for example, a nuclear magnetic resonance (NMR) measuring device or other instrumental analyzer.
- NMR nuclear magnetic resonance
- the melt flow rate (MFR) of (B-2) used in the present invention is not particularly limited, but usually the MFR (JIS K7210, temperature: 230 ° C., load: 21.18 N) is 0.1. It is about 5 to 100 g / 10 min, preferably 2 to 50 g / 10 min, and more preferably 3 to 30 g / 10 min.
- the MFR may be selected in consideration of molding processability when molding a sheet, adhesion when sealing a solar cell element (cell), a wraparound condition, and the like.
- the MFR is preferably relatively low, specifically about 0.5 to 5 g / 10 min from the handling property when the sheet is peeled off from the forming roll.
- MFR is preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min from the viewpoint of reducing the extrusion load and increasing the extrusion amount. Further, from the viewpoint of adhesion and ease of wraparound when sealing a solar cell element (cell), the MFR is preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min.
- a method for producing a copolymer of propylene and another monomer copolymerizable with the propylene or a homopolymer of propylene (B-2) used in the present invention is not particularly limited, and is publicly known.
- a known polymerization method using the above olefin polymerization catalyst can be employed.
- a slurry polymerization method, a solution polymerization method, a gas phase polymerization method, etc. using a multi-site catalyst represented by a Ziegler-Natta type catalyst, a single site catalyst represented by a metallocene catalyst or a post metallocene catalyst, Examples thereof include a bulk polymerization method using a radical initiator.
- a polymerization method using a single-site catalyst capable of polymerizing a raw material having a low molecular weight component and a narrow molecular weight distribution is preferable from the viewpoints of easy granulation after pelletization and prevention of blocking of raw material pellets. is there.
- (B-2) used in the present invention include propylene-butene random copolymers, propylene-ethylene random copolymers, propylene-ethylene-butene-1 copolymers, and the like.
- Products include Mitsui Chemical Co., Ltd. trade names "TAFMER XM”, “NOTIO”, Sumitomo Chemical Co., Ltd. trade names "TAFFCELLEN”, Prime Polymer Co., Ltd. )
- Product name “Prime TPO”, Dow Chemical Co., Ltd. product name “VERSIFY”, ExxonMobil Co., Ltd. product name “VistaMAXX”, etc. can do.
- (B-3) is a metal salt of a copolymer comprising an ⁇ -olefin such as ethylene or propylene and an aliphatic unsaturated carboxylic acid (preferred metals are Zn, Na, K, Li, Mg, etc.).
- Specific products include, for example, trade name “HIMILAN” manufactured by Mitsui Chemicals, Inc. and trade name “AMPLIFY IO” manufactured by Dow Chemical Co., Ltd.
- (B-4) is an ethylene-based copolymer comprising ethylene and at least one monomer selected from vinyl acetate, aliphatic unsaturated carboxylic acid, and aliphatic unsaturated monocarboxylic acid alkyl ester.
- Specific examples include an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, an ethylene-acrylic acid ester copolymer, and an ethylene-methacrylic acid ester copolymer.
- examples of the ester component include alkyl esters having 1 to 8 carbon atoms such as methyl, ethyl, propyl, and butyl.
- the copolymer is not limited to the above-mentioned two-component copolymer, but a three-component or more multi-component copolymer (for example, ethylene and an aliphatic unsaturated carboxylic acid and an aliphatic unsaturated copolymer) in which a third component is further added. It may be a ternary or higher copolymer or the like appropriately selected from saturated carboxylic acid esters.
- the content of the monomer copolymerized with ethylene is usually 5 to 35% by mass with respect to all monomer units in the copolymer.
- the melt flow rate (MFR) of the encapsulant (B) is not particularly limited as long as it satisfies the convexity index described later, but in order to further improve the appearance of the present invention, the back sheet side It is preferable that the sealing material satisfies the following condition (P).
- the resin composition constituting the encapsulant (B) is an olefin polymer (X) having an MFR (JIS K7210, temperature: 190 ° C., load: 21.18 N) of less than 5 g / 10 min.
- MFR JIS K7210, temperature: 190 degreeC, load: 21.18N
- Y olefin polymer which is 5 g / 10min or more.
- the appearance of the present invention can be further improved.
- the resin composition constituting the sealing material (B) used on the back sheet side has an MFR (JIS K7210, temperature: 190 ° C., load: 21.18N) less than 5 g / 10 min.
- MFR JIS K7210, temperature: 190 degreeC, load :
- MFR olefin type polymer contained in the resin composition which comprises the sealing material (B) by the side of a backsheet. 21.18N
- MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- the MFR of the olefin polymer (X) is 0.8 g / 10 min or more and less than 4 g / 10 min
- the MFR of the olefin polymer (Y) is 5 g / 10 min or more, 50 g / min. More preferably, the MFR of the olefin polymer (X) is 1 g / 10 min or more and 3 g / 10 min.
- the types of the olefin polymer (X) and the olefin polymer (Y) contained in the resin composition constituting the sealing material (B) used on the back sheet side are particularly limited. However, each of them may be used alone or in combination of two or more. Further, the mixing mass ratio of the olefin polymer (X) and the olefin polymer (Y) contained in the resin composition constituting the sealing material (B) used on the back sheet side is 95 to 55/5 to 45. It is preferable that Here, the range of the mixed mass ratio is preferable because the convex appearance and flatness of the solar cell module obtained after lamination can be achieved in a well-balanced manner.
- the mixing mass ratio of the olefin polymer (X) and the olefin polymer (Y) is more preferably 90 to 60/10 to 40, and 85 to 65/15 to 35. Is more preferable.
- the resin composition constituting the sealing material (B) used on the backsheet side may contain other resins described later, but the olefinic polymer (X) and the olefinic polymer (Y).
- the total of the resin composition preferably occupies 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more.
- the upper limit is not particularly limited, but is preferably 100% by mass or less.
- the mixing mass ratio is within the above range.
- the olefin polymer (X) and the olefin polymer (Y) do not need to be contained in the same layer, but preferably both polymers are contained in the same layer. Moreover, it is more preferable that both polymers are contained in the resin composition constituting each layer of the laminated sealing material.
- the sealing material other than the back sheet side may or may not satisfy the above condition (P), and the melt flow rate (MFR) is not particularly limited.
- the sealing material other than the back sheet side is a sealing material used for the front sheet side, the cushion layer, or the like.
- the MFR JIS K7210, temperature: 190 ° C., load: 21.18 N
- the MFR is about 0.5 to 100 g / 10 min, preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min. Things are used.
- the MFR may be selected in consideration of molding processability when molding a sheet, adhesion when sealing a solar cell element (cell), a wraparound condition, and the like.
- the MFR is preferably relatively low, specifically about 0.5 to 5 g / 10 min from the handling property when the sheet is peeled off from the forming roll.
- MFR is preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min from the viewpoint of reducing the extrusion load and increasing the extrusion amount.
- the MFR is preferably 2 to 50 g / 10 min, more preferably 3 to 30 g / 10 min.
- the sealing material (B) used in the present invention is a single layer or a laminated structure, but a laminated structure is preferable in order to achieve the properties required for the sealing material in a balanced manner.
- the properties generally required for the sealing material include flexibility and impact resistance for protecting the solar cell element, heat resistance when the solar cell module generates heat, and sunlight to the solar cell element.
- Transparency for efficient delivery total light transmittance, etc.
- adhesion to various adherends glass, backsheet, etc.
- durability dimensional stability
- flame resistance water vapor barrier properties
- economics etc.
- the crystal melting peak temperature (Tm) of the olefin polymer as the main component is preferably less than 100 ° C.
- a crystalline polymer is also applicable (hereinafter referred to as an olefin polymer having a crystal melting peak temperature of less than 100 ° C. including an amorphous polymer).
- the crystal melting peak temperature is preferably 30 to 95 ° C., more preferably 45 to 80 ° C., and further preferably 60 to 80 ° C.
- an olefin polymer having a crystal melting peak temperature (Tm) of 100 ° C. or higher is mixed with an olefin polymer having a crystal melting peak temperature (Tm) of less than 100 ° C. It is preferable.
- the upper limit of the crystal melting peak temperature (Tm) of the olefin polymer to be mixed is not particularly limited, but considering the thermal degradation of the solar cell element (cell) and the laminate set temperature during solar cell module production. It is about 150 ° C. In the present invention, the laminate set temperature when producing the solar cell module can be lowered, and the solar cell element (cell) is less likely to be thermally deteriorated. Further preferred.
- general-purpose high-density polyethylene resin is about 130 to 145 ° C.
- low-density polyethylene resin LDPE
- linear low-density polyethylene LLDPE
- general-purpose homopolypropylene resin is about 165 ° C.
- general-purpose propylene-ethylene random copolymer is about 130-150 ° C.
- the crystal melting peak temperature can be measured using a differential scanning calorimeter at a heating rate of 10 ° C./min according to JIS K7121.
- the sealing material (B) used in the present invention is a resin composition containing an olefin polymer having a crystal melting peak temperature of less than 100 ° C. and an olefin polymer having a crystal melting peak temperature of 100 ° C. or more. It is preferable to become.
- the said conditions (P) are satisfied, and the crystal melting peak temperature is less than 100 degreeC, and an olefin polymer and a crystal melting peak It is preferable to contain an olefin polymer having a temperature of 100 ° C. or higher.
- the content of both olefinic polymers in the resin composition is not particularly limited, but considering the flexibility, heat resistance, transparency, etc. of the obtained sealing material,
- the mixed (containing) mass ratio of the coalescence (olefin polymer having a crystal melting peak temperature of less than 100 ° C./olefin polymer having a crystal melting peak temperature of 100 ° C. or more) is preferably 99-50 / 1-50, more preferably Preferably, it is 98 to 60/2 to 40, more preferably 97 to 70/3 to 30, still more preferably 97 to 80/3 to 20, and still more preferably 97 to 90/3 to 10.
- the total of both olefin polymers is 100 parts by mass.
- the mixing (containing) mass ratio is within the above range because a sealing material excellent in balance of flexibility, heat resistance, transparency and the like can be easily obtained.
- the olefin polymer having a crystal melting peak temperature of 100 ° C. or higher to be mixed with the sealing material (B) used in the present invention may be appropriately selected in consideration of desired characteristics.
- the ethylene- ⁇ -olefin block copolymer can be most preferably used because of its excellent balance of properties, flexibility and low temperature characteristics.
- the block structure of the ethylene- ⁇ -olefin block copolymer is not particularly limited, but from the viewpoint of balancing flexibility, heat resistance, transparency, etc., comonomer content, crystallinity, density It is preferably a multiblock structure containing two or more segments or blocks having different crystal melting peak temperatures (Tm) or glass transition temperatures (Tg). Specific examples include a completely symmetric block, an asymmetric block, and a tapered block structure (a structure in which the ratio of the block structure gradually increases in the main chain). Regarding the structure and production method of the copolymer having the multi-block structure, International Publication No.
- 2005/090425 (WO2005 / 090425), International Publication No. 2005/090426 (WO2005 / 090426), and International Publication No.2005. / 090427 pamphlet (WO2005 / 090427) or the like can be employed.
- the ethylene- ⁇ -olefin block copolymer having the multi-block structure will be described in detail below.
- the ethylene- ⁇ -olefin block copolymer having a multiblock structure can be suitably used in the present invention, and an ethylene-octene multiblock copolymer having 1-octene as a copolymerization component as an ⁇ -olefin is preferable.
- As the block copolymer an almost non-crystalline soft segment copolymerized with a large amount of octene component (about 15 to 20 mol%) with respect to ethylene and a small amount of octene component (about 2 mol% with respect to ethylene).
- a multiblock copolymer having two or more highly crystalline hard segments each having a copolymerized crystal melting peak temperature of 110 to 145 ° C. is preferred.
- chain length and ratio of these soft segments and hard segments By controlling the chain length and ratio of these soft segments and hard segments, both flexibility and heat resistance can be achieved.
- trade name “Infuse” manufactured by Dow Chemical Co., Ltd. may be mentioned.
- adhesion to various adherends is required as an important function as well as handling properties and ease of air bleeding.
- the addition of the silane coupling agent mentioned later and the resin composition which mixed the silane modified ethylene resin are used suitably.
- silane-modified ethylene resin (Silane-modified ethylene resin)
- the silane-modified ethylene resin used in the present invention can be usually obtained by melt-mixing a polyethylene resin, a vinylsilane compound and a radical generator at a high temperature (about 160 ° C. to 220 ° C.) and graft polymerization.
- ⁇ Polyethylene resin> Although it does not restrict
- a polyethylene resin having a low density is preferably used because of its excellent transparency and flexibility.
- the polyethylene resin is preferably a density of 0.850 ⁇ 0.920g / cm 3, in particular, linear low density polyethylene having a density of 0.860 ⁇ 0.880g / cm 3 are preferred.
- a polyethylene resin having a low density and a polyethylene resin having a high density may be used in combination. Use in combination is preferred because the balance of transparency, flexibility and heat resistance can be adjusted relatively easily.
- the vinyl silane compound is not particularly limited as long as it is graft-polymerized with the above polyethylene resin.
- vinyl silane compounds can be used alone or in combination of two or more.
- vinyltrimethoxysilane is preferably used from the viewpoints of reactivity, adhesiveness and color tone.
- the amount of the vinylsilane compound added is not particularly limited, but is usually about 0.01 to 10.0 parts by weight, preferably 0.3 to 100 parts by weight with respect to 100 parts by weight of the polyethylene resin used.
- the amount is 8.0 parts by weight, and more preferably 1.0 to 5.0 parts by weight.
- the radical generator is not particularly limited, and examples thereof include hydroperoxides such as diisopropylbenzene hydroperoxide and 2,5-dimethyl-2,5-di (hydroperoxy) hexane; -Butyl peroxide, t-butyl cumyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di (t -Peroxy) dialkyl peroxides such as hexyne-3; bis-3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, benzoyl peroxide, o-methylbenzoyl peroxide, 2,4-dichlorobenzoylper Diacyl peroxides such as oxides; t-butylperoxya Tate, t-butylperoxy-2-e
- the addition amount of the radical generator is not particularly limited, but is usually about 0.01 to 5.0 parts by weight, preferably 0.02 to 1 part per 100 parts by weight of the polyethylene resin used. 0.0 part by mass, and more preferably 0.03 to 0.5 part by mass. Moreover, it is preferable that the residual amount of this radical generator is 0.001 mass% or less in the resin composition which comprises the sealing material (B) used for this invention. Furthermore, the gel fraction of the sealing material (B) used in the present invention is preferably 30% or less, more preferably 10% or less, further preferably 5% or less, and 0%. It is particularly preferred.
- the silane-modified ethylene resin or resin composition used in the present invention preferably does not substantially contain a silanol condensation catalyst that promotes a condensation reaction between silanols.
- a silanol condensation catalyst include dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dioctate, dioctyltin dilaurate and the like.
- substantially not containing means 0.05 parts by mass or less, preferably 0.03 parts by mass or less, particularly preferably 0.00 parts by mass with respect to 100 parts by mass of the resin composition.
