WO2012022031A1 - Micro universal serial bus disk in package - Google Patents

Micro universal serial bus disk in package Download PDF

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Publication number
WO2012022031A1
WO2012022031A1 PCT/CN2010/076081 CN2010076081W WO2012022031A1 WO 2012022031 A1 WO2012022031 A1 WO 2012022031A1 CN 2010076081 W CN2010076081 W CN 2010076081W WO 2012022031 A1 WO2012022031 A1 WO 2012022031A1
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WO
WIPO (PCT)
Prior art keywords
usb
flash memory
controller
memory device
flash
Prior art date
Application number
PCT/CN2010/076081
Other languages
French (fr)
Inventor
Rixin Sun
Lin Hu
Original Assignee
Biwin Technology Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Biwin Technology Limited filed Critical Biwin Technology Limited
Priority to PCT/CN2010/076081 priority Critical patent/WO2012022031A1/en
Publication of WO2012022031A1 publication Critical patent/WO2012022031A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06548—Conductive via connections through the substrate, container, or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

Definitions

  • the present invention relates to data storage devices such as USB flash drives and USB memory sticks. More specifically, although not solely limited thereto, the present invention relates to flash memory drives comprising a stack of flash memory members such as flash memory chips or dies. The present invention also relates to electronic data storage apparatus comprising a stacked assembly of flash memory members.
  • USB memory sticks As electronic data storage are essential to the operation of many electronic apparatus, especially electronic apparatus controlled or controllable by a computer or a microprocessor.
  • Such memory devices include USB memory sticks, solid state disks (SSD), mobile internet device (MID), etc.
  • SSD solid state disks
  • MID mobile internet device
  • flash memory is gaining increasing popularity due to its high performance-to-cost ratio, high data storage density, being solid state and being non-volatile.
  • flash memory devices such as USB flash drives are already a substantial improvement and advancement over predecessor memory devices, there is an ever increasing demand for more compact data storage devices.
  • a conventional USB flash drive of NAND type flash of Figure 1 comprises a NAND controller and a flash memory die which are resin encapsulated and mounted on a substrate of a printed circuit board (PCB).
  • PCB printed circuit board
  • Resin encapsulation of a flash memory die is necessary in most applications to protect bonding wires which connect the die to the PCB to promote device reliability and durability.
  • the encapsulated components are mounted on one side of the PCB opposite the side on which exposed metalized USB contact fingers are mounted.
  • the exposed metalized USB contact fingers provide data transfer channels for data communication between the flash memory and an external device, and are located on a front end of the PCB.
  • Such a typical flash drive measures 24.8mm (long) and 11 .3mm (wide).
  • the price of component fixation by permanent encapsulation, such as resin encapsulation, in the case of a USB flash drive is that the controller and the flash memory are to be mounted together and encapsulated on the same side of the metalized USB contact fingers to ensure that the USB contact fingers are exposed for external conduction and production economy.
  • Another consequence of permanent encapsulation of components is high wastage because repair of encapsulated components is difficult, if not impossible.
  • a USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the flash memory device is encapsulated while the controller is exposed.
  • the selective encapsulation of components helps to reduce component wastage and is therefore beneficial and more environmentally friendly.
  • the flash memory device may be resin encapsulated.
  • a USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the controller and the flash memory device are mounted on opposite sides of the substrate, and connected by metalized through holes on the substrate; characterized in that the controller and the flash memory device are on directly opposite sides of the substrate.
  • a flash drive of the present invention has a compact construction while maintaining the reliability and robustness of flash drives made according to conventional construction methodology.
  • the flash memory device comprises a stack of flash memory dies.
  • the use of a die-stacking construction in the assembling of the flash memory device further increases data storage capacity while maintaining the compactness character of the present invention.
  • the memory die of the stack of flash memory dies may be wire bonded to an adjacent memory die or adjacent memory dies of the stack.
  • each memory die of the stack of flash memory dies may be individually wire bonded to the substrate and connected to the controller for data transfer. Individual bonding of the contact terminals of a die to the PCB or the controller facilitates a multi-channel construction, thereby facilitating high speed data transfer by parallel channels.
  • Figures 1 is a plan view showing the contact finger side of a PCB of a conventional USB flash drive
  • Figures 2, 2A and 2B are respectively plan view showing the contact finger side, plan view showing the flash memory side of a component mounted PCB, and side elevation view of an exemplary USB flash drive according to a first embodiment of the present invention
  • Figure 2C is a schematic side elevation view of the exemplary PCB of Figure 1 along the line A-A',
  • Figure 2D is a schematic circuit block diagram illustrating the circuit connection of the USB drive of Figure 2
  • Figure 3 is a schematic longitudinal cross sectional view of the USB flash of Figure 2 when mounted on a casing
