WO2012175263A1 - Heat-sink device and manufacturing method thereof - Google Patents
Heat-sink device and manufacturing method thereof Download PDFInfo
- Publication number
- WO2012175263A1 WO2012175263A1 PCT/EP2012/059427 EP2012059427W WO2012175263A1 WO 2012175263 A1 WO2012175263 A1 WO 2012175263A1 EP 2012059427 W EP2012059427 W EP 2012059427W WO 2012175263 A1 WO2012175263 A1 WO 2012175263A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- sink
- fins
- sink fins
- sink device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the first object of the present invention is realized by a heat-sink device, viz. the heat-sink device comprises a first heat-sink structure in thermal contact with an object from which heat to be dissipated and a second heat-sink structure, wherein the first heat-sink structure is composed of a plu ⁇ rality of first heat-sink fins and the second heat-sink structure is composed of a plurality of second heat-sink fins, wherein the first heat-sink fins are inserted into cavities formed in the second heat-sink fins.
- the heat-sink device according to the present invention is generally ap ⁇ plied in illumination systems, especially in a LED illumina ⁇ tion system.
- the second heat-sink fins and the base are made of thermally con ⁇ ductive plastic in one piece having a thermal conductivity between 1 to 4 W/m-k.
- the thermally conductive plastic could be PP, PPS, PA or ABS etc., which reduces significantly the weight of the whole heat-sink device and simplifies a manu ⁇ facturing process.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a heat-sink device, which comprises a first heat-sink structure (A) in thermal contact with an object from which heat to be dissipated and a second heat-sink structure (B), wherein the first heat-sink structure (A) is composed of a plurality of first heat-sink fins (1) and the second heat-sink structure (B) is composed of a plurality of second heat-sink fins (2), wherein the first heat-sink fins (1) are inserted into cavities (3) formed in the second heat-sink fins (2). In addition, the present invention also relates to a method for manufacturing the above type of heat-sink device.
Description
Description
Heat-sink Device and Manufacturing Method Thereof Technical Field
The present invention relates to a heat-sink device. In ad¬ dition, the present invention also relates to a method of manufacturing the above type of heat-sink device.
Background Art In the current illumination systems, an illumination system with a LED module as a light source has found more and more applications. The LED module has high requirements for heat dissipation since the heat dissipation directly affects the performance and the service life of the LED module. Accord- ingly, heat-sink devices of various materials and shapes have been used in the prior art, such as a heat-sink device made of aluminum, which has good heat dissipation performance but has a relatively large weight. Therefore, at present, a heat-sink device made of thermally conductive plastic has found more and more applications. In order to improve the heat dissipation performance of such a type of heat-sink de¬ vice, a plurality of heat-sink fins distributed uniformly are provided on the circumference of the heat-sink device, and on the contact surface between the heat-sink device and the printed circuit board of the LED module there is provided with a metal plate or a bucket-shaped metal insert, said metal plate or said bucket-shaped metal insert being gener¬ ally molded into a thermally conductive plastic body of the heat-sink device during a process of manufacturing the heat- sink device. However, in terms of the heat dissipation performance of the heat-sink device, what plays a decisive role
is the heat dissipation performance of respective heat-sink fins of the heat-sink device. The existing types of plastic heat-sink device fail to substantively improve the heat dis¬ sipation performance of the whole heat-sink device. Summary of the Invention
Therefore, the object of the present invention is to provide a heat-sink device with improved heat dissipation performance. Said heat-sink device has good heat dissipation per¬ formance and a relatively small weight, and is lower in cost as compared with the traditional full metal heat-sink device. Another object of the present invention is to provide a method of manufacturing the above type of heat-sink device.
The first object of the present invention is realized by a heat-sink device, viz. the heat-sink device comprises a first heat-sink structure in thermal contact with an object from which heat to be dissipated and a second heat-sink structure, wherein the first heat-sink structure is composed of a plu¬ rality of first heat-sink fins and the second heat-sink structure is composed of a plurality of second heat-sink fins, wherein the first heat-sink fins are inserted into cavities formed in the second heat-sink fins. The heat-sink device according to the present invention is generally ap¬ plied in illumination systems, especially in a LED illumina¬ tion system. The heat generated by the chip of the LED mod- ule acting as a light source is transferred to the first heat-sink structure and the second heat-sink structure of the heat-sink device via a printed circuit board carrying the LED chip. The heat-sink device according to the present invention can decrease rapidly the junction temperature of the LED chip, thereby improving significantly the lumen efficiency of the LED chip and prolonging the service life of the LED mod-
ule .
