WO2012096847A2 - Apparatus for euv imaging and methods of using same - Google Patents
Apparatus for euv imaging and methods of using same Download PDFInfo
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- WO2012096847A2 WO2012096847A2 PCT/US2012/020504 US2012020504W WO2012096847A2 WO 2012096847 A2 WO2012096847 A2 WO 2012096847A2 US 2012020504 W US2012020504 W US 2012020504W WO 2012096847 A2 WO2012096847 A2 WO 2012096847A2
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- mirror
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- euv light
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- light
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
Definitions
- the present disclosure relates to optical apparatus and methods of using same.
- the conventional apparatus in the market for photomask inspection generally employ ultra-violet (UV) light with wavelengths at or above 193 nanometers (nm). This is suitable for masks designed for use in lithography based on 193nm light.
- UV ultra-violet
- next generation lithographic equipment is now designed for operation in the neighborhood of 13.5nm. Accordingly, patterned masks designed for operation near 13nm must be inspected.
- Such masks are reflective, having a patterned absorber layer over a resonantly-reflecting substrate (EUV multilayer, typically 40 pairs of MoSi with a 7nm period.
- EUV multilayer typically 40 pairs of MoSi with a 7nm period.
- the conventional inspection apparatus uses optics with a combination of wavelength and numerical apertures (NA) that are not sufficient (i.e. too small) to resolve pattern features and pattern defects of interest (printable) in EUV mask patterns characterized by a half-pitch below 22 nanometers (nm).
- NA numerical aperture
- One embodiment disclosed relates to an apparatus for inspecting a photomask using extreme ultra-violet (EUV) light.
- the apparatus includes an illumination source for generating the EUV light which illuminates a target substrate, objective optics for receiving and projecting the EUV light which is reflected from the target substrate, and a sensor for detecting the EUV light which is projected by the objective optics.
- EUV extreme ultra-violet
- the objective optics includes a first mirror which is arranged to receive and reflect the EUV light which is reflected from the target substrate, a second mirror which is arranged to receive and reflect the EUV light which is reflected by the first mirror, a third mirror which is arranged to receive and reflect the EUV light which is reflected by the second mirror, and a fourth mirror which is arranged to receive and reflect the EUV light which is reflected by the third mirror.
- FIG. 1 is a schematic diagram of a reflective imaging apparatus in accordance with an embodiment of the invention.
- FIG. 2 is an optical ray diagram of a mirror distribution for reflective objective optics in accordance with a first embodiment of the invention.
- FIG. 3 is an optical ray diagram of a mirror distribution for reflective objective optics in accordance with a second embodiment of the invention.
- FIG. 4 is an optical ray diagram of a mirror distribution for reflective objective optics in accordance with a third embodiment of the invention.
- EUV microscope objectives having 2 to 4 multilayer-coated mirrors (having 2 to 4 multilayer-coated mirrors) disclosed previously, designed for defect or pattern review applications, with operation in the neighborhood of 13nm wavelength of light, are based have NA in the range 0.05 - 0.12, and an object field extent just adequate to the review (microscopy) task - in the range of 5-20 microns at the mask.
- the resolving power and defect detection sensitivity of EUV objectives with NA in this range are inadequate for production-worthy EUV mask inspection of masks with feature half-pitch (HP) below 18 nm or so, due to shortcomings in both NA and high-quality object field size.
- UV and DUV laser sources of light which are high brightness and relatively high power.
- Light sources with significant spectral brightness in the neighborhood of 13nm are based on pulsed plasmas, with temperatures in the range 20-50 eV. Due to poor conversion efficiency (conversion from input energy to in-band radiation), such plasma sources show limited brightness at 13-14 nm, and raising the brightness significantly can drive source cost (and thus inspection costs imposed on the mask during fabrication) to levels which impair the economic
- EUVL EUV Lithography
- High-throughput operation of mask inspection systems with low brightness plasma sources drives the need for large object field and detector array, to increase the rate of instantaneous image signal integration and conversion to digital representation.
- the imaging optics must maximize the collection of light diffracted or scattered by patterning or multilayer defects residing on the EUV mask of interest. For most defects of interest, which diffract and scatter the incident light over a wide range of angles, increasing the NA of the objective will provide an increase in defect signals.
- Multilayer-mirror based imaging systems have poor transmission of light, due to the limited reflectivity of multilayers at the design wavelengths near 13-14 nm.
- a single MoSi multilayer mirror shows peak spectral reflectivity near 13.5 nm in the range of 60-70%. After multiple reflections from near-normal incidence mirrors in typical illumination and imaging optics in an EUV system, system transmission can fall below 1 %.
