WO2012072127A1 - Led light bulb - Google Patents

Led light bulb Download PDF

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Publication number
WO2012072127A1
WO2012072127A1 PCT/EP2010/068624 EP2010068624W WO2012072127A1 WO 2012072127 A1 WO2012072127 A1 WO 2012072127A1 EP 2010068624 W EP2010068624 W EP 2010068624W WO 2012072127 A1 WO2012072127 A1 WO 2012072127A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
led
characterized
according
led module
heat sink
Prior art date
Application number
PCT/EP2010/068624
Other languages
German (de)
French (fr)
Inventor
Herbert Ritter
Walter Hackhofer
Original Assignee
M & R Automation Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

For an LED module (21; 25) for an LED lighting means (10), comprising at least one LED chip (18; 23) fastened to a substrate material and a heat sink (17; 26) that cools the LED chip (18; 23), the heat sink (17; 26) is designated as the substrate material of the LED chip (18; 23).

Description

LED Light bulb

The invention relates to a LED module for a LED lamp consisting of at least one fixed on a support material LED chip and a LED chip cooling heat sink.

The invention further relates to an LED lamp with an at least one LED chip having LED module for emitting light having LED bulbs following additional elements:

• base with which the LED bulb is screwed into a screw socket and over the the LED lamps electric voltage can be supplied;

• Light surface element, preferably glass dome or plastic dome for

mechanical protection of the LED module and for homogenizing the light emitted by the LED chip light;

• control electronics necessary to drive at least one LED chip as

Current source is formed and which can be supplied via the socket with electrical voltage;

• insulating body formed for electrically isolating the base from the rest of the LED light source.

A LED module, and a LED lamp or an LED light bulb, for example, from the document US 2007/0267976 AI known with which LED

A standard bulb light bulb can be replaced. In most households lights are currently installed with standard sockets for screwing in light bulbs that may no longer be produced in the near future at least in Europe and sold. The well-known LED module comprises a plurality of LEDs (Light Emitting Diode) that radiate in different frequency ranges or colors and light are becoming increasingly popular due to their low power consumption and long life. The LEDs are soldered to a printed circuit board and electrically conductively connected by means of conductor tracks on the printed circuit board and bonding wires. The generated from the LEDs

dissipate heat energy, the known LED module to a heat sink made of thermally highly conductive material. Since the heat sink can not be attached on the light-emitting LEDs, the heat sink is provided below the printed circuit board, so the heat energy generated by the LEDs is relatively poor derived. It LED modules and LED lamps or LED light bulbs are commercially available furthermore, the established as an integrated circuit LEDs - so-called LED chips - used to generate light. With this technology, the LED module is still less to produce, however, an effective dissipating heat energy generated by the LED chips is more important due to the small size of the LED chips.

1 shows the structure of an LED module 1 of the known LED bulb commercially available, including a heat sink 2 is shown in more detail in a sectional view. The LED module 1 has a plurality of LED chips, wherein only one LED chip 3 shown in FIG. 2 The LED chip 3 comprises an integrated circuit 4 which is protected by a transparent protective covering. 5 The protective cover 5 may be colored either clear or with a color conversion means. An anode contact 6 of the LED chip 3 is soldered by a solder layer 7 on a printed circuit board 8 of the LED module. 1 The

Print plate 8 in turn is bonded by an adhesive layer 9 on the heat sink. 2

The illustrated in Figure 1. LED module 1 according to the prior art has now the disadvantage that the heat generated by the integrated circuit 4 of the LED chip 3

Heat energy from the LED chip 3 via the solder layer 7, and the printed circuit board 8 and the

Adhesive layer is transferred to the heat sink 2. 9 During the thermal resistance of the solder layer 7 is still negligibly small, have the printed circuit board 8 and the

Adhesive layer 9 a very poor thermal conductivity to why the LED chip 3 can only relatively slowly release heat energy to the heat sink. 2 since the

Operating temperature of the LED chip 3 is limited in the upward direction means a slow and thus poor heat dissipation of the heat energy generated that only relatively little power can be passed through the LED chip 3, so as not to destroy it. This allows the LED chip 3 are also relatively little light on why the luminosity of the known LED bulb is relatively low.

The invention is thus the object of an LED module and an LED

to create light means, in which the aforementioned disadvantages are avoided.

