WO2012116503A1 - 大功率led灯泡 - Google Patents

大功率led灯泡 Download PDF

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Publication number
WO2012116503A1
WO2012116503A1 PCT/CN2011/071949 CN2011071949W WO2012116503A1 WO 2012116503 A1 WO2012116503 A1 WO 2012116503A1 CN 2011071949 W CN2011071949 W CN 2011071949W WO 2012116503 A1 WO2012116503 A1 WO 2012116503A1
Authority
WO
WIPO (PCT)
Prior art keywords
led light
capacitor
resistor
circuit
circuit board
Prior art date
Application number
PCT/CN2011/071949
Other languages
English (en)
French (fr)
Inventor
翁小翠
Original Assignee
Weng Xiaocui
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011100476156A external-priority patent/CN102095111A/zh
Priority claimed from CN201120055537XU external-priority patent/CN202018010U/zh
Priority claimed from CN2011200599823U external-priority patent/CN201995159U/zh
Priority claimed from CN201120059940XU external-priority patent/CN202019481U/zh
Application filed by Weng Xiaocui filed Critical Weng Xiaocui
Publication of WO2012116503A1 publication Critical patent/WO2012116503A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the invention relates to a high power LED bulb.
  • a conventional heat sink member such as the Chinese patent application No. 200910115650.X, discloses a heat sink structure in which an upper portion and a lower portion of the inner chamber are integrally connected, and a reflective metal sheet is arranged upright in a cylindrical shape to dissipate heat.
  • the tube and the lamp holder are positioned and connected, and after the lamp cap is processed, the heat sink is assembled with the lamp cap; the technical defects are: complicated structure, troublesome manufacturing process, high cost and poor heat dissipation performance.
  • the present invention provides a novel high-power LED with simplified structure, simple manufacturing process, low cost and excellent heat dissipation performance. light bulb.
  • a novel high-power LED light bulb comprising a connector, a circuit board, an LED light source and a bulb cover, wherein the LED light source is located in the bulb cover, the connector and the connector
  • the circuit board is electrically connected, and the circuit board is connected to the LED light source.
  • the new high-power LED light bulb further includes a connecting sleeve, and the upper part of the connecting sleeve is connected with the joint, and the lower part of the connecting sleeve and the light a blister is connected, the circuit board is located at a middle portion of the connecting sleeve, an LED substrate is mounted on a bottom surface of the connecting sleeve, a bottom surface of the LED substrate is mounted with the LED light source, and a top surface of the LED substrate is mounted for use
  • the chemical refrigerant realizes a cooling box for dissipating heat, and an upper portion of the refrigerating tank is connected to the circuit board.
  • a bottom surface of the refrigeration box is integrated with a top surface of the LED substrate.
  • a top surface of the refrigeration box is coupled to the fixed bracket, and the circuit board is located on the fixed bracket.
  • an outer side of the LED substrate is provided with an upwardly extending heat dissipation ring, and the heat dissipation ring is connected to the connection sleeve.
  • the refrigeration box comprises a box body and a box cover, the outer side of the upper part of the box body is provided with an external thread, the inner wall of the box cover is provided with an internal thread, and the box cover is mounted on the box body, the fixing bracket and the box Cover connection.
  • the bottom surface of the LED substrate is arranged side by side with a plurality of grooves, and the inner wall of the groove is provided with a reflective layer for reflecting and focusing the light of the LED light source, and the LED light source is located in the groove.
  • the groove has a semicircular or inverted parabola cross section.
  • a heat conducting layer is disposed between the inner wall of the groove and the reflective layer, and an upper end of the heat conducting layer is lower than a bottom surface of the LED substrate, and the printed circuit is disposed on a bottom surface of the LED substrate.
  • the driving circuit of the circuit board includes a first capacitor, a first resistor, a rectifying circuit, a filter capacitor and a second resistor, wherein the mains access terminal is connected to the first capacitor, and the first resistor and the first capacitor are connected in parallel, The other end of the first capacitor is connected to an input side of the rectifier circuit, both ends of the output side of the rectifier circuit are connected to a filter capacitor, and the second resistor is connected in parallel with the filter capacitor, and the filter capacitor is Both ends are connected to two drive circuit output interfaces.