  • FIGS 3A, 3B and 3C are respectively perspective views of the USB flash drive of Figure 2 with housing mounted, with housing removed and in exploded form,
  • Figures 4, 4A and 4B are respectively side elevation, perspective and bottom plan views of a component mounted and encapsulated PCB of an exemplary USB flash drive according to a second embodiment of the present invention
  • Figure 4C is a schematic longitudinal cross-sectional view of the PCB of Figure 4 taken along the line B-B' when mounted in a casing,
  • FIG. 4D is a schematic block diagram of the USB flash drive of Figure 4,
  • Figure 4E is a schematic longitudinal cross-section view of a variation of the embodiment of Figure 4 in which the memory device comprises a stack of memory dies connected in series, and
  • Figures 5, 6 and 7 are perspective views of exemplary USB flash drives illustrating third to fifth embodiments of the present invention.
  • a USB flash drive 100 of Figures 2, 2A, 2B, 2C, 3 and 3A-3C as an example of a memory storage device comprises a flash memory die 110 as an exemplary flash memory device and a controller 120 which are mounted on a printed circuit board (PCB) 130.
  • the PCB is elongate and formed with a plurality of longitudinally extending metalized contact fingers 132 at one of its longitudinal free ends.
  • the elongate contact fingers 132 collectively form a USB interface for making electrical connection with a counterpart USB interface of a USB compatible device.
  • the contact fingers are gold plated to ensure good electrical contact and to mitigate the risk of oxidation after repeated uses.
  • the controller 120 is surface mounted on the side of the PCB on which the contact fingers are formed and adjacent the contact fingers. The longitudinal ends of the contact fingers proximal the controller are flush and connection is made between the fingers and corresponding ports of the controller by a printed circuit on the PCB.
  • Other peripheral circuit components such as passive and active components including resistors, capacitors, inductors, transistors are surface mounted on the PCB 130 adjacent the controller to form a complete data communication control circuitry.
  • a flash memory device 110 is mounted on a side of the PCB 130 which is opposite the side formed with the contact fingers or mounted with the controller as shown more clearly in Figure 2A.
  • the flash memory is mounted on the PCB so that it is directly underneath the contact fingers.
  • the flash memory device is wire bonded by bonding wires 114 to the PCB 130 and the PCB 130 is formed with metalized through holes (not shown) coupled with conductive tracks formed within the PCB in order to establish electrical connection with the control circuitry on the other side of the PCB 130.
  • the flash memory device can be encapsulated with resin while leaving the controller exposed. As the contact fingers and the controller are immediately adjacent, encapsulation of the flash memory device could be performed relatively easily without encapsulating the controller or the contact fingers.
  • the subassembly of the component mounted PCB comprising the controller and the flash memory device is them mounted on a casing 140 to form a complete packaged USB flash drive.
  • a packaged USB is commonly referred to as a UDP ("USB Disk in Package") and a USB flash drive of the present invention will be conveniently referred to as a Micro-UDP herein because of a substantial reduction in package length due to the present construction methodology.
  • the circuit block diagram of Figure 2B sets out the electrical connection relationship of the flash drive which would be readily understood by persons skilled in the art with reference to the construction of Figures 2 and 2A.
  • the casing 140 comprises a tubular casing portion and an end casing portion.
  • the tubular casing portion comprises a receptacle for mechanically engaging with the PCB subassembly upon longitudinal insertion.
  • the end portion is then inserted into the tubular casing portion as a plug.
  • Countering mechanical mating engagement means formed respectively on the sides of the cased ensure that a robust casing is formed once the end casing and the tubular casing are mechanically coupled.
  • a second embodiment of a USB flash drive 200 of Figures 4 and 4A-4C is substantially identical to that of the flash drive of Figures 2 and 3 and the same numerals are used for the same parts or components.
  • the memory device 210 comprises a stack of flash memory dies 212a, 212b, 212c & 212d, which are stacked together in a high-rise stepped manner.
  • the stepped stacking arrangement defines stepped portions such that the data and control ports of a memory die could be connected to the PCB by bonding wires in an orderly nested manner.
  • the connect terminals on the PCB, to which the memory bonding wires are terminated, are wired to the controller through printed circuits on the PCB, for example sandwiched printed wiring on a multi-layer PCB.
  • the stack of memory dies is resin encapsulated.
  • the circuit block diagram of Figure 4D is substantially identical to that of Figure 2D except that a flash NAND assembly comprising 4 NAND memory dies in a stack is use instead of a single die flash.
  • the flash drive of Figure 4E is substantially identical to that of Figure 4 except that the memory device, or the NAND assembly, comprises 4 flash dies stacked together and connected in series, forming a single channel flash assembly.
  • Figures 5, 6 and 7 are similar to the flash drive of Figure 4 except with modifications on the protective casing.
  • the micro-controller and the control circuitry may be resin encapsulated for enhanced durability. While the present invention has been explained with reference to the exemplary embodiments above, it should be appreciated by persons skilled in the art the embodiments are only for reference and should not be regarded as restrictive on the scope of the invention.

