WO2012124682A1 - 樹脂成形品及びその製造方法 - Google Patents

樹脂成形品及びその製造方法 Download PDF

Info

Publication number
WO2012124682A1
WO2012124682A1 PCT/JP2012/056383 JP2012056383W WO2012124682A1 WO 2012124682 A1 WO2012124682 A1 WO 2012124682A1 JP 2012056383 W JP2012056383 W JP 2012056383W WO 2012124682 A1 WO2012124682 A1 WO 2012124682A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive member
resin
conductive
molded product
conductive members
Prior art date
Application number
PCT/JP2012/056383
Other languages
English (en)
French (fr)
Inventor
勇次郎 菅谷
光治 加藤
Original Assignee
イリソ電子工業株式会社
有限会社Ｍｔｅｃ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イリソ電子工業株式会社, 有限会社Ｍｔｅｃ filed Critical イリソ電子工業株式会社
Priority to EP12758262.5A priority Critical patent/EP2687350A4/en
Priority to US14/005,410 priority patent/US20140069716A1/en
Publication of WO2012124682A1 publication Critical patent/WO2012124682A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/58—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention is used for manufacturing various devices such as a pressure sensor and a rotating magnetic sensor for automobiles, for example. It is about.
  • a resin molded product in which a plurality of conductive members to be terminals are insert-molded is incorporated in the sensor housing, and the pressure-sensitive element of the sensor and each conductive member are connected. ing.
  • a first element such as a capacitor is connected to each conductive member in the housing, but since the soldering iron cannot be used in the resin housing, the first element is connected to the conductive epoxy. It connects with each electrically-conductive member with adhesives, such as.
  • silver plating is used on the connection surface in order to increase conductivity.
  • silver plating tends to cause migration, a sealing resin is filled around the first element. There is a need to.
  • the work of connecting the first element in the housing and the work of filling the sealing resin are complicated, there is a problem that productivity is lowered.
  • JP 2004-363410 A JP-A-11-265965
  • each conductive member is connected only by the first element.
  • Each conductive member is distorted by the pressure of the resin flowing into the mold. As a result, an external force such as twisting or bending is applied from each conductive member to the first element, thereby deteriorating the characteristics of the first element.
  • the present invention has been made in view of the above-described problems.
  • the purpose of the present invention is to insert each conductive member and the first element from each conductive member by the pressure of the resin during molding when the resin is insert-molded with resin.
  • An object of the present invention is to provide a resin molded product capable of suppressing an external force applied to one element and a manufacturing method thereof.
  • the present invention provides a plurality of conductive members arranged at intervals in the width direction, a first element disposed across each conductive member, each conductive member, and the first In a resin molded product comprising a resin part insert-molded with a resin so as to cover the element, a second element connected to each conductive member so as to extend over each conductive member and fixing each conductive member I have.
  • the present invention arranges a first element across a plurality of conductive members arranged at intervals in the width direction so as to extend over the respective conductive members.
  • the second element for fixing the conductive members is connected to the conductive members so as to extend over the conductive members,
  • the member, the first element, and the second element are arranged in a mold for insert molding, and a resin portion is formed by filling a molten resin into the mold.
  • the 2nd element which fixes each conductive member is connected to each conductive member so that it may span each conductive member, when insert-molding the resin part which covers each conductive member and the 1st element Even when the pressure of the resin flowing into the mold is applied to each conductive member, the distortion between the conductive members is suppressed by the second element.
  • the present invention when insert molding the resin portion covering each conductive member and the first element, even if the pressure of the resin flowing into the mold is applied to each conductive member, the distortion between the conductive members is reduced. Since it can be suppressed, external forces such as twisting and bending applied from each conductive member to the first element can be greatly reduced, and there is an advantage that the characteristics of the first element are not deteriorated.
  • the perspective view of the resin molded product which shows the 1st Embodiment of this invention The perspective view which shows the connection state of an electroconductive member, a 1st element, and a 2nd element Perspective view of first element Perspective view of the second element
  • device which shows the
  • the front view which shows the connection process of a 1st element and a 2nd element Partial cross-sectional front view showing the connection process of the conductive member, the first element, and the second element Partial cross-sectional front view showing the connection state of the conductive member, the first element, and the second element
  • the partial cross section front view which shows the connection process of the electrically-conductive member which concerns on the 4th Embodiment of this invention, a 1st element, and a 2nd element Partial cross-sectional front view showing the connection state of the conductive member, the first element, and the second element
  • the perspective view which shows the connection state of the electrically-conductive member which concerns on the 5th Embodiment of this invention, a 1st element, and a 2nd element.
  • the perspective view which shows the connection state of the electrically-conductive member which concerns on the 6th Embodiment of this invention, a 1st element, and a 2nd element.
  • the partial cross section front view which shows the connection process of the electrically-conductive member which concerns on the 7th Embodiment of this invention, a 1st element, and a 2nd element Partial cross-sectional front view showing the connection state of the conductive member, the first element, and the second element
  • the perspective view which shows the connection state of the electrically-conductive member which concerns on the 8th Embodiment of this invention, a 1st element, and a 2nd element.
  • Perspective view of the second element Partial cross-sectional front view showing the connection state of the conductive member, the first element, and the second element
  • FIG. 1 to 10 show a first embodiment of the present invention.
  • the resin molded product shown in the figure is used for manufacturing various devices such as a pressure sensor and a rotating magnetic sensor for automobiles.
  • the resin molded product of the present embodiment includes three conductive members 1 that are spaced apart from each other in the width direction, two first elements 2 that are disposed so as to extend between the conductive members 1, and It consists of two second elements 3 fixed to the conductive member 1 and a resin part 4 that covers each conductive member 1, each first element 2, and each second element 3.
  • Each conductive member 1 is made of a conductive metal extending in a flat plate shape, and is used as a terminal connected to a connection partner (not shown).
