WO2013018247A1 - Tdiセンサ、撮像装置、部品実装装置、部品試験装置および基板検査装置 - Google Patents
Tdiセンサ、撮像装置、部品実装装置、部品試験装置および基板検査装置 Download PDFInfo
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- WO2013018247A1 WO2013018247A1 PCT/JP2012/001419 JP2012001419W WO2013018247A1 WO 2013018247 A1 WO2013018247 A1 WO 2013018247A1 JP 2012001419 W JP2012001419 W JP 2012001419W WO 2013018247 A1 WO2013018247 A1 WO 2013018247A1
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- image
- imaging
- component
- tdi sensor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Definitions
- the present invention relates to a TDI sensor, an image pickup apparatus including the sensor, a component mounting apparatus including the image pickup apparatus, a component test apparatus, and a board inspection apparatus.
- a component mounting apparatus that takes out a component from a component supply unit by a mounting head and mounts it on a mounting point on a substrate.
- the component mounting apparatus includes a component imaging device. This is because the component held by the mounting head is imaged before the component is mounted on the substrate to recognize the component holding state by the mounting head and correct the mounting posture of the component.
- Patent Document 1 discloses a component mounting apparatus of this type.
- the component mounting apparatus disclosed in Patent Document 1 includes a component recognition camera with a built-in line sensor, and a component imaging device including a plurality of illumination units, and the components are relative to the camera at a predetermined speed.
- the component is imaged by irradiating the component with any of the illumination units while being moved.
- the line images having different illumination conditions are alternately arranged twice.
- the line image of is acquired.
- two component images having different illumination conditions can be simultaneously acquired by passing the component once through the camera.
- the present invention has been made in view of such circumstances, and it is possible to acquire a plurality of types of component images satisfactorily and at high speed by moving the components once relative to the camera. It aims at providing the technology to do.
- the TDI sensor performs a line image capturing operation at a predetermined timing, and outputs a line image that has been exposed a plurality of times (integrated exposure) as an image for each imaging line. Therefore, it has been considered to acquire a component image while relatively moving a component at high speed by using a component recognition camera including a TDI sensor.
- the TDI sensor outputs a line image that has been subjected to integral exposure for each imaging line, it is difficult to obtain line images with different illumination conditions for each imaging line simply by switching the illumination conditions during relative movement of components. It is.
- the TDI sensor according to the present invention is a TDI sensor that performs a line image capturing operation at a predetermined timing and outputs a line image that has been exposed a plurality of times as an image for each imaging line.
- a light receiving unit including a charge holding column having a plurality of charge holding units arranged, wherein one pixel column and one or more of the charge holding columns are alternately arranged in a second direction orthogonal to the first direction;
- the charge held by the image pickup device of the pixel column and the charge holding unit of the charge holding column is sequentially transferred to adjacent columns in units of columns, and is finally accumulated as the line image signal by the transfer.
- a transfer unit for outputting a signal corresponding to the charge, but with a.
- the illumination condition is switched while the target object moves relative to the TDI sensor, so that a plurality of images with different lighting conditions are acquired as the target object image during the relative movement.
- a TDI sensor of the present invention in which pixel columns and charge holding columns are alternately arranged is applied.
- two images with different illumination conditions can be acquired. That is, as the object moves, the image sensor of each pixel column is exposed under the first illumination condition, so that a line image (referred to as a first illumination image) is captured by each pixel column.
- Line images (that is, electric charges) of these pixel columns are transferred to and held in the adjacent charge holding columns before the next exposure.
- the image sensor of each pixel column is exposed under the second illumination condition, whereby a line image (referred to as a second illumination image) is captured by each pixel column.
- the second illumination image of each pixel column is transferred to the adjacent charge holding unit, and the first illumination image of each charge holding unit is transferred to the adjacent pixel column.
- the first illumination image is re-exposed (charge is added) in each pixel row.
- a line image of a specific imaging line of the object which is a line image that is exposed a plurality of times under the first illumination condition, and a line image of a subsequent imaging line that is the second illumination.
- Line images that have been exposed multiple times under certain conditions are output alternately. Therefore, it is possible to acquire a plurality of types of component images satisfactorily and at high speed by moving the object once relative to the TDI sensor.
- FIG. 2 is a side view of a head unit schematically showing an imaging unit mounted on the component mounting apparatus shown in FIG. 1.
- A is the figure which showed typically the structure of the TDI sensor
- (b) is a figure explaining the accumulation state of the electric charge in each pixel row
- It is an electrical block diagram of a camera. It is a block diagram which shows the main electrical structures of the component mounting apparatus shown in FIG. It is a timing chart which shows each timing of illumination by an imaging unit, exposure (imaging), and image (charge) transfer.
- FIG. 1 is a plan view and FIG. 2 is a front view.
- FIGS. 1 and 2 and the drawings described later XYZ rectangular coordinates are shown in order to clarify the directional relationship between the drawings.
- the component mounting apparatus includes a base 1, a board transport mechanism 2 that is disposed on the base 1 and transports a board 3 such as a printed wiring board (PWB) in the X direction, and a component supply unit 4.
- the substrate transport mechanism 2 includes a pair of conveyors 2 a and 2 a that transport the substrate 3 on the base 1. These conveyors 2a and 2a receive the board 3 from the right side of the figure, convey it to a predetermined mounting work position (position shown in the figure), and hold the board 3 by a holding device (not shown). Then, after the mounting operation, the substrate 3 is carried out to the left side of the figure.
- the component supply unit 4 is disposed on both sides (Y direction both sides) of the substrate transport mechanism 2.
- a plurality of tape feeders 4 a arranged in the X direction along the substrate transport mechanism 2 are arranged.
- These tape feeders 4a are provided with reels around which small chip components such as ICs, transistors, capacitors, etc. are stored and wound.
- the tape feeders 4a are provided in the vicinity of the substrate transport mechanism 2 while intermittently delivering the tapes from the reels. A part is supplied to a predetermined part supply position.
- One or both of these component supply units 4 have a tray on which package type components such as QFP (Quad Flat Package) and BGA (Ball Grid Array) are arranged and placed instead of the tape feeder 4a. It may be set.
- the head unit 5 takes out components from the component supply unit 4 and mounts them on the substrate 3, and is disposed above the substrate transport mechanism 2, the component supply unit 4, and the like.
- the head unit 5 is movable in the X direction and the Y direction within a certain area by the head unit driving mechanism.
- the head unit driving mechanism is fixed to a Y-axis servo motor 10 and a pair of elevated frames 7 provided on the base 1, and extends to the Y-direction in parallel with each other.
- a unit support member 11 that is supported and extends in the X direction, and a ball screw shaft 9 that is screwed into the unit support member 11 and driven by a Y-axis servo motor 10 are included.
- the X-axis servo motor 15, the fixed rail 13 fixed to the unit support member 11 and supporting the head unit 5 so as to be movable in the X direction, and the head unit 5 are screwed and inserted to drive the X-axis servo motor 15.
- a ball screw shaft 14 driven as a source In other words, the head unit drive mechanism moves the head unit 5 in the X direction via the ball screw shaft 14 by driving the X axis servo motor 15, and also moves the unit via the ball screw shaft 9 by driving the Y axis servo motor 10.
- the support member 11 is moved in the Y direction.
- the head unit 5 is moved in the X direction and the Y direction within a certain region.
- the head unit 5 includes a plurality of mounting heads 16 each having a component suction nozzle 16a at the tip, and the mounting heads 16 are moved up and down (moved in the Z direction) with respect to the head unit 5 and rotated around the nozzle center axis. And a head drive mechanism using a servo motor for driving (rotation in the R direction in FIGS. 2 and 3) as a drive source.
- the total of six mounting heads 16 are mounted on the head unit 5 in a state of being arranged in a line in the X direction.
- the nozzle 16a of each mounting head 16 can communicate with any one of a negative pressure generating device, a positive pressure generating device, and the atmosphere via an electric switching valve. That is, by supplying a negative pressure to the nozzle 16a, the component 16 can be sucked and held by the nozzle 16a, and thereafter, when the positive pressure is supplied, the sucking and holding of the component is released.
- the head unit 5 includes the imaging unit 6 for recognizing the component C attracted and held by each mounting head 16, a unit driving mechanism for driving the imaging unit 6, and a substrate recognition camera 17 for recognizing the substrate 3. Etc. are installed.
- the substrate recognition camera 17 is fixed to one end of the head unit 5 in the X direction (the left end in the examples of FIGS. 1 and 2).
- This board recognition camera 17 images various marks written on the board 3 in order to specify the position of the board 3 positioned at the mounting work position and the contents of the mounting work.
- the substrate recognition camera 17 is integrally provided with a camera body including an area sensor and a condenser lens and an illuminating device, and the substrate 3 is irradiated with illumination light from above and the reflected light is received by the area sensor. Then, the mark is imaged.
