WO2012153549A1 - Piezoelectric sensor device - Google Patents

Piezoelectric sensor device

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Publication number
WO2012153549A1
WO2012153549A1 PCT/JP2012/052229 JP2012052229W WO2012153549A1 WO 2012153549 A1 WO2012153549 A1 WO 2012153549A1 JP 2012052229 W JP2012052229 W JP 2012052229W WO 2012153549 A1 WO2012153549 A1 WO 2012153549A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
piezoelectric
sensor
device
surface
substrate
Prior art date
Application number
PCT/JP2012/052229
Other languages
French (fr)
Japanese (ja)
Inventor
陽平 館
谷本 亮介
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezo-electric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator
    • H03H9/178Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N5/00Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
    • G01N5/02Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0504Holders; Supports for bulk acoustic wave devices
    • H03H9/0514Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezo-electric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator
    • H03H9/177Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator of the energy-trap type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0256Adsorption, desorption, surface mass change, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0426Bulk waves, e.g. quartz crystal microbalance, torsional waves

Abstract

Disclosed is a piezoelectric sensor device with which reduction in device size can be achieved and in which costs can be reduced without requiring precise fixing of the piezoelectric detection element and without needing to provide a space on the opposite side to the detection face. One side face of a piezoelectric detection element (2) of the enclosed energy type is designated as the detection face and a holding member (7) is laminated, with interposition of a joining layer (6), on the face on the opposite side to this detection face. If the acoustic impedance value of the piezoelectric detection element (2) is identified as the first acoustic impedance value Z1, the acoustic impedance value of the joining layer (6) is identified as the second acoustic impedance value Z2, and the acoustic impedance value of the holding member (7) is identified as the third acoustic impedance value Z3, then, for this piezoelectric sensor device (1), it is specified that: Z1 > Z2 < Z3.

Description

Piezoelectric sensor device

The present invention, biochemicals and relates piezoelectric sensor device used in the detection, such as inorganic or organic materials, and more particularly, utilizing to the detected changes in the resonance characteristics due to mass loading of the material to be detected to the detection surface a piezoelectric sensor device for detecting a substance.

Conventionally, various sensors using a crystal oscillator has been developed. For example, Patent Document 1 below, there is disclosed QCM (Quartz Crystal Microbalance) sensor shown in FIG. 5 (a) and (b). In QCM sensor 1001, crystal oscillator 1002 is used. Crystal oscillator 1002 has a structure having electrodes formed on upper and lower surfaces of the quartz substrate. When the object substance to adhere to the crystal oscillator 1002, the resonance characteristic of the crystal oscillator 1002 is changed. Using a change in the resonance characteristics, detecting a detection target substance.

Since the use of crystal oscillator 1002, it is necessary to package structure so as not to block the vibration of the crystal oscillator 1002. Therefore, the QCM sensor 1001, a substantially cylindrical housing element 1003 is used. Package member 1003 has a substantially cylindrical shape, and the bottom is closed. Crystal oscillator 1002 is fixed to a substantially cylindrical package member 1003 by an adhesive 1004. In this structure, the upper crystal oscillator 1002 is open to the upper end opening of the package member 1003. Therefore, the substance to be detected may be attached to the upper surface of the crystal oscillator 1002. On the other hand, below the crystal oscillator 1002, in order not to interfere with the vibration, sealed space B is formed.

JP 2008-32617 JP

In the QCM sensor 1001, the detection surface of the crystal oscillator 1002 had to form a space B closed on the opposite side. For this reason, it was not possible to proceed with the miniaturization. In addition, the space B must sealed. Otherwise, the substance to be detected enters the space B, which may not be accurately detected object substance.

Furthermore, should a crystal oscillator 1002, unless precisely fixed to the inner peripheral surface of the package member 1003. That is, when the crystal oscillator 1002 is not fixed in the correct position, the detection accuracy decreases. The quartz resonator 1002 has been fixed to the package member 1003 by adhesive 1004, it is difficult to fix the crystal oscillator 1002 in the correct position by an adhesive 1004. Therefore, the cost for managing the fixed precision crystal oscillator 1002 was also a problem that it takes.