The invention achieves the object by a LED module in which the heat sink as

Substrate of the LED chip is provided.

The invention achieves the object by a LED lamp wherein a LED module cited above is inserted into the LED lamp. This has the advantage obtained that the LED chip or LED chips may emit the heat energy generated during operation directly to the heat sink. The per unit time can be derived in this manner from the LED chip amount of heat is considerably larger than in the LED module according to the prior art, therefore, the LED chips can be driven with higher current and thus emit more light. The fiction, modern LED module and LED lamps thus shine much brighter, so first bulbs in the range of 100W and more are replaced by LED lamps. This new technology opens up a new market segment for LED lamps to replace very bright shining light bulbs.

It has proven to be advantageous to realize the heat sink made of aluminum because this material has a very low thermal resistance and heat dissipates good. Since the individual LED chips are connected in series for the control electronics mounted on the heat sink, has proved to be advantageous to provide a relatively thin insulating layer between the electrically conductive heat sink and the LED chip to prevent short-circuiting. The use of a dielectric as the insulating layer has proved to be advantageous, it can also be dyed the same white and so the light from the LED chips is reflected to the outside. It can therefore be dispensed with separate reflecting means.

A further advantageous embodiment of a LED module and LED bulb according to the invention is given when the heat sink is formed by an electrically insulating material such as ceramic. The thermal resistance of the ceramic is somewhat greater than that of aluminum, but may be dispensed with in this case, the insulating layer between the heat sink and LED chip, which is why, also in this

Embodiment of the invention very good Wärmeableitwerte yield.

The distance between the respective heat-generating LED chips to one another is absolutely essential in this respect, which is why it is advantageous to the area on which the LED chip can be applied to make as large as possible. As has bulbs have a circular cross section, it has proved advantageous to also select the surface of the heat sink on which the LED chips are soldered circular and to distribute the LED chips as uniformly as possible on the surface. LED chips in SMD design and printed circuit traces of silver or silver-containing material have been found to be particularly advantageous. can be conducted through the use of high-power LED chips, by a larger current before it can be destroyed, the output from the LED module luminous intensity can be further improved.

The LED illuminant with a standardized base and preferably provided with a so-called base E27 has the advantage that bulbs with such bases can be replaced by the corresponding LED lamps very simple.

It is particularly advantageous also to build the modular LED lighting means, wherein the control electronics is accommodated on a printed circuit board, which has a

Contact pin / Steckkontakt- communication with the LED module is connectable.

1 shows the structure of an LED module according to the prior art in a

Sectional view.

Figure 2 shows a side view of an LED bulb and a control electronics contained in the LED light bulb.

3 shows a LED chip in a plan view, a bottom view and a

Sectional view.

Figure 4 shows the construction of a LED module of the invention in a sectional view.

5 shows a LED module in a schematic sectional view, in the heat sink, the circuit board of the control electronics is inserted by means of a pin / Steckkontakt- compound.

Figure 2 shows a side view of a LED light bulb or an LED light bulb 10, which has a glass dome 11 as a light surface element and a socket 12 for screwing into a light bulb socket according to standard E27. Furthermore, the LED light bulb 10 has an insulating body 13, of the base 12 from the rest of the LED

Light bulb 10 is electrically isolated. This is necessary because of the base 12

applied mains voltage of 220V and the heat sink 17 made of aluminum must be at the mains voltage potential not, because a person during the screwing or unscrewing of the light bulb from the socket could receive an electric shock.

In Figure 2 is now symbolically the control electronics 14 is shown next to the LED bulb 10, the bulb 10 provides a controlled current source for the LED chips of the LED. The control electronics 14 is connected via two electrically insulated wires with the two contacts of the base 12 and over the two wires with 220V

Mains for. In Figure 2, the position of the control electronics 5 in the LED light bulb 10 is shown as a rectangle in broken lines 15 °. In Figure 2 are further four

Protective sheaths 16 of the four LED chips of the LED module shown symbolically in its position in the LED light bulb 10 degrees. 2 shows a heat sink 17 of the LED further

Light bulb 10 is shown, which is provided for cooling the LED light bulb 10 degrees. An insert 15A made of plastic is also shown symbolically in Figure 2 as dashed rectangle. The control electronics 5 is held mechanically on the one hand by the insert 15A and the other part of the insert 15A ensures electrical insulation of the control electronics 5 relative to the heat sink 17th