  • the driving circuit of the circuit board includes a first capacitor, a first resistor, a rectifying circuit, a filter capacitor, a second resistor, and a power factor boosting circuit, wherein the mains access terminal is connected to the first capacitor, the first resistor and The first capacitor is connected in parallel, and the other end of the first capacitor is connected to the input side of the rectifier circuit, and the positive terminal of the output side of the rectifier circuit is simultaneously connected to the second resistor end and the filter capacitor positive pole, and the rectifier circuit is The negative end of the output side is coupled to the other end of the second resistor, and the power factor boosting circuit includes a second diode, a third diode, a fourth diode, and an auxiliary filter capacitor, and the negative of the filter capacitor Simultaneously connected to the opposite end of the second diode and the forward end of the third diode, the forward end of the second diode is connected to the negative end of the output side of the rectifier circuit, the rectification The positive end of the output side of
  • the technical idea of the present invention is as follows: a refrigeration box that uses a chemical refrigerant to dissipate heat, and a refrigeration box is disposed on the LED substrate to achieve good heat dissipation.
  • the starting temperature is usually selected from 20 ° C to 60 ° C, and 50 ° C is taken as an example.
  • the LED substrate is illuminated. The temperature will gradually increase, and the temperature of the chemical refrigerant will also rise.
  • the temperature of the chemical refrigerant reaches 50 ° C, the refrigerant begins to react chemically, absorbing the LED substrate.
  • the heat which has good heat dissipation performance, can well ensure the operating temperature of the LED substrate; when the LED light source is extinguished, the chemical refrigerant is restored to the initial state.
  • the beneficial effects of the invention are mainly manifested in: 1. Simplified structure, simple manufacturing process, and formation This is low, good heat dissipation performance; 2. Improve light utilization and improve heat dissipation performance; 3. Avoid transformers, simplify circuit composition, no high frequency oscillation, no electromagnetic radiation, reduce energy consumption, and improve power conversion Efficiency; 4. Using current limiting resistor, effectively reduce the working current of the LED lamp when the power supply voltage fluctuates abnormally, and protect the LED; 5. Add a power factor boosting circuit composed of three diodes and a third capacitor. Can effectively adapt to high power factor applications. DRAWINGS
  • Figure 1 is a schematic view of the structure of a high-power LED bulb.
  • FIG. 2 is a schematic structural view of a high power LED substrate.
  • Figure 3 is a schematic view of the installation of a single LED light source.
  • Figure 4 is a schematic view of the installation of another single LED light source.
  • Figure 5 is a schematic view showing the installation of still another single LED light source.
  • Fig. 6 is a schematic view showing a driving circuit of a small current high voltage LED lamp.
  • Fig. 7 is a schematic diagram of a driving circuit of a high power factor small current high voltage LED lamp. detailed description
  • a novel high-power LED light bulb includes a connector 1, a circuit board 2, an LED light source 3, and a bulb cover 4.
  • the LED light source 3 is located in the bulb cover 4, and the connector 1 and the The circuit board 2 is electrically connected, and the circuit board 2 is connected to the LED light source 3.
  • the new high-power LED light bulb further includes a connecting sleeve 5, and an upper part of the connecting sleeve 5 is connected with the joint 1, the connecting sleeve 5 is connected to the bulb cover 4, the circuit board 2 is located in the middle of the connecting sleeve 5, the LED substrate 6 is mounted on the bottom surface of the connecting sleeve 5, and the LED light source 3 is mounted on the bottom surface of the LED substrate 6.
  • the top surface of the LED substrate 6 is mounted with a cooling box 7 for dissipating heat by using a chemical refrigerant, and the upper side of the refrigerating box 7 The portion is connected to the circuit board 2.
  • the upper portion of the bulb cover 4 is snap-fitted to the LED substrate 6. Of course, other assembly methods are also possible.
  • the bottom surface of the refrigeration box 7 is integral with the top surface of the LED substrate 6. This structure is advantageous for achieving good heat dissipation.
  • the top surface of the refrigerating case 7 is connected to a fixing bracket 8, and the circuit board 2 is located on the fixing bracket 8.
  • the LED substrate 6 is provided with a through hole for wiring mounting.
  • An outer side of the LED substrate 6 is provided with an upwardly extending heat dissipating ring 9, and the heat dissipating ring 9 is connected to the connecting sleeve 5.
  • the size of the heat-dissipating ring can be according to the requirements of the high-power LED bulb. If the power is relatively small, the heat-dissipating ring can be smaller. If the power is larger, the heat-dissipating ring can be extended upward to increase the heat-dissipating area; Materials can also be selected from materials that are easy to dissipate, such as aluminum.