- a silanol condensation catalyst is not substantially contained is that, in the present invention, polar groups such as silanol groups grafted on the polyethylene resin to be used without actively proceeding with the silanol crosslinking reaction.
- polar groups such as silanol groups grafted on the polyethylene resin to be used without actively proceeding with the silanol crosslinking reaction.
- the silane-modified ethylene resin used in the present invention is usually obtained by melt-mixing the above-mentioned polyethylene resin, a vinylsilane compound and a radical generator at a high temperature (about 160 ° C. to 220 ° C.) and graft polymerization. Is. Therefore, the density of the silane-modified ethylene resin used in the present invention and the preferred range of MFR are the same as the density of the polyethylene resin and the preferred range of MFR.
- silane-modified ethylene resin used in the present invention trade name “LINKLON” manufactured by Mitsubishi Chemical Corporation can be exemplified.
- additives can be added to the resin composition constituting the sealing material (B) used in the present invention, if necessary.
- the additive include a silane coupling agent, an antioxidant, an ultraviolet absorber, a weathering stabilizer, a light diffusing agent, a heat radiating agent, a nucleating agent, a pigment (for example, titanium oxide, carbon black), and a flame retardant. And discoloration inhibitors.
- the sealing material (B) is preferably added with at least one additive selected from a silane coupling agent, an antioxidant, an ultraviolet absorber, and a weathering stabilizer for reasons described later. .
- the sealing material (B) to be used is preferably a sealing material that does not substantially crosslink.
- substantially not crosslinked means that the xylene-soluble matter is at least 70% or more, preferably 85% or more, more preferably 95% or more, as measured by ASTM 2765-95.
- Silane coupling agents are useful for improving adhesion to protective materials for sealing materials (glass, resin front sheets, back sheets, etc.) and solar cell elements, such as vinyl groups, Examples thereof include compounds having a hydrolyzable group such as an alkoxy group in addition to an unsaturated group such as an acryloxy group and a methacryloxy group, an amino group, and an epoxy group.
- Specific examples of the silane coupling agent include N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropylmethyldimethoxysilane, and ⁇ -aminopropyltriethoxy.
- silane coupling agents examples thereof include silane, ⁇ -glycidoxypropyltrimethoxysilane, and ⁇ -methacryloxypropyltrimethoxysilane.
- These silane coupling agents can be used alone or in combination of two or more.
- ⁇ -glycidoxypropyltrimethoxysilane and ⁇ -methacryloxypropyltrimethoxysilane are preferably used because of good adhesiveness and little discoloration such as yellowing.
- the addition amount of the silane coupling agent is usually about 0.1 to 5 parts by mass, preferably 0.2 to 3 parts by mass with respect to 100 parts by mass of the resin composition constituting the sealing material (B). It is.
- a coupling agent such as an organic titanate compound can be effectively used.
- antioxidant various commercially available products can be applied, and various types such as monophenol type, bisphenol type, polymer type phenol type, sulfur type and phosphite type can be exemplified.
- monophenols include 2,6-di-tert-butyl-p-cresol, butylated hydroxyanisole, and 2,6-di-tert-butyl-4-ethylphenol.
- bisphenols examples include 2,2'-methylene-bis- (4-methyl-6-tert-butylphenol), 2,2'-methylene-bis- (4-ethyl-6-tert-butylphenol), 4,4 '-Thiobis- (3-methyl-6-tert-butylphenol), 4,4'-butylidene-bis- (3-methyl-6-tert-butylphenol), 3,9-bis [ ⁇ 1,1-dimethyl- 2- ⁇ - (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy ⁇ ethyl ⁇ 2,4,9,10-tetraoxaspiro] 5,5-undecane.
- Examples of the high molecular phenolic compound include 1,1,3-tris- (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2,4,6-tris ( 3,5-di-tert-butyl-4-bidoxybenzyl) benzene, tetrakis- ⁇ methylene-3- (3 ', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate ⁇ methane, bis ⁇ (3,3'-bis-4'-hydroxy-3'-tert-butylphenyl) butyric acid ⁇ glycol ester, 1,3,5-tris (3 ', 5'-di-tert-butyl- 4'-hydroxybenzyl) -s-triazine-2,4,6- (1H, 3H, 5H) trione, tocopherol (vitamin E) and the like.
- sulfur-based compounds examples include dilauryl thiodipropionate, dimyristyl thiodipropionate, and distearyl thiopropionate.
- phosphites include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, 4,4′-butylidene-bis (3-methyl-6-tert-butylphenyl-di-tridecyl) phosphite, Crick neopentanetetrayl bis (octadecyl phosphite), tris (mono and / or di) phenyl phosphite, diisodecyl pentaerythritol diphosphite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- Oxide, 10- (3,5-di-tert-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-decyloxy-9,10 pho
- phenol-based and phosphite-based antioxidants such as monophenols, bisphenols, and high-molecular phenols are preferably used in view of the effects of antioxidants, thermal stability, economy, etc. More preferably, they are used in combination.
- the addition amount of the antioxidant is usually about 0.1 to 1 part by weight, preferably 0.2 to 0.5 part by weight with respect to 100 parts by weight of the resin composition constituting the sealing material (B). Part.
- UV absorber various commercially available products can be applied, and various types such as benzophenone, benzotriazole, triazine, and salicylic acid ester can be exemplified.
- benzophenone ultraviolet absorbers include 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-2′-carboxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-n.
- benzotriazole ultraviolet absorber examples include hydroxyphenyl-substituted benzotriazole compounds such as 2- (2-hydroxy-5-methylphenyl) benzotriazole and 2- (2-hydroxy-5-tert-butylphenyl).
- Benzotriazole 2- (2-hydroxy-3,5-dimethylphenyl) benzotriazole, 2- (2-methyl-4-hydroxyphenyl) benzotriazole, 2- (2-hydroxy-3-methyl-5-t- Butylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-butylphenyl) benzotriazole, etc. be able to.
- triazine ultraviolet absorbers examples include 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2- ( Examples include 4,6-diphenyl-1,3,5-triazin-2-yl) -5- (hexyloxy) phenol.
- salicylic acid esters include phenyl salicylate and p-octylphenyl salicylate.
- the added amount of the ultraviolet absorber is usually about 0.01 to 2.0 parts by weight, preferably 0.05 to 0.00 parts per 100 parts by weight of the resin composition constituting the sealing material (B). 5 parts by mass.
- a hindered amine light stabilizer is suitably used as a weather stabilizer that imparts weather resistance in addition to the above ultraviolet absorber.
- a hindered amine light stabilizer does not absorb ultraviolet rays like an ultraviolet absorber, but exhibits a remarkable synergistic effect when used together with an ultraviolet absorber.
- the sealing material (B) used in the present invention are often colored and are not preferable for the sealing material (B) used in the present invention.
- hindered amine light stabilizers include dimethyl-1- (2-hydroxyethyl) succinate-4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly [ ⁇ 6- (1,1 , 3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl ⁇ ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ hexamethylene ⁇ 2, 2,6,6-tetramethyl-4-piperidyl ⁇ imino ⁇ ], N, N′-bis (3-aminopropyl) ethylenediamine-2,4-bis [N-butyl-N- (1,2,2, 6,6-pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, 2- (3 , 5-Di-tert-4- Mud alkoxybenzylace
- flexibility of the sealing material (B) used for this invention will not be restrict
- the storage elastic modulus (E ′) at a vibration frequency of 10 Hz and a temperature of 20 ° C. in the dynamic viscoelasticity measurement of the sealing material (B) is preferably 1 to 2000 MPa.
- the pressure is preferably 1 to 100 MPa, more preferably 5 to 50 MPa, and further preferably 5 to 30 MPa.
- the storage elastic modulus (E ′) refers to the storage elastic modulus of the encapsulant in the entire laminated structure.
- the pressure is preferably 100 to 800 MPa, more preferably 200 to 600 MPa.
- the storage elastic modulus (E ′) is obtained by measuring a predetermined temperature range at a vibration frequency of 10 Hz using a viscoelasticity measuring device and obtaining a value at a temperature of 20 ° C.
- the heat resistance of the sealing material (B) used in the present invention is affected by various properties (crystal melting peak temperature, crystal melting heat, MFR, molecular weight, etc.) of the olefin polymer to be used, and is adjusted by appropriately selecting these.
- the crystal melting peak temperature and molecular weight of the olefin polymer are strongly influenced.
- a solar cell module is heated to about 85 ° C. by heat generated during power generation or radiant heat of sunlight, etc. If the crystal melting peak temperature is 100 ° C. or higher, the sealing material (B ) Is preferable because the heat resistance can be ensured.
- the total light transmittance (JIS K7105) of the sealing material (B) used in the present invention is applied to the type of solar cell to be applied, for example, an amorphous thin film silicon type or a portion that does not block sunlight reaching the solar electronic element.
- it may not be considered as important, but considering the photoelectric conversion efficiency of the solar cell and the handling property when superposing various members, it is preferably 85% or more, and preferably 88% or more. More preferably, it is more preferably 90% or more.
- the flexibility, heat resistance and transparency of the sealing material (B) used in the present invention tend to be contradictory. Specifically, if the crystallinity of the resin composition used for improving flexibility is excessively lowered, the heat resistance is lowered and becomes insufficient. On the other hand, if the crystallinity of the resin composition used for improving the heat resistance is excessively improved, the transparency is lowered and becomes insufficient. Considering these balances, the vibrational frequency 10 Hz and the storage elastic modulus (E ′) at a temperature of 20 ° C. in dynamic viscoelasticity measurement as an index of flexibility, and heating in differential scanning calorimetry for an olefin polymer as an index of heat resistance.
- the storage elastic modulus (E ′) is 1 to 2000 MPa
- the crystal melting peak temperature is 100 ° C. or higher
- the total light transmittance is 85% or higher
- the storage elastic modulus (E ′) is 5 to 800 MPa, crystal melting.
- the peak temperature is 102 to 150 ° C.
- the total light transmittance is 85% or more
- the storage elastic modulus (E ′) is 10 to 600 MPa
- the crystal melting peak temperature is 05 ⁇ 130 ° C., and still further preferably a total light transmittance of 88% or more.
- the shape of the sealing material is not limited and may be liquid or sheet-like, but is preferably sheet-like from the viewpoint of handleability.
- a method for forming a sheet-like sealing material a known method, for example, an extrusion casting method using a T-die, a calendar having a melt mixing facility such as a single screw extruder, a multi-screw extruder, a Banbury mixer, a kneader, etc.
- an extrusion casting method using a T die is preferably used from the viewpoints of handling properties and productivity.
- the molding temperature in the extrusion casting method using a T-die is appropriately adjusted depending on the flow characteristics and film-forming properties of the resin composition to be used, but is generally 130 to 300 ° C., preferably 150 to 250 ° C.
- the thickness of the sealing material is not particularly limited, but is usually 0.03 mm or more, preferably 0.05 mm or more, more preferably 0.1 mm or more, and usually 1 mm or less, preferably 0.7 mm or less. More preferably, it is 0.5 mm or less.
- additives such as silane coupling agents, antioxidants, UV absorbers, and weathering stabilizers may be dry blended with the resin in advance and then supplied to the hopper. It may be supplied after making, or a master batch in which only the additive is previously concentrated in the resin may be made and supplied.
- the sheet on the surface and / or the back surface of the sealing material obtained in the form of a sheet, if necessary, the sheet can be used as a scroll to prevent blocking between sheets, and in the laminating process of the solar cell element, air handling properties and air Embossing and various unevenness (cone, pyramid shape, hemispherical shape, etc.) processing may be performed for the purpose of improving ease of punching.
- the wet index is preferably 50 mN / m or more, and more preferably 52 mN / m or more.
- the upper limit of the wetting index is generally about 70 mN / m.
- the sealing material (B) used in the present invention is a single layer or a laminated structure, but as described above, in order to achieve the properties required for the sealing material in a balanced manner, a plurality of composition contents and composition ratios are different.
- the laminated structure which consists of these layers is preferable, Furthermore, it is preferable that it is the laminated structure co-extruded by a multilayer die using an extruder in that case.
- the laminated structure composed of the plurality of layers include at least a laminated structure having a soft layer and a hard layer, which will be described later.
- the following laminated structure is preferably used.
- soft layer / hard layer / soft layer from the viewpoint of balance between flexibility, heat resistance, transparency, and economy, soft layer / hard layer / soft layer, hard layer / soft layer / hard layer, adhesive layer / intermediate layer / adhesive layer, soft layer (1)
- Two types and three layers represented by layer / regeneration additive layer / soft layer are preferably used.
- the soft layer / hard layer / soft layer is particularly preferable.
- the intermediate layer is provided from the viewpoint of increasing the thickness of the sealing material (B) or improving desired performance.
- the intermediate layer is a layer formed from a resin composition containing an olefin resin as a main component. It is.
- the regenerated additive layer is provided from the viewpoint of economic rationality and effective utilization of resources, for example, a resin composition obtained by regenerating and adding trimmings (ears) generated during film formation of the sealing material (B) or slit processing.
- a layer formed from The adhesive layer is provided from the viewpoint of improving adhesion to adjacent layers and adherends, such as carboxyl group, amino group, imide group, hydroxyl group, epoxy group, oxazoline group, thiol group and silanol group. It is a layer formed from a resin composition containing a resin modified with a polar group or a tackifying resin.
- the additive examples include a silane coupling agent, an antioxidant, an ultraviolet absorber, a weathering stabilizer, a light diffusing agent, a heat radiating agent, a nucleating agent, a pigment, a flame retardant, a discoloration preventing agent, a crosslinking agent and a crosslinking assistant. Agents and the like.
- the soft layer is a layer having a storage elastic modulus (E ′) at a vibration frequency of 10 Hz and a temperature of 20 ° C. of less than 100 MPa, preferably 5 to 50 MPa in dynamic viscoelasticity measurement. It is a layer having an elastic modulus (E ′) of 100 MPa or more, preferably 200 to 800 MPa. Adopting such a laminated structure is preferable because it is possible to relatively easily realize both the protection of the solar cell element and the handling properties (such as the elastic modulus at room temperature) of the entire sealing material. In addition, by satisfying both rigidity and flexibility at room temperature, a thin glass (for example, 1.1 mm) or a glassless configuration can be applied, and weight reduction can be expected.
- E ′ storage elastic modulus
- the thickness of the soft layer in close contact with the solar cell element is not particularly limited, but is preferably 0.005 mm or more in consideration of the protection of the solar cell element and the wraparound property of the resin, More preferably, it is 0.02 to 0.2 mm.
- the thickness of each soft layer may be the same or different.
- the thickness of the hard layer is not particularly limited, but is preferably 0.025 mm or more and 0.05 to 0.8 mm from the viewpoint of handling properties as a whole sealing material. More preferred.
