WO2013024980A1 - Hot melt composition - Google Patents
Hot melt composition Download PDFInfo
- Publication number
- WO2013024980A1 WO2013024980A1 PCT/KR2012/006030 KR2012006030W WO2013024980A1 WO 2013024980 A1 WO2013024980 A1 WO 2013024980A1 KR 2012006030 W KR2012006030 W KR 2012006030W WO 2013024980 A1 WO2013024980 A1 WO 2013024980A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hot melt
- melt adhesive
- adhesive composition
- aliphatic polycarbonate
- oxide
- Prior art date
Links
- 0 CCC(C)OC(OC(C**C1)C1C(C)C=C)=O Chemical compound CCC(C)OC(OC(C**C1)C1C(C)C=C)=O 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/02—Aliphatic polycarbonates
- C08G64/0208—Aliphatic polycarbonates saturated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/20—General preparatory processes
- C08G64/32—General preparatory processes using carbon dioxide
- C08G64/34—General preparatory processes using carbon dioxide and cyclic ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
Definitions
- the present invention relates to a hot melt adhesive composition including aliphatic carbonate, and more particularly, to a hot melt adhesive composition having a lower softening point and a low melt viscosity to thereby be applicable at a relatively low temperature, having excellent adhesion, and being environmentally friendly because toxic materials are not discharged at the time of disposal.
- a hot melt adhesive is a solid material at room temperature; however, when applying heat thereto, it is melted into a fluid state such as liquid or the like, to have adhesion to a material to be adhered. When the melted fluid state of hot melt adhesive is cooled, it is recovered to a solid state to have cohesion again.
- the hot melted adhesive is made of a thermoplastic material, it is melted at high temperature to form a shape, which is then cooled to be rapidly adhered to the material.
- the hot melt adhesive mainly uses the Van der Waals force and a polarity combination on a surface thereof to adhere the adhesive and a material to be adhered to each other.
- the adhesive strength is influenced by an anchoring effect in which a liquid adhesive flows into a hole or an uneven portion to increase the adhesive strength.
- the hot melt adhesive needs to have enough flowability when being melted. For this, the hot melt adhesive needs to be melted at temperature as high as possible.
- An ordinary hot melt adhesive of the related art mainly employs ethylenevinylacetate (EVA), which has been widely used for adhesion of a paperboard box, a construction interior material, or the like.
- EVA ethylenevinylacetate
- the microwax included in the EVA serves to adjust melting viscosity.
- the hot melt adhesive having the enough flowability and the high adhesive strength at a low melting temperature provides a high energy efficiency at the time of application and do not need to use a solvent according to the adhesive strength, which is an advantage of the hot melt, such that it is environmentally friendly.
- a resin having pyrolysis temperature lower than that of the hot melt adhesive of the related art is used, a cost of treating waste after use may be decreased, which have economical and environmental benefits.
- An object of the present invention is to provide a hot melt adhesive capable of having high polarity to thereby improve adhesive strength to a paper, wood, a metal, or the like, and having a low pyrolysis temperature and not generating any harmful gas when combusted, to thereby lower energy consumption at the time of waste treatment and generate less air pollution, and thus be environmentally friendly.
- the present invention provides a hot melt adhesive composition including aliphatic polycarbonate.
- the hot melt adhesive composition according to the present invention pyrolysis temperature is low, such that harmful gas is not generated at the time of waste treatment, resulting in providing an excellent environmentally friendly product.
- the hot melt adhesive composition has a low melting temperature to thereby be usable at a low temperature and exhibit sufficient adhesive strength.
- the present invention provides a hot melt adhesive composition including the aliphatic polycarbonate, and the aliphatic polycarbonate is obtained by reacting carbon dioxide and at least one different epoxide compound.
- the epoxide compound are at least one selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy; (C4-C20)cycloalkyleneoxide substituted or unsubstituted with halogen or alkoxy; and (C8-C20)styreneoxide substituted or unsubstituted with halogen, alkoxy, alkyl, or aryl.
- alkoxy may include alkyloxy, aryloxy, aralkyloxy, and the like, and examples of the aryloxy may include phenoxy, biphenyloxy, naphthyloxy, and the like.
- the alkoxy, alkyl, and aryl may have a substituent selected from a halogen atom or an alkoxy group.
