Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
  • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49016—Antenna or wave energy "plumbing" making
  • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Definitions

• the invention relates to a new method of manufacturing electronic inserts for identification documents, in particular electronic passports, as well as the structure of the insert obtained by the implementation of the method.
• Methods of manufacturing electronic passports comprising on the one hand a booklet consisting of superimposed sheets of paper bound together by a central binding, in which at least one of the sheets of the booklet comprises several layers of plastic material and / or paper and a flexible insert provided with an electronic module and an antenna, said insert being integrated between two adjacent layers of the sheet provided with the insert.
• a first problem is the succession of manufacturing steps of the insert itself.
• an adhesive film is placed on a paper or plastic support sheet, on which is disposed a metal antenna as well as an electronic module which is generally electrically connected to the metal. 'antenna. Then the whole is coated with another layer of adhesive film, and finally a second carrier sheet is superimposed. When the stack is complete, the whole is laminated in a lamination press, which has the effect of securing the different layers together because of the presence of adhesive layers.
• the lamination pressure is intended to be applied to the total surface of the insert, but in the case where the module electronic is in overthickness, even slight, the pressure applied locally on the module, which has a much smaller surface than that of the insert, can be of the order of 200 times greater than the nominal pressure. This excessive pressure exerted on the module can sometimes either break it or break the possible connections between the studs of the antenna and those of the electronic module.
• the adhesive used is a roll adhesive, provided with a protection or an adhesive carrier, also called “liner In Anglo-Saxon terminology.
• the implementation of such an adhesive provided with a "liner” is both expensive and likely to have defects affecting the overall manufacturing yield.
• a third problem related to the method of manufacturing inserts according to the state of the art is that the antenna, due to sori cost relatively high, is generally not deposited on the entire surface of the support. Or the antenna of such an insert has a thickness of about 80 microns, while the insert itself has a total thickness of about 400 micrometers.
• the lack of antenna on a large part of the surface of the insert is likely to create a "walking" effect, an irregularity in the thickness of the insert, while the specifications ePassports impose flatness standards on ever more stringent passport sheets. It is known in itself to compensate for the extra thickness due to the antenna, by the interposition of a thickness compensation sheet, but it is of a delicate implementation and represents an additional cost and a risk of falling from additional manufacturing yield.
• Goals of the invention is therefore to provide a new method of manufacturing electronic records intended to be integrated into security documents such as electronic passports, a method that is able to solve the technical problems mentioned above.
• a more specific object of the invention is to propose an improved manufacturing process which makes it possible to produce inserts for electronic passports, without the electronic module of the insert being subjected to the lamination pressure applied to the rest of the insert. .
• Another object of the invention is to provide a method of manufacturing inserts that is able to produce inserts with fewer flatness defects, which will allow their integration more discreet in security documents such as ePassports.
• Another object of the invention is to provide a method of manufacturing inserts having a lower unit cost, a higher manufacturing yield, and higher production rates.
• the subject of the invention is a method for manufacturing electronic inserts, and electronic inserts, as defined in the claims.
• the electronic module is no longer integrated into the insert before the lamination thereof, but the support layers, antenna and adhesive are laminated together first, and the electronic module is postponed only after lamination, in a cavity provided for this purpose. This prevents the electronic module from being damaged by the application of excessive pressure.
• the method according to the invention provides to use printed adhesives directly on the support layers of the inserts, in place of adhesives in rolls or sheets used until then.
• the method according to the invention also makes it possible to use, in order to compensate for the thickness of the antenna, a compensation layer directly printed in the area devoid of antenna, in place of the thickness compensation sheets used up to that point. . This avoids the handling of adhesive sheets.
• the invention therefore relates to a method of manufacturing inserts provided with an electronic module carrying a chip and an antenna, comprising the steps of:
• the manufacturing method according to the invention provides that each electronic module is applied in a cavity corresponding to the insert using a low pressure, substantially less than two orders of magnitude in relation to the lamination pressure of the support.
• the fixing pressure of the electronic module during the so-called embedding step is for example of the order of 10 to 20 kgf / cm 2.
• the adhesive disposed between the support sheets and the antennas is an adhesive printed on the support.
• the method further comprises a step of printing on the inner face of at least one of the support sheets, a thickness compensation band, outside the area of the support intended to receive the antenna.
• the invention also relates to an insert for the manufacture of an electronic passport, characterized in that it is made according to the manufacturing method described above.
• the invention also relates to a passport booklet, characterized in that it integrates between at least two of its sheets, an insert of the previous type.
• FIG. 1 represents a flowchart of the process for manufacturing inserts for electronic passports, according to the state of the art
• FIG. 2 represents the flowchart of the inserts manufacturing method, as modified according to the present invention
• FIG. 3 shows a plan view of a set of two inserts, before individualization by cutting
• Figures 4A and 4B show the insert of Figure 3, according to the state of the art, in sectional view along section A-A of Figure 3;
• FIGS. 5A and 5B show the insert of FIG. 3, in sectional view along section AA of FIG. 3, but incorporating the structural modifications resulting from the modified manufacturing method according to the invention.
• FIG. 1 there is shown a flowchart of a conventional method of manufacturing electronic inserts for security documents.
• the first steps 10, 11, 12 in parallel consist in supplying the components to be assembled, namely sheets (step 10) or rolls of adhesive, paper or plastic substrate sheets (step 11), antennas (Step 12) which are generally in the form of very thin sheets coated with a screen-printed metal antenna, or engraved, printed, or even sewn, and electronic modules (supplied in step 13) which essentially comprise an encapsulated electronic chip and contact pads for contacting corresponding ranges of the antenna.
• step 1415,16 After the component supply phase (10, 11, 12, 13), some of which are presented in a format corresponding to a plurality of inserts (this is the case in particular with the supports which are presented in the form of large dimensions), it is proceeded to a cutting (steps 14,15,16) components to facilitate the assembly of individual inserts.
• the substrates or substrates are supplied with sheets, and it is necessary (step 15) to cut cavities therein to receive the modules, and to cut them together to adapt the number of positions (for example 2, 3 or 4 positions). the number of inserts that machines can roll in parallel. it is possible, especially for screen-printed antennas, that they also be supplied with sheets each carrying a plurality of antennas, so that it is also necessary to cut them (step 16) into a number corresponding to that of the number of inserts manufactured in parallel.
• a sheet of adhesive is transferred to a lower support, then the antennas and, again, an adhesive sheet and possibly a thickness compensation sheet for the area not covered by the antenna.
• the adhesive sheet is typically coated a protective support or "liner", which must be removed on the 2 sheets of adhesive mentioned above.
• an upper support sheet is deferred, then the modules are removed, which corresponds to the transfer of an electronic module (step 18) with a suitable relative positioning on the support, and the whole is rolled up (step 19). ) in a lamination press, before proceeding to a final cut (step 20) having the effect of cutting a board of two or more inserts, which will later be cut into inserts individualized by the manufacturer of the electronic passport.
• FIG. 2 shows a flowchart of the modified manufacturing method according to the invention.
• the necessary components are first supplied and prepared (steps 30, 31, 32), namely sheets made of plastics material or paper intended for producing the supports, screen-printed, engraved or other antennas, and individualized electronic modules.
• step 33 Preferably before cutting the support sheets, it proceeds (step 33) to their adhesive.
• This operation involves coating the support sheets (lower and / or upper) with an adhesive, in particular a printed adhesive, for example by material jet, heat transfer, coating or other.
• step 35 is used to cut the supports and to make cavities in the supports, these cavities being intended to receive the electronic modules.
• step 36 to the assembly of the inserts, which has several substeps.
• a previously cut antenna is deposited from a sheet carrying a plurality of antennas, on each lower adhesive-coated support.
• a support element higher preferably also previously adhesively.
• the lamination of this stack is carried out (step 37) according to the well-known lamination methods.
• the layers of the stack as realized comprise only passive components which easily support the typical lamination pressure.
• the stacked and laminated sheets are cut (step 38) into sets corresponding to two or three future inserts, depending on the needs of the machine. embedding used for the postponement of the modules.
• step 39 inserting the modules (step 39), namely the transfer of previously individualized modules, in the corresponding cavity provided for this purpose (see Figure 3) on each insert, and applies a low pressure (of the order of 16 kgf / cm 2 ) on each module, which has the effect of mechanically attaching the module to the insert, at an adhesive zone thereof.
• FIG. 3 shows, in plan view, two inserts 41 that are still integral, before insertion of a module (not shown) into each cavity 42, and individualization of the inserts 41 by cutting.
• FIG. 4A represents the section as a whole
• FIG. 4B represents a more detailed sectional view of the insert in the vicinity of the electronic module 44.
• FIG. 5A shows the Hnsert section 41 as a whole
• FIG. 5B shows a more detailed sectional view of the insert in the vicinity of the electronic module 44.
• the thickness differential between the zone (on the left) provided with the electronic module and the zone (on the right) without module was compensated by the insertion of a layer 55 of thickness compensation.
• This layer 55 of thickness compensation can be obtained by the insertion of a compensation sheet of plastic or paper. But preferably, this layer, a very thin thickness of the order of 80 microns for example, is obtained by printing.
• the support layers 46 are for example made of Teslin (registered trademark), and the adhesive 54 is preferably deposited on each support layer 46 by screen printing, instead of the adhesive sheets used until then, which required a protective support or "liner".
• the adhesives 54 used for the manufacture of the inserts 41 may be thermoplastics (polyurethanes, polyesters, polyamides, etc.) or thermosetting materials (polyesters, phenols, epoxides, etc.).
• the rejects are greatly reduced and the overall production efficiency increased because inserting the modules after lamination allows to embed only good modules in good inserts, and this so-called inserting operation is performed according to well-controlled processes .