- the sealing material used in the present invention is prepared in a sheet form
- another base film for example, stretched polyester film (OPET), stretched polypropylene film (OPP) or ethylene-tetrafluoroethylene copolymer (ETFE)
- OPET stretched polyester film
- OPP stretched polypropylene film
- ETFE ethylene-tetrafluoroethylene copolymer
- PVDF Polyvinylidene fluoride
- PVF polyvinyl fluoride
- various weathering films such as acrylic
- the solar cell module of the present invention is preferably a member in which the back sheet (A) and the sealing material (B) are integrated.
- the backsheet (A) and the sealing material (B) used in the present invention may be combined alone, or a backsheet-sealing material integrated sheet in which the backsheet and the sealing material are integrated in advance is also suitable. Used for.
- the backsheet-sealing material integrated sheet of the present invention includes at least the backsheet (A) and the sealing material (B). Moreover, it is preferable that the sealing material (B) further satisfies the following condition (P).
- the resin composition constituting the encapsulant (B) is an olefin polymer (X) having an MFR (JIS K7210, temperature: 190 ° C., load: 21.18 N) of less than 5 g / 10 min.
- the union (X) and the olefin polymer (Y) are as described above.
- a backsheet-sealing material integrated sheet because the number of members can be reduced, so that the lay-up process at the time of lamination can be shortened and the handling property can be improved. Further, it is preferable to use the sheet because the reliability of adhesion between the back sheet and the sealing material is improved. Furthermore, since the lamination conditions can be set efficiently, the time required for studying the conditions and the costs of various members are suppressed, and as a result, it can be expected that the manufacturing cost of the solar cell module will be greatly reduced.
- the method for producing the backsheet-encapsulant-integrated sheet is not particularly limited, but generally known methods such as a thermal lamination method, a dry lamination method, an extrusion lamination method, a calendar coating method, and a coextrusion method are known. A manufacturing method is mentioned. In the present invention, a thermal lamination method, a dry lamination method, an extrusion lamination method, and a coextrusion method are preferably used. Briefly described below.
- the thermal lamination method two sheets formed into a sheet in advance, in the case of the present invention, the back sheet (A) and the sealing material (B) are stacked and heated and pressurized with a heating roll or the like. This is a method of heat bonding.
- the dry lamination method includes two sheets that have been formed into a sheet in advance, in the case of the present invention, a back sheet (A) and a sealing material (B), a two-component curable polyurethane adhesive, etc. Is applied to the laminated surface of one sheet, for example, the back sheet (A), and the solvent component is removed by hot air drying or the like.
- One sheet, that is, the sealing material (B) is overlapped and pressure-bonded, usually rolled up, stored at room temperature or a relatively low heating temperature, and the adhesive is cured and bonded together over time. is there.
- the extrusion lamination method is a method in which a back sheet (A) formed into a sheet shape in advance and a sealing material (B) melt-extruded into a film shape with a T die are roll-bonded and cooled to be laminated. .
- an adhesive resin or an anchor coat (a kind of primer coat) may be disposed between the back sheet (A) and the sealing material (B).
- the calender coating method is, for example, a thermoplastic resin.
- the resin composition constituting the encapsulant (B) is heated with a calender to be formed into a film, and at the same time, this is formed into a back sheet (A).
- This is a method of laminating and laminating on the laminated surface, pressing and cooling.
- an anchor coat can be applied to the laminated surface of the backsheet (A) as necessary.
- the resin composition constituting the back sheet (A) and the resin composition constituting the sealing material (B) are laminated in a film shape with a feed block or a multi-manifold die, and cooled with a chill roll. It is a method of laminating by pressure bonding. Here, if necessary, an adhesive layer may be interposed between the two layers.
- the solar cell module of the present invention has a shrinkage stress ( ⁇ (A)) (Pa) of the back sheet (A) and a shear elastic modulus (G ′ (B)) (Pa) of the sealing material (B) at the laminate setting temperature. It is important that the ratio ( ⁇ (A) / G ′ (B)) is 60.0 or less.
- the shrinkage stress ( ⁇ (A)) is a measured value (Pa) of the back sheet (A) at the laminate setting temperature
- the shear modulus (G ′ (B)) is a vibration frequency of 1 Hz at the laminate setting temperature. It is the measured value (Pa) of the sealing material (B).
- lamination set temperature is a set temperature of a laminator when the backsheet (A), the sealing material (B), the cell and the upper protective material are laminated and laminated, Is the range of the laminated set temperature.
- the lamination set temperature is preferably 100 ° C. or higher and 170 ° C. or lower, more preferably 100 ° C. or higher and 135 ° C. or lower.
- the ratio ( ⁇ ) of the shrinkage stress ( ⁇ (A)) (Pa) of the back sheet (A) and the shear elastic modulus (G ′ (B)) (Pa) of the sealing material (B) at the laminate setting temperature (A) / G ′ (B)), that is, it is preferable that the convex index is in the above-mentioned range because the convex phenomenon of the backsheet surface is suppressed after the solar cell module is laminated, and the appearance is improved.
- the mechanism by which the convex phenomenon on the backsheet surface appears is estimated as follows.
- a typical solar cell module composed of glass / sealing material / cell / sealing material / back sheet will be described as an example.
- the cause of the convex phenomenon on the backsheet surface is that the wiring (lead wire) connecting the cells buckles or rises into a “he” shape. It is a deformation. This is presumably because the spacing between cells narrows due to the shrinkage stress caused by the thermal shrinkage behavior of the backsheet that occurs in the laminating temperature range (about 100 to 170 ° C.).
- the ratio of the shrinkage stress ( ⁇ (A)) (Pa) of the back sheet (A) to the shear modulus (G ′ (B)) (Pa) of the sealing material (B) at the laminate setting temperature ( ( ⁇ (A) / G ′ (B)), that is, the convex index has been found to correlate with the behavior in which the interval between cells is narrowed.
- the elastic modulus of the sealing material (B) suppresses the behavior in which the space between cells is narrowed by the shrinkage stress caused by the thermal shrinkage behavior of the backsheet (A) generated in the laminating temperature range.
- the shrinkage stress caused by the thermal shrinkage behavior of the backsheet (A) generated in the laminating temperature range affects the cells and wirings through the sealing material (B) used in the present invention, and between cells. This causes a behavior in which the interval of the is narrowed.
- the shear modulus of the sealing material (B) to be used can be controlled and the behavior can be suppressed by the balance. That is, if the shrinkage stress of the back sheet (A) is the same, the greater the shear modulus of the sealing material (B), the more the convex phenomenon is suppressed and the convex index becomes smaller.
- the lower limit value of the convex index is usually 0 (zero). This is a case where the shrinkage stress of the backsheet (A) is 0 (zero), in other words, the thermal shrinkage rate is 0 (zero).
- the convex index is preferably 0.01 or more and 60.0 or less, more preferably 0.01 or more and 40.0 or less, and 0.01 or more and 35. It is more preferably 0 or less, and further preferably 1.0 or more and 20.0 or less.
- the upper limit value of the convex index is preferably as small as possible, but the lower limit value is preferably 1.0 or more in consideration of economy and the wraparound property of the sealing material at the time of lamination.
- the shrinkage stress ( ⁇ (A)) of the backsheet (A) was cut out from the backsheet (A) used in the size of 70 mm in the vertical direction and 10 mm in the horizontal direction, and both ends were separated at a chuck distance of 50 mm. It is fixed and immersed in a silicon bath at a laminate setting temperature for 5 minutes, and the average value (Pa) of the maximum shrinkage stress generated in the longitudinal direction is obtained.
- the shear modulus (G ′ (B)) of the sealing material (B) was measured using a rheometer manufactured by Rheology (trade name “Rheometer MR-300T”) at a vibration frequency of 1 Hz and a heating rate.
- the shear modulus (G ′) of a sample (thickness 0.3 mm) placed on a ⁇ 20 mm parallel plate under the conditions of 3 ° C./min and strain 0.5% was measured in the temperature range of 80 ° C. to 200 ° C., The value (Pa) at the laminate setting temperature is obtained.
- the method for reducing the shrinkage stress ( ⁇ (A)) resulting from the thermal shrinkage behavior of the backsheet (A) at the laminate setting temperature is not particularly limited, but is as follows. A method is mentioned.
- the back sheet (A) or the entire back sheet (A) is subjected to heat treatment (annealing treatment) (about 150 to 200 ° C.) or relaxation treatment using a tenter, a heat treatment roll, etc.
- Performing heat treatment or relaxation treatment when making the back sheet (A) from various substrate sheets by a method such as laminating, by reducing the shrinkage stress ( ⁇ (A)) by bringing the thermal shrinkage behavior close to zero A method of reducing the shrinkage stress ( ⁇ (A)) by bringing the thermal contraction behavior of the backsheet (A) close to zero or a layer having a low elastic modulus at the laminate setting temperature (for example, a PE layer) is laminated. Examples thereof include a method of reducing the shrinkage stress ( ⁇ (A)) by suppressing the elastic modulus at the laminate setting temperature of A).
- the shrinkage stress ( ⁇ (A)) of the backsheet (A) is preferably 7 ⁇ 10 5 Pa or less, and 6 ⁇ 10 5 Pa or less at 130 ° C. and 150 ° C. More preferably, it is 4 ⁇ 10 5 Pa or less, more preferably 3 ⁇ 10 5 Pa or less.
- the lower limit value of the shrinkage stress is usually 0 (zero) Pa.
- the thermal contraction rate of the backsheet (A) is preferably 1.5% or less, more preferably 1.0% or less, and 0.8% or less at 150 ° C. for 30 minutes. More preferably, it is most preferably 0.5% or less.
- the lower limit of the heat shrinkage rate is usually 0 (zero)%.
- the method of increasing the shear modulus (G ′ (B)) of the sealing material (B) at the laminate setting temperature is not particularly limited, but the following method may be mentioned. It is done.
- a method of crosslinking is not particularly limited, but the following method may be mentioned. It is done.
- a method for increasing the molecular weight of the material constituting the encapsulant (B) a method for introducing long chain branching, a method for increasing the crystallization rate during cooling by improving crystallinity, adding a nucleating agent, etc.
- a method of crosslinking is not particularly limited, but the following method may be mentioned. It is done.
- a method for increasing the molecular weight of the material constituting the encapsulant (B) a method for
- the method for increasing the molecular weight of the material constituting the encapsulant (B) is preferably used because it is easy to obtain raw materials industrially and is excellent in economy and recyclability.
- the shear modulus (G ′ (B)) of the sealing material (B) is preferably 1 ⁇ 10 3 to 1 ⁇ 10 5 Pa at 130 ° C. and 150 ° C. and a vibration frequency of 1 Hz. It is more preferably 5 ⁇ 10 3 to 5 ⁇ 10 4 Pa, and further preferably 8 ⁇ 10 3 to 3 ⁇ 10 4 Pa.
- melt flow rate may be selected, and the MFR (JIS K7210, temperature: 190 ° C., load: 21.18 N) is about 0.5 to 10 g / 10 min, more preferably 0.8. Those having a weight of ⁇ 8 g / 10 min, more preferably 1 to 5 g / 10 min are used.
- the laminate setting temperature is 100 ° C. or higher because adhesion to glass or a back sheet can be obtained.
- sealing material (B) used is a non-crosslinking sealing material, and immediately after lamination, the sealing material is in a high temperature state and a low shear modulus (G ′ (B)). This is because there is an effect of improving the temperature by cooling.
- this method is not standard equipment depending on the specifications of the laminating apparatus, or the glass is distorted by forced cooling, and the solar cell module may be warped.
- the solar cell module of this invention can be manufactured by fixing a solar cell element with the front sheet
- a solar cell module various types can be exemplified.
- the solar cell module is produced by using a sealing material, an upper protective material, a solar cell element, and a lower protective material.
- Battery module specifically, both sides of the solar cell element such as upper protective material / sealing material (sealing resin layer) / solar cell element / sealing material (sealing resin layer) / lower protective material A structure sandwiched between sealing materials (see FIG.
- the solar cell element is not particularly limited, but for example, single crystal silicon type, polycrystalline silicon type, amorphous silicon type, gallium-arsenic, copper-indium-selenium, cadmium-tellurium, etc. -V group or II-VI group compound semiconductor type, dye sensitized type, organic thin film type and the like.
- single crystal silicon type and polycrystalline silicon type solar cells are preferably used.
- plate materials such as glass, an acrylic resin, a polycarbonate resin, a polyester resin, a fluorine-containing resin, and the protective material of a single layer or multilayer It is done.
- a glass plate material is preferably used from the viewpoint of economy and mechanical strength, and a plate material having an acrylic resin or polycarbonate resin thickness of about 5 mm from the viewpoint of lightness and workability.
- the sealing material when the sealing material is used in two or more parts, the same sealing material may be used for all parts, or the resin composition, surface shape, thickness, etc. are different. A sealing material may be used.
- the solar cell element such as the upper protective material / sealing material (sealing resin layer) / solar cell element / sealing material (sealing resin layer) / lower protective material described above for the solar cell module of the present invention.
- An example of a structure sandwiched between sealing materials will be described.
- a transparent substrate 10 a sealing resin layer 12A, solar cell elements 14A and 14B, a sealing resin layer 12B, and a back sheet 16 are laminated in order from the sunlight receiving side.
- a junction box 18 (a terminal box for connecting wiring for extracting electricity generated from the solar cell element to the outside) is bonded to the lower surface of 16.
- the solar cell elements 14A and 14B are connected by a wiring 20 in order to conduct the generated current to the outside.
- the wiring 20 is taken out through a through hole (not shown) provided in the back sheet 16 and connected to the junction box 18.
- a known manufacturing method can be applied, and is not particularly limited, but in general, an upper protective material, a sealing resin layer, a solar cell element, a sealing resin layer, a lower portion There are a step of stacking the protective materials in order, and a step of vacuum-sucking them and heat-pressing them, that is, laminating. Also, batch type manufacturing equipment, roll-to-roll type manufacturing equipment, and the like can be applied.
- the solar cell module of the present invention can be used in various applications regardless of indoors or outdoors, such as small solar cells represented by mobile devices and large solar cells installed on roofs and rooftops, depending on the type and module shape of the applied solar cells. Can be applied.
- the present invention the occurrence of the convex phenomenon and the appearance defect phenomenon are difficult to occur in a small-sized module, and are particularly likely to occur in a large-sized module. Therefore, the present invention has a size of, for example, 90 cm ⁇ 90 cm or more. Especially, it is more effective in a module of 90 cm ⁇ 100 cm or more.
- the present invention will be described in more detail with reference to examples. However, the present invention is not limited by these examples.
- Various measured values and evaluations displayed in this specification were performed as follows.
- the flow direction of the sheet from the extruder is referred to as the longitudinal direction (MD)
- the orthogonal direction is referred to as the transverse direction (TD).
- the backsheet (A) used was cut into a size of 150 mm in the vertical direction and 150 mm in the horizontal direction, and a grid with a size of 100 mm in the vertical direction and 100 mm in the horizontal direction at the center of the side surface of the sealing material. Three samples filled in were prepared. Next, the sample was left in a hot air oven at 150 ° C. for 30 minutes, and the average value (%) of the ratio of shrinkage to the original size before shrinkage of the entered lattice was calculated in the longitudinal (MD) direction.
