WO2013035716A1 - Method for producing module - Google Patents

Method for producing module Download PDF

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Publication number
WO2013035716A1
WO2013035716A1 PCT/JP2012/072551 JP2012072551W WO2013035716A1 WO 2013035716 A1 WO2013035716 A1 WO 2013035716A1 JP 2012072551 W JP2012072551 W JP 2012072551W WO 2013035716 A1 WO2013035716 A1 WO 2013035716A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal assembly
module
resin layer
wiring board
connection
Prior art date
Application number
PCT/JP2012/072551
Other languages
French (fr)
Japanese (ja)
Inventor
伸明 小川
一生 山元
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2013532617A priority Critical patent/JP5708814B2/en
Publication of WO2013035716A1 publication Critical patent/WO2013035716A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate

Definitions

  • the present invention relates to a method for manufacturing a module including an interlayer connection conductor.
  • a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (see, for example, Patent Document 1). ).
  • a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface.
  • the metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.
  • the via conductor 506 is filled with a conductive paste containing Ag, Cu or the like after a desmear process is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501, or via fill plating is performed. Is formed.
  • a via hole is formed in the resin layer 503 using laser processing, it is difficult to adjust the output of the laser, and the formation accuracy of the via hole is problematic.
  • the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it has been an obstacle to shortening the module manufacturing time.
  • an object of the present invention is to provide a module including an interlayer connection conductor at low cost and in a short manufacturing time.
  • the module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin.
  • a stopping step and a removing step of removing the connecting portion are provided (claim 1).
  • the terminal assembly may be formed by connecting a plurality of the connection terminals to both sides of the connecting portion, and bending the connection terminals on both sides of the connecting portion. Item 2).
  • the terminal assembly is formed by the bending after the punching of the metal plate (Claim 3).
  • the method further includes a second mounting step of mounting another electronic component on the other main surface of the wiring board, and a second sealing step of sealing the other electronic component with a resin layer ( Claim 4).
  • the terminal assembly is further mounted such that the other end of the connection terminal of the terminal assembly is connected to the other main surface of the wiring board, and the second sealing step And the other electronic component mounted on the other main surface of the wiring board and the terminal assembly are sealed with a resin layer, and then the connecting portion of the terminal assembly is removed (claim). Item 5).
  • a terminal assembly is prepared in which one end portions of a plurality of connection terminals are connected via a connecting portion by processing a metal plate, and an electron is formed on one main surface of the wiring board.
  • the terminal assembly is mounted so that the component is mounted and the other end of the connection terminal is connected to the wiring board. And after sealing an electronic component and a terminal assembly by a resin layer, the connection part is removed and the module in which the several interlayer connection conductor was formed by each connection terminal is completed.
  • a module provided with an interlayer connection conductor can be manufactured without providing a via hole as in the prior art. Therefore, there is no problem that the chemical solution when the desmear treatment is performed on the via hole or the chemical solution when the via fill plating is performed erodes the resin layer and the wiring board.
  • a terminal assembly formed by connecting a plurality of connection terminals formed by processing a metal plate is mounted on one main surface of the wiring board, and this terminal assembly is sealed with a resin layer together with electronic components.
  • the interlayer connection conductor can be easily formed in the module. Therefore, compared to the conventional case where the interlayer connection conductor is formed in the module by the via conductor formed through a plurality of complicated processes, the module including the interlayer connection conductor is manufactured at low cost and in a short manufacturing time. be able to. Further, by mounting a terminal assembly in which a plurality of connection terminals are connected to a wiring board, a plurality of interlayer connection conductors can be formed at a time, and therefore the module manufacturing time can be further shortened.
  • the terminal assembly is formed by connecting a plurality of connecting terminals on both sides of the connecting portion and bending the connecting terminals on both sides of the connecting portion. Accordingly, a terminal assembly formed by arranging a plurality of connection terminals in two rows can be easily and inexpensively manufactured. Further, by mounting this terminal assembly on a wiring board, a plurality of interlayer connection conductors can be easily formed in a state where they are arranged in two rows. Therefore, a module provided with a plurality of interlayer connection conductors arranged in two rows can be manufactured at low cost and in a short manufacturing time.
  • the terminal assembly is formed at a low cost with a simple configuration in which the metal plate is punched and then bent, a plurality of interlayer connection conductors are arranged in two rows.
  • the resulting module can be manufactured more easily and inexpensively.
  • the mounting density of the electronic components mounted on the module can be increased.
  • the terminal assembly is further mounted on the other main surface of the wiring board, and the electronic component and the terminal assembly mounted on the other main surface of the wiring substrate are sealed with the resin layer, the terminal assembly Since the connecting portion of the body is removed, an interlayer connection conductor using connection terminals can be formed on the resin layer formed on the other main surface of the wiring board, similarly to the one main surface side.
  • the electronic component is placed on the resin layer formed by the second sealing step so as to be connected to any one end of the connection terminal mounted on the other main surface of the wiring board. Since it is mounted, the mounting density of the electronic components mounted on the module can be further increased.
  • FIG. 1 is an explanatory view of a terminal assembly used in a module according to a first embodiment of the present invention, wherein (a) is a metal plate processed so that one end of a connection terminal is connected via a connecting portion.
  • FIG. 5B is a perspective view of the terminal assembly.
  • FIG. 2 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (c) show different processes. 2A to 2C, for ease of explanation, a sectional view in the longitudinal direction of the terminal assembly is shown, and the connection terminals on the near side toward the paper surface are not shown. ing. Further, in FIGS. 2B and 2C, some hatching is omitted for easy explanation.
  • various communication modules such as a Bluetooth (registered trademark) module and a wireless LAN module, which are mounted on a mother board of a communication portable terminal, an antenna switch module, a high frequency such as a power supply module, etc. Circuit modules are manufactured.
  • a metal plate made of Cu or a Cu—Fe alloy is prepared, and the metal plate is subjected to punching or etching, whereby one end portion of the connection terminal 11 as shown in FIG. Are prepared in a state of being connected via the connecting portion 12.
  • the terminal assembly 10 is prepared by bending this metal plate (preparation process). In other words, in a state where the connecting portion 12 is supported by a jig or the like, each of the plurality of connecting terminals 11 connected to both sides of the connecting portion 12 is bent by pressing from above the connecting terminals 11 using a press or the like.
  • the terminal assembly 10 is prepared by processing.
  • connection terminals for mounting various chip components and electronic components 102 such as ICs on one main surface of the wiring substrate 101 and forming an interlayer connection conductor of the module 100.
  • the terminal assembly 10 is formed by connecting one end portion of the wiring board 101 via the connecting portion 12. Mounting at a position (first mounting step). At this time, the terminal assembly 10 and the electronic component 102 may be mounted by a general surface mounting technique such as solder reflow or ultrasonic vibration bonding.
  • the terminal assembly 10 is disposed so that the connecting portion 12 covers the electronic component 102, but the terminal assembly 10 is disposed so that the connecting portion 12 does not cover the electronic component 102. May be.
  • the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets.
  • a ceramic green sheet is a sheet of slurry in which a mixed powder of alumina and glass is mixed with an organic binder and solvent, and via holes are formed at predetermined positions on the ceramic green sheet by laser processing or the like.
  • the formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste.
  • the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, which is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
  • the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted, and an external connection electrode.
  • an internal wiring pattern a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted
  • an external connection electrode can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc., using a resin or a polymer material.
  • the wiring board 101 may be formed by selecting an optimal material as appropriate.
  • the first resin layer 103 may be formed of a composite resin in which an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide is mixed with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. it can.
  • an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide
  • a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. it can.
  • the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around Forming the first resin layer 103 having a desired thickness by covering the wiring substrate 101 with a resin sheet and heat-pressing the spacer so as to have a spacer thickness, and then heating the wiring substrate 101 in an oven to cure the resin.
  • the first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
  • the first resin layer 103 is formed so as to cover the connecting portion 12 of the terminal assembly 10, but the first resin layer 103 is formed so as to cover at least the connection terminal 11. It only has to be done.
  • the surface of the first resin layer 103 and the connecting portion 12 of the terminal assembly 10 are polished or ground by a roller blade or the like, thereby removing unnecessary resin and the connecting portion 12. (Removal step).
  • the terminal assembly 10 sealed with the first resin layer 103 is described without hatching the first resin layer 103. Yes. In this way, one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, and as a result, an external connection land formed by the one end of the connection terminal 11 is formed. 100 is completed.