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Credit Cards Or The Like (AREA)
• Adornments (AREA)

Priority Applications (8)

Applications Claiming Priority (2)

Publications (1)

Family

ID=44515219

Family Applications (1)

Country Status (12)

Cited By (1)

Citations (2)

Family Cites Families (5)

• 2011
  • 2011-04-05 FR FR1101018A patent/FR2973915B1/fr not_active Expired - Fee Related
• 2012
  • 2012-04-04 RU RU2013148997/08A patent/RU2591016C2/ru not_active IP Right Cessation
  • 2012-04-04 PL PL12721326T patent/PL2695110T3/pl unknown
  • 2012-04-04 WO PCT/FR2012/000127 patent/WO2012136905A1/fr active Application Filing
  • 2012-04-04 BR BR112013025887A patent/BR112013025887A2/pt not_active IP Right Cessation
  • 2012-04-04 PT PT127213262T patent/PT2695110E/pt unknown
  • 2012-04-04 CN CN201280027263.0A patent/CN103748601A/zh active Pending
  • 2012-04-04 ES ES12721326.2T patent/ES2550188T3/es active Active
  • 2012-04-04 EP EP12721326.2A patent/EP2695110B1/fr not_active Not-in-force
  • 2012-04-04 US US14/009,930 patent/US9256821B2/en not_active Expired - Fee Related
  • 2012-04-04 HU HUE12721326A patent/HUE027921T2/en unknown
• 2015
  • 2015-10-22 HR HRP20151118TT patent/HRP20151118T1/hr unknown

Patent Citations (2)

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