Abstract

A universal serial bus (USB) flash drive (200) comprises a controller (120) and a flash memory device (210) mounted on a substrate (130). The controller (120) is arranged for controlling data transfer between the flash memory device (210) and USB interface, wherein the controller (120) and the flash memory device (210) are mounted on opposite sides of the substrate (130), and connected by metalized through holes on the substrate (130). The USB flash drive (200) is characterized in that the controller (120) and the flash memory device (130) are on directly opposite sides of the substrate (130). Such a flash drive has a compact construction while maintaining the reliability and robustness of flash drives made according to conventional methodology.

Description

MICRO UDP
Field of the Invention
The present invention relates to data storage devices such as USB flash drives and USB memory sticks. More specifically, although not solely limited thereto, the present invention relates to flash memory drives comprising a stack of flash memory members such as flash memory chips or dies. The present invention also relates to electronic data storage apparatus comprising a stacked assembly of flash memory members.
Background of the Invention
Memory devices as electronic data storage are essential to the operation of many electronic apparatus, especially electronic apparatus controlled or controllable by a computer or a microprocessor. Such memory devices include USB memory sticks, solid state disks (SSD), mobile internet device (MID), etc. Among the various types of memory devices, flash memory is gaining increasing popularity due to its high performance-to-cost ratio, high data storage density, being solid state and being non-volatile. Whilst flash memory devices such as USB flash drives are already a substantial improvement and advancement over predecessor memory devices, there is an ever increasing demand for more compact data storage devices. For example, a conventional USB flash drive of NAND type flash of Figure 1 comprises a NAND controller and a flash memory die which are resin encapsulated and mounted on a substrate of a printed circuit board (PCB). Resin encapsulation of a flash memory die is necessary in most applications to protect bonding wires which connect the die to the PCB to promote device reliability and durability. The encapsulated components are mounted on one side of the PCB opposite the side on which exposed metalized USB contact fingers are mounted. The exposed metalized USB contact fingers provide data transfer channels for data communication between the flash memory and an external device, and are located on a front end of the PCB. Such a typical flash drive measures 24.8mm (long) and 11 .3mm (wide).
Furthermore, while sealed encapsulation of the electronic components enhances reliability and stability of USB flash drives, the price of component fixation by permanent encapsulation, such as resin encapsulation, in the case of a USB flash drive is that the controller and the flash memory are to be mounted together and encapsulated on the same side of the metalized USB contact fingers to ensure that the USB contact fingers are exposed for external conduction and production economy. Another consequence of permanent encapsulation of components is high wastage because repair of encapsulated components is difficult, if not impossible.
Summary of the Invention
According to the present invention, there is a USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the flash memory device is encapsulated while the controller is exposed. The selective encapsulation of components helps to reduce component wastage and is therefore beneficial and more environmentally friendly. For example, the flash memory device may be resin encapsulated.
According to another aspect of the present invention, there is provided a USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the controller and the flash memory device are mounted on opposite sides of the substrate, and connected by metalized through holes on the substrate; characterized in that the controller and the flash memory device are on directly opposite sides of the substrate. A flash drive of the present invention has a compact construction while maintaining the reliability and robustness of flash drives made according to conventional construction methodology.
In one embodiment, the flash memory device comprises a stack of flash memory dies. The use of a die-stacking construction in the assembling of the flash memory device further increases data storage capacity while maintaining the compactness character of the present invention.
As an example, the memory die of the stack of flash memory dies may be wire bonded to an adjacent memory die or adjacent memory dies of the stack.
In another example, each memory die of the stack of flash memory dies may be individually wire bonded to the substrate and connected to the controller for data transfer. Individual bonding of the contact terminals of a die to the PCB or the controller facilitates a multi-channel construction, thereby facilitating high speed data transfer by parallel channels.
Use of die-stacking technique in combination with the "opposite PCB sides" construction methodology of the present invention maximizes spatial utilization the PCB, thereby enhancing compactness of the micro-UDP of the present invention.
Brief Description of the Figures
The invention will be explained below by way of example and with reference to the accompany drawings, in which:
Figures 1 is a plan view showing the contact finger side of a PCB of a conventional USB flash drive,
Figures 2, 2A and 2B are respectively plan view showing the contact finger side, plan view showing the flash memory side of a component mounted PCB, and side elevation view of an exemplary USB flash drive according to a first embodiment of the present invention,
Figure 2C is a schematic side elevation view of the exemplary PCB of Figure 1 along the line A-A',
Figure 2D is a schematic circuit block diagram illustrating the circuit connection of the USB drive of Figure 2,
Figure 3 is a schematic longitudinal cross sectional view of the USB flash of Figure 2 when mounted on a casing,
Figures 3A, 3B and 3C are respectively perspective views of the USB flash drive of Figure 2 with housing mounted, with housing removed and in exploded form,