  • the first By cutting one end of the connection terminal 11 together with the resin layer 103, the height of the connection terminal 11 from the wiring substrate 101 can be made uniform.
  • Ni / Au plating may be applied to one end of the connection terminal 11 exposed on the surface of the first resin layer 103.
  • the connection terminal 11 may be bent without sufficient strength.
  • the metal plate is thick, for example, when the metal plate is processed by punching, when the metal plate is punched, deformation occurs in the vicinity of the cut surface of the metal plate, and the shape of the connection terminal 11 is not stable.
  • the metal plate is etched to form a plurality of connection terminals 11 integrally connected via the connecting portion 12, if the metal plate is thick, the etching process takes time. There is a possibility that a portion that does not require the etching process is greatly scratched (so-called over-etching).
  • the shape of the mask designed to etch the metal plate into a desired shape, and the shape of the metal plate after being subjected to the etching treatment by the exposure apparatus using the mask Therefore, it is difficult to accurately form the shape of the connection terminal 11.
  • the terminal assembly 10 is formed by bending a connection body of a plurality of connection terminals 11 as shown in FIG. 1B, a compression stress is applied to the inner side of the bent portion, and the outer side of the bent portion. A tensile stress acts on. Therefore, in particular, the cross-sectional shape of one end of the connection terminal 11 that is bent is deformed, and it is difficult to uniformly form the cross-sectional shape of both ends of the connection terminal 11. Therefore, in order to reduce the influence of the above-described problem, the inventor of the present application has repeatedly conducted experiments. As a result, the thickness of the metal plate necessary for forming the connection terminal 11 with high accuracy is 0.2 mm to 0 mm. It was found to be 0.8 mm, preferably 0.2 mm to 0.5 mm.
  • the end assembly 10 and the electronic component 102 in which one end portion of the connection terminal 11 is connected via the connecting portion 12 are mounted on one main surface of the wiring board 101, and the terminal assembly After the body 10 and the electronic component 102 are sealed with the first resin layer 103, the unnecessary resin and the connecting portion 12 of the terminal assembly 10 are removed by polishing or grinding to connect the interlayer connection conductors of the module 100.
  • the terminal 11 can be easily formed. Therefore, unlike the conventional case, it is not necessary to provide via holes formed through a plurality of complicated processes to form the interlayer connection conductor in the module 100, and the cost for production of the module 100 can be reduced and the manufacturing can be performed. Time can be shortened.
  • a plurality of interlayer connection conductors are formed in the module 100 at a time by mounting the terminal assembly 10 formed by connecting the plurality of connection terminals 11 forming the interlayer connection conductors via the connecting portions 12 on the wiring board 101. Therefore, the manufacturing time of the module 100 including the interlayer connection conductor can be further shortened.
  • the terminal assembly 10 is formed by connecting a plurality of connection terminals 11 to both sides of the connecting portion 12 and bending the connecting terminals 11 on both sides of the connecting portion 12. Therefore, the terminal assembly 10 in which the plurality of connection terminals 11 are arranged in two rows can be manufactured easily and inexpensively.
  • a plurality of interlayer connection conductors arranged in two rows can be easily formed in the module 100. Therefore, a plurality of interlayer connection conductors are arranged in two rows.
  • the module 100 can be manufactured at low cost and in a short manufacturing time.
  • the terminal assembly 10 when the terminal assembly 10 is formed by etching, for example, a metal plate having a thickness equal to or greater than the length of the connection terminal 11 is prepared, and the connection terminal 11 extends in the thickness direction of the metal plate with respect to the metal plate.
  • the terminal assembly 10 may be three-dimensionally formed by performing an etching process so as to be formed.
  • it is necessary to perform a long-time etching process on the metal plate in order to form the connection terminals 11 in the thickness direction of the metal plate there is a possibility that the above-described over-etching may occur.
  • the plurality of connection terminals 11 are integrated integrally via the connecting portion 12.
  • the terminal assembly 10 by forming the terminal assembly 10 by bending each connection terminal 11, the time required for the etching process of the metal plate can be shortened, and the influence of overetching can be suppressed. . Therefore, the terminal assembly 10 in which the shape of the connection terminal 11 is accurately formed can be easily formed.
  • the terminal assembly 10 when the terminal assembly 10 is formed by punching a metal plate and bending the punched metal plate, there is no need for an expensive exposure apparatus or etching processing equipment used for the etching process. Therefore, the terminal assembly 10 can be formed at a low cost.
  • the surface of the first resin layer 103 can be flattened and the module 100 can be reduced in height. Further, by removing the connecting portion 12, one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, so that the one end of the connection terminal 11 exposed on the surface of the first resin layer 103 is externally exposed. A land for connection can be formed.
  • the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. . In this case, in the process of mounting the terminal assembly 10 so as to cover the place where the connecting portion 12 should be a dividing line for separating the assembly of the wiring boards 101 and separating the modules 100 into two rows, The plurality of connection terminals 11 formed in the above may be connected to the connection terminals 11 of the modules 100 that are different from each other by one row.
  • FIG. 3 is a diagram showing a module according to the second embodiment of the present invention.
  • the module according to this embodiment differs from the first embodiment described above in that the electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a as shown in FIG. 3 (second mounting step). In addition, the electronic component 102 is sealed with the second resin layer 104 (second sealing step). Since other configurations are the same as those in the first embodiment described above, description of the configurations is omitted by giving the same reference numerals.
  • FIG. 4 is a diagram showing a module according to the third embodiment of the present invention.
  • the module according to this embodiment is different from the second embodiment described above, as shown in FIG. 4, in which the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100b. Is a point provided. Since other configurations are the same as those in the first and second embodiments described above, description of the configuration is omitted by giving the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
  • the metal shield layer 105 is provided on the second resin layer 104, noise can be prevented from propagating from the outside to the electronic component 102 that is sealed in the second resin layer 104.
  • electromagnetic waves and the like can be prevented from being radiated from the electronic component 102 sealed with the second resin layer 104.
  • FIG. 5 is a diagram showing a module according to the fourth embodiment of the present invention.
  • the module according to this embodiment differs from the second embodiment described with reference to FIG. 3 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100c as shown in FIG.
  • the second resin layer 104 is provided with an interlayer connection conductor by the connection terminal 11. That is, in the same manner as described for the one main surface of the wiring board 101 in the first embodiment described above, the terminal assembly 10 in which one end portion of the connection terminal 11 is connected via the connecting portion 12 is connected to the wiring board 101. By mounting on the other main surface, the other end of the connection terminal 11 is connected to the wiring board 101. Further, in the second sealing step, the other main surface of the wiring substrate 101 is filled with resin, and then the connecting portion 12 of the terminal assembly 10 mounted on the other main surface of the wiring substrate 101 is removed to form the module 100c. Is done.
  • the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminal 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals.
  • the electronic component 102 is further mounted on the surface of the second resin layer 104 formed by the second sealing step so as to be connected to the connection terminal 11 provided in the second resin layer 104. This is practical because the mounting density of the electronic components 102 to be mounted can be further increased.
  • Ni / Au plating is applied to one end portion of the connection terminal 11 exposed by removing the connecting portion 12 of the terminal assembly 10, and bumps such as solder are formed thereon. May be. By doing so, when connecting the module to an external substrate or the like, it is not necessary to form solder bumps on the external substrate side, which is practical.
  • the present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using a surface mounting technique.

Abstract

Provided is a technology that can produce a module provided with an inter-layer connection conductor at a low cost and with a short production time by means of mounting a terminal assembly, to which a plurality of connection terminals are joined via a joining section, onto a wiring substrate, sealing with resin, and then eliminating the joining section. When producing the module (100) resulting from mounting and resin sealing an electronic component (102) and a connection terminal (11) forming an inter-layer connection conductor onto a wiring substrate (101), a terminal assembly (10) resulting from one end of a plurality of connection terminals (11) being connected with a joining section (12) therebetween by means of machining a metal plate is prepared, the electronic component (102) and the terminal assembly (10) are mounted to one primary surface of the wiring substrate (101) (first mounting step), the electronic component (102) and the connection terminals (11) are sealed by a resin layer (103) (first sealing step), and then the joining section (12) is eliminated (elimination step). As a result, it is possible to produce a module (100) provided with an inter-layer connection conductor at a low cost and a short production time.

Description

モジュールの製造方法Module manufacturing method
　本発明は、層間接続導体を備えるモジュールの製造方法に関する。 The present invention relates to a method for manufacturing a module including an interlayer connection conductor.
