WO2012098835A1

WO2012098835A1 - Optical fiber wiring structure and method for producing same

Info

Publication number: WO2012098835A1
Application number: PCT/JP2012/000117
Authority: WO
Inventors: 生西　省吾
Original assignee: 三菱電線工業株式会社
Priority date: 2011-01-20
Filing date: 2012-01-11
Publication date: 2012-07-26
Also published as: JP2012150360A

Abstract

An optical fiber wiring structure (A) in which optical fiber cores (20) are laid so as to form a wiring pattern on a base (10), in said wiring pattern the optical fiber cores (20) extending parallel to each other at an interval.

Description

Optical fiber wiring structure and manufacturing method thereof

The present invention relates to an optical fiber wiring structure and a manufacturing method thereof.

In a device using a long optical fiber core such as a fiber laser or an optical fiber amplifier, for example, a device in which an optical fiber core is wound around a reel is incorporated in the device, or on a resin sheet as a base material. An optical fiber wiring sheet in which optical fiber cores are laid so as to form a predetermined wiring pattern is incorporated into the apparatus.

Patent Document 1 discloses a method for manufacturing an optical fiber wiring sheet, in which an ultraviolet curable resin is applied so as to cover the surface of an optical fiber, and ultraviolet rays are applied to the resin so that an uncrosslinked portion is present on the surface side of the resin. After configuring the remaining optical fiber cores, the optical fiber core wires are brought into close contact with each other and wound up on a mold, and then irradiated with ultraviolet rays again to cure the uncrosslinked resin. It is disclosed that the wires are bonded and integrated.

Further, in Patent Document 2, for the purpose of heat dissipation of the optical fiber, the optical fiber is wound in a circular shape and sandwiched between the first and second members made of a material having high thermal conductivity. It is disclosed to fill a material with high flexibility and high thermal conductivity.

JP 2000-329944 A JP 2001-274489 A

The present invention is an optical fiber wiring structure comprising: a base material; and an optical fiber core wire laid so as to form a wiring pattern extending in parallel and spaced apart from each other on the base material. is there.

The present invention is a method for manufacturing an optical fiber wiring structure in which optical fiber cores are wired on a substrate so as to form a wiring pattern extending in parallel with a distance from each other.

1 is a perspective view showing an optical fiber wiring structure according to Embodiment 1. FIG. 1 is a plan view showing an optical fiber wiring structure according to Embodiment 1. FIG. It is the III-III expanded sectional view in FIG. It is a perspective view of an optical fiber core wire. It is a perspective view of a wiring apparatus. It is a perspective view which shows the optical fiber wiring structure which concerns on Embodiment 2. FIG. It is an expanded sectional view equivalent to FIG. 3 in Embodiment 1 of the optical fiber wiring structure which concerns on Embodiment 2. FIG. (A) And (b) is a top view which shows the modification of an optical fiber wiring structure. It is a side view which shows another modification of an optical fiber wiring structure. It is a graph which shows the relationship between the time of Example 1 and 2 and the temperature rise of an optical fiber wiring structure.

Hereinafter, embodiments will be described in detail based on the drawings.

(Embodiment 1)
1 to 3 show an optical fiber wiring structure A according to Embodiment 1. FIG. The optical fiber wiring structure A according to the first embodiment is used for applications such as a fiber laser and an optical fiber amplifier.

In the optical fiber wiring structure A according to the first embodiment, the heat sink 10 constitutes a base material.

In the heat sink 10, the surface of the rectangular main body plate 11 is a flat surface, and a plurality of plate-like fins 12 are provided on the rear surface of the main body plate 11 so as to extend in the normal direction at intervals d in the long side direction. It is provided integrally and has a comb shape when viewed from the side. The material forming the heat sink 10 is preferably a metal having high thermal conductivity, and examples of such a material include aluminum and copper. The heat sink 10 may be coated with an anodized film colored in black or the like in order to improve corrosion resistance and wear resistance, and in order to improve heat dissipation characteristics. The main body plate 11 has, for example, a length of 50 to 300 mm, a width of 50 to 250 mm, and a thickness of 1 to 10 mm. For example, the fin 12 has a length extending from the main body plate 11 of 2 to 300 mm and a thickness of 5 to 50 mm. As a commercially available heat sink 10, for example, model number: EM / B / 150 (thermal resistance 0.64 ° C./W) manufactured by AAVID, or model number: OK278 / B / 150 (thermal resistance 0.48 ° C./W) Etc. The shapes, materials, and dimensions of the main body plate 11 and the fins 12 of the heat sink 10 are not limited to these, and may have other configurations.