- Shrinkage stress ( ⁇ (A)) of backsheet (A) Cut out three samples from the back sheet (A) to a size of 70 mm in the vertical direction and 10 mm in the horizontal direction, fix both ends at a distance of 50 mm between the chucks, immerse in a silicon bath at the laminate set temperature for 5 minutes, The average value (Pa) of the maximum shrinkage stress generated was determined.
- Laminate appearance (i) convex appearance, (ii) flatness) (I) Convex appearance
- the average value (convex appearance (average)) of the number of protrusions in the evaluation of the three solar cell modules was also evaluated based on the following criteria.
- A-4) Back sheet manufactured by Coveme, trade name dyMat PYE (total thickness: 295 ⁇ m, laminated structure; (encapsulant side) EVA / EVA (white; containing titanium oxide) / EVA / adhesive layer / PET / adhesive layer / PET (white; containing barium sulfate), shrinkage stress (130 ° C.); 6.01 ⁇ 10 5 Pa, shrinkage stress (150 ° C.); 8.58 ⁇ 10 5 Pa, thermal shrinkage (150 ° C. ⁇ 30 minutes, MD); 1.40%, Tm (EVA layer); 103 ° C.)
- the back sheet (A-2) was heat-treated by heat shrinkage (150 ° C. ⁇ 30 minutes, MD) reduced to 0.62%, shrinkage stress (130 ° C.); 1.15 ⁇ 10 5 Pa, shrinkage stress (150 ° C.); 3.23 ⁇ 10 5 Pa
- Silane-modified ethylene resin (Silane-modified ethylene resin) (Q-1); Silane-modified ethylene-octene random copolymer (manufactured by Mitsubishi Chemical Corporation, trade name: Linkron SL800N, density: 0.868 g / cm 3 , Tm: 54 ° C. and 116 ° C., ⁇ Hm: 22J / G and 4 J / g, storage elastic modulus (E ′) at 20 ° C .: 15 MPa, MFR (temperature: 190 ° C., load: 21.18 N): 1.7 g / 10 min)
- the sealing material (B) used in the examples is described below.
- (B-1) A resin composition in which (X-1) and (Q-1) are mixed at a mass ratio of 70:30 as the (I) layer, and (X- Using a resin composition in which 1) and (X-2) are mixed at a mass ratio of 95: 5, respectively, a layered structure of (I) layer / (II) layer / (I) layer is obtained.
- (I) / (II) / (I) 0.05 mm / 0.40 mm / 0.05 mm, and a storage elastic modulus (E ′) at 20 ° C .: 15 MPa was obtained.
- (B-3) As the (I) layer, a resin composition mixed at a ratio of 65 parts by mass of the above (X-1), 35 parts by mass of (Y-1) and 15 parts by mass of (Q-1), II) As the layers, resin compositions mixed at a ratio of 65 parts by mass of (X-1), 35 parts by mass of (Y-1) and 5 parts by mass of (X-2) were used, respectively. II) After co-extrusion at a resin temperature of 180 to 200 ° C. by a T-die method using a same-direction twin-screw extruder so as to form a layer / layer (I) layer, a cast embossing roll at 25 ° C.
- E ′ A sealing material having a pressure of 15 MPa was obtained.
- (B-4) Resin composition in B-3 mixed as a layer (I) at a ratio of 85 parts by mass of (X-1), 15 parts by mass of (Y-2) and 15 parts by mass of (Q-1) And (II) layer except that (X-1) 85 parts by mass, (Y-2) 15 parts by mass, and (X-2) 5 parts by mass of resin composition were used.
- B-3 the total thickness is 0.50 mm
- Rate (E ') The sealing material which is 15 MPa was obtained.
- (B-5) Resin composition mixed in B-3 at a ratio of 60 parts by mass of (X-1), 40 parts by mass of (Y-2) and 15 parts by mass of (Q-1) as (I) layer And (II) layer, except that (X-1) 60 parts by mass, (Y-2) 40 parts by mass, and (X-2) 5 parts by mass of resin composition were used.
- (B-6) in B-3, as the (I) layer, a resin composition in which 100 parts by mass of the above (X-1) and 15 parts by mass of (Q-1) are mixed, and as the (II) layer , (X-1) 100 parts by weight and (X-2) 5 parts by weight, except that the respective resin compositions were used.
- (I) / (II) / (I) 0.05 mm / 0.40 mm / 0.05 mm, and a storage elastic modulus (E ′) at 20 ° C .: 15 MPa was obtained.
- (B-7) in B-3, as the (I) layer, a resin composition in which 100 parts by mass of the above (Y-1) and (Q-1) 15 parts by mass are mixed, and as the (II) layer , (Y-1) 100 parts by weight and (X-2) 5 parts by weight, except that the respective resin compositions were used.
- (I) / (II) / (I) 0.05 mm / 0.40 mm / 0.05 mm, and a storage elastic modulus (E ′) at 20 ° C .: 15 MPa was obtained.
- Example 1 Using a vacuum laminator (trade name: NLM-230 ⁇ 360, manufactured by NPC Co., Ltd.) and using each member shown in Table 1, three solar cell modules were produced under the following conditions, and the laminate appearance was evaluated. went. The results are shown in Table 1. ⁇ Constitution> Glass / sealing material (B) / cell / sealing material (B) / back sheet (A) ⁇ Glass: Nakajima Glass Industry Co., Ltd.
- Example 2 In Example 1, except that the laminate setting temperature was changed from 130 ° C. to 150 ° C., three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 1. The results are shown in Table 1.
- Example 3 In Example 1, except that the sealing material (B) used was changed from B-1 to B-2, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 1. It was. The results are shown in Table 1.
- Example 4 In Example 1, except that the backsheet (A) to be used was changed from A-1 to A-2, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 1. . The results are shown in Table 1.
- Example 5 In Example 4, except that the laminate setting temperature was changed from 130 ° C. to 150 ° C., three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 4. The results are shown in Table 1.
- Example 6 In Example 1, except that the back sheet (A) to be used was changed from A-1 to A-3, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 1. . The results are shown in Table 1.
- Example 7 the solar cell module was manufactured in the same manner as in Example 6 except that the sealing material (B) used was changed from B-1 to B-2 and the laminate setting temperature was changed from 130 ° C to 150 ° C. Three sheets were produced and the laminate appearance was evaluated. The results are shown in Table 1.
- Example 8 In Example 1, except that the back sheet (A) to be used was changed from A-1 to A-4, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 1. . The results are shown in Table 1.
- Example 9 In Example 1, the back sheet (A) to be used is A-1 to A-5, the sealing material (B) to be used is B-1 to B-2, and the laminate set temperature is 130 ° C. to 150 ° C. Except for changing to, three solar cell modules were produced in the same manner as in Example 1, and the laminate appearance was evaluated. The results are shown in Table 1.
- Example 10 In Example 1, the back sheet (A) to be used is A-1 to A-6 (back sheet-sealing material integrated sheet), and the sealing material (B) to be used is B-1 to B-2.
- the configuration was changed to glass / sealing material (B) / cell / back sheet (A) (back sheet-sealing material integrated sheet)
- a solar cell module 3 A sheet was prepared and the laminate appearance was evaluated. The results are shown in Table 1.
- Example 1 Three solar cell modules were obtained in the same manner as in Example 1, except that the sealing material (B) was changed from B-1 to B-2 and the laminate setting temperature was changed from 130 ° C. to 150 ° C. It produced and evaluated the laminate external appearance. The results are shown in Table 1.
- Example 2 (Comparative Example 2) In Example 5, except that the sealing material (B) was changed from B-1 to B-2, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 5. The results are shown in Table 1.
- Example 4 (Comparative Example 4) In Example 8, except that the sealing material (B) was changed from B-1 to B-2, three solar cell modules were prepared and the laminate appearance was evaluated in the same manner as in Example 8. The results are shown in Table 1.
- Example 1 is the same as Example 1 except that the backsheet (A) used is changed from A-1 to A-3 and the sealing material (B) used is changed from B-1 to B-3. Similarly, three solar cell modules were produced, and the laminate appearance was evaluated. The results are shown in Table 2.
- Example 12 Example 11 is the same as Example 11 except that the backsheet (A) used is changed from A-3 to A-1 and the sealing material (B) used is changed from B-3 to B-4. Then, three solar cell modules were produced and the laminate appearance was evaluated. The results are shown in Table 2.
- Example 13 In Example 12, except that the backsheet (A) to be used was changed from A-1 to A-7, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 12. . The results are shown in Table 2.
- Example 14 In Example 13, except that the sealing material (B) used was changed from B-4 to B-5, three solar cell modules were prepared and the laminate appearance was evaluated in the same manner as in Example 13. It was. The results are shown in Table 2.
- Example 15 In Example 12, the backsheet (A) used is A-1 to A-8 (backsheet-sealing material integrated sheet), and the constitution is glass / sealing material (B) / cell / backsheet (A 3) Three solar cell modules were prepared and the appearance of the laminate was evaluated in the same manner as in Example 12 except for changing to (back sheet-sealing material integrated sheet). The results are shown in Table 2.
