WO2012155432A1 - Electronic communication device system and electromagnetic shielding equipment - Google Patents

Electronic communication device system and electromagnetic shielding equipment Download PDF

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Publication number
WO2012155432A1
WO2012155432A1 PCT/CN2011/080095 CN2011080095W WO2012155432A1 WO 2012155432 A1 WO2012155432 A1 WO 2012155432A1 CN 2011080095 W CN2011080095 W CN 2011080095W WO 2012155432 A1 WO2012155432 A1 WO 2012155432A1
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WO
WIPO (PCT)
Prior art keywords
metal
circuit board
electromagnetic shielding
position
metal frame
Prior art date
Application number
PCT/CN2011/080095
Other languages
French (fr)
Chinese (zh)
Inventor
任立立
韩萍
袁明
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to PCT/CN2011/080095 priority Critical patent/WO2012155432A1/en
Publication of WO2012155432A1 publication Critical patent/WO2012155432A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0049Casings being metallic containers

Abstract

An electronic communication device system and electromagnetic shielding equipment are provided. The electromagnetic shielding equipment includes a mental substrate (2); at least one element notch (4) is set on the surface of the mental substrate (2); a mental frame (3) is set at the edge of the metal substrate (2); electric pads (5) and also fixing holes (7) are arranged on the mental frame (3); the position of at least one element notch (4) corresponds to that of each element (10) on the circuit board (9) in an electronic communication device; the position of the mental frame (3) corresponds to that of a bare copper layer (11) on the circuit board (9), and the position of the circle centers of the fixing holes (7) on the mental frame (3) correspond to those of through holes (12) arranged on the edge of the circuit board (9). The electromagnetic shielding equipment with heat radiation function provided by the aforementioned technical solutions has good heat radiating effect and electromagnetic shielding effect, and its structure is simple and it can be achieved easily.

Description

An electronic communication device systems and electromagnetic shielding device

FIELD

The present invention relates to an electromagnetic shield technology, particularly, to an electronic communication device and its cooling system and an electromagnetic shielding device.

Background technique

EMC design and thermal design is an important aspect of the two electronic communications device reliability design of the product allows the heat generated during operation is effectively released by thermal design, to control the temperature rise in the product component, and guarantee that the reliable operation; for electromagnetic compatibility design, a considerable part of the work is to reduce the external electromagnetic radiation energy products, thereby reducing radiation damage to the surrounding environment and other users.

Typically, a number of circuits using electronic communication device product to the metal shield of the energy component of the radiation circuit electromagnetically shield, inner shield but when greater power components, so that heat will not be within the shield is good release out. In this case, the radiator cover disposed metallic shield to enhance heat dissipation. The electromagnetic shielding requirements, to be laid around trees copper ground shield disposed components, the components will take trees copper wiring region is not conducive to the other signal traces. And, when a large number of components need to shield, since the height of each component are not the same, require the use of different thickness of the thermal pad of elastic heat-conducting medium filling the gap between the shield cover and the component surface, so that it will the thermal resistance between the shield and the uneven surface components, in particular the thermal resistance between the shield and the component due to the relatively low thermal pad thicker increases, resulting in deterioration of thermal performance of such components. SUMMARY

The present invention is to solve the technical problem of providing an electronic communications system equipment and electromagnetic screen amount.P 5 ... '', '' ' To solve the above problems, the electromagnetic shielding device for an electronic communications device, comprising a metal substrate, the surface of the metal substrate disposed groove member, the four sides of the metal substrate with a metal frame, the metal mounting conductive pads on the frame, and fixing holes provided; groove element position corresponds to the position of the elements on the circuit board of an electronic communication device, the position of the metal frame is a copper layer corresponding to the trees on the circuit board, and the metal the location of the center frame fixing holes corresponding to the through hole of the circuit board center location.

Wherein the groove bottom surface of the element arranged uniform thickness of the thermal pad, which element accommodates a corresponding groove and the depth of the element so that the corresponding mounting element attached to the rear of the thermal pad;

The metal frame of a width equal to the width of the trees a copper layer on the circuit board, the metal frame assembly conductive gasket or liner is a metal reed conductive cloth pad.

Wherein, preclude the use of the metal material is aluminum, copper, aluminum, any one of copper alloy.