- the imaging unit 6 includes a camera 21 that captures an image of the component C, an illumination device 22 that provides imaging illumination to the component C (corresponding to illumination means of the present invention), and the camera 21 Includes a reflection mirror 29 that reflects the image of the component C, a casing 20 that holds these together, and the like.
- the camera 21 includes a TDI (Time Delay Integration) sensor 26 and a condensing lens 28, and is arranged substantially horizontally.
- the camera 21 images the component C by forming an image of reflected light from the component C by the imaging illumination on the light receiving unit 40A (shown in FIG. 4) of the TDI sensor 26 by the condenser lens 28. Details of the camera 21 including the TDI sensor 26 will be described later.
- the lighting device 22 is assembled to the casing 20 so as to be disposed below the mounting head 16 disposed at a predetermined component recognition height position.
- the illumination device 22 includes a first illumination unit 22a that illuminates the component C from below, and a second illumination unit 22b that illuminates the component C from the side.
- the first illumination unit 22a includes a plurality of LEDs 23 arranged in an upward direction, and illuminates illumination light from below the component C sucked and held by the mounting head 16 by turning on the LEDs 23.
- the 2nd illumination part 22b is arrange
- the second illumination unit 22b includes a plurality of LEDs 24 that face inward in the Y direction. By turning on these LEDs 24, the illumination light is irradiated to the part C from the side and slightly obliquely below. To do.
- the reflection mirror 29 is disposed at a position facing the mounting head 16. Thereby, the direction of the reflected light from the component C is changed to a direction close to the horizontal by the reflection mirror 29 and is incident on the camera 21.
- the LED 23 of the first illumination unit 22 a is disposed so as to surround the reflection mirror 29.
- the unit driving mechanism for driving the imaging unit 6 is fixed to the bottom frame 5a of the head unit 5 and fixed rails 32 and 32 that support the casing 20 so as to be movable in the X-axis direction, and a linear motor as a driving source. 34 and a linear encoder 36.
- the linear motor 34 is a permanent magnet 35a as a stator fixed to the bottom frame 5a along the X direction, and a mover fixed to the casing 20 so as to face the permanent magnet 35a with a predetermined gap.
- the coil portion 35b is applied to the casing 20 by energization of the coil portion 35b. With this configuration, the imaging unit 6 moves in the X direction along the fixed rails 32 and 32.
- the linear encoder 36 includes a magnetic scale 37a fixed to the bottom frame 5a along the X direction, and a magnetic sensor 37b such as an MR sensor or a Hall sensor fixed to the casing 20 so as to face the magnetic scale 37a. Including.
- the magnetic scale 37a is magnetically recorded with a scale, and the magnetic sensor 37b detects the scale and outputs a signal corresponding to the scale to the control device 60 described later.
- the imaging unit 6 is configured so that the camera 21 can sequentially capture the components C held by the mounting heads 16 while moving in the X direction by driving the linear motor 34. At this time, the position and moving speed of the imaging unit 6 are controlled by the control device 60 described later based on the output signal from the linear encoder 36.
- FIG. 4A schematically shows the configuration of the TDI sensor 26 provided in the camera 21.
- the TDI sensor 26 includes a light receiving unit 40A and a transfer unit 40B.
- the light receiving unit 40A includes a plurality of pixel arrays 41 in which a plurality of imaging elements 42 that generate and hold charges according to the amount of received light are arranged in a line in the first direction, and the pixel arrays 41 are orthogonal to the first direction. They are arranged in two directions.
- the number of pixel columns 41 included in the light receiving unit 40A is an odd number. In the illustrated example, the number of pixel columns 41 is seven for convenience, but actually, the number of pixel columns 41 and the number of pixels of each pixel column 41 (the number of image sensors 42) can provide a desired resolution. For example, the number of pixel columns is set to around 150 columns.
- the transfer unit 40B includes a plurality of register columns 45 respectively corresponding to the pixel columns 41.
- Each register column 45 includes a plurality of registers 44 that form a pair with each imaging element 42 of the corresponding pixel column 41.
- Each register 44 has a function of reading the charge of the paired image pickup elements 42 and sequentially transferring the read charges to the image pickup elements 42 of the adjacent pixel columns 41.
- the charge transfer direction can be switched, and in the drawing, an image in which the read charge is transferred to the image sensor 42 of the pixel column 41 adjacent in the second direction (+) side is indicated by a white arrow.
- the odd-numbered (odd row) counted from one end side in the arrangement direction is a pixel row 41 that can be received by each image sensor 42, and is an even number.
- the second (even number column) is a pixel column 41 in which each image sensor 42 cannot receive light by forming a light shielding filter 43 (corresponding to the light shielding portion of the present invention) on the surface of the image sensor 42.
- each image sensor 42 belonging to the even-numbered pixel column 41 does not generate charges by light reception, and has only a function of holding charges transferred from the image sensor 42 in the adjacent pixel column 41.
- the pixel column 41 belonging to the even-numbered column corresponds to the charge holding column of the present invention
- the image sensor 42 on which the light shielding filter 43 is formed corresponds to the charge holding unit of the present invention.
- each of the image sensors 42 belonging to the odd-numbered pixel columns 41 has a function of adding and holding charges generated by light reception to the charges transferred from the image sensors 42 of the adjacent pixel columns 41.
- the camera 21 is mounted on the imaging unit 6 so that the arrangement direction (second direction) of the pixel columns 41 of the TDI sensor 26 is parallel to the X direction. Thereby, when the imaging unit 6 moves in the X direction, charges corresponding to the reflected light from the component C are generated in the imaging elements 42 of the odd-numbered pixel columns 41 among the pixel columns 41 of the light receiving unit 40A. That is, the line images for each imaging line of the component C are sequentially captured by the imaging elements 42 of the odd-numbered pixel columns 41.
- the imaging operation of the component C by the camera 21 will be described by taking an example in which the imaging unit 6 captures the component C while moving from the (+) side to the ( ⁇ ) side in the X direction.
- the imaging of the part C is performed at a constant imaging timing synchronized with the movement of the imaging unit 6 under the illumination of the illumination device 22 in a state where the moving speed of the imaging unit 6 is kept constant by the control of the control device 60. This is performed by exposing the image sensor 42 of each pixel column 41. In this case, the 1st illumination part 22a and the 2nd illumination part 22b are lighted by turns.
- exposure is performed at a timing at which the imaging unit 6 moves by the arrangement pitch p of the pixel row 41 (a timing at which the component C moves by the arrangement pitch p relative to the imaging unit 6).
- a line image for one imaging line of the component C is captured by the odd-numbered pixel columns 41 in which the light shielding filter 43 is not formed. That is, as a result of exposure, reflected light from the component C enters the image sensor 42 of each pixel column 41, so that charges corresponding to the amount of received light are generated in each image sensor 42.
- the timing at which the exposure is first performed when the position of the distance L) reaches the position opposite to the first pixel row 41 via the reflection mirror 29 is defined as the first timing.
- the charge (line image of the part at the distance L of the part C) generated in the first (first column) pixel column 41 of the pixel columns 41 of the light receiving unit 40A is a register corresponding to the pixel column 41.
- the data is read out to the register 44 in the column 45 and further transferred to each image sensor 42 in the adjacent second pixel column 41.
- the imaging unit 6 moves by the arrangement pitch p
- the part distance (L + p) reaches the position facing the first pixel row 41 via the reflection mirror 29, and the timing (second)
- the image sensor 42 of each pixel column 41 is exposed by turning on the second illumination unit 22b.
- each image pickup element 42 in the second pixel row 41 transfers and holds charges (line images at the first timing of the part L at the distance L of the component C) due to exposure at the first timing.
- Each imaging element 42 in the eye pixel row 41 holds a charge (a line image of a part having a distance (L + p) of the component C) due to exposure at the second timing.
- the imaging unit 6 When the imaging unit 6 further moves, the charges (line image) of the second pixel column 41 are read out and adjacent to the register 44 of the register column 45 corresponding to the pixel column 41 in synchronization with this movement. The image is transferred to each image sensor 42 in the third pixel row 41.
- the imaging unit 6 moves by the arrangement pitch p, the part of the part C having the distance (L + 2p) reaches the position facing the first pixel row 41 via the reflection mirror 29, while the part C The part of the distance L reaches the position opposite to the third pixel row 41 via the reflection mirror 29, and at that timing (third timing), an imaging operation is performed by turning on the first illumination unit 22a.