　従来、図６のモジュールの一例に示すように、配線基板５０１の両面に実装された各種の電子部品５０２が、樹脂層５０３により封止されたモジュール５００が知られている（例えば特許文献１参照）。この場合、モジュール５００の一方の主面には金属シールド層５０４が設けられ、他方の主面には外部接続用の実装用端子５０５が設けられている。そして、金属シールド層５０４および実装用端子５０５は、それぞれ層間接続用のビア導体５０６により配線基板５０１の配線層と電気的に接続される。 Conventionally, as shown in an example of the module in FIG. 6, a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (see, for example, Patent Document 1). ). In this case, a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface. The metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.
国際公開２００５／０７８７９６号（段落００１７～００２５，００３５、図１、要約書など）International Publication No. 2005/078796 (paragraphs 0017-0025,0035, FIG. 1, abstract, etc.)
　ところで、ビア導体５０６は、配線基板５０１に設けられた樹脂層５０３にレーザ加工により形成されたビアホールに、デスミア処理が施された後、ＡｇやＣｕなどを含む導電ペーストが充填されたり、ビアフィルめっきが施されることにより形成される。このように、レーザ加工を用いて樹脂層５０３にビアホールが形成される場合、レーザの出力調整が難しく、ビアホールの形成精度にばらつきが生じることが問題となっている。また、ビア導体５０６は、複数の工程を経て樹脂層５０３に形成されるため、モジュールの製造時間の短縮を図る上で妨げとなっていた。また、レーザ加工により樹脂層５０３に形成されたビアホールにデスミア処理が施される際の薬液や、ビアフィルめっきが施される際の薬液が、樹脂層５０３や配線基板５０１を浸食するという問題があった。 By the way, the via conductor 506 is filled with a conductive paste containing Ag, Cu or the like after a desmear process is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501, or via fill plating is performed. Is formed. As described above, when a via hole is formed in the resin layer 503 using laser processing, it is difficult to adjust the output of the laser, and the formation accuracy of the via hole is problematic. Further, since the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it has been an obstacle to shortening the module manufacturing time. In addition, there is a problem that the chemical solution when the desmear treatment is performed on the via hole formed in the resin layer 503 by laser processing or the chemical solution when the via fill plating is performed erodes the resin layer 503 and the wiring substrate 501. It was.
　本発明は、上記した課題に鑑みてなされたものであり、複数の接続端子が連結部を介して連結された端子集合体を配線基板上に実装し、樹脂封止した後に連結部を除去することにより、低コストかつ短い製造時間で層間接続導体を備えるモジュールを提供できるようにすることを目的とする。 The present invention has been made in view of the above-described problems. A terminal assembly in which a plurality of connection terminals are connected via a connecting portion is mounted on a wiring board, and the connecting portion is removed after resin sealing. Accordingly, an object of the present invention is to provide a module including an interlayer connection conductor at low cost and in a short manufacturing time.
　上記した目的を達成するために、本発明のモジュールの製造方法は、層間接続導体を形成する柱状の接続端子および電子部品を配線基板上に実装し樹脂封止してなるモジュールの製造方法において、金属板を加工することにより連結部を介して複数の前記接続端子の一方端部が連結されてなる端子集合体を準備する準備工程と、前記配線基板の一方主面に、前記電子部品を実装するとともに前記接続端子の他方端部が前記配線基板に接続されるように前記端子集合体を実装する第１実装工程と、前記電子部品および前記端子集合体を樹脂層により封止する第１封止工程と、前記連結部を除去する除去工程とを備えることを特徴としている（請求項１）。 In order to achieve the above-described object, the module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin. Preparing a terminal assembly in which one end portions of a plurality of the connection terminals are connected via a connecting portion by processing a metal plate, and mounting the electronic component on one main surface of the wiring board And a first mounting step for mounting the terminal assembly so that the other end of the connection terminal is connected to the wiring board, and a first seal for sealing the electronic component and the terminal assembly with a resin layer. A stopping step and a removing step of removing the connecting portion are provided (claim 1).
　また、前記端子集合体は、前記連結部の両側にそれぞれ複数個の前記接続端子が連結され、前記連結部の両側の前記各接続端子が折り曲げ加工されて形成されることを特徴としている（請求項２）。 The terminal assembly may be formed by connecting a plurality of the connection terminals to both sides of the connecting portion, and bending the connection terminals on both sides of the connecting portion. Item 2).
　また、前記端子集合体は、前記金属板の打抜き加工の後、前記折り曲げ加工されて形成されることを特徴としている（請求項３）。 Also, the terminal assembly is formed by the bending after the punching of the metal plate (Claim 3).
　また、前記配線基板の他方主面に他の電子部品を実装する第２実装工程と、前記他の電子部品を樹脂層により封止する第２封止工程とをさらに備えることを特徴としている（請求項４）。 Further, the method further includes a second mounting step of mounting another electronic component on the other main surface of the wiring board, and a second sealing step of sealing the other electronic component with a resin layer ( Claim 4).
　また、前記第２実装工程において、前記配線基板の他方主面に前記端子集合体の前記接続端子の他方端部が接続されるように前記端子集合体をさらに実装し、前記第２封止工程において、前記配線基板の他方主面に実装された前記他の電子部品および前記端子集合体を樹脂層により封止した後、前記端子集合体の前記連結部を除去することを特徴としている（請求項５）。 Further, in the second mounting step, the terminal assembly is further mounted such that the other end of the connection terminal of the terminal assembly is connected to the other main surface of the wiring board, and the second sealing step And the other electronic component mounted on the other main surface of the wiring board and the terminal assembly are sealed with a resin layer, and then the connecting portion of the terminal assembly is removed (claim). Item 5).
　そして、前記配線基板の他方主面に実装される前記端子集合体の前記連結部を除去した後の前記各接続端子のいずれかに接続されるように、前記第２封止工程により形成された樹脂層に電子部品を実装してもよい（請求項６）。 And formed by the second sealing step so as to be connected to one of the connection terminals after removing the connecting portion of the terminal assembly mounted on the other main surface of the wiring board. Electronic components may be mounted on the resin layer (claim 6).
　請求項１の発明によれば、金属板を加工することにより連結部を介して複数の接続端子の一方端部が連結されてなる端子集合体を準備し、配線基板の一方主面に、電子部品を実装するとともに接続端子の他方端部が配線基板に接続されるように端子集合体を実装する。そして、電子部品と端子集合体とを樹脂層により封止した後に、連結部を除去することで、各接続端子により複数の層間接続導体が形成されたモジュールが完成する。 According to the first aspect of the present invention, a terminal assembly is prepared in which one end portions of a plurality of connection terminals are connected via a connecting portion by processing a metal plate, and an electron is formed on one main surface of the wiring board. The terminal assembly is mounted so that the component is mounted and the other end of the connection terminal is connected to the wiring board. And after sealing an electronic component and a terminal assembly by a resin layer, the connection part is removed and the module in which the several interlayer connection conductor was formed by each connection terminal is completed.
　このようにすることで、従来のように、ビアホールを設けることなく、層間接続導体を備えるモジュールを製造することができる。したがって、ビアホールにデスミア処理が施される際の薬液や、ビアフィルめっきが施される際の薬液が、樹脂層や配線基板を浸食するという問題が生じない。 By doing in this way, a module provided with an interlayer connection conductor can be manufactured without providing a via hole as in the prior art. Therefore, there is no problem that the chemical solution when the desmear treatment is performed on the via hole or the chemical solution when the via fill plating is performed erodes the resin layer and the wiring board.
　また、金属板を加工することにより形成された複数の接続端子が連結されてなる端子集合体を、配線基板の一方主面に実装し、この端子集合体を電子部品とともに樹脂層により封止し、複数の接続端子が連結された端子集合体の連結部を除去することで、容易に層間接続導体をモジュールに形成することができる。したがって、従来のように、複数の複雑な工程を経て形成されるビア導体により層間接続導体をモジュールに形成する場合と比較して、層間接続導体を備えるモジュールを低コストかつ短い製造時間で製造することができる。さらに、複数の接続端子が連結された端子集合体を配線基板に実装することにより、一度に複数の層間接続導体を形成できるため、モジュールの製造時間をさらに短縮することができる。 Also, a terminal assembly formed by connecting a plurality of connection terminals formed by processing a metal plate is mounted on one main surface of the wiring board, and this terminal assembly is sealed with a resin layer together with electronic components. By removing the connecting portion of the terminal assembly in which a plurality of connection terminals are connected, the interlayer connection conductor can be easily formed in the module. Therefore, compared to the conventional case where the interlayer connection conductor is formed in the module by the via conductor formed through a plurality of complicated processes, the module including the interlayer connection conductor is manufactured at low cost and in a short manufacturing time. be able to. Further, by mounting a terminal assembly in which a plurality of connection terminals are connected to a wiring board, a plurality of interlayer connection conductors can be formed at a time, and therefore the module manufacturing time can be further shortened.