  • the heat-dissipating ring can dissipate the heat of the LED substrate, and has a good auxiliary heat-dissipating function due to the large area of the heat-dissipating ring.
  • the bulb cover 4 is circular, diamond, elliptical or square. Of course, other shapes are also possible.
  • the refrigeration box comprises a box body and a box cover, the outer side of the upper part of the box body is provided with an external thread, the inner wall of the box cover is provided with an internal thread, and the box cover is mounted on the box body, the fixing bracket and the box Cover connection.
  • the box cover is mounted on the box body, the fixing bracket and the box Cover connection.
  • other assembly methods can be used between the box and the cover.
  • the fixing bracket is integral with the box cover.
  • the starting temperature at which the cooling effect is started is set, and the temperature is usually selected to be 20 ° C to 60 ° C.
  • the temperature of the LED substrate will gradually rise, and the temperature of the chemical refrigerant will also rise.
  • the temperature of the chemical refrigerant reaches 50 ° C, the refrigerant The chemical reaction begins to absorb the heat of the LED substrate, and the heat dissipation performance is good, and the operating temperature of the LED substrate can be well ensured; when the LED light source is extinguished, the chemical refrigerant is restored to the initial state.
  • a plurality of grooves 10 are arranged side by side on the bottom surface of the LED substrate 6.
  • the inner wall of the groove 10 is provided with a reflective layer for reflecting and focusing the light of the LED light source, and the LED light source 3 is located in the groove 10 Inside.
  • the groove 10 has a semicircular or inverted parabola cross section.
  • the semi-circular or inverted parabolic structure can reflect the light well and greatly improve the light utilization efficiency.
  • the groove structure increases the heat dissipation area and improves the heat dissipation effect.
  • the reflective layer 11 of this embodiment may be an aluminum plated layer.
  • other reflective plating structures such as galvanization or nickel plating may also be used.
  • a heat conducting layer 12 is disposed between the inner wall of the groove 10 and the reflective layer 11.
  • the upper end of the heat conducting layer is lower than the bottom surface of the LED substrate, and the printed circuit is disposed on the bottom surface of the LED substrate. Do not touch the printed circuit, otherwise it will easily cause a short circuit fault.
  • the heat conducting layer 12 has good thermal conductivity, can discharge the heat generated by the LED chip in time, and improves the heat dissipation performance.
  • the heat conducting layer is preferably a copper material. Of course, other materials having excellent heat conducting properties can also be used.
  • the LED chip is located at the bottom of the recess 10.
  • the bottom surface of the LED chip is attached to the bottom of the recess for improving the heat dissipation effect.
  • the bottom surface of the LED chip may also be opposite to the recess. The bottom of the groove does not fit.
  • the LED substrate 6 has a circular shape, a diamond shape, an elliptical shape or a square shape. Of course, you can also Use other shapes. In addition, the size of the substrate body can be determined according to the number of LED chips.
  • the side surface of the substrate body is provided with a guiding groove 13.
  • the power interface is located in the guiding slot 13, and the power interface is connected to the printed circuit.
  • the number of the grooves 11 may be one, or two or more may be provided as needed.
  • the driving circuit of the circuit board includes a first capacitor C1, a first resistor R1, a rectifier circuit D1, a filter capacitor C2, and a second resistor R2, and the mains access terminal and the first
  • the capacitor C1 is connected, the first resistor R1 is connected in parallel with the first capacitor C1, the other end of the first capacitor C1 is connected to the input side of the rectifier circuit D1, and both ends of the output side of the rectifier circuit D1 are filtered.
  • the capacitor C2 is connected, the second resistor R2 is connected in parallel with the filter capacitor C2, and both ends of the filter capacitor C2 are connected to two drive circuit output interfaces.
  • the rectifier circuit D1 is a bridge rectifier circuit. Of course, other commonly used rectifier circuits can also be used.
  • the IC chip and the transformer are not used, and the RC is used to step down, and after the step-down, the DC power is obtained by rectifying and filtering.
  • the DC power supply provides a small current and high voltage LED lamp drive.
  • the existing circuit does not have a high-frequency oscillation source, so that there is no high-frequency radiation, and the voltage and current parameters required for the operation of the LED light source are adjusted by the capacitance capacity value (first capacitance C1) in the circuit; preferably, the output of the power supply passes through the series resistance
  • the LED light source is driven after current limiting.
