WO2012031874A1 - An led module, method for manufacturing the same and an led chain consisting of led modules - Google Patents

An led module, method for manufacturing the same and an led chain consisting of led modules Download PDF

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Publication number
WO2012031874A1
WO2012031874A1 PCT/EP2011/064307 EP2011064307W WO2012031874A1 WO 2012031874 A1 WO2012031874 A1 WO 2012031874A1 EP 2011064307 W EP2011064307 W EP 2011064307W WO 2012031874 A1 WO2012031874 A1 WO 2012031874A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing part
led
pcb board
potting material
led module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/064307
Other languages
French (fr)
Inventor
Yubao He
Chenglong Dai
Yabin Luo
Canbang Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2012031874A1 publication Critical patent/WO2012031874A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module for backlight illuminating apparatus.
  • the present invention also relates to an LED chain consisting of LED modules and a method for manufacturing the LED module of the above type.
  • the low power LED chain is currently very popular for the backlight illuminating apparatus.
  • the LED chain of such type a plurality of LED modules is connected in series by wires to form the LED chain.
  • the backlight illuminating apparatus of such type are usually for outdoor application; therefore, the IP protection degree should be met.
  • the one-side potting is usually used in the prior art, i.e. the PCB board bearing the LED module is firstly placed in one completely opened side of the housing, then, the PCB board and the wires extracted from the PCB board are potted and enveloped by the potting material so as to obtain good protective effect, which can meet the requirement of the IP protection degree.
  • the disadvantage of this method is that it is impossible to make the second optics design on the LED module, that is to say, separate optical lens cannot be put on the LED module.
  • Another method is to envelop the LED module by the low pressure molding, but the protection performance of the LED module enveloped with such process is unfavorable, because the low pressure molding cannot well seal the place where the wire is extracted on the LED module.
  • respective independent optical lenses can be firstly disposed on the plane where the light is emitted on the LED chip, then they are enveloped, the place where the wire is extracted on the LED module still cannot be well sealed.
  • the objective of the present invention is to provide an LED module.
  • the LED module according to the present invention is capable of rendering favorable light distribution effect with separately provided optical lens, and possesses good waterproof and dustproof performance.
  • the LED module has: a housing; a PCB board provided in the housing; an LED chip provided on the PCB board; and an electrical lead connected to the PCB board, wherein, the housing comprises at least a first housing part and a second housing part that can be closely clamped to each other, the first housing part being provided with the optical lens and the second housing part being provided with the potting material hole through which the potting material is potted into the housing for envelopment.
  • the LED module according to the present invention is capable of rendering expected optical intensity distribution by separately provided optical lens, and the protection requirement of IP protection degree can be satisfied due to the potting material potted therein.
  • the potting material is capable of covering the PCB board, the joint between the PCB board and the electrical leads and the joint between the PCB board and the LED chip. All the electrical parts of the LED module are enveloped by the potting material so as to render excellent waterproof and dustproof performance, and the plane where the light is emitted on the LED chip is not covered by the potting material, which therefore lowers the requirement to the potting material, for instance, it is unnecessary to use nontransparent potting material.
  • the first housing part and the second housing part are tightly clamped to each other by snap-fitting.
  • they can be clamped together in some other manner, thereby the potting material will not overflow from the gap between the housings when it is potted into the housing.
  • the accommodating portion closely coordinating with the circumferential profile of the electrical lead when the first housing part and second housing part are clamped together.
  • the accommodating portion for the housings closely coordinates with the electrical lead to avoid the gap between the accommodating portion and the electrical lead, which therefore effectively prevents the external water or dust from going into the housings.
  • the optical lens and the first housing part are formed integrally, which reduces the difficulty and costs in manufacturing to a great extent.
  • the second housing part is provided with the exhaust hole thereon.