　請求項２の発明によれば、端子集合体は、連結部の両側にそれぞれ複数個の接続端子が連結され、当該連結部の両側の接続端子が折り曲げ加工されて形成される。したがって、複数の接続端子が２列に配列されて形成される端子集合体を容易かつ安価に製作できる。また、この端子集合体を配線基板に実装することにより、複数の層間接続導体を２列に配列した状態で簡単に形成できる。したがって、複数の層間接続導体が２列に配列されて設けられたモジュールを低コストかつ短い製造時間で製造することができる。 According to the invention of claim 2, the terminal assembly is formed by connecting a plurality of connecting terminals on both sides of the connecting portion and bending the connecting terminals on both sides of the connecting portion. Accordingly, a terminal assembly formed by arranging a plurality of connection terminals in two rows can be easily and inexpensively manufactured. Further, by mounting this terminal assembly on a wiring board, a plurality of interlayer connection conductors can be easily formed in a state where they are arranged in two rows. Therefore, a module provided with a plurality of interlayer connection conductors arranged in two rows can be manufactured at low cost and in a short manufacturing time.
　また、請求項３の発明によれば、端子集合体は、金属板の打ち抜き加工の後、折り曲げ加工されるという簡易な構成で安価に形成されるため、複数の層間接続導体が２列に配列されてなるモジュールをさらに容易かつ安価に製造することができる。 Further, according to the invention of claim 3, since the terminal assembly is formed at a low cost with a simple configuration in which the metal plate is punched and then bent, a plurality of interlayer connection conductors are arranged in two rows. The resulting module can be manufactured more easily and inexpensively.
　請求項４の発明によれば、配線基板の他方主面にも電子部品を実装し、その電子部品を樹脂層により封止するため、モジュールに実装する電子部品の実装密度を高めることができる。 According to the invention of claim 4, since the electronic component is mounted on the other main surface of the wiring board and the electronic component is sealed with the resin layer, the mounting density of the electronic components mounted on the module can be increased.
　請求項５の発明によれば、配線基板の他方主面に端子集合体をさらに実装し、配線基板の他方主面に実装した電子部品および端子集合体を樹脂層により封止した後、端子集合体の連結部が除去されるので、配線基板の他方主面に形成した樹脂層に、一方主面側と同様に、接続端子による層間接続導体を形成することができる。 According to the invention of claim 5, after the terminal assembly is further mounted on the other main surface of the wiring board, and the electronic component and the terminal assembly mounted on the other main surface of the wiring substrate are sealed with the resin layer, the terminal assembly Since the connecting portion of the body is removed, an interlayer connection conductor using connection terminals can be formed on the resin layer formed on the other main surface of the wiring board, similarly to the one main surface side.
　請求項６の発明によれば、配線基板の他方主面に実装される接続端子の一方端部のいずれかに接続されるように、第２封止工程により形成される樹脂層に電子部品を実装するため、モジュールに実装される電子部品の実装密度をさらに高めることができる。 According to the invention of claim 6, the electronic component is placed on the resin layer formed by the second sealing step so as to be connected to any one end of the connection terminal mounted on the other main surface of the wiring board. Since it is mounted, the mounting density of the electronic components mounted on the module can be further increased.
本発明の第１実施形態にかかるモジュールに用いる端子集合体を説明するための図である。It is a figure for demonstrating the terminal assembly used for the module concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるモジュールの製造方法を示す図である。It is a figure which shows the manufacturing method of the module concerning 1st Embodiment of this invention. 本発明の第２実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 3rd Embodiment of this invention. 本発明の第４実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 4th Embodiment of this invention. 従来のモジュールの一例を示す図である。It is a figure which shows an example of the conventional module.
　＜第１実施形態＞
　本発明の第１実施形態にかかるモジュールについて、図１、図２を参照して説明する。図１は本発明の第１実施形態にかかるモジュールに用いる端子集合体の説明図であり、（ａ）は接続端子の一方端部が連結部を介して連結された状態に加工された金属板を示す平面図であり、（ｂ）は端子集合体の斜視図を示す。図２は本発明の第１実施形態にかかるモジュールの製造方法を示す図であり、（ａ）～（ｃ）はそれぞれ異なる工程を示す。なお、図２（ａ）～（ｃ）では、説明を容易なものとするため、端子集合体の長手方向における断面図が図示されており、紙面に向かって手前側の接続端子は図示省略されている。また、図２（ｂ）（ｃ）においては、説明を容易なものとするため、一部ハッチングを省略して記載している。 <First Embodiment>
The module according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory view of a terminal assembly used in a module according to a first embodiment of the present invention, wherein (a) is a metal plate processed so that one end of a connection terminal is connected via a connecting portion. FIG. 5B is a perspective view of the terminal assembly. FIG. 2 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (c) show different processes. 2A to 2C, for ease of explanation, a sectional view in the longitudinal direction of the terminal assembly is shown, and the connection terminals on the near side toward the paper surface are not shown. ing. Further, in FIGS. 2B and 2C, some hatching is omitted for easy explanation.
　この実施形態で説明するモジュールの製造方法では、通信携帯端末のマザー基板などに実装される、Ｂｌｕｅｔｏｏｔｈ（登録商標）モジュールおよび無線ＬＡＮモジュールなどの各種の通信モジュール、アンテナスイッチモジュール、電源モジュールなどの高周波用回路モジュールが製造される。 In the module manufacturing method described in this embodiment, various communication modules such as a Bluetooth (registered trademark) module and a wireless LAN module, which are mounted on a mother board of a communication portable terminal, an antenna switch module, a high frequency such as a power supply module, etc. Circuit modules are manufactured.
　まず、ＣｕやＣｕ－Ｆｅ合金からなる金属板を用意し、その金属板に対して、打ち抜き加工またはエッチング処理を施すことにより、図１（ａ）に示すような、接続端子１１の一方端部が連結部１２を介して連結された状態の金属板を用意する。 First, a metal plate made of Cu or a Cu—Fe alloy is prepared, and the metal plate is subjected to punching or etching, whereby one end portion of the connection terminal 11 as shown in FIG. Are prepared in a state of being connected via the connecting portion 12.
　そして、図１（ｂ）に示すように、この金属板を折り曲げ加工することにより端子集合体１０を準備する（準備工程）。すなわち、連結部１２を治具などにより支持した状態で、連結部１２の両側に連結された複数の接続端子１１それぞれをプレス機などを使用して、接続端子１１の上方からプレスすることにより折り曲げ加工して端子集合体１０を準備する。 And as shown in FIG.1 (b), the terminal assembly 10 is prepared by bending this metal plate (preparation process). In other words, in a state where the connecting portion 12 is supported by a jig or the like, each of the plurality of connecting terminals 11 connected to both sides of the connecting portion 12 is bent by pressing from above the connecting terminals 11 using a press or the like. The terminal assembly 10 is prepared by processing.
　次に、図２（ａ）に示すように、配線基板１０１の一方主面に各種のチップ部品やＩＣなどの電子部品１０２を実装するとともに、モジュール１００の層間接続導体を形成する複数の接続端子１１の一方端部が連結部１２を介して連結されてなる端子集合体１０を、各接続端子１１の他方端部が配線基板１０１に接続されるように、配線基板１０１の一方主面の所定位置に実装する（第１実装工程）。このとき、端子集合体１０および電子部品１０２は、半田リフローや超音波振動接合などの一般的な表面実装技術により実装するとよい。なお、図２（ａ）においては、連結部１２が電子部品１０２を覆うように端子集合体１０が配置されているが、連結部１２が電子部品１０２を覆わないように端子集合体１０を配置してもよい。 Next, as shown in FIG. 2A, a plurality of connection terminals for mounting various chip components and electronic components 102 such as ICs on one main surface of the wiring substrate 101 and forming an interlayer connection conductor of the module 100. The terminal assembly 10 is formed by connecting one end portion of the wiring board 101 via the connecting portion 12. Mounting at a position (first mounting step). At this time, the terminal assembly 10 and the electronic component 102 may be mounted by a general surface mounting technique such as solder reflow or ultrasonic vibration bonding. In FIG. 2A, the terminal assembly 10 is disposed so that the connecting portion 12 covers the electronic component 102, but the terminal assembly 10 is disposed so that the connecting portion 12 does not cover the electronic component 102. May be.