- Charges corresponding to the amount of received light are generated in each imaging element 42 of the third pixel row 41. That is, the charge transferred from the second pixel column 41 to the third pixel column 41 (the first timing line image of the part at the distance L of the component C) is added to the third pixel column. Charges newly generated by the 41 image sensors 42 (a third timing line image of the part C at the distance L) are added. That is, in the third pixel row 41, the charge at the first timing (exposure by the first illuminating unit 22a) and the exposure at the third timing (first illuminating unit 22a) for the part of the distance C of the component C are performed.
- the image sensor 42 of the pixel column 41 in the second column holds charges due to the exposure at the second timing (exposure by the second illumination unit 22a) for the part of the distance (L + p) of the component C.
- the image sensor 42 of the eye pixel row 41 holds the charge due to the exposure at the third timing for the part (L + 2p) of the part C.
- the same operation is repeatedly performed in the pixel columns 41, 41..., So that as shown in FIG. Charges are sequentially added and accumulated at 41.
- the line image of the same imaging line of the component C is repeatedly exposed in the odd-numbered pixel columns 41.
- the charge for one imaging line exposed by lighting of the first illumination unit 22a at the timing of odd-numbered imaging and the lighting of the second illumination unit 22a at the timing of even-numbered imaging accumulated in this way.
- the charge for one imaging line exposed by the above is alternately read out from the pixel column 41 on the X direction (+) side end to the corresponding register column 45 and accumulated for one imaging line in each part of the component C.
- the imaging unit 6 moves from the (+) side in the X direction to the ( ⁇ ) side.
- the imaging unit 6 moves from the ( ⁇ ) side in the X direction to the (+) side.
- charges are stored and transferred with the pixel column 41 at the end on the (+) side in the X direction as the first (first column) pixel column 41, and the line image of one imaging line of the component C is obtained.
- Corresponding charges are output from the register column 45 corresponding to the pixel column 41 at the end in the X direction ( ⁇ ) side.
- the TDI sensor 26 includes two output units 26a and 26b (see FIG. 5) corresponding to the charge transfer direction as the signal output unit.
- FIG. 5 is a diagram showing the main electrical configuration of the camera 21.
- the camera 21 includes a camera control unit 50, an analog front end (AFE) 52, a data transmitter 53, a clock driver 54 and the like in addition to the TDI sensor 26.
- AFE analog front end
- the camera control unit 50 comprehensively controls the operation of the camera 21 based on a control signal received from the control device 60 described later via the image capturing device 68.
- the TDI sensor 26 includes two output units 26a and 26b for outputting image data in accordance with the scanning direction (the moving direction of the imaging unit 6 with respect to the part C), but the camera control unit 50 is described later.
- the clock signal from the clock driver 54 the charge transfer direction in the TDI sensor 26 is switched according to the scanning direction, and image data is output from one of the two output units 26a and 26b.
- the analog front end 52 sets the camera gain by a control signal from the camera control unit 50, adjusts the output value of the image data based on the camera gain, and then converts the image data (analog data) into digital image data.
- a correlated square sampler CDS: Correlated Double Sampler
- VGA Variable Gain Amplifier
- ADC Analog Digital Converter
- the data transmitter 53 transmits / receives a signal to / from an external device.
- the data transmitter 53 transmits the image data received from the analog front end 52 to the control device 60 to be described later via the image capture device 68, and sends a signal from the control device 60 via the image capture device 68.
- the image capturing device 68 has a function as an interface that converts signals transmitted between the camera 21 and the control device 60 into signals that can be read from each other.
- the clock driver 54 outputs a clock signal to the TDI sensor 26 based on the control signal corresponding to the scanning direction input from the camera control unit 50, and the imaging (exposure) timing by the TDI sensor 26 and the charge ( (Line image) transfer timing and transfer direction.
- the clock signal includes information corresponding to the scanning direction, and the TDI sensor 26 switches the charge accumulation and transfer direction based on this information.
- This component mounting apparatus further includes a control device 60 as shown in FIG. 6 for controlling the operation thereof.
- the control device 60 drives the main control unit 61 that comprehensively controls the overall operation of the component mounting apparatus, the storage unit 62 that stores various processing programs and various data, the head unit 5, the imaging unit 6, and the like.
- a drive control unit 64 for controlling, an image processing unit 65, and an illumination control unit 66 are provided, and these are connected via a bus 63 so that signals can be exchanged with each other.
- the main control unit 61 controls the drive control unit 64, the image processing unit 65, the illumination control unit 66, the camera 21, and the like according to the mounting program stored in the storage unit 62, and the component C to be attracted to the mounting head 16.
- Image recognition and various image processing and arithmetic processing for the image recognition are performed, and the image data is stored in the storage unit 62.
- two types of images with different illumination conditions specifically, while the imaging unit 6 is scanned (relatively moved) only once with respect to the component C attracted to the mounting head 16.
- the first component image in which only the first illumination unit 22a is lit and the second component image in which only the second illumination unit 22b is lit are acquired, and the mounting head 16 is based on the first component image and the second component image.
- the movement speed of the imaging unit 6 is controlled so as to recognize the holding state of the part C, and the imaging timing of the part C and the lighting device 22 are determined based on the timing chart (FIG. 7) stored in the storage unit 62. Control lighting timing.
- the imaging unit 6, the unit driving mechanism, the control device 60, and the like correspond to the imaging device of the present invention, of which the unit driving mechanism corresponds to the moving means of the imaging device, the main control unit 61, the illumination control The unit 66, the camera control unit 50, and the like correspond to the imaging control means of the present invention.
- the head unit driving mechanism and the control device 60 correspond to the transfer means of the present invention.
- the head unit 5 moves onto the component supply unit 4, and the components are sucked and held by each mounting head 16 (nozzle 16a).
- the imaging unit 6 is disposed at a predetermined standby position outside the arrangement region of the mounting heads 16, whereby the component picking operation by the mounting heads 16 is performed without any trouble.
- the positions on both sides of the mounting area of the mounting head 16 in the X direction are the standby positions (the (+) side in the X direction is the first standby position, and the ( ⁇ ) side is the second standby position).
- the imaging unit 6 is disposed at the first standby position.
- each component C is imaged, and the suction state of the component C held by each mounting head 16 is recognized based on the image data.
- each mounting head 16 is disposed at the component recognition height position above the region through which the imaging unit 6 passes, thereby moving the imaging unit 6 and the component C. Imaging is performed without hindrance.
- the head unit 5 is installed on the board after the component C is registered as a disposal target. 3 and the components C other than the object to be discarded are sequentially mounted on the substrate 3. At this time, by controlling the position of the head unit 5 and the rotation angle of the mounting head 16 according to the recognition result of the component C, the component is appropriately mounted at each mounting position on the substrate 3.
- the head unit 5 moves onto a component disposal box (not shown) and discards the component C to be discarded.
- a component disposal box not shown
- FIG. 7 is a timing chart showing control of the camera 21 and the lighting device 22.
- the main control unit 61 When the imaging unit 6 starts moving, the main control unit 61 outputs an imaging signal to the camera 21 (camera control unit 50) and the illumination control unit 66 at a predetermined timing based on an output signal from the linear encoder 36. Specifically, the imaging unit 6 repeatedly outputs an imaging signal at a timing when the imaging unit 6 moves by the arrangement pitch p of the pixel row 41 of the TDI sensor 26.
- the illuminating device 22 turns on the illuminating device 22 for a predetermined time based on the input of the imaging signal.
- the camera control unit 50 outputs a control signal to the clock driver 54, and causes the TDI sensor 26 to perform an imaging operation by causing the clock driver 54 to output a clock signal to the TDI sensor 26.
- the image sensor 42 of each pixel column 41 is exposed for a predetermined time, and after the exposure is completed, the charge generated in each pixel column 41 is transferred to the adjacent pixel column 41.
- the lighting device 22 switches between the first lighting unit 22a and the second lighting unit 22b each time the imaging signal is input from the main control unit 61. As described above, the first illumination unit 22a and the second illumination unit 22b are switched for each input of the imaging signal, so that the first component image and the second component are scanned while the imaging unit 6 scans the component C once. A part image is acquired.
- the first illumination unit 22a is first turned on, whereby the light received by the TDI sensor 26 as shown in FIG.
- the image sensor 42 of each odd pixel column 41 where the light shielding filter 43 is not formed is exposed, and a charge corresponding to the amount of received light is generated in each image sensor 42.
- the charges generated in these pixel columns 41 are transferred to the adjacent pixel columns 41 (even-numbered pixel columns 41) at a fixed timing. That is, a line image obtained by illumination of the first illumination unit 22a is captured by each odd-numbered pixel column 41, and the line image is transferred to the adjacent even-numbered pixel column 41.
- circled number 1 represents the line image obtained by illumination of the first illumination unit 22a and the circled number 2.
- FIGS. 8B and 8C Respectively show line images by illumination of the second illumination unit 22a (in FIGS. 8B and 8C, the reference numerals of the respective parts of the TDI sensor 26 are omitted for convenience).
