WO2013051689A1 - 半導電性ゴム組成物 - Google Patents
半導電性ゴム組成物 Download PDFInfo
- Publication number
- WO2013051689A1 WO2013051689A1 PCT/JP2012/075925 JP2012075925W WO2013051689A1 WO 2013051689 A1 WO2013051689 A1 WO 2013051689A1 JP 2012075925 W JP2012075925 W JP 2012075925W WO 2013051689 A1 WO2013051689 A1 WO 2013051689A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rubber
- copper
- semiconductive
- weight
- rubber composition
- Prior art date
Links
- 229920001971 elastomer Polymers 0.000 title claims abstract description 120
- 239000005060 rubber Substances 0.000 title claims abstract description 120
- 239000000203 mixture Substances 0.000 title claims abstract description 53
- 229920000570 polyether Polymers 0.000 claims abstract description 45
- 239000005749 Copper compound Substances 0.000 claims abstract description 30
- 150000001880 copper compounds Chemical class 0.000 claims abstract description 30
- -1 oxirane compound Chemical class 0.000 claims abstract description 30
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 25
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 23
- 229920000459 Nitrile rubber Polymers 0.000 claims description 13
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 229920002943 EPDM rubber Polymers 0.000 claims description 10
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 7
- 239000005751 Copper oxide Substances 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 7
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 7
- 150000001879 copper Chemical class 0.000 claims description 7
- 229910000431 copper oxide Inorganic materials 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000006258 conductive agent Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 239000004709 Chlorinated polyethylene Substances 0.000 claims description 5
- 229920005549 butyl rubber Polymers 0.000 claims description 5
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 claims description 5
- 229920006168 hydrated nitrile rubber Polymers 0.000 claims description 5
- 229920003049 isoprene rubber Polymers 0.000 claims description 5
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 claims description 4
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 4
- 239000005750 Copper hydroxide Substances 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 4
- 229940116318 copper carbonate Drugs 0.000 claims description 4
- 229910001956 copper hydroxide Inorganic materials 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 4
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 4
- ZOUQIAGHKFLHIA-UHFFFAOYSA-L copper;n,n-dimethylcarbamodithioate Chemical compound [Cu+2].CN(C)C([S-])=S.CN(C)C([S-])=S ZOUQIAGHKFLHIA-UHFFFAOYSA-L 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- 244000043261 Hevea brasiliensis Species 0.000 claims description 3
- 229920000800 acrylic rubber Polymers 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 3
- 229920002681 hypalon Polymers 0.000 claims description 3
- 229920003052 natural elastomer Polymers 0.000 claims description 3
- 229920001194 natural rubber Polymers 0.000 claims description 3
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 241000894007 species Species 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 239000004636 vulcanized rubber Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000010186 staining Methods 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000011777 magnesium Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000004073 vulcanization Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000007600 charging Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000010457 zeolite Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 5
- 239000011593 sulfur Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920003051 synthetic elastomer Polymers 0.000 description 4
- 239000005061 synthetic rubber Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical class O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 108091008695 photoreceptors Proteins 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 150000003751 zinc Chemical class 0.000 description 3
- XGIDEUICZZXBFQ-UHFFFAOYSA-N 1h-benzimidazol-2-ylmethanethiol Chemical compound C1=CC=C2NC(CS)=NC2=C1 XGIDEUICZZXBFQ-UHFFFAOYSA-N 0.000 description 2
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical class C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 2
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 235000011116 calcium hydroxide Nutrition 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- 235000012255 calcium oxide Nutrition 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000012990 dithiocarbamate Substances 0.000 description 2
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229960001545 hydrotalcite Drugs 0.000 description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 235000012254 magnesium hydroxide Nutrition 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 235000012245 magnesium oxide Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 235000014692 zinc oxide Nutrition 0.000 description 2
- YAPRWCFMWHUXRS-UHFFFAOYSA-N (2-hydroxyphenyl) propanoate Chemical compound CCC(=O)OC1=CC=CC=C1O YAPRWCFMWHUXRS-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- NJYFRQQXXXRJHK-UHFFFAOYSA-N (4-aminophenyl) thiocyanate Chemical compound NC1=CC=C(SC#N)C=C1 NJYFRQQXXXRJHK-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- UDYXMTORTDACTG-UHFFFAOYSA-N 1,1,3-tributylthiourea Chemical compound CCCCNC(=S)N(CCCC)CCCC UDYXMTORTDACTG-UHFFFAOYSA-N 0.000 description 1
- JQATXHUBFFGLDW-UHFFFAOYSA-N 1,3-bis(dimethylamino)propylthiourea Chemical compound CN(C(CCN(C)C)NC(=S)N)C JQATXHUBFFGLDW-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical class C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 1
- YXUGBTHHXGQXPO-UHFFFAOYSA-N 1-tert-butylperoxy-3-(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 YXUGBTHHXGQXPO-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- WHQOKFZWSDOTQP-UHFFFAOYSA-N 2,3-dihydroxypropyl 4-aminobenzoate Chemical compound NC1=CC=C(C(=O)OCC(O)CO)C=C1 WHQOKFZWSDOTQP-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical group CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- CZNRFEXEPBITDS-UHFFFAOYSA-N 2,5-bis(2-methylbutan-2-yl)benzene-1,4-diol Chemical compound CCC(C)(C)C1=CC(O)=C(C(C)(C)CC)C=C1O CZNRFEXEPBITDS-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- UDFARPRXWMDFQU-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(3,5-ditert-butyl-4-hydroxyphenyl)methylsulfanylmethyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CSCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 UDFARPRXWMDFQU-UHFFFAOYSA-N 0.000 description 1