- the light reaching the image plane and converted to digital signals by the detector array, from each resolved region of the mask must reach a certain number of primary (13nm) quanta, and so a certain minimum signal-to-noise ratio, which in well designed systems is a strong function of the number of primary quanta (photons absorbed in the detector material, typically silicon).
- the source brightness must be increased, which is difficult to develop and expensive to produce using currently known source technologies.
- the range of angles emitted by the source which are transferred to the mask by the illumination optics can be increased, since the amount of light will increase with this angular range, at least within a range of angles supported by the source brightness.
- the illumination pupil size can be increased until a physical constraint intervenes.
- beam splitters in reflective imaging systems used in conjunction with reflective objects (such as EUV mask inspection using EUV light) can simplify optical design and layout, by allowing interpenetration or overlap of illumination and imaging pupils in angle space.
- Current EUV beam splitter technology have low reflection and transmission coefficients ( 25-35 %). Inspection systems with beamsplitters must increase source brightness greatly to compensate for the loss of light reaching the detector. Inspection optics without a beamsplitter element is thus strongly preferred.
- Periodic MoSi multilayers have an angular bandpass of 20- 25 degrees at 13.5nm. Light incident outside of the angular bandpass is reflected by the multilayer at very low levels, and thus is largely absorbed, or wasted.
- EUVL at 11 HP may use aperiodic multilayers in the EUV mask design, which provide increased angular bandwidth, and enable EUVL imaging at higher NAs than possible with a conventional periodic multilayer design. This improves, but does not fully mitigate the issue of finite angular bandpass.
- UV masks extreme ultra-violet photomasks
- the conventional apparatus are typically "non-actinic" in that they result in an image of the mask that does not represent what will be realized using EUV light during lithography. Rather, the resultant image of the mask lacks both resolution and contrast, such that the image is not very useful for pattern inspection and defect detection.
- EUV inspectors photomask inspectors that use EUV light for imaging
- the current EUV inspectors also have limitations and drawbacks.
- the present patent application discloses reflective imaging apparatus that overcome the above-discussed problems with photomask inspectors.
- acquisition and subsequent signal processing of the signal corresponding to a localized defective pattern can be accomplished by comparing or differencing the digital images from a test region of a pattern and a reference region, whether acquired or synthesized from prior information. Such difference operation removes the pattern, leaving the defect as a perturbation of a quasi-uniform background signal.
- Imaging pupils are often circularly symmetric, leading to symmetric point spread functions at the image plane. While such symmetry is often required in lithography, mask inspection via difference imaging does not require symmetric psf, and consequently the imaging pupil can afford to be asymmetric. In particular, obscuration of a portion of the imaging pupil can be tolerated, if defect signal collection is not compromised significantly. Additionally, the shape of the parent pupil need not be circular. For instance, square or rectangular shapes for the parent are possible, and even advantageous when considering the incremental gain of scattered defect light or signal through addition of pupil region.
- obscuration fractions less than 5 or 10% are preferred.
- Obscuration in 4-mirror designs is often created through the blocking or shadowing of light reflected or scattered from the mask by the second mirror, or M2. Minimizing the size of both reflecting surface and peripheral support of M2 will minimize obscuration.
- the design of structural support for M2 must provide for sufficient rigidity, so that environmental disturbances or vibrations do not drive or lead to dynamic perturbations of M2 position and thus to degradation of image quality through blurring.
- the design process must balance obscuration, structural response and curvature factors in the geometry of the second mirror or M2, in order to secure the minimum viable defect SNR which enables fast and economic mask inspection.
- the choice of chief ray in design of the objective for mask inspection must balance several competing factors.
- the chief ray is defined by the centroid of the angular distribution of light rays transmitted by the objective to the image plane; i.e., with due consideration of the pupil apodization caused by mirror coatings.
- Inspection-optimized EUV objective designs bias the imaging chief rays toward the surface normal to maximize overlap of imaging pupil with multi-layer modulated angular distribution of light scattered by pattern defects, while providing sufficient angular range (still largely restricted to the multilayer angular bandpass) to the illumination pupil to secure adequate photon flux from the limited brightness plasma EUV sources.
- FIG. 1 is a schematic diagram of a reflective imaging apparatus in accordance with an embodiment of the invention.
- the apparatus 100 includes an EUV illumination source 102, an illumination mirror 104, a target substrate 106, a substrate holder 107, objective optics 108, a sensor (detector) 110, and a data processing system 112.
- the EUV illumination source 102 may comprise, for example, a laser-induced plasma source which outputs an EUV light beam 122.
- the EUV light is at a wavelength of 13.5 nm.
- the illumination mirror 104 reflects the EUV light such that the beam 124 illuminates the target substrate 106.
- the target substrate 106 is an EUV mask being inspection.
- the target substrate 106 may be scanned under the beam 124 by controllably translating the substrate holder 107 so that the field of view of the imaging apparatus covers regions on the substrate to be inspected.