It is provided according to the present invention that the first heat-sink fins have higher thermal conductivity than the second heat-sink fins. In the design solution of the present invention, the first heat-sink fins are generally made of pure metal such as copper, aluminum, etc. and are also, of course, made of other metal with high thermal con¬ ductive performance, while the second heat-sink fins are made of thermally conductive plastic. The first heat-sink fins are inserted into the cavities of the second heat-sink fins and the first heat-sink fins have higher thermal conductive performance, which improve significantly the heat dissipation performance of the second heat-sink fins, further improve the heat dissipation performance of the whole heat-sink device, accelerate the heat dissipation of the LED chip, and achieve the purpose of decreasing rapidly the junction temperature of the LED chip.
According to one preferred design solution of the present in¬ vention, the first heat-sink structure also has a support component, the support component supporting the object from which heat to be dissipated, which is generally designed as a LED module, and being connected to each of the first heat- sink fins for heat conduction. By using said support compo¬ nent, the heat from the LED module is allowed to be trans- ferred uniformly to each of the first heat-sink fins so as to dissipate heat uniformly.
Preferably, the second heat-sink structure also has a base, the base having a receiving part for receiving the support component. The support component is stably received in the base, such that the object from which heat to be dissipated, acting as a LED module, can also be held in the base. And
the LED module is enclosed as much as possible by the heat- sink device, which is more beneficial for the heat dissipa¬ tion of the LED module.
Preferably, the support component comprises a thermal conduc- tion plate and a mounting plate superimposing together, wherein the first heat-sink fins are embedded into the ther¬ mal conduction plate and the mounting plate, respectively, and the mounting plate makes each of the first heat-sink fins connected into one entirety. One surface of the thermal con- duction plate is in close contact with the object from which heat to be dissipated and the other surface is supported by the mounting plate, and the mounting plate abuts against the corresponding bottom surface of the receiving part of the base. Each of the first heat-sink fins are embedded into the lateral sides of the thermal conduction plate and the mount¬ ing plate. By using such a structure, each of the first heat-sink fins can be favorably held in the mounting plate and can make the heat from the thermal conduction plate dis¬ sipate uniformly. Further preferably, the thermal conduction plate and the mounting plate are respectively provided with a plurality of grooves, and the first heat-sink fins are inserted into the grooves, respectively, so as to ensure a thermally conductive connection between the thermal conduction plate and the first heat-sink fins and a fixed connection between the mounting plate and the first heat-sink fins.
It is provided according to the present invention that the second heat-sink fins and the base are made of thermally con¬ ductive plastic in one piece having a thermal conductivity between 1 to 4 W/m-k. In a preferred design solution of the present invention, the thermally conductive plastic could be
PP, PPS, PA or ABS etc., which reduces significantly the weight of the whole heat-sink device and simplifies a manu¬ facturing process.
Preferably, like the first heat-sink fins, the thermal con- duction plate is also made of metal material having thermal conductivity higher than 4 W/m-k. In a preferred design solu¬ tion of the present invention, the first heat-sink fins, the thermal conduction plate could also be made of copper- or aluminum-based materials, or the like and is also, of course, made of other metal with high thermal conductive performance. The heat from the LED chip can be transferred rapidly to the first heat-sink fins via the thermal conduction plate.
Another object of the present invention lies in providing a method for manufacturing a heat-sink device, said method com- prising the following steps: a) providing a first heat-sink structure with a plurality of first heat-sink fins; b) pro¬ viding a second heat-sink structure made of thermally conduc¬ tive plastic, the second heat-sink structure comprising a base and second heat-sink fins extending outward in a radial direction on an outer surface of the base, wherein cavities are formed in the second heat-sink fins; c) inserting the first heat-sink fins into the cavities of the second heat- sink fins; and d) packaging by plastic injection the first heat-sink fins and the second heat-sink fins using thermally conductive plastic. The heat-sink device manufactured using said method has good heat dissipation performance and a rela¬ tively small weight, and is lower in cost as compared with the traditional full metal heat-sink device.