- VMZVBRIIHDRYGK-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VMZVBRIIHDRYGK-UHFFFAOYSA-N 0.000 description 1
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 1
- MPNXSZJPSVBLHP-UHFFFAOYSA-N 2-chloro-n-phenylpyridine-3-carboxamide Chemical compound ClC1=NC=CC=C1C(=O)NC1=CC=CC=C1 MPNXSZJPSVBLHP-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- YEXMEDXSVBEXGZ-UHFFFAOYSA-N 2-tert-butylperoxy-2-methylpropane;2-methylpropanoic acid Chemical compound CC(C)C(O)=O.CC(C)(C)OOC(C)(C)C YEXMEDXSVBEXGZ-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- FQSGABVFCIJNRI-UHFFFAOYSA-N 4-methylbenzenesulfonamide N-phenylaniline Chemical compound C1(=CC=CC=C1)NC1=CC=CC=C1.C1(=CC=C(C=C1)S(=O)(=O)N)C FQSGABVFCIJNRI-UHFFFAOYSA-N 0.000 description 1
- ZZMVLMVFYMGSMY-UHFFFAOYSA-N 4-n-(4-methylpentan-2-yl)-1-n-phenylbenzene-1,4-diamine Chemical compound C1=CC(NC(C)CC(C)C)=CC=C1NC1=CC=CC=C1 ZZMVLMVFYMGSMY-UHFFFAOYSA-N 0.000 description 1
- QNCROBVCGOMSRR-UHFFFAOYSA-N 4-n-octylbenzene-1,4-diamine Chemical compound CCCCCCCCNC1=CC=C(N)C=C1 QNCROBVCGOMSRR-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- NLRVQGZDJHUKOM-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethoxy)cyclohexa-1,3-dien-1-ol Chemical compound C(CCCCCCC)SCOC1(CC(=CC=C1O)OCSCCCCCCCC)C NLRVQGZDJHUKOM-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- MUYBDFUGOVXYHM-UHFFFAOYSA-N CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 MUYBDFUGOVXYHM-UHFFFAOYSA-N 0.000 description 1
- 229910021594 Copper(II) fluoride Inorganic materials 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000003 Lead carbonate Inorganic materials 0.000 description 1
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical class C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ORLLXADIRYXLCH-UHFFFAOYSA-L [K].[Cu](Br)Br Chemical compound [K].[Cu](Br)Br ORLLXADIRYXLCH-UHFFFAOYSA-L 0.000 description 1
- REDUMNSTOASOGZ-UHFFFAOYSA-N [Sn].P(O)(O)O Chemical compound [Sn].P(O)(O)O REDUMNSTOASOGZ-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- PYSZASIZWHHPHJ-UHFFFAOYSA-L calcium;phthalate Chemical compound [Ca+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O PYSZASIZWHHPHJ-UHFFFAOYSA-L 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- GXROCGVLAIXUAF-UHFFFAOYSA-N copper octan-1-ol Chemical compound [Cu].CCCCCCCCO GXROCGVLAIXUAF-UHFFFAOYSA-N 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- GWFAVIIMQDUCRA-UHFFFAOYSA-L copper(ii) fluoride Chemical compound [F-].[F-].[Cu+2] GWFAVIIMQDUCRA-UHFFFAOYSA-L 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- LLVVIWYEOKVOFV-UHFFFAOYSA-L copper;diiodate Chemical compound [Cu+2].[O-]I(=O)=O.[O-]I(=O)=O LLVVIWYEOKVOFV-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- BQVVSSAWECGTRN-UHFFFAOYSA-L copper;dithiocyanate Chemical compound [Cu+2].[S-]C#N.[S-]C#N BQVVSSAWECGTRN-UHFFFAOYSA-L 0.000 description 1
- JDPSPYBMORZJOD-UHFFFAOYSA-L copper;dodecanoate Chemical compound [Cu+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O JDPSPYBMORZJOD-UHFFFAOYSA-L 0.000 description 1
- IXPUJMULXNNEHS-UHFFFAOYSA-L copper;n,n-dibutylcarbamodithioate Chemical compound [Cu+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC IXPUJMULXNNEHS-UHFFFAOYSA-L 0.000 description 1
- QBKDWKSJOQUIQN-UHFFFAOYSA-L copper;n,n-diethylcarbamate Chemical compound [Cu+2].CCN(CC)C([O-])=O.CCN(CC)C([O-])=O QBKDWKSJOQUIQN-UHFFFAOYSA-L 0.000 description 1
- ZISLUDLMVNEAHK-UHFFFAOYSA-L copper;terephthalate Chemical compound [Cu+2].[O-]C(=O)C1=CC=C(C([O-])=O)C=C1 ZISLUDLMVNEAHK-UHFFFAOYSA-L 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- PCERBVBQNKZCFS-UHFFFAOYSA-N dibenzylcarbamodithioic acid Chemical compound C=1C=CC=CC=1CN(C(=S)S)CC1=CC=CC=C1 PCERBVBQNKZCFS-UHFFFAOYSA-N 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 150000004659 dithiocarbamates Chemical class 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002084 enol ethers Chemical class 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 description 1
- 235000019285 ethoxyquin Nutrition 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- OCWMFVJKFWXKNZ-UHFFFAOYSA-L lead(2+);oxygen(2-);sulfate Chemical compound [O-2].[O-2].[O-2].[Pb+2].[Pb+2].[Pb+2].[Pb+2].[O-]S([O-])(=O)=O OCWMFVJKFWXKNZ-UHFFFAOYSA-L 0.000 description 1
- YJOMWQQKPKLUBO-UHFFFAOYSA-L lead(2+);phthalate Chemical compound [Pb+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O YJOMWQQKPKLUBO-UHFFFAOYSA-L 0.000 description 1
- UMKARVFXJJITLN-UHFFFAOYSA-N lead;phosphorous acid Chemical compound [Pb].OP(O)O UMKARVFXJJITLN-UHFFFAOYSA-N 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- MCVFFRWZNYZUIJ-UHFFFAOYSA-M lithium;trifluoromethanesulfonate Chemical compound [Li+].[O-]S(=O)(=O)C(F)(F)F MCVFFRWZNYZUIJ-UHFFFAOYSA-M 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NCLUCMXMAPDFGT-UHFFFAOYSA-L n,n-diethylcarbamodithioate;nickel(2+) Chemical compound [Ni+2].CCN(CC)C([S-])=S.CCN(CC)C([S-])=S NCLUCMXMAPDFGT-UHFFFAOYSA-L 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- HTSABAUNNZLCMN-UHFFFAOYSA-F paris green Chemical compound [Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-][As]=O.[O-][As]=O.[O-][As]=O.[O-][As]=O.[O-][As]=O.[O-][As]=O.CC([O-])=O.CC([O-])=O HTSABAUNNZLCMN-UHFFFAOYSA-F 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- FFIUNPRXUCRYFU-UHFFFAOYSA-N tert-butyl pentaneperoxoate Chemical compound CCCCC(=O)OOC(C)(C)C FFIUNPRXUCRYFU-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- KBLZDCFTQSIIOH-UHFFFAOYSA-M tetrabutylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC KBLZDCFTQSIIOH-UHFFFAOYSA-M 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- GFVKHYGXCQWRON-UHFFFAOYSA-N tributyl(ethyl)azanium Chemical compound CCCC[N+](CC)(CCCC)CCCC GFVKHYGXCQWRON-UHFFFAOYSA-N 0.000 description 1
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 description 1
- PIVZYJMLIVYZJA-UHFFFAOYSA-M trioctyl(propyl)azanium;bromide Chemical compound [Br-].CCCCCCCC[N+](CCC)(CCCCCCCC)CCCCCCCC PIVZYJMLIVYZJA-UHFFFAOYSA-M 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
- G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
- G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
- G03G15/162—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support details of the the intermediate support, e.g. chemical composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Definitions
- the semiconductive rubber composition and the vulcanized product of the present invention are used as a member for a semiconductive roller or belt for development, charging, transfer, etc. of an electrophotographic process in a copying machine printer or the like due to its semiconductive characteristics. in use.