An object of the present invention, when fixing the piezoelectric detector elements, without requiring complicated operations for managing accuracy, easily and can be manufactured at low cost, yet the piezoelectric sensor device can be downsized It is to provide.

Piezoelectric sensor device according to the present invention comprises a piezoelectric detector elements, and the bonding layer, and a holding member. Piezoelectric detector element has an open detection surface, it is configured to detect the detection target substance by mass change when the substance to be detected adheres to the detection plane, having a first acoustic impedance Z1 . The bonding layer, wherein the said detection surface of the piezoelectric detector elements are stacked on the opposite side, a material having a first second acoustic impedance value Z2 smaller than the acoustic impedance Z1. Said retaining member, said said piezoelectric detecting elements of the bonding layer is bonded to the opposite surface, made of a material having a third acoustic impedance Z3 larger than the second acoustic impedance value Z2.

In a specific aspect of the piezoelectric sensor device of this invention, the plural piezoelectric sensor device has included resonance frequency piezoelectric sensing element plural piezoelectric sensor devices are equal. In the present invention, hardly he leaks to the other member such as a mounting substrate via a vibration holding member of the piezoelectric sensing elements. Therefore, it is possible to suppress interference between the piezoelectric detector elements of the plurality of piezoelectric sensor devices. Therefore, by mounting a plurality of piezoelectric sensor device is configured using a piezoelectric detector elements having the same resonant frequency, for example, in one implementation on the substrate, you are possible to provide a piezoelectric sensor device comprising a plurality of detection portions.

In this case, preferably, the plurality of piezoelectric sensor device, a piezoelectric sensor device for one of the piezoelectric sensor device is a reference, other piezoelectric sensor device and the detection piezoelectric sensor device. In this case, by using the output of the reference piezoelectric sensor device, and an output of the detecting piezoelectric sensor device, it is possible to detect more accurately the substance to be detected.

Further, in another specific aspect of the present invention, mounting substrate on which the plurality of piezoelectric sensor device is mounted it is further provided. In this case, one of the mounting substrate, mounted the plurality of piezoelectric sensor device, as a single component, it is possible to construct a piezoelectric sensor device having a plurality of detection portions.

In another specific aspect of the piezoelectric sensor device according to the present invention, the piezoelectric detection element comprises a piezoelectric substrate, a plurality of electrodes provided so as to face each other with a part or all of the piezoelectric substrate. In this case, as in the well-known piezoelectric vibrator, it is possible to constitute a piezoelectric detector element used in the piezoelectric sensor device of the present invention.

Piezoelectric sensor device according to the present invention can be used to detect various substances to be detected, in yet another specific aspect of the present invention, the biosensor device is configured to be detected substance biochemicals . In that case, the biochemical in accordance with the present invention detects with high accuracy, and a small size, it is possible to provide an inexpensive biosensor device.

A piezoelectric sensor device according to the present invention, a piezoelectric sensing element, since the acoustic impedance of the bonding layer and the piezoelectric sensor device is configured as described above, hardly the vibration of the piezoelectric detecting element is prevented by the bonding layer and the holding member. Accordingly, there is a possible to the detection surface of the piezoelectric detector elements without providing the space on the opposite side to join the holding member via the bonding layer.

Therefore, without lowering the detection accuracy of the piezoelectric sensor device can be downsized. In addition, when bonding the piezoelectric detector elements to the holding member via the bonding layer, it does not require high precision positioning. Therefore, it is possible to significantly reduce the steps and costs required in order to increase the fixing precision of the piezoelectric detector elements.

1 (a) is a perspective view of a piezoelectric sensor device according to a first embodiment of the present invention, FIG. 1 (b) is a perspective view showing a piezoelectric detector element used in the piezoelectric sensor device. Figure 2 is a partially cutaway front sectional view showing a piezoelectric sensor device according to a second embodiment of the present invention. FIGS. 3 (a) and 3 (b) is a schematic plan view of a plan view and a piezoelectric substrate for illustrating another example of the piezoelectric detector element used in the present invention the watermark indicating the lower surface of the electrode shape . Figure 4 is a perspective view showing still another example of a piezoelectric detector element used in the piezoelectric sensor device of the present invention. 5 (a) and 5 (b) is a sectional view showing a portion along a conventional plan view showing a QCM sensor, and FIGS. 5 (a) A-A line in.