Figures 4, 4A and 4B are respectively side elevation, perspective and bottom plan views of a component mounted and encapsulated PCB of an exemplary USB flash drive according to a second embodiment of the present invention,
Figure 4C is a schematic longitudinal cross-sectional view of the PCB of Figure 4 taken along the line B-B' when mounted in a casing,
Figure 4D is a schematic block diagram of the USB flash drive of Figure 4,
Figure 4E is a schematic longitudinal cross-section view of a variation of the embodiment of Figure 4 in which the memory device comprises a stack of memory dies connected in series, and
Figures 5, 6 and 7 are perspective views of exemplary USB flash drives illustrating third to fifth embodiments of the present invention.
Detailed Description of Exemplary Embodiments
A USB flash drive 100 of Figures 2, 2A, 2B, 2C, 3 and 3A-3C as an example of a memory storage device comprises a flash memory die 110 as an exemplary flash memory device and a controller 120 which are mounted on a printed circuit board (PCB) 130. The PCB is elongate and formed with a plurality of longitudinally extending metalized contact fingers 132 at one of its longitudinal free ends. The elongate contact fingers 132 collectively form a USB interface for making electrical connection with a counterpart USB interface of a USB compatible device. The contact fingers are gold plated to ensure good electrical contact and to mitigate the risk of oxidation after repeated uses.
The controller 120 is surface mounted on the side of the PCB on which the contact fingers are formed and adjacent the contact fingers. The longitudinal ends of the contact fingers proximal the controller are flush and connection is made between the fingers and corresponding ports of the controller by a printed circuit on the PCB. Other peripheral circuit components, such as passive and active components including resistors, capacitors, inductors, transistors are surface mounted on the PCB 130 adjacent the controller to form a complete data communication control circuitry.
To provide non-volatile data storage capability, a flash memory device 110 is mounted on a side of the PCB 130 which is opposite the side formed with the contact fingers or mounted with the controller as shown more clearly in Figure 2A. The flash memory is mounted on the PCB so that it is directly underneath the contact fingers. The flash memory device is wire bonded by bonding wires 114 to the PCB 130 and the PCB 130 is formed with metalized through holes (not shown) coupled with conductive tracks formed within the PCB in order to establish electrical connection with the control circuitry on the other side of the PCB 130. As the flash memory device is mounted on the other side of the PCB, the flash memory can be encapsulated with resin while leaving the controller exposed. As the contact fingers and the controller are immediately adjacent, encapsulation of the flash memory device could be performed relatively easily without encapsulating the controller or the contact fingers.
The subassembly of the component mounted PCB comprising the controller and the flash memory device is them mounted on a casing 140 to form a complete packaged USB flash drive. A packaged USB is commonly referred to as a UDP ("USB Disk in Package") and a USB flash drive of the present invention will be conveniently referred to as a Micro-UDP herein because of a substantial reduction in package length due to the present construction methodology. The circuit block diagram of Figure 2B sets out the electrical connection relationship of the flash drive which would be readily understood by persons skilled in the art with reference to the construction of Figures 2 and 2A.
The casing 140 comprises a tubular casing portion and an end casing portion. The tubular casing portion comprises a receptacle for mechanically engaging with the PCB subassembly upon longitudinal insertion. The end portion is then inserted into the tubular casing portion as a plug. Countering mechanical mating engagement means formed respectively on the sides of the cased ensure that a robust casing is formed once the end casing and the tubular casing are mechanically coupled.
A second embodiment of a USB flash drive 200 of Figures 4 and 4A-4C is substantially identical to that of the flash drive of Figures 2 and 3 and the same numerals are used for the same parts or components. In this embodiment, the memory device 210 comprises a stack of flash memory dies 212a, 212b, 212c & 212d, which are stacked together in a high-rise stepped manner. The stepped stacking arrangement defines stepped portions such that the data and control ports of a memory die could be connected to the PCB by bonding wires in an orderly nested manner. As the data leads of each memory die are individually bonded to the PCB, this provides a compact UDP with multichannel data transfer capability suitable for USB 3.0 applications since the data channels of the plurality of memory dies could be connected in parallel to the NAND controller. The connect terminals on the PCB, to which the memory bonding wires are terminated, are wired to the controller through printed circuits on the PCB, for example sandwiched printed wiring on a multi-layer PCB. Similar to the first embodiment, the stack of memory dies is resin encapsulated. The circuit block diagram of Figure 4D is substantially identical to that of Figure 2D except that a flash NAND assembly comprising 4 NAND memory dies in a stack is use instead of a single die flash. The flash drive of Figure 4E is substantially identical to that of Figure 4 except that the memory device, or the NAND assembly, comprises 4 flash dies stacked together and connected in series, forming a single channel flash assembly.
The alternative embodiments of Figures 5, 6 and 7 are similar to the flash drive of Figure 4 except with modifications on the protective casing. As an addition or alternative, the micro-controller and the control circuitry may be resin encapsulated for enhanced durability. While the present invention has been explained with reference to the exemplary embodiments above, it should be appreciated by persons skilled in the art the embodiments are only for reference and should not be regarded as restrictive on the scope of the invention.
Table of Numerals
Figure imgf000012_0001