In the optical fiber wiring structure A according to the first embodiment, the optical fiber core wire 20 is wired on the surface of the main body plate 11 of the heat sink 10 via the adhesive layer 30 (adhesive).

FIG. 4 shows the optical fiber core wire 20.

The optical fiber core wire 20 includes an optical fiber 21 and a coating layer 22 that covers the optical fiber 21. The optical fiber core wire 20 has, for example, a length of 3 to 100 m and a core wire diameter of 50 to 1000 μm.

The optical fiber 21 has a core 21a having a relatively high refractive index at the center of the fiber and a clad 21b having a relatively low refractive index covering the core 21a. The material forming the optical fiber 21 is typically quartz, but may be a resin such as an acrylic resin if the heat resistance is allowed depending on the use conditions, and the core 21a is quartz and the clad 21b is resin. May be. For example, the core 21a may be doped with a rare earth element such as erbium (Er), yttrium (Y), or neodymium (Nd) as a dopant, or may be doped with germanium (Ge), aluminum (Al), or the like. It may be. The clad 21b may be doped with a dopant, or may not be doped with a dopant. Examples of the dopant in the former case include boron (B) and fluorine (F) that lower the refractive index. It is done. For example, the optical fiber 21 has a fiber diameter of 50 to 800 μm, a core diameter of 3 to 600 μm, and a thickness of the cladding 21b of 25 to 100 μm. However, from the viewpoint of improving the heat dissipation of the optical fiber 21, the fiber diameter of the optical fiber 21 is preferably 125 μm or more. Further, the optical fiber 21 may be a combination of a plurality of cores and claddings for passing light of a plurality of wavelengths, or a cross section having a shape other than a circle such as a D-shape or a polygon. Such optical fiber 21 is disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-151864, “Double-clad” fiber “laser” with “30 mW” output “power”, OSA “Trends” in “Optics” and “Photonics, vol. 16, p137-140 (1997). Is disclosed.

As a material for forming the covering layer 22, for example, an ultraviolet curable acrylic resin can be cited as a general-purpose material, but among the resins, a thin polyimide resin is preferable from the viewpoint of efficiently dissipating heat generated by the optical fiber 21. From the viewpoint of efficiently dissipating heat generated by the optical fiber 21, metals such as aluminum, copper, and gold having high thermal conductivity are preferable. The thickness of the covering layer 22 is, for example, 3 to 100 μm in the case of resin, and 30 to 200 μm in the case of metal.

In the wiring pattern, a pair of optical fiber core wires 20 extend along the long side of the main body plate 11 of the heat sink 10 so as to surround a loop formed in the central portion in the length direction of the optical fiber core wire 20. Orbiting outwards to form a shape (track shape for athletics) having opposing straight portions and one semicircular portion connecting one end of them and the other semicircular portion connecting the other ends 6 to 200 laps). The length of the straight line portion of the wiring pattern is the same on the inner side and the outer side, and is, for example, 30 to 200 mm. The radius of curvature of the semicircular portion is longer on the outside than on the inside, for example, 15 to 150 mm. In addition, the pair of optical fiber core wires 20 forming the outermost periphery of the wiring pattern is drawn to the outside of the heat sink 10, one of which is configured as an input end and the other as an output end.

By the way, in a fiber laser or an optical fiber amplifier using EDF (Erbium Doped Fiber) or the like, it is required to suppress deterioration in characteristics due to heat generation of the optical fiber. However, in the above-described wiring pattern, the optical fiber core wires 20 that are adjacent to each other and extend in parallel are not in contact with each other in both the straight portion and the semicircular portion, and as shown in FIG. 20 are provided so as to extend in parallel with each other at a distance d. Thus, the optical fiber core wires 20 are wired so as to form a wiring pattern extending in parallel with a distance d from each other. Since the heat sink 10 is used as a material, high heat dissipation can be obtained. As a result, high power can be achieved for fiber laser applications, and stabilization of characteristics can be achieved for optical fiber amplifier applications. The spacing d between the optical fiber cores 20 may be wide or narrow along the wiring pattern, but the optical fiber core wires 20 are efficiently disposed in a limited space and the optical fiber core wires are arranged. From the viewpoint of eliminating heat storage between 20 and efficiently dissipating the heat generated by the optical fiber 21, it is preferable to be constant along the wiring pattern. The distance d between the optical fiber cores 20 efficiently disposes the optical fiber core wires 20 in a limited space and eliminates heat storage between the optical fiber core wires 20 to efficiently generate heat from the optical fiber 21. From the viewpoint of heat dissipation, it is preferably 0.2 to 3.0 times the core wire diameter of the optical fiber core wire 20, and more preferably 0.5 to 1.5 times.