  • Each first element 2 is made of an electronic component such as a capacitor, resistor, varistor, or inductor, for example, and is connected to the second element 3 fixed to the adjacent conductive member 1 among the conductive members 1 by soldering. It has come to be.
  • the first element 2 includes a plate-shaped component body 2a formed of a material having desired electrical characteristics, and a pair of electrodes 2b provided on both ends in the width direction of the component body 2a.
  • the electrode 2b is formed so as to cover both end portions in the width direction of the component main body 2a.
  • the second element 3 includes, for example, a reinforcing member 3a made of a high-strength insulating material such as high-temperature fired ceramic and aluminum nitride, and a pair of connection portions 3b provided on both ends in the width direction of the reinforcing member 3a.
  • a reinforcing member 3a made of a high-strength insulating material such as high-temperature fired ceramic and aluminum nitride
  • connection portions 3b provided on both ends in the width direction of the reinforcing member 3a.
  • each of the conductive members 1 is connected to the adjacent conductive members 1 by soldering.
  • the reinforcing member 3 a is formed in a plate shape whose dimensions in the front-rear direction and the width direction are slightly larger than those of the first element 2, and the dimension in the width direction is larger than the interval between two adjacent conductive members 1.
  • Each connection part 3b consists of an electroconductive metal layer, and is formed ranging from the width direction both ends of the reinforcement member
  • the resin part 4 is made of a synthetic resin such as PBT, for example, and is formed so as to cover the center in the longitudinal direction of each conductive member 1.
  • a synthetic resin such as PBT, for example
  • the resin part 4 is formed by insert-molding each first element 2 and each second element 3 connected to each conductive member 1 with resin, and inside each of the conductive members 1 and each first element Element 2 and each second element 3 are embedded.
  • the resin of the resin part 4 has a melting temperature (for example, 220 ° C.) higher than the melting temperature (for example, 220 ° C.) of the soldering part 5 connecting each conductive member 1, each first element 2 and each second element 3.
  • a melting temperature for example, 220 ° C.
  • the melting temperature for example, 220 ° C.
  • 260 degreeC is used.
  • the first element 2 When manufacturing the resin molded product, first, as shown in FIG. 5, the first element 2 is placed so as to overlap the one surface in the thickness direction of the second element 3. One electrode 2b is connected to one connection part 3b of the second element 3 by soldering, and the other electrode 2b of the first element 2 is soldered to the other connection part 3b of the second element 3 Connecting. Next, the second element 3 to which the first element 2 is connected spans two adjacent conductive members 1 so that the other surface in the thickness direction faces the conductive member 1 as shown in FIG. As shown in FIG. 7, one connecting portion 3b of the second element 3 is connected to one conductive member 1 by soldering, and the other connecting portion 3b of the second element 3 is connected to the other conductive member. Connect to member 1 by soldering.
  • one of the first elements 2 and the second elements 3 connected to each other is connected to the conductive member 1 on one end side in the width direction and the conductive member 1 on the center side of each conductive member 1.
  • the other first element 2 and the second element 3 connected to each other are connected to the conductive member 1 on the other end side in the width direction and the conductive member 1 on the center side of each conductive member 1.
  • the soldering may be performed using a solder material and a soldering iron.
  • a solder layer is formed in advance on each connection portion 3b of the second element 3 with a solder paste or the like, and soldering is performed by reflow. It may be melted and connected.
  • each first element 2 and each second element 3 are arranged in the mold A, and inside the mold A as shown in FIG. Is filled with resin 4 '.
  • the pressure of the resin 4 ′ flowing into the mold A is applied to each conductive member 1, but each conductive member 1 is fixed to each other by each second element 3. Is suppressed by each second element 3.
  • the temperature of the resin 4 ′ flowing into the mold A is higher than the melting temperature of the soldering part 5, but when the resin 4 ′ contacts the soldering part 5, the resin 4 ′ is placed on the surface of the soldering part 5. It is thought that a solidified layer is formed. Thereby, the temperature rise of the soldering part 5 due to the heat of the resin 4 ′ flowing outside the solidified layer is suppressed by the solidified layer, and remelting of the soldering part 5 is prevented. In this case, in order to prevent remelting of the soldering part 5, it is preferable that the difference between the temperature of the resin 4 'flowing into the mold A and the melting temperature of the soldering part 5 is 90 ° C. or less.
  • the second element 3 is formed of an insulating reinforcing member 3a extending over the conductive member 1 to which the first element 2 is connected, and connection portions 3b provided on both ends of the reinforcing member 3a. Since each connection portion 3b is connected to the conductive member 1, the second element 3 can be formed in the same shape as the first element 2, and the second element 3 can be It can be easily connected to the conductive member 1 together with the element 2. In this case, since the connection portions 3b are insulated by the reinforcing member 3a, the conductive elements 1 are not electrically connected by the second element 3, and the characteristics of the first element 2 may be affected. There is no advantage.
  • first element 2 and the second element 3 are arranged so as to overlap each other in the thickness direction, and each electrode 2b of the first element 2 is connected to each connection portion 3b of the second element 3. Therefore, the mounting space of the first element 2 and the second element 3 in each conductive member 1 can be reduced, and the resin portion 4 can be downsized in the longitudinal direction of each conductive member 1.
  • the first element 2 is arranged on one surface side in the thickness direction of the second element 3, and the connection portion 3 b on the other surface side in the thickness direction of the second element 3 is used as the conductive member 1. Since the connection is made, the first element 2 and the conductive member 1 can be connected to one surface and the other surface in the thickness direction of the second element 3, respectively, and the connection work can be easily performed. .
  • each conductive member 1, each first element 2, and each second element 3 are connected by soldering, and the mold 4 is filled with a resin 4 ′ having a melting temperature higher than that of the soldering part 5. Since the resin part 4 is formed, for example, solder having a low melting point that does not use lead can be used, and it is also effective in preventing deterioration of the first element 2 due to a high temperature during soldering.
  • the second element 3 is connected to the surface of the conductive member 1 formed in a flat plate shape.