  • the exhaust hole When the potting material is potted into the housing, air within the housing will be exhausted through the exhaust hole, which effectively decreases the possibility of producing air bubble in the potting material during the potting process.
  • the potting material is one selected from the group consisting of epoxy potting material, silastic potting material, polyurethane potting material and thermally melting potting material. Of course, it also can be some other material adapted to potting with effective waterproof and dustproof performance.
  • Another object of the present invention is to provide an LED chain consisting of above LED modules.
  • the LED modules can be connected to each other in series, by connecting the electrical leads to each other, to form the LED chain.
  • the length of the LED chain can be extended to six meters.
  • the LED chain according to the present invention is capable of rendering favorable light distribution effect, and possesses good waterproof and dustproof performance.
  • Another objective of the present invention is to provide a method for manufacturing an LED module.
  • the method includes the following steps: a) providing a PCB board; b) providing an LED chip onto the PCB board; c) connecting an electrical lead to the PCB board; d) providing a first housing part and a second housing part, wherein, the first housing part has an optical lens, the PCB board is placed into the second housing part, and the first housing part and the second housing part are tightly clamped together; and e) potting a potting material though a potting material hole on the second housing part.
  • the LED module manufactured by the method according to the present invention is capable of rendering favorable light distribution effect with separately provided optical lens, and possesses good waterproof and dustproof performance as well.
  • the first housing part is provided with the optical lens integrally formed thereon, which reduces the difficulty and costs in manufacturing to a great extent.
  • step c) the potting material is potted through the potting material hole on the second housing part until the potting material covers the PCB board, the joint between the PCB board and the electrical lead, and the joint between the PCB board and the LED chip. All the electrical parts of the LED module are enveloped by the potting material so as to render excellent waterproof and dustproof performance, and the plane where the light is emitted on the LED chip is not covered by the potting material, which therefore lowers the requirement to the potting material, for instance, it is unnecessary to use nontransparent potting material.
  • step c air is exhausted through the exhaust hole provided on the second housing part.
  • air in the housing is exhausted through the exhaust hole, which therefore effectively reduces the possibility of producing air bubble in the potting material during the potting process.
  • Figure 1 is an exploded view of the LED module according to the present invention
  • Figure 2 is a pre-assembling scheme of the LED module according to the present invention
  • Figure 3 is a scheme of the second housing part of the LED module according to the present invention.
  • Figure 4 is a scheme of the LED chain formed by the LED modules according to the present invention.
  • FIG. 1 is an exploded view of the LED module according to the present invention. From the figure it can be seen that the LED module comprises PCB board 1 , LED chip 2, electrical lead 3, first housing part 4 and second housing part 5, wherein, the first housing part 4 is integrally formed with the optical lens 6 thereon, and the optical lens 6 is corresponding to the location of the LED chip 2.
  • Figure 2 is a pre-assembling scheme of the LED module according to the present invention. From the figure it can be seen that one electrical lead 3 is connected to both ends of the PCB board 1 . The LED chip 2 has been already mounted onto the PCB board 1 , but it cannot be seen from the figure due to the angle.
  • the hook 10 is provided on the first housing part 4, and the projection 1 1 is provided on the second housing part 5 to coordinate with the hook 10. Under the assembly condition, the hook 10 is tightly clamped onto the projection 1 1 , and the opposing faces of the first housing part 4 and the second housing part 5 abut against each other such that there is no gap therebetween.
  • FIG. 3 is a scheme of the second housing part 5 of the LED module according to the present invention. From the figure it can be seen that the second housing part 5 has the potting material hole 7 and the exhaust hole 8. When the potting material is potted into the second housing part 5, air within the housing is exhausted from the exhaust hole 8, so as to reduce the possibility of producing air bubble.
  • FIG 4 is a scheme of the LED chain formed by the LED modules according to the present invention.
  • the LED modules according to the present invention can be connected to each other in series, by connecting the electrical leads 3 to each other, to form the LED chain.
  • the length of the LED chain can be extended to six meters.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