なお、配線基板１０１は、この実施形態では、複数のセラミックグリーンシートが積層されて焼成されてなる多層セラミック基板である。セラミックグリーンシートは、アルミナおよびガラスなどの混合粉末が有機バインダおよび溶剤などと一緒に混合されたスラリーがシート化されたものであり、セラミックグリーンシートの所定位置に、レーザ加工などによりビアホールが形成され、形成されたビアホールにＡｇやＣｕなどを含む導体ペーストが充填されて、層間接続用のビア導体が形成され、導体ペーストによる印刷により種々の電極パターンが形成される。その後、各セラミックグリーンシートを積層、圧着することによりセラミック積層体を形成して、約１０００℃前後の低い温度で、所謂、低温焼成して形成されている。 In this embodiment, the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets. A ceramic green sheet is a sheet of slurry in which a mixed powder of alumina and glass is mixed with an organic binder and solvent, and via holes are formed at predetermined positions on the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste. Thereafter, the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, which is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
　このように、配線基板１０１には、内部配線パターン、端子集合体１０および電子部品１０２が実装される実装用電極および外部接続用電極などの種々の電極パターンが設けられているが、配線基板１０１は、樹脂やポリマー材料などを用いた、プリント基板、ＬＴＣＣ、アルミナ系基板、ガラス基板、複合材料基板、単層基板、多層基板などで形成することができ、モジュール１００の使用目的に応じて、適宜最適な材質を選択して配線基板１０１を形成すればよい。 As described above, the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted, and an external connection electrode. Can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc., using a resin or a polymer material. The wiring board 101 may be formed by selecting an optimal material as appropriate.
　次に、図２（ｂ）に示すように、配線基板１０１の一方主面に樹脂を充填することにより、配線基板１０１の一方主面に実装した電子部品１０２および端子集合体１０を第１樹脂層１０３により封止する（第１封止工程）。なお、図２（ｂ）においては、説明を容易なものとするため、第１樹脂層１０３により封止されている端子集合体１０に、第１樹脂層１０３のハッチングをかけずに記載している。第１樹脂層１０３は、エポキシ樹脂やフェノール樹脂、シアネート樹脂などの熱硬化性の樹脂に、酸化アルミニウムやシリカ（二酸化ケイ素）、二酸化チタンなどの無機フィラーが混合された複合樹脂により形成することができる。 Next, as shown in FIG. 2B, the electronic component 102 and the terminal assembly 10 mounted on the one main surface of the wiring substrate 101 are filled with the resin on one main surface of the wiring substrate 101, so that the first resin. Sealing is performed with the layer 103 (first sealing step). In FIG. 2B, for ease of explanation, the terminal assembly 10 sealed with the first resin layer 103 is shown without hatching the first resin layer 103. Yes. The first resin layer 103 may be formed of a composite resin in which an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide is mixed with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. it can.
　例えば、ＰＥＴフィルム上に複合樹脂を成型して半硬化させた樹脂シートを用いて第１樹脂層１０３を形成する場合には、所望の厚みを有するスペーサ（型）が周囲に配置された状態の配線基板１０１に樹脂シートを被せ、スペーサ厚みになるように加熱プレスした後、配線基板１０１をオーブンにより加熱して樹脂を硬化させることにより、所望の厚みを有する第１樹脂層１０３を形成することができる。なお、第１樹脂層１０３は、液状の樹脂を用いたポッティング技術やトランスファーモールド技術、コンプレッションモールド技術など、樹脂層を形成する一般的な成型技術を用いて形成すればよい。なお、図２（ｂ）においては、端子集合体１０の連結部１２を覆うように第１樹脂層１０３が形成されているが、少なくとも接続端子１１が覆われるように第１樹脂層１０３が形成されていればよい。 For example, when the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around Forming the first resin layer 103 having a desired thickness by covering the wiring substrate 101 with a resin sheet and heat-pressing the spacer so as to have a spacer thickness, and then heating the wiring substrate 101 in an oven to cure the resin. Can do. The first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique. In FIG. 2B, the first resin layer 103 is formed so as to cover the connecting portion 12 of the terminal assembly 10, but the first resin layer 103 is formed so as to cover at least the connection terminal 11. It only has to be done.
　続いて、図２（ｃ）に示すように、ローラブレード等により第１樹脂層１０３の表面および端子集合体１０の連結部１２を研磨や研削することにより、不要な樹脂ならびに連結部１２を除去する（除去工程）。なお、図２（ｃ）においても、説明を容易なものとするため、第１樹脂層１０３により封止されている端子集合体１０に、第１樹脂層１０３のハッチングをかけずに記載している。このようにすることで、第１樹脂層１０３の表面に接続端子１１の一方端部が露出し、その結果、接続端子１１の一方端部により形成された外部接続用のランドが形成され、モジュール１００が完成する。このとき、接続端子１１の他方端部を配線基板１０１に接続する半田の厚みなどの影響で、接続端子１１の配線基板１０１からの高さにばらつきが生じている場合であっても、第１樹脂層１０３と一緒に接続端子１１の一方端部を削ることにより、接続端子１１の配線基板１０１からの高さを揃えることができる。なお、第１樹脂層１０３の表面に露出した接続端子１１の一方端部に例えばＮｉ／Ａｕめっきを施してもよい。 Subsequently, as shown in FIG. 2C, the surface of the first resin layer 103 and the connecting portion 12 of the terminal assembly 10 are polished or ground by a roller blade or the like, thereby removing unnecessary resin and the connecting portion 12. (Removal step). In FIG. 2C, for ease of explanation, the terminal assembly 10 sealed with the first resin layer 103 is described without hatching the first resin layer 103. Yes. In this way, one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, and as a result, an external connection land formed by the one end of the connection terminal 11 is formed. 100 is completed. At this time, even if the height of the connection terminal 11 from the wiring board 101 varies due to the influence of the thickness of the solder connecting the other end of the connection terminal 11 to the wiring board 101, the first By cutting one end of the connection terminal 11 together with the resin layer 103, the height of the connection terminal 11 from the wiring substrate 101 can be made uniform. For example, Ni / Au plating may be applied to one end of the connection terminal 11 exposed on the surface of the first resin layer 103.
　ところで、端子集合体１０を形成するときに、金属板の厚みが薄いと、第１樹脂層１０３の表面に露出する接続端子の一方端部により形成される外部接続用のランドの面積が不足するおそれがあるため、第１樹脂層１０３の表面に露出する接続端子１１の一方端部に面積の大きいランドをさらに形成する必要性が生じる場合がある。また、金属板の厚みが薄いと、端子集合体１０を配線基板１０１に実装するときに、強度が足らずに接続端子１１が曲がるおそれがある。 By the way, when the terminal assembly 10 is formed, if the metal plate is thin, the area of the land for external connection formed by one end of the connection terminal exposed on the surface of the first resin layer 103 is insufficient. Since there is a possibility, it may be necessary to further form a land having a large area at one end of the connection terminal 11 exposed on the surface of the first resin layer 103. Further, if the metal plate is thin, when the terminal assembly 10 is mounted on the wiring board 101, the connection terminal 11 may be bent without sufficient strength.
　また、金属板の厚みが厚いと、例えば、打ち抜きにより金属板を加工する場合、金属板が打ち抜かれる際に、金属板の切断面近傍に変形が生じ、接続端子１１の形状が安定しない。また、金属板にエッチング処理を施すことにより、連結部１２を介して一体的に連結された複数の接続端子１１を形成する場合、金属板の厚みが厚いと、エッチング処理に時間がかかるため、エッチング処理の必要のない部分が大きく抉られるおそれがある（いわゆるオーバーエッチング）。この場合、金属板を所望の形状にエッチング処理するために設計されたマスクの形状と、当該マスクを用いて露光装置により露光処理されることによるエッチング処理が施された後の金属板の形状との間に差が生じ、接続端子１１の形状を精度よく形成することが困難である。 If the metal plate is thick, for example, when the metal plate is processed by punching, when the metal plate is punched, deformation occurs in the vicinity of the cut surface of the metal plate, and the shape of the connection terminal 11 is not stable. In addition, when the metal plate is etched to form a plurality of connection terminals 11 integrally connected via the connecting portion 12, if the metal plate is thick, the etching process takes time. There is a possibility that a portion that does not require the etching process is greatly scratched (so-called over-etching). In this case, the shape of the mask designed to etch the metal plate into a desired shape, and the shape of the metal plate after being subjected to the etching treatment by the exposure apparatus using the mask. Therefore, it is difficult to accurately form the shape of the connection terminal 11.
