WO2012067003A1 - Circuit substrate and manufacturing method therefor - Google Patents

Circuit substrate and manufacturing method therefor Download PDF

Info

Publication number
WO2012067003A1
WO2012067003A1 PCT/JP2011/075890 JP2011075890W WO2012067003A1 WO 2012067003 A1 WO2012067003 A1 WO 2012067003A1 JP 2011075890 W JP2011075890 W JP 2011075890W WO 2012067003 A1 WO2012067003 A1 WO 2012067003A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
electronic component
circuit board
protection wall
base material
Prior art date
Application number
PCT/JP2011/075890
Other languages
French (fr)
Japanese (ja)
Inventor
札場　一嘉
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012067003A1 publication Critical patent/WO2012067003A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component

Definitions

  • the present invention relates to a circuit board in which a semiconductor element and other electronic components are arranged on a substrate on which wiring is formed, and a method for manufacturing the circuit board. Moreover, it is related with a display apparatus provided with such a circuit board. Note that this application claims priority based on Japanese Patent Application No. 2010-256709 filed on November 17, 2010, the entire contents of which are incorporated herein by reference. .
  • Circuit boards in which electronic components such as driver ICs, resistors, capacitors, etc. are mounted on a wiring board (base material) are widely used in various electrical appliances (for example, liquid crystal, organic EL and other display devices) and other industrial products. It has been.
  • an adhesive resin material can be used as a means for mounting the electronic component on a substrate.
  • Patent Documents 1 and 2 describe conventional examples in which electronic components are mounted (arranged) on a base material by this type of adhesive means.
  • the present invention has been created to solve the above-described conventional problems, and its purpose is to prevent the oxidative corrosion of the electronic component by covering the entire electronic component with a resin material, and to use the resin. It is an object of the present invention to provide a circuit board and a method of manufacturing the circuit board that can prevent the occurrence of problems due to the outflow of the resin material by limiting the portion to which the material is applied.
  • the circuit board of the present invention has a base material on which predetermined wiring is formed, one or a plurality of electronic components arranged on the base material, and an insulating property that covers at least one of the electronic components. And a resin coating portion made of the above resin.
  • a resin outflow protection wall standing on the substrate is formed.
  • the resin outflow protective wall covers the upper surface of the electronic component and accumulates an insulating resin constituting the resin coating portion in a region extending from the upper surface of the electronic component to the protective wall.
  • the circuit board provided by the present invention includes a resin outflow protection wall, and the resin outflow protection wall accumulates an insulating resin so as to cover the entire surface including the upper surface of the electronic component.
  • the resin outflow protection wall since the resin outflow protection wall is formed in the vicinity of the electronic component, the region where the resin coating portion is formed on the base is limited, and the insulating resin is transferred from the resin outflow protection wall to the electronic component. Is accumulated in a region (resin application region) reaching the upper surface of the resin to form a resin coating portion. For this reason, there is no outflow of the resin material to the region where the resin on the base material should not be applied, and the entire surface (particularly the upper surface) of the electronic component is covered with the resin coating portion to form the resin coating portion.
  • It can be a circuit board having no portion (that is, a portion where the surface of the electronic component is exposed to the atmosphere). As a result, it is possible to provide a highly reliable circuit board that can prevent the occurrence of problems due to the outflow of the resin material and can prevent the oxidative corrosion of the electronic component.
  • the resin outflow protection wall is formed so as to substantially surround the electronic component covered with the resin coating portion.
  • substantially surrounding means a state of being surrounded to such an extent that the outflow of resin from the resin application region can be suppressed, and is not surrounded as much as possible as long as the outflow of resin can be suppressed. It means that there may be a blank part as a large space.
  • the resin outflow protection wall that substantially surrounds the electronic component prevents the resin from flowing out from the resin application region more reliably, and covers the entire electronic component with the formed resin coating portion. Can do.
  • the resin outflow protection wall is formed so as to substantially surround two or more of the electronic components. Two or more electronic components are integrally covered with the resin coating portion.
  • the resin outflow protection wall is formed to a position equal to or higher than a height of the electronic component covered with the resin coating portion from the base material. Has been. According to this configuration, the entire surface of the electronic component can be a circuit board that is more reliably coated with the insulating resin material.
  • an imaginary straight line connecting an upper surface end portion of the electronic component covered with the resin coating portion and a root portion of the resin outflow protection wall, and the base material Is an angle of 45 degrees or less.
  • the base material is a flexible printed board.
  • a display panel for example, a display panel used for a liquid crystal display device or an organic EL display device
  • any circuit board disclosed herein is provided. Since such a display panel includes the circuit board, it can be a display panel with excellent reliability.
  • the electronic component is disposed on the base material (for example, on the wiring formed on the base material), and the electronic component is disposed in the vicinity of at least one electronic component.
  • a resin outflow protection wall is formed in the vicinity of at least one electronic component so as to substantially surround the electronic component, and the resin material is coated so as to cover the upper surface of the electronic component.
  • the resin coating part is formed by coating.
  • a resin outflow protection wall is formed so as to substantially surround the electronic component, and an insulating resin material is applied to a region (resin application region) from the upper surface of the electronic component to the resin outflow protection wall.
  • the resin outflow protection wall prevents the resin material from flowing out, the entire surface of the electronic component can be covered with the resin without applying an excessive resin material to the electronic component. Thereby, since the electronic component is not exposed to the atmosphere, the oxidative corrosion of the electronic component can be effectively prevented.
  • the resin outflow protection wall is formed so as to substantially surround two or more of the electronic components. According to such a configuration, it is possible to effectively use a limited space on the substrate as compared with the case where a resin outflow protection wall is formed for each electronic component, and the resin material is applied (applied) to each electronic component. Therefore, the number of steps for applying the resin material is small.
  • the resin outflow protection wall is formed to a position equal to or higher than the height of the electronic component coated with the resin coating portion from the base material. According to such a configuration, even if the resin material applied to the resin application region is relatively low in viscosity, the resin outflow protection wall is formed at a sufficiently high height, so that the resin is coated to cover the entire electronic component. A covering part can be formed.
  • the resin outflow protection wall is formed so that the angle formed by According to such a configuration, since the resin outflow protection wall is formed at a position sufficiently away from the electronic component, when the resin material is applied to the resin application region, the resin material can flow over the resin outflow protection wall. It can prevent more reliably and can coat
  • FIG. 1 is a plan view schematically showing a circuit board according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic diagram showing the structure of a liquid crystal display panel including a circuit board according to an embodiment of the present invention.
  • FIG. 4 is a plan view schematically showing a circuit board according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a structure around an electronic component arranged on a circuit board according to another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing a structure around an electronic component arranged on a circuit board according to another embodiment of the present invention.
  • FIG. 1 is a plan view schematically showing a circuit board according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic diagram showing the structure of a liquid crystal display panel including a circuit
  • FIG. 7 is a plan view schematically showing a circuit board according to another embodiment of the present invention.
  • FIG. 8 is a schematic view showing a circuit board according to another embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing a peripheral structure of an electronic component arranged on a conventional circuit board.
  • FIG. 1 is a plan view schematically showing a circuit board 100 according to an embodiment of the present invention.
  • 2 is a cross-sectional view taken along line II-II in FIG.
  • symbol is attached
  • the dimensional relationship (length, width, thickness, etc.) in each drawing does not necessarily accurately reflect the actual dimensional relationship.
  • the circuit board 100 roughly includes a base material 10 on which predetermined wiring is formed and a base material 10 (for example, on the wiring of the base material 10). 1 or a plurality of electronic components (for example, a semiconductor element, a resistor, a capacitor, etc.) 30, a resin coating 50 that covers at least one of the electronic components 30, and the vicinity of the electronic component 30.
  • the resin outflow protection wall 70 is provided.
  • the base material 10 is a flexible printed board having flexibility, which is configured by arranging a wiring pattern made of a conductive material such as copper on an insulating film (insulator) mainly made of a resin material such as polyimide. is there.
  • the substrate 10 according to the present embodiment includes a first insulating film 12 a, a wiring pattern 14 made of (stacked) copper (formed) above the insulating film 12 a, and the wiring pattern 14.
  • a second insulating film 12b formed (laminated) above, a ground pattern (GND pattern) 16 made of copper formed (laminated) above the insulating film 12b, and formed above the GND pattern 16 It has a laminated structure including the (laminated) insulating film 12c.
  • the wiring pattern 14 is electrically connected to an electronic component mounting pad (not shown) formed on the surface of the substrate 10 through the through hole 15. As shown in FIG. 2, the electronic component 30 and the wiring pattern 14 are electrically connected by mounting the electronic component 30 with the solder member 40 on the electronic component mounting pad.
  • the base material 10 in the site
  • the resin spill protective wall 70 stands in the vicinity of a plurality (five in this embodiment) of the electronic components 30 arranged on the base material 10 so as to substantially surround the plurality of electronic components 30. Is formed.
  • the resin outflow protection wall 70 according to this embodiment is formed of a solder material. Examples of the solder material include tin (Sn) or a solder alloy containing tin as a main component.
  • the resin outflow protection wall 70 is fixed to the GND pattern 16 where the insulating film 12c of the base material 10 is removed in a predetermined pattern and exposed.
  • the resin outflow protection wall can also be formed using a solder resist. In this case, the resin outflow protection wall can be formed by applying a solder resist using a mask patterned in the vicinity of the electronic component 30 and on the insulating film 12 c of the substrate 10.
  • the resin coating 50 is made of an insulating resin material.
  • the insulating resin material include a thermosetting resin material and a photocurable resin material (for example, an ultraviolet curable resin material).
  • the resin covering portion 50 is accumulated (arranged) by the insulating resin material covering the entire surface including the upper surface of the electronic component 30 and reaching the resin outflow protection wall 70. Is formed. Thereby, since the electronic component 30 is not exposed to the atmosphere, it is possible to effectively prevent the oxidative corrosion of the electronic component 30 itself that may occur due to contact with moisture in the atmosphere.
  • the method according to the present embodiment includes (1) disposing the electronic component 30 on the substrate 10 and (2) resin outflow so as to substantially surround the electronic component 30 in the vicinity of at least one electronic component 30. Forming the protective wall 70; (3) applying an insulating resin material to a region substantially surrounded by the resin outflow protective wall 70, and forming the resin coating portion 50 so as to cover the upper surface of the electronic component 30; To include.
  • the base material 10 is prepared.
  • the base material 10 flows out of the resin at a position (position that substantially surrounds the electronic component 30) that is a predetermined distance away from a portion (typically, an electronic component mounting pad) where the electronic component 30 is disposed.
  • the insulating layer 12c is not formed, and the resin outflow protective wall forming portion 18 where the GND pattern 16 is exposed is provided.
  • the electronic component 30 is placed on the cream solder application portion. Then, the electronic component 30 is mounted (arranged) on the base material 10 by putting the base material 10 in a reflow furnace at a high temperature (about 220 to 260 ° C.) and solidifying the molten solder member 40.
  • the resin outflow protection wall 70 in the vicinity of at least one electronic component 30 so as to substantially surround the electronic component 30 will be described.
  • the resin outflow is a portion where the insulating film 12c on the base material 10 is not formed and the GND pattern 16 is exposed.
  • Cream solder is applied (applied) to the protective wall forming portion 18. At this time, it is preferable to apply the cream solder to a height of at least about one half of the height from the base material 10 of the electronic component 30 surrounded by the resin outflow protection wall 70.
  • the resin outflow protection wall 70 is formed by putting the base material 10 in a reflow furnace at a high temperature (about 220 to 260 ° C.) and solidifying the cream solder.
  • the formation of the resin outflow protection wall 70 may be performed in a separate process from the mounting of the electronic component 30 on the substrate 10.
  • an insulating resin material is applied to a region (resin application region) substantially surrounded by the resin outflow protection wall 70 by, for example, a dispenser method.
  • a region substantially surrounded by the resin outflow protection wall 70
  • the resin outflow protection wall 70 since there is the resin outflow protection wall 70, it is possible to prevent the applied resin material from flowing out of the resin application region.
  • the resin outflow protection wall 70 since the resin outflow protection wall 70 is formed, the resin material is accumulated around the electronic component 30, and the entire surface including the upper surface of the electronic component 30 can be covered with the resin material.
  • the applied resin material is cured to manufacture the circuit board 100 that covers the upper surface of the electronic component 30 and has the resin coating portion 50 formed in a region from the upper surface of the electronic component 30 to the resin outflow protection wall 70. be able to.
  • the entire electronic component 30 is covered with the resin material to prevent the oxidative corrosion of the electronic component 30 and the portion to which the resin material is applied. It is possible to provide a circuit board 100 that can be limited and prevent occurrence of problems due to outflow of resin material.
  • the circuit board 100 can be suitably used as a circuit board mounted on, for example, a display panel (for example, a display panel used in a liquid crystal display device, an organic EL display device, or other display devices).
  • FIG. 3 is a side view schematically showing a state in which the circuit board 100 is connected to the end of the liquid crystal display panel 110.
  • the liquid crystal display panel 110 generally has a rectangular shape as a whole, and has a display area that is an area where a pixel is formed at the center and displays an image.
  • the liquid crystal display panel 110 has the same configuration as the conventional liquid crystal display panel, and a pair of transparent color filter substrate 115 and array substrate 120 facing each other are enclosed between them.
  • the liquid crystal layer 125 has a sandwich structure.
  • a sealing material 130 is provided on the periphery of the color filter substrate 115 and the array substrate 120 so as to surround the periphery of the display region described above, and seals the liquid crystal layer 125.
  • the circuit board 100 using a flexible printed circuit board (FPC) as a base material 10 is disposed on at least one of the four sides constituting the rectangular periphery of the array substrate 120.
  • the circuit board 100 includes a liquid crystal display panel driving electronic component (driver IC chip) 30 for driving the liquid crystal display panel 110 and a resin outflow protection wall 70.
  • a resin coating 50 is formed in a region reaching the outflow protection wall 70.
  • the circuit board 100 By fixing one end of the circuit board 100 having such a configuration to the protruding peripheral edge, the circuit board 100 is connected to electrodes (pixel electrodes, counter electrodes, etc.) in the liquid crystal display panel 110.
  • the liquid crystal display panel 110 including the circuit board 100 can be a liquid crystal display panel 110 having excellent reliability because the oxidative corrosion of the electronic component 30 disposed on the circuit board 100 is prevented.
  • the circuit board 200 according to the present embodiment is formed with a resin outflow protection wall 170 so as to completely surround the plurality of electronic components 30 mounted on the base material 10.
  • a resin coating 150 is formed in a region that covers the upper surface of the electronic component 30 and extends from the upper surface of the electronic component 30 to the resin outflow protection wall 170.
  • the resin outflow protection wall 270 formed on the circuit board 300 according to this embodiment is from the surface of the base material 10 of the electronic component 30 substantially surrounded by the resin outflow protection wall 270.
  • the electronic component 30 is erected so as to have the same height as the top surface.
  • the height of the resin outflow protection wall 270 is changed by adjusting the amount of the resin outflow protection wall 270 when the cream solder is applied to the resin outflow protection wall forming portion 18 on the substrate 10 using a solder printer, for example. be able to.
  • the application of the resin outflow protection wall 270 having the above-described configuration enables the application.
  • the resin-coated portion 250 that covers the entire electronic component 30 can be formed without the resin material flowing out from the resin application region. Even if the resin outflow protection wall 270 is formed to a position higher than the height from the surface of the base material 10 of the electronic component 30 covered with the resin coating portion 250 to the upper surface of the electronic component 30, the same effect as described above can be obtained. can get.
  • the resin coating is not shown in a simplified manner.
  • the upper end portion of the electronic component 30 covered with the resin material and the root portion of the resin outflow protection wall 370 (typically, the resin outflow protection wall 370.
  • the resin outflow protective wall 370 is formed so that the angle ⁇ formed by the boundary between the insulating film 12c and the insulating film 12c is 45 degrees or less (typically 30 to 45 degrees).
  • a circuit board 500 according to a fifth embodiment will be described with reference to FIG.
  • a resin outflow protection wall 470a that substantially surrounds the electronic component 430a is formed in the vicinity of the electronic component 430a.
  • the part 430a is covered.
  • a resin outflow protection wall 470b is formed in the vicinity of the electronic component 430b, and the electronic component 430b is covered with the resin coating portion 450b.
  • the resin outflow protection walls 470a and 470b are formed for each of the electronic components 430a and 430b, thereby preventing the resin material from flowing out and covering the entire electronic components 430a and 430b. Can do.
  • the base material 610 of the circuit board 700 according to this embodiment corresponds to the array substrate of the liquid crystal display panel 680. Pixels for displaying an image are arranged on the front side of the array substrate 610 (the surface facing the color filter substrate 115), and a plurality of source wirings and gate wirings (not shown) for driving each pixel are arranged in a grid. It is formed so as to form a pattern. In each lattice region surrounded by the display wiring, a pixel electrode and a thin film transistor (TFT) which is a switching element are provided.
  • TFT thin film transistor
  • a signal is input to an output wiring and electronic component (driver IC chip) 630 (not shown) electrically connected to the gate wiring and the source wiring at the peripheral portion (electronic component mounting region) of the array substrate 610. Input wiring for the pattern is formed.
  • the array substrate and the color filter substrate described above may be the same as those used in a conventional liquid crystal display panel, and do not characterize the present invention, and thus will not be described in further detail.
  • an electronic component for example, a driver IC
  • 630 that supplies a signal for driving the liquid crystal display panel 680 is soldered on the output wiring and the input wiring by COG (Chip on Glass) mounting. Is mounted (mounted).
  • a resin outflow protection wall 670 standing on the array substrate 610 is formed in the vicinity of the electronic component 630.
  • the resin outflow protection wall 670 covers the upper surface of the electronic component 630 and from the upper surface of the electronic component 630.
  • a resin coating portion 650 is formed in the region extending to.
  • the liquid crystal display panel 680 having such a configuration since the entire surface of the electronic component 630 disposed on the array substrate 610 is covered with a resin material, the liquid crystal display panel excellent in reliability in which the oxidative corrosion of the electronic component 630 is prevented. Can be.
  • the entire electronic component is covered with a resin material to prevent oxidative corrosion of the electronic component, and the portion to which the resin material is applied is limited to prevent the occurrence of problems due to the outflow of the resin material.
  • a circuit board that can be prevented is provided.