LED module, having: a housing; a PCB board (1) provided in the housing; an LED chip (2) provided on the PCB board (1); and an electrical lead (3) connected to the PCB board (1), wherein, the housing comprises at least a first housing part (4) and a second housing part (5) that can be closely clamped to each other, the first housing part (4) being provided with an optical lens (6) and the second housing part (5) being provided with the potting material hole (7) through which a potting material is potted into the housing for envelopment. The LED module according to the present invention is capable of rendering favorable light distribution effect with separately provided optical lens, and possesses good waterproof and dustproof performance. In addition, the present also relates to an LED chain consisting of LED Modules and a method for manufacturing the LED module of the above type.

Description

Description
An LED Module, Method for Manufacturing the same and an LED chain consisting of LED modules
Technical Field
The present invention relates to an LED module for backlight illuminating apparatus. In addition, the present invention also relates to an LED chain consisting of LED modules and a method for manufacturing the LED module of the above type.
Background Art
The low power LED chain is currently very popular for the backlight illuminating apparatus. In the LED chain of such type, a plurality of LED modules is connected in series by wires to form the LED chain. Generally, the backlight illuminating apparatus of such type are usually for outdoor application; therefore, the IP protection degree should be met. In order to obtain good protection, the one-side potting is usually used in the prior art, i.e. the PCB board bearing the LED module is firstly placed in one completely opened side of the housing, then, the PCB board and the wires extracted from the PCB board are potted and enveloped by the potting material so as to obtain good protective effect, which can meet the requirement of the IP protection degree. However, the disadvantage of this method is that it is impossible to make the second optics design on the LED module, that is to say, separate optical lens cannot be put on the LED module. Another method is to envelop the LED module by the low pressure molding, but the protection performance of the LED module enveloped with such process is unfavorable, because the low pressure molding cannot well seal the place where the wire is extracted on the LED module. In addition, though in the low pressure molding, respective independent optical lenses can be firstly disposed on the plane where the light is emitted on the LED chip, then they are enveloped, the place where the wire is extracted on the LED module still cannot be well sealed.
Summary of the Invention
Therefore, the objective of the present invention is to provide an LED module. The LED module according to the present invention is capable of rendering favorable light distribution effect with separately provided optical lens, and possesses good waterproof and dustproof performance.
The objective of the present invention is accomplished in the way as follow: the LED module has: a housing; a PCB board provided in the housing; an LED chip provided on the PCB board; and an electrical lead connected to the PCB board, wherein, the housing comprises at least a first housing part and a second housing part that can be closely clamped to each other, the first housing part being provided with the optical lens and the second housing part being provided with the potting material hole through which the potting material is potted into the housing for envelopment. The LED module according to the present invention is capable of rendering expected optical intensity distribution by separately provided optical lens, and the protection requirement of IP protection degree can be satisfied due to the potting material potted therein.
According to a preferred solution of the present invention, the potting material is capable of covering the PCB board, the joint between the PCB board and the electrical leads and the joint between the PCB board and the LED chip. All the electrical parts of the LED module are enveloped by the potting material so as to render excellent waterproof and dustproof performance, and the plane where the light is emitted on the LED chip is not covered by the potting material, which therefore lowers the requirement to the potting material, for instance, it is unnecessary to use nontransparent potting material.
According to a preferred solution of the present invention, the first housing part and the second housing part are tightly clamped to each other by snap-fitting. Of course, they can be clamped together in some other manner, thereby the potting material will not overflow from the gap between the housings when it is potted into the housing.
According to the present invention, it is provided to form the accommodating portion closely coordinating with the circumferential profile of the electrical lead when the first housing part and second housing part are clamped together. The accommodating portion for the housings closely coordinates with the electrical lead to avoid the gap between the accommodating portion and the electrical lead, which therefore effectively prevents the external water or dust from going into the housings. Moreover, when the potting material is potted, it will not overflow from the gap between the housings and the electrical lead. According to a preferred solution of the present invention, the optical lens and the first housing part are formed integrally, which reduces the difficulty and costs in manufacturing to a great extent.
Preferably, the second housing part is provided with the exhaust hole thereon. When the potting material is potted into the housing, air within the housing will be exhausted through the exhaust hole, which effectively decreases the possibility of producing air bubble in the potting material during the potting process.
Advantageously, the potting material is one selected from the group consisting of epoxy potting material, silastic potting material, polyurethane potting material and thermally melting potting material. Of course, it also can be some other material adapted to potting with effective waterproof and dustproof performance.