Examples of the material for forming the adhesive layer 30 include a silicone adhesive, a rubber adhesive, and an acrylic adhesive. The adhesive layer 30 may be added with a filler such as metal powder or carbon that enhances thermal conductivity. The optical fiber core wire 20 may be wired through an adhesive layer instead of the adhesive layer 30. Examples of the material for forming the adhesive layer include a thermosetting resin adhesive and a thermoplastic resin system. Examples thereof include an adhesive and an elastomer-based adhesive. The thickness of the adhesive layer 30 or the adhesive layer is preferably as thin as possible from the viewpoint of efficiently dissipating heat generated by the optical fiber 21 to the heat sink 10, but is, for example, 20 to 100 μm.

In the optical fiber wiring structure A according to the first embodiment, a fluid-solidified filler 40 is filled between the optical fiber cores 20 wired on the heat sink 10. The filler 40 enhances heat transfer from the optical fiber 21. Here, the fluid-solidified filler 40 refers to a filler material in which the raw material has a liquid or paste fluidity and is solidified by reaction or solvent volatilization.

Examples of the fluid solidified filler 40 include thermosetting resins such as silicone rubber and epoxy resin, and thermoplastic resins. Of these, silicone rubber having excellent thermal conductivity is preferable from the viewpoint of efficiently dissipating heat generated by the optical fiber 21. The viscosity of the filler 40 before solidification is preferably 50 to 200 Pa · s from the viewpoint of filling processability. The hardness of the filler 40 after solidification (in accordance with durometer A, JIS K 6249) is preferably 20 to 80 from the viewpoint of followability to a dimensional change due to heat of the optical fiber core wire 20. The thermal conductivity (based on ISO 22007-2) of the filler 40 after solidification is preferably 0.2 to 2.5 W / m · K from the viewpoint of efficiently dissipating heat generated by the optical fiber 21. Examples of suitable commercially available fillers 40 include silicone rubber (trade name: KE-4890, etc.) manufactured by Shin-Etsu Chemical Co., Ltd.

In the optical fiber wiring structure A according to the first embodiment, the protective film 50 is provided so as to cover the surface of the main body plate 11 of the heat sink 10 from above the optical fiber core wire 20 wired on the heat sink 10. Yes. The optical fiber core wire 20 is protected from the outside by the protective film 50.

Examples of the material forming the protective film 50 include resins such as polyethylene resin, polypropylene resin, and polyethylene terephthalate resin. The surface of the protective film 50 is tightly coated by the adhesiveness of the filler 40 filled between the optical fiber cores 20, but the surface may be tightly coated via an adhesive or an adhesive. The thickness of the protective film 50 is, for example, 25 to 200 μm.

Next, a method for manufacturing the optical fiber wiring structure A according to Embodiment 1 will be described.

FIG. 5 shows a wiring device 100 used for manufacturing the optical fiber wiring structure A. The structure of the wiring device 100 is also disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2002-31723, 2002-365447, and 2003-75654.

In this wiring apparatus 100, a movable stage 120 is provided at the center of a rectangular base 110, and a support member 130 is erected at the center of one side of the base 110.

The movable stage 120 includes a lower first linear movement stage 121 and an upper second linear movement stage 122.

The first linear moving stage 121 includes a first fixing member 121a fixed on the base 110 and a first moving base 121b provided thereon. A guide convex portion 123 extending in the direction of arrow X in the drawing is provided on the upper surface side of the first fixing member 121a, while the guide convex portion 123 is engaged on the lower surface side of the first moving base 121b. A guide recess 124 is provided. The first moving base 121b is coupled to a motor (not shown), and by driving the first moving base 121b, the guide convex portion 123 and the guide concave portion 124 extend in the horizontal direction with respect to the first fixing member 121a, that is, It is configured to be able to reciprocate relatively in the direction of arrow X in the figure.