In order to solve the above problem, an electromagnetic shielding device for an electronic communications device, comprising a metal substrate, the surface of the metal substrate is a metal projection, the four sides of the metal substrate with a metal frame, the mounting conductive pads on a metal frame, and fixing hole is provided;

Metal boss position corresponding to each element of a circuit board of an electronic communication device, the position and width of the metal frame corresponds to the position and width of the tree copper layer circuit board, the metal frame and the center position of the fixing hole corresponding to the circuit location of the center of the plate through hole.

Wherein the uniform thickness disposed on the top surface of the thermal pad metal boss, the boss of the height of the metal such that the corresponding elements bonded to the thermally conductive mounting pad;

Equal to the width of the metal frame trees copper layer circuit board, the metal frame assembly conductive gasket or liner is a metal reed conductive cloth pad.

Wherein the electromagnetic shield means preclude the use of a metallic material is aluminum, copper, aluminum, any one of copper alloy.

To solve the above problems, an electronic communication device, comprising a circuit board and an electromagnetic shielding device, wherein:

A circuit board mounted with various elements, laying a copper layer trees four sides of the circuit board, and is provided with a through hole; electromagnetic shielding device equipped with the metal substrate, the surface of the metal substrate disposed groove member, the position corresponding to the groove elements on the circuit board the position of each element; the position of the four sides of the metal substrate with a metal frame, which corresponds to the position of the metal frame trees copper layer circuit board, the metal frame assembly conductive pad, and a fixing hole is provided, the center position of the corresponding fixing hole circuit board in the location of the center through hole;

Fixing holes through the metal frame and the circuit board is fixed so that the metal substrate layer is electrically connected to the tree by a copper metal frame; while closing the metal substrate and the circuit board.

among them,

Uniform thickness disposed on the bottom surface of the groove elements of the thermal pad, elements corresponding to the groove can accommodate a depth such that the element and the corresponding mounting element attached to the thermal pad;

Equal to the width of the metal frame trees copper layer circuit board, the metal frame assembly conductive gasket or liner is a metal reed conductive cloth pad.

To solve the above problems, an electronic communication device, comprising a circuit board and an electromagnetic shielding device, wherein:

A circuit board mounted with various elements, laying a copper layer trees four sides of the circuit board, and is provided with a through hole; electromagnetic shielding device equipped with the position of the metal substrate, the surface of the metal substrate is a metal boss, the boss corresponding to the metal circuitry the position of each plate element; the position corresponding to the position of the metal frame trees copper layer circuit board, the metal frame assembly conductive pad, and a fixing hole is provided, the fixing position corresponding to the center hole of the circuit board through holes center position;

Fixing holes through the metal frame and the circuit board is fixed so that the metal substrate layer is electrically connected to the tree by a copper metal frame; while closing the metal substrate and the circuit board.

Wherein the uniform thickness disposed on the top surface of the thermal pad metal boss, the boss of the height of the metal such that the corresponding elements bonded to the thermally conductive mounting pad;

Equal to the width of the metal frame trees copper layer circuit board, the metal frame assembly conductive gasket or liner is a metal reed conductive cloth pad.

Electromagnetic shielding device of an electronic communication device, the electromagnetic shielding device comprises a metal substrate, the surface of the metal substrate is provided with at least one channel element, four sides of the metal substrate provided with a metal frame fitted with a conductive metal on said frame pad, and is provided with fixing holes; wherein the position of at least one element of the slot corresponds to the position of the elements on the circuit board of the electronic communication device, the position of the metal frame corresponding to four sides of said circuit board laying center position of the through-hole positions trees copper layer, and the fixing hole corresponding to the location of the center of the four sides of the circuit board is disposed.

Wherein the configuration of the bottom surface of the at least one groove element has a uniform thickness of the thermal pad, at least after installation bonded to the thermal pad.

Wherein the width of the metal frame is equal to a width of the copper layer laid trees four sides of the circuit board; a conductive gasket or liner is a metal reed conductive cloth pad.

The electromagnetic shielding apparatus of aluminum, copper, an electromagnetic shielding device of an aluminum alloy or a copper alloy.

Electromagnetic shielding device of an electronic communication device, the electromagnetic shielding device comprises a metal substrate, the surface of the metal substrate is provided with at least a metal projection, four sides of the metal substrate provided with a metal frame, the metal frame fitted with a conductive gasket, and provided with a fixing hole;

Wherein at least one of the position of the metal of the boss corresponds to the position of the elements on the circuit board of the electronic communication device, the position of the metal frame corresponds to the position of the four sides of the circuit board copper layer laid trees, and location of the center of the through hole of the fixing hole corresponds to the center position of the four sides of the circuit board is disposed.