　また、図１（ｂ）に示すような複数の接続端子１１の連結体に折り曲げ加工を施すことにより端子集合体１０を形成する場合、折り曲げ部において、折り曲げの内側には圧縮応力、折り曲げの外側には引っ張り応力が作用する。したがって、特に、接続端子１１の折り曲げられる一方端部の断面形状が変形し、接続端子１１の両端部の断面形状を均一に形成することが困難になる。そこで、上記した問題の影響を少なくするために、本願発明者は、実験を繰り返し行なった結果、接続端子１１を高精度に形成するのに必要な金属板の板厚は、０．２ｍｍ～０．８ｍｍ、好ましくは０．２ｍｍ～０．５ｍｍであることを見出した。 Further, when the terminal assembly 10 is formed by bending a connection body of a plurality of connection terminals 11 as shown in FIG. 1B, a compression stress is applied to the inner side of the bent portion, and the outer side of the bent portion. A tensile stress acts on. Therefore, in particular, the cross-sectional shape of one end of the connection terminal 11 that is bent is deformed, and it is difficult to uniformly form the cross-sectional shape of both ends of the connection terminal 11. Therefore, in order to reduce the influence of the above-described problem, the inventor of the present application has repeatedly conducted experiments. As a result, the thickness of the metal plate necessary for forming the connection terminal 11 with high accuracy is 0.2 mm to 0 mm. It was found to be 0.8 mm, preferably 0.2 mm to 0.5 mm.
　したがって、上記した実施形態によれば、接続端子１１の一方端部が連結部１２を介して連結されてなる端集合体１０および電子部品１０２を配線基板１０１の一方主面に実装し、端子集合体１０ならびに電子部品１０２を第１樹脂層１０３により封止した後、不要な樹脂ならびに端子集合体１０の連結部１２を研磨または研削することにより除去することで、モジュール１００の層間接続導体を接続端子１１により容易に形成できる。そのため、従来のように、モジュール１００に層間接続導体を形成するのに複数の複雑な工程を経て形成されるビアホールを設ける必要がなく、モジュール１００の生産にかかるコストを削減することができるとともに製造時間の短縮を図ることができる。 Therefore, according to the above-described embodiment, the end assembly 10 and the electronic component 102 in which one end portion of the connection terminal 11 is connected via the connecting portion 12 are mounted on one main surface of the wiring board 101, and the terminal assembly After the body 10 and the electronic component 102 are sealed with the first resin layer 103, the unnecessary resin and the connecting portion 12 of the terminal assembly 10 are removed by polishing or grinding to connect the interlayer connection conductors of the module 100. The terminal 11 can be easily formed. Therefore, unlike the conventional case, it is not necessary to provide via holes formed through a plurality of complicated processes to form the interlayer connection conductor in the module 100, and the cost for production of the module 100 can be reduced and the manufacturing can be performed. Time can be shortened.
　また、層間接続導体を備えるモジュールを製造するに当たり、従来のように、ビアホールを設ける必要がないため、デスミア処理が施される際の薬液や、ビアフィルめっきが施される際の薬液が、第１樹脂層１０３や配線基板１０１を浸食するという問題も生じない。 In addition, since it is not necessary to provide a via hole as in the prior art in manufacturing a module including an interlayer connection conductor, a chemical solution used when desmear treatment or a chemical solution used when via fill plating is performed is the first. The problem of erosion of the resin layer 103 and the wiring board 101 does not occur.
　また、層間接続導体を形成する複数の接続端子１１が連結部１２を介して連結されてなる端子集合体１０を配線基板１０１に実装することにより、一度に複数の層間接続導体をモジュール１００に形成できるため、層間接続導体を備えるモジュール１００の製造時間をさらに短縮することができる。 Also, a plurality of interlayer connection conductors are formed in the module 100 at a time by mounting the terminal assembly 10 formed by connecting the plurality of connection terminals 11 forming the interlayer connection conductors via the connecting portions 12 on the wiring board 101. Therefore, the manufacturing time of the module 100 including the interlayer connection conductor can be further shortened.
　また、端子集合体１０は、連結部１２の両側にそれぞれ複数個の接続端子１１が連結され、当該連結部１２の両側の各接続端子１１が折り曲げ加工されて形成される。したがって、複数の接続端子１１が２列に配列された端子集合体１０を容易かつ安価に製作できる。また、この端子集合体１０を配線基板１０１に実装することにより、簡単に２列に配列された複数の層間接続導体をモジュール１００に形成できるため、複数の層間接続導体が２列に配列されてなるモジュール１００を低コストかつ短い製造時間で製造することができる。 Also, the terminal assembly 10 is formed by connecting a plurality of connection terminals 11 to both sides of the connecting portion 12 and bending the connecting terminals 11 on both sides of the connecting portion 12. Therefore, the terminal assembly 10 in which the plurality of connection terminals 11 are arranged in two rows can be manufactured easily and inexpensively. In addition, by mounting the terminal assembly 10 on the wiring board 101, a plurality of interlayer connection conductors arranged in two rows can be easily formed in the module 100. Therefore, a plurality of interlayer connection conductors are arranged in two rows. The module 100 can be manufactured at low cost and in a short manufacturing time.
　また、端子集合体１０をエッチング処理により形成する場合、例えば、接続端子１１の長さ以上の厚みを有する金属板を用意し、その金属板に対して、金属板の厚み方向に接続端子１１が形成されるようにエッチング処理を施して、端子集合体１０を立体的に形成してもよい。ところが、金属板の厚み方向に接続端子１１を形成するために長時間のエッチング処理を金属板に施す必要があるため、上記したようなオーバーエッチングが発生するおそれがある。しかしながら、この実施形態では、厚みの薄い金属板を用意し、金属板の厚み方向にエッチング処理を施すことにより、まず、平面的に複数の接続端子１１を、連結部１２を介して一体的に形成し、その後、各接続端子１１を折り曲げ加工することで端子集合体１０を形成することで、金属板のエッチング処理にかかる時間を短くすることができ、オーバーエッチングの影響を抑制することができる。そのため、接続端子１１の形状が精度よく形成された端子集合体１０を容易に形成することができる。 Further, when the terminal assembly 10 is formed by etching, for example, a metal plate having a thickness equal to or greater than the length of the connection terminal 11 is prepared, and the connection terminal 11 extends in the thickness direction of the metal plate with respect to the metal plate. The terminal assembly 10 may be three-dimensionally formed by performing an etching process so as to be formed. However, since it is necessary to perform a long-time etching process on the metal plate in order to form the connection terminals 11 in the thickness direction of the metal plate, there is a possibility that the above-described over-etching may occur. However, in this embodiment, by preparing a thin metal plate and performing an etching process in the thickness direction of the metal plate, first, the plurality of connection terminals 11 are integrated integrally via the connecting portion 12. Then, by forming the terminal assembly 10 by bending each connection terminal 11, the time required for the etching process of the metal plate can be shortened, and the influence of overetching can be suppressed. . Therefore, the terminal assembly 10 in which the shape of the connection terminal 11 is accurately formed can be easily formed.
　また、金属板に打ち抜き加工を行い、打ち抜き加工された金属板を折り曲げ加工することにより端子集合体１０を形成する場合、エッチング処理の際に使用される高価な露光装置やエッチング処理設備が必要ないため、安価に端子集合体１０を形成することができる。 Further, when the terminal assembly 10 is formed by punching a metal plate and bending the punched metal plate, there is no need for an expensive exposure apparatus or etching processing equipment used for the etching process. Therefore, the terminal assembly 10 can be formed at a low cost.
　また、第１封止工程の後に、第１樹脂層１０３の表面および端子集合体１０の連結部１２を研磨または研削することで、不要な樹脂ならびに端子集合体１０の連結部１２を除去するため、第１樹脂層１０３の表面を平坦化することができるとともにモジュール１００を低背化することができる。また、連結部１２を除去することにより、接続端子１１の一方端部が第１樹脂層１０３の表面に露出するため、第１樹脂層１０３の表面に露出する接続端子１１の一方端部により外部接続用のランドを形成することができる。 Moreover, in order to remove unnecessary resin and the connection part 12 of the terminal assembly 10 by grind | polishing or grinding the surface of the 1st resin layer 103 and the connection part 12 of the terminal assembly 10 after a 1st sealing process. In addition, the surface of the first resin layer 103 can be flattened and the module 100 can be reduced in height. Further, by removing the connecting portion 12, one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, so that the one end of the connection terminal 11 exposed on the surface of the first resin layer 103 is externally exposed. A land for connection can be formed.