The second linear movement stage 122 also has the same structure as the first linear movement stage 121, and the moving direction is orthogonal to the moving direction of the first linear movement stage 121. That is, the second linear moving stage 122 includes a second fixing member 122a fixed on the first moving table 121b and a second moving table 122b provided thereon. On the upper surface side of the second fixing member 122a, a guide convex portion 125 extending in the direction of the arrow Y in the figure is provided, while on the lower surface side of the second moving base 122b, the guide convex portion 125 is engaged. A guide recess 126 is provided. The upper surface of the second moving table 122b is configured such that the base material B can be attached and detached, and when the base material B is installed, the upper surface for laying the optical fiber core wire 20 is in a substantially horizontal state. Has been. The second moving table 122b is coupled to a motor (not shown), and by driving the second moving table 122b, the guide convex portion 125 and the guide concave portion 126 extend in the horizontal direction with respect to the second fixing member 122a. It is configured to be able to reciprocate relatively in the direction of arrow Y in the figure. Note that the X direction and the Y direction are orthogonal to each other.

The support member 130 is an L-shaped member that includes a leg 131 that rises vertically upward from the base 110 and an arm 132 that extends horizontally from the upper end of the leg 131 toward the center of the base 110. It consists of The wiring part 140 is attached to the tip of the arm part 132 so as to be positioned above the movable stage 120.

The wiring section 140 accommodates an optical fiber bobbin (not shown) inside, and has a wiring head 141 at the lower end, and pulls out the optical fiber core wire F wound around the optical fiber bobbin to provide the wiring head. 141 is configured to be supplied from the core wire supply port. The wiring section 140 is configured to rotate around a rotation axis that is substantially perpendicular to the plane of the base 110 by a motor (not shown).

As described above, in the wiring apparatus 100, the movable stage 120 moves the base material B in the two directions orthogonal to the X direction and the Y direction in the XY plane by the first and second linear movement stages 122, and moves. By supplying the optical fiber core wire F from the wiring section 140 supported by the support member 130 on the base material B, the optical fiber core wire F is wired on the base material B in a predetermined wiring pattern. It is configured.

When manufacturing the optical fiber wiring structure A according to the first embodiment, first, the adhesive layer 30 is formed by attaching an adhesive to the surface of the main body plate 11 of the heat sink 10 as a base material.

Next, the heat sink 10 is installed on the movable stage 120 of the wiring apparatus 100 so that the surface of the main body plate 11 provided with the adhesive layer 30 faces upward.

Subsequently, the heat sink 10 is moved in the XY plane by the movable stage 120, and the optical fiber core wire 20 is supplied from the wiring portion 140, so that a space d is provided on the main body plate 11 of the heat sink 10. The optical fiber core wire 20 is wired so as to form a predetermined wiring pattern extending in parallel (wiring process).

Then, the heat sink 10 is taken out from the wiring device 100, and the uncured liquid or paste filler 40 is filled between the optical fiber core wires 20 on the surface side of the main body plate 11 of the heat sink 10. Apply and cure (filler filling process).

Finally, the optical fiber wiring structure A according to the first embodiment is obtained by covering the surface of the main body plate 11 of the heat sink 10 so as to cover the surface of the main body plate 11 of the optical fiber core wire 20 and closely adhering it. Can do.

(Embodiment 2)
6 and 7 show an optical fiber wiring structure A (optical fiber sheet) according to the second embodiment. The optical fiber wiring structure A according to the second embodiment is also used for applications such as a fiber laser and an optical fiber amplifier. In addition, the part of the same name as Embodiment 1 is shown with the same code | symbol as Embodiment 1. FIG.

In the optical fiber wiring structure A according to the second embodiment, the resin sheet 60 constitutes a base material.

Examples of a material for forming the resin sheet 60 include resins such as polyethylene resin, polypropylene resin, and polyethylene terephthalate resin. The thickness of the resin sheet 60 is, for example, 0.1 to 0.8 mm.

Since the base material of the optical fiber wiring structure A according to Embodiment 2 is the resin sheet 60, the optical fiber amplifier and the like can be reduced in weight and size.

Other configurations of the optical fiber core wire 20, the adhesive layer 30, the filler 40, and the protective film 50, and the effects are the same as those of the first embodiment.

(Other embodiments)
In the first and second embodiments, the wiring pattern is configured in a track shape for athletics, but is not particularly limited thereto, and the wiring pattern is configured in a circular shape as shown in FIG. Alternatively, as shown in FIG. 8B, the wiring pattern is formed by adjoining the four straight portions extending along the four sides of the main body plate 11 or the resin sheet 60 of the heat sink 10. May be configured to have a substantially rectangular shape having a circular arc portion and a radius of curvature of the circular arc portion that is substantially the same from the inside to the outside. In the case of the latter configuration, the optical fiber core wire 20 which is longer than that in the first and second embodiments can be wired on the main body plate 11 or the resin sheet 60 of the heat sink 10.

In the first embodiment, the configuration is such that the optical fiber core wire 20 is wired on the surface of the main body plate 11 of the heat sink 10. However, the present invention is not particularly limited thereto, and as shown in FIG. One or a plurality of Peltier elements 13 may be attached on the plate 11, and the optical fiber core wire 20 may be wired on the heat sink 14 provided thereon. In such a configuration, not only heat dissipation but also temperature control can be performed.

In the first and second embodiments, the adhesive layer 30 (or the adhesive layer) is provided on the entire surface of the main body plate 11 or the resin sheet 60 of the heat sink 10. The layer 30 (or the adhesive layer) may be configured to be provided at least in a portion where the optical fiber core wire 20 is wired, and the optical fiber core wire 20 is simply connected via an adhesive (or adhesive). A wired configuration may also be used.

In the first and second embodiments, the filler 40 is filled between the optical fiber core wires 20. However, the present invention is not limited to this, and the filler 40 is not filled and the optical fiber core wires are not filled. A configuration in which a gap is provided between 20 may be used.

In the said Embodiment 1 and 2, although it was set as the structure by which the protective film 50 was provided so that the wired optical fiber core wire 20 might be covered, it is not limited to this in particular, The protective film 50 is provided. Alternatively, the configuration may be such that the wired optical fiber 20 is exposed on the surface.

(Optical fiber wiring structure)
<Example 1>
An optical fiber wiring structure having the same configuration as that of the first embodiment was manufactured and used as Example 1. For the heat sink as the base material, model number manufactured by AAVID: EM / B / 150 (length 200 mm, width 150 mm, thickness (including fin length) 40 mm, thermal resistance 0.64 ° C./W) Using. As the optical fiber core wire, 30 m having a core wire diameter of 250 μm, in which an optical fiber having a fiber diameter of 125 μm (core diameter of 8 μm) was coated with a coating layer of an ultraviolet curable acrylic resin, was used. For the adhesive layer, a silicone-based adhesive was used with a layer thickness of 50 μm. Silicone rubber (trade name: KE-4890 etc.) manufactured by Shin-Etsu Chemical Co., Ltd. was used as the filler. A polyethylene film having a thickness of 80 μm was used as the protective film.

<Example 2>
An optical fiber wiring structure having the same configuration as that of the second embodiment was manufactured and used as Example 2. A polyethylene terephthalate resin sheet (length 200 mm, width 150 mm, and thickness 0.34 mm) was used as the resin sheet as the substrate. The other configurations were the same as those in Example 1.

(Test evaluation method)
About each optical fiber wiring structure of Example 1 and 2, it heat-inputs so that a 1 W thermal load may be added uniformly to an optical fiber core wire wiring part, and the temperature of the optical fiber in an optical fiber wiring structure is 60 minutes Monitored. The temperature of the optical fiber in the optical fiber wiring structure was measured by measuring the length change due to the thermal expansion of the optical fiber and converting the length change into the temperature based on the relationship between the length and the temperature obtained in advance. .

(Test evaluation results)
FIG. 10 shows the relationship between the time of Examples 1 and 2 and the temperature rise of the optical fiber.

According to this, in Example 1, the temperature rise in 60 minutes was just over 2 ° C, and in Example 2, the temperature rise in 60 minutes was just over 12 ° C.

When the same test evaluation is performed by winding optical fiber cores having the same core length into a bundle, the temperature rise is estimated to be about 148 ° C. Compared with this, Examples 1 and 2 have extremely high heat dissipation. It turns out that it is excellent. In particular, it can be seen that Example 1 using a heat sink as a base material has significantly better heat dissipation than Example 2.