- Patterned light 126 is reflected from the target substrate 106 to the reflective objective optics 108.
- Preferred embodiments of the objective optics 108 are described in detail below in relation to FIGS. 2, 3 and 4.
- the objective optics 108 outputs a projection 128 of the patterned light onto the sensor 110.
- the sensor 110 may be a time- delay integration detector array so that the data may be detected while the target substrate is being scanned (translated) under the beam 124.
- the data processing system 112 may include electronic circuitry, one or more microprocessors, data storage, memory and input and output devices. The data processing system 112 may be configured to receive and process data from the sensor 110. In accordance with one embodiment, the data processing system 112 may process and analyze the detected data for pattern inspection and defect detection.
- FIG. 2 is an optical ray diagram of a mirror distribution for the objective optics 108 in accordance with a first embodiment of the invention.
- An optical prescription for the objective optics 108 in FIG. 2 is provided below in Appendix A.
- the mirrors there are four mirrors (202, 204, 206, and 208) arranged as shown in FIG. 2.
- the mirrors are arranged such that the patterned light 126 reflects from the first, second, third, and fourth mirrors (202, 204, 206, and 208, respectively) in that order.
- the first mirror 202 is concave
- the second mirror 204 is concave
- the third mirror 206 is convex
- the fourth mirror 208 is concave.
- the mirrors are, in order: concave;
- the second mirror 204 partially obscures the first mirror 202 from the patterned light 126. In other words, part of the area of the first mirror 202 is blocked by the second mirror 204 from receiving the light 126 reflected from the target substrate 106. Furthermore, an opening in the first mirror 202 is used to let the light reflected by the second mirror 204 pass through to reach the third mirror 206. Applicants have determined that, despite the first mirror 202 being partially obscured and needing a pass-through hole, a high numerical aperture is nevertheless achieved with this embodiment.
- the numerical aperture for the objective optics is at least 0.2, and the field of view is at least 5,000 square microns in area.
- the numerical aperture has been determined to be 0.24, and the size of the field of view has been determined to be 327 microns by 30 microns (9,810 square microns in area).
- both the numerical aperture and field of view are relatively large in this embodiment.
- the working distance is the distance between the target substrate 106 and the nearest optical element (in this case, the second mirror 204). A working distance of at least 100 millimeters (mm) is desirable to provide sufficient space for illumination of the target substrate 106. In this embodiment, the working distance is 145 mm.
- the total track may be defined as the distance from the target substrate 106 to the sensor 110.
- the total trace is 1 ,500 mm.
- FIG. 3 is an optical ray diagram of a mirror distribution for reflective objective optics in accordance with a second embodiment of the invention.
- An optical prescription for the objective optics 108 in FIG. 3 is provided below in Appendix B.
- the mirrors there are four mirrors (302, 304, 306, and 308) arranged as shown in FIG. 3.
- the mirrors are arranged such that the patterned light 126 reflects from the first, second, third, and fourth mirrors (302, 304, 306, and 308, respectively) in that order.
- the first mirror 302 is concave
- the second mirror 304 is concave
- the third mirror 306 is convex
- the fourth mirror 308 is concave.
- the mirrors are, in order: concave; convex; concave; and convex.
- the second mirror 304 partially obscures the first mirror 302 from the patterned light 126. In other words, part of the area of the first mirror 302 is blocked by the second mirror 304 from receiving the light 126 reflected from the target substrate 106. Furthermore, an opening in the first mirror 302 is used to let the light reflected by the second mirror 304 pass through to reach the third mirror 306. Applicants have determined that, despite the first mirror 302 being partially obscured and needing a pass-through hole, a high numerical aperture is nevertheless achieved with this embodiment.
- the numerical aperture for the objective optics is at least 0.2, and the field of view is at least 5,000 square microns in area.
- the numerical aperture has been determined to be 0.24, and the size of the field of view has been determined to be 440 microns by 420 microns (184,800 square microns in area).
- the numerical aperture is relatively large in this embodiment, and the field of view is particularly large. The large field of view advantageously enables multiple sensor columns.
- the working distance is the distance between the target substrate 106 and the nearest optical element (in this case, the second mirror 304).
- a working distance of at least 100 millimeters (mm) is desirable to provide sufficient space for illumination of the target substrate 106.
- the working distance is 237 mm.
- the total track may be defined as the distance from the target substrate 106 to the sensor 110.
- the total trace is 873 mm.
- FIG. 4 is an optical ray diagram of a mirror distribution for reflective objective optics in accordance with a third embodiment of the invention.
- An optical prescription for the objective optics 108 in FIG. 4 is provided below in Appendix C.
- the mirrors there are four mirrors (402, 404, 406, and 408) arranged as shown in FIG. 4.