  • the second embodiment shown in FIGS. As shown in the figure, when the second element 3 is engaged in the thickness direction with the concave portion 1a provided in the conductive member 1 to connect the conductive member 1 and the second element 3, the conductive member after connection is obtained. 1, the overall height dimension of the first element 2 and the second element 3 can be reduced, and the resin portion 4 can be downsized in the vertical direction. In this case, the second element 3 can be accurately positioned with respect to the conductive member 1 by the engagement between the second element 3 and the recess 1a.
  • the first element 2 is arranged on one surface side in the thickness direction of the second element 3 and the other surface side in the thickness direction of the second element 3 is electrically conductive.
  • the 1st element 2 is the thickness of the 2nd element 6. It may be arranged on one surface side in the direction, and one surface side in the thickness direction of the second element 6 may be connected to the conductive member 1.
  • the second element 6 includes an insulating reinforcing member 6a similar to that of the first embodiment, and connection portions 6b provided on both sides in the width direction of the reinforcing member 6a, and each connection portion 6b is reinforced. It is provided only on one surface in the thickness direction of the member 6a.
  • the first element 2 is placed on one surface in the thickness direction of the second element 6 so that one electrode 2b of the first element 2 is placed in the second direction.
  • the other electrode 2b of the first element 2 is connected to the other connection portion 6b of the second element 6 by soldering.
  • the second element 6 to which the first element 2 is connected is opposite in the thickness direction, and adjacent to each other so that one surface in the thickness direction faces the conductive member 1 side as shown in FIG.
  • one connecting portion 6b of the second element 6 is connected to one conductive member 1 by soldering, and the other of the second elements 6 is mounted. Are connected to the other conductive member 1 by soldering.
  • the first element 2 and the conductive member 1 are respectively disposed on the same surface (one surface in the thickness direction) of the second element 6, and the first element 2 is located between two adjacent conductive members 1. Therefore, the overall height of the conductive member 1, the first element 2, and the second element 3 after connection can be reduced, and the resin portion 4 can be downsized in the vertical direction. .
  • the second element 6 is engaged with the recess 1 a provided in the conductive member 1 in the thickness direction, as in the second embodiment. If the conductive member 1 and the second element 6 are connected, the overall height dimension of the conductive member 1, the first element 2, and the second element 6 after connection can be further reduced. This is extremely advantageous for downsizing the resin portion 4 in the vertical direction.
  • the second element 6 can be accurately positioned with respect to the conductive member 1 by the engagement between the second element 6 and the recess 1a.
  • the said 3rd and 4th embodiment shows the modification of a 2nd element, About another structure and the insert molding method of the resin part 4, it is the same as that of the said 1st Embodiment. .
  • the first element 2 and the second element 3 are connected so as to overlap each other in the thickness direction, but the fifth embodiment and FIG. As shown in the sixth embodiment of FIG. 20, the first element 2 and the second element 3 may be arranged side by side so as to be adjacent in the longitudinal direction of the conductive member 1. In this case, one second element 3 is arranged on one front-rear direction side of one first element 2 as in the fifth embodiment, or one first element as in the sixth embodiment. Two second elements 3 may be arranged on both sides in the front-rear direction.
  • the second element 3 similar to that of the first embodiment is used.
  • the second element 6 similar to that of the third embodiment is used. You may do it.
  • the conductive member 1 may be provided with a recess in which the first element 2 and the second element 3 (6) are engaged.
  • the second element 3 (6) is shown that is fixed across two adjacent conductive members 1 out of the three conductive members 1, but in FIGS.
  • an insulating reinforcing member 7a extending in the width direction so as to extend over the three conductive members 1, and one end side and the other end side in the width direction of the reinforcing member 7a.
  • a plurality of connection portions 7b provided on the center side may be connected to all three conductive members 1.
  • the first element 2 is connected to each of the two conductive members 1 adjacent to each other among the conductive members 1.
  • one first element 2 may be connected to the two conductive members 1 arranged at both ends in the width direction.
  • the other first element 2 is connected to the two conductive members 1 arranged on one end side and the center side in the width direction by using the second element 3 similar to that of the first embodiment.
  • the second element 8 of the present embodiment includes an insulating reinforcing member 8a extending in the width direction so as to extend over the three conductive members 1, and an upper surface, a side surface, and a lower surface on one end side in the width direction of the reinforcing member 8a.
  • a first connection portion 8b provided, a second connection portion 8c provided over the upper surface extending from the width direction center side to the other end side of the reinforcing member 8a, the side surface and the lower surface of the width direction other end side, It consists of the 3rd connection part 8d provided in the lower surface of the width direction center side of the reinforcement member 8a.
  • the first element 2 is disposed on the upper surface (one surface in the thickness direction) of the second element 8.
  • one electrode 2b of the first element 2 is connected to the first connection portion 8b of the second element 8, and the other electrode 2b is connected to the second connection portion 8c of the second element 8.
  • the first connection portion 8b of the second element 8 is connected to the conductive member 1 at one end in the width direction
  • the second connection portion 8c of the second element 8 is connected to the conductive member 1 at the other end in the width direction.
  • the first element 2 is connected to the two conductive members 1 arranged at both ends in the width direction.
  • the third connection portion 8d of the second element 8 is connected to the conductive member 1 on the center side in the width direction.
  • the third connection portion 8 d is not connected to the first element 2, but is fixed to the conductive member 1 on the center side in the width direction, so that the distortion between the conductive members 1 is suppressed by the second element 8. It is effective in doing. Note that the third connection portion 8d may be provided as necessary.
  • each conductive member 1, each first element 2, and each second element 3 are connected by soldering.
  • a conductive adhesive such as silver paste is used. You may make it connect using.
  • SYMBOLS 1 Conductive member, 2 ... 1st element, 3 ... 2nd element, 3a ... Reinforcement member, 3b ... Connection part, 4 ... Resin part, 5 ... Soldering part, 6 ... 2nd element, 6a ... Reinforcement Member, 6b ... connecting portion, 7 ... second element, 7a ... reinforcing member, 7b ... connecting portion, 8 ... second element, 8a ... reinforcing member, 8b ... first connecting portion, 8c ... second connection Part, 8d ... third connection part, A ... mold.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