The present invention is useful for an optical fiber wiring structure and a manufacturing method thereof.

A Optical fiber wiring structure B Base material d Space | interval F Optical fiber core wire 10 Heat sink 11 Main body plate 12 Fin 13 Peltier element 14 Heat sink 20 Optical fiber core wire 21 Optical fiber 21a Core 21b Clad 22 Coating layer 30 Adhesion layer 40 Filling Material 50 Protective film 60 Resin sheet 100 Wiring device 110 Base 120 Movable stage 121 First linear moving stage 121a First fixed member 121b First moving table 122 Second linear moving stage 122a Second fixed member 122b Second moving table 123 , 125 Guide

convex part

124, 126 Guide concave part 130 Support member 131 Leg part 132 Arm part 140 Wiring part 141 Wiring head

Claims

A substrate;
An optical fiber core wire arranged to form a wiring pattern extending in parallel with each other on the substrate;
An optical fiber wiring structure comprising:
In the optical fiber wiring structure according to claim 1,
An optical fiber wiring structure in which the distance between the optical fiber cores is 0.2 to 3.0 times the core diameter of the optical fiber cores.
In the optical fiber wiring structure according to claim 1 or 2,
An optical fiber wiring structure in which an interval between the optical fiber cores is constant along the wiring pattern.
In the optical fiber wiring structure according to any one of claims 1 to 3,
An optical fiber wiring structure in which the substrate is a heat sink.
In the optical fiber wiring structure according to claim 4,
An optical fiber wiring structure in which a heat sink as the base material is formed of aluminum or copper.
In the optical fiber wiring structure according to claim 4 or 5,
An optical fiber wiring structure in which a heat sink as the substrate is coated with an anodized film.
In the optical fiber wiring structure according to any one of claims 1 to 3,
An optical fiber wiring structure in which the substrate is a resin sheet.
In the optical fiber wiring structure according to any one of claims 1 to 7,
The said optical fiber core wire is an optical fiber wiring structure which has an optical fiber and the coating layer which coat | covers it.
In the optical fiber wiring structure according to claim 8,
An optical fiber wiring structure in which a fiber diameter of the optical fiber is 125 μm or more.
In the optical fiber wiring structure according to claim 8 or 9,
An optical fiber wiring structure in which the coating layer is formed of polyimide resin, aluminum, copper, or gold.
In the optical fiber wiring structure according to any one of claims 1 to 10,
An optical fiber wiring structure in which the optical fiber core wire is wired on the substrate via an adhesive layer or an adhesive layer.
In the optical fiber wiring structure according to claim 11,
An optical fiber wiring structure in which the adhesive layer or the adhesive layer has a thickness of 20 to 100 μm.
In the optical fiber wiring structure according to any one of claims 1 to 12,
An optical fiber wiring structure in which a fluid-solidified filler is filled between the optical fiber cores wired on the substrate.
In the optical fiber wiring structure according to claim 13,
An optical fiber wiring structure in which the filler is silicone rubber.
The optical fiber wiring structure according to claim 13 or 14,
An optical fiber wiring structure having a hardness measured by a durometer A in accordance with JIS K 6249 of the filler of 20 to 80.
The optical fiber wiring structure according to any one of claims 13 to 15,
An optical fiber wiring structure having a thermal conductivity of 0.2 to 2.5 W / m · K measured in accordance with ISO 22007-2 of the filler.
The optical fiber wiring structure according to any one of claims 1 to 16,
An optical fiber wiring structure in which a protective film is provided so as to cover the surface of the optical fiber core wire wired on the base material.
The manufacturing method of the optical fiber wiring structure including the wiring process which arrange | positions an optical fiber core wire on a base material so that the wiring pattern extended in parallel at intervals may be formed.
In the manufacturing method of the optical fiber wiring structure described in Claim 18,
The manufacturing method of the optical fiber wiring structure further including the filler filling process which fills the fluid solidification type filler between the optical fiber core wires wired on the base material after the said wiring process.
In the manufacturing method of the optical fiber wiring structure described in Claim 19,
A method for producing an optical fiber wiring structure, wherein the filler used in the filler filling step has a viscosity before solidification of 50 to 200 Pa · s.