WO2012173108A1 - Electrically conductive oxide and method for producing same, and oxide semiconductor film - Google Patents
Electrically conductive oxide and method for producing same, and oxide semiconductor film Download PDFInfo
- Publication number
- WO2012173108A1 WO2012173108A1 PCT/JP2012/064986 JP2012064986W WO2012173108A1 WO 2012173108 A1 WO2012173108 A1 WO 2012173108A1 JP 2012064986 W JP2012064986 W JP 2012064986W WO 2012173108 A1 WO2012173108 A1 WO 2012173108A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- crystalline
- powder
- conductive oxide
- semiconductor film
- mgo
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 151
- 239000000203 mixture Substances 0.000 claims abstract description 70
- 238000005245 sintering Methods 0.000 claims abstract description 46
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- 238000000465 moulding Methods 0.000 claims abstract description 18
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 17
- 229910052738 indium Inorganic materials 0.000 claims abstract description 15
- 238000005477 sputtering target Methods 0.000 claims abstract description 15
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 8
- 229910017976 MgO 4 Inorganic materials 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 30
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 20
- 238000001354 calcination Methods 0.000 claims description 15
- 239000000654 additive Substances 0.000 claims description 13
- 230000000996 additive effect Effects 0.000 claims description 13
- 239000002178 crystalline material Substances 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 230000000704 physical effect Effects 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 description 84
- 238000004544 sputter deposition Methods 0.000 description 42
- 238000002156 mixing Methods 0.000 description 33
- 239000000758 substrate Substances 0.000 description 24
- 230000005669 field effect Effects 0.000 description 18
- 238000002441 X-ray diffraction Methods 0.000 description 17
- 238000005530 etching Methods 0.000 description 14
- 239000013078 crystal Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000004458 analytical method Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 10
- 238000009616 inductively coupled plasma Methods 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910020068 MgAl Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 238000007580 dry-mixing Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910019092 Mg-O Inorganic materials 0.000 description 1
- 229910019395 Mg—O Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007541 Zn O Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G15/00—Compounds of gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/44—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/44—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminates
- C04B35/443—Magnesium aluminate spinel
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62685—Treating the starting powders individually or as mixtures characterised by the order of addition of constituents or additives
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
- C04B2235/3222—Aluminates other than alumino-silicates, e.g. spinel (MgAl2O4)
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3239—Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3241—Chromium oxides, chromates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3256—Molybdenum oxides, molybdates or oxide forming salts thereof, e.g. cadmium molybdate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3258—Tungsten oxides, tungstates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3286—Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3293—Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3298—Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3865—Aluminium nitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5409—Particle size related information expressed by specific surface values
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
Definitions
- the present invention relates to a conductive oxide, a manufacturing method thereof, and an oxide semiconductor film, and more particularly to a conductive oxide used as a target when forming an oxide semiconductor film by a sputtering method and a manufacturing method thereof.
- an amorphous silicon film is mainly used for a channel layer of a conventional TFT (thin film transistor).
- TFT thin film transistor
- an oxide semiconductor film containing In—Ga—Zn-based composite oxide (IGZO) as a main component has attracted attention as a semiconductor film that can replace an amorphous silicon film.
- IGZO In—Ga—Zn-based composite oxide
- Patent Document 1 discloses a technique for forming an amorphous oxide semiconductor film by a sputtering method using a target made of a sintered body of conductive oxide powder. It is disclosed. An oxide semiconductor film formed in this manner has an advantage of higher carrier mobility than an amorphous silicon film.
- Patent Document 1 The sputtering method disclosed in Japanese Patent Application Laid-Open No. 2008-199005 (Patent Document 1) will be described in detail. First, a target and a substrate are placed facing each other in a sputtering apparatus. Then, a voltage is applied to the target to sputter rare gas ions on the target surface, and the constituent atoms of the target are ejected. The constituent atoms of the target are deposited on the substrate, whereby an IGZO (In—Ga—Zn—O-based composite oxide) film is formed.
- IGZO In—Ga—Zn—O-based composite oxide
- Patent Document 2 discloses a sputtering containing a compound represented by InGaZnO 4 as a main component and containing a metal element having a positive tetravalence or higher. Disclose the target.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2008-199005 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2008-214697 (Patent Document 2) contains expensive Ga, it is expensive. It is. For this reason, development of the conductive oxide which is cheap compared with IGZO and can be suitably used for a sputtering target to obtain an oxide semiconductor film having high physical properties is demanded.
- An object of the present invention is to provide a conductive oxide that is inexpensive and can be suitably used as a sputtering target to obtain an oxide semiconductor film having high physical properties, a method for manufacturing the same, and an oxide semiconductor film.
- the present invention includes In, Al, M and O that are at least one element selected from the group consisting of Zn and Mg, and includes crystalline Al 2 MO 4 . It is a conductive oxide containing.
- crystalline Al 2 ZnO 4 can be included as crystalline Al 2 MO 4 .
- the proportion of crystalline Al 2 ZnO 4 occupied in the cross-sectional area of the conductive oxide may be 60% or less than 10%.
- crystalline In 2 Al 2 (1-m) Zn 1-q O 7-p (0 ⁇ m ⁇ 1, 0 ⁇ q ⁇ 1, 0 ⁇ p ⁇ 3m + q) and crystalline In 2 O 3 It may further include at least one crystalline material selected from the group.
- crystalline Al 2 MgO 4 can be included as crystalline Al 2 MO 4 .
- the ratio of crystalline Al 2 MgO 4 to the cross-sectional area of the conductive oxide can be set to 2% or more and 60% or less.
- crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s (0 ⁇ n ⁇ 1, 0 ⁇ t ⁇ 1, 0 ⁇ s ⁇ 3n + t) and crystalline In 2 O 3 It may further include at least one crystalline material selected from the group.
- the conductive oxide according to the present invention when the total atomic ratio of In, Al, and M is 100 atomic%, 10 to 50 atomic% In, 10 to 50 atomic% Al, and 15 to 40 atoms % M. can be included. Further, it may further contain at least one additive element selected from the group consisting of N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Sn, and Bi.
- the conductive oxide according to the present invention can be used as a sputtering target.
- the present invention is an oxide semiconductor film formed using the conductive oxide described above.
- a first mixture containing Al 2 O 3 powder and MO powder is prepared, where M is at least one element selected from the group consisting of Zn and Mg.
- the MO powder is a ZnO powder
- the crystalline Al 2 MO 4 powder is a crystalline Al 2 ZnO 4 powder
- a crystalline Al 2 ZnO 4 powder is produced.
- the calcining temperature of the mixture 1 may be 800 ° C. or more and less than 1200 ° C.
- the sintering temperature of the molded body in the step of sintering the molded body may be 1280 ° C. or more and less than 1500 ° C.
- the MO powder is an MgO powder
- the crystalline Al 2 MO 4 powder is a crystalline Al 2 MgO 4 powder
- a crystalline Al 2 MgO 4 powder is produced.
- the calcining temperature of the mixture No. 1 can be 800 ° C. or higher and lower than 1200 ° C.
- the sintering temperature of the molded body in the step of sintering the molded body can be 1300 ° C. or higher and 1500 ° C. or lower.
- a conductive oxide a method for producing the same, and an oxide semiconductor film which are inexpensive and can be suitably used as a sputtering target to obtain an oxide semiconductor film having high physical properties.
- the conductive oxide according to an embodiment of the present invention includes In, Al, M and O that are at least one element selected from the group consisting of Zn and Mg, and is crystalline Al. 2 Including MO 4 Since the conductive oxide of the present embodiment includes In, Al, M, which is at least one element selected from the group consisting of Zn and Mg, and O, expensive Ga contained in IGZO is contained. Since it is not included, it is cheaper than IGZO. In addition, since the conductive oxide of this embodiment includes crystalline Al 2 MO 4 , the characteristics of the oxide semiconductor film obtained by sputtering using the conductive oxide as a target are stabilized.
- crystalline Al 2 ZnO 4 is included as crystalline Al 2 MO 4 .
- crystalline Al 2 ZnO 4 the characteristics of the oxide semiconductor film obtained by sputtering using a conductive oxide as a target can be stabilized and the etching rate can be increased. Therefore, a conductive oxide containing crystalline Al 2 ZnO 4 is preferably used as a target for forming an oxide semiconductor film by a sputtering method.
- the ratio of ZnO 4 is preferably 10% or more and 60% or less, and more preferably 14% or more and 50% or less. If the proportion of crystalline Al 2 ZnO 4 in the cross-sectional area of the conductive oxide is lower than 10%, the characteristics of the oxide semiconductor film obtained by sputtering using the conductive oxide as a target become unstable, and the etching rate Becomes lower. When the ratio of crystalline Al 2 ZnO 4 in the cross-sectional area of the conductive oxide is higher than 60%, the surface roughness Ra of the oxide semiconductor film obtained by sputtering using the conductive oxide as a target becomes rough.
- the proportion of crystalline Al 2 ZnO 4 occupied in the cross-sectional area of the conductive oxide containing crystalline Al 2 ZnO 4 can be obtained by EDX (Energy Dispersive X-ray spectrometry). More specifically, the electrons (reflected electron image) reflected from the cross section resulting from the incident electron beam irradiated onto the cross section of the conductive oxide sample are observed. Then, by performing fluorescent X-ray analysis of regions having different contrasts and specifying the crystalline Al 2 ZnO 4 region, the ratio of the area of the crystalline Al 2 ZnO 4 region to the cross-sectional area can be measured. .
- the surface roughness Ra refers to the arithmetic average roughness Ra defined by JIS B0601: 2001, and can be measured by an AFM (atomic force microscope) or the like.
- the conductive oxide containing crystalline Al 2 ZnO 4 is crystalline In 2 Al 2 (1-m) Zn 1-q O 7-p (0 ⁇ m ⁇ 1, 0 ⁇ q ⁇ 1, 0 ⁇ It is preferable to further include at least one crystalline material selected from the group consisting of p ⁇ 3m + q) and crystalline In 2 O 3 .
- the surface roughness Ra of the oxide semiconductor film obtained by sputtering using a conductive oxide as a target can be reduced. it can.
- the thermal conductivity of the conductive oxide is increased, so that the discharge is stabilized when direct current sputtering is performed using the conductive oxide as a target.
- the field-effect mobility of the oxide semiconductor film obtained by sputtering using a conductive oxide as a target can be increased.