Another object of the present invention is to provide an LED chain consisting of above LED modules. The LED modules can be connected to each other in series, by connecting the electrical leads to each other, to form the LED chain. The length of the LED chain can be extended to six meters. The LED chain according to the present invention is capable of rendering favorable light distribution effect, and possesses good waterproof and dustproof performance.
Another objective of the present invention is to provide a method for manufacturing an LED module. The method includes the following steps: a) providing a PCB board; b) providing an LED chip onto the PCB board; c) connecting an electrical lead to the PCB board; d) providing a first housing part and a second housing part, wherein, the first housing part has an optical lens, the PCB board is placed into the second housing part, and the first housing part and the second housing part are tightly clamped together; and e) potting a potting material though a potting material hole on the second housing part. The LED module manufactured by the method according to the present invention is capable of rendering favorable light distribution effect with separately provided optical lens, and possesses good waterproof and dustproof performance as well. In a preferred solution of the method according to the present invention, in step d), the first housing part is provided with the optical lens integrally formed thereon, which reduces the difficulty and costs in manufacturing to a great extent.
According to a preferred solution of the present invention, in step c), the potting material is potted through the potting material hole on the second housing part until the potting material covers the PCB board, the joint between the PCB board and the electrical lead, and the joint between the PCB board and the LED chip. All the electrical parts of the LED module are enveloped by the potting material so as to render excellent waterproof and dustproof performance, and the plane where the light is emitted on the LED chip is not covered by the potting material, which therefore lowers the requirement to the potting material, for instance, it is unnecessary to use nontransparent potting material.
Preferably, in step c), air is exhausted through the exhaust hole provided on the second housing part. When the potting material is potted into the housing, air in the housing is exhausted through the exhaust hole, which therefore effectively reduces the possibility of producing air bubble in the potting material during the potting process.
It should be understood that the general descriptions above and the detailed descriptions below are illustrative, and aim at providing further understanding to the claimed invention. Brief Description of the Drawings
The drawings constitute a portion of the Description for further understanding of the present invention. These drawings illustrate the embodiments of the present invention and explain the principle of the present invention together with the Description. In the drawings, the same element is represented by the same reference sign, wherein
Figure 1 is an exploded view of the LED module according to the present invention; Figure 2 is a pre-assembling scheme of the LED module according to the present invention;
Figure 3 is a scheme of the second housing part of the LED module according to the present invention; and Figure 4 is a scheme of the LED chain formed by the LED modules according to the present invention.
Detailed Description of the Embodiments
Figure 1 is an exploded view of the LED module according to the present invention. From the figure it can be seen that the LED module comprises PCB board 1 , LED chip 2, electrical lead 3, first housing part 4 and second housing part 5, wherein, the first housing part 4 is integrally formed with the optical lens 6 thereon, and the optical lens 6 is corresponding to the location of the LED chip 2.
Figure 2 is a pre-assembling scheme of the LED module according to the present invention. From the figure it can be seen that one electrical lead 3 is connected to both ends of the PCB board 1 . The LED chip 2 has been already mounted onto the PCB board 1 , but it cannot be seen from the figure due to the angle. In addition, it can be seen clearly from the figure that the hook 10 is provided on the first housing part 4, and the projection 1 1 is provided on the second housing part 5 to coordinate with the hook 10. Under the assembly condition, the hook 10 is tightly clamped onto the projection 1 1 , and the opposing faces of the first housing part 4 and the second housing part 5 abut against each other such that there is no gap therebetween.
From Figure 2 it also can be seen that the electrical leads 3 are extracted from both sides of the housings, therefore, when the first housing part 4 and the second housing part 5 are clamped to each other, the accommodating portion 9 is formed, respectively, at both ends of the housings to closely coordinate with the circumferential profile of the electrical lead 3, so that water or dust cannot go into the interior of the housings therefrom.
Figure 3 is a scheme of the second housing part 5 of the LED module according to the present invention. From the figure it can be seen that the second housing part 5 has the potting material hole 7 and the exhaust hole 8. When the potting material is potted into the second housing part 5, air within the housing is exhausted from the exhaust hole 8, so as to reduce the possibility of producing air bubble.
Figure 4 is a scheme of the LED chain formed by the LED modules according to the present invention. The LED modules according to the present invention can be connected to each other in series, by connecting the electrical leads 3 to each other, to form the LED chain. The length of the LED chain can be extended to six meters.
The above is merely preferred embodiments of the present invention but not limiting the present invention. For the person skilled in the art, the present invention may have various alterations and changes. Any alterations, equivalent substitutions, improvements, within the spirit and principle of the present invention, should be covered in the protection scope of the present invention.
List of reference signs
1 PCB board
2 LED module
3 electrical lead
4 first housing part
5 second housing part
6 optical lens
7 potting material hole 8 exhaust hole
9 accommodating portion
10 hook
1 1 projection