  • the circuit board includes a first capacitor C1, a first resistor R1, a rectifier circuit D1, a filter capacitor C2, and a second resistor R2.
  • the first capacitor CI is connected, the first resistor R1 and the first capacitor CI are connected in parallel, and the other end of the first capacitor C1 is connected to the input side of the rectifier circuit D1, and the output side of the rectifier circuit D1 is
  • the positive terminal is connected to the positive terminal of the second resistor R2 and the second capacitor C2.
  • the negative terminal of the output side of the rectifier circuit D1 is connected to the other end of the second resistor R2.
  • the power factor boosting circuit includes a second a diode D2, a third diode D3, a fourth diode D4, and an auxiliary filter capacitor C3.
  • the cathode of the filter capacitor C2 is simultaneously opposite to the opposite end of the second diode D2 and the third diode D3.
  • the positive terminal of the second diode D2 is connected to the negative terminal of the output side of the rectifier circuit, and the positive terminal of the output side of the rectifier circuit D1 and the fourth diode D4
  • the opposite end of the third diode D3 is simultaneously connected to the positive terminal of the fourth diode D4 and the positive terminal of the auxiliary filter capacitor C3, and the negative electrode of the auxiliary filter capacitor C3 is
  • the negative terminal of the output side of the rectifier circuit is connected, and the two ends of the second resistor R2 are driven by two Output interface.
  • the rectifier circuit D1 is a bridge rectifier circuit. Of course, other commonly used rectifier circuits can also be used.
  • the set diode includes a forward end and a reverse end, and flows through the diode from the forward end to the reverse end.
  • the IC chip and the transformer are not used, and the RC is used to step down, and after the step-down, the DC power is obtained by rectifying and filtering.
  • the DC power supply provides a small current and high voltage LED lamp drive.