- aliphatic polycarbonate may be represented by Chemical Formula 1 below:
- epoxide compound according to the present invention may include ethylene oxide, propylene oxide, butene oxide, pentene oxide, hexene oxide, octene oxide, decene oxide, dodecene oxide, tetradecene oxide, hexadecene oxide, octadecene oxide, butadiene monoxide, 1,2-epoxide-7-octene, epifluorohydrine, epichlorohydrine, epibromohydrine, isopropyl glycidyl ether, butyl glycidyl ether, t-butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, cyclopentene oxide, cyclohexene oxide, cyclooctene oxide, cyclododecene oxide, alpha-pinene oxide, 2,3-ep
- An example of a method of producing the aliphatic polycarbonate may include a solution polymerization method or a bulk polymerization method. More specifically, polymerization may be performed by feeding carbon dioxide in the presence of the epoxide compound and a catalyst while using an organic solvent as a reactive medium.
- organic solvent aliphatic hydrocarbons such as pentane, octane, decane, cyclohexane, and the like; aromatic hydrocarbons such as benzene, toluene, xylene, and the like; and halogenated hydrocarbons such as chloromethane, methylenechloride, chloroform, carbontetrachloride, 1,1-dichloroethane, 1,2-dichloethane, ethylchloride, trichloroethane, 1-chloropropane, 2-chloropropane, 1-chlorobutane, 2-chlorobutane, 1-chloro-2-methylpropane, chlorobenzene, bromobenzene, and the like, may be used alone or in combination of two or more thereof.
- aliphatic hydrocarbons such as pentane, octane, decane, cyclohexane, and the like
- the pressure of carbon dioxide may be from normal pressure to 100 atm, and preferably, 5 atm to 30 atm.
- the polymerization temperature at the time of copolymerization may be 20 ⁇ 120°C, and preferably, 50 ⁇ 90°C. More preferably, the bulk polymerization method using a monomer itself as a solvent may be performed.
- the aliphatic polycarbonate is polyalkylene carbonate produced based on descriptions of Korean Patent Laid-Open Publication Nos. 2008-0015454, 2009-0090154, 2010-067593, and 2010-0013255 filed by the present applicants, and examples of the alkylene may include, but are not limited to, ethylene, propylene, 1-butylene, cyclohexene, alkylglycidylether, n-butyl, n-octyl, and the like.
- the aliphatic polycarbonate of Chemical Formula 1 above leads to a hot melt adhesive composition having a glass transition temperature (Tg) of 40 to 110°C.
- the hot melt adhesive composition according to the present invention has a softening point of 70 to 130°C. Hence, the hot melt adhesive composition according to the present invention has an excellent adhesive strength or viscosity despite the low softening point thereof, and thus, is favorably applied at a low temperature.
- the residual amount of a catalyst in the aliphatic polycarbonate used in the hot melt adhesive composition is 3 ppm or less.
- the residual amount of catalyst is minimized, such that the hot melt adhesive composition may be anticipated to have improved adhesive strength and thermal stability.
- the pyrolysis temperature is low, such that the harmful gas is not generated at the time of waste treatment, resulting in providing an excellent environmentally friendly product.
- the hot melt adhesive composition has the low melting temperature to thereby be usable at low temperature and exhibit sufficient adhesive strength.
- the hot melt adhesive composition is not easily pyrolyzed when being exposed to heat, due to the low residual amount of catalyst of 3 ppm or less.
- Polypropylene carbonate having molecular weight of 290,000 g/mol as a base resin was extruded by using a 5m-length twin extruder at a rate of 1.6 kg/h at 230°C to obtain polypropylene carbonate having a molecular weight of 50,000 g/mol.
- the low-molecular weight polypropylene carbonate and 10 parts by weight of propylene carbonate as a plasticizer were mixed together, and the mixture was then extruded by using a twin extruder at 190°C, to be produced into a pellet.
- the viscosity of the thus produced hot melt adhesive was 10 Pa.sec.
- the hot melt adhesive was melted at 190°C, and then applied between a PVC sheet and wood in order to adhere them.
- the adhesive strength measurement result is shown in Table 1 below.
- the hot melt adhesive compositions according to Examples 1 and 2 of the present invention had softening points of 100°C and 110°C, respectively, and thus, the low melting temperatures thereof were low, such that they were usable at a low temperature and exhibited sufficient adhesive strength.
- the hot melt adhesive composition according to the present invention can have a softening point lower than that of Comparative Example 1 and unreduced adhesive strength, thereby providing an environmentally friendly hot melt adhesive.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (8)
- A hot melt adhesive composition comprising aliphatic polycarbonate.