- the semiconductive rubber material rubbers such as acrylonitrile butadiene rubber, ethylene propylene diene rubber, and chloroprene rubber are known. Although these semiconductive rubber materials have excellent wear resistance, they have high volume resistivity. There was a problem. Therefore, as a rubber component used for a semiconductive rubber material other than the above, a polyether polymer obtained by polymerizing an oxirane compound is known.
- a semiconductive rubber material vulcanized with an organic peroxide is a semiconductive material obtained by vulcanizing with sulfur. It is generally known that a photoreceptor is less contaminated than a rubber material (see Patent Document 1).
- the semiconductive rubber material vulcanized with an organic peroxide is a semiconductive rubber vulcanized with sulfur in terms of volume resistivity and environmental dependency. It turned out to be inferior to the material. Therefore, in the invention described in Patent Document 1, it is difficult to provide a semiconductive rubber material that has recently been required in the market and has a low volume resistivity and a low volume resistivity environment dependency. Met.
- the present invention has been made against the background of the above circumstances.
- a semiconductive rubber composition and a vulcanized product thereof which have low contamination and volume resistivity after vulcanization and have a small volume resistivity environment dependency.
- the purpose is to provide.
- the semiconductive rubber composition according to the present invention contains (a) a polyether polymer obtained by polymerizing an oxirane compound, (b) a copper compound, and (c) an organic peroxide as a rubber component.
- a rubber component containing a polyether polymer obtained by polymerizing an oxirane compound, (b) a copper compound, and (c) an organic peroxide are used in combination.
- the polyether polymer contains at least two units selected from ethylene oxide, propylene oxide, epichlorohydrin, and allyl glycidyl ether as constituent units.
- the copper compound (b) is an inorganic copper compound selected from copper oxide, copper hydroxide, copper carbonate, copper chloride, copper sulfide and copper sulfate, copper of carboxylic acid It is preferably at least one selected from a salt and a copper salt of dithiocarbamic acid, more preferably at least one selected from copper oxide, copper stearate, and copper dimethyldithiocarbamate.
- the rubber component may contain only a polyether polymer obtained by polymerizing an oxirane compound, and a rubber type other than the polyether polymer may be used. Further, it may be contained.
- the amount of (b) copper compound is preferably 0.5 parts by weight or less with respect to 100 parts by weight of (a) rubber component.
- the content of the organic peroxide (c) relative to 100 parts by weight of the rubber component (a) is X parts by weight, and the theoretical active oxygen content of the organic peroxide (c) is Y (%), 0.4 ⁇ X ⁇ Y ⁇ 200 It is preferable that
- the semiconductive rubber composition of the present invention contains (a) a rubber component containing a polyether polymer obtained by polymerizing an oxirane compound, (b) a copper compound, and (c) an organic peroxide. It is preferable to add a conductive agent (d) to the featured semiconductive rubber composition.
- the rubber component preferably contains 10% by weight or more of a polyether polymer obtained by polymerizing an oxirane compound, and a polyether polymer obtained by polymerizing an oxirane compound. It is preferable to contain 10 to 90% by weight of the product and 10 to 90% by weight of rubber other than the polyether polymer obtained by polymerizing the oxirane compound.
- natural rubber or synthetic rubber is exemplified as a rubber type other than the polyether polymer
- synthetic rubber includes isoprene rubber (IR), 1,2-polybutadiene (VBR). ), Styrene butadiene rubber (SBR), butyl rubber (IIR), ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), chloroprene rubber (CR), chlorosulfonated polyethylene (CSM), chlorinated polyethylene (CPE),
- acrylic rubber ACM
- ACM acrylic rubber
- NBR acrylonitrile butadiene rubber
- H-NBR hydrogenated acrylonitrile butadiene rubber
- EPDM ethylene propylene rubber
- NBR
- the (a) rubber component preferably contains 10% by weight or more of a polyether polymer, more preferably 30% by weight or more, and 70% by weight or more. It is particularly preferred to contain, and most preferably 90% by weight or more.
- the semiconductive rubber material obtained by vulcanizing the semiconductive rubber composition of the present invention becomes a semiconductive rubber roll or a semiconductive endless rubber belt, and is mainly used as an electrophotographic equipment material.