- Example 16 In Example 11, except that the sealing material (B) used was changed from B-3 to B-6, three solar cell modules were produced and the laminate appearance was evaluated in the same manner as in Example 11. It was. The results are shown in Table 2.
- Example 17 In Example 12, except that the sealing material (B) used was changed from B-4 to B-6, three solar cell modules were prepared and the laminate appearance was evaluated in the same manner as in Example 12. It was. The results are shown in Table 2.
- Example 12 the solar cell module was fabricated in the same manner as in Example 12 except that the sealing material (B) used was changed from B-4 to B-7 and the laminate setting temperature was changed from 130 ° C to 150 ° C. Three sheets were produced and the laminate appearance was evaluated. The results are shown in Table 2.
- the solar cell module using the encapsulant that further satisfies the specified condition (P) can be confirmed not only to have a good convex appearance but also to improve flatness.
- the convex index is 20.0 or less, and the one using the sealing material that further satisfies the specified condition (P) is superior in both the convex appearance and the flatness (Example 11).
- Example 12 and Example 15 are examples of the solar cell module using the encapsulant that further satisfies the specified condition (P)
- seat, and the manufacturing method of a solar cell module can be provided. Further, by measuring the basic physical properties of the shrinkage stress of the back sheet and the shear modulus of the sealing material at the laminate setting temperature, it is possible to predict the finished appearance before actually laminating the solar cell module. Furthermore, since the lamination conditions can be set efficiently, the time required for studying the conditions and the costs of various members are suppressed, and as a result, it can be expected that the manufacturing cost of the solar cell module will be greatly reduced.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明の目的は、太陽電池モジュールにおいて、ラミネート後の外観が良好である太陽電池モジュール、バックシート-封止材一体型シート、および太陽電池モジュールの製造方法を提供することにある。
すなわち、本発明は、下記[1]~[18]に関する。
[1]少なくとも、バックシート(A)と、封止材(B)とがラミネートされてなる太陽電池モジュールであって、ラミネート設定温度における下記バックシート(A)の収縮応力(σ(A))(Pa)と下記封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が60.0以下であることを特徴とする太陽電池モジュール。
バックシート(A)の収縮応力(σ(A)):ラミネート設定温度におけるバックシート(A)の測定値(Pa)
封止材(B)のせん断弾性率(G´(B)):ラミネート設定温度における振動周波数1Hzでの封止材(B)の測定値(Pa)
[2]ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が0.01以上、60.0以下であることを特徴とする前記[1]に記載の太陽電池モジュール。
[3]ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が0.01以上、35.0以下であることを特徴とする前記[1]に記載の太陽電池モジュール。
[4]ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が1.0以上、20.0以下であることを特徴とする前記[1]に記載の太陽電池モジュール。
[5]封止材(B)の振動周波数10Hz、温度20℃における貯蔵弾性率(E´)が1~100MPaであることを特徴とする前記[1]~[4]のいずれか1項に記載の太陽電池モジュール。
[6]封止材(B)がエチレンと炭素数3~20のα-オレフィンとの共重合体を主成分とする封止材であることを特徴とする前記[1]~[5]のいずれか1項に記載の太陽電池モジュール。
[7]封止材(B)が、バックシート(A)の内側に用いられてなることを特徴とする前記[1]~[6]のいずれか1項に記載の太陽電池モジュール。
[8]封止材(B)が、さらに下記条件(P)を満足することを特徴とする前記[7]に記載の太陽電池モジュール。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する
[9]封止材(B)を構成する樹脂組成物に含有されるオレフィン系重合体(X)とオレフィン系重合体(Y)の混合質量比が95~55/5~45であることを特徴とする前記[8]に記載の太陽電池モジュール。
[10]封止材(B)を構成する樹脂組成物に含有されるオレフィン系重合体(X)のMFR(JIS K7210、温度:190℃、荷重:21.18N)が0.5g/10min以上、5g/10min未満であり、オレフィン系重合体(Y)のMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上、100g/10min以下であることを特徴とする前記[8]又は[9]に記載の太陽電池モジュール。
[11]封止材(B)が、少なくとも動的粘弾性測定における振動周波数10Hz、温度20℃の貯蔵弾性率(E´)が100MPa未満である軟質層、及び動的粘弾性測定における振動周波数10Hz、温度20℃の貯蔵弾性率(E´)が100MPa以上である硬質層を有する積層構成であることを特徴とする前記[1]~[10]のいずれか1項に記載の太陽電池モジュール。
[12]封止材(B)が実質的に架橋しない封止材であることを特徴とする前記[1]~[11]のいずれか1項に記載の太陽電池モジュール。
[13]バックシート(A)の収縮応力(σ(A))が130℃および150℃において、7×105Pa以下であることを特徴とする前記[1]~[12]のいずれか1項に記載の太陽電池モジュール。
[14]バックシート(A)の収縮応力(σ(A))が130℃および150℃において、4×105Pa以下であることを特徴とする前記[1]~[12]のいずれか1項に記載の太陽電池モジュール。
[15]バックシート(A)と封止材(B)が一体化している部材であることを特徴とする前記[1]~[14]のいずれか1項に記載の太陽電池モジュール。
[16]ラミネート設定温度が100℃以上、135℃以下であることを特徴とする前記[1]~[15]のいずれか1項に記載の太陽電池モジュールの製造方法。
[17]少なくとも、バックシート(A)と、封止材(B)とを備えた太陽電池モジュール用バックシート-封止材一体型シートであって、ラミネート設定温度における下記バックシート(A)の収縮応力(σ(A))(Pa)と下記封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が60.0以下であることを特徴とする太陽電池モジュール用バックシート-封止材一体型シート。
バックシート(A)の収縮応力(σ(A)):ラミネート設定温度におけるバックシート(A)の測定値(Pa)
封止材(B)のせん断弾性率(G´(B)):ラミネート設定温度における振動周波数1Hzでの封止材(B)の測定値(Pa)
[18]封止材(B)が、さらに下記条件(P)を満足することを特徴とする前記[17]に記載の太陽電池モジュール用バックシート-封止材一体型シート。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する
また、ラミネート設定温度におけるバックシートの収縮応力と封止材のせん断弾性率という基礎的な物性を測定することにより、太陽電池モジュールを実際にラミネートする前に、仕上がり外観の予測が可能となる。さらに、効率的にラミネート条件を設定できることから、条件検討に要する時間と各種部材の費用が抑制され、結果、太陽電池モジュールの製造コストを大幅に低減させることが期待できる。
本発明の太陽電池モジュールは、ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))(以下、凸指数と呼ぶことがある)が特定の範囲であることを特徴とするものである。
ここで、太陽電池モジュールは、一般的に、バックシート(A)と封止材(B)と、太陽電池素子と、透明基材(上部保護材)とを有するものである。
本発明に用いるバックシート(A)は、後述する凸指数を満足すれば特に制限されるものではない。具体的には、ポリエステル系樹脂(ポリエチレンテレフタレート(PET)やポリエチレンナフタレート(PEN)など)、フッ素系樹脂(ポリテトラフルオロエチレン(PTFE)、テトラフルオロエチレン-パーフルオロアルキルビニルエーテル共重合体(PFA)、テトラフルオロエチレン-ヘキサフルオロプロピレン共重合体(FEP)、エチレン-テトラフルオロエチレン共重合体(ETFE)、ポリクロロトリフルオロエチレン(PCTFE)、ポリフッ化ビニリデン(PVDF)及びポリフッ化ビニル(PVF)など)、ポリオレフィン系樹脂(ポリエチレン(PE)、ポリプロピレン(PP)、各種α-オレフィン共重合体、エチレン-酢酸ビニル共重合体(EVA)、エチレン-エチルアクリレート共重合体(EEA)、エチレン-アクリル酸共重合体(EAA)及びエチレン-メタクリル酸共重合体(EMAA)など)、環状オレフィン系樹脂(COP、COCなど)、ポリスチレン系樹脂(アクリロニトリル-スチレン共重合体(AS)、アクリロニトリル-ブタジエン-スチレン共重合体(ABS)、アクリロニトリル-スチレン-アクリルゴム共重合体(ASA)及びシンジオタクチックポリスチレン(SPS)など)、ポリアミド(PA)、ポリカーボネート(PC)、ポリメチルメタクリレート(PMMA)、変性ポリフェニレンエーテル(変性PPE)、ポリフェニレンサルファイド(PPS)、ポリエーテルサルフォン(PES) 、ポリフェニルサルフォン(PPSU)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルイミド(PEI)、ポリイミド(PI)およびバイオポリマー(ポリ乳酸、イソソルバイド系ポリマー、ポリアミド系ポリマー、ポリエステル系ポリマー及びポリオレフィン系ポリマーなど)等の電気絶縁性を有する材料によって基材シート、または、基材フィルムが形成される。
さらに、基材シートの表面及び/または裏面には、ハンドリング性や接着性および耐久性などを向上させるため、必要に応じて、エンボス加工や各種処理(コロナ処理、プラズマ処理など)およびコーティング(フッ素系樹脂コーティング、加水分解防止コーティング、ハードコーティングなど)などを行うことができる。
ここで、バックシートに一般的に要求される特性としては、封止材との接着性、機械的強度、耐久性(耐候性、耐加水分解特性など)、光反射性、水蒸気バリア性、難燃性、意匠性、経済性およびラミネート後の外観などが挙げられ、中でも結晶シリコン系太陽電池モジュールの場合には、封止材との接着性、機械的強度、耐久性、経済性およびラミネート後の外観が重要視される。
(1)フッ素系樹脂層/接着層/ポリエステル樹脂層/接着層/易接着層(封止材側);具体的には、PVF/接着層/二軸延伸PET/接着層/EVA、PVF/接着層/二軸延伸PET/接着層/PE、PVF/接着層/二軸延伸PET/接着層/PP、ETFE/接着層/二軸延伸PET/接着層/EVA、ETFE/接着層/二軸延伸PET/接着層/PE、ETFE/接着層/二軸延伸PET/接着層/PPなど、
(2)ポリエステル樹脂層/接着層/ポリエステル樹脂層/接着層/易接着層(封止材側);具体的には、二軸延伸PET(耐加水分解処方)/接着層/二軸延伸PET/接着層/EVA、二軸延伸PET(耐加水分解処方)/接着層/二軸延伸PET/接着層/PE、二軸延伸PET(耐加水分解処方)/接着層/二軸延伸PET/接着層/PP、(表面コーティング)二軸延伸PET/接着層/二軸延伸PET/接着層/易接着層など、
(3)ポリエステル樹脂層/接着層/易接着層(封止材側);具体的には、二軸延伸PET(耐加水分解処方)/接着層/EVA、二軸延伸PET(耐加水分解処方)/接着層/PE、二軸延伸PET(耐加水分解処方)/接着層/PP、(表面コーティング)二軸延伸PET/接着層/易接着層などが挙げられる。
上記(1)~(3)の接着層は必要に応じて配置するものであり、接着層がない構成でもよい。また、水蒸気バリア性を重要視する場合には、例えば、前記した二軸延伸PET(耐加水分解処方)/接着層/二軸延伸PET/接着層/PE構成において、二軸延伸PET(耐加水分解処方)/接着層/各種蒸着層(SiOx、アルミナなど)/二軸延伸PET/接着層/二軸延伸PET/接着層/PEなどの構成としてもよい。
本発明に用いる封止材(B)は、後述する凸指数を満足すれば特に制限されるものではなく、バックシート側、フロントシート側などのいずれの位置にも使用できる。具体的には、エチレン-酢酸ビニル共重合体(EVA)、ポリエチレン(PE)、ポリプロピレン(PP)、アイオノマー(IO)およびポリビニルブチラール(PVB)などを主成分とする封止材が挙げられるが、本発明においては、下記の(B-1)~(B-4)の各々に示されるオレフィン系重合体を主成分とする封止材が好適に用いられる。ここで、主成分としては、得られる封止材の柔軟性、フィッシュアイ(ゲル)の少なさ、回路の腐食性物質(酢酸など)の少なさおよび経済性などの観点から(B-1)や(B-2)に示されるものが好ましく、中でも低温特性に優れる点で(B-1)に示されるものが特に好適に用いられる。
(B-1)は、エチレンと炭素数3~20のα-オレフィンとの共重合体である。ここで、エチレンと共重合するα-オレフィンとしては、プロピレン、1-ブテン、1-ペンテン、1-へキセン、1-へプテン、1-オクテン、1-ノネン、1-デセン、3-メチル-ブテン-1、4-メチル-ペンテン-1等が例示される。
本発明においては、工業的な入手し易さや諸特性、経済性などの観点からエチレンと共重合するα-オレフィンとしては、プロピレン、1-ブテン、1-へキセン、1-オクテンが好適に用いられる。また、透明性や柔軟性などの観点からエチレン-α-オレフィンランダム共重合体が好適に用いられる。エチレンと共重合するα-オレフィンは1種のみを単独でまたは2種以上を組み合わせて用いることができる。
また、エチレンと炭素数3~20のα-オレフィンとの共重合体(B-1)の立体構造、分岐、分岐度分布、分子量分布や共重合形式(ランダム、ブロックなど)は、特に制限されるものではないが、例えば、長鎖分岐を有する共重合体は、一般に機械物性が良好であり、また、シートを成形する際の溶融張力(メルトテンション)が高くなりカレンダー成形性が向上するなどの利点がある。
ここで、MFRは、シートを成形する際の成形加工性や太陽電池素子(セル)を封止する時の密着性、回り込み具合などを考慮して選択すればよい。例えば、シートをカレンダー成形する場合には、シートを成形ロールから引き剥がす際のハンドリング性からMFRは、比較的低い値、具体的には0.5~5g/10min程度が好ましく、また、Tダイを用いて押出成形する場合には、押出負荷を低減させ押出量を増大させる観点からMFRは、1~50g/10minが好ましく、2~50g/10minがより好ましく、さらに好ましくは3~30g/10minである。さらに、太陽電池素子(セル)を封止する時の密着性や回り込み易さの観点からは、MFRは、好ましくは2~50g/10min、より好ましくは3~30g/10minである。
上記の結晶融解熱量は、示差走査熱量計を用いて、JIS K7122に準じて加熱速度10℃/分で測定することができる。
(B-2)は、プロピレンと該プロピレンと共重合可能な他の単量体との共重合体あるいは、プロピレンの単独重合体である。但し、これらの共重合形式(ランダム、ブロックなど)、分岐、分岐度分布や立体構造には特に制限がなく、イソタクチック、アタクチック、シンジオタクチックあるいはこれらの混在した構造の重合体とすることができる。
共重合可能な他の単量体としては、エチレンや1-ブテン、1-ヘキセン、4-メチル-ペンテン-1、1-オクテン等の炭素数4~12のα-オレフィンおよびジビニルベンゼン、1,4-シクロヘキサジエン、ジシクロペンタジエン、シクロオクタジエン、エチリデンノルボルネン等のジエン類等が例示される。
本発明においては、工業的な入手し易さや諸特性、経済性などの観点からプロピレンと共重合するα-オレフィンとしては、エチレンや1-ブテンが好適に用いられる。また、透明性や柔軟性などの観点からプロピレン-α-オレフィンランダム共重合体が好適に用いられる。プロピレンと共重合する単量体は1種のみを単独でまたは2種以上を組み合わせて用いることができる。
ここで、MFRは、シートを成形する際の成形加工性や太陽電池素子(セル)を封止する時の密着性、回り込み具合などを考慮して選択すればよい。例えば、シートをカレンダー成形する場合には、シートを成形ロールから引き剥がす際のハンドリング性からMFRは、比較的低い方、具体的には0.5~5g/10min程度が好ましく、また、Tダイを用いて押出成形する場合には、押出負荷を低減させ押出量を増大させる観点からMFRは、好ましくは2~50g/10min、より好ましくは3~30g/10minである。さらに、太陽電池素子(セル)を封止する時の密着性や回り込み易さの観点からは、MFRは、好ましくは2~50g/10min、より好ましくは3~30g/10minである。