Abstract

Provided is a circuit substrate (100) equipped with a substrate (10) on which prescribed wiring has been formed; one or more electronic components (30) formed on the aforementioned substrate; and a resin cover part (50) comprising an insulating resin that covers at least one of the aforementioned electronic components. A resin outflow protective wall (70) is formed upright on the aforementioned substrate near the electronic component(s) covered by the aforementioned resin cover part, and by means of the aforementioned resin outflow protective wall the insulating resin that forms the aforementioned resin cover part covers the top face of the aforementioned electronic component(s) and accumulates in the region from the top face of the electronic component(s) to said protective wall.

Description

回路基板とその製造方法Circuit board and manufacturing method thereof
　本発明は、配線が形成された基材上に半導体素子その他の電子部品が配置された回路基板及びその製造方法に関する。また、そのような回路基板を備える表示装置に関する。
　なお、本出願は２０１０年１１月１７日に出願された日本国特許出願２０１０－２５６７０９号に基づく優先権を主張しており、その出願の全内容は本明細書中に参照として組み入れられている。 The present invention relates to a circuit board in which a semiconductor element and other electronic components are arranged on a substrate on which wiring is formed, and a method for manufacturing the circuit board. Moreover, it is related with a display apparatus provided with such a circuit board.
Note that this application claims priority based on Japanese Patent Application No. 2010-256709 filed on November 17, 2010, the entire contents of which are incorporated herein by reference. .
　種々の電化製品（例えば、液晶、有機ＥＬその他の表示装置）及びその他の工業製品には、ドライバＩＣ、抵抗、コンデンサ等の電子部品が配線基板（基材）に搭載された回路基板が広く用いられている。
　従来、上記電子部品を基材に実装する手段として、接着用の樹脂材料を用いることが挙げられる。例えば、特許文献１や特許文献２にはこの種の接着手段によって基材上に電子部品を実装（配置）させる従来例が記載されている。 Circuit boards in which electronic components such as driver ICs, resistors, capacitors, etc. are mounted on a wiring board (base material) are widely used in various electrical appliances (for example, liquid crystal, organic EL and other display devices) and other industrial products. It has been.
Conventionally, as a means for mounting the electronic component on a substrate, an adhesive resin material can be used. For example, Patent Documents 1 and 2 describe conventional examples in which electronic components are mounted (arranged) on a base material by this type of adhesive means.
日本国特許出願公開２００８－８５１３５号公報Japanese Patent Application Publication No. 2008-85135 日本国特許出願公開２０００－１８３２３７号公報Japanese Patent Application Publication No. 2000-183237
　ところで、上記のような樹脂材料の使用形態に加えて、ドライバＩＣ等の電子部品は湿気等により酸化して腐食する虞があるため、腐食防止のためにかかる樹脂材料を利用することが考えられる。即ち、該電子部品を適当な樹脂材料で覆うことにより、電子部品の表面が大気中へ露出することを防止して、上記酸化腐食から電子部品を保護することがある。しかしながら、図９に示すように、樹脂材料１０５０が流動してしまうため電子部品１０３０の全体が樹脂材料１０５０によって覆われず、電子部品１０３０の上面、特に上面の端部が露出してしまう場合がある。また、電子部品の全体を被覆するために過剰な樹脂材料を塗布すると、基材（配線基板）上の本来樹脂材料を塗布してはいけない部分（領域）にまで樹脂材料が流出してしまい不具合の原因となる場合がある。特に樹脂材料として粘性の低いものを使用する場合はその傾向が顕著となる。
　そこで、本発明は、上述した従来の課題を解決すべく創出されたものであり、その目的は、電子部品の全体を樹脂材料で覆うことにより該電子部品の酸化腐食を防止すると共に、該樹脂材料が塗布される部分を制限して樹脂材料の流出による不具合の発生を未然に防止し得る回路基板並びに該回路基板を製造する方法を提供することである。 By the way, in addition to the use form of the resin material as described above, electronic parts such as driver ICs may be oxidized and corroded by moisture or the like, so it is conceivable to use such resin material for preventing corrosion. . That is, by covering the electronic component with an appropriate resin material, the surface of the electronic component may be prevented from being exposed to the atmosphere, and the electronic component may be protected from the oxidative corrosion. However, as shown in FIG. 9, since the resin material 1050 flows, the entire electronic component 1030 is not covered with the resin material 1050, and the upper surface of the electronic component 1030, in particular, the end of the upper surface may be exposed. is there. Also, if an excessive amount of resin material is applied to cover the entire electronic component, the resin material will flow out to the portion (area) where the resin material should not be applied on the substrate (wiring board). It may cause. In particular, when a resin material having a low viscosity is used, the tendency becomes remarkable.
Accordingly, the present invention has been created to solve the above-described conventional problems, and its purpose is to prevent the oxidative corrosion of the electronic component by covering the entire electronic component with a resin material, and to use the resin. It is an object of the present invention to provide a circuit board and a method of manufacturing the circuit board that can prevent the occurrence of problems due to the outflow of the resin material by limiting the portion to which the material is applied.
　上記目的を実現するべく、本発明により、回路基板が提供される。即ち、本発明の回路基板は、所定の配線が形成された基材と、上記基材上に配置された一又は複数の電子部品と、上記電子部品のうちの少なくとも一つを被覆する絶縁性の樹脂からなる樹脂被覆部とを備えている。ここで、上記樹脂被覆部で被覆された電子部品の近傍には、上記基材上に立設された樹脂流出防護壁が形成されている。上記樹脂流出防護壁によって、上記樹脂被覆部を構成する絶縁性の樹脂が上記電子部品の上面を覆うと共に該電子部品の上面から該防護壁に至る領域に蓄積されている。 In order to realize the above object, a circuit board is provided according to the present invention. That is, the circuit board of the present invention has a base material on which predetermined wiring is formed, one or a plurality of electronic components arranged on the base material, and an insulating property that covers at least one of the electronic components. And a resin coating portion made of the above resin. Here, in the vicinity of the electronic component covered with the resin coating portion, a resin outflow protection wall standing on the substrate is formed. The resin outflow protective wall covers the upper surface of the electronic component and accumulates an insulating resin constituting the resin coating portion in a region extending from the upper surface of the electronic component to the protective wall.
　本発明によって提供される回路基板は、樹脂流出防護壁を備えており、該樹脂流出防護壁によって、絶縁性の樹脂が電子部品の上面を含む全体を覆うように蓄積されている。
　かかる構成によると、樹脂流出防護壁が電子部品の近傍に形成されているため基材上の樹脂被覆部が形成される領域が制限されると共に、絶縁性の樹脂が樹脂流出防護壁から電子部品の上面に至る領域（樹脂塗布領域）に蓄積されて樹脂被覆部が形成される。このため、基材上の樹脂を塗布してはならない領域への樹脂材料の流出がなく、且つ電子部品の表面全体（特に上面）が樹脂被覆部に被覆されており樹脂被覆部が形成されていない部分（即ち、電子部品の表面が大気中に露出した部分）のない回路基板となり得る。これにより、樹脂材料の流出による不具合の発生を未然に防止し得ると共に電子部品の酸化腐食を防止し得る信頼性に優れた回路基板を提供することができる。 The circuit board provided by the present invention includes a resin outflow protection wall, and the resin outflow protection wall accumulates an insulating resin so as to cover the entire surface including the upper surface of the electronic component.
According to such a configuration, since the resin outflow protection wall is formed in the vicinity of the electronic component, the region where the resin coating portion is formed on the base is limited, and the insulating resin is transferred from the resin outflow protection wall to the electronic component. Is accumulated in a region (resin application region) reaching the upper surface of the resin to form a resin coating portion. For this reason, there is no outflow of the resin material to the region where the resin on the base material should not be applied, and the entire surface (particularly the upper surface) of the electronic component is covered with the resin coating portion to form the resin coating portion. It can be a circuit board having no portion (that is, a portion where the surface of the electronic component is exposed to the atmosphere). As a result, it is possible to provide a highly reliable circuit board that can prevent the occurrence of problems due to the outflow of the resin material and can prevent the oxidative corrosion of the electronic component.
　ここで開示される回路基板の一つの好ましい態様では、上記樹脂流出防護壁は、上記樹脂被覆部で被覆された電子部品を実質的に包囲するように形成されている。なお、本明細書において「実質的に包囲」とは、樹脂塗布領域からの樹脂の流出を抑制できる程度に包囲された状態をいい、樹脂の流出を抑制できる限り包囲されていない微小（微細）な空間としての空白部があってもよいことを意味する。
　かかる構成によると、電子部品を実質的に包囲する樹脂流出防護壁によって、樹脂塗布領域からの樹脂の流出をより確実に防止すると共に、形成された樹脂被覆部によって電子部品の全体を被覆することができる。
　また、ここで開示される回路基板の他の一つの好ましい態様では、上記樹脂流出防護壁は、上記電子部品のうちの二以上を実質的に包囲するように形成されており、該包囲された二以上の電子部品は上記樹脂被覆部によって一体的に被覆されている。 In one preferable aspect of the circuit board disclosed herein, the resin outflow protection wall is formed so as to substantially surround the electronic component covered with the resin coating portion. In this specification, “substantially surrounding” means a state of being surrounded to such an extent that the outflow of resin from the resin application region can be suppressed, and is not surrounded as much as possible as long as the outflow of resin can be suppressed. It means that there may be a blank part as a large space.
According to this configuration, the resin outflow protection wall that substantially surrounds the electronic component prevents the resin from flowing out from the resin application region more reliably, and covers the entire electronic component with the formed resin coating portion. Can do.