In Figure 3, the left LED chip 18 without protective sheath is shown in a plan view, with two bond contacts are shown of gold as the cathode contacts 19 of the integrated circuit of the LED chips 18th In Figure 3 center of the LED chip 18 is in a

illustrated bottom view, it will be seen that the entire bottom surface of the LED chip 18 is metallized as anode contact 20th In Figure 3, the right of the LED chip 18 is in a

-Sectional view shown, both the cathode pins 19 and the

is illustrated anode contact 20th The two bond contacts are connected via bonding wires to the appropriate tracks.

In Figure 4, the construction of a LED module 21 according to the invention with a directly soldered on the heat sink 17 by means of a solder layer 22 LED chip 23 in a

see sectional view. The heat sink 17 is made of electrically conductive aluminum and the anode contacts of the LED chips of the LED module 21 have through the series circuit at different voltage potentials, and therefore an electrically insulating dielectric is deposited on the surface of the heat sink 17 24th In the dielectric 24 electrically conductive conductor tracks are printed, which are made of silver and with which the LED chips of the LED module 21 are connected to the control electronics 14 in series. The emitted from the LED chip 23 heat energy is supplied via the anode contact 20 and the solder layer 22 and the very thin layer of dielectric 24 discharged practically directly to the heat sink 17th In this way, it is advantageously get a very efficient removal of heat energy, which is why the electronic control 14 chip can memorize a relatively strong current in the LED, which in turn make a relatively large light intensity.

Figure 5 shows another LED module 25 in a schematic sectional view, in which a heat sink 26, the circuit board of a control electronics 27 by means of a

Contact pin / Steckkontakt- connection is plugged 28th The pin / Steckkontakt- compound 28 has two pins 29 to the control electronics 27 and two plug-in contacts 30 on the heat sink 26 for contacting the traces on the dielectric 31st This modular design a particularly cost-effective production of a LED light bulb is ensured.

When the cooling body 26 in the embodiment according to figure 5 by a

Heatsink would be formed of an electrically insulating material such as ceramic, could then be dispensed onto the insulating layer of the dielectric. A particularly cost-effective manufacturing of an LED module and LED bulb would be ensured.

It may be noted that an LED module ten or more LED chips may have. Furthermore, different manifestations of the heat sink depending on the shape of the replicated bulb or other technical needs would be conceivable. An inventive LED module is in a variety of different LED

imagine bulbs and in no way limited to use in an LED light bulb. Thus, an inventive LED module could be used for example in an LED flashlight or LED headlights of a car.

It may be mentioned that the provision of one, two, five or even twenty LED chips may be advantageous depending on the application in the LED module.

Furthermore, it is advantageous to interconnect LED chips to groups which are each supplied by a separate power source. In an LED bulb with two groups of LED chips influencing the color temperature is possible (for example, from warm white to cold white). By adding another group in a so-called three-channel operation and the brightness of the LED lamp can be influenced. The control for changing the color temperature or brightness can be done remotely via radio or via switching signals in the mains voltage.