(B-3)は、エチレン、プロピレン等のα-オレフィンと脂肪族不飽和カルボン酸とからなる共重合体の金属塩(好ましい金属はZn、Na、K、Li、Mg等である)である。
具体的な商品としては、三井化学(株)製の商品名「ハイミラン(HIMILAN)」、ダウ・ケミカル(株)製の商品名「アンプリファイIO(AMPLIFY IO)」等を例示することができる。
(B-4)は、エチレンと、酢酸ビニルエステル、脂肪族不飽和カルボン酸および脂肪族不飽和モノカルボン酸アルキルエステルより選ばれる少なくとも1つの単量体とからなるエチレン系共重合体である。
具体的には、エチレン-アクリル酸共重合体、エチレン-メタクリル酸共重合体、エチレン-アクリル酸エステル共重合体、エチレン-メタクリル酸エステル共重合体等が挙げられる。ここで、該エステル成分としては、メチル、エチル、プロピル、ブチルなどの炭素数1~8のアルキルエステルが挙げられる。本発明においては、上記2成分の共重合体に制限されることなく、さらに第3の成分を加えた3成分以上の多元共重合体(例えば、エチレンと脂肪族不飽和カルボン酸および脂肪族不飽和カルボン酸エステルより適宜選ばれる3元以上の共重合体等)であってもよい。エチレンと共重合される単量体の含有量は、共重合体中の全単量体単位に対して、通常5~35質量%である。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する
また、バックシート側に用いる封止材(B)を構成する樹脂組成物に含有されるオレフィン系重合体(X)とオレフィン系重合体(Y)の混合質量比が95~55/5~45であることが好ましい。ここで、該混合質量比の範囲であれば、ラミネート後に得られる太陽電池モジュールの凸外観とフラット性がバランスよく達成できるため好ましい。これらのことから、オレフィン系重合体(X)とオレフィン系重合体(Y)の混合質量比は、90~60/10~40であることがより好ましく、85~65/15~35であることがさらに好ましい。
バックシート側に用いる封止材(B)を構成する樹脂組成物には、後述する他の樹脂を含有していてもよいが、オレフィン系重合体(X)及びオレフィン系重合体(Y)の合計が樹脂組成物中、50質量%以上を占めるのが好ましく、70質量%以上を占めるのがよりに好ましく、90質量%以上を占めるのがさらに好ましい。上限については、特に制限されるものではないが、100質量%以下であることが好ましい。
なお、上記オレフィン系重合体(X)とオレフィン系重合体(Y)を、後述する積層構成の封止材を構成する樹脂組成物に含有させる場合、混合質量比が上記の範囲内であれば、オレフィン系重合体(X)とオレフィン系重合体(Y)とが同一の層内に含有されている必要はないが、好ましくは、同一層内に両重合体が含有されている。また、積層構成の封止材の各層を構成する樹脂組成物に両重合体が含有されているのが、より好ましい。
ここで、MFRは、シートを成形する際の成形加工性や太陽電池素子(セル)を封止する時の密着性、回り込み具合などを考慮して選択すればよい。例えば、シートをカレンダー成形する場合には、シートを成形ロールから引き剥がす際のハンドリング性からMFRは、比較的低い方、具体的には0.5~5g/10min程度が好ましく、また、Tダイを用いて押出成形する場合には、押出負荷を低減させ押出量を増大させる観点からMFRは、好ましくは2~50g/10min、より好ましくは3~30g/10minである。さらに、太陽電池素子(セル)を封止する時の密着性や回り込み易さの観点からは、MFRは、好ましくは2~50g/10min、より好ましくは3~30g/10minである。
ここで、封止材の柔軟性を重視すると主成分とするオレフィン系重合体の結晶融解ピーク温度(Tm)は、100℃未満であることが好ましいが、結晶融解ピーク温度を発現しない、すなわち非晶性の重合体も適用可能である(以下、非晶性の重合体を含めて、結晶融解ピーク温度が100℃未満のオレフィン系重合体と呼ぶ)。原料ペレットのブロッキングなどを考慮すると、該結晶融解ピーク温度が30~95℃であることが好ましく、45~80℃であることがより好ましく、60~80℃であることがさらに好ましい。
また、封止材の耐熱性を重視すると、結晶融解ピーク温度(Tm)が100℃未満のオレフィン系重合体に結晶融解ピーク温度(Tm)が100℃以上のオレフィン系重合体を混合して用いることが好ましい。混合するオレフィン系重合体の結晶融解ピーク温度(Tm)の上限値は、特に制限されるものではないが、太陽電池素子(セル)の熱劣化や太陽電池モジュール作製時のラミネート設定温度を考慮すると150℃程度である。本発明においては、太陽電池モジュールを作製する際のラミネート設定温度を低温化でき、太陽電池素子(セル)を熱劣化させにくいことから130℃以下であることが好ましく、125℃以下であることがさらに好ましい。
ここで、樹脂組成物中における両オレフィン系重合体の含有量は、特に制限されるものではないが、得られる封止材の柔軟性、耐熱性、透明性等を考慮すると、両オレフィン系重合体の混合(含有)質量比(結晶融解ピーク温度が100℃未満のオレフィン系重合体/結晶融解ピーク温度が100℃以上のオレフィン系重合体)は、好ましくは99~50/1~50、より好ましくは、98~60/2~40、より好ましくは、97~70/3~30、さらに好ましくは、97~80/3~20、よりさらに好ましくは、97~90/3~10である。但し、両オレフィン系重合体の合計を100質量部とする。ここで、混合(含有)質量比が該範囲内であれば、柔軟性、耐熱性、透明性等のバランスに優れた封止材が得られ易いため好ましい。
ここで、エチレン-α-オレフィンブロック共重合体のブロック構造は、特に制限されるものではないが、柔軟性、耐熱性、透明性等のバランス化の観点から、コモノマー含有率、結晶性、密度、結晶融解ピーク温度(Tm)、又はガラス転移温度(Tg)の異なる2つ以上のセグメント又はブロックを含有するマルチブロック構造であることが好ましい。具体的には、完全対称ブロック、非対称ブロック、テ-パ-ドブロック構造(ブロック構造の比率が主鎖内で漸増する構造)などが挙げられる。該マルチブロック構造を有する共重合体の構造や製造方法については、国際公開第2005/090425号パンフレット(WO2005/090425)、国際公開第2005/090426号パンフレット(WO2005/090426)、および国際公開第2005/090427号パンフレット(WO2005/090427)などで詳細に開示されているものを採用することができる。
該マルチブロック構造を有するエチレン-α-オレフィンブロック共重合体は、本発明において好適に使用でき、α-オレフィンとして1-オクテンを共重合成分とするエチレン-オクテンマルチブロック共重合体が好ましい。該ブロック共重合体としては、エチレンに対してオクテン成分が多く(約15~20モル%)共重合されたほぼ非晶性のソフトセグメントと、エチレンに対してオクテン成分が少なく(約2モル%未満)共重合された結晶融解ピーク温度が110~145℃である高結晶性のハードセグメントが、各々2つ以上存在するマルチブロック共重合体が好ましい。これらのソフトセグメントとハードセグメントの連鎖長や比率を制御することにより、柔軟性と耐熱性の両立を達成することができる。
該マルチブロック構造を有する共重合体の具体例としては、ダウ・ケミカル(株)製の商品名「インフューズ(Infuse)」が挙げられる。
ここで、シラン変性エチレン系樹脂について説明する。
本発明に用いられるシラン変性エチレン系樹脂は、通常、ポリエチレン系樹脂とビニルシラン化合物及びラジカル発生剤を高温(160℃~220℃程度)で溶融混合し、グラフト重合させることにより得ることができる。
上記ポリエチレン系樹脂としては、特に制限されるものではないが、具体的には、低密度ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、超低密度ポリエチレン、または直鎖状低密度ポリエチレンが挙げられる。これらは1種のみを単独でまたは2種以上を組み合わせて用いることができ、特には、前記(B-1)で挙げたポリエチレンを好ましく使用することができる。
ビニルシラン化合物としては、上記ポリエチレン系樹脂とグラフト重合するものであれば特に制限されるものではないが、例えばビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリプロポキシシラン、ビニルトリイソプロポキシシラン、ビニルトリブトキシシラン、ビニルトリペンチロキシシラン、ビニルトリフェノキシシラン、ビニルトリベンジルオキシシラン、ビニルトリメチレンジオキシシラン、ビニルトリエチレンジオキシシラン、ビニルプロピオニルオキシシラン、ビニルトリアセトキシシラン、および、ビニルトリカルボキシシランが挙げられる。これらビニルシラン化合物は、1種のみを単独で又は2種以上を組み合わせて用いることができる。本発明においては、反応性、接着性や色調などの観点からビニルトリメトキシシランが好適に用いられる。
ラジカル発生剤としては、特に制限されるものではないが、例えば、ジイソプロピルベンゼンヒドロパーオキサイド、2,5-ジメチル-2,5-ジ(ヒドロパーオキシ)ヘキサン等のヒドロパーオキサイド類;ジ-t-ブチルパーオキサイド、t-ブチルクミルパーオキサイド、ジクミルパーオキサイド、2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン、2,5-ジメチル-2,5-ジ(t-パーオキシ)ヘキシン-3等のジアルキルパーオキサイド類;ビス-3,5,5-トリメチルヘキサノイルパーオキサイド、オクタノイルパーオキサイド、ベンゾイルパーオキサイド、o-メチルベンゾイルパーオキサイド、2,4-ジクロロベンゾイルパーオキサイド等のジアシルパーオキサイド類;t-ブチルパーオキシアセテート、t-ブチルパーオキシ-2-エチルヘキサノエート、t-ブチルパーオキシピバレート、t-ブチルパーオキシオクトエート、t-ブチルパーオキシイソプロピルカーボネート、t-ブチルパーオキシベンゾエート、ジ-t-ブチルパーオキシフタレート、2,5-ジメチル-2,5-ジ(ベンゾイルパーオキシ)ヘキサン、2,5-ジメチル-2,5-ジ(ベンゾイルパーオキシ)ヘキシン-3等のパーオキシエステル類;メチルエチルケトンパーオキサイド、シクロヘキサノンパーオキサイド等のケトンパーオキサイド類等の有機過酸化物、または、アゾビスイソブチロニトリル、アゾビス(2,4-ジメチルバレロニトリル)等のアゾ化合物等が挙げられる。これらラジカル発生剤は、1種のみを単独で又は2種以上を組み合わせて用いることができる。
ここで、実質的に含有していないとは、樹脂組成物100質量部に対して、0.05質量部以下、好ましくは0.03質量部以下、特に好ましくは0.00質量部である。
本発明に用いる封止材(B)を構成する樹脂組成物には、必要に応じて、種々の添加剤を添加することができる。該添加剤としては、例えば、シランカップリング剤、酸化防止剤、紫外線吸収剤、耐候安定剤、光拡散剤、放熱剤、造核剤、顔料(例えば、酸化チタン、カーボンブラックなど)、難燃剤、変色防止剤などが挙げられる。本発明においては、封止材(B)が、シランカップリング剤、酸化防止剤、紫外線吸収剤、耐候安定剤から選ばれる少なくとも一種の添加剤が添加されていることが後述する理由等から好ましい。また、本発明においては、封止材を構成する樹脂組成物に架橋剤や架橋助剤を添加する必要はないが、添加することを排除するものではなく、例えば、高度の耐熱性を要求される場合は架橋剤および/または架橋助剤を配合してもよい。本発明においては、用いる封止材(B)が実質的に架橋しない封止材であることが好ましい。ここで、実質的に架橋しないとは、ASTM 2765-95で測定してキシレン可溶物が少なくとも70%以上、好ましくは85%以上、さらに好ましくは95%以上であることとする。
シランカップリング剤は、封止材の保護材(ガラス、樹脂製のフロントシート、バックシートなど)や太陽電池素子等に対する接着性を向上させるのに有用であり、その例としては、ビニル基、アクリロキシ基、メタクリロキシ基のような不飽和基、アミノ基、エポキシ基などとともに、アルコキシ基のような加水分解可能な基を有する化合物を挙げることができる。シランカップリング剤の具体例としては、N-(β-アミノエチル)-γ-アミノプロピルトリメトキシシラン、N-(β-アミノエチル)-γ-アミノプロピルメチルジメトキシシラン、γ-アミノプロピルトリエトキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-メタクリロキシプロピルトリメトキシシランなどを例示することができる。これらシランカップリング剤は、1種のみを単独で又は2種以上を組み合わせて用いることができる。
本発明においては、接着性が良好であり、黄変などの変色が少ないこと等からγ-グリシドキシプロピルトリメトキシシランやγ-メタクリロキシプロピルトリメトキシシランが好ましく用いられる。
該シランカップリング剤の添加量は、封止材(B)を構成する樹脂組成物100質量部に対し、通常、0.1~5質量部程度であり、好ましくは0.2~3質量部である。また、シランカップリング剤と同様に、有機チタネート化合物などのカップリング剤も有効に活用できる。
酸化防止剤としては、種々の市販品が適用でき、モノフェノール系、ビスフェノール系、高分子型フェノール系、硫黄系、ホスファイト系など各種タイプのものを挙げることができる。モノフェノール系としては、例えば、2,6-ジ-tert-ブチル-p-クレゾール、ブチル化ヒドロキシアニゾール、2,6-ジ-tert-ブチル-4-エチルフェノールなどを挙げることができる。ビスフェノール系としては、2,2′-メチレン-ビス-(4-メチル-6-tert-ブチルフェノール)、2,2′-メチレン-ビス-(4-エチル-6-tert-ブチルフェノール)、4,4′-チオビス-(3-メチル-6-tert-ブチルフェノール)、4,4′-ブチリデン-ビス-(3-メチル-6-tert-ブチルフェノール)、3,9-ビス〔{1,1-ジメチル-2-{β-(3-tert-ブチル-4-ヒドロキシ-5-メチルフェニル)プロピオニルオキシ}エチル}2,4,9,10-テトラオキサスピロ〕5,5-ウンデカンなどを挙げることができる。
上記酸化防止剤は、1種のみを単独で又は2種以上を組み合わせて用いることができる。
紫外線吸収剤としては、種々の市販品が適用でき、ベンゾフェノン系、ベンゾトリアゾール系、トリアジン系、サリチル酸エステル系など各種タイプのものを挙げることができる。ベンゾフェノン系紫外線吸収剤としては、例えば、2-ヒドロキシ-4-メトキシベンゾフェノン、2-ヒドロキシ-4-メトキシ-2’-カルボキシベンゾフェノン、2-ヒドロキシ-4-オクトキシベンゾフェノン、2-ヒドロキシ-4-n-ドデシルオキシベンゾフェノン、2-ヒドロキシ-4-n-オクタデシルオキシベンゾフェノン、2-ヒドロキシ-4-ベンジルオキシベンゾフェノン、2-ヒドロキシ-4-メトキシ-5-スルホベンゾフェノン、2-ヒドロキシ-5-クロロベンゾフェノン、2,4-ジヒドロキシベンゾフェノン、2,2’-ジヒドロキシ-4-メトキシベンゾフェノン、2,2’-ジヒドロキシ-4,4’-ジメトキシベンゾフェノン、2,2’,4,4’-テトラヒドロキシベンゾフェノンなどを挙げることができる。
該紫外線吸収剤の添加量は、封止材(B)を構成する樹脂組成物100質量部に対し、通常、0.01~2.0質量部程度であり、好ましくは0.05~0.5質量部である。
上記の紫外線吸収剤以外に耐候性を付与する耐候安定剤としては、ヒンダードアミン系光安定化剤が好適に用いられる。ヒンダードアミン系光安定化剤は、紫外線吸収剤のようには紫外線を吸収しないが、紫外線吸収剤と併用することによって著しい相乗効果を示す。ヒンダードアミン系以外にも光安定化剤として機能するものはあるが、着色している場合が多く本発明に用いる封止材(B)には好ましくない。
該ヒンダードアミン系光安定化剤の添加量は、封止材(B)を構成する樹脂組成物100質量部に対し、通常、0.01~0.5質量部程度であり、好ましくは0.05~0.3質量部である。
例えば、封止材(B)の動的粘弾性測定における振動周波数10Hz、温度20℃の貯蔵弾性率(E´)が1~2000MPaであることが好ましい。太陽電池素子の保護や柔軟性を考慮すると、1~100MPaであることが好ましく、5~50MPaであることがより好ましく、5~30MPaであることがさらに好ましい。なお、封止材(B)が積層構成の場合は、前記貯蔵弾性率(E´)は積層構成全体の封止材の貯蔵弾性率をいう。また、シート形状などで封止材を採取した場合のハンドリング性やシート表面同士のブロッキング防止、あるいは、太陽電池モジュールにおける軽量化(通常3mm程度に対して、薄膜ガラス(1.1mm程度)が適用可能、あるいはガラスレスの構成が適用可能)などを考慮すると、100~800MPaであることが好ましく、200~600MPaであることがより好ましい。該貯蔵弾性率(E´)は、粘弾性測定装置を用いて、振動周波数10Hzで所定温度範囲を測定し、温度20℃における値を求めることで得られる。
封止材の形状は、限定されるものではなく、液状であっても、シート状であってもよいが、取り扱い性の観点からシート状であるのが好ましい。
シート状の封止材の製膜方法としては、公知の方法、例えば単軸押出機、多軸押出機、バンバリーミキサー、ニーダーなどの溶融混合設備を有し、Tダイを用いる押出キャスト法、カレンダー法やインフレーション法等を採用することができ、特に制限されるものではないが、本発明においては、ハンドリング性や生産性等の面からTダイを用いる押出キャスト法が好適に用いられる。Tダイを用いる押出キャスト法での成形温度は、用いる樹脂組成物の流動特性や製膜性等によって適宜調整されるが、概ね130~300℃、好ましくは、150~250℃である。
封止材の厚みは特に限定されるものではないが、通常0.03mm以上、好ましくは0.05mm以上、より好ましくは0.1mm以上であり、かつ、通常1mm以下、好ましくは0.7mm以下、より好ましくは0.5mm以下である。
また、各種被着体への接着性を向上させる目的で表面にコロナ処理やプラズマ処理およびプライマー処理などの各種表面処理を行うことができる。ここで、表面処理量の目安としては、濡れ指数で50mN/m以上であることが好ましく、52mN/m以上であることがより好ましい。濡れ指数の上限値は一般的に70mN/m程度である。
上記複数の層からなる積層構成としては、少なくとも、後述する軟質層及び硬質層を有する積層構成が挙げられ、例えば、次のような積層構成が好適に用いられる。
(1)2種3層構成;具体的には、軟質層/硬質層/軟質層、硬質層/軟質層/硬質層、接着層/中間層/接着層、軟質層/再生添加層/軟質層など、
(2)2種2層構成;具体的には、軟質層/硬質層、軟質層(I)/軟質層(II)、接着層/軟質層、接着層/硬質層、軟質層(添加剤含む)/軟質層(添加剤含まず)、軟質層(添加剤Aを含む)/軟質層(添加剤Bを含む)(添加剤処方が異なる)など、
(3)3種3層構成;具体的には、軟質層/接着層/硬質層、軟質層(I)/中間層/軟質層(II)、接着層(I)/中間層/接着層(II)など、
(4)3種5層構成;具体的には、軟質層/接着層/硬質層/接着層/軟質層、硬質層/接着層/軟質層/接着層/硬質層、軟質層/再生添加層/硬質層/再生添加層/軟質層および軟質層/再生添加層/硬質層/再生添加層/硬質層などが挙げられる。
なお、中間層とは、封止材(B)の厚さを増すためや所望の性能を向上させるなどの観点から設けられ、例えばオレフィン系樹脂を主成分とする樹脂組成物から形成される層である。再生添加層とは、経済合理性や資源の有効活用などの観点から設けられ、例えば封止材(B)の製膜やスリット加工などの際に生じるトリミング(耳)を再生添加した樹脂組成物から形成される層である。
接着層とは、隣接する層同士や被着体などへの接着性を向上させる観点から設けられ、例えばカルボキシル基、アミノ基、イミド基、水酸基、エポキシ基、オキサゾリン基、チオール基及びシラノール基などの極性基で変性された樹脂や粘着付与樹脂などを含有する樹脂組成物から形成される層である。