- the second illumination unit 22b When the next imaging signal is output as the imaging unit 6 moves, the second illumination unit 22b is turned on, and the imaging elements 42 of the odd-numbered pixel columns 41 are exposed as shown in FIG. 8B. As a result, charges corresponding to the amount of received light are generated in each imaging element 42. That is, a line image obtained by illumination of the second illumination unit 22b is captured. In this case, since the light-shielding filter 43 is formed in the pixel column 41 of the even-numbered column and no charge is generated in the imaging element 42 of the pixel column 41, the line previously captured by the illumination of the first illumination unit 22a. The charge of the image is held as it is without being affected by the illumination of the second illumination unit 22b. When the exposure is completed, the charges of the pixel columns 41 are sequentially transferred to the adjacent pixel columns 41 at a fixed timing.
- the first illumination unit 22a is turned on, and as shown in FIG. 8C, the imaging elements of the pixel columns 41 located in the odd columns.
- the newly generated charge is added to and accumulated in the charge of the line image previously captured by the illumination of the first illumination unit 22a.
- the charge of the line image previously captured by the illumination of the second illumination unit 22b is The one illumination unit 22a is held as it is without being affected by the illumination.
- the first illumination unit 22a and the second illumination unit 22b are alternately lit, and are line images for one imaging line of the component C, and the first illumination unit 22a. Charges for 4 times are added and accumulated by illumination, and image data of the accumulated line image (in other words, line images that have been subjected to multiple exposures for 4 times) and charges for 4 times are added and accumulated by illumination of the second illumination unit 22a.
- the image data of the line image is alternately output from the TDI sensor 26 over the entire length of the part C from the front end to the rear end in the relative movement direction, and these image data are output from the camera 21 via the image capturing device 68. The data are sequentially output to the processing unit 65.
- the image processing unit 65 generates the first component image of the component C from the image data group of the line image by the illumination of the first illumination unit 22a among the image data group of the line image input from the camera 21, and The second part image of the part C is generated from the image data group of the line image obtained by the illumination of the second illumination unit 22b. Accordingly, the main control unit 61 recognizes the holding state of the component C by each mounting head 16 based on the first component image and the second component image generated by the image processing unit 65.
- a part at a distance L from the tip of the part C in the relative movement direction with respect to the imaging unit 6 is a pixel in the first column of the TDI sensor 26 via the reflection mirror 29.
- the subsequent exposure timing is the second timing, the third timing,...
- each part of the part C facing the odd-numbered pixel columns 41 of the TDI sensor 26 is simultaneously imaged through the reflection mirror 29.
- the exposure is performed at the above timing synchronized with the relative movement (pitch p) of the component C while the first illumination unit 22a and the first illumination unit 22a are switched.
- the respective part passes through the reflection mirror 29 and the first pixel row 41, the first row.
- the first illumination unit 22a is turned on at the odd-numbered timing each time the pixel rows 41 face the odd-numbered pixel rows 41, so that the first row, the third row are moved along with the relative movement of the component C. Charges are sequentially added and accumulated in each of the pixel columns 41 of the odd-numbered columns.
- the odd-numbered first imaging line and the even-numbered first imaging line Charges resulting from imaging at different timings and different illumination conditions are alternately output from the TDI sensor 26 while being sequentially accumulated. That is, a line image corresponding to one imaging line for each pitch p of the component C, which is multiple-exposed at different timings and different illumination conditions between adjacent imaging lines, extends from the TDI sensor 26 to the entire length of the component C. Output sequentially.
- the imaging unit 6 is scanned once with respect to the component C held by each mounting head 16, the first component image and the first illumination by the illumination of the first illumination unit 22a are detected. It is possible to acquire the second component image by the illumination of the two illumination unit 22b.
- the imaging unit 6 uses the camera 21 including the TDI sensor 26 in which the light-shielding filter 43 is formed in the even-numbered pixel column 41 as described above as a component imaging camera.
- the imaging unit 6 uses the camera 21 including the TDI sensor 26 in which the light-shielding filter 43 is formed in the even-numbered pixel column 41 as described above as a component imaging camera.
- the first component image and the second component image having different illumination conditions can be obtained without increasing the size and cost of the component mounting apparatus by mounting the high-luminance illumination apparatus. Good and efficient acquisition can be performed for component recognition.
- the TDI sensor 26 mounted on the camera 21 is such that the light-shielding filter 43 is formed in the even-numbered pixel row 41 (imaging device 42) as described above. Additional processing of the TDI sensor, for example, painting the imaging element 42 of the even-numbered pixel column 41 and processing the imaging element 42 into the light shielding filter 43 can be manufactured at a relatively low cost. Therefore, according to this component mounting apparatus, the above-described effects can be obtained with a relatively inexpensive configuration.
- the example in which the first component image and the second component image are acquired by mounting the illumination device 22 including the two types of illumination units 22a and 22b in the imaging unit 6 has been described.
- a third component image in which only the third illumination unit 22c is lit is acquired in addition to the one having the third illumination unit 22c (shown in FIG. 10). It is also possible to do.
- the TDI sensor 26 as shown in FIG. 9A, two pixel columns 41 with the light shielding filter 43 formed are arranged between the pixel columns 41 without the light shielding filter 43 formed therein. Things apply.
- the light receiving unit 40A includes 10 pixel columns 41, and the light shielding filter 43 is provided on the pixel columns 41 other than the first, fourth, seventh, and tenth pixel columns 41 with the left side of the figure as a reference. Is formed.
- the first illuminator 22a, the second illuminator 22b, and the third illuminator 22c are sequentially turned on every input of the imaging signal by the control of the main controller 61 based on the timing chart shown in FIG. Can be switched.
- the imaging unit 6 scans the component C once, first to third component images each including an imaging line for every three pitches p of the component C are acquired.
- the imaging unit 6 captures an image of the component C while moving from the (+) side in the X direction to the ( ⁇ ) side.
- the first illumination unit 22a When the imaging unit 6 starts moving and the first imaging signal is output, the first illumination unit 22a is turned on, and as shown in FIG. 9A, each pixel column 41 in which the light shielding filter 43 is not formed. The image sensor 42 is exposed. Thereby, the line image by the illumination of the 1st illumination part 22a is taken in by the said pixel row
- the circled number 1 is a line image by illumination of the first illumination unit 22a
- the circled number 2 is a line image by illumination of the second illumination unit 22a
- the line images by illumination of the illumination part 22c are each shown. Also, in FIGS. 9B to 9D, the reference numerals of the respective parts are omitted for convenience.
- the second illumination unit 22b When the next imaging signal is output along with the movement of the imaging unit 6, the second illumination unit 22b is turned on, and as shown in FIG. 9B, imaging of the pixel row 41 where the light shielding filter 43 is not formed.
- the element 42 When the element 42 is exposed, a line image obtained by illumination of the second illumination unit 22b is captured by the pixel row 41.
- the line image captured by the illumination of the second illumination unit 22b is used. Retained without being affected.
- the charges of the pixel columns 41 are sequentially transferred to the adjacent pixel columns 41 at a fixed timing.
- the third illumination unit 22c is turned on, and as shown in FIG. 9 (c), the pixel column 41 in which the light shielding filter 43 is not formed.
- the image sensor 42 is exposed, a line image by the illumination of the third illumination unit 22c is captured by the pixel row 41.
- the three illumination units 22c are held as they are without being affected by the illumination.
- the first illumination unit 22a is turned on, and as shown in FIG. 9D, the pixel row 41 in which the light shielding filter 43 is not formed.
- the newly generated charge is added to and accumulated in the charge of the line image previously captured by the illumination of the first illumination unit 22a.
- the line images previously captured by the illumination of the second illumination unit 22b and the third illumination unit 22c are held in the image sensor 42 of the pixel column 41 where the light shielding filter is formed, There is no influence by the illumination of the 1st illumination part 22a.
- the first to third illumination units 22a to 22c are sequentially turned on, and are line images of one imaging line of the component C, and the illumination of the first illumination unit 22a.
- the image data of the line image in which the charges for four times are added and accumulated (line image that has been subjected to multiple exposure for four times) and the image of the line image in which the charges for four times are added and accumulated by the illumination of the second illumination unit 22a.
- the data and the charge of four times are added by the illumination of the third illumination unit 22c, and the accumulated image data of the line image is sequentially output from the TDI sensor 26.
- the image processing unit 65 among the image data of the line image input from the camera 21, the image data group of the line image by the illumination of the first illumination unit 22a (3 pitches (3p) of the pixel row 41 of the component C)
- the first part image is generated from the line data of each part for each part), and the line image image data group (3 pitches (3p) of the pixel row 41 of the part C) by the illumination of the second illumination unit 22b.
- the second part image is generated from the image data group consisting of images, and the image data group of the line image by the illumination of the third illumination unit 22c (the line of each part for every 3 pitches (3p) of the pixel row 41 of the part C) image
- An image data group which is an image data group composed of line images of the respective portions shifted by 2 pitches 2p of the pixel row 41 with respect to the respective portions of the component C which is the imaging target of the first component image.
- the third part image is generated.
- the structure according to the said embodiment fundamentally also when turning on four or more illumination parts alternatively and acquiring four or more component images from which illumination conditions mutually differ.
- the TDI sensor 26 of the camera 21 one pixel row 41 in which the light shielding filter 43 is not formed and a pixel row 41 in which the light shielding filter 43 is formed, and the number obtained by subtracting one from the number of the illumination units.
- the TDI sensor 26 including the light receiving units 40A in which the pixel columns 41 are alternately arranged may be applied so that the part C is imaged while sequentially switching the lighting units to be lit.
- the several component image which switched the illumination parts 22a, 22b, and 22c of the illuminating device 22, ie, the several components which switched the illumination direction a plurality of component images having different illumination conditions such as illumination intensity (luminous intensity) and illumination light color may be acquired.
- a lighting device 22 that can selectively illuminate each color of red (R), green (G), and blue (B) is applied, and red, green based on the timing chart shown in FIG. And three component images of blue may be acquired.
- the image processing unit 65 can generate a color image of the component C by synthesizing these component images. That is, it is possible to acquire a color image of the component C by scanning the imaging unit 6 once with respect to the component C.
- the TDI sensor 26 of the camera 21 the one in which the light shielding filter 43 is formed on the imaging element 42 of the specific pixel column 41 is applied.
- the TDI sensor 26 ⁇ / b> A as shown in FIG. 11 is used. It is also possible to apply.
- the TDI sensor 26A shown in the figure has a configuration in which a line memory 41 'is provided instead of the pixel row 41 in which the light shielding filter 43 is formed in the pixel row 41 of the TDI sensor 26 shown in FIG.
- a line memory 41 ' a plurality of capacitors 42' (corresponding to the charge holding unit of the present invention) respectively corresponding to the image sensors 42 of the pixel column 41 in which the light shielding filter 43 is formed in the first embodiment are adjacent to each other.
- the pixel array 41 is arranged in a direction parallel to the pixel column 41, and has only a function of holding charges transferred from the image pickup elements 42 of the adjacent pixel columns 41.
- each register row 45 reads out the charge from the image sensor 42 of the corresponding pixel row 41 or the capacitor 42 'of the line memory 41', and the read out charge as shown by the white arrow in the figure. Is transferred to the image sensor 42 of the adjacent pixel column 41 or the capacitor 42 'of the line memory 41'.
- the line memory 41 ' has a high degree of freedom in shape because it is not necessary to secure a light receiving area like the pixel column 41. Therefore, as shown in the figure, the line memory 41 ′ can be formed narrower in the X direction (the arrangement direction of the pixel columns 41) than the pixel column 41. According to the TDI sensor 26A, it is possible to arrange a larger number of pixel columns 41 (effective pixel columns 41 that can be exposed) than the TDI sensor 26 with the same size as the TDI sensor 26 of FIG. As a result, in the alternate imaging under the two illumination conditions, the ratio of the width of the line image of each part of the component C can be made larger than the ratio of the width of the non-imaging line.
- the line images of the parts are partially overlapped), and higher resolution (high resolution in the X direction) can be realized for each of the two component images under the two types of illumination conditions than the TDI sensor 26 of FIG. Therefore, when the camera 21 including the TDI sensor 26A is applied, there is an advantage that two component images with higher accuracy can be acquired with a configuration substantially the same as that of the first embodiment. Conversely, if the resolution (resolution in the X direction) is the same as that of the TDI sensor 26 shown in FIG. 4, the TDI sensor 26 ⁇ / b> A can be made more compact in the X direction than the TDI sensor 26. Therefore, in this case, it is possible to reduce the size of the camera 21, which has the advantage of contributing to the reduction in size and weight of the imaging unit 6.
- the pitch of each column including the pixel column 41 and the line memory 41 ′ is Alternately different. Therefore, when the camera 21 including the TDI sensor 26A is applied, the illumination device 22 is switched, exposure (capture of a line image) by the image sensor 42 of each pixel column 41, and transfer of charges (line image).
- the main control unit 61 may cause the camera 21 to output an imaging signal in accordance with an output signal from the linear encoder 36 so that the image is appropriately performed based on the pitch.
- a TDI sensor similar to the TDI sensor 26A for example, in the pixel column 41 of the TDI sensor 26 shown in FIG. 9, instead of the pixel column 41 in which the light shielding filter 43 is formed, a line memory 41 ′ is provided and a TDI sensor is provided. It can also be applied. According to the configuration of this TDI sensor, while acquiring three component images under three kinds of illumination conditions as in the TDI sensor 26 shown in FIG. 9, the resolution is higher than that of the TDI sensor 26A (higher in the X direction). Resolution) component images can be acquired.
- a camera 21 including a TDI sensor 26B as shown in FIG. 12 can be used.
- the TDI sensor 26B shown in the figure has a plurality of pixel column groups arranged in a unit of a pixel column group including a plurality of pixel columns 41 arranged in a predetermined order and having different wavelength ranges capable of receiving light. It has a configuration. Specifically, by providing the red filter R, the pixel column 41 that receives only red light, the green filter G, the pixel column 41 that receives only green light, and the blue filter R. A pixel row 41 that receives only blue light, and a pixel row group in which these are arranged in a predetermined order, and a plurality of pixel row groups (three in the figure) are arranged. Have.
- the main control unit 61 turns on only a predetermined illumination unit among the first illumination unit 22a and the second illumination unit 22b according to the component C.
- the illumination control unit 66 is controlled accordingly.
- the main control unit 61 moves the imaging unit 6 at a constant speed (relatively moves with respect to the component C), while moving the imaging unit 6 by a distance corresponding to three times the arrangement pitch of the pixel row 41.
- An imaging signal is output at the timing. That is, the illumination control unit 66 is controlled to turn on the illumination unit at the above timing.
- the main control unit 61 controls the camera control unit 50 to expose the image sensor 42 of each pixel column 41 of the TDI sensor 26 in accordance with the input of the imaging signal from the main control unit 61, and this one exposure.
- the clock dry 54 is controlled so that the line image (charge) is transferred three times. That is, as indicated by the solid line, broken line, and alternate long and short dash line in the figure, the charge of each pixel column 41 belonging to each pixel column group corresponds to the corresponding pixel column 41 of the adjacent pixel column group, that is, the pixel in which the same filter is formed.
- the charge transfer timing is controlled so as to be transferred to the columns 41 respectively.
- red, green, and blue component images are acquired as images of the component C while the imaging unit 6 scans the component C once. Is done. That is, when the movement of the image pickup unit 6 is started and the first image pickup signal is output from the main control unit 61, the image pickup element 42 of each pixel row 41 is exposed to be exposed by each pixel row 41 of the pixel row group. Red, green and blue line images are captured. These line images are respectively transferred to the corresponding pixel columns 41 of the adjacent pixel column group.
- the line image is sequentially transferred to the corresponding pixel column 41 of the adjacent pixel column group while the exposure of each pixel column 41 is performed, so that the line images of the same imaging line are respectively subjected to the multiple exposure red.
- Green and blue line images are output from the TDI sensor 26B to the image processing unit 65.
- the image processing unit 65 generates an image based on a line image having a common light receiving wavelength among the line images output from the TDI sensor 26B, that is, a line image of the same color, so that 3 of the pixel row 41 for each of the three colors. A part image composed of a line image group of the part C for each pitch is generated, and a color image of the part C is generated by combining these images. Therefore, the main control unit 61 recognizes the holding state of the component C by each mounting head 16 based on the color image of the component C.
- a pixel row 41 that receives only infrared rays by providing an infrared transmission filter and a pixel row 41 that receives light other than infrared rays by providing an infrared light shielding filter are provided as one pixel row.
- a group in which a plurality of pixel column groups are arranged may be applied as a group.
- the head unit driving mechanism and the control device 60 for moving the head unit 5 in the XY directions are the moving means in the present invention.
- the head unit 5 has a plurality of mounting heads 16 arranged in a row in the X direction, but a plurality of mounting heads 16 are arranged in two rows in the front and rear (two rows in the Y direction). There may be.
- the number of pixels in each pixel column 41 of the TDI sensor 26 may be set so that the parts C held by the front and rear mounting heads 16 can be simultaneously imaged by the TDI sensor 26. For example, when the illumination conditions of the components C attracted by the front and rear mounting heads 16 are different from each other, component images having different illumination conditions including the front and rear components C are acquired while alternately switching the illumination conditions, and image processing is performed.
- the part image currently imaged on the illumination conditions corresponding to the one part C among the parts C before and after is extracted from these part images, and the part C of the one side is extracted from the extracted part image.
- a component image may be generated, and a component image may be generated in the same manner for the component C on the other side.
- the control device 60 may switch the imaging mode in which one type of component image is acquired.
- the first two exposures are performed by turning on the common illumination unit (for example, the first illumination unit 22a).
- control device 60 may switch the imaging mode for acquiring one type of component image, two types of component images, and three types of component images according to the type of the component C. .
- the configuration in which the imaging device according to the present invention is mounted on a surface mounter has been described.
- the present invention is not limited to this.
- a component testing apparatus that inspects electronic components such as IC chips. It is also possible to mount it on.
- FIG. 13 is a plan view showing a component testing apparatus 70 (corresponding to the component testing apparatus according to the present invention) on which the imaging device according to the present invention is mounted.
- a component testing apparatus 70 corresponding to the component testing apparatus according to the present invention
- XY coordinate axes are shown for clarifying the directional relationship.
- the base 71 of the component testing apparatus 70 is provided with a cassette setting portion 73 on which cassettes 72 in which wafers Wa in which bare chips are diced are stored in multiple stages can be mounted.
- the cassette 72 mounted on the cassette installation portion 73 is transported to a position below the opening 74 formed in the base 71 by a transport mechanism (not shown), and the bare chip is picked up by the takeout member 75 at this position.
- the take-out member 75 conveys the bare chip from the opening 74 to the component standby part 77 along the rail 76 extending in the Y direction on the base 71.
- the component standby unit 77 is disposed between a pair of rails 78 extending in the X direction on the base 71, and the bare chip conveyed to the component standby unit 77 is paired with a pair of head units 79 that are driven along the rails 78. 80 is conveyed to the inspection socket 81 on the base 71 and a predetermined inspection is executed.
- Each head unit 79, 80 has a chip suction head, and the head holds the bare chip by suction.
- the imaging units 106 and 116 are fixedly provided on the base 71 between the component standby unit 77 and the inspection socket 71 (corresponding to the inspection unit of the present invention). ing.
- the imaging units 106 and 116 include a camera that captures an image of the bare chip held by the head units 79 and 80 from the lower side, a lighting device, a casing that integrally holds these, and the like. Including.
- the camera for example, a camera having a TDI sensor equivalent to the TDI sensor shown in FIG. 4 is provided, and similarly to the illumination device 22 shown in FIG. A lighting device is provided.
- the imaging units 106 and 116 image a bare chip conveyed from the component standby unit 77 to the inspection socket 81, and a control device (not shown) detects a defect (for example, a bump height defect) based on the image data.
- a defect for example, a bump height defect
- the transfer speed of the bare chip by the control device (not shown), the imaging timing by the camera (TDI sensor), the switching timing of the illumination unit, the transfer timing of the line image (charge) in the TDI sensor, etc. are described above by the control device (not shown). Control is performed in the same manner as the component mounting apparatus.
- the bare chip detected as a defective product is transported to the defective product tray 83 mounted on the defective product recovery unit 82 on the base 71 by the head units 79 and 80.
- the control device detects the attitude of the bare chip with respect to the head units 79 and 80 based on the plurality of images.
- the bare chip detected as being displaced with respect to the head units 79 and 80 is subjected to position correction by the head units 79 and 80 and then transferred to the inspection socket 81.
- the bare chip determined to be defective is transported to the defective product tray 83 by the head units 79 and 80, while the bare chip determined to be non-defective is
- Each of the head units 79 and 80 is transported to the component storage portion 84 on the base 71 and is stored in the base tape 85 for the tape feeder in the component storage portion 84. The tape will be attached.
- the tray 83 of the defective product recovery unit 82 becomes full, the tray 83 is transferred to the tray discharge unit 86 by a tray moving mechanism (not shown), and the tray standby adjacent to the defective product recovery unit 82 is waited for.
- the tray 88 in the section 87 is transferred to the defective product collection section 82 by the head units 79 and 80, and the empty tray is transferred from the empty tray mounting section 89 to the tray standby section 87 by a tray moving mechanism (not shown). It has become.
- the imaging units 106 and 116, the head units 79 and 80, the driving mechanism and the control device for the head unit, and the like correspond to the imaging device of the present invention, and among them, the driving of the head units 79 and 80 and the head unit.
- the mechanism corresponds to the moving means of the image pickup apparatus, and the control device corresponds to the image pickup control means of the present invention.
- the head unit driving mechanism and the control device correspond to the transfer means of the present invention.
- the configuration in which the imaging units 106 and 116 are arranged on the base 71 of the component testing apparatus 70 has been described.
- the present invention is not limited to this.
- the imaging units 106 and 116 may be movably attached to the head units 79 and 80.
- the imaging apparatus is a printed circuit board inspection apparatus that inspects a substrate on which a paste such as solder paste is printed in a screen printing apparatus in addition to the component mounting apparatus and the component testing apparatus as described above (the present invention). It is also possible to mount it on one of the board inspection apparatuses according to the above.
- the printed circuit board inspection apparatus moves in a two-dimensional direction (XY direction) parallel to the printing surface relative to the printed circuit board held by the printed circuit board held by the printed circuit board holding unit. It includes an imaging unit that can be supported, a drive mechanism that relatively moves the imaging unit and the substrate (corresponding to the moving means of the present invention), and a control device that controls these in an integrated manner.
- the imaging unit includes a camera that images the substrate from above, an illuminating device, and a casing that integrally holds these.
- a camera for example, a camera having a TDI sensor equivalent to the TDI sensor shown in FIG. 4 is provided, and similarly to the illumination device 22 shown in FIG. A lighting device is provided.
- this printed circuit board inspection apparatus detects a defective part based on the image data by imaging the printed part while moving the imaging unit with respect to the substrate.
- the control unit not shown in the figure shows the conveyance speed of the imaging unit, the imaging timing by the camera (TDI sensor), the switching timing of the illumination unit, the transfer timing of the line image (charge) in the TDI sensor, etc. Control is performed in the same manner as the component mounting apparatus.
- TDI sensor the imaging timing by the camera
- the switching timing of the illumination unit the transfer timing of the line image (charge) in the TDI sensor, etc.
- Control is performed in the same manner as the component mounting apparatus.
- a plurality of images with different illumination conditions are acquired while the imaging unit passes in one direction above the print location, and the control device determines the quality of the print location based on the plurality of images.
- the imaging device according to the present invention can be mounted on a mounting board inspection device (one of the substrate inspection devices according to the present invention).
- the mounting board inspection apparatus recognizes the mounting state of the component based on the image data by imaging the component mounting location on the board with a camera. It is possible to adopt a configuration equivalent to the above. According to this mounting board inspection apparatus, it is possible to acquire a plurality of images with different illumination conditions and determine whether components are mounted or not based on the plurality of images, as in the case of the printed board inspection apparatus.
- the above is an illustration of the embodiment of the present invention, and the specific configurations of the TDI sensor, the imaging device, the component mounting device, the component testing device, the printed board inspection device, and the mounting substrate inspection device are the gist of the present invention. Changes can be made as appropriate without departing from the scope.
- the configuration of the imaging unit or the like described in the component mounting apparatus can be similarly applied to a component testing apparatus and a board inspection apparatus such as a printed board inspection apparatus or a mounting board inspection apparatus. is there.
- the TDI sensor is a TDI sensor that performs line image capturing operation at a predetermined timing, and outputs a line image that has been exposed multiple times as an image for each imaging line.
- the pixel rows each having a plurality of image pickup devices that are arranged and each generate and hold charges corresponding to the exposure amount, and have the function of holding the charges only, and correspond to each image pickup device in the pixel row.
- a charge holding column having a plurality of charge holding units arranged in one direction, and the one pixel row and one or more of the charge holding columns are alternately arranged in a second direction orthogonal to the first direction.
- the charges held by the light receiving unit, the image pickup device of the pixel column, and the charge holding unit of the charge holding column are sequentially transferred to adjacent columns on a column-by-column basis.
- An imaging apparatus is an imaging apparatus for imaging an object under a specific number and a plurality of illumination conditions, and is the above-described TDI sensor and includes one pixel row as the light receiving unit.
- a TDI sensor including a light receiving section in which the number of the charge holding columns obtained by subtracting one from the specific number is alternately arranged; and a moving unit that relatively moves the object in the second direction with respect to the TDI sensor.
- Illuminating means capable of illuminating an object to be moved by the moving means and changing the illumination condition to the plurality of illumination conditions; and during the relative movement of the object with respect to the TDI sensor, the illuminating means The TD so that the line image of the object for each illumination condition is captured by the image sensor of the pixel row while the illumination conditions are sequentially switched to the plurality of illumination conditions.
- An imaging control unit that controls an imaging timing of the sensor and an illumination condition switching timing of the illumination unit, and controls the transfer timing of the charge in the TDI sensor so that the transfer of the charge is performed in synchronization with the imaging timing.
- image processing means for generating an image of the specific number of objects by generating an image of the object based on line images having a common illumination condition among the line images output from the TDI sensor; Is provided.
- a TDI sensor in which pixel columns and charge holding columns are alternately arranged is used. Provided, and an imaging means that can be changed to two illumination conditions is provided.
- the imaging operation is performed while the illumination conditions are alternately switched during the relative movement of the object, so that the object is illuminated as an image of the object while moving relative to the TDI sensor.
- Two images with different conditions are acquired. Specifically, as the object moves, the image sensor of each pixel column is exposed under the first illumination condition, so that a line image (referred to as a first illumination image) is captured by each pixel column. Line images (that is, electric charges) of these pixel columns are transferred to and held in the adjacent charge holding columns before the next exposure. Then, the image sensor of each pixel column is exposed under the second illumination condition, whereby a line image (referred to as a second illumination image) is captured by each pixel column.
- a line image referred to as a second illumination image
- the first illumination image is held in the charge holding unit, it is not affected by the illumination light. Thereafter, the second illumination image of each pixel column is transferred to the adjacent charge holding unit, and the first illumination image of each charge holding unit is transferred to the adjacent pixel column. Then, under the first illumination condition, By exposing the image sensor, the first illumination image is re-exposed (charge is added) in each pixel row. That is, from the TDI sensor, a line image of a specific imaging line of a target object that is exposed a plurality of times under the first illumination condition, and a line image of a subsequent imaging line that is the second illumination condition. The line images exposed multiple times are output alternately.
- an image of the object is generated based on the line image having the same illumination condition among the line images output from the TDI sensor, so that the component image and the second illumination under the first illumination condition are generated. A part image under conditions is generated.
- the charge holding column only needs to hold a line image (charge) without being affected by illumination light. Therefore, the charge holding column may be one in which capacitors are arranged as the charge holding unit, or is a pixel column equivalent to the pixel column, and prevents light from entering the surface of each image sensor. A light shielding part may be formed.
- the degree of freedom of the shape of the charge holding unit is high, for example, if the charge holding column has a width smaller than the width of the image column in the second direction, It is possible to make the TDI sensor compact in the same direction while maintaining the resolution.
- the TDI sensor can be easily obtained by, for example, additionally processing a light shielding portion in a specific pixel column of an existing TDI sensor.
- the charge holding column only needs to hold a line image (charge) without being affected by illumination light. Therefore, the charge holding column may be one in which capacitors are arranged as the charge holding unit, or is a pixel column equivalent to the pixel column, and prevents light from entering the surface of each image sensor. A light shielding part may be formed.
- the degree of freedom of the shape of the charge holding unit is high, for example, if the charge holding column has a width smaller than the width of the image column in the second direction, It is possible to make the TDI sensor compact in the same direction while maintaining the resolution.
- the TDI sensor can be easily obtained by, for example, additionally processing a light shielding portion in a specific pixel column of an existing TDI sensor.
- the illumination unit may be configured to selectively irradiate the object with illumination light of each of the three primary colors as the illumination condition
- the image processing unit may include the plurality of objects.
- An image of each of the three primary colors may be generated as an image, and a color image may be generated by combining these three primary color images.
- a TDI sensor is a TDI sensor that performs a line image capturing operation at a predetermined timing and outputs a line image that is exposed a plurality of times as an image for each imaging line.
- Light reception including a plurality of pixel rows having a plurality of imaging elements arranged in one direction and generating and holding charges corresponding to exposure amounts, respectively, and arranged in a second direction orthogonal to the first direction
- a transfer unit that sequentially transfers charges held in the pixel columns to adjacent pixel columns in units of columns and outputs a signal corresponding to the charges finally accumulated by the transfer as a signal of the line image
- the light receiving unit includes, as a unit, a pixel column group composed of a plurality of the pixel columns arranged in a predetermined order in the second direction and having different wavelength ranges capable of receiving light. Column group is one having a plurality of rows configurations in the second direction.
- An imaging apparatus is an imaging apparatus for capturing an image of an object and acquiring a plurality of types of images, wherein the object is relative to the TDI sensor and the TDI sensor.
- Moving means for relatively moving the object in the second direction
- illuminating means for illuminating the object moved by the moving means
- the imaging timing of the TDI sensor is controlled so as to be taken in by the imaging device of the column, and the charge of each pixel column belonging to each pixel column group is adjacent after the imaging operation of the TDI sensor and before the next imaging operation.
- Imaging control means for controlling the transfer timing of the charges so as to be transferred to the corresponding pixel columns of the group, and the line image output from the TDI sensor.
- An image processing means for generating an image of an object corresponding to the number of pixel columns included in the pixel column group by generating an image of the object based on a line image having a common light receiving wavelength range. It is to be prepared.
- this imaging apparatus while the object moves relative to the TDI sensor, a plurality of images having different wavelength ranges of received light are acquired as images of the object. That is, as the object moves, the image sensor of each pixel column included in the pixel column group is exposed, so that line images having different wavelength ranges are captured by the respective image columns.
- the line images (charges) of these pixel columns are transferred to and held in the corresponding pixel columns of the adjacent pixel column group before the next exposure. That is, from the TDI sensor, a plurality of line images having different wavelength ranges of received light and sequentially exposed line images are sequentially output.
- an image of the object is generated based on a line image having a common wavelength range of received light among the line images output from the TDI sensor, so that the pixel columns included in the pixel column group The number of objects corresponding to the number of objects is generated.
- the TDI sensor has a pixel column group including three pixel columns that can receive only light of each of the three primary colors as the pixel column group, and the image processing means outputs from the TDI sensor.
- An image of an object of each of the three primary colors is generated based on a line image of a common color among the line images to be generated, and a color image of the object is generated by combining the images of these three primary colors.
- a component mounting apparatus includes a head capable of holding a component, the above-described imaging device for imaging a component as an object, and an image captured by the imaging device that is held by the head.
- Transfer means for recognizing the holding state of the component by the head based on the image data of the component, and transferring the component onto a substrate by the head, and the moving means of the imaging device includes the head And the TDI sensor are relatively moved in the second direction, and the transfer means mounts the component on the substrate by moving the head relative to the substrate.
- a component held by the head is relatively moved once with respect to the TDR sensor, whereby a plurality of component images are acquired as component images of the component. Then, after the component holding state by the head is recognized based on the component image, the component is mounted on the substrate.
- a component testing apparatus is based on the above-described imaging device for imaging a component as an object, and image data of the component that is held by the head and captured by the imaging device.
- Transfer means for recognizing the holding state of the component by the head and transferring the component onto a predetermined inspection unit by the head, and the moving means of the imaging device includes the head, the TDI sensor, Relative to the second direction, and the transfer means places the component on the inspection unit by moving the head relative to the inspection unit. is there.
- the component held by the head is relatively moved only once with respect to the TDR sensor, whereby a plurality of component images are acquired as the component image of the component. Then, after the component holding state by the head is recognized based on the component image, the component is mounted on the substrate.
- a board inspection apparatus is based on the above-described imaging apparatus for imaging a printed circuit board or a component-mounted board as an object, and an image of an inspection target portion imaged by the imaging apparatus. Recognizing means for recognizing a printing state or a component mounting state, and the moving means of the imaging apparatus relatively moves the substrate and the TDI sensor in the second direction.
- the substrate is moved relative to the TDR sensor only once, so that a plurality of images are acquired as component images of the inspection target portion of the board, and based on the plurality of images, the print state or The component mounting state is recognized.
- the TDI sensor, the imaging device, the component mounting device, the component testing device, and the board inspection device according to the present invention can acquire a plurality of types of component images satisfactorily and at high speed. This is useful in the field of mounting substrate manufacturing.
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Abstract
Description
図1及び図2は、本発明に係る部品実装装置(本発明にかかる撮像装置が適用される部品実装装置)を概略的に示しており、図1は平面図で、図2は正面図で、それぞれ部品実装装置を概略的に示している。なお、図1、図2及び後に説明する図面には、各図の方向関係を明確にするためにXYZ直角座標が示されている。
上記第1実施形態では、カメラ21のTDIセンサ26として、特定の画素列41の撮像素子42に遮光フィルタ43が形成されたものが適用されているが、図11に示すようなTDIセンサ26Aを適用することも可能である。
撮像ユニット6のカメラ21として、図12に示すようなTDIセンサ26Bを備えるカメラ21を用いることも可能である。
(1)上記各実施形態では、撮像ユニット6をヘッドユニット5に搭載し、各実装ヘッド16に吸着保持された部品Cに対して撮像ユニット6を移動させる構成について説明したが、これに限定されることはなく、例えば、撮像ユニットを基台1に固定的に配置し、主制御部61の制御により、この撮像ユニットに対してヘッドユニット5を相対的に移動させることにより各実装ヘッド16に保持された部品Cを撮像する構成としてもよい。この場合には、カメラを上向けに配置し、反射ミラーを介することなく、照明装置22による照明下で部品Cからの反射光(部品像)を直接カメラ21で取り込むようにすればよい。
Claims (12)
- 所定のタイミングでライン画像の撮像動作を行い、撮像ライン毎の画像として複数回露光されたライン画像を出力するTDIセンサであって、
第1方向に並びかつそれぞれ露光量に応じた電荷を生成して保持する複数の撮像素子を有する画素列と、前記電荷を保持する機能のみを有しかつ前記画素列の各撮像素子に対応するように前記第1方向に並ぶ複数の電荷保持部を有する電荷保持列とを含み、一つの前記画素列と一乃至複数の前記電荷保持列とが前記第1方向と直交する第2方向に交互に配列される受光部と、
前記画素列の撮像素子および前記電荷保持列の電荷保持部が保持する電荷を列単位で隣接する列に順次転送するとともに、前記ライン画像の信号として、前記転送により最終的に蓄積された電荷に対応する信号を出力する転送部と、を備えることを特徴とするTDIセンサ。 - 請求項1に記載のTDIセンサにおいて、
前記電荷保持列は、前記電荷保持部としてキャパシタが並んだものであることを特徴とするTDIセンサ。 - 請求項2に記載のTDIセンサにおいて、
前記電荷保持列は、前記第2方向における前記画像列の幅寸法よりも小さい幅寸法を有することを特徴とするTDIセンサ。 - 請求項1に記載のTDIセンサにおいて、
前記電荷保持列は、前記画素列と同等の画素列であって各撮像素子の表面に光の入射を阻止する遮光部が形成されたものであることを特徴とするTDIセンサ。 - 特定数かつ複数の照明条件で対象物を撮像するための撮像装置であって、
請求項1乃至4の何れか一項に記載のTDIセンサであって前記受光部として一つの前記画素列と前記特定数から一を減算した数の前記電荷保持列とが交互に配列された受光部を備えるTDIセンサと、
前記TDIセンサに対して前記対象物を前記第2方向に相対移動させる移動手段と、
前記移動手段により移動させられる対象物を照明するとともにその照明条件を前記複数の照明条件に変更することが可能な照明手段と、
前記TDIセンサに対する前記対象物の相対移動中に、前記照明手段の照明条件が前記複数の照明条件に順番に切り換えられながら前記照明条件毎の対象物のライン画像が前記画素列の撮像素子により取り込まれるように前記TDIセンサの撮像タイミングおよび前記照明手段の照明条件の切り替えタイミングを制御するとともに、前記撮像タイミングに同期して前記電荷の転送が行われるように前記TDIセンサにおける前記電荷の転送タイミングを制御する撮像制御手段と、
前記TDIセンサから出力される前記ライン画像のうち照明条件が互いに共通するライン画像に基づいて対象物の画像を生成することにより前記特定数の対象物の画像を生成する画像処理手段と、を備えることを特徴とする撮像装置。 - 請求項5に記載の撮像装置において、
前記照明手段は、前記照明条件として三原色それぞれの照明光を択一的に前記対象物に照射可能に構成されており、
前記画像処理手段は、対象物の前記複数の画像として三原色それぞれの画像を生成するとともに、これら三原色の画像を合成することによりカラー画像を生成することを特徴とする撮像装置。 - 所定のタイミングでライン画像の撮像動作を行い、撮像ライン毎の画像として複数回露光されたライン画像を出力するTDIセンサであって、
第1方向に並びかつそれぞれ露光量に応じた電荷を生成して保持する複数の撮像素子を有する複数の画素列を含み、これら画素列が前記第1方向と直交する第2方向に配列された受光部と、
前記画素列が保持する電荷を列単位で隣接する画素列に順次転送するとともに、前記ライン画像の信号として、前記転送により最終的に蓄積された電荷に対応する信号を出力する転送部と、を備え、
前記受光部は、前記第2方向に所定の順序で連続して並びかつ受光可能な波長域が互いに異なる複数の前記画素列からなる画素列群を一単位として、当該画素列群が前記第2方向に複数配列された構成を有することを特徴とするTDIセンサ。 - 対象物を撮像して複数種類の画像を取得するための撮像装置であって、
請求項7に記載のTDIセンサと、
前記TDIセンサに対して前記対象物を前記第2方向に相対移動させる移動手段と、
前記移動手段により移動させられる対象物を照明する照明手段と、
前記TDIセンサに対する前記対象物の相対移動中に、対象物のライン画像が前記画素列の撮像素子により取り込まれるように前記TDIセンサの撮像タイミングを制御するとともに、TDIセンサの撮像動作後、次の撮像動作前に、各画素列群に属する各画素列の電荷が隣接する画素列群の対応する画素列にそれぞれ転送されるように前記電荷の転送タイミングを制御する撮像制御手段と、
前記TDIセンサから出力される前記ライン画像のうち受光波長域が共通するライン画像に基づいて対象物の画像を生成することにより、前記画素列群が含む画素列の数に対応する数の対象物の画像を生成する画像処理手段と、を備えることを特徴とする撮像装置。 - 請求項8に記載の撮像装置において
前記TDIセンサは、前記画素列群として三原色それぞれの光のみを受光可能な3つの画素列を含む画素列群を有し、
前記画像処理手段は、前記TDIセンサから出力される前記ライン画像のうち共通する色のライン画像に基づいて三原色それぞれの対象物の画像を生成するとともに、これら三原色の画像を合成することにより対象物のカラー画像を生成することを特徴とする撮像装置。 - 部品を保持可能なヘッドと、
対象物として部品を撮像するための請求項5、6、8及び9の何れかに記載の撮像装置と、
前記ヘッドに保持されかつ前記撮像装置により撮像された前記部品の画像データに基づき前記ヘッドによる部品の保持状態を認識した上で当該部品を前記ヘッドにより基板上に移載する移載手段と、を含み、
前記撮像装置の前記移動手段は、前記ヘッドと前記TDIセンサとを前記第2方向に相対的に相対移動させるものであり、
前記移載手段は、前記ヘッドを前記基板に対して相対的に移動させることにより前記部品を前記基板上に搭載する、ことを特徴とする部品実装装置。 - 部品を保持可能なヘッドと、
対象物として部品を撮像するための請求項5、6、8及び9の何れかに記載の撮像装置と、
前記ヘッドに保持されかつ前記撮像装置により撮像された前記部品の画像データに基づき前記ヘッドによる部品の保持状態を認識した上で当該部品を前記ヘッドにより所定の検査部上に移載する移載手段と、を含み、
前記撮像装置の前記移動手段は、前記ヘッドと前記TDIセンサとを前記第2方向に相対的に相対移動させるものであり、
前記移載手段は、前記ヘッドを前記検査部に対して相対的に移動させることにより前記部品を前記検査部に載置する、ことを特徴とする部品試験装置。 - 対象物として印刷処理又は部品実装された基板を撮像するための請求項5、6、8及び9の何れかに記載の撮像装置と、
この撮像装置により撮像される検査対象箇所の画像に基づき印刷状態又は部品実装状態を認識する認識手段と、を含み、
前記撮像装置の前記移動手段は、前記基板と前記TDIセンサとを前記第2方向に相対的に相対移動させるものである、ことを特徴とする基板検査装置。
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WO2020070858A1 (ja) * | 2018-10-04 | 2020-04-09 | 株式会社Fuji | 部品撮像用カメラ及び部品実装機 |
JP2021163870A (ja) * | 2020-03-31 | 2021-10-11 | パナソニックIpマネジメント株式会社 | 部品装着装置 |
Also Published As
Publication number | Publication date |
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EP2741252A4 (en) | 2014-12-31 |
JP5753020B2 (ja) | 2015-07-22 |
US9258474B2 (en) | 2016-02-09 |
EP2741252A1 (en) | 2014-06-11 |
EP2741252B1 (en) | 2017-11-15 |
EP2741252B8 (en) | 2017-12-20 |
US20140184847A1 (en) | 2014-07-03 |
CN103718210A (zh) | 2014-04-09 |
KR20140051971A (ko) | 2014-05-02 |
KR101603617B1 (ko) | 2016-03-15 |
CN103718210B (zh) | 2017-05-31 |
JP2013033419A (ja) | 2013-02-14 |
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