- the mirrors are arranged such that the patterned light 126 reflects from the first, second, third, and fourth mirrors (402, 404, 406, and 408, respectively) in that order.
- the first mirror 402 is concave
- the second mirror 404 is convex
- the third mirror 406 is concave
- the fourth mirror 408 is concave.
- the mirrors are, in order: concave; convex; concave; and concave.
- the second mirror 404 partially obscures the first mirror 402 from the patterned light 126. In other words, part of the area of the first mirror 402 is blocked by the second mirror 404 from receiving the light 126 reflected from the target substrate 106. Furthermore, an opening in the first mirror 402 is used to let the light reflected by the second mirror 404 pass through to reach the third mirror 406. Applicants have determined that, despite the first mirror 402 being partially obscured and needing a pass-through hole, a high numerical aperture is nevertheless achieved with this embodiment.
- the numerical aperture for the objective optics is at least 0.2, and the field of view is at least 5,000 square microns in area.
- the numerical aperture has been determined to be 0.24, and the size of the field of view has been determined to be 410 microns by 255 microns (104,550 square microns in area).
- the numerical aperture is relatively large in this embodiment, and the field of view is also large.
- the working distance is the distance between the target substrate 106 and the nearest optical element (in this case, the second mirror 404).
- a working distance of at least 100 millimeters (mm) is desirable to provide sufficient space for illumination of the target substrate 106.
- the working distance is 230 mm.
- the total track may be defined as the distance from the target substrate 106 to the sensor 110.
- the total trace is 1 ,420 mm.
- Thickness is axial distance to next surface
- a decenter defines a new coordinate system (displaced and/or rotated) in which subsequent surfaces are defined. Surfaces following a decenter are aligned on the local mechanical axis (z-axis) of the new coordinate system. The new mechanical axis remains in use until changed by another decenter.
- the order in which displacements and tilts are applied on a given surface is specified using different decenter types and these generate different new coordinate systems; those used here are explained below.
- Alpha, beta, and gamma are in degrees.
- TOTAL TRACK 1500. .0000 1500. .0000
- OAL 251. .5370 251. .5370
- DIAMETER 147. .8187 148. .7584
- DIAMETER 0. 7865 0. 7915
- Thickness is axial distance to next surface
- a decenter defines a new coordinate system (displaced and/or rotated) in which subsequent surfaces are defined. Surfaces following a decenter are aligned on the local mechanical axis (z-axis) of the new coordinate system. The new mechanical axis remains in use until changed by another decenter. The order in which displacements and tilts are applied on a given surface is specified using different decenter types and these
- Alpha, beta, and gamma are in degrees.
- DIAMETER 255.1309
- DIAMETER 1.2328
- Thickness is axial distance to next surface
- a decenter defines a new coordinate system (displaced and/or rotated) in which subsequent surfaces are defined. Surfaces following a decenter are aligned on the local mechanical axis (z-axis) of the new coordinate system. The new mechanical axis remains in use until changed by another decenter. The order in which displacements and tilts are applied on a given surface is specified using different decenter types and these
- Alpha, beta, and gamma are in degrees.
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187006207A KR102013083B1 (en) | 2011-01-11 | 2012-01-06 | Apparatus for euv imaging and methods of using same |
EP12734716.9A EP2663897A4 (en) | 2011-01-11 | 2012-01-06 | Apparatus for euv imaging and methods of using same |
JP2013549471A JP6324071B2 (en) | 2011-01-11 | 2012-01-06 | Apparatus for EUV imaging and method using the apparatus |
US13/702,973 US8842272B2 (en) | 2011-01-11 | 2012-01-06 | Apparatus for EUV imaging and methods of using same |
KR1020137020937A KR20140042781A (en) | 2011-01-11 | 2012-01-06 | Apparatus for euv imaging and methods of using same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201161431768P | 2011-01-11 | 2011-01-11 | |
US61/431,768 | 2011-01-11 |
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WO2012096847A2 true WO2012096847A2 (en) | 2012-07-19 |
WO2012096847A3 WO2012096847A3 (en) | 2012-11-01 |
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PCT/US2012/020504 WO2012096847A2 (en) | 2011-01-11 | 2012-01-06 | Apparatus for euv imaging and methods of using same |
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US (1) | US8842272B2 (en) |
EP (1) | EP2663897A4 (en) |
JP (1) | JP6324071B2 (en) |
KR (2) | KR20140042781A (en) |
WO (1) | WO2012096847A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP2014507798A (en) | 2014-03-27 |
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US8842272B2 (en) | 2014-09-23 |
KR20180028072A (en) | 2018-03-15 |
WO2012096847A3 (en) | 2012-11-01 |
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KR102013083B1 (en) | 2019-08-21 |
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