- the semiconductive rubber vulcanizate obtained by the present invention has low contamination and volume resistivity, and the volume resistivity is less dependent on the environment. For this reason, such a semiconductive rubber vulcanizate is very useful for semiconductive rubber rolls and belts of copying machines, printers and the like.
- the semiconductive rubber composition of the present invention comprises (a) a polyether component obtained by polymerizing an oxirane compound, (b) a copper compound, and (c) an organic peroxide as a rubber component. And a semiconductive rubber composition.
- Examples of polyether polymers (rubbers) obtained by polymerizing oxirane compounds used in the present invention include alkylene oxides such as ethylene oxide, propylene oxide, and n-butylene oxide, methyl glycidyl ether, ethyl glycidyl ether, n -Homopolymers or copolymers of compounds selected from glycidyl ethers such as glycidyl ether, allyl glycidyl ether, phenyl glycidyl ether, epihalohydrins such as epichlorohydrin, epibromohydrin, styrene oxide, etc.
- a combination or a copolymer can be used alone or in combination of two or more.
- the polyether polymer obtained by polymerizing the oxirane compound preferably contains two units selected from epichlorohydrin, propylene oxide, ethylene oxide, and allyl glycidyl ether as structural units, and units of ethylene oxide and allyl glycidyl ether.
- a unit of epichlorohydrin, ethylene oxide and allyl glycidyl ether is included in the structural unit.
- the constitutional unit based on ethylene oxide is preferably 50 to 85 mol%, more preferably 58 to 80 mol% based on the total polymerization units. Preferably, it is 65 to 75 mol%.
- the constitutional unit based on allyl glycidyl ether is preferably 1 to 15 mol%, preferably 2 to 12 mol%, based on the total polymerization units. More preferred is 3 to 10 mol%.
- the constitutional unit based on epichlorohydrin is preferably 10 to 45 mol%, more preferably 15 to 35 mol%, based on the total polymerization units. 20 to 30 mol% is particularly preferable.
- the semiconductive rubber composition of the present invention when the total amount of the rubber component is 100 parts by weight, it is preferable to contain 10% by weight or more of a polyether polymer obtained by polymerizing an oxirane compound. It is more preferably 30% by weight or more, particularly preferably 70% by weight or more, and most preferably 90% by weight or more.
- the rubber component may contain only a polyether polymer obtained by polymerizing an oxirane compound, and a rubber type other than the polyether polymer may be used. Further, it may be contained.
- the rubber other than the polyether polymer obtained by polymerizing the oxirane compound includes natural rubber or synthetic rubber. Examples of the synthetic rubber include isoprene rubber (IR), 1,2-polybutadiene (VBR), and styrene butadiene rubber.
- SBR butyl rubber
- IIR ethylene propylene rubber
- EPM ethylene propylene diene rubber
- EPDM chloroprene rubber
- CSM chlorosulfonated polyethylene
- CPE chlorinated polyethylene
- ACM Acrylonitrile butadiene rubber
- H-NBR hydrogenated acrylonitrile butadiene rubber
- Rukoto is preferable.
- the polyether polymer is 10 to 90% by weight in the rubber component. It is preferable to contain 90 to 10% by weight of a rubber type other than the ether polymer, 30 to 90% by weight of the polyether polymer, and 70 to 10% by weight of a rubber type other than the polyether polymer. It is more preferable to contain 70 to 90% by weight of the polyether polymer and 30 to 10% by weight of rubber types other than the polyether polymer.
- the (b) copper compound in the present invention can be used without any limitation on inorganic copper compounds and organic copper compounds. Specific examples of these include copper thiocyanate (rhodan copper), copper cyanide. (Copper bromide), copper bromide soda, copper bromide potassium, copper sulfate, copper nitrate, copper carbonate, copper iodate, copper acetoarsenite, copper pyrophosphate, copper borofluoride, copper oxide, copper hydroxide, Examples include copper peroxide, copper chloride, copper iodide, copper bromide, copper fluoride, copper carbide, copper sulfide, cupric ammonium chloride, copper azide and the like, and the organic copper compounds include copper acetate and copper octylate.
- Copper salts of carboxylic acids such as copper naphthenate, copper stearate, copper benzoate, copper laurate, copper terephthalate, copper dimethyldithiocarbamate, copper diethylcarbamate, copper dibutyldithiocarbamate, N-ethyl-N-pheny Dithiocarbamates, N- pentamethylenedithiocarbamate copper
- copper salt of dithiocarbamic acid such as dibenzyl dithiocarbamate copper
- copper phthalocyanine phthalocyanine blue, phthalocyanine green
- the copper compound (b) of the present invention is an inorganic copper compound selected from copper oxide, copper hydroxide, copper carbonate, copper chloride, copper sulfide and copper sulfate, a copper salt of carboxylic acid and a copper salt of dithiocarbamic acid.
- copper oxide, copper stearate, and copper dimethyldithiocarbamate are preferred.
- the blending amount of the (b) copper compound is preferably 0.5 parts by weight or less, more preferably 0.01 to 0.5 parts by weight with respect to 100 parts by weight of the (a) rubber component.
- the content is more preferably 0.01 to 0.3 parts by weight, and particularly preferably 0.05 to 0.1 parts by weight.
- organic peroxide (c) used for vulcanizing the semiconductive rubber composition in the present invention include tert-butyl hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, Cumene hydroperoxide, diisopropylbenzene hydroperoxide, di-tert-butyl peroxide, dicumyl peroxide, tert-butylcumyl peroxide, 1,1-tert-butylperoxycyclohexane, 2,5-dimethyl-2,5-ditert- Butylperoxyhexane, 2,5-dimethyl-2,5-ditertdibutylperoxyhexyne-3, 1,3-bistert-butylperoxyisopropylbenzene, 2,5-dimethyl-2,5-dibenzoylperoxyhexane, 1,1-bis tert- Tilperoxy-3,3,5-trimethylcyclohexane, n-but
- the compounding amount of the (c) organic peroxide is such that the content of the (c) organic peroxide is X parts by weight with respect to 100 parts by weight of the (a) rubber component, and the theoretical activity of the (c) organic peroxide.