Wherein at least one of a top surface configuration of the metal boss has a uniform thickness of the thermal pad, should be at least a height of the metal boss is mounted so that the corresponding elements bonded to the thermally conductive pad.

Wherein the width of the metal frame is equal to a width of the copper layer laid trees four sides of the circuit board; a conductive gasket or liner is a metal reed conductive cloth pad.

The electromagnetic shielding apparatus of aluminum, copper, aluminum alloy, copper alloy electromagnetic shielding device.

An electronic communications device, comprising a circuit board and an electromagnetic shielding device, wherein:

The circuit board is attached to at least one of the quadrilateral element, the circuit board is laid a copper layer trees, and is provided with a through hole;

The electromagnetic shielding means comprises a metal substrate, the surface of the metal substrate is provided with at least one slot member, the position of at least one element of said slot corresponds to the position of the elements on the circuit board; four sides of the metal substrate is provided a metal frame, the metal frame position corresponding to the position of the copper layer trees, fitted with conductive pads on said metal frame, and is provided with a fixing hole, the center position of the fixing hole corresponding to the through hole the location of the center;

The metal frame through the fixing hole and the through hole of the circuit board is fixed so that the metal substrate is electrically connected to the tree by a copper layer of the metal frame, while the metal substrate and the closing the circuit board to form an integral electromagnetic shield cavity.

Wherein the configuration of the bottom surface of the at least one groove element has a uniform thickness of the thermal pad, the bonding means at least to the thermal pad.

Wherein, a width equal to the width of the metal frame of the trees copper layer;

The conductive gasket or liner is a metal reed conductive cloth pad.

An electronic communications device, comprising a circuit board and an electromagnetic shielding device, wherein:

The circuit board is attached to at least one of the quadrilateral element, the circuit board is laid a copper layer trees, and is provided with a through hole;

The electromagnetic shielding means comprises a metal substrate, the surface of the metal substrate is provided with at least a metal projection, a position of at least the metallic boss a position corresponding to the respective elements of said circuit board; the metal substrate four sides is provided with a metal frame, the metal frame position corresponding to the position of the trees of the copper layer, the metal frame fitted with a conductive gasket, and provided with a fixing hole, the fixing hole corresponding to the location of the center the location of the center through-hole;

The metal frame through the fixing hole and the through hole of the circuit board is fixed so that the metal substrate is electrically connected to the tree by a copper layer of the metal frame, while the metal substrate and the closing the circuit board to form an integral electromagnetic shield cavity.

Wherein the configuration of the thermal pad with a uniform thickness of at least a top surface of said metal boss, the height should be at least one of the metal elements corresponding to the projection of the circuit board so that the rear mounting thermally bonded to the backing mat.

Wherein, a width equal to the width of the metal frame of the trees copper layer;

The conductive gasket or liner is a metal reed conductive cloth pad. The present invention is an electronic communication device systems and electromagnetic shielding device, through a metal substrate, a metal frame, and the thermally conductive pads provided on the spacer means, so that the heat of the circuit board components is transmitted directly to the metal substrate, the metal substrate heat is transferred to the outside air or release metal chassis, while the energy of the electromagnetic radiation shielding component is localized in the cavity formed in the metal substrate and the metal frame, which effectively reduce the harm to the external environment. Electromagnetic shielding device having a heat dissipation function of the present invention is provided having a good heat dissipation and electromagnetic shielding effect, and a simple structure, easy to implement. Brief Description

Figure 1 is an electronic communication device in a schematic view of a circuit board;

FIG 2 of the present invention, a first embodiment of an electromagnetic shielding device perspective view;

FIG 3 is an overall diagram of an electronic communication device mounting system according to a first embodiment of the invention; FIG. 4 is a cross-sectional view of an electronic utility integrally assembled system of the first embodiment of the communication device of new type; FIG. 5 is a second embodiment of the invention a schematic perspective view of an electromagnetic shielding device;

FIG 6 is a cross-sectional view of a second novel integrally assembled embodiment of an electronic communication device system utility. Preferred embodiment of the present invention embodiment

The following embodiments of the present invention the technical solution described in detail in conjunction with the accompanying drawings and preferred. Exemplary embodiments The following examples serve only to illustrate and explain the present invention limit the technical solution of the present invention is not to be construed.

1 is a schematic diagram of an electronic communication device in a circuit board. The need for cooling and shielding element and the elements are mounted on the plate-like 10- surface of the circuit board 9, the through-hole trees laying a copper layer 11, a circuit board 9 is provided with four sides of the circuit board 9 in 12, to ensure the protection circuit board 9 or work in close contact with the electromagnetic shielding device according to the present embodiment of the invention.

2 shows a perspective configuration diagram of a first embodiment of the present invention, an electromagnetic shielding device, the apparatus

1 comprises a metallic substrate 2, the surface of the metal substrate 2 provided at a position of each element on the circuit board 9 with a corresponding element grooves 4 in accordance with; the four sides of the metal substrate 2 are fixed to the trees copper layer 9, the position of the circuit board 11 corresponding to and 3 equal to the width of the metal frame, the metal frame 3 is equipped with the conductive pads 6 (such as a metal liner or reed conductive cloth pad), corresponding to the fixing holes of the circuit board 9 7 position of the through hole 12 is provided, the fixing hole 7 is a screw or rivet holes and the like.

4 on the bottom surface of the groove element 1 is provided with means 5 of the thermal pad of uniform thickness. The height of each element 9 of the groove depth corresponding to the elements and the circuit board 4, i.e., elements corresponding to elements accommodating grooves and the depth of the element after installation so that the corresponding bonding pad on the thermal conductivity, thereby ensuring that all components of the device a thermal pad of uniform thickness between 5, the present embodiment selected 1mm thick uniform thermal pad.

Metal frame 3 is fixed by the fixing holes 7 and the circuit board 9, 11 ensure the reliability of the copper layer 9 is electrically protective trees or work connected to a circuit board, while the metal substrate 2 and the circuit board 9 is closed to form a whole electromagnetic shielding cavity.

A metallic material may be aluminum, copper, aluminum, any one of copper alloy.

FIG 3 is a schematic view of the present invention is integrally assembled to the first electronic communication device system embodiment of the new embodiment, the system includes an electromagnetic shielding device 9 and an electronic circuit board communication device 1. When mounted, the metal substrate apparatus 1 an electromagnetic Shield 2 3 copper layer 11 is electrically connected to the circuit board 9 through the metal frame, and form one to all elements enclosed electromagnetic shield cavity 9 of the circuit board; the metal frame 3 6 the conductive pads (e.g., pads or metal reed conductive cloth pad) by a fixing nail (such as screws or rivets) depressurizing the metal frame 3 and the circuit board 11 trees in the copper layer 9 in contact with the tolerance, both to ensure good contact and reliably electrically connected. 5 uniform thickness of the thermal pad provided in the bottom of the groove component 4, the circuit board 9 on the filling element 10 and the gap between the metal substrate 2, ensure that the heat element 10 is effectively conducted to the metallic substrate 2.

FIG 4 is an overall system for mounting an electronic communication device according to the present invention, a cross-sectional schematic view of a first embodiment; when the mounting device 1 covers the circuit board 9, by a screw fixing means 9 and the circuit board 3 of the metal frame. Component elements 10 and the grooves 4 is provided with a uniform thickness of the thermal pad 5, a gap between the filling element 10 and the metal substrate, heat is efficiently conducted to ensure the element substrate 2 to the metal.

Perspective schematic view of an electromagnetic shielding device 5 of the second embodiment of the present invention and FIG surface of the metal substrate 2 on the device 1 according to the position 9 of each element is provided with a metal projection 8 of the circuit board; four sides of the metal substrate 2 are fixed trees copper layer 9 on the position and width of the circuit board 11 corresponding to the metal frame 3, the metal frame 3 fitted on the conductive pads 6 (such as a metal liner or reed conductive cloth pad), corresponding to the circuit board 9 position of the through hole 12 is provided with a fixing hole 7.

Means a metal on the convex surface of the table 8 with a uniform thickness of the thermal pad 5. Each of the metal bumps corresponding to the height of the elements on the circuit board 9 and the height of the table 8, i.e., the height of the metal of the boss should be such that the corresponding elements bonded to the thermally conductive mounting pad, in order to ensure that all elements of the device 1 between the uniform thickness of the thermal pad 5, the present embodiment lmm selected uniform thickness of the thermal pad.

8 metal boss or other rigid media facilitate heat dissipation.

Metal frame 3 is fixed by the fixing holes 7 and the circuit board 9, 11 ensure the reliability of the copper layer 9 is electrically protective trees or work connected to a circuit board, while the metal substrate 2 and the circuit board 9 is closed to form a whole electromagnetic shielding cavity.