　各導電部材及び第１の素子を樹脂でインサート成形する際、成形時の樹脂の圧力によって各導電部材から第１の素子に加わる外力を抑制することのできる樹脂成形品及びその製造方法を提供する。各導電部材１同士を固定する第２の素子３を各導電部材１に亘るように各導電部材１に接続したので、各導電部材１及び各第１の素子２を覆う樹脂部をインサート成形する際、金型内に流入する樹脂の圧力が各導電部材１に加わった場合でも、各導電部材１同士の歪みを第２の素子３によって抑制することができる。これにより、各導電部材１から第１の素子２に加わる捩れ、曲げ等の外力を大幅に低減することができ、第１の素子２の特性を低下させることがないという利点がある。

Description

樹脂成形品及びその製造方法
　本発明は、例えば自動車用の圧力センサや回転磁気センサ等の各種機器の製造に用いられ、複数の導電部材に第１の素子を接続したものを樹脂でインサート成形する樹脂成形品及びその製造方法に関するものである。
　従来、例えば自動車用の圧力センサを製造する場合、端子となる複数の導電部材をインサート成形した樹脂成形品をセンサのハウジング内に組み込み、センサの感圧素子と各導電部材とを接続するようにしている。その際、各導電部材にはコンデンサ等の第１の素子をハウジング内で接続しているが、樹脂製のハウジング内ではハンダごてを使用することができないため、第１の素子を導電性エポキシ等の接着剤で各導電部材に接続している。また、導電性エポキシで接続する場合は、導電性を高めるために接続面に銀メッキが用いられるが、銀メッキはマイグレーションを生じやすいため、第１の素子の周囲に封止用の樹脂を充填する必要がある。しかしながら、第１の素子をハウジング内で接続する作業や封止用の樹脂を充填する作業は煩雑であるため、生産性を低下させるという問題点があった。
　そこで、第１の素子を予め各導電部材に亘ってハンダ付けにより接続した後、各導電部材及び第１の素子を覆う樹脂部をインサート成形によって形成するようにすれば（例えば、特許文献１または２参照）、ハウジング内での第１の素子の接続作業や封止用樹脂の充填作業が不要となり、生産性を向上させることができる。
特開２００４－３６３４１０号公報 特開平１１－２６５９６５号公報
　しかしながら、前述のように第１の素子を予め各導電部材に接続した後、樹脂部をインサート成形するようにした場合、各導電部材は第１の素子のみで接続されているため、成形時に金型内に流入する樹脂の圧力によって各導電部材同士の歪みが生ずる。これにより、各導電部材から第１の素子に捩れや曲げ等の外力が加わり、第１の素子の特性を低下させるという問題点があった。
　本発明は前記問題点に鑑みてなされたものであり、その目的とするところは、各導電部材及び第１の素子を樹脂でインサート成形する際、成形時の樹脂の圧力によって各導電部材から第１の素子に加わる外力を抑制することのできる樹脂成形品及びその製造方法を提供することにある。
　本発明は前記目的を達成するために、互いに幅方向に間隔をおいて配置された複数の導電部材と、各導電部材に亘るように配置される第１の素子と、各導電部材及び第１の素子を覆うように樹脂でインサート成形された樹脂部とを備えた樹脂成形品において、前記各導電部材に亘るように各導電部材に接続され、各導電部材同士を固定する第２の素子を備えている。
　また、本発明は前記目的を達成するために、互いに幅方向に間隔をおいて配置された複数の導電部材に、各導電部材に亘るように第１の素子を配置し、各導電部材及び第１の素子を覆う樹脂部をインサート成形によって形成する樹脂成形品の製造方法において、前記各導電部材同士を固定する第２の素子を各導電部材に亘るように各導電部材に接続し、各導電部材、第１の素子及び第２の素子をインサート成形用の金型内に配置するとともに、溶融した樹脂を金型内に充填することにより樹脂部を形成するようにしている。
　これにより、各導電部材同士を固定する第２の素子が各導電部材に亘るように各導電部材に接続されることとから、各導電部材及び第１の素子を覆う樹脂部をインサート成形する際、金型内に流入する樹脂の圧力が各導電部材に加わった場合でも、各導電部材同士の歪みが第２の素子によって抑制される。
　本発明によれば、各導電部材及び第１の素子を覆う樹脂部をインサート成形する際、金型内に流入する樹脂の圧力が各導電部材に加わった場合でも、各導電部材同士の歪みを抑制することができるので、各導電部材から第１の素子に加わる捩れ、曲げ等の外力を大幅に低減することができ、第１の素子の特性を低下させることがないという利点がある。
本発明の第１の実施形態を示す樹脂成形品の斜視図 導電部材、第１の素子及び第２の素子の接続状態を示す斜視図 第１の素子の斜視図 第２の素子の斜視図 第１の素子及び第２の素子の接続工程を示す正面図 導電部材、第１の素子及び第２の素子の接続工程を示す一部断面正面図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図 成形工程を示す側面断面図 成形工程を示す側面断面図 成形工程を示す側面断面図 本発明の第２の実施形態に係る導電部材、第１の素子及び第２の素子の接続工程を示す一部断面正面図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図 本発明の第３の実施形態を示す第１の素子の斜視図 第１の素子及び第２の素子の接続工程を示す正面図 導電部材、第１の素子及び第２の素子の接続工程を示す一部断面正面図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図 本発明の第４の実施形態に係る導電部材、第１の素子及び第２の素子の接続工程を示す一部断面正面図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図 本発明の第５の実施形態に係る導電部材、第１の素子及び第２の素子の接続状態を示す斜視図 本発明の第６の実施形態に係る導電部材、第１の素子及び第２の素子の接続状態を示す斜視図 本発明の第７の実施形態に係る導電部材、第１の素子及び第２の素子の接続工程を示す一部断面正面図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図 本発明の第８の実施形態に係る導電部材、第１の素子及び第２の素子の接続状態を示す斜視図 第２の素子の斜視図 導電部材、第１の素子及び第２の素子の接続状態を示す一部断面正面図
　図１乃至図１０は本発明の第１の実施形態を示すものである。同図に示す樹脂成形品は、例えば自動車用の圧力センサや回転磁気センサ等の各種機器の製造に用いられるものである。
　本実施形態の樹脂成形品は、互いに幅方向に間隔をおいて配置された３本の導電部材１と、各導電部材１間に亘るように配置される２つの第１の素子２と、各導電部材１に固定される２つの第２の素子３と、各導電部材１、各第１の素子２及び各第２の素子３を覆う樹脂部４とからなる。
　各導電部材１は、平板状に延びる導電性の金属からなり、図示しない接続相手と接続される端子として用いられる。
　各第１の素子２は、例えばコンデンサ、抵抗、バリスタ、インダクタ等の電子部品からなり、各導電部材１のうち互いに隣り合う導電部材１にそれぞれハンダ付けにより固定された第２の素子３に接続されるようになっている。第１の素子２は、所期の電気的特性を有する素材によって形成された板状の部品本体２ａと、部品本体２ａの幅方向両端側にそれぞれ設けられた一対の電極２ｂとからなり、各電極２ｂは部品本体２ａの幅方向両端部を覆うように形成されている。
　第２の素子３は、例えば高温焼成セラミック、窒化アルミニウム等、強度の高い絶縁性の素材からなる補強部材３ａと、補強部材３ａの幅方向両端側にそれぞれ設けられた一対の接続部３ｂとからなり、各導電部材１のうち互いに隣り合う導電部材１にそれぞれハンダ付けにより接続されるようになっている。補強部材３ａは前後方向及び幅方向の寸法が第１の素子２よりも若干大きい板状に形成され、幅方向の寸法は隣り合う２つの導電部材１の間隔よりも大きくなっている。各接続部３ｂは導電性の金属層からなり、補強部材３ａの幅方向両端面から厚さ方向一方の面及び他方の面に亘って形成されている。
　樹脂部４は、例えばＰＢＴ等の合成樹脂からなり、各導電部材１の長手方向中央側を覆うように形成されている。尚、図では直方体状の樹脂部４を示したが、その形状は樹脂成形品が組み込まれる相手側の部品の形状等に応じて任意の形状に形成される。樹脂部４は、各導電部材１に接続された各第１の素子２及び各第２の素子３を樹脂でインサート成形することによって形成され、その内部には各導電部材１、各第１の素子２及び各第２の素子３が埋設される。この場合、樹脂部４の樹脂には、各導電部材１、各第１の素子２及び各第２の素子３を接続するハンダ付け部５の溶融温度（例えば２２０℃）よりも高い溶融温度（例えば２６０℃）のものが用いられる。
　前記樹脂成形品を製造する場合は、まず、図５に示すように第２の素子３の厚さ方向一方の面に第１の素子２を重ねるように載置し、第１の素子２の一方の電極２ｂを第２の素子３の一方の接続部３ｂにハンダ付けにより接続するとともに、第１の素子２の他方の電極２ｂを第２の素子３の他方の接続部３ｂにハンダ付けにより接続する。次に、第１の素子２が接続された第２の素子３を、図６に示すように厚さ方向他方の面が導電部材１側に臨むように隣り合う２つの導電部材１に亘って載置し、図７に示すように第２の素子３の一方の接続部３ｂを一方の導電部材１にハンダ付けにより接続するとともに、第２の素子３の他方の接続部３ｂを他方の導電部材１にハンダ付けにより接続する。この場合、図２に示すように、互いに接続された一方の第１の素子２及び第２の素子３を、各導電部材１のうち幅方向一端側の導電部材１と中央側の導電部材１に接続し、互いに接続された他方の第１の素子２及び第２の素子３を、各導電部材１のうち幅方向他端側の導電部材１と中央側の導電部材１に接続する。尚、前記ハンダ付けは、ハンダ材とハンダごてを用いて行ってもよいが、第２の素子３の各接続部３ｂにハンダペースト等により予めハンダ層を形成しておき、リフローによってハンダを溶融して接続するようにしてもよい。
　次に、図８に示すように導電部材１の長手方向中央側、各第１の素子２及び各第２の素子３を金型Ａ内に配置し、図９に示すように金型Ａ内に樹脂４′を充填する。その際、金型Ａ内に流入する樹脂４′の圧力が各導電部材１に加わるが、各導電部材１は各第２の素子３によって互いに固定されているため、各導電部材１同士の歪みが各第２の素子３によって抑制される。
　また、金型Ａ内に流入する樹脂４′の温度はハンダ付け部５の溶融温度よりも高いが、樹脂４′がハンダ付け部５に接触すると、ハンダ付け部５の表面に樹脂４′の固化層が形成されると考えられる。これにより、固化層の外側を流れる樹脂４′の熱によるハンダ付け部５の温度上昇が固化層によって抑制され、ハンダ付け部５の再溶融が防止される。この場合、ハンダ付け部５の再溶融を防止する上で、金型Ａ内に流入する樹脂４′の温度とハンダ付け部５の溶融温度との差は９０℃以下とすることが好ましい。
　そして、樹脂４′が硬化した後、金型Ａを除去することにより、図１０に示すように樹脂部４が各導電部材１、各第１の素子２及び各第２の素子３と一体に形成される。
　このように、本実施形態によれば、各導電部材１同士を固定する第２の素子３を各導電部材１に亘るように各導電部材１に接続したので、各導電部材１及び各第１の素子２を覆う樹脂部４をインサート成形する際、金型Ａ内に流入する樹脂４′の圧力が各導電部材１に加わった場合でも、各導電部材１同士の歪みを第２の素子３によって抑制することができる。これにより、各導電部材１から第１の素子２に加わる捩れ、曲げ等の外力を大幅に低減することができ、第１の素子２の特性を低下させることがないという利点がある。
　また、第２の素子３を、第１の素子２が接続される導電部材１に亘って延びる絶縁性の補強部材３ａと、補強部材３ａの両端側にそれぞれ設けられた接続部３ｂとから形成し、各接続部３ｂをそれぞれ導電部材１に接続するようにしたので、第２の素子３を第１の素子２と同等の形状に形成することができ、第２の素子３を第１の素子２と共に導電部材１に容易に接続することができる。この場合、各接続部３ｂ間は補強部材３ａによって絶縁されているので、第２の素子３によって各導電部材１間が導通することがなく、第１の素子２の特性に影響を与えることがないという利点がある。
　更に、第１の素子２と第２の素子３とを互いに厚さ方向に重なり合うように配置し、第１の素子２の各電極２ｂを第２の素子３の各接続部３ｂに接続するようにしたので、各導電部材１における第１の素子２及び第２の素子３の実装スペースを小さくすることができ、樹脂部４を各導電部材１の長手方向に小型化することができる。
　この場合、第１の素子２を、第２の素子３の厚さ方向一方の面側に配置するとともに、第２の素子３の厚さ方向他方の面側の接続部３ｂを導電部材１に接続するようにしたので、第２の素子３の厚さ方向一方の面と他方の面に第１の素子２と導電部材１をそれぞれ接続することができ、接続作業を容易に行うことができる。
　また、各導電部材１、各第１の素子２及び各第２の素子３をハンダ付けにより接続し、ハンダ付け部５よりも溶融温度の高い樹脂４′を金型Ａ内に充填することにより樹脂部４を形成するようにしたので、例えば鉛を使用していない低融点のハンダを用いることができるとともに、ハンダ付け時の高温による第１の素子２の劣化防止にも効果的である。