- the oxygen amount is Y (%), 0.4 ⁇ X ⁇ Y ⁇ 200 It is preferable that 0.4 ⁇ X ⁇ Y ⁇ 100 More preferably, 0.4 ⁇ X ⁇ Y ⁇ 80 It is particularly preferred that
- the theoretical active oxygen amount is calculated by the following formula (1).
- Theoretical active oxygen amount (%) ⁇ (number of peroxide bonds in molecule ⁇ 16) / molecular weight ⁇ ⁇ 100 (1)
- a conductive agent (d) may be further added.
- the conductive agent (d) in the present invention include quaternary ammonium salts, borates, perchlorates, potassium salts, surfactants, lithium salts and the like.
- tetrabutylammonium bromide tetrabutylammonium perchlorate, ethyltributylammonium ethosulphate, sodium perchlorate, lithium perchlorate, calcium perchlorate, lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, octadecyl Examples include trimethylammonium chloride, dodecyltrimethylammonium chloride, hexadecyltrimethylammonium chloride, trioctylpropylammonium bromide, dimethylalkyllaurylbetaine, lithium trifluoromethanesulfonate, and the like, and preferably includes at least one kind.
- the content of the conductive agent (d) is preferably 0.5 to 10 parts by weight, more preferably 1 to 8 parts by weight with respect to 100 parts by weight of the rubber component (a). It is particularly preferred that the amount be ⁇ 5 parts by weight.
- metal compounds include Group II (Group 2 and Group 12) metal oxides, hydroxides, carbonates, carboxylates, silicates, borates, phosphites, and Group III of the Periodic Table. (Group 3 and Group 13) metal oxides, hydroxides, carboxylates, silicates, sulfates, nitrates, phosphates, Group IV (Groups 4 and 14) metal oxides, Examples thereof include metal compounds such as basic carbonates, basic carboxylates, basic phosphites, basic sulfites, and tribasic sulfates.
- the metal compound include magnesia, magnesium hydroxide, aluminum hydroxide, barium hydroxide, sodium carbonate, magnesium carbonate, barium carbonate, quicklime, slaked lime, calcium carbonate, calcium silicate, calcium stearate, zinc stearate, Calcium phthalate, calcium phosphite, zinc white, tin oxide, lisage, red lead, lead white, dibasic lead phthalate, dibasic lead carbonate, tin stearate, basic lead phosphite, basic phosphorous acid Tin, basic lead sulfite, tribasic lead sulfate and the like can be mentioned, and sodium carbonate, magnesia, magnesium hydroxide, quicklime, slaked lime, calcium silicate, zinc white and the like are preferable.
- the inorganic microporous crystal means a crystalline porous body and can be clearly distinguished from amorphous porous bodies such as silica gel and alumina.
- amorphous porous bodies such as silica gel and alumina.
- examples of such inorganic microporous crystals include zeolites, aluminophosphate type molecular sieves, layered silicates, synthetic hydrotalcites, alkali metal titanates and the like.
- a particularly preferred acid acceptor is synthetic hydrotalcite.
- the zeolites are natural zeolites, A-type, X-type and Y-type synthetic zeolites, sodalites, natural or synthetic mordenites, various zeolites such as ZSM-5, and metal substitutes thereof. It may be used in combination of two or more. Further, the metal of the metal substitution product is often sodium. As the zeolite, those having a large acid-accepting ability are preferable, and A-type zeolite is preferable.
- the synthetic hydrotalcite is represented by the following general formula (2).
- z is a real number from 1 to 5
- w is a real number from 0 to 10, respectively.
- hydrotalcites represented by the general formula (2) include Mg 4.5 Al 2 (OH) 13 CO 3 .3.5H 2 O, Mg 4.5 Al 2 (OH) 13 CO 3 , Mg 4 Al 2 (OH) 12 CO 3 .3.5H 2 O, Mg 6 Al 2 (OH) 16 CO 3 .4H 2 O, Mg 5 Al 2 (OH) 14 CO 3 .4H 2 O, Mg 3 Al 2 (OH) 10 CO 3 ⁇ 1.7H 2 O, Mg 3 ZnAl 2 (OH) 12 CO 3 ⁇ 3.5H 2 O, can be cited Mg 3 ZnAl 2 (OH) 12 CO 3 and the like.
- anti-aging agent used in the present invention known anti-aging agents can be used. Examples thereof include phenyl- ⁇ -naphthylamine, p-toluenesulfonylamide-diphenylamine, 4,4- ⁇ , ⁇ -dimethylbenzyldiphenylamine.
- the semiconductive rubber composition of the present invention various fillers, reinforcing agents, plasticizers, processing aids, flame retardants other than the above as long as the effects of the present invention are not impaired.
- pigments, vulcanization accelerators and the like can be optionally blended.
- any means conventionally used in the field of polymer processing can be used, for example, a mixing roll, a Banbury mixer, various kneaders, etc. can be used.
- the molding method include compression molding using a mold, extrusion molding, and injection molding. Extrusion molding and injection molding using the semiconductive rubber composition of the present invention are preferred.
- a vulcanized product using the semiconductive rubber composition of the present invention is obtained by adding a predetermined vulcanizing agent or the like to the semiconductive rubber composition and heating to 100 to 200 ° C.
- the time varies depending on the temperature, but it is usually between 0.5 and 300 minutes.
- each compounding agent shown in Tables 1 to 6 was kneaded with a pressure kneader at 120 ° C. to prepare an A kneading compound.
- This A kneaded compound was kneaded with an open roll to prepare a B kneaded compound.
- a in the table is a raw material for the A kneaded compound
- B is a raw material to be blended in the A kneaded compound when the B kneaded compound is prepared.
- a sheet of the B kneaded compound prepared above was press vulcanized at 170 ° C. for 15 minutes. After adjusting the state of the obtained crosslinked sheet in a 10 ° C./15% RH environment, a 23 ° C./50% RH environment, and a 35 ° C./85% RH environment, respectively, in accordance with JIS K6271, Using a Hiresta made by Mitsubishi Yuka Co., Ltd. using a heavy ring electrode, the volume resistivity after 1 minute application of 10 V was measured.