また、上記添加剤としては、シランカップリング剤、酸化防止剤、紫外線吸収剤、耐候安定剤、光拡散剤、放熱剤、造核剤、顔料、難燃剤、変色防止剤、架橋剤及び架橋助剤などが挙げられる。
ここで、太陽電池素子に密着する軟質層の厚みは、特に制限されるものではないが、太陽電池素子の保護性や樹脂の回り込み性などを考慮すると、0.005mm以上であることが好ましく、0.02~0.2mmであることがより好ましい。なお、上記軟質層の各々の厚みは、同一でも異なっていてもよい。また、硬質層の厚みは、特に制限されるものではないが、封止材全体としてのハンドリング性の点から、0.025mm以上であることが好ましく、0.05~0.8mmであることがより好ましい。
本発明に用いるバックシート(A)と封止材(B)は、各々単独で組み合わせてもよいし、バックシートと封止材が予め一体化されたバックシート-封止材一体型シートも好適に用いられる。本発明のバックシート-封止材一体型シートは、少なくとも、前記バックシート(A)と、前記封止材(B)とを備える。また、封止材(B)は、さらに下記条件(P)を満足することが好ましい。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する
バックシート(A)、封止材(B)、オレフィン系重合体(X)、及びオレフィン系重合体(Y)については、前述のとおりである。
本発明の太陽電池モジュールは、ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が60.0以下であることが重要である。ここで、収縮応力(σ(A))は、ラミネート設定温度におけるバックシート(A)の測定値(Pa)であり、せん断弾性率(G´(B))は、ラミネート設定温度における振動周波数1Hzでの封止材(B)の測定値(Pa)である。
本発明において、「ラミネート設定温度」とは、バックシート(A)、封止材(B)、セル及び上部保護材を重ね合わせ、ラミネートする際のラミネーターの設定温度であり、「ラミネート温度域」とは、ラミネート設定温度の範囲である。また、ラミネート設定温度は、好ましくは100℃以上、170℃以下であり、より好ましくは100℃以上、135℃以下である。
ここで、凸指数の上限値については、より小さいほど好ましいが、下限値については、経済性とラミネート時の封止材の回りこみ性などを考慮し、1.0以上が好ましい。
まず、バックシート(A)の収縮応力(σ(A))は、用いたバックシート(A)から縦方向70mm、横方向10mmの大きさに試料を3枚切り取り、チャック間距離50mmで両端を固定し、ラミネート設定温度のシリコンバスに5分間浸漬し、縦方向に発生する最大の収縮応力の平均値(Pa)を求めたものである。
次に、封止材(B)のせん断弾性率(G´(B))は、Rheology社製のレオメーター(商品名「レオメーターMR-300T」)を用いて、振動周波数1Hz、昇温速度3℃/分、歪0.5%の条件で、φ20mmパラレルプレート上にのせた試料(厚さ0.3mm)のせん断弾性率(G´)を80℃~200℃の温度範囲で測定し、ラミネート設定温度における値(Pa)を求めたものである。
次に、凸指数の制御方法について説明する。凸現象を抑制するためには、凸指数はより小さいほど好ましい。凸指数を小さくするためには(1)ラミネート設定温度におけるバックシート(A)の熱収縮挙動に起因する収縮応力(σ(A))を小さくする方法と(2)ラミネート設定温度における封止材(B)のせん断弾性率(G´(B))を大きくする方法および(3)ラミネートを低温で行うことが主に挙げられる。
次に本発明の太陽電池モジュールは、封止材(B)を用い、太陽電池素子を上下の保護材であるフロントシートおよびバックシート(A)で固定することにより製作することができる。このような太陽電池モジュールとしては、種々のタイプのものを例示することができ、好ましくは、封止材と、上部保護材と、太陽電池素子と、下部保護材とを用いて作製された太陽電池モジュールが挙げられ、具体的には、上部保護材/封止材(封止樹脂層)/太陽電池素子/封止材(封止樹脂層)/下部保護材のように太陽電池素子の両側から封止材で挟むような構成のもの(図1参照)、下部保護材の内周面上に形成させた太陽電池素子上に封止材と上部保護材を形成させるような構成のもの、上部保護材の内周面上に形成させた太陽電池素子、例えばフッ素樹脂系透明保護材上にアモルファス太陽電池素子をスパッタリング等で作製したものの上に封止材と下部保護材を形成させるような構成のものなどを挙げることができる。
なお、本発明の太陽電池モジュールにおいて、封止材が2箇所以上の部位に使用される場合、全ての部位に同じ封止材を用いてもよいし、樹脂組成、表面形状、厚みなどが異なる封止材を用いてもよい。
(1)結晶融解ピーク温度(Tm)
(株)パーキンエルマー製の示差走査熱量計、商品名「Pyris1 DSC」を用いて、JIS K7121に準じて、試料約10mgを加熱速度10℃/分で-40℃から200℃まで昇温し、200℃で1分間保持した後、冷却速度10℃/分で-40℃まで降温し、再度、加熱速度10℃/分で200℃まで昇温した時に測定されたサーモグラムから結晶融解ピーク温度(Tm)(℃)を求めた。
(株)パーキンエルマー製の示差走査熱量計、商品名「Pyris1 DSC」を用いて、JIS K7122に準じて、試料約10mgを加熱速度10℃/分で-40℃から200℃まで昇温し、200℃で1分間保持した後、冷却速度10℃/分で-40℃まで降温し、再度、加熱速度10℃/分で200℃まで昇温した時に測定されたサーモグラムから結晶融解熱量(ΔHm)(J/g)を求めた。
用いたバックシート(A)から縦方向150mm、横方向150mmの大きさに切り取り、封止材側面の中央に縦方向100mm、横方向100mmの大きさの格子目を油性マジックで記入した試料を3枚作製した。次いで、150℃の熱風オーブンに30分間放置し、縦(MD)方向について、記入した格子目の収縮前の原寸に対する収縮量の比率の平均値(%)を算出した。
アイティ計測(株)製の粘弾性測定装置、商品名「粘弾性スペクトロメーターDVA-200」を用いて、試料(縦方向4mm、横方向60mm)を振動周波数10Hz、ひずみ0.1%、昇温速度3℃/分、チャック間25mmで横方向について、-150℃から150℃まで測定し、得られたデータから20℃における貯蔵弾性率(E´)(MPa)を求めた。
用いたバックシート(A)から縦方向70mm、横方向10mmの大きさに試料を3枚切り取り、チャック間距離50mmで両端を固定し、ラミネート設定温度のシリコンバスに5分間浸漬し、縦方向に発生する最大の収縮応力の平均値(Pa)を求めた。
Rheology社製のレオメーター、商品名「レオメーターMR-300T」を用いて、振動周波数:1Hz、昇温速度:3℃/分、歪0.5%の条件で、φ20mmパラレルプレート上にのせた試料(厚さ0.3mm)のせん断弾性率(G´)を80℃~200℃の温度範囲で測定し、ラミネート設定温度における値(Pa)を求めた。
前記(5)および(6)で求められた値の比(σ(A)/G´(B))を求めた。
(i)凸外観
3枚の太陽電池モジュール(n=1~3)に発生した突起数をそれぞれ求め、下記基準で評価した。また、3枚の太陽電池モジュールの評価の突起数の平均値(凸外観(平均))も下記の基準で評価した。
(AA)凸現象がほとんど見られないか微小である(0~3箇所/120箇所)
(A)凸現象が微小であるが見られる(4~9箇所/120箇所)
(B)凸現象が少し見られる(10~19箇所/120箇所)
(C)凸現象が多く見られ、また、突起も高い(20箇所以上/120箇所)
(ii)フラット性
実施例11~17及び比較例5において、3枚の太陽電池モジュールのバックシート面のセル間の外観の平均状況を下記基準で評価した。
(A)セル間の凹みがほとんどなく、バックシート面のフラット性が良好である
(B)セル間の凹みが大きく、太陽電池モジュール全体が板チョコレート状の外観である
実施例で使用したバックシートを下記する。
(A-1)Madico社製バックシート、商品名Protekt HD(総厚み;265μm、積層構成;(封止材側)EVA/接着層/PET/コート層、収縮応力(130℃);2.65×105Pa、収縮応力(150℃);4.32×105Pa、熱収縮率(150℃×30分、MD);1.03%、Tm(EVA層);104℃)
封止材を構成する材料を下記する。
(オレフィン系重合体(X))
(X-1);エチレン-オクテンランダム共重合体(ダウ・ケミカル(株)製、商品名:アフィニティーEG8100G、密度:0.870g/cm3、エチレン/1-オクテン=68/32質量%(89/11モル%)、Tm:59℃、ΔHm:49J/g、20℃における貯蔵弾性率(E´):14MPa、MFR(温度:190℃、荷重:21.18N):1g/10min)
(Y-1);エチレン-オクテンランダム共重合体(ダウ・ケミカル(株)製、商品名:アフィニティーEG8200G、密度:0.870g/cm3、エチレン/1-オクテン=68/32質量%(89/11モル%)、Tm:59℃、ΔHm:49J/g、20℃における貯蔵弾性率(E´):14MPa、MFR(温度:190℃、荷重:21.18N):5g/10min)
(Q-1);シラン変性エチレン-オクテンランダム共重合体(三菱化学(株)製、商品名:リンクロンSL800N、密度:0.868g/cm3、Tm:54℃と116℃、ΔHm:22J/gと4J/g、20℃における貯蔵弾性率(E´):15MPa、MFR(温度:190℃、荷重:21.18N):1.7g/10min)
(B-1)(I)層として、上記(X-1)と(Q-1)を、質量比70:30の割合で混合した樹脂組成物、また、(II)層として、(X-1)と(X-2)を、質量比95:5の割合で混合した樹脂組成物をそれぞれ用いて、(I)層/(II)層/(I)層の積層構成となるように、同方向二軸押出機を用いたTダイ法にて樹脂温度180~200℃にて共押出成形した後、25℃のキャストエンボスロールで急冷製膜し、総厚みが0.50mm、各層厚みが(I)/(II)/(I)=0.05mm/0.40mm/0.05mmであり、20℃における貯蔵弾性率(E´):15MPaである封止材を得た。
真空ラミネーター((株)エヌ・ピー・シー製、商品名:NLM-230×360)により、表1に示す各部材を用い、下記条件により太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
〈構成〉
ガラス/封止材(B)/セル/封止材(B)/バックシート(A)
・ガラス;中島硝子工業(株)製白板エンボス/太陽電池向けカバーガラス
商品名ソレクト、サイズ996mm×1664mm、厚み3.2mm
・セル;Qセルズジャパン(株)製太陽電池セル、商品名Q6LTT-200
(6インチ、2バスバータイプ)
*セル数:60(6列×10セル)
*セル数が60である場合、最大120箇所に凸現象が発生する可能性がある
・配線;日立電線ファインテック(株)製PVワイヤー
商品名NoWarp、SSA-SPS 0.2×2.0
(0.2%耐力;56~57MPa)
・バックシート(A);A-1
・封止材(B);B-1
*封止材(B)のサイズは前記ガラスと同一である(即ち、サイズ996mm×1664mm)
〈ラミネート条件〉
・ラミネート設定温度;130℃
・真空引き時間;5分
・プレス保持時間;5分
・圧力条件;1st(30kPa)、2nd(60kPa)、3rd(70kPa)
・冷却ファン;使用せず
実施例1において、ラミネート設定温度を130℃から150℃に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用する封止材(B)をB-1からB-2に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-2に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例4において、ラミネート設定温度を130℃から150℃に変更した以外は、実施例4と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-3に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例6において、使用する封止材(B)をB-1からB-2に、ラミネート設定温度を130℃から150℃に変更した以外は、実施例6と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-4に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-5に、また、使用する封止材(B)をB-1からB-2、ラミネート設定温度を130℃から150℃に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-6(バックシート-封止材一体型シート)、また、使用する封止材(B)をB-1からB-2とし、構成をガラス/封止材(B)/セル/バックシート(A)(バックシート-封止材一体型シート)に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、封止材(B)をB-1からB-2に、ラミネート設定温度を130℃から150℃に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例5において、封止材(B)をB-1からB-2に変更した以外は、実施例5と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例8において、封止材(B)をB-1からB-2に、ラミネート設定温度を130℃から150℃に変更した以外は、実施例8と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例8において、封止材(B)をB-1からB-2に変更した以外は、実施例8と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表1に示す。
実施例1において、使用するバックシート(A)をA-1からA-3に、また、使用する封止材(B)をB-1からB-3に変更した以外は、実施例1と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例11において、使用するバックシート(A)をA-3からA-1に、使用する封止材(B)をB-3からB-4に変更した以外は、実施例11と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例12において、使用するバックシート(A)をA-1からA-7に変更した以外は、実施例12と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例13において、使用する封止材(B)をB-4からB-5に変更した以外は、実施例13と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例12において、使用するバックシート(A)をA-1からA-8(バックシート-封止材一体型シート)とし、構成をガラス/封止材(B)/セル/バックシート(A)(バックシート-封止材一体型シート)に変更した以外は、実施例12と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例11において、使用する封止材(B)をB-3からB-6に変更した以外は、実施例11と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例12において、使用する封止材(B)をB-4からB-6に変更した以外は、実施例12と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
実施例12において、使用する封止材(B)をB-4からB-7に、ラミネート設定温度を130℃から150℃に変更した以外は、実施例12と同様にして、太陽電池モジュールを3枚作製し、ラミネート外観の評価を行った。結果を表2に示す。
また、ラミネート設定温度におけるバックシートの収縮応力と封止材のせん断弾性率という基礎的な物性を測定することにより、太陽電池モジュールを実際にラミネートする前に、仕上がり外観の予測が可能となる。さらに、効率的にラミネート条件を設定できることから、条件検討に要する時間と各種部材の費用が抑制され、結果、太陽電池モジュールの製造コストを大幅に低減させることが期待できる。
12A,12B・・・封止樹脂層
14A,14B・・・太陽電池素子
16・・・バックシート
18・・・ジャンクションボックス
20・・・配線
Claims (18)
- 少なくとも、バックシート(A)と、封止材(B)とがラミネートされてなる太陽電池モジュールであって、ラミネート設定温度における下記バックシート(A)の収縮応力(σ(A))(Pa)と下記封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が60.0以下であることを特徴とする太陽電池モジュール。
バックシート(A)の収縮応力(σ(A)):ラミネート設定温度におけるバックシート(A)の測定値(Pa)
封止材(B)のせん断弾性率(G´(B)):ラミネート設定温度における振動周波数1Hzでの封止材(B)の測定値(Pa) - ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が0.01以上、60.0以下であることを特徴とする請求項1に記載の太陽電池モジュール。
- ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が0.01以上、35.0以下であることを特徴とする請求項1に記載の太陽電池モジュール。
- ラミネート設定温度におけるバックシート(A)の収縮応力(σ(A))(Pa)と封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が1.0以上、20.0以下であることを特徴とする請求項1に記載の太陽電池モジュール。
- 封止材(B)の振動周波数10Hz、温度20℃における貯蔵弾性率(E´)が1~100MPaであることを特徴とする請求項1~4のいずれか1項に記載の太陽電池モジュール。
- 封止材(B)がエチレンと炭素数3~20のα-オレフィンとの共重合体を主成分とする封止材であることを特徴とする請求項1~5のいずれか1項に記載の太陽電池モジュール。
- 封止材(B)が、バックシート(A)の内側に用いられてなることを特徴とする請求項1~6のいずれか1項に記載の太陽電池モジュール。
- 封止材(B)が、さらに下記条件(P)を満足することを特徴とする請求項7に記載の太陽電池モジュール。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する - 封止材(B)を構成する樹脂組成物に含有されるオレフィン系重合体(X)とオレフィン系重合体(Y)の混合質量比が95~55/5~45であることを特徴とする請求項8に記載の太陽電池モジュール。
- 封止材(B)を構成する樹脂組成物に含有されるオレフィン系重合体(X)のMFR(JIS K7210、温度:190℃、荷重:21.18N)が0.5g/10min以上、5g/10min未満であり、オレフィン系重合体(Y)のMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上、100g/10min以下であることを特徴とする請求項8又は9に記載の太陽電池モジュール。
- 封止材(B)が、少なくとも動的粘弾性測定における振動周波数10Hz、温度20℃の貯蔵弾性率(E´)が100MPa未満である軟質層、及び動的粘弾性測定における振動周波数10Hz、温度20℃の貯蔵弾性率(E´)が100MPa以上である硬質層を有する積層構成であることを特徴とする請求項1~10のいずれか1項に記載の太陽電池モジュール。
- 封止材(B)が実質的に架橋しない封止材であることを特徴とする請求項1~11のいずれか1項に記載の太陽電池モジュール。
- バックシート(A)の収縮応力(σ(A))が130℃および150℃において、7×105Pa以下であることを特徴とする請求項1~12のいずれか1項に記載の太陽電池モジュール。