A metallic material may be aluminum, copper, aluminum, any one of copper alloy.

FIG 6 is a communication apparatus of the present invention, an electronic system of the second embodiment of the cross-sectional schematic view of the whole assembly; mounting apparatus 1 when covering a circuit board 9, by the fixing means 9 and nailing the metal frame 1 of the circuit board 3. Element 10 and the metal bumps uniform thickness of the table 8 of the thermal pad 5 is provided to fill the gap between the element 10 and the metal substrate, heat is efficiently conducted to ensure the element substrate 2 to the metal.

Electronic communication device systems and electromagnetic shielding device according to the present invention provides an embodiment, the metal substrate by a depth corresponding to the height of the circuit board element or a thermally conductive metal spacer element grooves and projections of uniform thickness, the effective heat distributing element ; cavity while the shield, the metal substrate by the metal frame and the circuit board is fixed and closed form, is effectively suppressed electromagnetic radiation energy of the element; and the apparatus configuration is simple, easy to implement.

Of course, the foregoing description is only preferred embodiments of the present invention embodiment, but the scope of protection of the present invention is not limited thereto, any skilled art The human eye within the technical scope disclosed in the present invention can be easily thought changes or replacements shall fall within the scope of protection of the present invention. Accordingly, the scope of protection of the present invention should be defined by the scope of the claims.

Industrial Applicability

The present invention is an electronic communication device systems and electromagnetic shielding device, through a metal substrate, a metal frame, and the thermally conductive pads provided on the spacer means, so that the heat of the circuit board components is transmitted directly to the metal substrate, the metal substrate heat is transferred to the outside air or release metal chassis, while the energy of the electromagnetic radiation shielding component is localized in the cavity formed in the metal substrate and the metal frame, which effectively reduce the harm to the external environment. Electromagnetic shielding device having a heat dissipation function of the present invention is provided having a good heat dissipation and electromagnetic shielding effect, and a simple structure, easy to implement. Therefore, although the present invention has industrial applicability.

Claims

Claims
1, the electromagnetic shielding device of an electronic communication device, the electromagnetic shielding device comprises a metal substrate, the surface of the metal substrate is provided with at least one channel element, four sides of the metal substrate provided with a metal frame, the metal frame assembly a conductive gasket, and provided with a fixing hole;
Wherein said at least one groove element location corresponds to the position of the elements on the circuit board of the electronic communication device, the position of the metal frame in a position corresponding to four sides of said circuit board, copper layer laid trees, and the the center position of the center position of the through hole of said fixing holes corresponding to the four sides of the circuit board provided.
2, the electromagnetic shielding device as claimed in claim 1, wherein,
Configuration of the bottom surface of at least one element of the thermal pad groove has uniform thickness, bonded to at least one of said thermal pad.
3, electromagnetic shielding device as claimed in claim 2, wherein,
A width equal to the width of the metal frame of the copper layer laid trees four sides of said circuit board; a conductive gasket or liner is a metal reed conductive cloth pad.
4, the electromagnetic shielding device as claimed in any one of any one of claims 1 to 3, the electromagnetic shielding device as aluminum, copper, an electromagnetic shielding device of an aluminum alloy or a copper alloy.
5, an electromagnetic shielding device for an electronic communications device, the electromagnetic shielding device comprising a metal substrate, a metal substrate surface is provided with at least a metal projection, four sides of the metal substrate provided with a metal frame, the metal frame equipped with a conductive pad, and is provided with a fixing hole;
Wherein at least one of the position of the metal of the boss corresponds to the position of the elements on the circuit board of the electronic communication device, the position of the metal frame corresponds to the position of the four sides of the circuit board copper layer laid trees, and location of the center of the through hole of the fixing hole corresponds to the center position of the four sides of the circuit board is disposed.
6, the electromagnetic shielding device as claimed in claim 5, wherein,
At least a top surface configuration of the metal boss has a uniform thickness of the thermal pad, should be at least a height of the metal boss is mounted so that the corresponding elements bonded to the thermally conductive pad.
7, an electromagnetic shielding device as claimed in claim 6, wherein,
A width equal to the width of the metal frame of the copper layer laid trees four sides of said circuit board; a conductive gasket or liner is a metal reed conductive cloth pad.
8, the electromagnetic shielding device as claimed in any one of any one of claims 5-7, the electromagnetic shielding device as aluminum, copper, aluminum alloy, copper alloy electromagnetic shielding device.
9. An electronic communications device, comprising a circuit board and an electromagnetic shielding device, wherein: said circuit board is mounted at least one element, four sides of the circuit board is laid a copper layer trees, and is provided with a through hole;
The electromagnetic shielding means comprises a metal substrate, the surface of the metal substrate is provided with at least one slot member, the position of at least one element of said slot corresponds to the position of the elements on the circuit board; four sides of the metal substrate is provided a metal frame, the metal frame position corresponding to the position of the copper layer trees, fitted with conductive pads on said metal frame, and is provided with a fixing hole, the center position of the fixing hole corresponding to the through hole the location of the center;
The metal frame through the fixing hole and the through hole of the circuit board is fixed so that the metal substrate is electrically connected to the tree by a copper layer of the metal frame, while the metal substrate and the closing the circuit board to form an integral electromagnetic shield cavity.
10, an electronic communication device according to claim system of claim 9, wherein,
Configuration of the bottom surface of the at least one groove element has a uniform thickness of the thermal pad, bonded to at least one of said thermal pad.
11, an electronic communication device according to claim system of claim 10, wherein,
The metal frame width equal to the width of the copper layer trees;
The conductive gasket or liner is a metal reed conductive cloth pad.
12, an electronic communication device, comprising a circuit board and an electromagnetic shielding device, wherein: said circuit board is mounted at least one element, four sides of the circuit board is laid a copper layer trees, and is provided with a through hole;
The electromagnetic shielding means comprises a metal substrate, the surface of the metal substrate is provided with at least a metal projection, a position of at least the metallic boss a position corresponding to the respective elements of said circuit board; the metal substrate four sides is provided with a metal frame, the metal frame position corresponding to the position of the trees of the copper layer, the metal frame fitted with a conductive gasket, and provided with a fixing hole, the fixing hole corresponding to the location of the center the location of the center through-hole;
The metal frame through the fixing hole and the through hole of the circuit board is fixed so that the metal substrate is electrically connected to the tree by a copper layer of the metal frame, while the metal substrate and the closing the circuit board to form an integral electromagnetic shield cavity.
13. The system of claim 12 wherein the electronic communication device, wherein,
At least one of said top surface of the metal boss disposed uniform thickness of the thermal pad, at least one of the height of the metal should be such that the boss element corresponding to the rear mounting board bonded to the thermally conductive pad .
14, an electronic communication device according to claim system of claim 13, wherein,
The metal frame width equal to the width of the copper layer trees;
The conductive gasket or liner is a metal reed conductive cloth pad.
PCT/CN2011/080095 2011-09-23 2011-09-23 Electronic communication device system and electromagnetic shielding equipment WO2012155432A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/080095 WO2012155432A1 (en) 2011-09-23 2011-09-23 Electronic communication device system and electromagnetic shielding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/080095 WO2012155432A1 (en) 2011-09-23 2011-09-23 Electronic communication device system and electromagnetic shielding equipment

Publications (1)

Publication Number Publication Date
WO2012155432A1 true WO2012155432A1 (en) 2012-11-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/080095 WO2012155432A1 (en) 2011-09-23 2011-09-23 Electronic communication device system and electromagnetic shielding equipment

Country Status (1)

Country Link
WO (1) WO2012155432A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (en) * 2000-04-21 2003-09-10 电子设备屏蔽公司 EMI and RFI shielding for printed circuit boards
CN201700124U (en) * 2010-04-19 2011-01-05 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Shielding case and electronic device with same
CN201766809U (en) * 2010-08-24 2011-03-16 中兴通讯股份有限公司 Electronic communication equipment system and electromagnetic shielding device
CN102037799A (en) * 2008-04-17 2011-04-27 莱尔德电子材料(深圳)有限公司 EMI shielding slide assemblies for slidably opening and closing portable electronic devices and for providing EMI shielding for board-mounted electronic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (en) * 2000-04-21 2003-09-10 电子设备屏蔽公司 EMI and RFI shielding for printed circuit boards
CN102037799A (en) * 2008-04-17 2011-04-27 莱尔德电子材料(深圳)有限公司 EMI shielding slide assemblies for slidably opening and closing portable electronic devices and for providing EMI shielding for board-mounted electronic components
CN201700124U (en) * 2010-04-19 2011-01-05 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Shielding case and electronic device with same
CN201766809U (en) * 2010-08-24 2011-03-16 中兴通讯股份有限公司 Electronic communication equipment system and electromagnetic shielding device

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