- the environmental variation of the volume resistivity of the present application is the logarithm of the volume resistivity in a low temperature and low humidity environment (10 ° C./15% RH environment) and the volume resistance in a high temperature and high humidity environment (35 ° C./85% RH environment). It is calculated from the difference in logarithm of the rate, and more specifically, is calculated by the following formula. log 10 (10 ° C. ⁇ 15% RH volume resistivity) ⁇ log 10 (35 ° C. ⁇ 85% RH volume resistivity)
- Tables 7 to 15 show the test results of Examples and Comparative Examples obtained from each test method.
- Examples 1 to 5 are (a) a polyether polymer obtained by polymerizing an oxirane compound as a rubber component, (b) a copper compound, ( c) By containing an organic peroxide, (b) lower resistance (especially in a low temperature and low humidity environment (10 ° C./15% RH environment) and The environmental dependency of the volume resistivity is improved under a medium temperature and medium humidity environment (23 ° C./50% RH environment). Moreover, although the comparative example 2 and the comparative example 3 replaced with (b) copper compound and used metal compounds other than (b) copper compound, compared with the comparative example 1, the fall of volume resistivity and volume resistivity The environmental dependence of was not improved.
- Comparative Example 4 and Comparative Example 5 in Table 11 use (c) sulfur instead of organic peroxide, but vulcanize rubber compositions formulated by combining sulfur and a copper compound. With rubber, the decrease in volume resistivity and the environmental dependence of volume resistivity were not improved. From these results, 1) it is expected that the vulcanized rubber of the rubber composition containing a combination of an organic peroxide and a copper compound can reduce the volume resistivity and reduce the environmental dependency of the volume resistivity. It turns out that there exists an effect which cannot be obtained. Further, since Comparative Example 4 and Comparative Example 5 use sulfur as a vulcanizing agent, the photoconductor is highly contaminated as compared with Examples 1 to 5 using an organic peroxide as a vulcanizing agent. it is conceivable that.
- Examples 6 to 12 (a) as a rubber component, in addition to a polyether polymer obtained by polymerizing an oxirane compound, a rubber type other than the polyether polymer, (b) a copper compound, (c) In the semiconductive rubber composition containing an organic peroxide, acrylonitrile butadiene rubber, chloroprene rubber, and ethylene propylene diene rubber are contained in arbitrary amounts as rubber types other than the polyether polymer. In Comparative Examples 6 to 12, the formulation of Examples 6 to 12 did not contain (b) a copper compound. From the results shown in Tables 8 and 12, Examples 6 to 12 showed lower resistance and improved environmental dependency of volume resistivity than Comparative Examples 6 to 12.
- Comparative Examples 13 to 18 in Tables 14 and 15 the rubber components were 100% by weight of acrylonitrile butadiene rubber, 100% by weight of chloroprene rubber, and 100% by weight of ethylene propylene diene rubber, respectively. There was no difference in the volume resistivity and the environmental dependency of the volume resistivity, and the volume resistivity was greatly inferior compared with Examples 6-12. In Comparative Examples 17 and 18, since “10 ° C. ⁇ 15% RH volume resistivity” and “35 ° C. ⁇ 85% RH volume resistivity” were too high and exceeded 10 13 ⁇ ⁇ cm, environmental fluctuation was measured. could not.
- contamination after vulcanization can be obtained by using a polyether polymer obtained by polymerizing an oxirane compound as a rubber component and using (b) a copper compound and (c) an organic peroxide in combination. It can be seen that it is possible to produce a semiconductive vulcanized rubber material having low properties and volume resistivity and having a small volume resistivity environment dependency.