- バックシート(A)の収縮応力(σ(A))が130℃および150℃において、4×105Pa以下であることを特徴とする請求項1~12のいずれか1項に記載の太陽電池モジュール。
- バックシート(A)と封止材(B)が一体化している部材であることを特徴とする請求項1~14のいずれか1項に記載の太陽電池モジュール。
- ラミネート設定温度が100℃以上、135℃以下であることを特徴とする請求項1~15のいずれか1項に記載の太陽電池モジュールの製造方法。
- 少なくとも、バックシート(A)と、封止材(B)とを備えた太陽電池モジュール用バックシート-封止材一体型シートであって、ラミネート設定温度における下記バックシート(A)の収縮応力(σ(A))(Pa)と下記封止材(B)のせん断弾性率(G´(B))(Pa)の比(σ(A)/G´(B))が60.0以下であることを特徴とする太陽電池モジュール用バックシート-封止材一体型シート。
バックシート(A)の収縮応力(σ(A)):ラミネート設定温度におけるバックシート(A)の測定値(Pa)
封止材(B)のせん断弾性率(G´(B)):ラミネート設定温度における振動周波数1Hzでの封止材(B)の測定値(Pa) - 封止材(B)が、さらに下記条件(P)を満足することを特徴とする請求項17に記載の太陽電池モジュール用バックシート-封止材一体型シート。
条件(P);封止材(B)を構成する樹脂組成物が、MFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min未満であるオレフィン系重合体(X)とMFR(JIS K7210、温度:190℃、荷重:21.18N)が5g/10min以上であるオレフィン系重合体(Y)とを含有する
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147019362A KR20140117403A (ko) | 2012-01-13 | 2013-01-10 | 외관이 양호한 태양 전지 모듈 및 그의 제조 방법 |
EP13736248.9A EP2804223A4 (en) | 2012-01-13 | 2013-01-10 | SOLAR CELL MODULE WITH EXCELLENT APPEARANCE AND METHOD OF MANUFACTURING THEREOF |
US14/371,862 US20140360560A1 (en) | 2012-01-13 | 2013-01-10 | Solar cell module having excellent appearance and method for manufacturing same |
CN201380005254.6A CN104040730B (zh) | 2012-01-13 | 2013-01-10 | 外观良好的太阳能电池组件及其制造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012005339 | 2012-01-13 | ||
JP2012-005342 | 2012-01-13 | ||
JP2012-005339 | 2012-01-13 | ||
JP2012005342 | 2012-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013105616A1 true WO2013105616A1 (ja) | 2013-07-18 |
Family
ID=48781558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/050339 WO2013105616A1 (ja) | 2012-01-13 | 2013-01-10 | 外観が良好な太陽電池モジュール及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140360560A1 (ja) |
EP (1) | EP2804223A4 (ja) |
KR (1) | KR20140117403A (ja) |
CN (1) | CN104040730B (ja) |
TW (1) | TW201335262A (ja) |
WO (1) | WO2013105616A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015068558A1 (ja) * | 2013-11-05 | 2015-05-14 | 三菱樹脂株式会社 | 粘着剤組成物 |
JP2015093974A (ja) * | 2013-11-14 | 2015-05-18 | 三菱樹脂株式会社 | 封止材及びそれを用いて作製された太陽電池モジュール |
US20170373209A1 (en) * | 2015-01-23 | 2017-12-28 | Yparex B.V. | Electronic device module |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6347398B2 (ja) * | 2012-03-30 | 2018-06-27 | 三菱ケミカル株式会社 | 複合中空糸膜及び中空糸膜モジュール |
CN103441162B (zh) * | 2013-09-06 | 2016-04-13 | 苏州柯莱美高分子材料科技有限公司 | 太阳能电池组件的太阳能背板以及太阳能电池组件 |
US20160162616A1 (en) * | 2014-03-27 | 2016-06-09 | King Fahd University Of Petroleum And Minerals | Performance and life prediction model for photovoltaic module: effect of encapsulant constitutive behavior |
TWI644933B (zh) * | 2014-09-18 | 2018-12-21 | 柏列利斯股份公司 | 用於層元件之層的聚合物組成物 |
JP2017531066A (ja) * | 2014-09-18 | 2017-10-19 | ボレアリス エージー | 層エレメントの層のためのポリマー組成物 |
TWI609908B (zh) * | 2014-09-18 | 2018-01-01 | 柏列利斯股份公司 | 用於層元件之層的聚合物組成物 |
TWI615431B (zh) * | 2014-09-18 | 2018-02-21 | 柏列利斯股份公司 | 用於層元件之層的聚合物組成物 |
EP3139417A1 (en) * | 2015-09-03 | 2017-03-08 | Borealis AG | Polyethylene composition for a layer element of a photovoltaic module |
WO2017211503A1 (en) | 2016-06-09 | 2017-12-14 | Solvay Specialty Polymers Italy S.P.A. | Multilayer assembly comprising silane-grafted polyolefin |
US9902242B1 (en) * | 2016-11-14 | 2018-02-27 | Ford Global Technologies, Llc | Moon roof assembly with integral hybrid solar trim panel |
IT201800003834A1 (it) * | 2018-03-22 | 2019-09-22 | Naizil S R L | Metodo di realizzazione di un prodotto laminare fotovoltaico flessibile |
TW201945190A (zh) | 2018-04-16 | 2019-12-01 | 奧地利商柏列利斯股份公司 | 多層元件 |
EP3782200A1 (en) * | 2018-04-16 | 2021-02-24 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method of manufacturing a photovotaic module |
CN111954934A (zh) * | 2018-04-16 | 2020-11-17 | 瑞士电子显微技术研究与开发中心股份有限公司 | 制造光伏模组的方法 |
CN111403516A (zh) * | 2018-12-28 | 2020-07-10 | 汉能移动能源控股集团有限公司 | 太阳能电池组件及太阳能电池组件的制备方法 |
CN109920869B (zh) * | 2019-02-27 | 2021-08-20 | 黄山天马新材料科技有限公司 | 含有硅烷偶联剂光伏组件背面高性能保护膜及其制备方法 |
CN115149217B (zh) * | 2021-03-30 | 2023-11-14 | 京东方科技集团股份有限公司 | 柔性电极、显示装置及可穿戴设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005090426A1 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for higher olefin multi-block copolymer formation |
WO2005090427A2 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for ethylene multi-block copolymer formation |
WO2005090425A1 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for ethylene copolymer formation |
JP2006324556A (ja) | 2005-05-20 | 2006-11-30 | Toppan Printing Co Ltd | 太陽電池用バックシートおよびそれを用いた太陽電池モジュール |
JP2007150084A (ja) | 2005-11-29 | 2007-06-14 | Dainippon Printing Co Ltd | 太陽電池モジュール用裏面保護シート、太陽電池モジュール用裏面積層体、および、太陽電池モジュール |
JP2011114262A (ja) * | 2009-11-30 | 2011-06-09 | Dainippon Printing Co Ltd | 裏面一体化シート及びそれを使用した太陽電池モジュールの製造方法 |
JP2011159709A (ja) * | 2010-01-29 | 2011-08-18 | Asahi Kasei E-Materials Corp | 樹脂封止シート及び太陽電池モジュール |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140343A1 (ja) * | 2009-06-01 | 2010-12-09 | 三井化学株式会社 | エチレン系樹脂組成物、太陽電池封止材およびそれを用いた太陽電池モジュール |
KR101097009B1 (ko) * | 2009-07-17 | 2011-12-20 | 미쓰비시 쥬시 가부시끼가이샤 | 태양 전지 봉지재 및 그것을 이용하여 제작된 태양 전지 모듈 |
JP2011049228A (ja) * | 2009-08-25 | 2011-03-10 | Dainippon Printing Co Ltd | 太陽電池モジュール用裏面一体化シート |
FR2974243B1 (fr) * | 2011-04-18 | 2013-04-12 | Arkema France | Film bi-couches d'un module photovoltaique |
-
2013
- 2013-01-10 US US14/371,862 patent/US20140360560A1/en not_active Abandoned
- 2013-01-10 EP EP13736248.9A patent/EP2804223A4/en not_active Withdrawn
- 2013-01-10 WO PCT/JP2013/050339 patent/WO2013105616A1/ja active Application Filing
- 2013-01-10 CN CN201380005254.6A patent/CN104040730B/zh not_active Expired - Fee Related
- 2013-01-10 KR KR1020147019362A patent/KR20140117403A/ko not_active Application Discontinuation
- 2013-01-11 TW TW102101052A patent/TW201335262A/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005090426A1 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for higher olefin multi-block copolymer formation |
WO2005090427A2 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for ethylene multi-block copolymer formation |
WO2005090425A1 (en) | 2004-03-17 | 2005-09-29 | Dow Global Technologies Inc. | Catalyst composition comprising shuttling agent for ethylene copolymer formation |
JP2006324556A (ja) | 2005-05-20 | 2006-11-30 | Toppan Printing Co Ltd | 太陽電池用バックシートおよびそれを用いた太陽電池モジュール |
JP2007150084A (ja) | 2005-11-29 | 2007-06-14 | Dainippon Printing Co Ltd | 太陽電池モジュール用裏面保護シート、太陽電池モジュール用裏面積層体、および、太陽電池モジュール |
JP2011114262A (ja) * | 2009-11-30 | 2011-06-09 | Dainippon Printing Co Ltd | 裏面一体化シート及びそれを使用した太陽電池モジュールの製造方法 |
JP2011159709A (ja) * | 2010-01-29 | 2011-08-18 | Asahi Kasei E-Materials Corp | 樹脂封止シート及び太陽電池モジュール |
Non-Patent Citations (1)
Title |
---|
See also references of EP2804223A4 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015068558A1 (ja) * | 2013-11-05 | 2015-05-14 | 三菱樹脂株式会社 | 粘着剤組成物 |
JPWO2015068558A1 (ja) * | 2013-11-05 | 2017-03-09 | 三菱樹脂株式会社 | 粘着剤組成物 |
JP2015093974A (ja) * | 2013-11-14 | 2015-05-18 | 三菱樹脂株式会社 | 封止材及びそれを用いて作製された太陽電池モジュール |
US20170373209A1 (en) * | 2015-01-23 | 2017-12-28 | Yparex B.V. | Electronic device module |
JP2018508127A (ja) * | 2015-01-23 | 2018-03-22 | イパレックス ベスローテン フェンノートシャップ | 電子デバイスモジュール |
US10903381B2 (en) * | 2015-01-23 | 2021-01-26 | Yparex B.V. | Electronic device module |
JP7059011B2 (ja) | 2015-01-23 | 2022-04-25 | イパレックス ベスローテン フェンノートシャップ | 電子デバイスモジュール |
Also Published As
Publication number | Publication date |
---|---|
EP2804223A4 (en) | 2015-10-21 |
US20140360560A1 (en) | 2014-12-11 |
KR20140117403A (ko) | 2014-10-07 |
CN104040730A (zh) | 2014-09-10 |
TW201335262A (zh) | 2013-09-01 |
CN104040730B (zh) | 2017-03-08 |
TWI560231B (ja) | 2016-12-01 |
EP2804223A1 (en) | 2014-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013105616A1 (ja) | 外観が良好な太陽電池モジュール及びその製造方法 | |
JP5396556B1 (ja) | 太陽電池モジュール及びその製造方法 | |
JP5625060B2 (ja) | 太陽電池封止材及びそれを用いて作製された太陽電池モジュール | |
JP2013165263A (ja) | 外観が良好な太陽電池モジュール及びその製造方法 | |
US8865835B2 (en) | Solar cell sealing material and solar cell module produced using the same | |
KR102004567B1 (ko) | 태양 전지용 봉지 시트 | |
WO2012029464A1 (ja) | 太陽電池封止材及びそれを用いて作製された太陽電池モジュール | |
JP2015162498A (ja) | 太陽電池封止材用積層体、太陽電池封止材及び太陽電池モジュール | |
JP6364811B2 (ja) | 太陽電池モジュール | |
JP5759875B2 (ja) | 太陽電池封止材及びそれを用いて作製された太陽電池モジュール | |
JP2013165264A (ja) | 外観が良好な太陽電池モジュール及びその製造方法 | |
JP2014204090A (ja) | 太陽電池封止材及びそれを用いて作製された太陽電池モジュール | |
JP6747474B2 (ja) | 太陽電池モジュール | |
JP6155680B2 (ja) | 太陽電池モジュールの製造方法及び該製造方法によって製造された太陽電池モジュール | |
JP6427871B2 (ja) | 太陽電池モジュール | |
JP6277839B2 (ja) | 太陽電池封止材およびこれを用いた太陽電池モジュール | |
JP6314535B2 (ja) | 太陽電池モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13736248 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20147019362 Country of ref document: KR Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2013736248 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013736248 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |