WO2013000942A1 - Procédé et dispositif de découpage au laser de tôles recouvertes d'un film ou d'un revêtement - Google Patents

Procédé et dispositif de découpage au laser de tôles recouvertes d'un film ou d'un revêtement Download PDF

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Publication number
WO2013000942A1
WO2013000942A1 PCT/EP2012/062426 EP2012062426W WO2013000942A1 WO 2013000942 A1 WO2013000942 A1 WO 2013000942A1 EP 2012062426 W EP2012062426 W EP 2012062426W WO 2013000942 A1 WO2013000942 A1 WO 2013000942A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
laser
cutting
fiber core
workpiece
Prior art date
Application number
PCT/EP2012/062426
Other languages
German (de)
English (en)
Inventor
Eberhard Wahl
Tobias Kaiser
Original Assignee
Trumpf Werkzeugmaschinen Gmbh + Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Werkzeugmaschinen Gmbh + Co. Kg filed Critical Trumpf Werkzeugmaschinen Gmbh + Co. Kg
Priority to CN201290000636.0U priority Critical patent/CN203956324U/zh
Publication of WO2013000942A1 publication Critical patent/WO2013000942A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles

Definitions

  • the present invention relates to a method for laser cutting a provided with a film or a coating (such as paint, scale, etc.) workpiece by means of a laser beam with a laser wavelength less about 4 ⁇ , in particular in the range of about 1 ⁇ , and a associated laser cutting machine.
  • Solid-state laser ie by means of laser radiation with a laser wavelength of 1 [im, resulting in a cut without previous evaporation of the film, however, a visible deterioration in the quality of the cut edge, since the 1 micron laser radiation is poorly absorbed in the film and thus the film material
  • FKL laser cutting in a first step, the film first has to be evaporated from the sheet before the sheet can then be cut in a second step. These two steps increase the main time of the FKL laser cutting machine. Similar problems also occur when laser cutting of provided with a coating (such as paint, scale, etc.) provided workpieces.
  • This object is achieved in that a first laser beam coupled into a first fiber core of a double-core fiber and from the first fiber core as a cutting laser beam for cutting the workpiece
  • Coating is decoupled. Preferably, it is in the
  • the film or the coating is vaporized by the leading evaporation laser beam and then cut the workpiece or coating-free workpiece by the trailing cutting laser beam.
  • the intensity of the evaporation laser beam is chosen as possible so that the film or the coating safely evaporated and the workpiece is not damaged. Since the evaporation laser beam only serves to evaporate the film or the coating, the resulting slight increase in temperature of the workpiece does not adversely affect the subsequent laser cut.
  • One on the factory A piece of cutting gas jet can safely blow off the aerosol of the evaporated film or coating which has formed during evaporation. According to the invention can therefore be cut in one pass and is unlike previously no further cutting gas needed for a second pass.
  • the second fiber core annularly surrounds the first fiber core, and ideally, the cladding surrounding the inner fiber core may form the outer fiber core.
  • an outer, e.g. Concentric fiber core is also coupled to a lesser extent laser light.
  • an annular evaporation laser beam of lower intensity forms on the workpiece about the cutting focus point of the actual cutting laser beam, which evaporates the film or coating with its laser beam edge leading to the cutting laser beam, whereby the trailing cutting laser beam impinges on the workpiece, which is now foil-free or coating-free ,
  • the evaporation laser beam may have the same wavelength or a different wavelength as the cutting laser beam, in the latter case, the wavelength of the evaporation laser beam can be optimally adapted to the absorption of the film or coating.
  • the leading evaporating laser beam should have a lower power density over a larger area than the cutting laser beam in order to apply enough energy to evaporate the film or coating.
  • the power density is chosen so that the actual workpiece is not damaged or no Foliential. Coating components are introduced into the workpiece.
  • the evaporation laser beam can be generated from the first laser beam or else be a laser beam generated independently of the first laser beam.
  • the invention also relates to an associated laser cutting machine with a laser, in particular solid-state laser, for generating a first laser beam with a La laser wavelength less than about 4 pm, in particular in the range of about 1 ⁇ , and with a double-core fiber, a first fiber core, in the first laser beam coupled and from which the laser beam is coupled as a cutting laser beam for cutting the workpiece, and a second fiber core, in which a second laser beam coupled and from which the second laser beam as a on the Workpiece is coupled to the cutting laser beam at least partially in the cutting direction leading evaporating laser beam for vaporizing the film or coating.
  • a beam splitter can be provided in the beam path of the first laser beam.
  • FIGS. 1 and 2 schematically show two embodiments of the invention
  • Laser cutting machine for carrying out the laser cutting method according to the invention for foiled or coated sheets.
  • the laser cutting machine 1 shown in FIG. 1 is used for laser cutting a foiled sheet 2, ie a sheet 4 provided with a (protective) foil 3, or a coated, e.g. painted sheet metal.
  • the laser cutting machine 1 comprises a solid-state laser 5, for example neodymium, ytterbium or erbium lasers, for generating a laser beam 6 with a laser wavelength ⁇ in the range of approximately 1 ⁇ m.
  • the laser beam 6 is split by means of a beam splitter 7 into two laser beams 8, 9 with the same laser wavelength ⁇ , but with different intensity.
  • the laser beam 8 with the higher intensity is coupled into the inner fiber core 11 of a double-core fiber 10 and coupled out of the inner fiber core 1 1 as a cutting laser beam 13.
  • the laser beam 9 with the lower intensity is in the annular surrounding the inner Faserkem 1 1 outer
  • the fiber core 12 of the double core fiber 10 is coupled in and coupled out of the outer fiber core 12 as an evaporation laser beam 14 surrounding the cutting laser beam 13 in an annular manner.
  • the outer fiber core 12 may be formed by the cladding of the inner fiber core 11.
  • the cutting and evaporating laser beams 13, 14 are deflected in a laser cutting head 15 by means of a deflection optics (eg scanner optics) 16 on the foiled sheet 2 and moved in the cutting direction 17 on the foiled sheet 2.
  • a deflection optics eg scanner optics
  • the film 3 is vaporized by the on the sheet 2 the cutting laser beam 13 leading edge of the evaporation laser beam 14, as indicated by dashed lines, and the now sheet-free sheet 4 is cut by the trailing cutting laser beam 13.
  • the intensity of the evaporation laser beam 14 is selected so that the film 3 is evaporated off safely and the sheet 4 is not damaged.
  • the evaporation laser beam 14 since the evaporation laser beam 14 only serves to evaporate the film 3, the slight increase in temperature of the sheet 4 that occurs during this process does not have a detrimental effect on the subsequent laser cut. A directed to the sheet 4 cutting gas jet (not shown) blows the resulting during evaporation aerosol of the evaporated film 3 safely away from the plate 4. Unlike in Fig. 1, where the evaporation laser beam 14 has the same wavelength ⁇ as the cutting laser beam 13, in the laser cutting machine 1 shown in Fig. 2, the cutting laser beam 13 and the evaporation laser beam 14 different wavelengths ⁇ - ⁇ , ⁇ 2 .
  • a first laser beam 8 with the wavelength ⁇ is generated by means of a first solid-state laser 5i and coupled into the inner fiber core 11 of the double-core fiber 10 and coupled out of the inner fiber core 11 as a cutting laser beam 13.
  • a second solid-state laser 5 2 a second laser beam 9 is generated with the wavelength ⁇ 2 optimized for the absorption of the film 3 and coupled into the outer fiber core 12 of the double-core fiber 10 and decoupled from the outer fiber core 12 as an evaporating laser beam 14.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

L'invention concerne un procédé de découpage au laser d'une pièce (4) munie d'un film (3) ou d'un revêtement au moyen d'un rayon laser de découpage (13) présentant une longueur d'onde de laser (λ) inférieure à environ 4 μm, en particulier d'environ 1 μm. Selon l'invention, un premier rayon laser (8) est injecté dans un premier noyau de fibre (11) d'une fibre à deux noyaux (10) et sort du premier noyau de fibre (11) en tant que rayon laser de découpage (13) pour découper la pièce (4). Puis, un deuxième rayon laser (9) est injecté dans un deuxième noyau de fibre (12) de la fibre à deux noyaux (10) et sort du deuxième noyau de fibre (12) en tant que rayon laser de vaporisation (14) précédant le rayon laser de découpage (13) sur la pièce (4) au moins partiellement dans la direction de découpage (16), ledit rayon laser de vaporisation étant destiné à vaporiser le film (3) ou le revêtement.
PCT/EP2012/062426 2011-06-28 2012-06-27 Procédé et dispositif de découpage au laser de tôles recouvertes d'un film ou d'un revêtement WO2013000942A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201290000636.0U CN203956324U (zh) 2011-06-28 2012-06-27 用于激光切割镀膜板或涂层板的激光切割机

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011078173.0 2011-06-28
DE102011078173.0A DE102011078173B4 (de) 2011-06-28 2011-06-28 Verfahren zum Laserschneiden eines mit einer Folie versehenen Werkstücks mittels zweier Laserstrahlen sowie dazugehörige Laserschneidmaschine

Publications (1)

Publication Number Publication Date
WO2013000942A1 true WO2013000942A1 (fr) 2013-01-03

Family

ID=46354373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/062426 WO2013000942A1 (fr) 2011-06-28 2012-06-27 Procédé et dispositif de découpage au laser de tôles recouvertes d'un film ou d'un revêtement

Country Status (3)

Country Link
CN (1) CN203956324U (fr)
DE (1) DE102011078173B4 (fr)
WO (1) WO2013000942A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020205948A1 (de) 2020-05-12 2021-11-18 Trumpf Laser- Und Systemtechnik Gmbh Laserschneidverfahren und Laserschneidanlage

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10807190B2 (en) * 2015-06-09 2020-10-20 Corelase Oy Laser processing apparatus and method and an optical component therefor
JP6662397B2 (ja) * 2016-02-05 2020-03-11 村田機械株式会社 レーザ加工機およびレーザ加工方法
CN106346146B (zh) * 2016-11-04 2018-01-19 中国航空工业集团公司北京航空材料研究院 一种去除金属表面陶瓷涂层的高能短脉冲激光加工方法
DE102018204814A1 (de) * 2018-03-29 2019-10-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung und Verfahren zum Erzeugen von Laserstrahlungen mit unterschiedlicher Leistung und Brillanz
DE102019210019B4 (de) * 2019-07-08 2021-06-10 Trumpf Laser- Und Systemtechnik Gmbh Optische Apparatur zum Laserschweißen eines Werkstücks, Verfahren zum Laserschweißen eines Werkstücks mittels mehrerer Teilstrahlen sowie Verwendung einer optischen Apparatur zum Laserschweißen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664504B2 (en) * 2000-12-13 2003-12-16 L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and plant for laser cutting with dual-flow and double-focus cutting head
WO2005053895A1 (fr) * 2003-12-05 2005-06-16 Spi Lasers Uk Limited Dispositif pour le traitement industriel de materiau par rayonnement optique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19859243A1 (de) 1998-12-22 2000-07-20 Horst Exner Anordnung zum Schweissen, Schneiden, Bohren oder Beschichten mit einer Zweistrahlquelle und Verwendung von Laserstrahlen zum Schweissen, Schneiden, Bohren oder Beschichten von metallischen oder nichtmetallischen Stoffen
DE102010003750A1 (de) 2010-04-08 2011-10-13 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Anordnung zum Verändern der Strahlprofilcharakteristik eines Laserstrahls mittels einer Mehrfachclad-Faser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664504B2 (en) * 2000-12-13 2003-12-16 L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and plant for laser cutting with dual-flow and double-focus cutting head
WO2005053895A1 (fr) * 2003-12-05 2005-06-16 Spi Lasers Uk Limited Dispositif pour le traitement industriel de materiau par rayonnement optique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020205948A1 (de) 2020-05-12 2021-11-18 Trumpf Laser- Und Systemtechnik Gmbh Laserschneidverfahren und Laserschneidanlage
WO2021228829A1 (fr) 2020-05-12 2021-11-18 Trumpf Laser- Und Systemtechnik Gmbh Procédé de découpe laser et installation de découpe laser

Also Published As

Publication number Publication date
DE102011078173B4 (de) 2020-06-18
CN203956324U (zh) 2014-11-26
DE102011078173A1 (de) 2013-01-03

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