　尚、前記第１の実施形態では、平板状に形成した導電部材１の表面に第２の素子３を接続するようにしたものを示したが、図１１及び図１２の第２の実施形態に示すように、導電部材１に設けた凹部１ａに第２の素子３を厚さ方向に係合し、導電部材１と第２の素子３とを接続するようにすれば、接続後の導電部材１、第１の素子２及び第２の素子３の全体の高さ寸法を小さくすることができ、樹脂部４を上下方向に小型化することができる。この場合、第２の素子３と凹部１ａとの係合により、第２の素子３を導電部材１に対して正確に位置決めすることもできる。
　また、前記第１の実施形態では、第１の素子２を、第２の素子３の厚さ方向一方の面側に配置するとともに、第２の素子３の厚さ方向他方の面側を導電部材１に接続するようにしたものを示したが、図１３乃至図１６の第３の実施形態に示す第２の素子６のように、第１の素子２を第２の素子６の厚さ方向一方の面側に配置するとともに、第２の素子６の厚さ方向一方の面側を導電部材１に接続するようにしてもよい。
　即ち、第２の素子６は、第１の実施形態と同様の絶縁性の補強部材６ａと、補強部材６ａの幅方向両側にそれぞれ設けられた接続部６ｂとからなり、各接続部６ｂは補強部材６ａの厚さ方向一方の面のみに設けられている。
　本実施形態では、図１４に示すように第２の素子６の厚さ方向一方の面に第１の素子２を重ねるように載置し、第１の素子２の一方の電極２ｂを第２の素子６の一方の接続部６ｂにハンダ付けにより接続するとともに、第１の素子２の他方の電極２ｂを第２の素子６の他方の接続部６ｂにハンダ付けにより接続する。次に、第１の素子２が接続された第２の素子６を厚さ方向に反対向きにして、図１５に示すように厚さ方向一方の面が導電部材１側に臨むように隣り合う２つの導電部材１に亘って載置し、図１６に示すように第２の素子６の一方の接続部６ｂを一方の導電部材１にハンダ付けにより接続するとともに、第２の素子６の他方の接続部６ｂを他方の導電部材１にハンダ付けにより接続する。
　これにより、第１の素子２及び導電部材１はそれぞれ第２の素子６の同一の面（厚さ方向一方の面）に配置され、第１の素子２は隣り合う２つの導電部材１の間に配置されるので、接続後の導電部材１、第１の素子２及び第２の素子３の全体の高さ寸法を小さくすることができ、樹脂部４を上下方向に小型化することができる。
　この場合、図１７乃至図１８の第４の実施形態に示すように、第２の実施形態と同様、導電部材１に設けた凹部１ａに第２の素子６を厚さ方向に係合し、導電部材１と第２の素子６とを接続するようにすれば、接続後の導電部材１、第１の素子２及び第２の素子６の全体の高さ寸法をより一層小さくすることができ、樹脂部４を上下方向に小型化する上で極めて有利である。この場合、第２の実施形態と同様、第２の素子６と凹部１ａとの係合により、第２の素子６を導電部材１に対して正確に位置決めすることもできる。
　尚、前記第３及び第４の実施形態は、第２の素子の変形例を示すものであり、その他の構成及び樹脂部４のインサート成形方法については、前記第１の実施形態と同様である。
　また、前記第１乃至第４の実施形態では、第１の素子２及び第２の素子３を互いに厚さ方向に重なり合うように接続したものを示したが、図１９の第５の実施形態及び図２０の第６の実施形態に示すように、第１の素子２及び第２の素子３を導電部材１の長手方向に隣接するように並べて配置するようにしてもよい。この場合、第５の実施形態のように１つの第１の素子２の前後方向一方に１つの第２の素子３を配置したり、或いは第６の実施形態のように１つの第１の素子２の前後方向両側に２つの第２の素子３を配置するようにしてもよい。
　尚、前記第５及び第６の実施形態では、第１の実施形態と同様の第２の素子３を用いたものを示したが、第３の実施形態と同様の第２の素子６を用いるようにしてもよい。この場合、第２または第４の実施形態と同様、導電部材１に第１の素子２及び第２の素子３（６）が係合する凹部を設けるようにしてもよい。
　また、前記各実施形態では、３本の導電部材１のうち、隣り合う２つの導電部材１ごとに亘って固定される第２の素子３（６）を示したが、図２１及び図２２の第７の実施形態に示す第２の素子７のように、３本の導電部材１に亘るように幅方向に延びる絶縁性の補強部材７ａと、補強部材７ａの幅方向一端側、他端側及び中央側にそれぞれ設けられた複数の接続部７ｂとから形成されたものを３本の導電部材１の全てに接続するようにしてもよい。
　更に、前記各実施形態では、各導電部材１のうち互いに隣接する２つの導電部材１にそれぞれ第１の素子２を１つずつ接続するようにしたものを示したが、図２３乃至図２５の第８の実施形態に示す第２の素子８のように、幅方向両端に配置される２つの導電部材１に一方の第１の素子２を接続するようにしてもよい。この場合、幅方向一端側と中央側に配置される２つの導電部材１には、他方の第１の素子２が第１の実施形態と同様の第２の素子３を用いて接続される。
　本実施形態の第２の素子８は、３本の導電部材１に亘るように幅方向に延びる絶縁性の補強部材８ａと、補強部材８ａの幅方向一端側の上面、側面及び下面に亘って設けられた第１の接続部８ｂと、補強部材８ａの幅方向中央側から他端側に亘る上面、幅方向他端側の側面及び下面に亘って設けられた第２の接続部８ｃと、補強部材８ａの幅方向中央側の下面に設けられた第３の接続部８ｄとからなる。
　本実施形態では、第２の素子８の上面（厚さ方向一方の面）に第１の素子２が配置される。この場合、第１の素子２の一方の電極２ｂは第２の素子８の第１の接続部８ｂに接続され、他方の電極２ｂは第２の素子８の第２の接続部８ｃに接続される。第２の素子８の第１の接続部８ｂは幅方向一端側の導電部材１に接続され、第２の素子８の第２の接続部８ｃは幅方向他端側の導電部材１に接続される。これにより、幅方向両端に配置される２つの導電部材１に第１の素子２が接続される。また、第２の素子８の第３の接続部８ｄは、幅方向中央側の導電部材１に接続される。この場合、第３の接続部８ｄは第１の素子２には接続されないが、幅方向中央側の導電部材１に固定されるので、各導電部材１同士の歪みを第２の素子８によって抑制する上で効果的である。尚、第３の接続部８ｄは、必要に応じて設けるようにしてもよい。
　また、前記各実施形態では、各導電部材１、各第１の素子２及び各第２の素子３をハンダ付けにより接続するようにしたものを示したが、例えば銀ペースト等の導電性接着剤を用いて接続するようにしてもよい。
　１…導電部材、２…第１の素子、３…第２の素子、３ａ…補強部材、３ｂ…接続部、４…樹脂部、５…ハンダ付け部、６…第２の素子、６ａ…補強部材、６ｂ…接続部、７…第２の素子、７ａ…補強部材、７ｂ…接続部、８…第２の素子、８ａ…補強部材、８ｂ…第１の接続部、８ｃ…第２の接続部、８ｄ…第３の接続部、Ａ…金型。