- the semiconductive rubber composition which is the subject of the present invention is excellent in environmental dependency of volume resistivity while maintaining semiconductivity, and is used as a developing, charging and transfer roll in a laser printer and a copying machine. Widely applicable.
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Abstract
Description
(1)測定環境が低温低湿下及び高温高湿下において、半導電特性を有すること。
(2)低温低湿下、高温高湿下においても印刷特性が変わらないことが好ましいため、体積抵抗率の環境依存性が小さいこと。
(3)感光体と直接接触する部材、帯電ロール、転写ロール等に関しては、感光体の汚染性がより小さいこと。
0.4≦X×Y≦200
であることが好ましい。
オキシラン化合物を重合してなるポリエーテル系重合物としては、アリルグリシジルエーテルに基づく構成単位を全重合単位に対して、1~15モル%であることが好ましく、2~12モル%であることがより好ましく、3~10モル%であることが特に好ましい。
オキシラン化合物を重合してなるポリエーテル系重合物としては、エピクロルヒドリンに基づく構成単位を全重合単位に対して、10~45モル%であることが好ましく、15~35モル%であることがより好ましく、20~30モル%であることが特に好ましい。
0.4≦X×Y≦200
であることが好ましく、
0.4≦X×Y≦100
であることがより好ましく、
0.4≦X×Y≦80
であることが特に好ましい。理論活性酸素量は下記式(1)で算出される。
理論活性酸素量(%)={(分子中の過酸化結合数×16)/分子量}×100 (1)
MgXZnYAlZ(OH)(2(X+Y)+3Z-2)CO3・wH2O (2)
[式中、xとyはそれぞれx+y=1~10の関係を有する0~10の実数、zは1~5の実数、wは0~10の実数をそれぞれ示す。]
※1 オキシラン化合物を重合してなるポリエーテル系重合物 ダイソー株式会社製 エピクロルヒドリン-エチレンオキサイド-アリルグリシジルエーテル三元共重合体「EPION-301」
※2 白石カルシウム株式会社製、軽質炭酸カルシウム「シルバーW」
※3 日本油脂株式会社製、パークミルD(ジクミルパーオキサイド・理論活性酸素量5.92)
※4 大内新興化学工業株式会社製、ジチオカルバミン酸塩系加硫促進剤「ノクセラーTTCU」
※5 株式会社ADEKA、エステル系導電剤 「アデカサイザーLV-70」
※6 大内新興化学株式会社製 チアゾール系加硫促進剤「ノクセラーDM」
※7 大内新興化学株式会社製 チウラム系加硫促進剤「ノクセラーTS」
※8 JSR株式会社製「N250S」
※9 昭和電工株式会社製「ショウプレンWXJ」
※10 住友化学株式会社製「エスプレン505A」
前記で作成したB練りコンパウンドをシート化したものを170℃で15分プレス加硫した。得られた架橋シートを10℃/15%RH環境下、23℃/50%RH環境下、35℃/85%RH環境下、にてそれぞれ状態調整を行った後、JIS K6271に準拠し、二重リング電極を用いた三菱油化株式会社製ハイレスタを用いて、10V印加、1分後の体積抵抗率を測定した。
体積抵抗率の測定で得られた10℃/15%RH環境下、35℃/85%RH環境下、それぞれの体積抵抗率をもとに、体積抵抗率の環境変動を求めた。尚、体積抵抗率の環境変動の数値が小さいほど体積抵抗率の環境依存性が小さいことになる。本願の体積抵抗率の環境変動は低温低湿環境下(10℃/15%RH環境下)での体積抵抗率の対数と高温高湿環境下(35℃/85%RH環境下)での体積抵抗率の対数の差より算出され、より具体的には以下の計算式で算出される。
log10(10℃×15%RH体積抵抗率)-log10(35℃×85%RH体積抵抗率)
また、比較例2と比較例3は、(b)銅化合物に替えて、(b)銅化合物以外の金属化合物を用いたが、比較例1と比較して体積抵抗率の低下及び体積抵抗率の環境依存性は改善されなかった。更に、表11の比較例4及び比較例5は、(c)有機過酸化物に替えて、硫黄を用いたものであるが、硫黄と銅化合物とを組み合わせて配合したゴム組成物の加硫ゴムでは、体積抵抗率の低下及び体積抵抗率の環境依存性は改善されなかった。これらの結果から、1)有機過酸化物と銅化合物とを組み合わせて配合したゴム組成物の加硫ゴムでは、体積抵抗率を低減し、かつ体積抵抗率の環境依存性を小さくできるという予期し得ない効果を奏することがわかる。また、比較例4及び比較例5は加硫剤として硫黄を用いているために、有機過酸化物を加硫剤として用いた実施例1~5と比較して、感光体の汚染性が高いと考えられる。
Claims (14)
- (a)ゴム成分として、オキシラン化合物を重合してなるポリエーテル系重合物、(b)銅化合物、(c)有機過酸化物を含有することを特徴とする半導電性ゴム組成物。
- 前記ポリエーテル系重合物が、エチレンオキサイド、プロピレンオキサイド、エピクロルヒドリン、アリルグリシジルエーテルから選択される少なくとも二つのユニットを構成単位に含むことを特徴とする請求項1に記載の半導電性ゴム組成物。
- 前記(b)銅化合物が、酸化銅、水酸化銅、炭酸銅、塩化銅、硫化銅、硫酸銅から選択される無機銅化合物、カルボン酸の銅塩及びジチオカルバミン酸の銅塩から選択される少なくとも一種であることを特徴とする請求項1又は2に記載の半導電性ゴム組成物。
- 前記(b)銅化合物が、酸化銅、ステアリン酸銅、ジメチルジチオカルバミン酸銅から選択される少なくとも一種の銅化合物を含有することを特徴とする請求項1~3のいずれかに記載の半導電性ゴム組成物。
- 前記(a)ゴム成分として、前記ポリエーテル系重合物以外のゴム種をさらに含有することを特徴とする請求項1~4のいずれかに記載の半導電性ゴム組成物。
- 前記(b)銅化合物の配合量が、前記(a)ゴム成分100重量部に対して、0.5重量部以下であることを特徴とする請求項1~5のいずれかに記載の半導電性ゴム組成物。
- 前記(a)ゴム成分100重量部に対する前記(c)有機過酸化物の含有量をX重量部、前記(c)有機過酸化物の理論活性酸素量をY(%)としたとき、
0.4≦X×Y≦200
であることを特徴とする請求項1~6のいずれかに記載の半導電性ゴム組成物。 - 前記(a)ゴム成分100重量部中、前記ポリエーテル系重合物を10重量%以上含有することを特徴とする請求項1~7のいずれかに記載の半導電性ゴム組成物。
- 前記(a)ゴム成分100重量部中、前記ポリエーテル系重合物を10~90重量%、前記ポリエーテル系重合物以外のゴム種を10~90重量%を含有することを特徴とする請求項1~8のいずれかに記載の半導電性ゴム組成物。
- 前記ポリエーテル系重合物以外のゴム種が、天然ゴム、イソプレンゴム、1,2-ポリブタジエン、スチレンブタジエンゴム、ブチルゴム、エチレンプロピレンゴム、エチレンプロピレンジエンゴム、クロロプレンゴム、クロロスルホン化ポリエチレン、塩素化ポリエチレン、アクリルゴム、アクリロニトリルブタジエンゴム、及び水素化アクリロニトリルブタジエンゴムから選択される少なくとも1種であることを特徴とする請求項5~9のいずれかに記載の半導電性ゴム組成物。
- 更に、(d)導電剤を添加することを特徴とする請求項1~10のいずれかに記載の半導電性ゴム組成物。
- 請求項1~11のいずれかに記載の半導電性ゴム組成物を加硫してなる半導電性ゴム材料。
- 請求項12に記載の半導電性ゴム材料を用いた半導電性ゴムロール又は半導電性無端ゴムベルト。
- 請求項13に記載の半導電性ゴムロール又は半導電性無端ゴムベルトを用いてなる電子写真機器材料。
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016104269A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社大阪ソーダ | 電子写真機器部品用組成物 |
JP2017019981A (ja) * | 2015-07-15 | 2017-01-26 | 横浜ゴム株式会社 | ゴム組成物および空気入りタイヤ |
US10000623B2 (en) | 2013-11-12 | 2018-06-19 | Robinson Brothers Limited | Accelerator compositions and methods |