Claims

Claims:
1 . An LED module, having: a housing; a PCB board (1 ) provided in the housing; an LED chip (2) provided on the PCB board (1 ); and an electrical lead (3) connected to the PCB board (1 ), characterized in that, the housing comprises at least a first housing part (4) and a second housing part (5) that can be closely clamped to each other, the first housing part (4) is provided with an optical lens (6) and the second housing part (5) is provided with the potting material hole (7) through which a potting material is potted into the housing for envelopment.
2. The LED module according to Claim 1 , characterized in that the potting material is capable of covering the PCB board (1 ), joint between the PCB board (1 ) and the electrical lead (3) and joint between the PCB board (1 ) and the LED chip (2).
3. The LED module according to Claim 1 , characterized in that the first housing part (4) and the second housing part (5) are tightly clamped to each other by snap-fitting.
4. The LED module according to Claim 3, characterized in that an accommodating portions (9) are formed to closely coordinate with a circumferential profile of the electrical lead (3) when the first housing part (4) and the second housing part (5) are clamped to each other.
5. The LED module according to Claim 1 , characterized in that the optical lens (6) and the first housing part (4) are formed integrally.
6. The LED module according to Claim 1 , characterized in that an exhaust hole (8) is further provided on the second housing part (5).
7.. The LED module according to any one of Claims 1 to 6, characterized in that the potting material is one selected from a group consisting of epoxy potting material, silastic potting material, polyurethane potting material and thermally melting potting material.
8. An LED chain, , characterized in that the LED chain consists of LED modules according to any one of claims 1 to 7.
9. A method for manufacturing an LED module, characterized by including the following steps:
a) providing a PCB board (1 );
b) providing an LED chip (2) onto the PCB board (1 );
c) connecting an electrical lead (3) to the PCB board (1 );
d) providing a first housing part (4) and a second housing part (5), wherein, the first housing part (4) has an optical lens (6), the PCB board (1 ) is placed into the second housing part (5), and the first housing part (4) and the second housing part (5) are tightly clamped together; and
e) potting a potting material though a potting material hole (7) on the second housing part (5).
10. The method according to Claim 9, characterized by, in step d), providing the first housing part (4) integrally formed with the optical lens (6) thereon.
11 . The method according to Claim 9, characterized by, in step e), potting the potting material through the potting material hole (7) on the second housing part (5) until the potting material covers the PCB board (1 ), joint between the PCB board (1 ) and the electrical lead (3), and joint between the PCB board (1 ) and the LED chip (1 ).
12. The method according to Claim 9, characterized by, in step e), exhausting air through an exhaust hole (8) provided on the second housing part (5).
PCT/EP2011/064307 2010-09-10 2011-08-19 An led module, method for manufacturing the same and an led chain consisting of led modules Ceased WO2012031874A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010102901428A CN102401252A (en) 2010-09-10 2010-09-10 LED module, LED light bar and manufacturing method of LED module
CN201010290142.8 2010-09-10

Publications (1)

Publication Number Publication Date
WO2012031874A1 true WO2012031874A1 (en) 2012-03-15

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034491A1 (en) * 2011-09-05 2013-03-14 Osram Ag A housing for an illuminating apparatus, a manufacturing method of the same, and an illuminating apparatus having the housing
CN111770255A (en) * 2020-07-20 2020-10-13 福州鑫图光电有限公司 Dustproof and moistureproof structure for scientific grade CMOS camera
US12379078B1 (en) * 2024-07-17 2025-08-05 Shenzhen Andysom Lighting Co., Ltd. Light source module and decorative light string

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105096763B (en) * 2015-09-21 2017-08-18 宁波复洋光电有限公司 A kind of LED module production device and process
CN106917982B (en) * 2016-05-26 2020-03-24 远特信电子(深圳)有限公司 Decorative lamp and decorative lamp group
CN117869833A (en) * 2023-03-16 2024-04-12 惠州柒海科技有限公司 Novel flexible LED lighting device
US12693006B1 (en) * 2025-12-09 2026-07-28 Jinyun Xiong Waterproof lamp structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050139850A1 (en) * 2003-12-26 2005-06-30 Toki Corporation Silicone-filled casing for use with light-emitting unit and method of manufacturing the light-emitting unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050139850A1 (en) * 2003-12-26 2005-06-30 Toki Corporation Silicone-filled casing for use with light-emitting unit and method of manufacturing the light-emitting unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034491A1 (en) * 2011-09-05 2013-03-14 Osram Ag A housing for an illuminating apparatus, a manufacturing method of the same, and an illuminating apparatus having the housing
CN111770255A (en) * 2020-07-20 2020-10-13 福州鑫图光电有限公司 Dustproof and moistureproof structure for scientific grade CMOS camera
US12379078B1 (en) * 2024-07-17 2025-08-05 Shenzhen Andysom Lighting Co., Ltd. Light source module and decorative light string

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