　また、上記したように、モジュール１００を個別に製造してもよいが、複数のモジュール１００の集合体を形成した後に、個々のモジュール１００に個片化することによりモジュール１００を製造してもよい。この場合、連結部１２が配線基板１０１の集合体を個片化するための分割線となるべき場所を覆うように端子集合体１０を実装し、モジュール１００を個片化する工程において、２列に形成されていた複数の接続端子１１を１列ずつ異なるモジュール１００の接続端子１１となるようにしてもよい。 Further, as described above, the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. . In this case, in the process of mounting the terminal assembly 10 so as to cover the place where the connecting portion 12 should be a dividing line for separating the assembly of the wiring boards 101 and separating the modules 100 into two rows, The plurality of connection terminals 11 formed in the above may be connected to the connection terminals 11 of the modules 100 that are different from each other by one row.
　＜第２実施形態＞
　本発明の第２実施形態にかかるモジュールについて、図３を参照して説明する。図３は本発明の第２実施形態にかかるモジュールを示す図である。 <Second Embodiment>
A module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a diagram showing a module according to the second embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第１実施形態と異なるのは、図３に示すように、モジュール１００ａの配線基板１０１の他方主面に電子部品１０２をさらに実装する（第２実装工程）とともに、それらの電子部品１０２を第２樹脂層１０４により封止する（第２封止工程）点である。その他の構成は上記した第１実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 The module according to this embodiment differs from the first embodiment described above in that the electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a as shown in FIG. 3 (second mounting step). In addition, the electronic component 102 is sealed with the second resin layer 104 (second sealing step). Since other configurations are the same as those in the first embodiment described above, description of the configurations is omitted by giving the same reference numerals.
　この場合、配線基板１０１の他方主面に電子部品１０２を実装することにより、モジュール１００ａに実装する電子部品１０２の実装密度を高めることができるので実用的である。 In this case, mounting the electronic components 102 on the other main surface of the wiring board 101 is practical because the mounting density of the electronic components 102 mounted on the module 100a can be increased.
　＜第３実施形態＞
　本発明の第３実施形態にかかるモジュールについて、図４を参照して説明する。図４は本発明の第３実施形態にかかるモジュールを示す図である。 <Third Embodiment>
A module according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing a module according to the third embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第２実施形態と異なるのは、図４に示すように、モジュール１００ｂの配線基板１０１の他方主面に設けられた第２樹脂層１０４に金属シールド層１０５が設けられている点である。その他の構成は上記した第１、第２実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。なお、金属シールド層１０５は、配線基板１０１に設けられたＧＮＤ用配線と電気的に接続されるのが望ましい。 The module according to this embodiment is different from the second embodiment described above, as shown in FIG. 4, in which the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100b. Is a point provided. Since other configurations are the same as those in the first and second embodiments described above, description of the configuration is omitted by giving the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
　このように構成すると、第２樹脂層１０４に金属シールド層１０５が設けられているため、特に、第２樹脂層１０４に封止される電子部品１０２に外部からノイズが伝搬するのが防止できるとともに、第２樹脂層１０４に封止される電子部品１０２から電磁波などが輻射するのが防止できる。 With this configuration, since the metal shield layer 105 is provided on the second resin layer 104, noise can be prevented from propagating from the outside to the electronic component 102 that is sealed in the second resin layer 104. In addition, electromagnetic waves and the like can be prevented from being radiated from the electronic component 102 sealed with the second resin layer 104.
　＜第４実施形態＞
　本発明の第４実施形態にかかるモジュールについて、図５を参照して説明する。図５は本発明の第４実施形態にかかるモジュールを示す図である。 <Fourth embodiment>
A module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a diagram showing a module according to the fourth embodiment of the present invention.
　この実施形態にかかるモジュールが、図３を参照して説明した第２実施形態と異なるのは、図５に示すように、モジュール１００ｃの配線基板１０１の他方主面に端子集合体１０を実装することにより（第２実装工程）、第２樹脂層１０４に接続端子１１による層間接続導体が設けられている点である。すなわち、上記した第１実施形態において配線基板１０１の一方主面について説明したのと同様に、接続端子１１の一方端部が連結部１２を介して連結されてなる端子集合体１０を配線基板１０１の他方主面に実装することにより、接続端子１１の他方端部が配線基板１０１に接続される。また、第２封止工程において配線基板１０１の他方主面に樹脂を充填し、その後、配線基板１０１の他方主面に実装した端子集合体１０の連結部１２を除去することによりモジュール１００ｃが形成される。 The module according to this embodiment differs from the second embodiment described with reference to FIG. 3 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100c as shown in FIG. Thus (second mounting step), the second resin layer 104 is provided with an interlayer connection conductor by the connection terminal 11. That is, in the same manner as described for the one main surface of the wiring board 101 in the first embodiment described above, the terminal assembly 10 in which one end portion of the connection terminal 11 is connected via the connecting portion 12 is connected to the wiring board 101. By mounting on the other main surface, the other end of the connection terminal 11 is connected to the wiring board 101. Further, in the second sealing step, the other main surface of the wiring substrate 101 is filled with resin, and then the connecting portion 12 of the terminal assembly 10 mounted on the other main surface of the wiring substrate 101 is removed to form the module 100c. Is done.
　また、この実施形態では、第２樹脂層１０４に設けられた接続端子１１により形成された層間接続導体に接続されるように、第２樹脂層１０４にさらに電子部品１０２を実装する。その他の構成は上記した第１～第３実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 In this embodiment, the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminal 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals.
　このように構成すると、配線基板１０１の他方主面に端子集合体１０をさらに実装することにより、第２樹脂層１０４に接続端子１１による層間接続導体を形成することができ、配線基板１０１の他方主面においても、第１実施形態と同様の効果を奏することができる。 With this configuration, by further mounting the terminal assembly 10 on the other main surface of the wiring board 101, an interlayer connection conductor using the connection terminals 11 can be formed on the second resin layer 104. The same effect as that of the first embodiment can be obtained on the main surface.
　また、第２封止工程により形成された第２樹脂層１０４の表面に、第２樹脂層１０４に設けられた接続端子１１に接続されるように電子部品１０２をさらに実装するため、モジュール１００ｃに実装する電子部品１０２の実装密度をさらに高めることができるので実用的である。 In addition, the electronic component 102 is further mounted on the surface of the second resin layer 104 formed by the second sealing step so as to be connected to the connection terminal 11 provided in the second resin layer 104. This is practical because the mounting density of the electronic components 102 to be mounted can be further increased.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能である。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.
　例えば、除去工程において、端子集合体１０の連結部１２を除去したことにより露出した接続端子１１の一方端部に、例えば、Ｎｉ／Ａｕめっきなどを施して、そこに半田などのバンプを形成してもよい。このようにすることで、モジュールを外部基板などと接続する際に、外部基板側に半田バンプを形成する必要がなくなり、実用的である。 For example, in the removing step, for example, Ni / Au plating is applied to one end portion of the connection terminal 11 exposed by removing the connecting portion 12 of the terminal assembly 10, and bumps such as solder are formed thereon. May be. By doing so, when connecting the module to an external substrate or the like, it is not necessary to form solder bumps on the external substrate side, which is practical.
　本発明は、モジュールの配線基板に柱状の接続端子を表面実装技術を用いて実装することにより、モジュールの層間接続導体を形成する技術に広く適用することができる。 The present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using a surface mounting technique.