Claims

claims:
1. LED module (21; 25) for a LED lighting device (10) comprising at least one fixed on a support material LED chip (18; 23) and an LED chip (18; 23) a cooling heat sink (17; 26), characterized in that the heat sink (17; 26) as the support material of the LED chip (18; 23) is provided.
2. LED module (21; 25) according to claim 1, characterized in that at least one second LED chip (18; 23) is provided, which LED chips (18; 23) for a to the LED module (21; 25) connectable power source (14; 27) are connected in series.
3. LED module (21; 25) according to any one of the preceding claims, characterized in that the heat sink (17; 26) of electrically conductive material, preferably aluminum is formed and that the LED chips (18; 23) are electrically conductively connected via conductor tracks which conductor tracks on an insulating layer (24; 31) of the heat sink (17; 26) are applied, preferably printed thereon.
4. LED module (21; 25) according to claim 3, characterized in that the insulating layer (24; 31) is formed by a dielectric having a white color.
5. LED module (21; 25) according to any one of claims 1 or 2, characterized in that the cooling body made of electrically insulating material, preferably ceramic is formed and that the LED chips (18; 23) are electrically conductively connected via conductor tracks, which conductor tracks applied to the heat sink are preferably printed.
6. LED module (21; 25) according to one of the preceding claims, characterized
in that the LED chips (18; 23) supporting surface of the heat sink (17; 26) is formed by a substantially circular area.
(21; 25) 7. LED module according to claim 6, characterized in that the LED chips (18; 23) distributed substantially uniformly to each other and with the maximum possible distance on the surface of the heat sink (17; 26) are provided.
8. LED module (21; 25) according to one of the preceding claims, characterized
in that the LED chips (18; 23) have a SMD construction.
9. LED module (21; 25) according to one of the preceding claims, characterized
in that the conductor tracks of silver or silver-containing material are formed.
10. LED module (21; 25) according to one of the preceding claims, characterized
in that the LED chips (18; 23) are formed by high-power LED chips.
11. LED module according to one of the preceding claims, characterized in that into groups connected LED chips; are provided, wherein each group of LED chips (18, 23) supplied by an own power source, and the LED chips (18 (18 23); 23) a group for the respective current source is connected in series are provided.
12. LED lamp (10) with an at least one LED chip (18; 23) having LED module (21; 25) for emitting light, comprising LED lamps (10), the following further elements:
• base (12) with which the LED lamps (10) in a screw socket
can be screwed and on the the LED lamps (10), electric voltage is supplied;
• light surface element, preferably glass dome (11) or plastic dome, to
mechanical protection of the LED module (21; 25) and for homogenizing the from the LED chip (18; 23) the light emitted;
• control electronics (14; 27) for driving at least one LED chip (18;
23) is designed as a current source and (via the base 12) is supplied with electrical voltage;
• insulating body (13) which is formed to electrically insulate the socket (12) from the rest of the LED light bulb (10),
characterized in that a LED module (21; 25) is provided according to one of claims 1 to 11.
13. LED lamp (10) according to claim 12, characterized in that the base (12) by a standardized socket, preferably by a E27 base is formed.
14. LED lamp (10) according to one of claims 12 or 13, characterized
in that the control electronics (14; 27) to the LED module (21; 25) by means of a pin / Steckkontakt- compound (28) is plugged.
15. LED lamp (10) according to one of claims 12 or 13, characterized
in that the control electronics (14; 27) is plugged to the socket (12) by means of a pin / Steckkontakt- connection or plug strip / board.
PCT/EP2010/068624 2010-12-01 2010-12-01 Led light bulb WO2012072127A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2010/068624 WO2012072127A1 (en) 2010-12-01 2010-12-01 Led light bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2010/068624 WO2012072127A1 (en) 2010-12-01 2010-12-01 Led light bulb

Publications (1)

Publication Number Publication Date
WO2012072127A1 true true WO2012072127A1 (en) 2012-06-07

Family

ID=44501610

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/068624 WO2012072127A1 (en) 2010-12-01 2010-12-01 Led light bulb

Country Status (1)

Country Link
WO (1) WO2012072127A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030040200A1 (en) * 2001-08-24 2003-02-27 Densen Cao Method for making a semiconductor light source
US7196358B1 (en) * 2005-11-25 2007-03-27 Solidlite Corporation Light emitting diode module with high heat dissipation
US20070267976A1 (en) 2003-05-05 2007-11-22 Bohler Christopher L Led-Based Light Bulb
US20080291675A1 (en) * 2007-05-23 2008-11-27 Advanced Connectek Inc. Light emitting diode lamp
DE102007041817A1 (en) * 2007-09-03 2009-03-05 Osram Gesellschaft mit beschränkter Haftung A light emitting module and method of producing the

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030040200A1 (en) * 2001-08-24 2003-02-27 Densen Cao Method for making a semiconductor light source
US20070267976A1 (en) 2003-05-05 2007-11-22 Bohler Christopher L Led-Based Light Bulb
US7196358B1 (en) * 2005-11-25 2007-03-27 Solidlite Corporation Light emitting diode module with high heat dissipation
US20080291675A1 (en) * 2007-05-23 2008-11-27 Advanced Connectek Inc. Light emitting diode lamp
DE102007041817A1 (en) * 2007-09-03 2009-03-05 Osram Gesellschaft mit beschränkter Haftung A light emitting module and method of producing the

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