In another preferred embodiment of the circuit board disclosed herein, the resin outflow protection wall is formed so as to substantially surround two or more of the electronic components. Two or more electronic components are integrally covered with the resin coating portion.
　ここで開示される回路基板の他の一つの好ましい態様では、上記樹脂流出防護壁は、上記樹脂被覆部で被覆された電子部品の上記基材からの高さと同じか又はそれより高い位置まで形成されている。
　かかる構成によると、電子部品の表面の全体が絶縁性の樹脂材料でより確実に被覆された回路基板となり得る。 In another preferred embodiment of the circuit board disclosed herein, the resin outflow protection wall is formed to a position equal to or higher than a height of the electronic component covered with the resin coating portion from the base material. Has been.
According to this configuration, the entire surface of the electronic component can be a circuit board that is more reliably coated with the insulating resin material.
　ここで開示される回路基板の他の一つの好ましい態様では、上記樹脂被覆部で覆われた電子部品の上面端部と上記樹脂流出防護壁の根元部とを結ぶ仮想直線と、上記基材とのなす角度が４５度以下である。
　かかる構成によると、樹脂流出防護壁が電子部品から十分に離れた距離に形成されているため、樹脂被覆部が樹脂流出防護壁を乗り越えることなく形成されると共に、該樹脂被覆部によって電子部品の全体が被覆されている。 In another preferred embodiment of the circuit board disclosed herein, an imaginary straight line connecting an upper surface end portion of the electronic component covered with the resin coating portion and a root portion of the resin outflow protection wall, and the base material Is an angle of 45 degrees or less.
According to this configuration, since the resin outflow protection wall is formed at a distance sufficiently away from the electronic component, the resin coating portion is formed without getting over the resin outflow protection wall, and the resin coating portion prevents the electronic component from The whole is covered.
　ここで開示される回路基板の他の一つの好ましい態様では、上記基材はフレキシブルプリント基板である。
　また、本発明によると、ここで開示されるいずれかの回路基板を備える表示パネル（例えば液晶表示装置や有機ＥＬ表示装置に用いられる表示パネル）が提供される。かかる表示パネルは、上記回路基板を備えていることから、信頼性に優れる表示パネルとなり得る。 In another preferred embodiment of the circuit board disclosed herein, the base material is a flexible printed board.
In addition, according to the present invention, a display panel (for example, a display panel used for a liquid crystal display device or an organic EL display device) including any circuit board disclosed herein is provided. Since such a display panel includes the circuit board, it can be a display panel with excellent reliability.
　また、本発明によると、他の側面として、所定の配線が形成された基材と、上記基材上に配置された一又は複数の電子部品とを備える回路基板を製造する方法が提供される。即ち、ここで開示される回路基板の製造方法は、上記基材上（例えば該基材に形成された配線上）に上記電子部品を配置すること、少なくとも一つの上記電子部品の近傍に該電子部品を実質的に包囲するように樹脂流出防護壁を形成すること、上記樹脂流出防護壁によって実質的に包囲された領域（樹脂塗布領域）に絶縁性の樹脂材料を塗布（付与）し、上記電子部品の上面を被覆するように樹脂被覆部を形成すること、を包含する。
　本発明の回路基板の製造方法では、少なくとも一つの電子部品の近傍に該電子部品を実質的に包囲するように樹脂流出防護壁を形成して、電子部品の上面を被覆するように樹脂材料を塗布して樹脂被覆部を形成している。
　このように、電子部品を実質的に包囲するように樹脂流出防護壁を形成して、電子部品の上面から樹脂流出防護壁に至る領域（樹脂塗布領域）に絶縁性の樹脂材料を塗布することによって、樹脂材料を塗布してはならない部分（領域）に樹脂材料が流出することなく電子部品の全体を被覆するような樹脂被覆部を形成することができる。また、樹脂流出防護壁によって、樹脂材料の流出が防止されるため、電子部品に過剰な樹脂材料を塗布することなく電子部品の表面の全体を樹脂で被覆することができる。これにより、電子部品は大気中へ露出されないため該電子部品の酸化腐食を効果的に防止することができる。 According to the present invention, as another aspect, there is provided a method of manufacturing a circuit board including a base material on which predetermined wiring is formed and one or more electronic components arranged on the base material. . That is, in the circuit board manufacturing method disclosed herein, the electronic component is disposed on the base material (for example, on the wiring formed on the base material), and the electronic component is disposed in the vicinity of at least one electronic component. Forming a resin outflow protection wall so as to substantially surround the component; applying (applying) an insulating resin material to a region (resin application region) substantially surrounded by the resin outflow protection wall; Forming a resin coating portion so as to cover the upper surface of the electronic component.
In the circuit board manufacturing method of the present invention, a resin outflow protection wall is formed in the vicinity of at least one electronic component so as to substantially surround the electronic component, and the resin material is coated so as to cover the upper surface of the electronic component. The resin coating part is formed by coating.
In this way, a resin outflow protection wall is formed so as to substantially surround the electronic component, and an insulating resin material is applied to a region (resin application region) from the upper surface of the electronic component to the resin outflow protection wall. Thus, it is possible to form a resin coating portion that covers the entire electronic component without flowing out of the resin material in a portion (region) where the resin material should not be applied. In addition, since the resin outflow protection wall prevents the resin material from flowing out, the entire surface of the electronic component can be covered with the resin without applying an excessive resin material to the electronic component. Thereby, since the electronic component is not exposed to the atmosphere, the oxidative corrosion of the electronic component can be effectively prevented.
　ここで開示される製造方法の一つの好ましい態様では、上記電子部品のうちの二以上を実質的に包囲するように上記樹脂流出防護壁を形成する。
　かかる構成によると、電子部品ごとに樹脂流出防護壁を形成する場合と比較して、基材上の限られたスペースを有効利用することができると共に、電子部品ごとに樹脂材料を塗布（付与）する必要がないため、樹脂材料を塗布する工程が少なくて済む。 In one preferable aspect of the manufacturing method disclosed herein, the resin outflow protection wall is formed so as to substantially surround two or more of the electronic components.
According to such a configuration, it is possible to effectively use a limited space on the substrate as compared with the case where a resin outflow protection wall is formed for each electronic component, and the resin material is applied (applied) to each electronic component. Therefore, the number of steps for applying the resin material is small.
　ここで開示される製造方法の他の一つの好ましい態様では、上記樹脂被覆部で被覆された電子部品の上記基材からの高さと同じか又はそれより高い位置まで上記樹脂流出防護壁を形成する。
　かかる構成によると、樹脂塗布領域に塗布する樹脂材料の粘性が比較的低いものであっても樹脂流出防護壁が十分な高さに形成されているため、電子部品の全体を被覆するように樹脂被覆部を形成することができる。 In another preferred embodiment of the manufacturing method disclosed herein, the resin outflow protection wall is formed to a position equal to or higher than the height of the electronic component coated with the resin coating portion from the base material. .
According to such a configuration, even if the resin material applied to the resin application region is relatively low in viscosity, the resin outflow protection wall is formed at a sufficiently high height, so that the resin is coated to cover the entire electronic component. A covering part can be formed.
　ここで開示される製造方法の他の一つの好ましい態様では、上記樹脂被覆部で覆われた電子部品の上面端部と上記樹脂流出防護壁の根元部とを結ぶ仮想直線と、上記基材とのなす角度が４５度以下となるように上記樹脂流出防護壁を形成する。
　かかる構成によると、樹脂流出防護壁が電子部品から十分に離れた位置に形成されるため、樹脂塗布領域に樹脂材料を塗布した際に、樹脂材料が樹脂流出防護壁を乗り越えて流出することをより確実に防止すると共に電子部品の表面全体を樹脂材料で被覆することができる。 In another preferable aspect of the manufacturing method disclosed herein, an imaginary straight line connecting an upper surface end portion of the electronic component covered with the resin coating portion and a root portion of the resin outflow protection wall, and the base material The resin outflow protection wall is formed so that the angle formed by
According to such a configuration, since the resin outflow protection wall is formed at a position sufficiently away from the electronic component, when the resin material is applied to the resin application region, the resin material can flow over the resin outflow protection wall. It can prevent more reliably and can coat | cover the whole surface of an electronic component with a resin material.
図１は、本発明の一実施形態に係る回路基板を模式的に示す平面図である。FIG. 1 is a plan view schematically showing a circuit board according to an embodiment of the present invention. 図２は、図１中のＩＩ‐ＩＩ線に沿う断面図である。FIG. 2 is a cross-sectional view taken along line II-II in FIG. 図３は、本発明の一実施形態に係る回路基板を備えた液晶表示パネルの構造を示す模式図である。FIG. 3 is a schematic diagram showing the structure of a liquid crystal display panel including a circuit board according to an embodiment of the present invention. 図４は、本発明の他の一実施形態に係る回路基板を模式的に示す平面図である。FIG. 4 is a plan view schematically showing a circuit board according to another embodiment of the present invention. 図５は、本発明の他の一実施形態に係る回路基板上に配置されている電子部品の周辺の構造を示す断面図である。FIG. 5 is a cross-sectional view showing a structure around an electronic component arranged on a circuit board according to another embodiment of the present invention. 図６は、本発明の他の一実施形態に係る回路基板上に配置されている電子部品の周辺の構造を示す断面図である。FIG. 6 is a cross-sectional view showing a structure around an electronic component arranged on a circuit board according to another embodiment of the present invention. 図７は、本発明の他の一実施形態に係る回路基板を模式的に示す平面図である。FIG. 7 is a plan view schematically showing a circuit board according to another embodiment of the present invention. 図８は、本発明の他の一実施形態に係る回路基板を示す模式図である。FIG. 8 is a schematic view showing a circuit board according to another embodiment of the present invention. 図９は、従来の回路基板上に配置されている電子部品の周辺の構造を示す断面図である。FIG. 9 is a cross-sectional view showing a peripheral structure of an electronic component arranged on a conventional circuit board.
