WO2012041458A3 - Projection exposure tool for microlithography and method for microlithographic exposure - Google Patents

Projection exposure tool for microlithography and method for microlithographic exposure Download PDF

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Publication number
WO2012041458A3
WO2012041458A3 PCT/EP2011/004743 EP2011004743W WO2012041458A3 WO 2012041458 A3 WO2012041458 A3 WO 2012041458A3 EP 2011004743 W EP2011004743 W EP 2011004743W WO 2012041458 A3 WO2012041458 A3 WO 2012041458A3
Authority
WO
WIPO (PCT)
Prior art keywords
exposure
substrate
reticle
microlithography
measuring apparatus
Prior art date
Application number
PCT/EP2011/004743
Other languages
French (fr)
Other versions
WO2012041458A2 (en
Inventor
Markus GÖPPERT
Helmut Haidner
Carmen Hettich
Original Assignee
Carl Zeiss Smt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Gmbh filed Critical Carl Zeiss Smt Gmbh
Publication of WO2012041458A2 publication Critical patent/WO2012041458A2/en
Publication of WO2012041458A3 publication Critical patent/WO2012041458A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Abstract

A projection exposure tool (210) for microlithography configured for exposing a substrate (20) to be structured by respective imaging of mask structures of a reticle (214) comprising at least one layer onto different regions of the substrate (20) in a number of exposure steps, comprising: irradiation optics (213) configured to irradiate a front side (216) of the reticle with exposure radiation (226) during the exposure of the substrate (20), a measuring apparatus (240) for taking a topography measurement on the reticle layer, which measuring apparatus (240) is arranged to irradiate measuring light onto a rear side (215) of the reticel (214), and a control apparatus (60) which is configured to control the measuring apparatus (40) such that during the period of time required to expose the substrate the topography of at least one section of the reticle layer is measured.
PCT/EP2011/004743 2010-09-28 2011-09-22 Projection exposure tool for microlithography and method for microlithographic exposure WO2012041458A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US38726610P 2010-09-28 2010-09-28
US61/387,266 2010-09-28
DE201010041562 DE102010041562A1 (en) 2010-09-28 2010-09-28 Projection exposure apparatus for microlithography and method for microlithographic exposure
DE102010041562.6 2010-09-28

Publications (2)

Publication Number Publication Date
WO2012041458A2 WO2012041458A2 (en) 2012-04-05
WO2012041458A3 true WO2012041458A3 (en) 2012-11-08

Family

ID=45804519

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/004743 WO2012041458A2 (en) 2010-09-28 2011-09-22 Projection exposure tool for microlithography and method for microlithographic exposure

Country Status (3)

Country Link
DE (1) DE102010041562A1 (en)
TW (1) TW201234124A (en)
WO (1) WO2012041458A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2009273A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv Level sensor arrangement for lithographic apparatus, lithographic apparatus and device manufacturing method.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020081498A1 (en) * 2000-10-17 2002-06-27 Albrecht Ehrmann Lithography mask configuration
US20030016338A1 (en) * 1997-01-28 2003-01-23 Nikon Corporation Exposure apparatus and method
US20030090640A1 (en) * 2001-11-02 2003-05-15 Tadahito Fujisawa Exposure method and apparatus
US20060273267A1 (en) * 2005-06-02 2006-12-07 Canon Kabushiki Kaisha Exposure method and apparatus
US20070080281A1 (en) * 2005-10-06 2007-04-12 Smith Daniel G Imaging optical system configured with through the lens optics for producing control information

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7593100B2 (en) 2005-01-24 2009-09-22 Nikon Corporation Measuring method, measuring system, inspecting method, inspecting system, exposure method and exposure system, in which information as to the degree of the flatness of an object is pre-obtained
JP2007035783A (en) * 2005-07-25 2007-02-08 Canon Inc Exposure device and method therefor
DE102008017645A1 (en) 2008-04-04 2009-10-08 Carl Zeiss Smt Ag Apparatus for microlithographic projection exposure and apparatus for inspecting a surface of a substrate
NL2003673A (en) * 2008-11-21 2010-05-25 Asml Netherlands Bv Lithographic apparatus and methods for compensating substrate unflatness, determining the effect of patterning device unflatness, and determing the effect of thermal loads on a patterning device.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030016338A1 (en) * 1997-01-28 2003-01-23 Nikon Corporation Exposure apparatus and method
US20020081498A1 (en) * 2000-10-17 2002-06-27 Albrecht Ehrmann Lithography mask configuration
US20030090640A1 (en) * 2001-11-02 2003-05-15 Tadahito Fujisawa Exposure method and apparatus
US20060273267A1 (en) * 2005-06-02 2006-12-07 Canon Kabushiki Kaisha Exposure method and apparatus
US20070080281A1 (en) * 2005-10-06 2007-04-12 Smith Daniel G Imaging optical system configured with through the lens optics for producing control information

Also Published As

Publication number Publication date
TW201234124A (en) 2012-08-16
WO2012041458A2 (en) 2012-04-05
DE102010041562A1 (en) 2012-03-29

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