  • the existing circuit does not have a high-frequency oscillation source, so that there is no high-frequency radiation, and the voltage and current parameters required for the operation of the LED light source are adjusted by the capacitance capacity value (first capacitance C1) in the circuit; preferably, the output of the power source directly drives the LED light source.
  • the power factor boosting circuit can improve the power of the entire LED lamp driving circuit because it effectively meets the power factor of the light source for high power factor occasions.

Description

大功率 LED灯泡 技术领域
本发明涉及一种大功率 LED灯泡。
背景技术
现有的 LED灯泡， 为了说实现较大功率， 通常会在灯泡上设置散 热器件， 因为大功率的 LED灯泡在工作时会产生较大的热量， 如果 不能及时将余热排出， 会导致 LED芯片使用寿命缩短， 大大缩短了
书
LED灯泡的使用寿命。
现有的散热器件， 例如专利申请号为 200910115650.X的中国专 利申请， 公开了一种散热筒结构， 内腔上部和下部分别连成一体， 反 射状直立排列成圆筒的金属片组成， 散热筒和灯头定位连接，通常在 灯头加工完成后，再将散热筒与灯头装配连接；其存在的技术缺陷为： 结构复杂、 制造工艺麻烦、 成本高和散热性能较差。
发明内容
为了克服已有大功率 LED灯泡的结构复杂、制造工艺麻烦、成本 高、散热性能较差的不足， 本发明提供一种简化结构、制造工艺简单、 成本较低、 散热性能优良的新型大功率 LED灯泡。
本发明解决其技术问题所采用的技术方案是： 一种新型大功率 LED灯泡， 包括接头、 线路板、 LED光源和灯 泡罩，所述 LED光源位于所述灯泡罩内，所述接头与所述线路板电连 接， 所述线路板与所述 LED光源连接， 所述新型大功率 LED灯泡还 包括连接套， 所述连接套上部与所述接头连接， 所述连接套下部与灯 泡罩连接， 所述线路板位于所述连接套的中部， LED基板安装在所述 连接套的底面， 所述 LED基板的底面安装所述 LED光源， 所述 LED 基板的顶面安装用以采用化学制冷剂实现散热的制冷箱， 所述制冷箱 的上部与所述线路板连接。
进一步， 所述制冷箱的底面与所述 LED基板的顶面呈一体。
再进一步， 所述制冷箱的顶面与固定支架连接， 所述线路板位于 所述固定支架上。
更进一步，所述 LED基板的外侧设有向上延伸的散热环，所述散 热环与所述连接套连接。
所述制冷箱包括箱体和箱盖， 所述箱体上部外侧设有外螺紋， 所 述箱盖内壁设有内螺紋， 所述箱盖安装在所述箱体上， 所述固定支架 与箱盖连接。
所述 LED基板的底面并排布置多个凹槽，所述凹槽内壁设有用以 反射 LED光源光线并聚焦的反射层，所述 LED光源位于所述凹槽内。
所述凹槽的横截面呈半圆形或倒抛物线形。
所述凹槽内壁与反射层之间设有导热层， 所述导热层的上端低于 所述 LED基板的底面，所述印刷线路布置在所述 LED基板的底面上。
所述线路板的驱动电路包括第一电容、 第一电阻、 整流电路、 滤 波电容和第二电阻， 市电接入端与所述第一电容连接， 所述第一电阻 和第一电容并联， 所述第一电容的另一端与所述整流电路的输入侧连 接， 所述整流电路的输出侧的两端与滤波电容连接， 所述第二电阻与 所述滤波电容并联， 所述滤波电容的两端与两个驱动电路输出接口连 接。 所述线路板的驱动电路包括第一电容、 第一电阻、 整流电路、 滤 波电容、 第二电阻和功率因数提升电路， 市电接入端与所述第一电容 连接， 所述第一电阻和第一电容并联， 所述第一电容的另一端与所述 整流电路的输入侧连接， 所述整流电路的输出侧的正极端同时与第二 电阻一端和滤波电容正极连接， 所述整流电路的输出侧的负极端与所 述第二电阻另一端联接， 所述功率因数提升电路包括第二二极管、 第 三二极管、 第四二极管和辅助滤波电容， 所述滤波电容的负极同时与 第二二极管的反向端和第三二极管的正向端连接， 所述第二二极管的 正向端与所述整流电路的输出侧的负极端连接， 所述整流电路的输出 侧的正极端与第四二极管的反向端连接， 所述第三二极管的反向端同 时与第四二极管的正向端、 辅助滤波电容的正极连接， 所述辅助滤波 电容的负极与所述整流电路的输出侧的负极端连接， 所述第二电阻两 端与两个驱动电路输出接口连接。