　１０　　端子集合体
　１１　　接続端子
　１２　　連結部
　１００，１００ａ、１００ｂ，１００ｃ　　モジュール
　１０１　　配線基板
　１０２　　電子部品
　１０３　　第１樹脂層
　１０４　　第２樹脂層 DESCRIPTION OF SYMBOLS 10 Terminal assembly 11 Connection terminal 12 Connection part 100,100a, 100b, 100c Module 101 Wiring board 102 Electronic component 103 1st resin layer 104 2nd resin layer

Claims (6)

  1. 　層間接続導体を形成する柱状の接続端子および電子部品を配線基板上に実装し樹脂封止してなるモジュールの製造方法において、
    　金属板を加工することにより連結部を介して複数の前記接続端子の一方端部が連結されてなる端子集合体を準備する準備工程と、
    　前記配線基板の一方主面に、前記電子部品を実装するとともに前記接続端子の他方端部が前記配線基板に接続されるように前記端子集合体を実装する第１実装工程と、
    　前記電子部品および前記端子集合体を樹脂層により封止する第１封止工程と、
    　前記連結部を除去する除去工程と
    を備えることを特徴とするモジュールの製造方法。     In the method of manufacturing a module formed by mounting resin-sealed columnar connection terminals and electronic components that form interlayer connection conductors on a wiring board,
    A preparation step of preparing a terminal assembly in which one end portions of the plurality of connection terminals are connected via a connecting portion by processing a metal plate;
    A first mounting step of mounting the electronic component on one main surface of the wiring board and mounting the terminal assembly so that the other end of the connection terminal is connected to the wiring board;
    A first sealing step of sealing the electronic component and the terminal assembly with a resin layer;
    A module manufacturing method comprising: a removing step of removing the connecting portion.
  2. 　前記端子集合体は、前記連結部の両側にそれぞれ複数個の前記接続端子が連結され、前記連結部の両側の前記各接続端子が折り曲げ加工されて形成されることを特徴とする請求項１に記載のモジュールの製造方法。 2. The terminal assembly according to claim 1, wherein a plurality of the connection terminals are connected to both sides of the connection part, and the connection terminals on both sides of the connection part are bent. A manufacturing method of the module described.
  3. 　前記端子集合体は、前記金属板の打抜き加工の後、前記折り曲げ加工されて形成されることを特徴とする請求項２に記載のモジュールの製造方法。 3. The module manufacturing method according to claim 2, wherein the terminal assembly is formed by the bending after the punching of the metal plate.
  4. 　前記配線基板の他方主面に他の電子部品を実装する第２実装工程と、前記他の電子部品を樹脂層により封止する第２封止工程とをさらに備えることを特徴とする請求項１ないし３のいずれかに記載のモジュールの製造方法。 2. The method according to claim 1, further comprising: a second mounting step of mounting another electronic component on the other main surface of the wiring board; and a second sealing step of sealing the other electronic component with a resin layer. 4. A method for manufacturing a module according to any one of items 3 to 3.
  5. 　前記第２実装工程において、前記配線基板の他方主面に前記端子集合体の前記接続端子の他方端部が接続されるように前記端子集合体をさらに実装し、前記第２封止工程において、前記配線基板の他方主面に実装された前記他の電子部品および前記端子集合体を樹脂層により封止した後、前記端子集合体の前記連結部を除去することを特徴とする請求項４に記載のモジュールの製造方法。 In the second mounting step, the terminal assembly is further mounted such that the other end of the terminal assembly is connected to the other main surface of the wiring board. In the second sealing step, The said connection part of the said terminal assembly is removed after sealing the said other electronic component mounted in the other main surface of the said wiring board and the said terminal assembly with the resin layer, The said connection part is characterized by the above-mentioned. A manufacturing method of the module described.
  6. 　前記配線基板の他方主面に実装される前記端子集合体の前記連結部を除去した後の前記各接続端子のいずれかに接続されるように、電子部品を前記第２封止工程により形成された樹脂層に実装することを特徴とする請求項５に記載のモジュールの製造方法。
          An electronic component is formed by the second sealing step so as to be connected to one of the connection terminals after removing the connecting portion of the terminal assembly mounted on the other main surface of the wiring board. The module manufacturing method according to claim 5, wherein the module is mounted on a resin layer.
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014175133A1 (en) * 2013-04-23 2014-10-30 ピーエスフォー ルクスコ エスエイアールエル Semiconductor device and method for manufacturing same
WO2019138895A1 (en) * 2018-01-11 2019-07-18 株式会社村田製作所 Module with built-in components and method for manufacturing same
WO2020100849A1 (en) * 2018-11-12 2020-05-22 株式会社村田製作所 Mountable electronic component and electronic circuit module
WO2020202841A1 (en) * 2019-04-03 2020-10-08 株式会社村田製作所 Module, terminal assembly, and method for producing module
WO2021192739A1 (en) * 2020-03-27 2021-09-30 株式会社村田製作所 Module and method for manufacturing same
JP7325384B2 (en) 2020-07-22 2023-08-14 三菱電機株式会社 Semiconductor device manufacturing method
US11749589B2 (en) 2018-11-30 2023-09-05 Murata Manufacturing Co., Ltd. Module
WO2023210420A1 (en) * 2022-04-28 2023-11-02 住友ベークライト株式会社 Circuit board with heat sink and method for manufacturing same, and semiconductor device using same and method for manufacturing said semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163195A (en) * 1997-11-26 1999-06-18 Kyocera Corp Linkage lead pin
JP2000261152A (en) * 1999-03-11 2000-09-22 Fuji Xerox Co Ltd Printed wiring board assembly
JP2001094033A (en) * 1999-09-22 2001-04-06 Casio Comput Co Ltd Semiconductor chip module and method for manufacturing it
JP2008016729A (en) * 2006-07-07 2008-01-24 Kyushu Institute Of Technology Manufacturing method for semiconductor device with double-sided electrode structure
WO2008065896A1 (en) * 2006-11-28 2008-06-05 Kyushu Institute Of Technology Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101528B2 (en) * 1988-06-03 1994-12-12 住友特殊金属株式会社 Support for array lead pins
JP2002134653A (en) * 2000-10-23 2002-05-10 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP5573422B2 (en) * 2010-06-29 2014-08-20 富士通株式会社 Manufacturing method of semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163195A (en) * 1997-11-26 1999-06-18 Kyocera Corp Linkage lead pin
JP2000261152A (en) * 1999-03-11 2000-09-22 Fuji Xerox Co Ltd Printed wiring board assembly
JP2001094033A (en) * 1999-09-22 2001-04-06 Casio Comput Co Ltd Semiconductor chip module and method for manufacturing it
JP2008016729A (en) * 2006-07-07 2008-01-24 Kyushu Institute Of Technology Manufacturing method for semiconductor device with double-sided electrode structure
WO2008065896A1 (en) * 2006-11-28 2008-06-05 Kyushu Institute Of Technology Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US11682597B2 (en) 2018-01-11 2023-06-20 Murata Manufacturing Co., Ltd. Module with built-in component and method for manufacturing the same
JP7167945B2 (en) 2018-01-11 2022-11-09 株式会社村田製作所 MODULE WITH BUILT-IN COMPONENT AND METHOD OF MANUFACTURING THE SAME
JPWO2019138895A1 (en) * 2018-01-11 2020-12-10 株式会社村田製作所 Module with built-in parts and its manufacturing method
WO2019138895A1 (en) * 2018-01-11 2019-07-18 株式会社村田製作所 Module with built-in components and method for manufacturing same
WO2020100849A1 (en) * 2018-11-12 2020-05-22 株式会社村田製作所 Mountable electronic component and electronic circuit module
JP7156391B2 (en) 2018-11-12 2022-10-19 株式会社村田製作所 electronic circuit module
JPWO2020100849A1 (en) * 2018-11-12 2021-09-02 株式会社村田製作所 Mountable electronic components and electronic circuit modules
US11749589B2 (en) 2018-11-30 2023-09-05 Murata Manufacturing Co., Ltd. Module
WO2020202841A1 (en) * 2019-04-03 2020-10-08 株式会社村田製作所 Module, terminal assembly, and method for producing module
CN113544843A (en) * 2019-04-03 2021-10-22 株式会社村田制作所 Module, terminal assembly, and method for manufacturing module
JPWO2020202841A1 (en) * 2019-04-03 2021-12-02 株式会社村田製作所 Modules, terminal aggregates, and how to manufacture modules
JP7088409B2 (en) 2019-04-03 2022-06-21 株式会社村田製作所 Modules, terminal aggregates, and how to manufacture modules
US11895769B2 (en) 2019-04-03 2024-02-06 Murata Manufacturing Co., Ltd. Module, terminal assembly, and method for producing module
WO2021192739A1 (en) * 2020-03-27 2021-09-30 株式会社村田製作所 Module and method for manufacturing same
JP7325384B2 (en) 2020-07-22 2023-08-14 三菱電機株式会社 Semiconductor device manufacturing method
WO2023210420A1 (en) * 2022-04-28 2023-11-02 住友ベークライト株式会社 Circuit board with heat sink and method for manufacturing same, and semiconductor device using same and method for manufacturing said semiconductor device
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