- crystalline Al 2 MgO 4 is included as crystalline Al 2 MO 4 .
- crystalline Al 2 MgO 4 the characteristics of the oxide semiconductor film obtained by sputtering using a conductive oxide as a target can be stabilized, and the field-effect mobility of the oxide semiconductor film can be increased. Therefore, a conductive oxide containing crystalline Al 2 MgO 4 is preferably used as a target for forming an oxide semiconductor film by a sputtering method.
- a crystalline ratio of Al 2 MgO 4 occupied in the cross-sectional area of the conductive oxide containing crystalline Al 2 MgO 4 is preferably 2% to 60%, more preferably at most 20% more than 5%.
- a conductive oxide containing crystalline MgAl 2 O 4 at such an area ratio as a sputtering target an oxide semiconductor film with high field-effect mobility can be manufactured.
- a conductive oxide containing crystalline Al 2 MgO 4 further comprising a crystalline In 2 O 3 the proportion of crystalline In 2 O 3 occupying the sectional area of the conductive oxide, 40% 98% The following is preferable, and 40% or more and 60% or less are more preferable.
- an oxide semiconductor film with high field-effect mobility is manufactured by forming an oxide semiconductor film Can do.
- the ratios of crystalline Al 2 MgO 4 and crystalline In 2 O 3 in the cross-sectional area of the conductive oxide are calculated as follows. First, the peaks of crystalline Al 2 MgO 4 and crystalline In 2 O 3 are confirmed by X-ray diffraction. Next, the conductive oxide is cut at an arbitrary surface. The cut surface of the conductive oxide is irradiated with an incident electron beam using an analytical scanning electron microscope to observe electrons reflected from the cross section (reflected electron image). In such a backscattered electron image, by performing fluorescent X-ray analysis on regions with different contrasts, the region where Al and Mg are mainly observed is identified as crystalline Al 2 MgO 4 , and only the In peak is observed. The region to be formed is identified as crystalline In 2 O 3 . In this way, the ratio of the area of crystalline MgAl 2 O 4 and crystalline In 2 O 3 occupying the cross section is calculated.
- the conductive oxide containing crystalline Al 2 MgO 4 is crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s (0 ⁇ n ⁇ 1, 0 ⁇ t ⁇ 1, 0 ⁇ s ⁇ 3n + t) and at least one crystalline material selected from the group consisting of crystalline In 2 O 3 is preferable.
- Such crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s is prepared by mixing crystalline powders of crystalline In 2 Al 2 MgO 7 and crystalline Al 2 MgO 4 under predetermined conditions. It is formed by modification and deficiency of Al and Mg in crystalline In 2 Al 2 MgO 7 .
- the oxygen stoichiometric ratio is smaller than “7” corresponding to the stoichiometric ratio of this deficiency. It may take a value (ie, s> 0).
- the crystalline In 2 Al 2 (1-n ) Mg 1-t O 7-s Although it is difficult to directly calculate the values of n and t in the crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s , the crystalline In 2 Al 2 (1-n ) The presence or absence of Mg 1-t O 7-s can be confirmed. The presence or absence of crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s is determined by determining the composition of the conductive oxide by ICP emission analysis and identifying the crystalline phase by X-ray diffraction. To do.
- the thermal conductivity of the conductive oxide is increased, so that the discharge is stabilized when direct current sputtering is performed using the conductive oxide as a target.
- the field-effect mobility of the oxide semiconductor film obtained by sputtering using a conductive oxide as a target can be increased.
- the conductive oxide of this embodiment when the total atomic ratio of In, Al, and M is 100 atomic%, 10 to 50 atomic% In, 10 to 50 atomic% Al, and 15 to 40 atoms % M is preferable.
- a conductive oxide having such an atomic ratio is inexpensive and can be suitably used as a sputtering target to obtain an oxide semiconductor film having high physical properties (for example, high etching rate, high field effect mobility, etc.). .
- the conductive oxide of this embodiment is at least one additive element selected from the group consisting of N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Sn, and Bi. Further, it is preferable that these additional elements are contained in an amount of 0.1 ⁇ 10 22 atm / cc to 5.0 ⁇ 10 22 atm / cc. That is, the total concentration of the additive elements contained in the conductive oxide of this embodiment is preferably 0.1 ⁇ 10 22 atm / cc or more and 5.0 ⁇ 10 22 atm / cc or less.
- SIMS secondary ion mass spectrometry
- the conductive oxide of this embodiment is suitably used for a sputtering target.
- the “target for sputtering method” means a material obtained by forming a film by sputtering method into a plate shape, or the plate-like material on a backing plate (back plate for attaching a target material).
- the backing plate is a generic term for affixed materials and the like, and the backing plate can be manufactured using materials such as oxygen-free copper, steel, stainless steel, aluminum, aluminum alloy, molybdenum, and titanium.
- the shape of the target described above is not particularly limited, and may be a round shape or a square shape.
- the target may have a disk shape (flat plate shape) with a diameter of 1 cm, or a square shape (flat plate with a diameter exceeding 2 m, such as a sputtering target for a large LCD (liquid crystal display device). (Rectangular).
- An oxide semiconductor film according to another embodiment of the present invention is formed using the conductive oxide of the above embodiment, and preferably using the conductive oxide of the above embodiment as a target. It is formed by a sputtering method. Since the oxide semiconductor film of this embodiment is formed using the conductive oxide of the above embodiment, the characteristics are stabilized, the etching rate is increased, and / or the field effect transfer is performed. The degree becomes higher.
- a target and a substrate are placed facing each other in a sputtering apparatus, a voltage is applied to the target to sputter rare gas ions on the surface of the target, and target atoms are ejected. Is formed on the substrate to form an oxide semiconductor film.
- the manufacturing method further conductive oxide which is another embodiment of the present invention, when at least one element selected from the group consisting of Zn and Mg and M, Al 2 O 3 A step of preparing a first mixture containing the powder and the MO powder (S10), a step of producing a crystalline Al 2 MO 4 powder by calcining the first mixture (S20), and a crystalline Al 2 A step of preparing a second mixture containing MO 4 powder and In 2 O 3 powder (S30), a step of obtaining a molded body by molding the second mixture (S40), and sintering the molded body A step (S50) of producing a conductive oxide.
- an inexpensive conductive oxide that is preferably used for forming a semiconductor oxide by including the above-described steps, more specifically, oxidized by a sputtering method.
- An inexpensive conductive oxide that is suitably used as a target for forming a physical semiconductor film can be efficiently produced.
- the step (S10) of preparing the first mixture containing the Al 2 O 3 powder and the MO powder includes Al 2 O as a raw material powder. This is performed by mixing 3 powder and MO powder (that is, ZnO powder and / or MgO powder).
- the purity of the Al 2 O 3 powder and the MO powder is not particularly limited, but is preferably 99.9% by mass or more and 99.99% by mass or more from the viewpoint of improving the quality of the conductive oxide to be produced. Is preferred.
- the mixing method of the Al 2 O 3 powder and the MO powder is not particularly limited, and may be a dry mixing method or a wet mixing method.
- a method such as mixing by a normal ball mill, mixing by a planetary ball mill, mixing by a bead mill, stirring mixing by ultrasonic waves, or the like is preferably used.
- the drying method when the wet mixing method is used may be natural drying or forced drying using a spray dryer or the like.
- the step (S20) of producing the crystalline Al 2 MO 4 powder is performed by calcining the first mixture.
- the calcining temperature of the first mixture is preferably 800 ° C. or higher and lower than 1200 ° C.
- the calcination temperature is less than 800 ° C.
- unreacted raw material powder remains and it becomes difficult to produce a crystalline Al 2 MO 4 powder having sufficient crystallinity.
- the calcining temperature is 1200 ° C. or higher, the grain size of the crystalline Al 2 MO 4 powder obtained by calcining becomes large, and it becomes difficult to obtain a dense sintered body in the subsequent sintering step. It takes time to pulverize the crystalline Al 2 MO 4 powder before the sintering step.
- the calcining atmosphere is not particularly limited, but is preferably an air atmosphere from the viewpoint of suppressing desorption of oxygen from the powder and being simple.
- Formation of crystalline Al 2 MO 4 powder by calcination is confirmed by the chemical composition determined by ICP emission analysis and the crystal phase identified by X-ray diffraction.
- the crystalline Al 2 MO 4 powder thus obtained preferably has an average particle size of 0.1 ⁇ m to 1.5 ⁇ m.
- the value calculated by the light scattering method shall be employ
- Crystalline Al 2 MO 4 powder and In 2 O 3 preparing a second mixture comprising a powder (S30) is carried out by mixing the crystalline Al 2 MO 4 powder and In 2 O 3 powder .
- the purity of the In 2 O 3 powder is not particularly limited, but is preferably 99.9% by mass or more and more preferably 99.99% by mass or more from the viewpoint of increasing the quality of the conductive oxide to be produced.
- the mixing method of the crystalline Al 2 MO 4 powder and the I 2 O 3 powder is not particularly limited, and may be a dry mixing method or a wet mixing method.
- a method such as mixing by a normal ball mill, mixing by a planetary ball mill, mixing by a bead mill, stirring mixing by ultrasonic waves, or the like is preferably used.
- the drying method when the wet mixing method is used may be natural drying or forced drying using a spray dryer or the like.
- N Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, together with crystalline Al 2 MO 4 powder and In 2 O 3 powder.
- Ta, W, Sn, and Bi The raw material powder containing at least one additive element selected from the group consisting of Bi is mixed.
- Such additive element raw material powder is not particularly limited, but from the viewpoint of suppressing mixing of impurity elements other than constituent elements and additive elements and oxygen desorption, AlN powder, Al 2 O 3 powder, SiO 2 powder, TiO 2 powder V 2 O 5 powder, Cr 2 O 3 powder, ZrO 2 powder, Nb 2 O 3 powder, MoO 2 powder, HfO 2 powder, Ta 2 O 3 powder, WO 3 powder, SnO 2 powder, and Bi 2 O 3 Powder is preferably used.
- the conductive oxide was selected from N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Sn, and Bi.
- a conductive oxide that includes at least one kind of additive element and can manufacture an oxide semiconductor film with high field-effect mobility can be manufactured.