Claims (9)

  1. 　互いに幅方向に間隔をおいて配置された複数の導電部材と、各導電部材に亘るように配置される第１の素子と、各導電部材及び第１の素子を覆うように樹脂でインサート成形された樹脂部とを備えた樹脂成形品において、
    　前記各導電部材に亘るように各導電部材に接続され、各導電部材同士を固定する第２の素子を備えた
    　ことを特徴とする樹脂成形品。
  2. 　前記第２の素子を、各導電部材に亘って延びる絶縁性の補強部材と、各導電部材にそれぞれ接続される複数の接続部とから形成した
    　ことを特徴とする請求項１記載の樹脂成形品。
  3. 　前記第１の素子と第２の素子とを互いに厚さ方向に重なり合うように配置し、第１の素子を第２の素子の接続部に接続した
    　ことを特徴とする請求項２記載の樹脂成形品。
  4. 　前記第１の素子を第２の素子の厚さ方向一方の面側に配置し、第２の素子の厚さ方向他方の面側を導電部材に接続した
    　ことを特徴とする請求項３記載の樹脂成形品。
  5. 　前記第１の素子を第２の素子の厚さ方向一方の面側に配置し、第１の素子が各導電部材の間に位置するように第２の素子の厚さ方向一方の面側を導電部材に接続した
    　ことを特徴とする請求項３記載の樹脂成形品。
  6. 　前記各導電部材に、第２の素子が厚さ方向に係合する凹部を設けた
    　ことを特徴とする請求項１、２、３、４または５記載の樹脂成形品。
  7. 　互いに幅方向に間隔をおいて配置された複数の導電部材に、各導電部材に亘るように第１の素子を配置し、各導電部材及び第１の素子を覆う樹脂部をインサート成形によって形成する樹脂成形品の製造方法において、
    　前記各導電部材同士を固定する第２の素子を各導電部材に亘るように各導電部材に接続し、
    　各導電部材、第１の素子及び第２の素子をインサート成形用の金型内に配置するとともに、
    　溶融した樹脂を金型内に充填することにより樹脂部を形成する
    　ことを特徴とする樹脂成形品の製造方法。
  8. 　前記各導電部材、第１の素子及び第２の素子をハンダ付けにより接続し、
    　ハンダ付け部よりも溶融温度の高い樹脂を前記金型内に充填することにより前記樹脂部を形成する
    　ことを特徴とする請求項７記載の樹脂成形品の製造方法。
  9. 　前記金型内に充填される樹脂の溶融温度と前記ハンダ付け部の溶融温度との温度差は９０℃以下である
    　ことを特徴とする請求項８記載の樹脂成形品の製造方法。
PCT/JP2012/056383 2011-03-17 2012-03-13 樹脂成形品及びその製造方法 WO2012124682A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP12758262.5A EP2687350A4 (en) 2011-03-17 2012-03-13 RESIN MOLDED PRODUCT AND PROCESS FOR PRODUCTION THEREOF
US14/005,410 US20140069716A1 (en) 2011-03-17 2012-03-13 Resin molded product and method for producing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011059672A JP5296823B2 (ja) 2011-03-17 2011-03-17 樹脂成形品及びその製造方法
JP2011-059672 2011-03-17

Publications (1)

Publication Number Publication Date
WO2012124682A1 true WO2012124682A1 (ja) 2012-09-20