Claims

1 . A USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the controller and the flash memory device are mounted on opposite sides of the substrate, and connected by metalized through holes on the substrate; characterized in that the controller and the flash memory device are on directly opposite sides of the substrate.
2. A USB flash drive according to Claim 1 , wherein the flash memory device comprises a stack of flash memory dies.
3. A USB flash drive according to Claim 2, wherein a memory die of the stack of flash memory dies is wire bonded to an adjacent memory die or adjacent memory dies of the stack.
4. A USB flash drive according to Claim 2, wherein each memory die of the stack of flash memory dies is individually wire bonded to the substrate and connected to the controller for data transfer.
5. A USB flash drive according to Claims 3 or 4 wherein the memory dies in the stack are arranged in an overhanging relationship.
6. A USB flash drive comprising a controller and a flash memory device mounted on a substrate, the controller being arranged for controlling data transfer between the flash memory device and USB interface, wherein the flash memory device is encapsulated while the controller is exposed.
7. A USB flash drive according to Claim 6, wherein the flash memory device is resin encapsulated.
8. A USB flash drive according to any of the preceding Claims, wherein the controller is mounted immediately adjacent the USB interface, and the flash memory device is immediately underneath the USB interface and the controller on another side of the PCB.
9. A USB flash drive according to any of the preceding Claims, wherein the USB interface includes metalized USB contacts on the substrate, the controller and the USB contacts are on the same side of the substrate.
10. A USB flash drive according to any of the preceding Claims, wherein the substrate is a printed circuit board.
1 1 . A USB flash drive according to any of the preceding Claims, wherein the flash memory device is a multichannel flash memory assembly comprising a plurality of stacked flash memory dies.
12. A USB flash drive according to any of the preceding Clainns, wherein the component mounted PCB of the USB flash drive or the flash drive has a length of less than 20mm, preferably less than 16.5mm.
PCT/CN2010/076081 2010-08-17 2010-08-17 Micro universal serial bus disk in package WO2012022031A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109119104A (en) * 2018-10-12 2019-01-01 苏州普福斯信息科技有限公司 A kind of mobile hard disk with cooling system
US11487445B2 (en) * 2016-11-22 2022-11-01 Intel Corporation Programmable integrated circuit with stacked memory die for storing configuration data

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1377041A (en) * 2001-03-22 2002-10-30 株式会社和人Elcoms Flash memory card
CN1453841A (en) * 2002-03-28 2003-11-05 三因迪斯克公司 Improved memory package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1377041A (en) * 2001-03-22 2002-10-30 株式会社和人Elcoms Flash memory card
CN1453841A (en) * 2002-03-28 2003-11-05 三因迪斯克公司 Improved memory package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11487445B2 (en) * 2016-11-22 2022-11-01 Intel Corporation Programmable integrated circuit with stacked memory die for storing configuration data
CN109119104A (en) * 2018-10-12 2019-01-01 苏州普福斯信息科技有限公司 A kind of mobile hard disk with cooling system

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