本发明的技术构思为： 采用化学制冷剂实现散热的制冷箱， 并将 制冷箱配置在 LED基板上， 实现了良好的散热。
在选择化学制冷剂时， 通常需要设定开始实现制冷效果的起始温 度， 该温度通常选择为 20°C~60°C， 以 50°C为例进行说明； LED光源 点亮后， LED基板的温度会逐渐上升， 化学制冷剂的温度也会随之上 升， 当 LED光源被点亮足够的时间， 化学制冷剂的温度达到 50°C， 所述制冷剂开始发生化学反应， 吸收 LED基板的热量，起到良好的散 热性能， 能够良好的保证 LED基板的工作温度； 当 LED光源熄灭后， 所述化学制冷剂会还原为初始状态。
本发明的有益效果主要表现在： 1、 简化结构、 制造工艺简单、 成 本较低、 散热性能优良； 2、 提高光利用率、 提升散热性能； 3、 由于 避免采用变压器， 简化了电路组成， 无高频振荡、 无电磁辐射， 降低 了能耗， 同时提高了电源转换效率； 4、采用限流电阻， 在电源电压发 生异常波动时， 有效降低 LED灯的工作电流， 起到保护 LED的作用； 5、加入由三个二极管和第三电容组成的功率因数提升电路，能够有效 适应高功率因数场合。 附图说明
图 1是大功率 LED灯泡的结构示意图。
图 2是大功率 LED基板的结构示意图。
图 3是一种单个 LED光源的安装示意图。
图 4是另一种单个 LED光源的安装示意图。
图 5是再一种单个 LED光源的安装示意图。
图 6是小电流高压 LED灯的驱动电路的示意图。
图 7是高功率因数的小电流高压 LED灯的驱动电路的示意图。 具体实施方式
下面结合附图对本发明作进一步描述。 参照图 1~图7， 一种新型大功率 LED灯泡， 包括接头 1、 线路板 2、 LED光源 3和灯泡罩 4， 所述 LED光源 3位于所述灯泡罩 4内， 所述接头 1与所述线路板 2电连接， 所述线路板 2与所述 LED光源 3 连接， 所述新型大功率 LED灯泡还包括连接套 5， 所述连接套 5上部 与所述接头 1连接， 所述连接套 5下部与灯泡罩 4连接， 所述线路板 2位于所述连接套 5的中部， LED基板 6安装在所述连接套 5的底面， 所述 LED基板 6的底面安装所述 LED光源 3， 所述 LED基板 6的顶 面安装用以采用化学制冷剂实现散热的制冷箱 7， 所述制冷箱 7的上 部与所述线路板 2连接。
所述灯泡罩 4的上部与所述 LED基板 6卡扣式连接。当然， 也可 以采用其他装配方式。
所述制冷箱 7的底面与所述 LED基板 6的顶面呈一体。该结构有 利于实现良好地散热。
所述制冷箱 7的顶面与固定支架 8连接， 所述线路板 2位于所述 固定支架 8上。
所述 LED基板 6上开有供线路安装的通孔。
所述 LED基板 6的外侧设有向上延伸的散热环 9， 所述散热环 9 与所述连接套 5连接。所述散热环的大小可以根据大功率 LED灯泡的 需要， 如果功率相对较小， 则散热环可以小一些， 如果功率较大， 散 热环可以向上延伸， 以增加散热面积； 当然， 对于散热环的材料也可 以选用容易散热的材料， 例如铝等。
该散热环能够将 LED基板的热量传导发散，由于散热环的面积较 大， 具有良好的辅助散热功能。
所述灯泡罩 4呈圆形、 菱形、 椭圆形或方形。 当然， 也可以采用 其他形状。
所述制冷箱包括箱体和箱盖， 所述箱体上部外侧设有外螺紋， 所 述箱盖内壁设有内螺紋， 所述箱盖安装在所述箱体上， 所述固定支架 与箱盖连接。 当然， 箱体和箱盖之间也可以采用其他装配方式。
所述固定支架与箱盖呈一体。
本实施例中， 设定开始实现制冷效果的起始温度， 该温度通常选 择为 20°C~60°C。 当 LED光源点亮后， LED基板的温度会逐渐上升， 化学制冷剂 的温度也会随之上升， 当 LED光源被点亮足够的时间， 化学制冷剂的 温度达到 50°C， 所述制冷剂开始发生化学反应， 吸收 LED基板的热 量， 起到良好的散热性能， 能够良好的保证 LED基板的工作温度； 当 LED光源熄灭后， 所述化学制冷剂会还原为初始状态。
本实施例中， 所述 LED基板 6的底面并排布置多个凹槽 10， 所 述凹槽 10内壁设有用以反射 LED光源光线并聚焦的反射层，所述 LED 光源 3位于所述凹槽 10内。
所述凹槽 10的横截面呈半圆形或倒抛物线形。半圆形或倒抛物线 形的结构，能够将光线进行良好的聚焦反射，大大提高了光线利用率; 同时凹槽结构增加了散热面积， 同时提高了散热效果。
本实施例的反射层 11可以采用镀铝层， 当然，也可以采用镀锌或 镀镍等其它反射镀层结构。
所述凹槽 10内壁与反射层 11之间设有导热层 12，所述导热层的 上端低于所述 LED基板的底面， 所述印刷线路布置在所述 LED基板 的底面上； 导热层 12与印刷线路不能接触， 否则容易引起短路故障。
所述导热层 12具有良好的导热性能， 能够将 LED芯片产生的热 量及时排出， 提升了散热性能， 所述导热层优选为铜材料， 当然， 也 可以采用其他导热性能优良的材料。