- the method of molding the second mixture is not particularly limited, but from the viewpoint of high productivity, press molding, CIP (cold etc.) A method such as (pressure-pressing) molding or cast molding is preferably used. Further, from the viewpoint of efficiently forming in stages, it is preferable to perform CIP molding after press molding.
- the sintering temperature of the molded body depends on the type of crystalline Al 2 MO 4 powder containing the molded body (here, M is at least one element selected from the group consisting of Zn and Mg).
- the sintering temperature of the molded body preferably less than 1280 ° C. or higher 1500 ° C..
- the sintering temperature is less than 1280 ° C.
- the crystalline Al 2 ZnO 4 powder and In 2 O 3 powder are not sufficiently sintered, and it is difficult to produce a dense sintered body necessary as a sputtering target. It is.
- the sintering temperature is 1500 ° C. or higher, crystalline Al 2 ZnO 4 is not formed but only crystalline In 2 Al 2 (1-m) Zn 1-q O 7-p is formed.
- An oxide semiconductor film obtained by sputtering using a target becomes unstable in characteristics, and its surface roughness Ra increases and its etching rate decreases.
- the sintering temperature of the compact is 1280 ° C. or higher and lower than 1300 ° C.
- crystalline Al 2 ZnO 4 and crystalline In 2 O 3 are formed in the crystalline phase.
- the sintering temperature of the formed body is 1300 ° C. or higher and lower than 1500 ° C.
- crystalline Al 2 ZnO 4 and crystalline In 2 Al 2 (1-m) Zn 1-q O 7-p are formed in the crystalline phase.
- the sintering temperature of the molded body is preferably 1300 ° C. or higher 1500 ° C. or less.
- the sintering temperature is less than 1300 ° C., the crystalline Al 2 MgO 4 powder and In 2 O 3 powder are not sufficiently sintered, and it is difficult to produce a dense sintered body necessary as a sputtering target. It is.
- the sintering temperature is higher than 1500 ° C., Mg is desorbed, resulting in a variation in the composition of the sintered body and inhomogeneity.
- the sintering temperature of the compact is 1300 ° C.
- crystalline Al 2 MgO 4 and crystalline In 2 O 3 are formed in the crystalline phase.
- the sintering temperature of the formed body is 1390 ° C. or higher and lower than 1500 ° C.
- crystalline Al 2 ZnO 4 and crystalline In 2 Al 2 (1-n) Zn 1-t O 7-s are formed in the crystalline phase.
- a ZnO mixture was prepared. Water was used as a dispersion medium during pulverization and mixing. This mixture was dried with a spray dryer to obtain a first mixture.
- a first mixture prepared resulting crystalline Al 2 ZnO 4 powder was placed in an aluminum oxide crucible and calcined for 5 hours at a temperature of 900 ° C. in an air atmosphere.
- a crystalline Al 2 ZnO 4 powder that is a calcined powder formed of crystalline Al 2 ZnO 4 was obtained.
- the presence of crystalline Al 2 ZnO 4 was confirmed by the chemical composition determined by ICP emission analysis and the crystal phase identified by X-ray diffraction.
- the obtained second mixture was press-molded under the condition of a surface pressure of 1.0 ton f / cm 2 , and CIP-molded under the condition of each surface pressure of 2.0 ton f / cm 2 .
- a disk-shaped molded body having a diameter of 100 mm and a thickness of about 9 mm was obtained.
- the eight molded bodies obtained were 1250 ° C (Example A1), 1280 ° C (Example A2), 1300 ° C (Example A3), 1350 ° C (Example A4), 1375 ° C (Example A5), 1400 ° C ( Eight sintered bodies having different crystalline composition ratios as conductive oxides (Example A6), 1450 ° C. (Example A7), and 1500 ° C. (Example AR1), respectively, for 5 hours. A1 to A7 and Example AR1) were obtained.
- the relative density of the obtained sintered body was calculated by the following method. First, the bulk density of the obtained sintered body was measured by the Archimedes method. Next, the sintered body was pulverized and the true density of the powder was measured by a pycnometer method. Next, the relative density of the sintered body was calculated by dividing the bulk density by the true density.
- Oxide Semiconductor Films were produced by DC (direct current) magnetron sputtering using the obtained eight conductive oxides as targets. Specifically, a synthetic quartz glass substrate having a size of 25 mm ⁇ 25 mm ⁇ thickness 0.6 mm was disposed as a film formation substrate on a water-cooled substrate holder in the film formation chamber of the sputtering apparatus. The conductive oxide was disposed at a distance of 40 mm so that the main surface thereof was opposed to the main surface of the synthetic quartz glass substrate. Here, a part of the main surface of the synthetic quartz glass substrate was covered with a metal mask.
- the pressure inside the film forming chamber was reduced to 1 ⁇ 10 ⁇ 4 Pa.
- Ar gas is introduced into the film forming chamber up to a pressure of 1 Pa, and direct current power of 30 W is applied to cause sputtering discharge.
- the surface of the conductive oxide (target) was cleaned (pre-sputtering) for 10 minutes.
- Ar gas was introduced into the film formation chamber to a pressure of 20 Pa, 50 W direct current power was applied to cause sputtering discharge, and the oxide semiconductor film was formed for 1 hour by removing the shutter. Note that no bias voltage was applied to the substrate holder, and the substrate holder was only water-cooled.
- the oxide semiconductor film was formed.
- the obtained oxide semiconductor film was amorphous when its crystallinity was evaluated by X-ray diffraction (SmartLab manufactured by Rigaku Corporation).
- the conductive oxide containing In, Al, Zn, and O and containing crystalline Al 2 ZnO 4 is By sputtering as a target, an oxide semiconductor film having stable characteristics and a high etching rate was able to be manufactured. Furthermore, as shown in Examples A3 to A7, a conductive oxide having a ratio of crystalline Al 2 ZnO 4 to a cross-sectional area of 10% or more and 60% or less has a surface roughness Ra by sputtering using the conductive oxide as a target. A fine oxide semiconductor film could be produced.
- Example B (Examples B1 to B6) In Examples B1 to B6 of Example B, conductive oxidation comprising crystalline Al 2 MgO 4 and crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n (0 ⁇ n ⁇ 1) A product was made.
- Molding The second mixture obtained above is press-molded under the condition of a surface pressure of 1.0 ton f / cm 2 , and CIP-molded at each surface pressure of 2.0 ton f / cm 2. A disk-shaped molded body having a thickness of about 9 mm was produced.
- Example B7 The conductive oxide of Example B7 was produced by the same production method as in Example B1, except that the preparation method of the second mixture and the sintering temperature of the compact were different from Example B1. That is, in Example B7, in the step of preparing the second mixture, in addition to crystalline Al 2 MgO 4 powder and In 2 O 3 powder, AlN powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / By adding g), a second mixture of In 2 O 3 —AlN—crystalline Al 2 MgO 4 mixed powder was obtained. By using this second mixture, sintering was carried out at a sintering temperature of 1390 ° C. in an atmospheric pressure and nitrogen atmosphere for 5 hours to prepare a disk-shaped molded body having a diameter of 100 mm and a thickness of about 9 mm.
- Example B8 to B20 In Examples B8 to B20, the conductivity of Examples B8 to B20 is the same as that of Example B7 except that the method for preparing the second mixture and the sintering temperature and sintering atmosphere of the molded body are different. An oxide was produced.
- Example B8 to B20 the AlN powder of Example B7 was replaced with an oxide powder containing additive elements (Al 2 O 3 powder, SiO 2 powder, TiO 2 powder, V 2 O 5 powder, Cr 2 O 3 powder, ZrO 2 powder, Nb 2 O 3 powder, MoO 2 powder, HfO 2 powder, Ta 2 O 3 powder, WO 3 powder, SnO 2 powder, Bi 2 O 3 powder) Sintering was performed therein to produce conductive oxides of Examples B8 to B20.
- additive elements Al 2 O 3 powder, SiO 2 powder, TiO 2 powder, V 2 O 5 powder, Cr 2 O 3 powder, ZrO 2 powder, Nb 2 O 3 powder, MoO 2 powder, HfO 2 powder, Ta 2 O 3 powder, WO 3 powder, SnO 2 powder, Bi 2 O 3 powder
- the obtained mixture was put in an aluminum oxide crucible and calcined in an air atmosphere at 1200 ° C. for 5 hours to obtain crystalline In 2 Al 2 MgO 7 powder.
- the crystalline In 2 Al 2 MgO 7 powder obtained above was molded by uniaxial pressure molding to produce a disk-shaped molded body having a diameter of 100 mm and a thickness of 9 mm.
- the molded body was fired at 1500 ° C. for 5 hours in an air atmosphere to produce a conductive oxide of Example BR1. Due to the powder mixing method and the sintering temperature of 1500 ° C. or higher, only crystalline In 2 Al 2 MgO 7 is formed, and crystalline MgAl 2 O 4 and crystalline In 2 Al 2 (1-n) mg 1-n O 7-4n was not formed.
- Example BR2 a conductive oxide was produced by a process different from the method for producing the conductive oxide of Examples B1 to B20. That is, first, In 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / g) was charged into a bead mill apparatus. The In 2 O 3 powder was pulverized and mixed for 30 minutes using water as a dispersion solvent. Thereafter, by evaporating the water by spray drying, to form a granulated powder comprising only an In 2 O 3.
- In 2 O 3 powder purity: 99.99 mass%, BET specific surface area: 5 m 2 / g
- the granulated powder obtained above was molded by uniaxial pressure molding to produce a compact on a disc having a diameter of 100 mm and a thickness of 9 mm.
- the molded body thus produced was sintered at 1500 ° C. for 5 hours in an air atmosphere to produce a conductive oxide of Example BR2.
- Example B21 to B26 The conductivity of Examples B21 to B26 is the same as Example B1 except that the mixing ratio of the raw material powders in the first mixture and the second mixture is different from Example B1 and the sintering temperature is less than 1390 ° C.
- An oxide was produced. That is, in Examples B21 to B26, the mixing ratio of the Al 2 O 3 powder, the MgO powder, and the In 2 O 3 particles was adjusted so that the atomic ratio shown in the column “Atom concentration ratio” in Table 3 was obtained. . Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
- Example B27 A conductive oxide of Example B27 was produced in the same manner as in Example B7 except that the sintering temperature was different from that of Example B7. Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
- Example B28-B40 The conductive oxides of Examples B28 to B40 were prepared in the same manner as in Examples B8 to B20, except that the sintering temperature was different from that of Examples B8 to B20. Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
- the atomic ratio (unit: atomic%) of In, Al, and Mg was measured using ICP emission analysis. The results are shown in the column “Atom concentration ratio” in Tables 2 and 3.