Family

ID=46830749

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/056383 WO2012124682A1 (ja) 2011-03-17 2012-03-13 樹脂成形品及びその製造方法

Country Status (4)

Country Link
US (1) US20140069716A1 (ja)
EP (1) EP2687350A4 (ja)
JP (1) JP5296823B2 (ja)
WO (1) WO2012124682A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458376B2 (ja) * 2014-07-03 2019-01-30 株式会社デンソー 樹脂成型品の製造方法
JP2016103429A (ja) * 2014-11-28 2016-06-02 富士通コンポーネント株式会社 コネクタ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445818Y1 (ja) * 1966-09-13 1969-03-03
JPH10116934A (ja) * 1996-10-09 1998-05-06 Fuji Electric Co Ltd 樹脂封止半導体装置およびその製造方法
JPH11265965A (ja) 1998-03-17 1999-09-28 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JPH11291286A (ja) * 1998-04-09 1999-10-26 Hitachi Ltd 電気接続子の射出成形方法及び発熱抵抗式流量測定装置の電気接続子
JP2003225931A (ja) * 2002-02-01 2003-08-12 Sumitomo Electric Ind Ltd 光モジュールの製造方法
JP2004363410A (ja) 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法
JP2007320268A (ja) * 2006-06-03 2007-12-13 Apic Yamada Corp 樹脂封止型電子部品の製造方法および樹脂封止型電子部品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772225A (en) * 1987-11-19 1988-09-20 Amp Inc Electrical terminal having means for mounting electrical circuit components in series thereon and connector for same
US5583377A (en) * 1992-07-15 1996-12-10 Motorola, Inc. Pad array semiconductor device having a heat sink with die receiving cavity
JPH0676894A (ja) * 1992-08-28 1994-03-18 Murata Mfg Co Ltd コネクタ
JP2002074300A (ja) * 2000-08-31 2002-03-15 Shinko Electric Ind Co Ltd 非接触型ｉｃカ−ド及びその製造方法
JP2002184908A (ja) * 2000-12-19 2002-06-28 Sony Corp 電子回路装置
WO2002095335A1 (de) * 2001-05-23 2002-11-28 Continental Teves Ag & Co. Ohg Elektronischer sensor mit elektronischen sensorbauelementen und verfahren zu dessen herstellung
AT411639B (de) * 2002-04-26 2004-03-25 Pollmann Austria Ohg Verfahren zum herstellen einer kunststoffumspritzten leiterstruktur sowie elektrische schaltungseinheit mit einer kunststoffumspritzten leiterstruktur
JP3956920B2 (ja) * 2003-08-26 2007-08-08 松下電工株式会社 コネクタ
DE102004044614B4 (de) * 2004-09-13 2007-10-25 Hans Huonker Gmbh Verfahren zur Herstellung von mehrfach umspritzten Elektronikbauteilen
JP2006329668A (ja) * 2005-05-23 2006-12-07 Alps Electric Co Ltd 検出装置及びその製造方法
US7268429B2 (en) * 2005-06-27 2007-09-11 Delphi Technologies, Inc. Technique for manufacturing an overmolded electronic assembly
KR101145011B1 (ko) * 2006-11-03 2012-05-11 한라공조주식회사 전자 클러치용 슬리브 커넥터 및 그 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445818Y1 (ja) * 1966-09-13 1969-03-03
JPH10116934A (ja) * 1996-10-09 1998-05-06 Fuji Electric Co Ltd 樹脂封止半導体装置およびその製造方法
JPH11265965A (ja) 1998-03-17 1999-09-28 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JPH11291286A (ja) * 1998-04-09 1999-10-26 Hitachi Ltd 電気接続子の射出成形方法及び発熱抵抗式流量測定装置の電気接続子
JP2003225931A (ja) * 2002-02-01 2003-08-12 Sumitomo Electric Ind Ltd 光モジュールの製造方法
JP2004363410A (ja) 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法
JP2007320268A (ja) * 2006-06-03 2007-12-13 Apic Yamada Corp 樹脂封止型電子部品の製造方法および樹脂封止型電子部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2687350A4

Also Published As

Publication number Publication date
EP2687350A4 (en) 2014-09-03
US20140069716A1 (en) 2014-03-13
JP2012192688A (ja) 2012-10-11
JP5296823B2 (ja) 2013-09-25
EP2687350A1 (en) 2014-01-22

Similar Documents

Publication Publication Date Title
US11887772B2 (en) Surface mount inductor
KR101563092B1 (ko) 인덕턴스 소자
CN104979221A (zh) 半导体装置的制造方法及半导体装置
CN111587486A (zh) 半导体装置以及半导体装置的制造方法
TWI717485B (zh) 面安裝型電阻器
WO2012124682A1 (ja) 樹脂成形品及びその製造方法
US10650975B2 (en) Multilayer electronic component
KR101232241B1 (ko) 세라믹 전자부품
JP4887973B2 (ja) 面実装型電流ヒューズの製造方法
KR20160007197A (ko) 탄탈륨 캐패시터
KR102527716B1 (ko) 탄탈륨 커패시터
JP2014036217A (ja) タンタルキャパシタ及びその製造方法
CN104115244A (zh) 电子部件及其制造方法
JP2020191389A (ja) 抵抗器
KR101548865B1 (ko) 탄탈륨 캐패시터
JP5163057B2 (ja) サーミスタ
JP5941080B2 (ja) タンタルキャパシタ及びその製造方法
KR20150049918A (ko) 탄탈륨 캐패시터 및 그 제조 방법
KR20160054809A (ko) 탄탈륨 캐패시터 및 그 제조 방법
CN113363031B (zh) 面安装型电阻器
KR101585583B1 (ko) 전기 접촉 단자
CN112154523B (zh) 电阻器
CN108140489B (zh) 固体电解电容器
JP2009182230A (ja) 樹脂封止型半導体装置及びその製造方法
JP4307439B2 (ja) 固体電解コンデンサの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12758262

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2012758262

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 14005410

Country of ref document: US