　以下、図面を参照しながら、本発明の好適な実施形態を説明する。なお、本明細書において特に言及している事項以外の事柄であって本発明の実施に必要な事項は、当該分野における従来技術に基づく当業者の設計事項として把握され得る。本発明は、本明細書及び図面によって開示されている内容と当該分野における技術常識とに基づいて実施することができる。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. It should be noted that matters other than matters specifically mentioned in the present specification and necessary for carrying out the present invention can be grasped as design matters of those skilled in the art based on the prior art in this field. The present invention can be carried out based on the contents disclosed in the present specification and drawings and the common general technical knowledge in the field.
　まず、図１及び図２を参照しながら、本発明の好ましい一実施形態（第１の実施形態）に係る回路基板１００について説明する。図１は、本発明の一実施形態に係る回路基板１００を模式的に示す平面図である。図２は、図１中のＩＩ‐ＩＩ線に沿う断面図である。なお、以下の図面において、同じ作用を奏する部材、部位には同じ符号を付し、重複する説明は省略又は簡略化することがある。また、各図における寸法関係（長さ、幅、厚さ等）は、必ずしも実際の寸法関係を正確に反映するものではない。 First, a circuit board 100 according to a preferred embodiment (first embodiment) of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view schematically showing a circuit board 100 according to an embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. In addition, in the following drawings, the same code | symbol is attached | subjected to the member and site | part which show the same effect | action, and the overlapping description may be abbreviate | omitted or simplified. In addition, the dimensional relationship (length, width, thickness, etc.) in each drawing does not necessarily accurately reflect the actual dimensional relationship.
　図１及び図２に示すように、本実施形態に係る回路基板１００は、大まかに言って、所定の配線が形成された基材１０と、基材１０上（例えば基材１０の配線上）に配置された一又は複数の電子部品（例えば、半導体素子、抵抗、コンデンサ等）３０と、電子部品３０のうちの少なくとも一つを被覆する樹脂被覆部５０と、電子部品３０の近傍に形成された樹脂流出防護壁７０とを備えている。 As shown in FIGS. 1 and 2, the circuit board 100 according to the present embodiment roughly includes a base material 10 on which predetermined wiring is formed and a base material 10 (for example, on the wiring of the base material 10). 1 or a plurality of electronic components (for example, a semiconductor element, a resistor, a capacitor, etc.) 30, a resin coating 50 that covers at least one of the electronic components 30, and the vicinity of the electronic component 30. The resin outflow protection wall 70 is provided.
　基材１０は、例えば、ポリイミド等の樹脂材料を主体とする絶縁膜（絶縁体）の上に銅などの導電材料からなる配線パターンを配置して構成された、柔軟性を有するフレキシブルプリント基板である。本実施形態に係る基材１０は、図２に示すように、第１の絶縁膜１２ａと、該絶縁膜１２ａの上方に形成（積層）された銅からなる配線パターン１４と、該配線パターン１４の上方に形成（積層）された第２の絶縁膜１２ｂと、該絶縁膜１２ｂの上方に形成（積層）された銅からなるグラウンドパターン（ＧＮＤパターン）１６と、該ＧＮＤパターン１６の上方に形成（積層）された絶縁膜１２ｃとを含む積層構造を有している。配線パターン１４は、スルーホール１５を介して基材１０の表面に形成された図示しない電子部品実装用のパッドに電気的に接続している。図２に示すように、該電子部品実装用のパッドに電子部品３０がはんだ部材４０によって実装されることによって、電子部品３０と配線パターン１４とが電気的に接続されている。なお、基材１０において、後述する樹脂流出防護壁７０が形成される部位では、絶縁膜１２ｃが形成されておらずＧＮＤパターン１６が露出した構成となっている。また、基材１０としては、ガラスエポキシ基板等のリジッド基板を用いてもよい。 The base material 10 is a flexible printed board having flexibility, which is configured by arranging a wiring pattern made of a conductive material such as copper on an insulating film (insulator) mainly made of a resin material such as polyimide. is there. As shown in FIG. 2, the substrate 10 according to the present embodiment includes a first insulating film 12 a, a wiring pattern 14 made of (stacked) copper (formed) above the insulating film 12 a, and the wiring pattern 14. A second insulating film 12b formed (laminated) above, a ground pattern (GND pattern) 16 made of copper formed (laminated) above the insulating film 12b, and formed above the GND pattern 16 It has a laminated structure including the (laminated) insulating film 12c. The wiring pattern 14 is electrically connected to an electronic component mounting pad (not shown) formed on the surface of the substrate 10 through the through hole 15. As shown in FIG. 2, the electronic component 30 and the wiring pattern 14 are electrically connected by mounting the electronic component 30 with the solder member 40 on the electronic component mounting pad. In addition, in the base material 10, in the site | part in which the resin outflow protection wall 70 mentioned later is formed, it is the structure which the GND pattern 16 was exposed without the insulating film 12c being formed. Further, as the base material 10, a rigid substrate such as a glass epoxy substrate may be used.
　樹脂流出防護壁７０は、基材１０上に配置された複数（本実施形態では５個）の電子部品３０の近傍であって該複数の電子部品３０を実質的に包囲するような位置に立設されて形成されている。本実施形態に係る樹脂流出防護壁７０は、はんだ材料から形成されている。はんだ材料としては、例えば、スズ（Ｓｎ）若しくはスズを主成分とするはんだ合金が挙げられる。樹脂流出防護壁７０は、上記基材１０の絶縁膜１２ｃが所定のパターンに取り除かれて露出するＧＮＤパターン１６に固着している。
　なお、樹脂流出防護壁は、ソルダーレジストを用いても形成することができる。この場合、電子部品３０の近傍であって上記基材１０の絶縁膜１２ｃ上にパターニングされたマスクを用いてソルダーレジストを塗布することによって樹脂流出防護壁を形成することができる。 The resin spill protective wall 70 stands in the vicinity of a plurality (five in this embodiment) of the electronic components 30 arranged on the base material 10 so as to substantially surround the plurality of electronic components 30. Is formed. The resin outflow protection wall 70 according to this embodiment is formed of a solder material. Examples of the solder material include tin (Sn) or a solder alloy containing tin as a main component. The resin outflow protection wall 70 is fixed to the GND pattern 16 where the insulating film 12c of the base material 10 is removed in a predetermined pattern and exposed.
The resin outflow protection wall can also be formed using a solder resist. In this case, the resin outflow protection wall can be formed by applying a solder resist using a mask patterned in the vicinity of the electronic component 30 and on the insulating film 12 c of the substrate 10.
　樹脂被覆部５０は、絶縁性の樹脂材料から構成される。絶縁性の樹脂材料としては、例えば、熱硬化性樹脂材料や光硬化性樹脂材料（例えば紫外線硬化性樹脂材料）が挙げられる。図１及び図２に示すように、樹脂被覆部５０は、絶縁性の樹脂材料が電子部品３０の上面を含む全面を覆って樹脂流出防護壁７０に至る領域に蓄積（配置）されることによって形成されている。これにより、電子部品３０は大気中に露出しないため大気中の水分等との接触により起こり得る該電子部品３０自体の酸化腐食を効果的に防止することができる。 The resin coating 50 is made of an insulating resin material. Examples of the insulating resin material include a thermosetting resin material and a photocurable resin material (for example, an ultraviolet curable resin material). As shown in FIGS. 1 and 2, the resin covering portion 50 is accumulated (arranged) by the insulating resin material covering the entire surface including the upper surface of the electronic component 30 and reaching the resin outflow protection wall 70. Is formed. Thereby, since the electronic component 30 is not exposed to the atmosphere, it is possible to effectively prevent the oxidative corrosion of the electronic component 30 itself that may occur due to contact with moisture in the atmosphere.
　次に、本実施形態に係る回路基板１００の製造方法の一例について図１及び図２を参照しつつ説明する。本実施形態に係る方法は、（１）基材１０上に電子部品３０を配置すること、（２）少なくとも一つの電子部品３０の近傍に該電子部品３０を実質的に包囲するように樹脂流出防護壁７０を形成すること、（３）樹脂流出防護壁７０によって実質的に包囲された領域に絶縁性の樹脂材料を塗布し、電子部品３０の上面を被覆するように樹脂被覆部５０を形成することを包含する。 Next, an example of a method for manufacturing the circuit board 100 according to the present embodiment will be described with reference to FIGS. The method according to the present embodiment includes (1) disposing the electronic component 30 on the substrate 10 and (2) resin outflow so as to substantially surround the electronic component 30 in the vicinity of at least one electronic component 30. Forming the protective wall 70; (3) applying an insulating resin material to a region substantially surrounded by the resin outflow protective wall 70, and forming the resin coating portion 50 so as to cover the upper surface of the electronic component 30; To include.
　まず、上述した基材１０上に電子部品３０を配置する工程について説明する。上記基材１０を用意する。該基材１０は、電子部品３０を配置する部位（典型的には電子部品実装用パッド）から所定の距離だけ離れた位置（電子部品３０を実質的に包囲するような位置）において、樹脂流出防護壁７０を形成するために絶縁膜１２ｃが形成されておらずＧＮＤパターン１６が露出している樹脂流出防護壁形成部位１８を有している。そして、上記基材１０の電子部品３０を配置する部位上に、例えば半田印刷機を用いてクリームはんだ（はんだの粉末にフラックスを加えて適当な粘度にしたもの）を塗布（付与）して、クリームはんだの塗布部分に電子部品３０を載置する。その後、基材１０を高温（凡そ２２０℃から２６０℃程度）のリフロー炉に入れて、溶融したはんだ部材４０を固化させることによって電子部品３０を基材１０上に実装（配置）する。 First, the process of arranging the electronic component 30 on the base material 10 described above will be described. The base material 10 is prepared. The base material 10 flows out of the resin at a position (position that substantially surrounds the electronic component 30) that is a predetermined distance away from a portion (typically, an electronic component mounting pad) where the electronic component 30 is disposed. In order to form the protective wall 70, the insulating layer 12c is not formed, and the resin outflow protective wall forming portion 18 where the GND pattern 16 is exposed is provided. Then, on the part of the substrate 10 where the electronic component 30 is placed, for example, a solder printer is used to apply (apply) cream solder (the solder powder is made to have an appropriate viscosity by adding a flux), The electronic component 30 is placed on the cream solder application portion. Then, the electronic component 30 is mounted (arranged) on the base material 10 by putting the base material 10 in a reflow furnace at a high temperature (about 220 to 260 ° C.) and solidifying the molten solder member 40.