Hereinafter, with reference to the drawings by describing the specific embodiments of the present invention, clarify the invention.

1 (a) is a perspective view showing a piezoelectric sensor device according to a first embodiment of the present invention. Piezoelectric sensor device 1 of the present embodiment is a biosensor apparatus for detecting a biochemical substance such as proteins. However, piezoelectric sensor device 1, other than biochemical substances, for example, can be used for applications to measure the substance to be detected chemicals such as gas.

Piezoelectric sensor device 1 includes a piezoelectric sensing element 2. As shown in FIG. 1 (b), the piezoelectric detection element 2 includes a piezoelectric substrate 3, a first electrode 4 formed on the upper surface of the piezoelectric substrate 3, a second electrode formed on the lower surface of the piezoelectric substrate 3 and a 5.

The piezoelectric substrate 3 is made of a piezoelectric ceramic such as lead zirconate titanate ceramics. However, the piezoelectric substrate 3 may be formed by a piezoelectric single crystal such as quartz.

In this embodiment, the piezoelectric substrate 3 is made of a piezoelectric ceramic is polarized in the direction indicated by the arrow P shown. The piezoelectric substrate 3 is planar shape with a rectangular strip-like shape. The polarization direction P is the direction connecting the first end surface 3a and a second end surface 3b.

The first electrode 4, the upper surface of the piezoelectric substrate 3, and extended from the central region toward the second end surface 3b side, leading to the completion of edges between the upper surface and the second end surface 3b. The second electrode 5, the center of the lower surface area of ​​the piezoelectric substrate 3 is formed to the first end surface 3a and the lower surface reaches the eggplant edges. In the central region of the piezoelectric substrate 3, a first electrode 4 and the second electrode 5 overlap each other via the piezoelectric substrate 3. This overlapping is part constitutes a piezoelectric vibrating portion.

Since the polarization direction P of the piezoelectric substrate 3 is the direction, first, when an AC electric field is applied between the second electrodes 4 and 5, the thickness shear vibration mode is excited are confined to the vibrating portion. That is, the piezoelectric detection element 2 is a piezoelectric element using an energy-trap thickness shear vibration mode.

It said first and second electrodes 4 and 5 may be formed Ag, Au, Cu, by an appropriate metal such as Al or an alloy thereof.

The piezoelectric sensing element 2 is made of piezoelectric ceramics, and its acoustic impedance and the first acoustic impedance Z1.

In the piezoelectric sensor device 1 shown in FIG. 1 (a), the upper surface of the piezoelectric detector element 2 is detected face. This of the above detection surface piezoelectric detector elements 2 to the face or lower surface of the opposite side, the bonding layer 6 are laminated. Bonding layer 6 is, in this embodiment, made of an insulating adhesive. As such an adhesive, epoxy resin adhesive, it may be any appropriate adhesive such as a silicone resin based adhesive. However, the bonding layer 6, as long as the fulfill bonding function may be other insulating bonding material other than the adhesive.

The lower surface of the bonding layer 6, the holding member 7 are stacked. Holding member 7 has a rectangular plate shape. In the present embodiment, the holding member 7 has the same planar shape as the piezoelectric substrate 3. Holding member 7 constitute a surface on which mounting the piezoelectric sensor device 1 to the mounting substrate. That opens the detection surface of the piezoelectric detector element 2 as detection target substances can adhere, in order to seal the surface opposite the holding member 7 is joined via a bonding layer 6. The material forming the holding member 7, it is possible to use an insulating ceramic such as alumina, a suitable material such as a synthetic resin such as epoxy resin. In this embodiment, the holding member. 7 made of an insulating ceramic.

The acoustic impedance value of the adhesive layer 6 as the second acoustic impedance value Z2, the acoustic impedance of the holding member 7 and the third acoustic impedance Z3.