- the conductive oxides produced in Examples B1 to B40 and Examples BR1 to BR2 were cut on an arbitrary surface, and the cut surfaces were subjected to fluorescent X-ray analysis using an analytical scanning electron microscope, whereby conductive oxides were obtained.
- the ratio of crystalline Al 2 MgO 4 and the ratio of crystalline In 2 O 3 occupying the cross-sectional area was calculated.
- the conductive oxides prepared in Examples B1 to B40 were subjected to crystal analysis by powder X-ray diffraction. Specifically, the diffraction angle 2 ⁇ was measured by irradiating Cu K ⁇ rays as X-rays, and it was confirmed by the diffraction peaks that both In 2 O 3 and Al 2 MgO 4 were crystalline. On the other hand, in the conductive oxide produced in Example BR1, the presence of Al 2 MgO 4 was not confirmed even by evaluation using an analytical scanning electron microscope and X-ray diffraction, and In 2 Al 2 MgO was detected by X-ray diffraction. A diffraction peak of 7 was confirmed.
- composition of the additive element and the number of atoms per 1 cm 3 (atom / cm 3 ) of the conductive oxides prepared in Examples B1 to B40 and Examples BR1 to BR2 were calculated by SIMS. The results are shown in the “added elements” and “concentration” columns of Tables 2 and 3.
- An oxide semiconductor film was formed by DC (direct current) magnetron sputtering using the conductive oxides obtained in Examples B1 to B40 and Examples BR1 and BR2 as targets.
- a TFT including the oxide semiconductor film as a channel layer was manufactured, and the field-effect mobility of each TFT was calculated to evaluate the performance of the conductive oxides of Examples B1 to B40 and Examples BR1 to BR2.
- the above-mentioned field effect mobility was specifically calculated as follows. First, the conductive oxides obtained in Examples B1 to B40 and Examples BR1 to BR2 were processed into targets having a diameter of 3 inches (76.2 mm) and a thickness of 5.0 mm. And the target was arrange
- the inside of the sputtering apparatus is evacuated to about 1 ⁇ 10 ⁇ 4 Pa, and with the shutter placed between the substrate and the target, Ar gas is introduced into the film forming chamber to set the pressure in the film forming chamber to 1 Pa. Further, the surface of the target was cleaned (pre-sputtering) for 10 minutes by applying 120 W DC power to the target and performing sputtering discharge.
- Ar gas containing 15% by volume of oxygen gas at a flow rate ratio is introduced into the film forming chamber so that the pressure in the film forming chamber is 0.8 Pa, and further, a sputtering direct current power of 120 W is applied to the target, whereby a glass substrate is obtained.
- An oxide semiconductor film with a thickness of 70 nm was formed thereon.
- the substrate holder was only cooled with water and no bias voltage was applied.
- the oxide semiconductor film was etched.
- a resist was applied on the oxide semiconductor film, exposed, and developed so that only portions of the oxide semiconductor film where the source electrode and the drain electrode were formed were exposed.
- a metal layer made of Ti, a metal layer made of Al, and a metal layer made of Mo in this order on the portion where the resist is not formed (electrode forming portion) by sputtering, Ti / A source electrode and a drain electrode having a three-layer structure of Al / Mo and a film thickness of 100 nm were formed.
- the resist over the oxide semiconductor film was peeled off, whereby a TFT including an oxide semiconductor film made of In—Al—Mg—O as a channel layer was manufactured.
- the conductive oxide according to the present invention can be preferably used as a target for sputtering film formation.
Abstract
Description
本発明の一実施形態である導電性酸化物は、Inと、Alと、ZnおよびMgからなる群から選ばれる少なくとも1種類の元素であるMと、Oと、を含み、かつ、結晶質Al2MO4を含む。本実施形態の導電性酸化物は、Inと、Alと、ZnおよびMgからなる群から選ばれる少なくとも1種類の元素であるMと、Oとを含むことから、IGZOに含まれる高価なGaを含んでいないため、IGZOに比べて安価である。また、本実施形態の導電性酸化物は、結晶質Al2MO4を含むことから、導電性酸化物をターゲットとするスパッタリングにより得られる酸化物半導体膜の特性が安定化される。結晶質Al2MO4において、Mに対応するZnとMgとは、いずれも原子価が+2であり、イオン半径が極めて近似しているため、結晶質Al2ZnO4と結晶質Al2MgO4とは、いずれもスピネル型の結晶構造を有している。 [Conductive oxide]
The conductive oxide according to an embodiment of the present invention includes In, Al, M and O that are at least one element selected from the group consisting of Zn and Mg, and is crystalline Al. 2 Including MO 4 Since the conductive oxide of the present embodiment includes In, Al, M, which is at least one element selected from the group consisting of Zn and Mg, and O, expensive Ga contained in IGZO is contained. Since it is not included, it is cheaper than IGZO. In addition, since the conductive oxide of this embodiment includes crystalline Al 2 MO 4 , the characteristics of the oxide semiconductor film obtained by sputtering using the conductive oxide as a target are stabilized. In crystalline Al 2 MO 4 , Zn and Mg corresponding to M both have a valence of +2 and their ionic radii are very close, so crystalline Al 2 ZnO 4 and crystalline Al 2 MgO 4 All have a spinel crystal structure.
本発明の別の実施形態である酸化物半導体膜は、上記の実施形態の導電性酸化物を用いて形成されたものであり、好ましくは上記の実施形態の導電性酸化物をターゲットに用いてスパッタリング法により形成されたものである。本実施形態の酸化物半導体膜は、上記の実施形態の導電性酸化物を用いて形成されているため、その特性が安定化させてそのエッチング速度を高くなり、および/または、その電界効果移動度が高くなる。なお、スパッタリング法とは、スパッタリング装置内にターゲットと基板とを対向して配置して、ターゲットに電圧を印加してターゲット表面に希ガスイオンをスパッタリングし、ターゲットの構成原子を飛び出させ、このターゲットの構成原子を基板上に堆積されることにより、酸化物半導体膜を形成する方法をいう。 [Oxide semiconductor film]
An oxide semiconductor film according to another embodiment of the present invention is formed using the conductive oxide of the above embodiment, and preferably using the conductive oxide of the above embodiment as a target. It is formed by a sputtering method. Since the oxide semiconductor film of this embodiment is formed using the conductive oxide of the above embodiment, the characteristics are stabilized, the etching rate is increased, and / or the field effect transfer is performed. The degree becomes higher. In the sputtering method, a target and a substrate are placed facing each other in a sputtering apparatus, a voltage is applied to the target to sputter rare gas ions on the surface of the target, and target atoms are ejected. Is formed on the substrate to form an oxide semiconductor film.
図1を参照して、本発明のさらに別の実施形態である導電性酸化物の製造方法は、ZnおよびMgからなる群から選ばれる少なくとも1種類の元素をMとするとき、Al2O3粉末とMO粉末とを含む第1の混合物を調製する工程(S10)と、第1の混合物を仮焼することにより結晶質Al2MO4粉末を作製する工程(S20)と、結晶質Al2MO4粉末とIn2O3粉末とを含む第2の混合物を調製する工程(S30)と、第2の混合物を成形することにより成形体を得る工程(S40)と、成形体を焼結する工程(S50)と、を含む導電性酸化物の製造方法である。 [Method for producing conductive oxide]
Referring to FIG. 1, the manufacturing method further conductive oxide which is another embodiment of the present invention, when at least one element selected from the group consisting of Zn and Mg and M, Al 2 O 3 A step of preparing a first mixture containing the powder and the MO powder (S10), a step of producing a crystalline Al 2 MO 4 powder by calcining the first mixture (S20), and a crystalline Al 2 A step of preparing a second mixture containing MO 4 powder and In 2 O 3 powder (S30), a step of obtaining a molded body by molding the second mixture (S40), and sintering the molded body A step (S50) of producing a conductive oxide.
ZnおよびMgからなる群から選ばれる少なくとも1種類の元素をMとするとき、Al2O3粉末とMO粉末とを含む第1の混合物を調製する工程(S10)は、原料粉末としてAl2O3粉末とMO粉末(すなわちZnO粉末および/またはMgO粉末)とを混合することにより行われる。ここで、Al2O3粉末およびMO粉末の純度は、特に制限はないが、製造する導電性酸化物の品質を高くする観点から、99.9質量%以上が好ましく、99.99質量%以上が好ましい。また、Al2O3粉末とMO粉末との混合割合は、特に制限はないが、結晶質Al2MO4粉末の収率を高める観点から、モル比率で、Al2O3:MO=1:0.95~1.05が好ましい。 (Preparation process of the first mixture)
When at least one element selected from the group consisting of Zn and Mg is M, the step (S10) of preparing the first mixture containing the Al 2 O 3 powder and the MO powder includes Al 2 O as a raw material powder. This is performed by mixing 3 powder and MO powder (that is, ZnO powder and / or MgO powder). Here, the purity of the Al 2 O 3 powder and the MO powder is not particularly limited, but is preferably 99.9% by mass or more and 99.99% by mass or more from the viewpoint of improving the quality of the conductive oxide to be produced. Is preferred. The mixing ratio of the Al 2 O 3 powder and the MO powder is not particularly limited, but from the viewpoint of increasing the yield of the crystalline Al 2 MO 4 powder, the molar ratio is Al 2 O 3 : MO = 1: 0.95 to 1.05 is preferable.
結晶質Al2MO4粉末を作製する工程(S20)は、上記の第1の混合物を仮焼することにより行われる。第1の混合物の仮焼温度は、800℃以上1200℃未満が好ましい。仮焼温度が800℃未満であると、未反応の原料粉末が残存し十分な結晶性を有する結晶質Al2MO4粉末を作製することが困難となる。仮焼温度が1200℃以上であると、仮焼により得られる結晶質Al2MO4粉末の粒径が大きくなりそのままでは後の焼結工程で緻密な焼結体を得ることが困難となり、焼結工程前に結晶質Al2MO4粉末の粉砕に時間を要する。仮焼雰囲気は、特に制限はないが、粉末からの酸素の脱離を抑制し、また簡便である観点から、大気雰囲気が好ましい。 (Production process of crystalline Al 2 MO 4 powder)
The step (S20) of producing the crystalline Al 2 MO 4 powder is performed by calcining the first mixture. The calcining temperature of the first mixture is preferably 800 ° C. or higher and lower than 1200 ° C. When the calcination temperature is less than 800 ° C., unreacted raw material powder remains and it becomes difficult to produce a crystalline Al 2 MO 4 powder having sufficient crystallinity. When the calcining temperature is 1200 ° C. or higher, the grain size of the crystalline Al 2 MO 4 powder obtained by calcining becomes large, and it becomes difficult to obtain a dense sintered body in the subsequent sintering step. It takes time to pulverize the crystalline Al 2 MO 4 powder before the sintering step. The calcining atmosphere is not particularly limited, but is preferably an air atmosphere from the viewpoint of suppressing desorption of oxygen from the powder and being simple.
結晶質Al2MO4粉末とIn2O3粉末とを含む第2の混合物を調製する工程(S30)は、結晶質Al2MO4粉末とIn2O3粉末とを混合することにより行われる。ここで、In2O3粉末の純度は、特に制限はないが、製造する導電性酸化物の品質を高くする観点から、99.9質量%以上が好ましく、99.99質量%以上が好ましい。また、結晶質Al2MO4粉末とI2O3粉末との混合割合は、特に制限はないが、導電性酸化物の導電性を高める観点から、モル比率で、結晶質Al2MO4:I2O3=1:0.95~1が好ましい。 (Preparation process of the second mixture)
Crystalline Al 2 MO 4 powder and In 2 O 3 preparing a second mixture comprising a powder (S30) is carried out by mixing the crystalline Al 2 MO 4 powder and In 2 O 3 powder . Here, the purity of the In 2 O 3 powder is not particularly limited, but is preferably 99.9% by mass or more and more preferably 99.99% by mass or more from the viewpoint of increasing the quality of the conductive oxide to be produced. Further, the mixing ratio of the crystalline Al 2 MO 4 powder and the I 2 O 3 powder is not particularly limited, but from the viewpoint of enhancing the conductivity of the conductive oxide, the crystalline Al 2 MO 4 : I 2 O 3 = 1: 0.95 to 1 is preferable.
(成形工程)
第2の混合物を成形することにより成形体を得る工程(S40)において、第2の混合物を成形する方法は、特に制限はないが、生産性が高い観点から、プレス成形、CIP(冷間等方圧プレス)成形、鋳込み成形などの方法が好適に用いられる。また、段階的に効率的に成形する観点から、プレス成形した後、さらにCIP成形することが好ましい。 In the case of producing a conductive oxide containing an additive element, N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, together with crystalline Al 2 MO 4 powder and In 2 O 3 powder. , Ta, W, Sn, and Bi. The raw material powder containing at least one additive element selected from the group consisting of Bi is mixed. Such additive element raw material powder is not particularly limited, but from the viewpoint of suppressing mixing of impurity elements other than constituent elements and additive elements and oxygen desorption, AlN powder, Al 2 O 3 powder, SiO 2 powder, TiO 2 powder V 2 O 5 powder, Cr 2 O 3 powder, ZrO 2 powder, Nb 2 O 3 powder, MoO 2 powder, HfO 2 powder, Ta 2 O 3 powder, WO 3 powder, SnO 2 powder, and Bi 2 O 3 Powder is preferably used. By adding such additive element raw material powder, the conductive oxide was selected from N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Sn, and Bi. A conductive oxide that includes at least one kind of additive element and can manufacture an oxide semiconductor film with high field-effect mobility can be manufactured.
(Molding process)
In the step of obtaining a molded body by molding the second mixture (S40), the method of molding the second mixture is not particularly limited, but from the viewpoint of high productivity, press molding, CIP (cold etc.) A method such as (pressure-pressing) molding or cast molding is preferably used. Further, from the viewpoint of efficiently forming in stages, it is preferable to perform CIP molding after press molding.
成形体を焼結する工程(S50)により、導電性酸化物が得られる。成形体の焼結温度は、成形体が含んでいる結晶質Al2MO4粉末(ここで、MはZnおよびMgからなる群から選ばれる少なくとも1種類の元素である)の種類によって異なる。 (Sintering process)
An electroconductive oxide is obtained by the process (S50) of sintering a molded object. The sintering temperature of the molded body depends on the type of crystalline Al 2 MO 4 powder containing the molded body (here, M is at least one element selected from the group consisting of Zn and Mg).
1.第1の混合物の調製
Al2O3粉末(純度:99.99質量%、BET(Brunauer,Emmett,Teller)比表面積:10m2/g)と、ZnO粉末(純度:99.99質量%、BET比表面積:4m2/g)とを、Al2O3:ZnO=1:1のモル混合比率で、ボールミル装置を用いて3時間粉砕混合することにより、第1の混合物としてAl2O3-ZnO混合物を作製した。粉砕混合の際の分散媒としては、水を用いた。この混合物を、スプレードライヤで乾燥させることにより、第1の混合物を得た。 [Example A]
1. Preparation of first mixture Al 2 O 3 powder (purity: 99.99% by mass, BET (Brunauer, Emmett, Teller) specific surface area: 10 m 2 / g) and ZnO powder (purity: 99.99% by mass, BET Specific surface area: 4 m 2 / g) at a molar mixing ratio of Al 2 O 3 : ZnO = 1: 1 by pulverization and mixing for 3 hours using a ball mill apparatus, to obtain Al 2 O 3 − as the first mixture. A ZnO mixture was prepared. Water was used as a dispersion medium during pulverization and mixing. This mixture was dried with a spray dryer to obtain a first mixture.
得られた第1の混合物を、酸化アルミニウム製ルツボに入れて、大気雰囲気中で900℃の温度で5時間仮焼した。こうして、結晶質Al2ZnO4で形成される仮焼粉末である結晶質Al2ZnO4粉末が得られた。結晶質Al2ZnO4の存在は、ICP発光分析により求められる化学組成と、X線回折により同定される結晶相とにより、確認した。 2. A first mixture prepared resulting crystalline Al 2 ZnO 4 powder was placed in an aluminum oxide crucible and calcined for 5 hours at a temperature of 900 ° C. in an air atmosphere. Thus, a crystalline Al 2 ZnO 4 powder that is a calcined powder formed of crystalline Al 2 ZnO 4 was obtained. The presence of crystalline Al 2 ZnO 4 was confirmed by the chemical composition determined by ICP emission analysis and the crystal phase identified by X-ray diffraction.
得られた結晶質Al2ZnO4粉末(仮焼粉末)と、In2O3粉末(純度:99.99質量%、BET比表面積:5m2/g)とを、結晶質Al2ZnO4:In2O3=1:0.95のモル混合比率で、ボールミル装置を用いて6時間粉砕混合することにより、第2の混合物としてIn2O3-結晶質Al2ZnO4混合物を調製した。粉砕混合の際の分散媒としては、水を用いた。この混合物を、スプレードライヤで乾燥させることにより、第2の混合物を得た。 3. Preparation of Second Mixture The obtained crystalline Al 2 ZnO 4 powder (calcined powder) and In 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / g) were crystallized. The mixture is pulverized and mixed for 6 hours using a ball mill apparatus at a molar mixing ratio of fine Al 2 ZnO 4 : In 2 O 3 = 1: 0.95, whereby In 2 O 3 -crystalline Al 2 ZnO is used as the second mixture. Four mixtures were prepared. Water was used as a dispersion medium during pulverization and mixing. This mixture was dried with a spray dryer to obtain a second mixture.
得られた第2の混合物を、面圧1.0トンf/cm2の条件でプレス成形し、各面圧2.0トンf/cm2の条件でCIP成形することにより、8個の直径100mmで厚さ約9mmの円板状の成形体を得た。 4). Molding The obtained second mixture was press-molded under the condition of a surface pressure of 1.0 ton f / cm 2 , and CIP-molded under the condition of each surface pressure of 2.0 ton f / cm 2 . A disk-shaped molded body having a diameter of 100 mm and a thickness of about 9 mm was obtained.
得られた8個の成形体を、1250℃(例A1)、1280℃(例A2)、1300℃(例A3)、1350℃(例A4)、1375℃(例A5)、1400℃(例A6)、1450℃(例A7)、1500℃(例AR1)の温度でそれぞれ5時間焼結することにより、導電性酸化物として結晶質の組成比率が互いに異なる8個の焼結体(例A1~A7、および例AR1)が得られた。 5. Sintering The eight molded bodies obtained were 1250 ° C (Example A1), 1280 ° C (Example A2), 1300 ° C (Example A3), 1350 ° C (Example A4), 1375 ° C (Example A5), 1400 ° C ( Eight sintered bodies having different crystalline composition ratios as conductive oxides (Example A6), 1450 ° C. (Example A7), and 1500 ° C. (Example AR1), respectively, for 5 hours. A1 to A7 and Example AR1) were obtained.
得られた上記8個の導電性酸化物をターゲットとして、DC(直流)マグネトロンスパッタリングにより、8個の酸化物半導体膜をそれぞれ作製した。具体的には、スパッタリング装置の成膜室内の水冷している基板ホルダ上に、成膜用基板として25mm×25mm×厚さ0.6mmの合成石英ガラス基板を配置した。上記の導電性酸化物を、その主表面が上記の合成石英ガラス基板の主表面に対向するように40mmの距離に配置した。ここで、合成石英ガラス基板は、その主表面の一部領域を金属マスクで被覆した。 6). Production and Evaluation of Oxide Semiconductor Films by Sputtering Eight oxide semiconductor films were produced by DC (direct current) magnetron sputtering using the obtained eight conductive oxides as targets. Specifically, a synthetic quartz glass substrate having a size of 25 mm × 25 mm × thickness 0.6 mm was disposed as a film formation substrate on a water-cooled substrate holder in the film formation chamber of the sputtering apparatus. The conductive oxide was disposed at a distance of 40 mm so that the main surface thereof was opposed to the main surface of the synthetic quartz glass substrate. Here, a part of the main surface of the synthetic quartz glass substrate was covered with a metal mask.
得られた酸化物半導体膜の表面粗さRaを、AFM(原子間力顕微鏡)により10μm×10μm角の範囲で測定した。結果を表1にまとめた。 (1) Evaluation of surface roughness Ra The surface roughness Ra of the obtained oxide semiconductor film was measured in the range of 10 μm × 10 μm square by AFM (atomic force microscope). The results are summarized in Table 1.
合成石英ガラス基板上において、酸化物半導体膜が形成された領域と金属マスクに覆われて酸化物半導体膜が形成されなかった領域との間の段差を触針式表面粗さ計で測定することによって、成膜された酸化物半導体膜の厚さを求めた。 (2) Evaluation of etching rate On a synthetic quartz glass substrate, a step between a region where an oxide semiconductor film is formed and a region covered with a metal mask and where an oxide semiconductor film is not formed is a stylus type surface. The thickness of the formed oxide semiconductor film was determined by measuring with a roughness meter.
(例B1~B6)
実施例Bの例B1~B6においては、結晶質Al2MgO4と結晶質In2Al2(1-n)Mg1-nO7-4n(0≦n<1)とを含む導電性酸化物を作製した。 [Example B]
(Examples B1 to B6)
In Examples B1 to B6 of Example B, conductive oxidation comprising crystalline Al 2 MgO 4 and crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n (0 ≦ n <1) A product was made.
Al2O3粉末(純度:99.99質量%、BET比表面積:5m2/g)と、MgO粉末(純度:99.99質量%、BET比表面積:6m2/g)とを、モル混合比率がAl2O3:MgO=1:1となるようにボールミル装置に入れた。これらの粉末を分散溶媒として水を用いて30分間粉砕混合した。その後、スプレードライヤによって水を揮発させることにより、Al2O3-MgO混合物からなる第1の混合物を得た。 1. Prepare first mixture Al 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / g) and MgO powder (purity: 99.99 mass%, BET specific surface area: 6 m 2 / g) Was placed in a ball mill apparatus so that the molar mixing ratio was Al 2 O 3 : MgO = 1: 1. These powders were pulverized and mixed for 30 minutes using water as a dispersion solvent. Thereafter, water was volatilized by a spray dryer to obtain a first mixture made of an Al 2 O 3 —MgO mixture.
次に、上記の第1の混合物を酸化アルミニウム製ルツボに入れて、900℃の大気雰囲気中で5時間の仮焼を行なうことにより、結晶質Al2MgO4粉末が得られた。結晶質Al2MgO4の存在は、ICP発光分析により求められる化学組成と、X線回折により同定される結晶相とにより、確認した。 2. Preparation of crystalline Al 2 MgO 4 powder Next, the first mixture of the above placed in an aluminum oxide crucible, by performing calcination for 5 hours in the air atmosphere at 900 ° C., crystalline Al 2 MgO 4 A powder was obtained. The presence of crystalline Al 2 MgO 4 was confirmed by the chemical composition determined by ICP emission analysis and the crystal phase identified by X-ray diffraction.
上記の結晶質Al2MgO4粉末とIn2O3粉末(純度:99.99質量%、BET比表面積:8m2/g)とを、モル混合比率がAl2MgO4:In2O3=1:1となるようにボールミル装置に入れた。そして、これらの粒子を分散溶媒として水を用いて6時間粉砕混合した。その後、スプレードライヤによって水を揮発させることにより、第2の混合物であるIn2O3-結晶質Al2MgO4混合物を得た。 3. Preparation of Second Mixture The above crystalline Al 2 MgO 4 powder and In 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 8 m 2 / g) were mixed at a molar mixing ratio of Al 2 MgO 4. : In 2 O 3 = 1: 1. These particles were pulverized and mixed for 6 hours using water as a dispersion solvent. Thereafter, water was volatilized by a spray dryer to obtain a second mixture of In 2 O 3 -crystalline Al 2 MgO 4 .
上記で得られた第2の混合物を、面圧1.0トンf/cm2の条件でプレス成形し、各面圧2.0トンf/cm2でCIP成形することにより、直径100mmで厚さ約9mmの円板状の成形体を作製した。 4). Molding The second mixture obtained above is press-molded under the condition of a surface pressure of 1.0 ton f / cm 2 , and CIP-molded at each surface pressure of 2.0 ton f / cm 2. A disk-shaped molded body having a thickness of about 9 mm was produced.
このようにして得られた成形体を大気雰囲気中にて、以下の表2の「焼結温度」の欄に示す温度で5時間焼成することにより導電性酸化物を作製した。なお、焼結温度を1390℃以上1500℃以下としたことにより、結晶質Al2MgO4および結晶質In2Al2(1-n)Mg1-nO7-4nを含む導電性酸化物が得られた。 5. Sintering The compact thus obtained was fired for 5 hours in the atmosphere at the temperature shown in the column of “Sintering temperature” in Table 2 below to produce a conductive oxide. By setting the sintering temperature to 1390 ° C. or higher and 1500 ° C. or lower , a conductive oxide containing crystalline Al 2 MgO 4 and crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n can be obtained. Obtained.
例B1に対し第2の混合物の調製方法ならびに成形体の焼結温度が異なる他は、例B1と同様の製造方法によって、例B7の導電性酸化物を作製した。すなわち、例B7では、第2の混合物を調製する工程において、結晶質Al2MgO4粉末とIn2O3粉末に加え、AlN粉末(純度:99.99質量%、BET比表面積:5m2/g)を加えたことにより、In2O3-AlN-結晶質Al2MgO4混合粉体からなる第2の混合物を得た。かかる第2の混合物を用いて、1390℃の焼結温度で、大気圧、窒素雰囲気にて5時間焼結することにより、直径100mmで厚さ約9mmの円板状の成形体を作製した。 (Example B7)
The conductive oxide of Example B7 was produced by the same production method as in Example B1, except that the preparation method of the second mixture and the sintering temperature of the compact were different from Example B1. That is, in Example B7, in the step of preparing the second mixture, in addition to crystalline Al 2 MgO 4 powder and In 2 O 3 powder, AlN powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / By adding g), a second mixture of In 2 O 3 —AlN—crystalline Al 2 MgO 4 mixed powder was obtained. By using this second mixture, sintering was carried out at a sintering temperature of 1390 ° C. in an atmospheric pressure and nitrogen atmosphere for 5 hours to prepare a disk-shaped molded body having a diameter of 100 mm and a thickness of about 9 mm.
例B8~B20では、例B7に対し、第2の混合物の調整方法ならびに成形体の焼結温度および焼結雰囲気が異なる他は、例B7と同様の製造方法によって、例B8~B20の導電性酸化物を作製した。すなわち、例B8~B20では、例B7のAlN粉末を、添加元素を含む酸化物粉末(Al2O3粉末、SiO2粉末、TiO2粉末、V2O5粉末、Cr2O3粉末、ZrO2粉末、Nb2O3粉末、MoO2粉末、HfO2粉末、Ta2O3粉末、WO3粉末、SnO2粉末、Bi2O3粉末)に代え、表2に示す焼結温度で、大気中にて焼結を行ない、例B8~B20の導電性酸化物を作製した。 (Examples B8 to B20)
In Examples B8 to B20, the conductivity of Examples B8 to B20 is the same as that of Example B7 except that the method for preparing the second mixture and the sintering temperature and sintering atmosphere of the molded body are different. An oxide was produced. That is, in Examples B8 to B20, the AlN powder of Example B7 was replaced with an oxide powder containing additive elements (Al 2 O 3 powder, SiO 2 powder, TiO 2 powder, V 2 O 5 powder, Cr 2 O 3 powder, ZrO 2 powder, Nb 2 O 3 powder, MoO 2 powder, HfO 2 powder, Ta 2 O 3 powder, WO 3 powder, SnO 2 powder, Bi 2 O 3 powder) Sintering was performed therein to produce conductive oxides of Examples B8 to B20.
例BR1では、例B1~B20の導電性酸化物の製造方法とは異なる工程により導電性酸化物を作製した。すなわち、例BR1の導電性酸化物の製造方法では、まずAl2O3粉末(純度:99.99質量%、BET比表面積:11m2/g)と、MgO粉末(純度:99.99質量%、BET比表面積:4m2/g)と、In2O3粉末(純度:99.99質量%、BET比表面積:5m2/g)とを、モル混合比率がIn2O3:Al2O3:MgO=1:1:1となるようにビーズミル装置に投入した。そして、これらの混合粉末を分散溶媒として水を用いて30分間粉砕混合した。その後、スプレードライヤによって水を揮発させることにより、In2O3-Al2O3-MgO混合物を得た。 (Example BR1)
In Example BR1, a conductive oxide was produced by a process different from the method for producing the conductive oxide of Examples B1 to B20. That is, in the method for producing the conductive oxide of Example BR1, first, Al 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 11 m 2 / g) and MgO powder (purity: 99.99 mass%). , BET specific surface area: 4 m 2 / g) and In 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / g), the molar mixing ratio is In 2 O 3 : Al 2 O 3 : MgO = 1: 1: 1 was charged into the bead mill apparatus. These mixed powders were pulverized and mixed for 30 minutes using water as a dispersion solvent. Thereafter, water was volatilized by a spray dryer to obtain an In 2 O 3 —Al 2 O 3 —MgO mixture.
例BR2では、例B1~B20の導電性酸化物の製造方法とは異なる工程により導電性酸化物を作製した。すなわち、まずIn2O3粉末(純度:99.99質量%、BET比表面積:5m2/g)をビーズミル装置に投入した。そして、In2O3粉末を分散溶媒として水を用いて30分間粉砕混合した。その後、スプレードライによって水を揮発させることにより、In2O3のみからなる造粒粉を形成した。 (Example BR2)
In Example BR2, a conductive oxide was produced by a process different from the method for producing the conductive oxide of Examples B1 to B20. That is, first, In 2 O 3 powder (purity: 99.99 mass%, BET specific surface area: 5 m 2 / g) was charged into a bead mill apparatus. The In 2 O 3 powder was pulverized and mixed for 30 minutes using water as a dispersion solvent. Thereafter, by evaporating the water by spray drying, to form a granulated powder comprising only an In 2 O 3.
例B1に対し第1の混合物および第2の混合物中の原料粉末の混合比率が異なると共に焼結温度が1390℃未満である他は、例B1と同様の方法によって、例B21~B26の導電性酸化物を作製した。すなわち、例B21~B26では、表3の「原子濃度比率」の欄に示す原子比率となるように、Al2O3粉末と、MgO粉末と、In2O3粒子との混合比率を調整した。なお、焼結温度を1390℃未満としたことにより、導電性酸化物が結晶質In2Al2(1-n)Mg1-nO7-4nを含まなかった。 (Example B21 to B26)
The conductivity of Examples B21 to B26 is the same as Example B1 except that the mixing ratio of the raw material powders in the first mixture and the second mixture is different from Example B1 and the sintering temperature is less than 1390 ° C. An oxide was produced. That is, in Examples B21 to B26, the mixing ratio of the Al 2 O 3 powder, the MgO powder, and the In 2 O 3 particles was adjusted so that the atomic ratio shown in the column “Atom concentration ratio” in Table 3 was obtained. . Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
例B7に対し焼結温度が異なる他は、例B7と同様の方法によって、例B27の導電性酸化物を作製した。なお、焼結温度を1390℃未満としたことにより、導電性酸化物は結晶質In2Al2(1-n)Mg1-nO7-4nを含まなかった。 (Example B27)
A conductive oxide of Example B27 was produced in the same manner as in Example B7 except that the sintering temperature was different from that of Example B7. Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
例B8~B20のそれぞれに対し焼結温度が異なる他は、例B8~B20のそれぞれと同様の方法によって、例B28~B40のそれぞれの導電性酸化物を作製した。なお、焼結温度を1390℃未満としたことにより、導電性酸化物が結晶質In2Al2(1-n)Mg1-nO7-4nを含まなかった。 (Example B28-B40)
The conductive oxides of Examples B28 to B40 were prepared in the same manner as in Examples B8 to B20, except that the sintering temperature was different from that of Examples B8 to B20. Note that, by setting the sintering temperature to less than 1390 ° C., the conductive oxide did not contain crystalline In 2 Al 2 (1-n) Mg 1-n O 7-4n .
例B1~B40および例BR1~BR2で得られた導電性酸化物をターゲットとして用いて、DC(直流)マグネトロンスパッタ法により酸化物半導体膜を成膜した。該酸化物半導体膜をチャネル層として備えるTFTを作製し、各TFTの電界効果移動度を算出することにより、例B1~B40および例BR1~BR2の導電性酸化物の性能を評価した。 (Evaluation: Field effect mobility)
An oxide semiconductor film was formed by DC (direct current) magnetron sputtering using the conductive oxides obtained in Examples B1 to B40 and Examples BR1 and BR2 as targets. A TFT including the oxide semiconductor film as a channel layer was manufactured, and the field-effect mobility of each TFT was calculated to evaluate the performance of the conductive oxides of Examples B1 to B40 and Examples BR1 to BR2.
μfe=gm・L/(W・Ci・Vds) ・・・式(2)
(評価結果と考察)
表2および3に示される結果から、例B1~B40の導電性酸化物を用いて作製した酸化物半導体膜は、例BR1~BR2の導電性酸化物を用いて作製した酸化物半導体膜に比して、TFTの電界効果移動度が高い値を示している。これは、例B1~B40の導電性酸化物が、In、Al、Mg、Oを含み、かつ結晶質として結晶質Al2MgO4を含むことによるものと考えられる。 g m = dI ds / dV gs (1)
μ fe = g m · L / (W · C i · V ds ) (2)
(Evaluation results and discussion)
From the results shown in Tables 2 and 3, the oxide semiconductor films manufactured using the conductive oxides of Examples B1 to B40 are in comparison with the oxide semiconductor films manufactured using the conductive oxides of Examples BR1 to BR2. Thus, the field effect mobility of the TFT is high. This is presumably because the conductive oxides of Examples B1 to B40 contain In, Al, Mg, O, and contain crystalline Al 2 MgO 4 as the crystalline material.
Claims (14)
- Inと、Alと、ZnおよびMgからなる群から選ばれる少なくとも1種類の元素であるMと、Oと、を含み、かつ、結晶質Al2MO4を含む導電性酸化物。 A conductive oxide containing In, Al, and at least one element selected from the group consisting of Zn and Mg, and O, and containing crystalline Al 2 MO 4 .
- 前記結晶質Al2MO4として結晶質Al2ZnO4を含む請求項1に記載の導電性酸化物。 Conductive oxide according to claim 1 comprising a crystalline Al 2 ZnO 4 as the crystalline Al 2 MO 4.
- 前記導電性酸化物の断面積に占める前記結晶質Al2ZnO4の割合が10%以上60%以下である請求項2に記載の導電性酸化物。 The conductive oxide according to claim 2, wherein a ratio of the crystalline Al 2 ZnO 4 occupying in a cross-sectional area of the conductive oxide is 10% or more and 60% or less.
- 結晶質In2Al2(1-m)Zn1-qO7-p(0≦m<1、0≦q<1、0≦p≦3m+q)および結晶質In2O3からなる群から選ばれる少なくとも1種類の結晶質をさらに含む請求項2または3に記載の導電性酸化物。 Selected from the group consisting of crystalline In 2 Al 2 (1-m ) Zn 1-q O 7-p (0 ≦ m <1,0 ≦ q <1,0 ≦ p ≦ 3m + q) and crystalline In 2 O 3 The conductive oxide according to claim 2, further comprising at least one crystalline material.
- 前記結晶質Al2MO4として結晶質Al2MgO4を含む請求項1に記載の導電性酸化物。 Conductive oxide according to claim 1 comprising a crystalline Al 2 MgO 4 as the crystalline Al 2 MO 4.
- 前記導電性酸化物の断面積に占める前記結晶質Al2MgO4の割合が2%以上60%以下である請求項5に記載の導電性酸化物。 The conductive oxide according to claim 5, wherein a ratio of the crystalline Al 2 MgO 4 to a cross-sectional area of the conductive oxide is 2% or more and 60% or less.
- 結晶質In2Al2(1-n)Mg1-tO7-s(0≦n<1、0≦t<1、0≦s≦3n+t)および結晶質In2O3からなる群から選ばれる少なくとも1種類の結晶質をさらに含む請求項5または6に記載の導電性酸化物。 Selected from the group consisting of crystalline In 2 Al 2 (1-n) Mg 1-t O 7-s (0 ≦ n <1, 0 ≦ t <1, 0 ≦ s ≦ 3n + t) and crystalline In 2 O 3 The conductive oxide according to claim 5, further comprising at least one crystalline material.
- In、Al、およびMの合計の原子比率を100原子%とすると、10~50原子%のInと、10~50原子%のAlと、15~40原子%のMと、を含む請求項1~7のいずれかに記載の導電性酸化物。 2. The atomic ratio of the total of In, Al, and M includes 10 to 50 atomic% In, 10 to 50 atomic% Al, and 15 to 40 atomic% M, assuming that the total atomic ratio of In, Al and M is 100 atomic%. 8. The conductive oxide according to any one of 1 to 7.
- N、Al、Si、Ti、V、Cr、Zr、Nb、Mo、Hf、Ta、W、Sn、およびBiからなる群から選ばれる少なくとも1種類の添加元素をさらに含む、請求項1~8のいずれかに記載の導電性酸化物。 The element according to claim 1 further comprising at least one additive element selected from the group consisting of N, Al, Si, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Sn, and Bi. The conductive oxide in any one.
- スパッタリング法のターゲットに用いられる請求項1~9のいずれかに記載の導電性酸化物。 The conductive oxide according to claim 1, which is used for a sputtering target.
- 請求項1~10のいずれかに記載された導電性酸化物を用いて形成された酸化物半導体膜。 An oxide semiconductor film formed using the conductive oxide according to any one of claims 1 to 10.
- ZnおよびMgからなる群から選ばれる少なくとも1種類の元素をMとするとき、Al2O3粉末とMO粉末とを含む第1の混合物を調製する工程(S10)と、
前記第1の混合物を仮焼することにより結晶質Al2MO4粉末を作製する工程(S20)と、
前記結晶質Al2MO4粉末とIn2O3粉末とを含む第2の混合物を調製する工程(S30)と、
前記第2の混合物を成形することにより成形体を得る工程(S40)と、
前記成形体を焼結する工程(S50)と、を含む導電性酸化物の製造方法。 A step (S10) of preparing a first mixture containing Al 2 O 3 powder and MO powder, where M is at least one element selected from the group consisting of Zn and Mg;
Producing a crystalline Al 2 MO 4 powder by calcining the first mixture (S20);
Preparing a second mixture containing the crystalline Al 2 MO 4 powder and In 2 O 3 powder (S30);
A step of obtaining a molded body by molding the second mixture (S40);
A method of producing a conductive oxide, comprising: sintering the molded body (S50). - 前記MO粉末はZnO粉末であり、前記結晶質Al2MO4粉末は結晶質Al2ZnO4粉末であって、前記結晶質Al2ZnO4粉末を作製する工程(S20)における前記第1の混合物の仮焼温度は800℃以上1200℃未満であり、前記成形体を焼結する工程(S50)における前記成形体の焼結温度は1280℃以上1500℃未満である請求項12に記載の導電性酸化物の製造方法。 The MO powder is a ZnO powder, the crystalline Al 2 MO 4 powder is a crystalline Al 2 ZnO 4 powder, and the first mixture in the step of preparing the crystalline Al 2 ZnO 4 powder (S20). The calcination temperature is 800 ° C or higher and lower than 1200 ° C, and the sintering temperature of the molded body in the step of sintering the molded body (S50) is 1280 ° C or higher and lower than 1500 ° C. Production method of oxide.
- 前記MO粉末はMgO粉末であり、前記結晶質Al2MO4粉末は結晶質Al2MgO4粉末であって、前記結晶質Al2MgO4粉末を作製する工程(S20)における前記第1の混合物の仮焼温度は800℃以上1200℃未満であり、前記成形体を焼結する工程(S50)における前記成形体の焼結温度は1300℃以上1500℃以下である請求項12に記載の導電性酸化物の製造方法。 The MO powder is an MgO powder, the crystalline Al 2 MO 4 powder is a crystalline Al 2 MgO 4 powder, and the first mixture in the step of preparing the crystalline Al 2 MgO 4 powder (S20). The calcination temperature is 800 ° C or higher and lower than 1200 ° C, and the sintering temperature of the molded body in the step of sintering the molded body (S50) is 1300 ° C or higher and 1500 ° C or lower. Production method of oxide.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013520553A JP5929911B2 (en) | 2011-06-15 | 2012-06-12 | Conductive oxide, method for producing the same, and oxide semiconductor film |
CN201280029318.1A CN103608310B (en) | 2011-06-15 | 2012-06-12 | Electroconductive oxide and manufacture method thereof and oxide semiconductor film |
KR1020137029873A KR102003077B1 (en) | 2011-06-15 | 2012-06-12 | Electrically conductive oxide and method for producing same, and oxide semiconductor film |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-132982 | 2011-06-15 | ||
JP2011132982 | 2011-06-15 | ||
JP2011-139631 | 2011-06-23 | ||
JP2011139631 | 2011-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012173108A1 true WO2012173108A1 (en) | 2012-12-20 |
Family
ID=47357095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/064986 WO2012173108A1 (en) | 2011-06-15 | 2012-06-12 | Electrically conductive oxide and method for producing same, and oxide semiconductor film |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5929911B2 (en) |
KR (1) | KR102003077B1 (en) |
CN (1) | CN103608310B (en) |
TW (1) | TWI532864B (en) |
WO (1) | WO2012173108A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112363A1 (en) * | 2013-01-15 | 2014-07-24 | 出光興産株式会社 | Sputtering target, oxide semiconductor thin film, and production methods for both |
WO2015137468A1 (en) * | 2014-03-14 | 2015-09-17 | 大日精化工業株式会社 | Thermally conductive complex oxide, production method therefor, thermally conductive complex oxide-containing composition, and use therefor |
JP2016522317A (en) * | 2013-04-11 | 2016-07-28 | ヘレーウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトHeraeus Deutschland GmbH&Co.KG | LIGHT ABSORBING LAYER, LAYER SYSTEM HAVING THIS LAYER, LAYER SYSTEM MANUFACTURING METHOD, AND SPUTTER TARGET MATERIAL |
WO2018096992A1 (en) * | 2016-11-25 | 2018-05-31 | 宇部マテリアルズ株式会社 | Physical vapor-deposition target member and sputtering target member, and physical vapor-deposition film and layer structure manufacturing method |
US11374130B2 (en) | 2020-02-07 | 2022-06-28 | Kioxia Corporation | Semiconductor device and semiconductor memory device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2933825B1 (en) * | 2014-03-31 | 2017-07-05 | Flosfia Inc. | Crystalline multilayer structure and semiconductor device |
CN105063559A (en) * | 2015-08-17 | 2015-11-18 | 基迈克材料科技(苏州)有限公司 | Zr element-doped AZO target material with enhanced photoelectric property |
EP4286339A1 (en) * | 2022-05-31 | 2023-12-06 | Imec VZW | Mixed metal oxides |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008018402A1 (en) * | 2006-08-11 | 2008-02-14 | Hitachi Metals, Ltd. | Zinc oxide sinter, process for producing the same, and sputtering target |
WO2010007989A1 (en) * | 2008-07-15 | 2010-01-21 | 東ソー株式会社 | Sintered complex oxide, method for producing sintered complex oxide, sputtering target and method for producing thin film |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06191844A (en) * | 1992-12-25 | 1994-07-12 | Hoya Corp | Electric conductive transparent oxide |
JP3947575B2 (en) * | 1994-06-10 | 2007-07-25 | Hoya株式会社 | Conductive oxide and electrode using the same |
JP3501614B2 (en) * | 1997-02-26 | 2004-03-02 | 株式会社オプトロン | ITO sintered body, method of manufacturing the same, and method of forming ITO film using the ITO sintered body |
US7635440B2 (en) * | 2003-03-04 | 2009-12-22 | Nippon Mining & Metals Co., Ltd. | Sputtering target, thin film for optical information recording medium and process for producing the same |
JP5244327B2 (en) | 2007-03-05 | 2013-07-24 | 出光興産株式会社 | Sputtering target |
KR101312259B1 (en) | 2007-02-09 | 2013-09-25 | 삼성전자주식회사 | Thin film transistor and method for forming the same |
TWI393695B (en) * | 2009-10-02 | 2013-04-21 | Chunghwa Picture Tubes Ltd | Fabricating method of nano-powder and application thereof |
JP5081959B2 (en) * | 2010-08-31 | 2012-11-28 | Jx日鉱日石金属株式会社 | Oxide sintered body and oxide semiconductor thin film |
-
2012
- 2012-06-12 KR KR1020137029873A patent/KR102003077B1/en active IP Right Grant
- 2012-06-12 JP JP2013520553A patent/JP5929911B2/en active Active
- 2012-06-12 WO PCT/JP2012/064986 patent/WO2012173108A1/en active Application Filing
- 2012-06-12 CN CN201280029318.1A patent/CN103608310B/en active Active
- 2012-06-15 TW TW101121654A patent/TWI532864B/en active
-
2016
- 2016-04-28 JP JP2016091156A patent/JP6137382B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008018402A1 (en) * | 2006-08-11 | 2008-02-14 | Hitachi Metals, Ltd. | Zinc oxide sinter, process for producing the same, and sputtering target |
WO2010007989A1 (en) * | 2008-07-15 | 2010-01-21 | 東ソー株式会社 | Sintered complex oxide, method for producing sintered complex oxide, sputtering target and method for producing thin film |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112363A1 (en) * | 2013-01-15 | 2014-07-24 | 出光興産株式会社 | Sputtering target, oxide semiconductor thin film, and production methods for both |
JPWO2014112363A1 (en) * | 2013-01-15 | 2017-01-19 | 出光興産株式会社 | Sputtering target, oxide semiconductor thin film, and manufacturing method thereof |
JP2016522317A (en) * | 2013-04-11 | 2016-07-28 | ヘレーウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトHeraeus Deutschland GmbH&Co.KG | LIGHT ABSORBING LAYER, LAYER SYSTEM HAVING THIS LAYER, LAYER SYSTEM MANUFACTURING METHOD, AND SPUTTER TARGET MATERIAL |
WO2015137468A1 (en) * | 2014-03-14 | 2015-09-17 | 大日精化工業株式会社 | Thermally conductive complex oxide, production method therefor, thermally conductive complex oxide-containing composition, and use therefor |
KR20160134752A (en) * | 2014-03-14 | 2016-11-23 | 다이니치 세이카 고교 가부시키가이샤 | Thermally conductive complex oxide, production method therefor, thermally conductive complex oxide-containing composition, and use therefor |
JPWO2015137468A1 (en) * | 2014-03-14 | 2017-04-06 | 大日精化工業株式会社 | Thermally conductive complex oxide, method for producing the same, thermally conductive complex oxide-containing composition and use thereof |
JP2017190456A (en) * | 2014-03-14 | 2017-10-19 | 大日精化工業株式会社 | Heat conductive composite oxide, manufacturing method therefor and heat conductive composite oxide-containing composition |
KR101873139B1 (en) | 2014-03-14 | 2018-06-29 | 다이니치 세이카 고교 가부시키가이샤 | Thermally conductive complex oxide, production method therefor, thermally conductive complex oxide-containing composition, and use therefor |
US10072195B2 (en) | 2014-03-14 | 2018-09-11 | Dainichiseika Color & Chemicals Mfg. Co., Ltd. | Thermally conductive complex oxide, production method therefor, thermally conductive complex oxide-containing composition, and use therefor |
WO2018096992A1 (en) * | 2016-11-25 | 2018-05-31 | 宇部マテリアルズ株式会社 | Physical vapor-deposition target member and sputtering target member, and physical vapor-deposition film and layer structure manufacturing method |
US11374130B2 (en) | 2020-02-07 | 2022-06-28 | Kioxia Corporation | Semiconductor device and semiconductor memory device |
Also Published As
Publication number | Publication date |
---|---|
KR20140036176A (en) | 2014-03-25 |
KR102003077B1 (en) | 2019-07-23 |
CN103608310B (en) | 2016-02-03 |
TWI532864B (en) | 2016-05-11 |
JP6137382B2 (en) | 2017-05-31 |
CN103608310A (en) | 2014-02-26 |
JPWO2012173108A1 (en) | 2015-02-23 |
TW201305371A (en) | 2013-02-01 |
JP2016153370A (en) | 2016-08-25 |
JP5929911B2 (en) | 2016-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6137382B2 (en) | Conductive oxide, method for producing the same, and method for producing oxide semiconductor film | |
WO2009142289A1 (en) | Sputtering target, method for forming amorphous oxide thin film using the same, and method for manufacturing thin film transistor | |
TWI648241B (en) | Oxide sintered body, method of manufacturing the same, sputtering target, and semiconductor device | |
CN107001146B (en) | Oxide sintered material, method for producing oxide sintered material, sputtering target, and method for producing semiconductor device | |
TWI737727B (en) | Oxide sintered body, manufacturing method thereof, sputtering target, and manufacturing method of semiconductor device | |
TWI769255B (en) | Oxide sintered body and its manufacturing method, sputtering target, oxide semiconductor film, and manufacturing method of semiconductor element | |
JP2013001590A (en) | Conductive oxide, method of manufacturing the same and oxide semiconductor film | |
KR102401708B1 (en) | Oxide sintered compact and its manufacturing method, sputtering target, and semiconductor device manufacturing method | |
JP5407969B2 (en) | Conductive oxide and method for producing the same | |
JP5494082B2 (en) | Conductive oxide and method for producing the same | |
JP6350466B2 (en) | Oxide sintered body and method for manufacturing the same, sputter target, and method for manufacturing semiconductor device | |
JP5526904B2 (en) | Conductive oxide sintered body and manufacturing method thereof | |
KR102406137B1 (en) | Oxide sintered compact and its manufacturing method, sputtering target, and semiconductor device manufacturing method | |
JP5333525B2 (en) | Conductive oxide, method for producing the same, and oxide semiconductor film | |
JP5857775B2 (en) | Conductive oxide and method for producing the same | |
JP6493601B2 (en) | Oxide sintered body and method for manufacturing the same, sputter target, and method for manufacturing semiconductor device | |
JP5811877B2 (en) | Conductive oxide and method for producing the same | |
JP2014094862A (en) | Conductive oxide, oxide semiconductor film and semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12799830 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013520553 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20137029873 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12799830 Country of ref document: EP Kind code of ref document: A1 |