WO2018116723A1 (ja) * | 2016-12-22 | 2018-06-28 | Nok株式会社 | アクリロニトリル・ブタジエン共重合ゴム-エピクロロヒドリン系ゴム組成物 |
WO2019130950A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
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JP2019116566A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
WO2023210519A1 (ja) * | 2022-04-28 | 2023-11-02 | デンカ株式会社 | ゴム組成物、加硫成形体及び加硫物 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109280394A (zh) * | 2018-10-12 | 2019-01-29 | 广州德润橡胶制品有限公司 | 一种高反复充放电性的半导电硅橡胶辊筒材料及其制备方法 |
JP7404863B2 (ja) * | 2019-12-25 | 2023-12-26 | 住友ゴム工業株式会社 | 導電性ゴム組成物、導電性ゴムローラ、画像形成装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997003122A1 (fr) * | 1995-07-11 | 1997-01-30 | Nippon Zeon Co., Ltd. | Composition de caoutchouc conductrice et procede de production |
JP2006309063A (ja) * | 2005-05-02 | 2006-11-09 | Yamauchi Corp | 導電性ローラ用ゴム組成物および導電性ローラ |
JP2007099788A (ja) * | 2005-09-30 | 2007-04-19 | Daiso Co Ltd | 半導電性加硫ゴム用組成物、その加硫ゴム材料、および加硫ゴム部材 |
JP2008045031A (ja) * | 2006-08-16 | 2008-02-28 | Sumitomo Rubber Ind Ltd | 導電性熱可塑性エラストマー組成物、その製造方法及び成形物 |
JP2010174090A (ja) * | 2009-01-28 | 2010-08-12 | Nippon Zeon Co Ltd | ゴム組成物 |
JP2010180357A (ja) * | 2009-02-06 | 2010-08-19 | Sumitomo Rubber Ind Ltd | 半導電性ゴム組成物とそれを用いた半導電性ゴムローラ |
JP2011068758A (ja) * | 2009-09-25 | 2011-04-07 | Daiso Co Ltd | バイオディーゼル燃料と直接接触する成型部品を製造するための加硫用ゴム組成物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3735587B2 (ja) * | 2002-05-30 | 2006-01-18 | 株式会社東芝 | 配線ガイドラインチェックシステム |
-
2012
- 2012-10-05 KR KR1020147010672A patent/KR101918614B1/ko active IP Right Grant
- 2012-10-05 WO PCT/JP2012/075925 patent/WO2013051689A1/ja active Application Filing
- 2012-10-05 CN CN201280049339.XA patent/CN103857746A/zh active Pending
- 2012-10-05 JP JP2013537570A patent/JPWO2013051689A1/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997003122A1 (fr) * | 1995-07-11 | 1997-01-30 | Nippon Zeon Co., Ltd. | Composition de caoutchouc conductrice et procede de production |
JP2006309063A (ja) * | 2005-05-02 | 2006-11-09 | Yamauchi Corp | 導電性ローラ用ゴム組成物および導電性ローラ |
JP2007099788A (ja) * | 2005-09-30 | 2007-04-19 | Daiso Co Ltd | 半導電性加硫ゴム用組成物、その加硫ゴム材料、および加硫ゴム部材 |
JP2008045031A (ja) * | 2006-08-16 | 2008-02-28 | Sumitomo Rubber Ind Ltd | 導電性熱可塑性エラストマー組成物、その製造方法及び成形物 |
JP2010174090A (ja) * | 2009-01-28 | 2010-08-12 | Nippon Zeon Co Ltd | ゴム組成物 |
JP2010180357A (ja) * | 2009-02-06 | 2010-08-19 | Sumitomo Rubber Ind Ltd | 半導電性ゴム組成物とそれを用いた半導電性ゴムローラ |
JP2011068758A (ja) * | 2009-09-25 | 2011-04-07 | Daiso Co Ltd | バイオディーゼル燃料と直接接触する成型部品を製造するための加硫用ゴム組成物 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10000623B2 (en) | 2013-11-12 | 2018-06-19 | Robinson Brothers Limited | Accelerator compositions and methods |
WO2016104269A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社大阪ソーダ | 電子写真機器部品用組成物 |
KR20170098209A (ko) * | 2014-12-24 | 2017-08-29 | 가부시키가이샤 오사카소다 | 전자 사진 기기 부품용 조성물 |
JPWO2016104269A1 (ja) * | 2014-12-24 | 2017-10-05 | 株式会社大阪ソーダ | 電子写真機器部品用組成物 |
KR102454277B1 (ko) * | 2014-12-24 | 2022-10-14 | 가부시키가이샤 오사카소다 | 전자 사진 기기 부품용 조성물 |
JP2017019981A (ja) * | 2015-07-15 | 2017-01-26 | 横浜ゴム株式会社 | ゴム組成物および空気入りタイヤ |
JPWO2018116723A1 (ja) * | 2016-12-22 | 2018-12-20 | Nok株式会社 | アクリロニトリル・ブタジエン共重合ゴム−エピクロロヒドリン系ゴム組成物 |
WO2018116723A1 (ja) * | 2016-12-22 | 2018-06-28 | Nok株式会社 | アクリロニトリル・ブタジエン共重合ゴム-エピクロロヒドリン系ゴム組成物 |
WO2019130950A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
WO2019130946A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
JP2019116567A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
JP2019116566A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
JPWO2019130946A1 (ja) * | 2017-12-27 | 2020-12-17 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
JP7167943B2 (ja) | 2017-12-27 | 2022-11-09 | 株式会社大阪ソーダ | 半導電性ゴム組成物 |
WO2023210519A1 (ja) * | 2022-04-28 | 2023-11-02 | デンカ株式会社 | ゴム組成物、加硫成形体及び加硫物 |
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