- The hot melt adhesive composition of claim 1, wherein the aliphatic polycarbonate is obtained by reacting carbon dioxide and at least one different epoxide compound.
- The hot melt adhesive composition of claim 2, wherein the epoxide compound is at least one selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy; (C4-C20)cycloalkyleneoxide substituted or unsubstituted with halogen or alkoxy; and (C8-C20)styreneoxide substituted or unsubstituted with halogen, alkoxy, alkyl, or aryl.
- The hot melt adhesive composition of claim 1 or 2, wherein the aliphatic polycarbonate is represented by Chemical Formula 1 below:[Chemical Formula 1][in Chemical Formula 1, m is an integer of 2 to 10; n is an integer of 1 to 3; R is hydrogen, (C1-C4)alkyl, or -CH2-O-R' (R' is (C1-C8)alkyl); and x:y is 5:95 to 99.99 :0.01.)].
- The hot melt adhesive composition of claim 2, wherein the aliphatic polycarbonate has a molecular weight of 50,000 g/mole, which is controlled by using a twin extruder at a rate of 1.0~2.0kg/h at 225~240℃, the twin extruder having an extruding path length of 4 to 6 M.
- The hot melt adhesive composition of claim 4, wherein the aliphatic polycarbonate has a glass transition temperature (Tg) of 40 to 110℃.
- The hot melt adhesive composition of any one of claims 1 to 6, wherein it has a softening point of 70 to 130℃.
- The hot melt adhesive composition of claim 7, wherein a residual amount of catalyst in the aliphatic polycarbonate is 3 ppm or less.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280040327.0A CN103842464A (en) | 2011-08-18 | 2012-07-27 | Hot melt composition |
JP2014525917A JP2014527565A (en) | 2011-08-18 | 2012-07-27 | Hot melt adhesive composition |
EP12823800.3A EP2744867A4 (en) | 2011-08-18 | 2012-07-27 | Hot melt composition |
US14/238,988 US20140206835A1 (en) | 2011-08-18 | 2012-07-27 | Hot Melt Composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0081965 | 2011-08-18 | ||
KR1020110081965A KR101392705B1 (en) | 2011-08-18 | 2011-08-18 | Hot melt composition |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013024980A1 true WO2013024980A1 (en) | 2013-02-21 |
Family
ID=47715269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/006030 WO2013024980A1 (en) | 2011-08-18 | 2012-07-27 | Hot melt composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140206835A1 (en) |
EP (1) | EP2744867A4 (en) |
JP (1) | JP2014527565A (en) |
KR (1) | KR101392705B1 (en) |
CN (1) | CN103842464A (en) |
WO (1) | WO2013024980A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2949718A4 (en) * | 2013-09-10 | 2016-10-12 | Lg Chemical Ltd | Resin composition comprising polyalkylene carbonate and self-adhesive film produced therefrom |
WO2017194445A1 (en) * | 2016-05-09 | 2017-11-16 | Repsol, S.A. | Adhesive formulations with improved thermal and bonding properties |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104449521B (en) * | 2014-12-23 | 2017-08-25 | 中国科学院长春应用化学研究所 | A kind of hot-melt adhesive composition and preparation method thereof |
KR102309698B1 (en) | 2020-01-16 | 2021-10-07 | 주식회사 이레A.T (에이티) | Hot melt adhesive with excellent durability and adhesion |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4833036A (en) * | 1988-03-21 | 1989-05-23 | Arco Chemical Technology, Inc. | Polyalkylene carbonate hot melt adhesive |
US20040171721A1 (en) * | 2002-12-16 | 2004-09-02 | Esemplare Pascal E. | Stabilizing polyalkylene carbonate resins |
WO2010060038A1 (en) * | 2008-11-23 | 2010-05-27 | Novomer, Inc. | Polycarbonates as adhesives in electronics manufacturing |
JP2011122059A (en) * | 2009-12-10 | 2011-06-23 | Mitsubishi Chemicals Corp | Resin composition and film, plate and injection molded product obtained by molding the same |
EP2351804A1 (en) * | 2009-06-15 | 2011-08-03 | Sumitomo Bakelite Company Limited | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