Further, the piezoelectric sensing element 2, a first terminal electrode 8 is formed on the first end face of the stack of the bonding layer 6 and the holding member 7. The second terminal electrode 9 is formed on the end surface opposite that facing the first end surface. The first terminal electrode 8 is formed to reach the lower surface from the first end face of the laminate. The second terminal electrode 9 is formed to reach the upper and lower surfaces from the second end face of the laminate. In part that led to the upper surface of the stack of the second terminal electrodes 9 and contacts the first electrode 4 and the surface contact manner.

Portion which reaches the lower surface of the laminate of the first terminal electrode 8 and the second terminal electrode 9 is provided in order to surface contact in contact with the electrode lands like on the mounting substrate to be described later.

In the piezoelectric sensor device 1, the substance to be detected adheres to the upper surface of the detection surface or piezoelectric detection element 2, the resonance characteristics of the piezoelectric sensing element 2 changes. Thereby, it is possible to detect the amount of presence and the substance to be detected in the object substance.

Conventionally, a piezoelectric sensor device using a piezoelectric detector elements, it is necessary to provide a space for allowing vibration of the piezoelectric detector elements. In other words, the detection surface is open on the opposite side, had to form a space B shown in FIG. In contrast, in the piezoelectric sensor device 1, it is not necessary to form such a space B. That is, as is apparent from FIG. 1 (a), the entire lower surface of the piezoelectric sensing element 2 is bonded to the holding member 7 through the bonding layer 6. Thus, the space on the opposite side to the detection face of the piezoelectric detector element 2 is absent. Accordingly, the piezoelectric sensor device 1 can be miniaturized.

In addition, a piezoelectric sensor device 1, through the bonding layer 6 is laminated to the holding member 7, it is only necessary to bond, the piezoelectric sensor device 1, it is possible to simplify the assembly process. In the conventional QCM sensors 1001, since it is necessary to form a space B, the package structure is complicated, had to increase the accuracy of the fixed position of the quartz resonator 1002. In contrast, the piezoelectric sensor device of the present embodiment 1, it is not necessary to provide a space, not only can simplify the package structure, there is no need to increase the fixing precision of the piezoelectric detector element 2.

Further, the piezoelectric sensor device 1 of the present embodiment, even with the structure formed by omitting the space, deterioration of resonance characteristics of the piezoelectric detector element 2 hardly occurs. This is because the first acoustic impedance Z1 ~ third acoustic impedance Z3 is, there is a relation of Z1> Z2 <Z3. That is, since the first to third acoustic impedance values ​​Z1 ~ 3 meets such a relationship, vibration leaked from the piezoelectric detection element 2 in the bonding layer 6, the interface between the bonding layer 6 and the holding member 7 in is reflected. Therefore, even when a structure without the space, resonance characteristics of the piezoelectric detector element 2 is hardly deteriorated. Thus, by utilizing the change in the resonance characteristics due to mass loading effect of the object substance adhering to the detection surface, and is it possible to measure the amount of presence and the substance to be detected in the object substance with high accuracy.

Figure 2 is a partially cutaway front sectional view showing a piezoelectric sensor device 16 according to the second embodiment of the present invention. In the second embodiment, a plurality of piezoelectric sensor devices 1,1A on the mounting substrate 11 is mounted. Piezoelectric sensor device 1,1A is configured similarly to the piezoelectric sensor device 1 of the first embodiment.

Mounting the substrate 11 is made of an insulating material such as alumina. On the mounting board 11, electrode lands 12 to 15 are formed. On the electrode lands 12 and 13, first and second terminal electrodes 8 and 9 of the piezoelectric sensor device 1 are respectively contact. In this manner, not shown, by using a conductive bonding material made of solder or conductive adhesive, is mounted on the portion of the piezoelectric sensor device 1 is formed an electrode lands 12 and 13. Similarly, the piezoelectric sensor device 1A, in a portion where the electrode lands 14 and 15 are provided, are mounted on the mounting substrate 11.

Piezoelectric sensor device 1,1A, since having the above structure, the vibration of the piezoelectric detector element 2 is less likely to leak to the holding member 7 side. Therefore, the same mounting substrate 11, i.e., a plurality of piezoelectric sensor devices 1,1A on a single mounting substrate 11 is fixed as described above, even if implemented, interference between the piezoelectric sensor device 1,1A hardly occurs.

Accordingly, the piezoelectric sensor device 1 and the piezoelectric sensor device 1A, the resonant frequency of the piezoelectric detector element 2 are equal, it is possible to use exactly the same piezoelectric sensor device. Thereby, it is possible to perform the simplification and cost reduction of the second embodiment of the piezoelectric sensor device 16 of the assembly process with a plurality of piezoelectric sensor devices 1, 1A.

Incidentally, the plurality of piezoelectric sensor devices 1, 1A, one may also be used as a detection piezoelectric sensor device is, preferably, one piezoelectric sensor device 1 as the reference piezoelectric sensor device, other piezoelectric sensor device 1A it is desirable that the detecting piezoelectric sensor device. Thereby, the reference piezoelectric sensor device, based on the output difference between the detecting piezoelectric sensor device can measure more accurately the substance to be detected.

Further, when mounting a plurality of piezoelectric sensor device on the mounting substrate 11, the number of the piezoelectric sensor device is not limited to the illustrated construction, it may be 3 or more piezoelectric sensor device is mounted.

In the second embodiment shown in FIG. 2, a plurality of piezoelectric sensor devices 1,1A on the mounting board 11 has been mounted, it is only one piezoelectric sensor device 1 is mounted on the mounting board it may be.

Furthermore, in the second embodiment, the resonance frequency of the piezoelectric detector elements 2 of the piezoelectric sensor device 1, the resonance frequency of the piezoelectric detector elements 2 of the piezoelectric sensor device 1A has been equal or different. If the resonant frequencies are different, it is possible to more effectively suppress the interference between the piezoelectric sensor device 1, 1A.

3 (a) and (b) is a schematic plan view showing the lower surface of the electrode shape watermark plan view and a piezoelectric substrate showing a modification of the piezoelectric detector element used in the present invention.

As shown in FIG. 3 (a) and (b), the piezoelectric sensing element 21 according to this modified example has a rectangular plate-shaped piezoelectric substrate 22. The piezoelectric substrate 22 is made of a piezoelectric ceramic is polarized in the thickness direction. Planar shape at the center of the upper surface of the piezoelectric substrate 22 is first electrode 23 of the circular are formed. On the lower surface, so as to face the first electrode 23, second electrode 24 is formed. Portion where the first electrode 23 and second electrode 24 are overlapped constitute a piezoelectric vibrating portion of the energy-trap utilizing a thickness longitudinal vibration mode.

The first electrode 23 is electrically connected to the connection electrode 26 disposed along the edge formed between the top surface and one end surface of the piezoelectric substrate 22 via the wiring electrodes 25. Similarly, the second electrode 24 is connected to the connection electrode 28 via the wiring electrodes 27. The connection electrode 28 is formed to reach the form edges of the lower surface and the other end surface of the piezoelectric substrate 22.

As shown in FIG. 3, in the present invention, a piezoelectric sensing element may be an energy-trap type piezoelectric element using a thickness longitudinal vibration mode.

Figure 4 is a perspective view for explaining still another modification of the piezoelectric detector element used in the present invention. The piezoelectric sensing element 31 of this modification is an energy trapped type piezoelectric element using the second-order wave of a thickness extensional vibration. The piezoelectric sensing element 31 has a rectangular plate-shaped piezoelectric substrate 32. The piezoelectric substrate 32 is polarized in the thickness direction. On the upper surface of the piezoelectric substrate 32 has first electrode 33 is formed on the lower surface and the second electrodes 34 are formed. The first electrode 33 and second electrode 34 are extending from the upper surface and the center of the lower surface of the piezoelectric substrate 32 toward the second end face 32b side.

Furthermore, the intermediate height position of the piezoelectric substrate 32, internal electrodes 35 are formed. Internal electrode 35 in the central region of the first electrode 33 and second electrode 34 and the piezoelectric substrate 32, overlap via the piezoelectric substrate layer. Internal electrodes 35 are extended from the central portion of the piezoelectric substrate 32 toward the first end face 32a, it is drawn to the first end surface 32a.

In the piezoelectric sensing element 31, the first, second electrodes 33 and 34, by applying an alternating electric field between the internal electrode 35, the energy confinement type piezoelectric element utilizing the second-order wave of a thickness extensional vibration mode to operate as. In the present invention, it may be used an energy trapped type piezoelectric element utilizing the higher order modes of such a thickness extensional vibration mode piezoelectric detecting element.

As shown in FIGS. 3 and 4, in the present invention, not only the thickness shear mode, a piezoelectric element utilizing harmonics of a thickness extensional vibration mode and a thickness extensional vibration mode, various energy confinement type piezoelectric element can be used as a piezoelectric detector elements, it is not particularly limited.

1, 1A ... piezoelectric sensor device 2 ... piezoelectric detector elements 3 piezoelectric substrate 3a ... first end surface 3b ... second end surface 4 ... first electrode 5 ... second electrode 6 ... bonding layer 7 ... holding member 8 ... the first terminal electrode 9 ... second terminal electrodes 11 ... mounting board 12-15 ... electrode lands 16 ... piezoelectric sensor device 21 ... piezoelectric detector elements 22 ... piezoelectric substrate 23: first electrode 24: second electrode 25 ... wiring electrodes 26 ... connection electrodes 27 wire electrodes 28 ... connecting electrodes 31 ... piezoelectric detector elements 32 ... piezoelectric substrate 32a ... first end surface 32 b ... second end surface 33 ... first electrode 34: second electrode 35 ... internal electrode

Claims (6)

  1. It has an open detection surface, and the detection plane is configured to detect the detection target substance by mass change when the substance to be detected is attached to a piezoelectric sensing element having a first acoustic impedance Z1,
    And wherein the said detection surface of the piezoelectric detector elements are stacked on the opposite side, the bonding layer made of a material having a second acoustic impedance value Z2 smaller than the first acoustic impedance Z1,
    The said piezoelectric detecting elements of the bonding layer is bonded to the opposite surface, and a holding member made of a material having a third acoustic impedance Z3 larger than the second acoustic impedance value Z2, the piezoelectric sensor apparatus.
  2. A plurality of piezoelectric sensor device according to claim 1, is equal to the resonance frequency of the piezoelectric detector elements of the plurality of piezoelectric sensor device, piezoelectric sensor device.
  3. Wherein the plurality of piezoelectric sensor device, a piezoelectric sensor device for one of the piezoelectric sensor device is a reference, the other piezoelectric sensor device is a piezoelectric sensor device for detecting, piezoelectric sensor device according to claim 2.
  4. Further comprising a mounting substrate having the plurality of piezoelectric sensor device is mounted, a piezoelectric sensor device according to claim 2 or 3.
  5. The piezoelectric sensing element, a piezoelectric substrate, comprising a plurality of electrodes provided so as to face each other with a part or all of the piezoelectric substrate, the piezoelectric sensor device according to any one of claims 1-4.
  6. A biosensor device according to the material to be detected biochemicals, piezoelectric sensor device according to any one of claims 1 to 5.
PCT/JP2012/052229 2011-05-12 2012-02-01 Piezoelectric sensor device WO2012153549A1 (en)

Priority Applications (2)

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JP2011107426 2011-05-12
JP2011-107426 2011-05-12

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03144359A (en) * 1989-10-31 1991-06-19 Sumitomo Bakelite Co Ltd Ultrasonic sensor
JPH08251694A (en) * 1995-02-15 1996-09-27 Hewlett Packard Co <Hp> Ultrasonic transducer and reflection attenuating method
JP2005533265A (en) * 2002-07-19 2005-11-04 シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft Method of detecting a device and materials for detecting a substance
JP2007508539A (en) * 2003-10-08 2007-04-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Bulk acoustic wave sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03144359A (en) * 1989-10-31 1991-06-19 Sumitomo Bakelite Co Ltd Ultrasonic sensor
JPH08251694A (en) * 1995-02-15 1996-09-27 Hewlett Packard Co <Hp> Ultrasonic transducer and reflection attenuating method
JP2005533265A (en) * 2002-07-19 2005-11-04 シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft Method of detecting a device and materials for detecting a substance
JP2007508539A (en) * 2003-10-08 2007-04-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Bulk acoustic wave sensor

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