　次に、少なくとも一つの電子部品３０の近傍に該電子部品３０を実質的に包囲するように樹脂流出防護壁７０を形成する工程について説明する。上記基材１０の電子部品３０を配置する部位上にクリームはんだを塗布する際に、上記基材１０上の絶縁膜１２ｃが形成されておらずＧＮＤパターン１６が露出している部位である樹脂流出防護壁形成部位１８にクリームはんだを塗布（付与）する。このとき、クリームはんだは、樹脂流出防護壁７０で包囲する電子部品３０の基材１０からの高さの少なくとも２分の１程度の高さに塗布することが好ましい。そして、基材１０を高温（凡そ２２０℃から２６０℃程度）のリフロー炉に入れて上記クリームはんだを固化させることによって樹脂流出防護壁７０を形成する。かかる樹脂流出防護壁７０を形成することは、上記電子部品３０を基材１０上に実装するのとは別工程で行ってもよい。 Next, a process of forming the resin outflow protection wall 70 in the vicinity of at least one electronic component 30 so as to substantially surround the electronic component 30 will be described. When the solder paste is applied on the portion of the base material 10 where the electronic component 30 is placed, the resin outflow is a portion where the insulating film 12c on the base material 10 is not formed and the GND pattern 16 is exposed. Cream solder is applied (applied) to the protective wall forming portion 18. At this time, it is preferable to apply the cream solder to a height of at least about one half of the height from the base material 10 of the electronic component 30 surrounded by the resin outflow protection wall 70. Then, the resin outflow protection wall 70 is formed by putting the base material 10 in a reflow furnace at a high temperature (about 220 to 260 ° C.) and solidifying the cream solder. The formation of the resin outflow protection wall 70 may be performed in a separate process from the mounting of the electronic component 30 on the substrate 10.
　次に、樹脂流出防護壁７０によって実質的に包囲された領域に絶縁性の樹脂材料を塗布し、電子部品３０の上面を被覆するように樹脂被覆部５０を形成する工程について説明する。上記樹脂流出防護壁７０が形成された基材１０において、樹脂流出防護壁７０で実質的に包囲された領域（樹脂塗布領域）に絶縁性の樹脂材料を、例えば、ディスペンサ方式によって塗布する。このとき、樹脂流出防護壁７０があるため、塗布された樹脂材料が上記樹脂塗布領域外へと流出するのを防ぐことができる。さらに、樹脂流出防護壁７０が形成されていることで樹脂材料が電子部品３０の周りに蓄積されていき、電子部品３０の上面を含む全面を樹脂材料によって被覆することができる。その後、塗布した樹脂材料を硬化させることによって、電子部品３０の上面を覆うと共に該電子部品３０の上面から樹脂流出防護壁７０に至る領域に樹脂被覆部５０が形成された回路基板１００を製造することができる。以上より、本実施形態に係る回路基板１００の製造方法によると、電子部品３０の全体を樹脂材料で覆うことにより該電子部品３０の酸化腐食を防止すると共に、該樹脂材料が塗布される部分を制限して樹脂材料の流出による不具合の発生を未然に防止し得る回路基板１００を提供することができる。 Next, a process of applying an insulating resin material to a region substantially surrounded by the resin outflow protection wall 70 and forming the resin coating portion 50 so as to cover the upper surface of the electronic component 30 will be described. In the base material 10 on which the resin outflow protection wall 70 is formed, an insulating resin material is applied to a region (resin application region) substantially surrounded by the resin outflow protection wall 70 by, for example, a dispenser method. At this time, since there is the resin outflow protection wall 70, it is possible to prevent the applied resin material from flowing out of the resin application region. Furthermore, since the resin outflow protection wall 70 is formed, the resin material is accumulated around the electronic component 30, and the entire surface including the upper surface of the electronic component 30 can be covered with the resin material. Thereafter, the applied resin material is cured to manufacture the circuit board 100 that covers the upper surface of the electronic component 30 and has the resin coating portion 50 formed in a region from the upper surface of the electronic component 30 to the resin outflow protection wall 70. be able to. As described above, according to the method for manufacturing the circuit board 100 according to the present embodiment, the entire electronic component 30 is covered with the resin material to prevent the oxidative corrosion of the electronic component 30 and the portion to which the resin material is applied. It is possible to provide a circuit board 100 that can be limited and prevent occurrence of problems due to outflow of resin material.
　ここで、上記回路基板１００は、例えば、表示パネル（例えば液晶表示装置、有機ＥＬ表示装置その他の表示装置に用いる表示パネル）に搭載される回路基板として好適に使用し得る。図３は、液晶表示パネル１１０の端部に回路基板１００が接続されている状態を模式的に示す側面図である。
　液晶表示パネル１１０は、概して、全体として矩形の形状を有しており、その中央に画素が形成されている領域であって画像を表示する表示領域を有している。また、図３に示すように、液晶表示パネル１１０は、従来の液晶表示パネルと同様の構成をしており、互いに対向する一対の透明性のカラーフィルタ基板１１５及びアレイ基板１２０と、その間に封入される液晶層１２５とから構成されるサンドイッチ構造を有している。カラーフィルタ基板１１５及びアレイ基板１２０の周縁部には、上述した表示領域の周囲を囲むようにシール材１３０が設けられており、上記液晶層１２５を封止している。アレイ基板１２０の矩形状の周縁を構成する四辺のうち少なくとも一辺の周縁部には、図３に示すように、フレキシブルプリント基板（ＦＰＣ）を基材１０とする上記回路基板１００が配置されている。かかる回路基板１００には、液晶表示パネル１１０を駆動するための液晶表示パネル駆動用の電子部品（ドライバＩＣチップ）３０と、樹脂流出防護壁７０とを備えており、電子部品３０の上面から樹脂流出防護壁７０に至る領域に樹脂被覆５０が形成されている。このような構成の回路基板１００の一方の端部が上記はみ出た周縁部に固定されることにより、該回路基板１００は、液晶表示パネル１１０内の電極（画素電極や対向電極等）に接続される。回路基板１００を備える液晶表示パネル１１０は、回路基板１００上に配置された電子部品３０の酸化腐食が防止されているため信頼性に優れる液晶表示パネル１１０となり得る。 Here, the circuit board 100 can be suitably used as a circuit board mounted on, for example, a display panel (for example, a display panel used in a liquid crystal display device, an organic EL display device, or other display devices). FIG. 3 is a side view schematically showing a state in which the circuit board 100 is connected to the end of the liquid crystal display panel 110.
The liquid crystal display panel 110 generally has a rectangular shape as a whole, and has a display area that is an area where a pixel is formed at the center and displays an image. As shown in FIG. 3, the liquid crystal display panel 110 has the same configuration as the conventional liquid crystal display panel, and a pair of transparent color filter substrate 115 and array substrate 120 facing each other are enclosed between them. The liquid crystal layer 125 has a sandwich structure. A sealing material 130 is provided on the periphery of the color filter substrate 115 and the array substrate 120 so as to surround the periphery of the display region described above, and seals the liquid crystal layer 125. As shown in FIG. 3, the circuit board 100 using a flexible printed circuit board (FPC) as a base material 10 is disposed on at least one of the four sides constituting the rectangular periphery of the array substrate 120. . The circuit board 100 includes a liquid crystal display panel driving electronic component (driver IC chip) 30 for driving the liquid crystal display panel 110 and a resin outflow protection wall 70. A resin coating 50 is formed in a region reaching the outflow protection wall 70. By fixing one end of the circuit board 100 having such a configuration to the protruding peripheral edge, the circuit board 100 is connected to electrodes (pixel electrodes, counter electrodes, etc.) in the liquid crystal display panel 110. The The liquid crystal display panel 110 including the circuit board 100 can be a liquid crystal display panel 110 having excellent reliability because the oxidative corrosion of the electronic component 30 disposed on the circuit board 100 is prevented.
　次に、図４を参照しつつ第２の実施形態に係る回路基板２００について説明する。
　図４に示すように、本実施形態に係る回路基板２００は、基材１０上に実装された複数の電子部品３０を完全に包囲するように樹脂流出防護壁１７０が形成されている。そして、電子部品３０の上面を覆うと共に該電子部品３０の上面から樹脂流出防護壁１７０に至る領域に樹脂被覆部１５０が形成されている。このように、電子部品３０が樹脂流出防護壁１７０によって完全に包囲されているため、樹脂材料を樹脂塗布領域に塗布する際に、該樹脂材料の流出を確実に防止することができる。特に粘度の低い樹脂材料を塗布するときに効果を発揮する。 Next, a circuit board 200 according to the second embodiment will be described with reference to FIG.
As shown in FIG. 4, the circuit board 200 according to the present embodiment is formed with a resin outflow protection wall 170 so as to completely surround the plurality of electronic components 30 mounted on the base material 10. A resin coating 150 is formed in a region that covers the upper surface of the electronic component 30 and extends from the upper surface of the electronic component 30 to the resin outflow protection wall 170. Thus, since the electronic component 30 is completely surrounded by the resin outflow protection wall 170, the resin material can be reliably prevented from flowing out when the resin material is applied to the resin application region. This is particularly effective when a resin material having a low viscosity is applied.
　次に、図５を参照しつつ第３の実施形態に係る回路基板３００について説明する。
　図５に示すように、本実施形態に係る回路基板３００に形成された樹脂流出防護壁２７０は、該樹脂流出防護壁２７０によって実質的に包囲されている電子部品３０の基材１０の表面から該電子部品３０の上面までの高さと同じ高さとなるように立設している。樹脂流出防護壁２７０は、例えば、半田印刷機を用いてクリームはんだを基材１０上の樹脂流出防護壁形成部位１８に塗布する際に、その塗布量を調節することによってその高さを変更することができる。基材１０の表面のスペースが限られているために電子部品３０と樹脂流出防護壁２７０との間隔が比較的狭い場合であっても、上記形態の樹脂流出防護壁２７０を備えることによって，塗布した樹脂材料が樹脂塗布領域から流出することなく、電子部品３０の全体を被覆した樹脂被覆部２５０を形成することができる。なお、樹脂流出防護壁２７０は、樹脂被覆部２５０で被覆された電子部品３０の基材１０の表面から該電子部品３０の上面までの高さより高い位置まで形成しても上記と同様の効果が得られる。 Next, a circuit board 300 according to the third embodiment will be described with reference to FIG.