KR20110091853A (en) * | 2008-11-05 | 2011-08-16 | 도꾸리쯔교세이호진 상교기쥬쯔 소고겡뀨죠 | Aliphatic polycarbonate complex derived from carbon dioxide, and process for producing same |
Family Cites Families (8)
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US4142021A (en) * | 1977-06-01 | 1979-02-27 | Air Products And Chemicals, Inc. | Oxygen barrier laminate films including a polyalkylene carbonate adhesive |
CN1786045A (en) * | 2005-11-30 | 2006-06-14 | 中山大学 | Poly methyl ethylene cyclo hexamethylene carbonate material and its preparation method |
ES2517870T3 (en) * | 2007-05-04 | 2014-11-04 | Sk Innovation Co., Ltd. | Polycarbonate production procedure and coordination complex used for it |
KR100981270B1 (en) * | 2008-02-20 | 2010-09-10 | 에스케이에너지 주식회사 | Method for recovering catalysts from a copolymerization process |
JP5676461B2 (en) * | 2009-05-22 | 2015-02-25 | エルジー・ケム・リミテッド | Resin composition for disposable resin molded article and resin molded article for disposable |
KR20100136006A (en) * | 2009-06-18 | 2010-12-28 | 에스케이에너지 주식회사 | Polymeric thermoplastic compositions having excellent resistance to moisture and oxygen transmission and sheet which are made of these polymeric thermoplastic compositions |
KR101814832B1 (en) * | 2009-12-10 | 2018-01-30 | 미쯔비시 케미컬 주식회사 | Polycarbonate resin composition and molded body, film, plate and injection-molded article obtained by molding same |
CN101906208B (en) * | 2010-07-30 | 2012-02-29 | 中山大学 | Methyl ethylene carbonic ester block copolymer and preparation method thereof |
-
2011
- 2011-08-18 KR KR1020110081965A patent/KR101392705B1/en active IP Right Grant
-
2012
- 2012-07-27 JP JP2014525917A patent/JP2014527565A/en active Pending
- 2012-07-27 CN CN201280040327.0A patent/CN103842464A/en active Pending
- 2012-07-27 US US14/238,988 patent/US20140206835A1/en not_active Abandoned
- 2012-07-27 EP EP12823800.3A patent/EP2744867A4/en not_active Withdrawn
- 2012-07-27 WO PCT/KR2012/006030 patent/WO2013024980A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4833036A (en) * | 1988-03-21 | 1989-05-23 | Arco Chemical Technology, Inc. | Polyalkylene carbonate hot melt adhesive |
US20040171721A1 (en) * | 2002-12-16 | 2004-09-02 | Esemplare Pascal E. | Stabilizing polyalkylene carbonate resins |
KR20110091853A (en) * | 2008-11-05 | 2011-08-16 | 도꾸리쯔교세이호진 상교기쥬쯔 소고겡뀨죠 | Aliphatic polycarbonate complex derived from carbon dioxide, and process for producing same |
WO2010060038A1 (en) * | 2008-11-23 | 2010-05-27 | Novomer, Inc. | Polycarbonates as adhesives in electronics manufacturing |
EP2351804A1 (en) * | 2009-06-15 | 2011-08-03 | Sumitomo Bakelite Company Limited | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
JP2011122059A (en) * | 2009-12-10 | 2011-06-23 | Mitsubishi Chemicals Corp | Resin composition and film, plate and injection molded product obtained by molding the same |
Non-Patent Citations (1)
Title |
---|
See also references of EP2744867A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2949718A4 (en) * | 2013-09-10 | 2016-10-12 | Lg Chemical Ltd | Resin composition comprising polyalkylene carbonate and self-adhesive film produced therefrom |
JP2016532756A (en) * | 2013-09-10 | 2016-10-20 | エルジー・ケム・リミテッド | Resin composition containing polyalkylene carbonate and self-adhesive film produced therefrom |
WO2017194445A1 (en) * | 2016-05-09 | 2017-11-16 | Repsol, S.A. | Adhesive formulations with improved thermal and bonding properties |
CN109072035A (en) * | 2016-05-09 | 2018-12-21 | 雷普索尔公司 | The adhesive formulation of heat and bond properties with improvement |
Also Published As
Publication number | Publication date |
---|---|
KR20130019781A (en) | 2013-02-27 |
EP2744867A4 (en) | 2015-03-25 |
JP2014527565A (en) | 2014-10-16 |
KR101392705B1 (en) | 2014-05-12 |
US20140206835A1 (en) | 2014-07-24 |
EP2744867A1 (en) | 2014-06-25 |
CN103842464A (en) | 2014-06-04 |
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