所述 LED芯片位于所述凹槽 10的底部， 优选的， 为了提高散热 效果， 所述 LED芯片的底面与所述凹槽底部贴合， 当然， 所述 LED 芯片的底面也可以与所述凹槽底部不贴合。
所述 LED基板 6呈圆形、 菱形、 椭圆形或方形。 当然， 也可以采 用其他形状。另外，所述基板本体的大小可根据 LED芯片的数量来确 定。
所述基板本体的的侧面开有引槽 13，所述电源接口位于所述引槽 13内， 所述电源接口与所述印刷线路连接。 所述引槽 11可以为一个， 也可以根据需要设置两个或两个以上。
参照图 6， 所述线路板 （LED驱动器） 的驱动电路， 包括第一电 容 Cl、 第一电阻 Rl、 整流电路 Dl、 滤波电容 C2和第二电阻 R2， 市 电接入端与所述第一电容 C1连接， 所述第一电阻 R1和第一电容 C1 并联， 所述第一电容 C1的另一端与所述整流电路 D1的输入侧连接， 所述整流电路 D1的输出侧的两端与滤波电容 C2连接，所述第二电阻 R2与所述滤波电容 C2并联， 所述滤波电容 C2的两端与两个驱动电 路输出接口连接。
所述滤波电容 C2的一端连接限流电阻 R3 , 所述限流电阻 R3与 一个驱动电路输出接口连接。 所述整流电路 D1 为桥式整流电路。 当 然， 也可以选用其他常用的整流电路来实现。
本实施例中， 相对于现有技术， 没有采用 IC芯片和变压器， 采用 阻容方式来降压， 降压后再由整流滤波得到直流电源， 该直流电源提 供小电流高压 LED灯驱动，现对于现有电路没有高频振荡源， 从而无 高频辐射， LED光源工作所需的电压和电流参数通过电路中的电容容 量数值（第一电容 C1 )来调整； 优选的， 电源的输出经过串联电阻限 流后驱动 LED光源。
参照图 7， 所述线路板（LED驱动器） 的包括第一电容 Cl、 第一 电阻 Rl、 整流电路 Dl、 滤波电容 C2和第二电阻 R2， 市电接入端与 所述第一电容 CI连接， 所述第一电阻 R1和第一电容 CI并联， 所述 第一电容 C1的另一端与所述整流电路 D1的输入侧连接，所述整流电 路 D1的输出侧的正极端同时与第二电阻 R2—端和第二电容 C2正极 连接，所述整流电路 D1的输出侧的负极端与所述第二电阻 R2另一端 连接， 所述功率因数提升电路包括第二二极管 D2、 第三二极管 D3、 第四二极管 D4和辅助滤波电容 C3, 所述滤波电容 C2的负极同时与 第二二极管 D2的反向端和第三二极管 D3的正向端连接，所述第二二 极管 D2的正向端与所述所述整流电路的输出侧的负极端连接， 所述 整流电路 D1的输出侧的正极端与第四二极管 D4的反向端连接，所述 第三二极管 D3的反向端同时与第四二极管 D4的正向端、辅助滤波电 容 C3的正极连接，所述辅助滤波电容 C3的负极与所述整流电路的输 出侧的负极端连接， 所述第二电阻 R2两端与两个驱动电路输出接口 连接。
所述整流电路 D1 为桥式整流电路。 当然， 也可以选用其他常用 的整流电路来实现。
本实施例中， 设定二极管包括正向端和反向端， 当电流通过二极 管时， 从正向端向反向端流过。
本实施例中， 相对于现有技术， 没有采用 IC芯片和变压器， 采用 阻容方式来降压， 降压后再由整流滤波得到直流电源， 该直流电源提 供小电流高压 LED灯驱动，现对于现有电路没有高频振荡源， 从而无 高频辐射， LED光源工作所需的电压和电流参数通过电路中的电容容 量数值 （第一电容 C1 ) 来调整； 优选的， 电源的输出直接驱动 LED 光源。 采用功率因数提升电路，能够提高整个 LED灯驱动电路的功率因 有效满足光源功率因数为高功率因数场合。

Claims

权 利 要 求 书
1、 一种新型大功率 LED灯泡， 包括接头、 线路板、 LED光源和灯泡 罩，所述 LED光源位于所述灯泡罩内，所述接头与所述线路板电连接， 所述线路板与所述 LED光源连接，其特征在于：所述新型大功率 LED 灯泡还包括连接套， 所述连接套上部与所述接头连接， 所述连接套下 部与灯泡罩连接， 所述线路板位于所述连接套的中部， LED基板安装 在所述连接套的底面， 所述 LED基板的底面安装所述 LED光源， 所 述 LED基板的顶面安装用以采用化学制冷剂实现散热的制冷箱，所述 制冷箱的上部与所述线路板连接。
2、 如权利要求 1所述的新型大功率 LED灯泡， 其特征在于： 所述制 冷箱的底面与所述 LED基板的顶面呈一体。
3、 如权利要求 1或 2所述的新型大功率 LED灯泡， 其特征在于： 所 述制冷箱的顶面与固定支架连接， 所述线路板位于所述固定支架上。
4、 如权利要求 1或 2所述的新型大功率 LED灯泡， 其特征在于： 所 述 LED基板的外侧设有向上延伸的散热环，所述散热环与所述连接套 连接。