As shown in FIG. 5, the resin outflow protection wall 270 formed on the circuit board 300 according to this embodiment is from the surface of the base material 10 of the electronic component 30 substantially surrounded by the resin outflow protection wall 270. The electronic component 30 is erected so as to have the same height as the top surface. The height of the resin outflow protection wall 270 is changed by adjusting the amount of the resin outflow protection wall 270 when the cream solder is applied to the resin outflow protection wall forming portion 18 on the substrate 10 using a solder printer, for example. be able to. Even if the space between the electronic component 30 and the resin outflow protection wall 270 is relatively narrow due to the limited space on the surface of the base material 10, the application of the resin outflow protection wall 270 having the above-described configuration enables the application. The resin-coated portion 250 that covers the entire electronic component 30 can be formed without the resin material flowing out from the resin application region. Even if the resin outflow protection wall 270 is formed to a position higher than the height from the surface of the base material 10 of the electronic component 30 covered with the resin coating portion 250 to the upper surface of the electronic component 30, the same effect as described above can be obtained. can get.
　次に、図６を参照しつつ第４の実施形態に係る回路基板４００について説明する。なお、図６では、樹脂被覆部は簡略化して図示していない。
　図６に示すように、本実施形態に係る回路基板４００では、樹脂材料で被覆する電子部品３０の上面端部と、樹脂流出防護壁３７０の根元部（典型的には、樹脂流出防護壁３７０と絶縁膜１２ｃとの境界部分）とのなす角度θが４５度以下（典型的には３０度～４５度）となるように樹脂流出防護壁３７０を形成している。上記角度となるように樹脂流出防護壁３７０を電子部品３０の近傍に形成することで、電子部品３０と樹脂流出防護壁３７０との間に十分な間隔が保持されるため、樹脂材料を電子部品３０に塗布した際に、樹脂材料が流出することなく電子部品３０の全体を被覆することができる。 Next, a circuit board 400 according to the fourth embodiment will be described with reference to FIG. In FIG. 6, the resin coating is not shown in a simplified manner.
As shown in FIG. 6, in the circuit board 400 according to the present embodiment, the upper end portion of the electronic component 30 covered with the resin material and the root portion of the resin outflow protection wall 370 (typically, the resin outflow protection wall 370. The resin outflow protective wall 370 is formed so that the angle θ formed by the boundary between the insulating film 12c and the insulating film 12c is 45 degrees or less (typically 30 to 45 degrees). By forming the resin outflow protection wall 370 in the vicinity of the electronic component 30 so as to have the above angle, a sufficient space is maintained between the electronic component 30 and the resin outflow protection wall 370. When applied to 30, the entire electronic component 30 can be covered without the resin material flowing out.
　次に、図７を参照しつつ第５の実施形態に係る回路基板５００について説明する。
　図７に示すように、本実施形態に係る回路基板５００では、電子部品４３０ａの近傍に該電子部品４３０ａを実質的に包囲する樹脂流出防護壁４７０ａが形成されており、樹脂被覆部４５０ａによって電子部品４３０ａは覆われている。同様に、電子部品４３０ｂの近傍には樹脂流出防護壁４７０ｂが形成されており、樹脂被覆部４５０ｂによって電子部品４３０ｂは覆われている。本実施形態のように、樹脂材料で被覆する必要がある電子部品４３０ａ，４３０ｂが近接しておらず離れた位置に形成されているような場合や、電子部品４３０ａ，４３０ｂの間に樹脂を塗布してはならないような場合には、電子部品４３０ａ，４３０ｂごとに樹脂流出防護壁４７０ａ，４７０ｂを形成することで、樹脂材料の流出を防止すると共に電子部品４３０ａ，４３０ｂの全体をそれぞれ被覆することができる。 Next, a circuit board 500 according to a fifth embodiment will be described with reference to FIG.
As shown in FIG. 7, in the circuit board 500 according to the present embodiment, a resin outflow protection wall 470a that substantially surrounds the electronic component 430a is formed in the vicinity of the electronic component 430a. The part 430a is covered. Similarly, a resin outflow protection wall 470b is formed in the vicinity of the electronic component 430b, and the electronic component 430b is covered with the resin coating portion 450b. As in this embodiment, when the electronic components 430a and 430b that need to be coated with a resin material are not close to each other and are formed at separate positions, or a resin is applied between the electronic components 430a and 430b. In such a case, the resin outflow protection walls 470a and 470b are formed for each of the electronic components 430a and 430b, thereby preventing the resin material from flowing out and covering the entire electronic components 430a and 430b. Can do.
　次に、図８を参照しつつ第６の実施形態に係る回路基板７００について説明する。
　本実施形態に係る回路基板７００の基材６１０は液晶表示パネル６８０のアレイ基板に相当するものである。かかるアレイ基板６１０の表側（カラーフィルタ基板１１５に対向する面）には、画像を表示させるための画素が配列しており、各画素を駆動するための複数の図示しないソース配線およびゲート配線が格子状のパターンをなすように形成されている。かかる表示用配線に囲まれた各格子領域には、画素電極およびスイッチング素子である薄膜トランジスタ（ＴＦＴ）が設けられている。さらに、アレイ基板６１０の周縁部（電子部品実装領域）には、上記ゲート配線及びソース配線と電気的に接続している図示しない出力用配線、電子部品（ドライバＩＣチップ）６３０に信号を入力するための入力用配線がパターン形成されている。なお、上述したアレイ基板及びカラーフィルタ基板については、従来の液晶表示パネルに用いるものと同様でよく、本発明を特徴付けるものではないため、これ以上の詳細な説明は省略する。
　図８に示すように、液晶表示パネル６８０を駆動するための信号を供給する電子部品（例えばドライバＩＣ）６３０は、ＣＯＧ（Ｃｈｉｐ　ｏｎ　Ｇｌａｓｓ）実装によって、上記出力用配線及び入力用配線にはんだを介して実装（装着）されている。さらに、電子部品６３０の近傍には、アレイ基板６１０上に立設された樹脂流出防護壁６７０が形成されており、電子部品６３０の上面を覆うと共に該電子部品６３０の上面から樹脂流出防護壁６７０に至る領域に樹脂被覆部６５０が形成されている。かかる構成の液晶表示パネル６８０は、アレイ基板６１０上に配置された電子部品６３０の全面が樹脂材料に被覆されているため、該電子部品６３０の酸化腐食が防止された信頼性に優れる液晶表示パネルとなり得る。 Next, a circuit board 700 according to the sixth embodiment will be described with reference to FIG.
The base material 610 of the circuit board 700 according to this embodiment corresponds to the array substrate of the liquid crystal display panel 680. Pixels for displaying an image are arranged on the front side of the array substrate 610 (the surface facing the color filter substrate 115), and a plurality of source wirings and gate wirings (not shown) for driving each pixel are arranged in a grid. It is formed so as to form a pattern. In each lattice region surrounded by the display wiring, a pixel electrode and a thin film transistor (TFT) which is a switching element are provided. Further, a signal is input to an output wiring and electronic component (driver IC chip) 630 (not shown) electrically connected to the gate wiring and the source wiring at the peripheral portion (electronic component mounting region) of the array substrate 610. Input wiring for the pattern is formed. Note that the array substrate and the color filter substrate described above may be the same as those used in a conventional liquid crystal display panel, and do not characterize the present invention, and thus will not be described in further detail.
As shown in FIG. 8, an electronic component (for example, a driver IC) 630 that supplies a signal for driving the liquid crystal display panel 680 is soldered on the output wiring and the input wiring by COG (Chip on Glass) mounting. Is mounted (mounted). Further, a resin outflow protection wall 670 standing on the array substrate 610 is formed in the vicinity of the electronic component 630. The resin outflow protection wall 670 covers the upper surface of the electronic component 630 and from the upper surface of the electronic component 630. A resin coating portion 650 is formed in the region extending to. In the liquid crystal display panel 680 having such a configuration, since the entire surface of the electronic component 630 disposed on the array substrate 610 is covered with a resin material, the liquid crystal display panel excellent in reliability in which the oxidative corrosion of the electronic component 630 is prevented. Can be.
　以上、本発明の具体例を図面を参照しつつ詳細に説明したが、これらは例示にすぎず、特許請求の範囲を限定するものではない。特許請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。 Specific examples of the present invention have been described above in detail with reference to the drawings. However, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
　本発明によると、電子部品の全体を樹脂材料で覆うことによって該電子部品の酸化腐食を防止すると共に、該樹脂材料が塗布される部分を制限して樹脂材料の流出による不具合の発生を未然に防止し得る回路基板が提供される。 According to the present invention, the entire electronic component is covered with a resin material to prevent oxidative corrosion of the electronic component, and the portion to which the resin material is applied is limited to prevent the occurrence of problems due to the outflow of the resin material. A circuit board that can be prevented is provided.
１０　基材
１２ａ，１２ｂ，１２ｃ　絶縁膜
１４　配線パターン
１５　スルーホール
１６　グラウンドパターン（ＧＮＤパターン）
１８　樹脂流出防護壁形成部位
３０　電子部品
４０　はんだ部材
５０　樹脂被覆部
７０　樹脂流出防護壁
１００　回路基板
１１０　液晶表示パネル
１１５　カラーフィルタ基板
１２０　アレイ基板
１２５　液晶層
１３０　シール材
１５０　樹脂被覆部
１７０　樹脂流出防護壁
２００　回路基板
２５０　樹脂被覆部
２７０　樹脂流出防護壁
３００　回路基板
３７０　樹脂流出防護壁
４００　回路基板
４３０ａ，４３０ｂ　電子部品
４５０ａ，４５０ｂ　樹脂被覆部
４７０ａ，４７０ｂ　樹脂流出防護壁
５００　回路基板
６１０　基材（アレイ基板）
６３０　電子部品
６５０　樹脂被覆部
６７０　樹脂流出防護壁
６８０　液晶表示パネル
７００　回路基板
１０３０　電子部品
１０５０　樹脂材料 10 Substrate 12a, 12b, 12c Insulating film 14 Wiring pattern 15 Through hole 16 Ground pattern (GND pattern)
18 Resin outflow protection wall forming portion 30 Electronic component 40 Solder member 50 Resin coating portion 70 Resin outflow protection wall 100 Circuit board 110 Liquid crystal display panel 115 Color filter substrate 120 Array substrate 125 Liquid crystal layer 130 Sealing material 150 Resin coating section 170 Resin outflow protection Wall 200 Circuit board 250 Resin coating portion 270 Resin outflow protection wall 300 Circuit board 370 Resin outflow protection wall 400 Circuit boards 430a and 430b Electronic components 450a and 450b Resin coating portions 470a and 470b Resin outflow protection wall 500 Circuit board 610 Base material (array) substrate)
630 Electronic component 650 Resin coating portion 670 Resin outflow protection wall 680 Liquid crystal display panel 700 Circuit board 1030 Electronic component 1050 Resin material