Preferably, in the step a) there further includes a process of connecting the plurality of first heat-sink fins into one entirety via a mounting plate. The respective first heat-
sink fins are firmly connected together by the mounting plate, which makes a process of inserting the first heat-sink fins into the cavities of the second heat-sink fins more sim¬ ple . Further preferably, in the step a) there further includes a process of providing a thermal conduction plate for support¬ ing an object from which heat to be dissipated on the mount¬ ing plate so as to connect the thermal conduction plate to each of the first heat-sink fins for heat conduction. By setting the thermal conduction plate, the heat from the ob¬ ject from which heat to be dissipated can be more favorably transferred to each of the first heat-sink fins.
Brief Description of the Drawings
The accompanying drawings constitute a part of the Descrip- tion and are used to provide further understanding of the present invention. Such accompanying drawings illustrate the embodiments of the present invention and are used to describe the principles of the present invention together with the De¬ scription. In the accompanying drawings the same components are represented using the same reference. As shown in the drawings :
Fig. 1 is an exploded perspective view of a heat dissipation device according to the present invention;
Fig. 2 is an exploded perspective view of a first heat-sink structure of a heat-sink device according to the present in¬ vention; and
Fig. 3a to Fig. 3c are flow charts of assembling according to a manufacturing method of the present invention.
Detailed Description of the Embodiments
Fig. 1 is an exploded perspective view of a heat dissipation device according to the present invention. From Fig. 1, it can be seen that the heat-sink device comprises a first heat- sink structure A and a second heat-sink structure B, wherein the first heat-sink structure A has a plurality of independ¬ ent first heat-sink fins 1 which are made of metal, espe¬ cially made of copper or aluminum. In addition, the first heat-sink structure A also has a support component C which supports an object from which heat to be dissipated not shown, which is a LED module, and the support component C is connected to each of the first heat-sink fins 1. In a spe¬ cific embodiment of the present invention, the support compo¬ nent C is designed as a circular disk, and each of the first heat-sink fins 1 are uniformly inserted into the circumference of the circular disk-shaped support component C.
From Fig. 1, it can be seen that the heat-sink device according to the present invention also comprises the second heat- sink structure B which has a base 4. The base 4 is designed as a cylindrical shape and a plurality of second heat-sink fins 2 integrated with the base 4 are formed on the outer surface of the base 4. In addition, a receiving part 5 is formed in the base 4. In the design solution of the present invention, the base 4 and the second heat-sink fins 2 are formed into one entirety by a process of plastic injection using thermally conductive plastic. From the figure, it can be seen that a cavity 3 is formed on each second heat-sink fin 2, and the first heat-sink fins 1 of the first heat-sink structure A are inserted into the cavities 3 to form an inte- gral heat-sink device. In order to make the first heat-sink fins 1 in better contact with the second heat-sink fins 2, the molten thermally conductive plastic, after completion of
assembling, can be filled into the gaps between the first heat-sink fins 1 and the second heat-sink fins 2 and is then cured. In the heat-sink device having been assembled, the first heat-sink fins 1 are completely inserted into the cavi- ties 3 of the second heat-sink fins 2 and the support compo¬ nent C is received in the receiving part 5.
Fig. 2 is an exploded perspective view of the first heat-sink structure A of the heat-sink device according to the present invention. From the figure, it can be seen that the first heat-sink structure A comprises a plurality of the first heat-sink fins 1 as well as the thermal conduction plate 6 and mounting plate 7 constituting the support component C. In the design solution of the present invention, the thermal conduction plate 6 is made of copper or aluminum, and the mounting plate 7 is made of thermally conductive plastic. A plurality of grooves 8 are provided on the circumference of the thermal conduction plate 6 and the mounting plate 7. The first heat-sink fins 1 are inserted into the grooves (8), re¬ spectively, which makes the plurality of first heat-sink fins 1 held stably in the mounting plate 7 so as to facilitate as¬ sembling. In the final state of assembling, the mounting plate 7 abuts against the bottom surface of the receiving part 5 of the base 4, while one surface of the thermal con¬ duction plate 6 abuts against the mounting plate, and the other surface thereof abuts against the object from which heat to be dissipated, that is a LED module. Moreover, the thermal conduction plate 6 is also in contact with the first heat-sink fins 1, such that the heat of the LED module is transferred to the second heat-sink structure B. Fig. 3a to Fig. 3c are flow charts of assembling according to a manufacturing method of the present invention. First, in the step a) there is provided the first heat-sink structure
_
y
A. In said step, first, there are provided the plurality of first heat-sink fins 1, the thermal conduction plate 6, and the mounting plate 7 (see Fig. 3a); second, these first heat- sink fins 1 are inserted into the corresponding grooves 8 of the mounting plate 7 to form a stable integral structure (see Fig. b) ; finally, the thermal conduction plate 6 is placed above the mounting plate 7, and the respective first heat- sink fins 1 engages with the grooves 8 of the thermal conduc¬ tion plate 6 so as to form a good thermally conductive con- nection with the thermal conduction plate (see Fig. 3c) . In the step b) , there is provided the second heat-sink structure B made of thermally conductive plastic, and the second heat- sink structure comprises the base 4 and the second heat-sink fins 2 extending outward in a radial direction on the outer surface of the base, wherein the cavities 3 are formed in the second heat-sink fins 2 (see Fig. 3d) . In the step c) , the first heat-sink fins 1 are inserted into the cavities 3 of the second heat-sink fins 2, and in the step d) , the first heat-sink fins 1 and the second heat-sink fins 2 are packaged by plastic injection using thermally conductive plastic so as to form the heat-sink device according to the present invention (see Fig. 3e) .
The descriptions above are only preferable embodiments of the present invention and are not used to restrict the present invention. For those skilled in the art, the present inven¬ tion may have various changes and variations. Any modifica¬ tions, equivalent substitutions, improvements etc. within the spirit and principle of the present invention shall all be included in the scope of protection of the present invention.
1
List of reference signs
1 first heat-sink fins
2 second heat-sink fins
3 cavities
4 a base
5 a receiving part
6 a thermal conduction plate
7 a mounting plate
8 grooves
A a first heat-sink structure
B a second heat-sink structure
C a support component
Claims
1. A heat-sink device, characterized in that, the heat-sink device comprises a first heat-sink structure (A) in thermal contact with an object which heat to be dissipated and a sec¬ ond heat-sink structure (B) , wherein the first heat-sink structure (A) is composed of a plurality of first heat-sink fins (1) and the second heat-sink structure (B) is composed of a plurality of second heat-sink fins (2), wherein the first heat-sink fins (1) are inserted into cavities (3) formed in the second heat-sink fins (2) .
2. The heat-sink device according to Claim 1, characterized in that, the first heat-sink fins (1) have higher ther- mal conductivity than the second heat-sink fins (2) .
3. The heat-sink device according to Claim 1, characterized in that, the first heat-sink structure (A) also has a support component (C) , the support component (C) supporting the ob- ject from which heat to be dissipated and being connected to each of the first heat-sink fins (1) for heat conduction.
4. The heat-sink device according to Claim 3, characterized in that, the second heat-sink structure (B) also has a base (4), the base (4) having a receiving part (5) for receiving the support component (C) .
5. The heat-sink device according to Claim 4, characterized in that, the support component (C) comprises a thermal con- duction plate (6) and a mounting plate (7) superimposing together, wherein the first heat-sink fins (1) are embedded into the thermal conduction plate (6) and the mounting plate (7), respectively, and the mounting plate (7) makes each of the first heat-sink fins (1) connected into one entirety.
6. The heat-sink device according to Claim 5, characterized in that, the thermal conduction plate (6) and the mounting plate (7) are respectively provided with a plurality of grooves (8), and the first heat-sink fins (1) are inserted into the grooves (8), respectively.
7. The heat-sink device according to Claim 4, characterized in that, the second heat-sink fins (2) and the base (4) are made of thermally conductive plastic in one piece having a thermal conductivity between 1 to 4 W/ m-k.
8. The heat-sink device according to Claim 7, characterized in that, the thermally conductive plastic is PP, PPS, PA or ABS.
9. The heat-sink device according to Claim 5, characterized in that, the first heat-sink fins (1) and the thermal conduc¬ tion plate (6) are made of metal material having thermal con- ductivity higher than 4 W/ m-k.
10. The heat-sink device according to Claim 9, characterized in that the first heat-sink fins (1) and the thermal conduc¬ tion plated (6) are made of copper- or aluminum-based materi- als.
11. A method for manufacturing a heat-sink device, characterized by the following steps:
a) providing a first heat-sink structure (A) with a plurality of first heat-sink fins (1);
b) providing a second heat-sink structure (B) made of thermally conductive plastic, the second heat-sink structure (B) comprising a base (4) and second heat-sink fins (2) extending outward in a radial direction on an outer surface of the base (4), wherein cavities (3) are formed in the second heat-sink fins (2 ) ;
c) inserting the first heat-sink fins (1) into the cavities (3) of the second heat-sink fins (2); and
d) packaging by plastic injection the first heat-sink fins
(1) and the second heat-sink fins (2) using thermally conduc¬ tive plastic.
12. The manufacturing method according to Claim 11, charac- terized in that, in the step a) there further includes a process of connecting the plurality of first heat-sink fins (1) into one entirety via a mounting plate (7) .
13. The manufacturing method according to Claim 12, charac- terized in that, in the step a) there further includes a process of providing a thermal conduction plate (6) for sup¬ porting an object from which heat to be dissipated on the mounting plate (7) so as to connect the thermal conduction plate (6) to each of the first heat-sink fins (1) for heat conduction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110168535.6 | 2011-06-21 | ||
| CN2011101685356A CN102840567A (en) | 2011-06-21 | 2011-06-21 | Heat sink and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012175263A1 true WO2012175263A1 (en) | 2012-12-27 |
Family
ID=46208459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2012/059427 Ceased WO2012175263A1 (en) | 2011-06-21 | 2012-05-22 | Heat-sink device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102840567A (en) |
| WO (1) | WO2012175263A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2918896A4 (en) * | 2013-11-21 | 2015-12-09 | Wang Lina | Led module |
| JP2017162788A (en) * | 2016-03-04 | 2017-09-14 | 三菱電機株式会社 | Lighting device and lighting apparatus |
| US20170307204A1 (en) * | 2016-04-25 | 2017-10-26 | Shat-R-Shield, Inc. | Led luminaire |
| US10386058B1 (en) | 2016-03-17 | 2019-08-20 | Shat-R-Shield, Inc. | LED luminaire |
| US10604275B2 (en) * | 2017-05-19 | 2020-03-31 | Goodrich Lighting Systems Gmbh | Exterior aircraft light unit |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103307573B (en) * | 2012-03-13 | 2018-07-24 | 欧司朗股份有限公司 | Radiator and lighting device with the radiator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2081220A2 (en) * | 2008-01-16 | 2009-07-22 | Neng Tyi Precision Industries Co., Ltd. | Method for manufacturing heat sink having heat-dissipating fins and structure of the same |
| US20100044009A1 (en) * | 2008-08-20 | 2010-02-25 | Shyh-Ming Chen | Annular heat dissipating device |
-
2011
- 2011-06-21 CN CN2011101685356A patent/CN102840567A/en active Pending
-
2012
- 2012-05-22 WO PCT/EP2012/059427 patent/WO2012175263A1/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2081220A2 (en) * | 2008-01-16 | 2009-07-22 | Neng Tyi Precision Industries Co., Ltd. | Method for manufacturing heat sink having heat-dissipating fins and structure of the same |
| US20100044009A1 (en) * | 2008-08-20 | 2010-02-25 | Shyh-Ming Chen | Annular heat dissipating device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2918896A4 (en) * | 2013-11-21 | 2015-12-09 | Wang Lina | Led module |
| JP2017162788A (en) * | 2016-03-04 | 2017-09-14 | 三菱電機株式会社 | Lighting device and lighting apparatus |
| US10386058B1 (en) | 2016-03-17 | 2019-08-20 | Shat-R-Shield, Inc. | LED luminaire |
| US20170307204A1 (en) * | 2016-04-25 | 2017-10-26 | Shat-R-Shield, Inc. | Led luminaire |
| US10767849B2 (en) * | 2016-04-25 | 2020-09-08 | Shat-R-Shield, Inc. | LED luminaire |
| US11092296B2 (en) | 2016-04-25 | 2021-08-17 | Shat-R-Shield, Inc. | LED luminaire |
| US10604275B2 (en) * | 2017-05-19 | 2020-03-31 | Goodrich Lighting Systems Gmbh | Exterior aircraft light unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102840567A (en) | 2012-12-26 |
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