5、 如权利要求 3所述的新型大功率 LED灯泡， 其特征在于： 所述制 冷箱包括箱体和箱盖， 所述箱体上部外侧设有外螺紋， 所述箱盖内壁 设有内螺紋，所述箱盖安装在所述箱体上，所述固定支架与箱盖连接。
6、 如权利要求 1或 2所述的新型大功率 LED灯泡， 其特征在于： 所 述 LED 基板的底面并排布置多个凹槽， 所述凹槽内壁设有用以反射 LED光源光线并聚焦的反射层， 所述 LED光源位于所述凹槽内。
7、 如权利要求 6所述的高导热性能的功率型 LED灯， 其特征在于： 所述凹槽的横截面呈半圆形或倒抛物线形。
8、 如权利要求 6所述的高导热性能的功率型 LED灯， 其特征在于： 所述凹槽内壁与反射层之间设有导热层， 所述导热层的上端低于所述 LED基板的底面， 所述印刷线路布置在所述 LED基板的底面上。
9、 如权利要求 1或 2所述的高导热性能的功率型 LED灯， 其特征在 于： 所述线路板的驱动电路包括第一电容、 第一电阻、 整流电路、 滤 波电容和第二电阻， 市电接入端与所述第一电容连接， 所述第一电阻 和第一电容并联， 所述第一电容的另一端与所述整流电路的输入侧连 接， 所述整流电路的输出侧的两端与滤波电容连接， 所述第二电阻与 所述滤波电容并联， 所述滤波电容的两端与两个驱动电路输出接口连 接。
10、如权利要求 1或 2所述的高导热性能的功率型 LED灯，其特征在 于： 所述线路板的驱动电路包括第一电容、 第一电阻、 整流电路、 滤 波电容、 第二电阻和功率因数提升电路， 市电接入端与所述第一电容 连接， 所述第一电阻和第一电容并联， 所述第一电容的另一端与所述 整流电路的输入侧连接， 所述整流电路的输出侧的正极端同时与第二 电阻一端和滤波电容正极连接， 所述整流电路的输出侧的负极端与所 述第二电阻另一端联接， 所述功率因数提升电路包括第二二极管、 第 三二极管、 第四二极管和辅助滤波电容， 所述滤波电容的负极同时与 第二二极管的反向端和第三二极管的正向端连接， 所述第二二极管的 正向端与所述整流电路的输出侧的负极端连接， 所述整流电路的输出 侧的正极端与第四二极管的反向端连接， 所述第三二极管的反向端同 时与第四二极管的正向端、 辅助滤波电容的正极连接， 所述辅助滤波 电容的负极与所述整流电路的输出侧的负极端连接， 所述第二电阻两 端与两个驱动电路输出接口连接。
PCT/CN2011/071949 2011-02-28 2011-03-18 大功率led灯泡 WO2012116503A1 (zh)

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CN2011100476156A CN102095111A (zh) 2011-02-28 2011-02-28 新型大功率led灯泡
CN201110047615.6 2011-02-28
CN201120055537XU CN202018010U (zh) 2011-03-04 2011-03-04 大功率led基板
CN201120055537.X 2011-03-04
CN201120059940.X 2011-03-09
CN2011200599823U CN201995159U (zh) 2011-03-09 2011-03-09 高功率因数的小电流高压led灯的驱动电路
CN201120059940XU CN202019481U (zh) 2011-03-09 2011-03-09 小电流高压led灯的驱动电路
CN201120059982.3 2011-03-09

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CN101581408A (zh) * 2009-07-01 2009-11-18 北京高科能光电技术有限公司 一种led灯泡
CN201661878U (zh) * 2009-12-31 2010-12-01 董仲江 一种大功率球泡灯
JP2010282777A (ja) * 2009-06-03 2010-12-16 Arufakusu Kk Ｌｅｄ照明具
CN201739797U (zh) * 2010-04-08 2011-02-09 曹木群 一种大功率led球泡

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010282777A (ja) * 2009-06-03 2010-12-16 Arufakusu Kk Ｌｅｄ照明具
CN101581408A (zh) * 2009-07-01 2009-11-18 北京高科能光电技术有限公司 一种led灯泡
CN201661878U (zh) * 2009-12-31 2010-12-01 董仲江 一种大功率球泡灯
CN201739797U (zh) * 2010-04-08 2011-02-09 曹木群 一种大功率led球泡

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