Claims (11)

  1. 　回路基板であって、
    　所定の配線が形成された基材と、
    　前記基材上に配置された一又は複数の電子部品と、
    　前記電子部品のうちの少なくとも一つを被覆する絶縁性の樹脂からなる樹脂被覆部とを備えており、
    　ここで、前記樹脂被覆部で被覆された電子部品の近傍には、前記基材上に立設された樹脂流出防護壁が形成されており、
    　前記樹脂流出防護壁によって、前記樹脂被覆部を構成する絶縁性の樹脂が前記電子部品の上面を覆うと共に該電子部品の上面から該防護壁に至る領域に蓄積されていることを特徴とする、回路基板。     A circuit board,
    A base material on which predetermined wiring is formed;
    One or more electronic components disposed on the substrate;
    A resin coating portion made of an insulating resin that covers at least one of the electronic components;
    Here, in the vicinity of the electronic component coated with the resin coating portion, a resin outflow protective wall is formed standing on the base material,
    Insulating resin constituting the resin coating portion covers the upper surface of the electronic component and is accumulated in a region from the upper surface of the electronic component to the protective wall by the resin outflow protective wall, Circuit board.
  2. 　前記樹脂流出防護壁は、前記樹脂被覆部で被覆された電子部品を実質的に包囲するように形成されていることを特徴とする、請求項１に記載の回路基板。 2. The circuit board according to claim 1, wherein the resin outflow protection wall is formed so as to substantially surround the electronic component covered with the resin coating portion.
  3. 　前記樹脂流出防護壁は、前記電子部品のうちの二以上を実質的に包囲するように形成されており、該包囲された二以上の電子部品は前記樹脂被覆部によって一体的に被覆されていることを特徴とする、請求項１に記載の回路基板。 The resin outflow protection wall is formed so as to substantially surround two or more of the electronic components, and the surrounded two or more electronic components are integrally covered with the resin coating portion. The circuit board according to claim 1, wherein:
  4. 　前記樹脂流出防護壁は、前記樹脂被覆部で被覆された電子部品の前記基材からの高さと同じか又はそれより高い位置まで形成されていることを特徴とする、請求項１から３のいずれか一項に記載の回路基板。 The said resin outflow protective wall is formed to the position equal to or higher than the height from the said base material of the electronic component coat | covered with the said resin coating part, The any one of Claim 1 to 3 characterized by the above-mentioned. A circuit board according to claim 1.
  5. 　前記樹脂被覆部で覆われた電子部品の上面端部と前記樹脂流出防護壁の根元部とを結ぶ仮想直線と、前記基材とのなす角度が４５度以下であることを特徴とする、請求項１から４のいずれか一項に記載の回路基板。 An angle formed by an imaginary straight line connecting an upper surface end portion of the electronic component covered with the resin coating portion and a root portion of the resin outflow protection wall and the base material is 45 degrees or less, Item 5. The circuit board according to any one of Items 1 to 4.
  6. 　前記基材はフレキシブルプリント基板であることを特徴とする、請求項１から５のいずれか一項に記載の回路基板。 The circuit board according to any one of claims 1 to 5, wherein the base material is a flexible printed board.
  7. 　請求項１から６のいずれか一項に記載の回路基板を備える表示パネル。 A display panel comprising the circuit board according to any one of claims 1 to 6.
  8. 　所定の配線が形成された基材と、前記基材上に配置された一又は複数の電子部品とを備える回路基板を製造する方法であって、
    　前記基材上に前記電子部品を配置すること、
    　少なくとも一つの前記電子部品の近傍に該電子部品を実質的に包囲するように樹脂流出防護壁を形成すること、
    　前記樹脂流出防護壁によって実質的に包囲された領域に絶縁性の樹脂材料を塗布し、前記電子部品の上面を被覆するように樹脂被覆部を形成すること、
    を包含することを特徴とする、回路基板の製造方法。     A method of manufacturing a circuit board comprising a base material on which predetermined wiring is formed and one or more electronic components arranged on the base material,
    Disposing the electronic component on the substrate;
    Forming a resin outflow protection wall in the vicinity of at least one electronic component so as to substantially surround the electronic component;
    Applying an insulating resin material to a region substantially surrounded by the resin outflow protection wall, and forming a resin coating portion so as to cover the upper surface of the electronic component;
    A method of manufacturing a circuit board, comprising:
  9. 　前記電子部品のうちの二以上を実質的に包囲するように前記樹脂流出防護壁を形成することを特徴とする、請求項８に記載の製造方法。 The manufacturing method according to claim 8, wherein the resin outflow protection wall is formed so as to substantially surround two or more of the electronic components.
  10. 　前記樹脂被覆部で被覆された電子部品の前記基材からの高さと同じか又はそれより高い位置まで前記樹脂流出防護壁を形成することを特徴とする、請求項８又は９に記載の製造方法。 The manufacturing method according to claim 8 or 9, wherein the resin outflow protection wall is formed up to a position equal to or higher than a height of the electronic component covered with the resin coating portion from the base material. .
  11. 　前記樹脂被覆部で覆われた電子部品の上面端部と前記樹脂流出防護壁の根元部とを結ぶ仮想直線と、前記基材とのなす角度が４５度以下となるように前記樹脂流出防護壁を形成することを特徴とする、請求項８から１０のいずれか一項に記載の製造方法。 The resin outflow protection wall so that an angle formed between an imaginary straight line connecting an upper surface end portion of the electronic component covered with the resin coating portion and a base portion of the resin outflow protection wall and the base material is 45 degrees or less. The method according to claim 8, wherein the manufacturing method is formed.
PCT/JP2011/075890 2010-11-17 2011-11-10 Circuit substrate and manufacturing method therefor WO2012067003A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-256709 2010-11-17
JP2010256709 2010-11-17

