WO2012155432A1 - Système de dispositif de communication électronique et équipement de blindage électromagnétique - Google Patents

Système de dispositif de communication électronique et équipement de blindage électromagnétique Download PDF

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Publication number
WO2012155432A1
WO2012155432A1 PCT/CN2011/080095 CN2011080095W WO2012155432A1 WO 2012155432 A1 WO2012155432 A1 WO 2012155432A1 CN 2011080095 W CN2011080095 W CN 2011080095W WO 2012155432 A1 WO2012155432 A1 WO 2012155432A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
circuit board
electromagnetic shielding
metal frame
shielding device
Prior art date
Application number
PCT/CN2011/080095
Other languages
English (en)
Chinese (zh)
Inventor
任立立
韩萍
袁明
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to PCT/CN2011/080095 priority Critical patent/WO2012155432A1/fr
Publication of WO2012155432A1 publication Critical patent/WO2012155432A1/fr

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0049Casings being metallic containers

Definitions

  • the utility model relates to electromagnetic shielding technology, in particular to an electronic communication device system and a heat dissipating and electromagnetic shielding device thereof.
  • Thermal design and electromagnetic compatibility design are two important aspects of reliability design of electronic communication equipment. Through heat dissipation design, the heat generated during the operation of the product can be effectively released, thereby controlling the temperature rise of components in the product and ensuring its stability. Reliable operation; For electromagnetic compatibility design, a considerable part of the work is to reduce the external electromagnetic radiation energy of the product, thereby reducing the harm of radiation to the surrounding environment and users.
  • an electromagnetic shielding device for an electronic communication device including a metal a substrate, the surface of the metal substrate is provided with a component groove, the metal substrate is provided with a metal frame on four sides thereof, the metal frame is provided with a conductive pad, and a fixing hole is disposed; the position of the component slot corresponds to each component of the circuit board of the electronic communication device.
  • the position of the metal frame corresponds to the position of the copper layer on the circuit board, and the center position of the fixing hole on the metal frame corresponds to the center position of the through hole on the circuit board.
  • the component slot can accommodate the corresponding component and its depth allows the corresponding component to be attached to the thermal pad after installation;
  • the width of the metal frame is equal to the width of the copper layer on the circuit board, and the conductive pad assembled on the metal frame is a metal reed pad or a conductive cloth pad.
  • the metal material used for the purpose is any one of aluminum, copper, aluminum alloy, and copper alloy.
  • an electromagnetic shielding device for an electronic communication device includes a metal substrate having a metal boss on a surface thereof, and a metal frame is mounted on four sides of the metal substrate, and the metal frame is provided with a conductive pad, and Set a fixing hole;
  • the position of the metal boss corresponds to the position of each component on the circuit board of the electronic communication device
  • the position and width of the metal frame correspond to the position and width of the copper layer on the circuit board
  • the center position of the fixing hole on the metal frame corresponds to the circuit The center of the through hole on the plate.
  • the top surface of the metal boss is provided with a uniform thickness of the thermal pad, and the height of the metal stud should be such that the corresponding component is attached to the thermal pad after installation;
  • the width of the metal frame is equal to the width of the copper layer on the circuit board, and the conductive pads assembled on the metal frame are metal reed pads or conductive cloth pads.
  • the metal material used for the electromagnetic shielding device is any one of aluminum, copper, aluminum alloy, and copper alloy.
  • an electronic communication device system includes a circuit board and an electromagnetic shielding device, wherein:
  • Each component is mounted on the circuit board, and a copper layer is laid on four sides of the circuit board, and a through hole is disposed;
  • the electromagnetic shielding device is provided with a metal substrate, the surface of the metal substrate is provided with a component slot, and the position of the component slot corresponds to the position of each component on the circuit board;
  • the four sides of the metal substrate are provided with a metal frame, and the position of the metal frame corresponds to the circuit board a position of the copper layer, the conductive frame is assembled on the metal frame, and a fixing hole is provided, and the center position of the fixing hole corresponds to the center position of the through hole on the circuit board;
  • the metal frame is fixed to the circuit board through the fixing hole, so that the metal substrate is electrically connected to the copper layer through the metal frame; and the metal substrate and the circuit board are closed at the same time.
  • a thermally conductive gasket of uniform thickness is disposed on the bottom surface of the component slot, and the component slot can accommodate the corresponding component and has a depth such that the corresponding component is attached to the thermal pad after installation;
  • the width of the metal frame is equal to the width of the copper layer on the circuit board, and the conductive pads assembled on the metal frame are metal reed pads or conductive cloth pads.
  • an electronic communication device system includes a circuit board and an electromagnetic shielding device, wherein:
  • Each component is mounted on the circuit board, a copper layer is laid on four sides of the circuit board, and a through hole is arranged;
  • the electromagnetic shielding device is provided with a metal substrate, and the surface of the metal substrate is provided with a metal boss, and the position of the metal boss corresponds to the circuit Position of each component on the board;
  • the position of the metal frame corresponds to the position of the copper layer on the circuit board, the metal frame is provided with a conductive pad, and a fixing hole is provided, and the center position of the fixing hole corresponds to the through hole of the circuit board Center position
  • the metal frame is fixed to the circuit board through the fixing hole, so that the metal substrate is electrically connected to the copper layer through the metal frame; and the metal substrate and the circuit board are closed at the same time.
  • the top surface of the metal boss is provided with a uniform thickness of the thermal pad, and the height of the metal stud should be such that the corresponding component is attached to the thermal pad after installation;
  • the width of the metal frame is equal to the width of the copper layer on the circuit board, and the conductive pads assembled on the metal frame are metal reed pads or conductive cloth pads.
  • An electromagnetic shielding device for an electronic communication device comprising a metal substrate, the surface of the metal substrate is provided with at least one component slot, the metal substrate is provided with a metal frame on four sides thereof, and the metal frame is equipped with a conductive a gasket and provided with a fixing hole;
  • the position of the at least one component slot corresponds to the position of each component on the circuit board of the electronic communication device
  • the position of the metal frame corresponds to the position of the copper layer laid on the four sides of the circuit board
  • the center position of the fixing hole corresponds to the center position of the through hole provided on the four sides of the circuit board.
  • At least one of the element slots is provided with a uniform thickness of a thermal pad on the bottom surface thereof, and is attached to the thermal pad at least after installation.
  • the width of the metal frame is equal to the width of the copper layer laid on the four sides of the circuit board;
  • the conductive pad is a metal reed pad or a conductive cloth pad.
  • the electromagnetic shielding device is an electromagnetic shielding device of aluminum, copper, aluminum alloy or copper alloy.
  • An electromagnetic shielding device for an electronic communication device comprising a metal substrate, the surface of the metal substrate is provided with at least one metal boss, the metal substrate is provided with a metal frame on four sides thereof, and the metal frame is equipped with a conductive gasket and provided with a fixing hole;
  • the position of the at least one metal boss corresponds to the position of each component on the circuit board of the electronic communication device
  • the position of the metal frame corresponds to the position of the copper layer on the four sides of the circuit board
  • the center position of the fixing hole corresponds to the center position of the through hole provided on the four sides of the circuit board.
  • At least one of the metal bosses is provided with a uniform thickness of the thermal pad on the top surface, and at least one of the metal bosses is height-mounted such that the corresponding component is attached to the thermally conductive pad after installation.
  • the width of the metal frame is equal to the width of the copper layer laid on the four sides of the circuit board;
  • the conductive pad is a metal reed pad or a conductive cloth pad.
  • the electromagnetic shielding device is an electromagnetic shielding device in aluminum, copper, aluminum alloy, or copper alloy.
  • An electronic communication device system comprising a circuit board and an electromagnetic shielding device, wherein:
  • At least one component is mounted on the circuit board, and a copper layer is disposed on four sides of the circuit board, and a through hole is disposed;
  • the electromagnetic shielding device includes a metal substrate, and at least one surface of the metal substrate is disposed a component slot, wherein a position of the at least one component slot corresponds to a position of each component on the circuit board; a metal frame is disposed on four sides of the metal substrate, and a position of the metal frame corresponds to a position of the copper layer
  • the metal frame is equipped with a conductive pad, and is provided with a fixing hole, and a center position of the fixing hole corresponds to a center position of the through hole;
  • the metal frame is fixed to the circuit board through the fixing hole and the through hole, so that the metal substrate is electrically connected to the copper layer through the metal frame, and the metal substrate and the metal substrate are simultaneously
  • the board is enclosed to form an integral electromagnetic shielding cavity.
  • At least one of the element slots is provided with a uniform thickness of a thermal pad on the bottom surface thereof, at least after being attached to the thermal pad.
  • width of the metal frame is equal to the width of the copper layer
  • the conductive pad is a metal reed pad or a conductive cloth pad.
  • An electronic communication device system comprising a circuit board and an electromagnetic shielding device, wherein:
  • At least one component is mounted on the circuit board, and a copper layer is disposed on four sides of the circuit board, and a through hole is disposed;
  • the electromagnetic shielding device includes a metal substrate, and a surface of the metal substrate is provided with at least one metal bump, and a position of at least one of the metal bumps corresponds to a position of each component on the circuit board; a metal frame is disposed on the four sides, the position of the metal frame corresponds to the position of the copper layer, the metal frame is equipped with a conductive pad, and a fixing hole is disposed, and a center position of the fixing hole corresponds to the The center position of the through hole;
  • the metal frame is fixed to the circuit board through the fixing hole and the through hole, so that the metal substrate is electrically connected to the copper layer through the metal frame, and the metal substrate and the metal substrate are simultaneously
  • the board is enclosed to form an integral electromagnetic shielding cavity.
  • At least one of the metal bosses is disposed on a top surface thereof with a uniform thickness of a heat conductive gasket, and at least one of the metal bosses is disposed such that the components on the corresponding circuit board are attached to the heat conductive lining after being mounted On the mat.
  • width of the metal frame is equal to the width of the copper layer
  • the conductive pad is a metal reed pad or a conductive cloth pad.
  • the electronic communication device system and the electromagnetic shielding device of the utility model enable the heat of the components on the circuit board to be directly transmitted to the metal substrate through the metal substrate, the metal frame, the conductive gasket and the thermal conductive pad provided on the device, and the metal substrate will be The heat is transmitted to the outside air or the metal casing, and the electromagnetic radiation energy of the component is confined to the shielding cavity formed by the metal substrate and the metal frame, thereby effectively reducing the harm to the external environment.
  • the electromagnetic shielding device with heat dissipation function provided by the utility model has good heat dissipation effect and electromagnetic shielding effect, and has a simple structure and is easy to implement. BRIEF abstract
  • 1 is a schematic diagram of a circuit board in an electronic communication device
  • FIG. 2 is a perspective view of an electromagnetic shielding device according to a first embodiment of the present invention
  • FIG. 3 is a schematic view showing the overall assembly of the electronic communication device system according to the first embodiment of the present invention
  • FIG. 4 is a cross-sectional view showing the entire assembly of the electronic communication device system according to the first embodiment of the present invention
  • a schematic view of an electromagnetic shielding device
  • Figure 6 is a cross-sectional view showing the overall assembly of the electronic communication device system of the second embodiment of the present invention. Preferred embodiment of the present invention
  • FIG. 1 it is a schematic diagram of a circuit board in an electronic communication device.
  • the components that require heat dissipation and shielding are mounted on the board surface of the circuit board 9 like the component 10, and a copper layer 11 is placed on the four sides of the circuit board 9, and the circuit board 9 is provided with a through hole 12 to ensure the protection of the circuit board 9.
  • the ground or work place is in close contact with the electromagnetic shielding device of the embodiment of the present invention.
  • FIG. 2 is a perspective view showing the three-dimensional structure of the electromagnetic shielding device of the first embodiment of the present invention, the device
  • metal substrate 1 includes a metal substrate 2, the surface of which is provided with corresponding component slots 4 according to the positions of the components on the circuit board 9; the four sides of the metal substrate 2 are respectively fixed at positions corresponding to the copper layer 11 on the circuit board 9 and Metal frame 3 of equal width, metal frame 3 is equipped with conductive gasket 6 (such as metal spring) A pad or a conductive cloth pad) is provided with a fixing hole 7 corresponding to the position of the through hole 12 of the circuit board 9, and the fixing hole 7 is a screw hole or a rivet hole.
  • conductive gasket 6 such as metal spring
  • the bottom surface of the component slot 4 on the device 1 is provided with a thermally conductive gasket 5 of uniform thickness.
  • the depth of each component slot 4 corresponds to the height of each component on the circuit board 9, that is, the component slot can accommodate the corresponding component and its depth allows the corresponding component to be attached to the thermal pad after installation, thereby ensuring all components and devices
  • the thickness of the thermal pad 5 between 1 is uniform. In this embodiment, a 1 mm thick thermal pad is uniformly selected.
  • the metal frame 3 is fixed to the circuit board 9 through the fixing hole 7 to ensure the reliability of the electrical connection of the copper layer 11 of the circuit board 9 at the protective ground or the working place, and at the same time, the metal substrate 2 and the circuit board 9 are closed to form an integral body. Electromagnetic shielding cavity.
  • the metal material of the device 1 may be any one of aluminum, copper, aluminum alloy, and copper alloy.
  • Fig. 3 is a schematic view showing the overall assembly of the electronic communication device system of the first embodiment of the present invention, which system includes an electronic communication device circuit board 9 and an electromagnetic shielding device 1.
  • the metal substrate 2 of the electromagnetic shielding device 1 When installed, the metal substrate 2 of the electromagnetic shielding device 1 is electrically connected to the copper layer 11 of the circuit board 9 through the metal frame 3, and forms an electromagnetic shielding cavity closed to all components on the circuit board 9;
  • the conductive gasket 6 (such as a metal reed gasket or a conductive cloth gasket) is pressure-relieved by fixing nails (such as screws or rivets) to eliminate the contact tolerance between the metal frame 3 and the copper layer 11 of the circuit board 9, thereby ensuring good contact between the two. Reliable electrical connection.
  • a uniform thickness of the thermal pad 5 disposed on the bottom surface of the component slot 4 fills the gap between the component 10 and the metal substrate 2 on the circuit board 9 to ensure that the heat of the component 10 is efficiently conducted to the metal substrate 2.
  • Figure 4 is a schematic cross-sectional view showing the overall assembly of the electronic communication device system of the first embodiment of the present invention; the device 1 covers the circuit board 9 during mounting, and the circuit board 9 and the metal frame 3 of the device 1 are fixed by screws.
  • a heat-conductive gasket 5 having a uniform thickness is disposed between the component 10 and the component groove 4 to fill the gap between the component 10 and the metal substrate 2, and the heat of the component is efficiently conducted to the metal substrate 2.
  • FIG. 5 is a perspective view of the electromagnetic shielding device according to the second embodiment of the present invention.
  • the surface of the metal substrate 2 of the device 1 is provided with metal bosses 8 according to the positions of the components on the circuit board 9; the four sides of the metal substrate 2 are respectively fixed.
  • a metal frame 3 having a position and a width corresponding to the copper layer 11 on the circuit board 9, and the metal frame 3 is provided with a conductive pad 6 (such as a metal reed pad or a conductive cloth pad),
  • a fixing hole 7 is provided at a position of the through hole 12 in the circuit board 9.
  • the top surface of the metal boss 8 on the device 1 is provided with a thermally conductive gasket 5 of uniform thickness.
  • the height of each metal boss 8 corresponds to the height of each component on the circuit board 9, that is, the height of the metal boss should be such that the corresponding component is attached to the heat conductive pad after installation, thereby ensuring the relationship between all components and the device 1.
  • the thickness of the thermal pad 5 is uniform. In this embodiment, a thermal pad of 1 mm thickness is uniformly selected.
  • the metal boss 8 or other rigid medium that facilitates heat dissipation.
  • the metal frame 3 is fixed to the circuit board 9 through the fixing hole 7 to ensure the reliability of the electrical connection of the copper layer 11 of the circuit board 9 at the protective ground or the working place, and at the same time, the metal substrate 2 and the circuit board 9 are closed to form an integral body. Electromagnetic shielding cavity.
  • the metal material of the device 1 may be any one of aluminum, copper, aluminum alloy, and copper alloy.
  • Figure 6 is a schematic cross-sectional view showing the overall assembly of the electronic communication device system of the second embodiment of the present invention; the device 1 covers the circuit board 9 during mounting, and the circuit board 9 and the metal frame 3 of the device 1 are fixed by fixing pins.
  • a uniform thickness of the thermal pad 5 is disposed between the component 10 and the metal boss 8 to fill the gap between the component 10 and the metal substrate 2 to ensure effective conduction of heat to the metal substrate 2.
  • the electronic communication device system and the electromagnetic shielding device embodiment provided by the utility model effectively dissipate the heat of the component through a metal substrate, a component groove or a metal boss having a depth corresponding to the component height on the circuit board, and a heat conductive gasket of uniform thickness.
  • the shielding cavity formed by fixing and sealing the metal substrate and the circuit board through the metal frame effectively suppresses the electromagnetic radiation energy of the component; and the device has a simple structure and is easy to implement.
  • the electronic communication device system and the electromagnetic shielding device of the utility model enable the components on the circuit board to have heat directly through the metal substrate, the metal frame, the conductive gasket and the heat conducting gasket provided on the device
  • the metal substrate transfers the heat to the outside air or the metal casing, and the electromagnetic radiation energy of the component is confined to the shielding cavity formed by the metal substrate and the metal frame, thereby effectively reducing the harm to the external environment.
  • the electromagnetic shielding device with heat dissipation function provided by the utility model has good heat dissipation effect and electromagnetic shielding effect, and has a simple structure and is easy to implement. Therefore, the present invention has industrial applicability.

Abstract

La présente invention a trait à un système de dispositif de communication électronique et à un équipement de blindage électromagnétique. L'équipement de blindage électromagnétique inclut un substrat de métal (2) ; au moins une encoche d'élément (4) qui est définie sur la surface du substrat de métal (2) ; un cadre de métal (3) qui est défini sur le bord du substrat de métal (2) ; des plages de connexion électriques (5) ainsi que des trous de fixation (7) qui sont agencés sur le cadre de métal (3) ; la position d'au moins une encoche d'élément (4) correspond à celle de chaque élément (10) sur la carte de circuit imprimé (9) dans un dispositif de communication électronique ; la position du cadre de métal (3) correspond à celle d'une couche de cuivre nu (11) sur la carte de circuit imprimé (9), et la position des centres de cercle des trous de fixation (7) sur le cadre de métal (3) correspond à celles des trous traversants (12) qui sont agencés sur le bord de la carte de circuit imprimé (9). L'équipement de blindage électromagnétique, qui est doté d'une fonction de radiation de chaleur et obtenu grâce aux solutions techniques susmentionnées, est pourvu d'un bon effet de radiation de chaleur et d'un bon effet de blindage électromagnétique, sa structure est simple et il peut être facilement obtenu.
PCT/CN2011/080095 2011-09-23 2011-09-23 Système de dispositif de communication électronique et équipement de blindage électromagnétique WO2012155432A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/080095 WO2012155432A1 (fr) 2011-09-23 2011-09-23 Système de dispositif de communication électronique et équipement de blindage électromagnétique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/080095 WO2012155432A1 (fr) 2011-09-23 2011-09-23 Système de dispositif de communication électronique et équipement de blindage électromagnétique

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WO2012155432A1 true WO2012155432A1 (fr) 2012-11-22

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (zh) * 2000-04-21 2003-09-10 电子设备屏蔽公司 印制电路板的emi和rfi屏蔽
CN201700124U (zh) * 2010-04-19 2011-01-05 鸿富锦精密工业(深圳)有限公司 屏蔽罩及具有屏蔽罩的电子装置
CN201766809U (zh) * 2010-08-24 2011-03-16 中兴通讯股份有限公司 一种电子通信设备系统及电磁屏蔽装置
CN102037799A (zh) * 2008-04-17 2011-04-27 莱尔德电子材料(深圳)有限公司 可滑动地打开和闭合便携式电子设备且为板上安装的电子部件提供emi屏蔽的emi屏蔽滑动组件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (zh) * 2000-04-21 2003-09-10 电子设备屏蔽公司 印制电路板的emi和rfi屏蔽
CN102037799A (zh) * 2008-04-17 2011-04-27 莱尔德电子材料(深圳)有限公司 可滑动地打开和闭合便携式电子设备且为板上安装的电子部件提供emi屏蔽的emi屏蔽滑动组件
CN201700124U (zh) * 2010-04-19 2011-01-05 鸿富锦精密工业(深圳)有限公司 屏蔽罩及具有屏蔽罩的电子装置
CN201766809U (zh) * 2010-08-24 2011-03-16 中兴通讯股份有限公司 一种电子通信设备系统及电磁屏蔽装置

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