Publications (1)

Publication Number Publication Date
WO2012067003A1 true WO2012067003A1 (en) 2012-05-24

Family

ID=46083936

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/075890 WO2012067003A1 (en) 2010-11-17 2011-11-10 Circuit substrate and manufacturing method therefor

Country Status (1)

Country Link
WO (1) WO2012067003A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016004002A1 (en) * 2014-07-01 2016-01-07 Isola Usa Corp. Prepregs and laminates having a uv curable resin layer
US9579868B2 (en) 2014-07-01 2017-02-28 Isola Usa Corp. Prepregs and laminates having a UV curable resin layer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916351A (en) * 1982-07-19 1984-01-27 Matsushita Electric Ind Co Ltd Electronic circuit device and manufacture thereof
JPH04252057A (en) * 1991-01-28 1992-09-08 Nec Corp Hybrid integrated circuit
JPH09148495A (en) * 1995-11-28 1997-06-06 Nec Corp Hybrid integrated circuit device and manufacturing method therefor
JP2001127216A (en) * 1999-10-29 2001-05-11 Sharp Corp Resin-sealed semiconductor device and liquid crystal display module using the same
JP2009099850A (en) * 2007-10-18 2009-05-07 Sony Chemical & Information Device Corp Method and apparatus for manufacturing semiconductor module, and semiconductor module
JP2009135485A (en) * 2007-11-07 2009-06-18 Mitsubishi Chemicals Corp Semiconductor light-emitting apparatus and method of manufacturing the same
JP2010045082A (en) * 2008-08-08 2010-02-25 Sharp Corp Display element/electronic element module and its manufacturing method, and electronic information equipment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916351A (en) * 1982-07-19 1984-01-27 Matsushita Electric Ind Co Ltd Electronic circuit device and manufacture thereof
JPH04252057A (en) * 1991-01-28 1992-09-08 Nec Corp Hybrid integrated circuit
JPH09148495A (en) * 1995-11-28 1997-06-06 Nec Corp Hybrid integrated circuit device and manufacturing method therefor
JP2001127216A (en) * 1999-10-29 2001-05-11 Sharp Corp Resin-sealed semiconductor device and liquid crystal display module using the same
JP2009099850A (en) * 2007-10-18 2009-05-07 Sony Chemical & Information Device Corp Method and apparatus for manufacturing semiconductor module, and semiconductor module
JP2009135485A (en) * 2007-11-07 2009-06-18 Mitsubishi Chemicals Corp Semiconductor light-emitting apparatus and method of manufacturing the same
JP2010045082A (en) * 2008-08-08 2010-02-25 Sharp Corp Display element/electronic element module and its manufacturing method, and electronic information equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016004002A1 (en) * 2014-07-01 2016-01-07 Isola Usa Corp. Prepregs and laminates having a uv curable resin layer
US9579868B2 (en) 2014-07-01 2017-02-28 Isola Usa Corp. Prepregs and laminates having a UV curable resin layer
US10631412B2 (en) 2014-07-01 2020-04-21 Isola Usa Corp. Prepregs and laminates having a UV curable resin layer
EP3911129A1 (en) * 2014-07-01 2021-11-17 Isola USA Corp. Prepregs and laminates having a uv curable resin layer
US11558962B2 (en) 2014-07-01 2023-01-17 Isola Usa Corp. Prepregs and laminates having a UV curable resin layer

Similar Documents

Publication Publication Date Title
US9761654B2 (en) Display device
US10903127B2 (en) Film for a package substrate
US8259247B2 (en) Liquid crystal display device
JP2006018220A (en) Bonding method of flexible base film and display device bonded by the method
US10324342B2 (en) Driver of display device and manufacturing method of the same
JP6427360B2 (en) Display device
WO2018235730A1 (en) Display module
WO2012067003A1 (en) Circuit substrate and manufacturing method therefor
KR20160043190A (en) Chip-On-Film Circuit and Flexible Display Device having the same
JP2009098266A (en) Display device
JP2008090147A (en) Connection terminal board and electronic device using the same
JP5653530B2 (en) Display device
TWI487439B (en) Flexible circuit board, display device comprising the same, and fabricating method of the flexible circuit board
US9907163B2 (en) Flexible circuit board and display device
CN101543147B (en) Wiring board and display unit
JP2010113252A (en) Electro-optical device and electronic apparatus provided with the same
JP2012215628A (en) Electronic panel
KR102078993B1 (en) Organic Light-Emitting Diode Display Device
JP4289106B2 (en) Flexible printed circuit board, mounting structure, electro-optical device including the mounting structure, and electronic device including the electro-optical device
KR102017643B1 (en) Flexible printed circuit boards and fabricating method of the same
JP6537681B2 (en) Method of manufacturing electro-optical display device
JP4484750B2 (en) WIRING BOARD, ELECTRONIC CIRCUIT ELEMENT HAVING THE SAME, AND DISPLAY DEVICE
KR20060087712A (en) Liquid crystal display
CN102738111B (en) Chip Package Structure
TWI515492B (en) Package structure and display module

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11842209

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11842209

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP