WO2012021301A1 - Interconnection between conducting polymer materials - Google Patents

Interconnection between conducting polymer materials Download PDF

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Publication number
WO2012021301A1
WO2012021301A1 PCT/US2011/045747 US2011045747W WO2012021301A1 WO 2012021301 A1 WO2012021301 A1 WO 2012021301A1 US 2011045747 W US2011045747 W US 2011045747W WO 2012021301 A1 WO2012021301 A1 WO 2012021301A1
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WO
WIPO (PCT)
Prior art keywords
polymer
portions
conducting polymer
poly
electrically conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/045747
Other languages
French (fr)
Inventor
Ian W. Hunter
Lauren Montemayor
Eli Travis Paster
Priam Pillai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Massachusetts Institute of Technology
Original Assignee
Massachusetts Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Institute of Technology filed Critical Massachusetts Institute of Technology
Publication of WO2012021301A1 publication Critical patent/WO2012021301A1/en
Priority to US13/766,257 priority Critical patent/US10134501B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances

Definitions

  • This invention relates to electrically conducting polymers and more particularly to a method for joining portions of electrically conducting polymers.
  • Conducting polymers such as poiypyrrole (PPy) have many uses resulting primarily from the fact that the polymers are flexible and can be made into thin films among other geometries. Those with skill in the art will recognize that flexible electrically conducting polymers can be used as substitutes for metal conductors. In many applications, it may be required to join two portions of a conductive polymer together and assure that the joined material is itself electrically conducting. Many interconnect techniques involve using metal solder which can add weight and impede the flexibility of the polymer material. Other techniques involve high temperatures or large electrical potentials that degrade the electrical and mechanical properties of the polymer.
  • An object of the invention is to provide a method that is simple and flexible method of joining conductive polymers.
  • the method involves connecting two portions of an electrically conducting polymer using a second soluble polymer. It includes disposing a solution of the soluble polymer in contact with the two portions of the first electrically conducting polymer. The solvent is allowed to evaporate leaving the second polymer joining the two portions of the first polymer.
  • the first electrically conducting polymer is poiypyrrole (PPy).
  • a suitable second polymer for this application is poly 3-hexyl thiophene (P3HT).
  • a suitable solvent for the P3HT is dichloromethane which wets the surface of the PPy.
  • the solution is 0.3wt% poly 3-hexyl thiophene in dichloromethane.
  • the P3HT is doped with iodine to improve its conductivity.
  • Fig la is a schematic illustration showing the joining of two portions of a conducting polymer connected using a soluble conducting polymer interconnect.
  • Fig 1 b is a schematic illustration showing the joining of two portions of conducting polymer using a soluble non-conducting polymer interconnect.
  • Fig 2 is a photograph of polymer joined by the method of the invention.
  • Fig 3 is a graph of a uniaxial tensile test for the joined polymer.
  • Fig 4a is a picture of the joining procedure showing the unconnected conducting polymer strips
  • Fog 4b is a picture of the joining procedure showing the two strips immersed into the solution Fig 5. is an SEM image of a fractured PPy film at the joint with P3HT.
  • polypyrrole portions 1 and 3 have been joined with another conducting polymer, poly 3-hexyl thiophene (P3HT). This is designated as element 2.
  • P3HT poly 3-hexyl thiophene
  • P3HT While P3HT is electrically conducting, it is not as conducting as PPy so its conductivity can be improved by doping the P3HT film with iodine. The doping was performed by leaving iodine crystals with the joined film under a vacuum. The joined film is illustrated in the photograph of Fig. 2.
  • Fig lb also shows another embodiment of the invention were a soluble non-electrical ly conducting polymer can be used to create the interconnect. In this embodiment a soluble polymer forms around the joint encasing the junction.
  • the electrical resistance of the PPy strips 1 and 3 joined with the P3HT was measured before and after the iodine doping step. The results are shown in the Table below.
  • Fig. 3 shows the force strain curve.
  • Fig. 5 is a scanning electron microscope micrograph showing the fracture at the joint with the P3HT.
  • conductive polymers including but not limited to polypyrrole, poly 3-hexyl thiophione, poly aniline, poly 3-ethylene dioxythiophnes etc can be joined using this method.
  • Any soluble polymer including but not limited to poly 3-hexyl thiophene, polyaniline or polystyrene can also be used the interconnect material.

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

Method for connecting two portions of a first electrically conducting polymer with a second polymer. The method includes disposing a solution of a second polymer in a solvent to be in contact with the two portions of the first electrically conducting polymer and allowing the solvent to evaporate leaving the second polymer joining the two portions of the first polymer. The second polymer may be doped to improve its conductivity.

Description

INTERCONNECTION BETWEEN CONDUCTING POLYMER MATERIALS
Priority Information
The present application claims priority to U.S. Provisional Application Serial No. U.S. 61/373,298 filed on August 13, 2010 and incorporated herein by reference in its entirety.
Sponsorship Information
This invention was made with government support under Grant number NBCHC 0080001, awarded by the Department of the Interior. The government has certain rights in the invention.
Background of the Invention
This invention relates to electrically conducting polymers and more particularly to a method for joining portions of electrically conducting polymers.
Conducting polymers such as poiypyrrole (PPy) have many uses resulting primarily from the fact that the polymers are flexible and can be made into thin films among other geometries. Those with skill in the art will recognize that flexible electrically conducting polymers can be used as substitutes for metal conductors. In many applications, it may be required to join two portions of a conductive polymer together and assure that the joined material is itself electrically conducting. Many interconnect techniques involve using metal solder which can add weight and impede the flexibility of the polymer material. Other techniques involve high temperatures or large electrical potentials that degrade the electrical and mechanical properties of the polymer.
An object of the invention is to provide a method that is simple and flexible method of joining conductive polymers.
Summary of the Invention
The method involves connecting two portions of an electrically conducting polymer using a second soluble polymer. It includes disposing a solution of the soluble polymer in contact with the two portions of the first electrically conducting polymer. The solvent is allowed to evaporate leaving the second polymer joining the two portions of the first polymer. In a preferred embodiment, the first electrically conducting polymer is poiypyrrole (PPy). A suitable second polymer for this application is poly 3-hexyl thiophene (P3HT). A suitable solvent for the P3HT is dichloromethane which wets the surface of the PPy. In a preferred embodiment, the solution is 0.3wt% poly 3-hexyl thiophene in dichloromethane. The P3HT is doped with iodine to improve its conductivity.
Brief Description of the Drawing
Fig la is a schematic illustration showing the joining of two portions of a conducting polymer connected using a soluble conducting polymer interconnect.
Fig 1 b is a schematic illustration showing the joining of two portions of conducting polymer using a soluble non-conducting polymer interconnect.
Fig 2 is a photograph of polymer joined by the method of the invention.
Fig 3 is a graph of a uniaxial tensile test for the joined polymer.
Fig 4a is a picture of the joining procedure showing the unconnected conducting polymer strips
Fog 4b is a picture of the joining procedure showing the two strips immersed into the solution Fig 5. is an SEM image of a fractured PPy film at the joint with P3HT.
Description of the Preferred Embodiment
With reference first to Fig. la, polypyrrole portions 1 and 3 have been joined with another conducting polymer, poly 3-hexyl thiophene (P3HT). This is designated as element 2.
In an experiment, two thin strips of polypyrrole having dimensions 3mm by 20μιη by 50mm and 3mm by 20μιη by 45mm were fixed on the sides of a platform of a Teflon coated well. A solution of 0.3wt % poly 3-hexyl thiophene (4.5mg/ml) in dichloromethane (DCM) was drop cast into the well. As the DCM evaporated, a P3HT film comes out of solution in the interface between the PPy strips 1 and 3. The P3HT film creates a conducting polymer bond that joins the two strips 1 and 3 together (This procedure is illustrated in Fig 4a and 4b). While P3HT is electrically conducting, it is not as conducting as PPy so its conductivity can be improved by doping the P3HT film with iodine. The doping was performed by leaving iodine crystals with the joined film under a vacuum. The joined film is illustrated in the photograph of Fig. 2. Fig lb also shows another embodiment of the invention were a soluble non-electrical ly conducting polymer can be used to create the interconnect. In this embodiment a soluble polymer forms around the joint encasing the junction. The electrical resistance of the PPy strips 1 and 3 joined with the P3HT was measured before and after the iodine doping step. The results are shown in the Table below.
Table
Figure imgf000004_0001
Stress-strain curves were measured of the joined strips and the film fractured at the
P3HT joint. Fig. 3 shows the force strain curve. Fig. 5 is a scanning electron microscope micrograph showing the fracture at the joint with the P3HT. Those of ordinary skill in the art will recognize that different geometries of the conducting polymers may be used such as wires, strips or two dimensional films. Conducting polymers in all of these geometries can be joined by the method disclosed herein. While this disclosure has focused on PPy joined with P3HT, it is to be understood that the method of the invention can be used with any conductive polymers. For example any conducting polymer including but not limited to polypyrrole, poly 3-hexyl thiophione, poly aniline, poly 3-ethylene dioxythiophnes etc can be joined using this method. Any soluble polymer including but not limited to poly 3-hexyl thiophene, polyaniline or polystyrene can also be used the interconnect material.
It is recognized that modifications and variations of the invention will be apparent to those of ordinary skill in the art and all such modifications and variations are included within the scope of the appended claims.

Claims

What is claimed is: 1. Method for connecting two portions of a first electrically conducting polymer comprising: disposing a solution of a soluble polymer in a solvent to be in contact with the two portions of the first electrically conducting polymer; and
allowing the solvent to evaporate leaving the second polymer joining the two portions of the first polymer.
2. The method of claim 1 wherein the first polymer is polypyrrole.
3. The method of claim 2 wherein the second polymer is poly 3-hexyl thiophene.
4. The method of claim 3 wherein the solvent is dichloromethane.
5. The method of claim 3 wherein the solution is 0.3wt % poly 3-hexyl thiophene in dichloromethane.
6. The method of claim 1 further including doping the poly 3-hexyl thiophene with iodine to improve its conductivity.
PCT/US2011/045747 2010-08-13 2011-07-28 Interconnection between conducting polymer materials Ceased WO2012021301A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/766,257 US10134501B2 (en) 2010-08-13 2013-02-13 Interconnection between conducting polymer materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37329810P 2010-08-13 2010-08-13
US61/373,298 2010-08-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/766,257 Continuation US10134501B2 (en) 2010-08-13 2013-02-13 Interconnection between conducting polymer materials

Publications (1)

Publication Number Publication Date
WO2012021301A1 true WO2012021301A1 (en) 2012-02-16

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WO (1) WO2012021301A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050159580A1 (en) * 2003-03-19 2005-07-21 Xerox Corporation Polythiophenes and devices thereof
US20060131567A1 (en) * 2004-12-20 2006-06-22 Jie Liu Surface modified electrodes and devices using reduced organic materials
WO2007005617A2 (en) * 2005-06-30 2007-01-11 The Regents Of The University Of California Electrically conducting polymer glue, devices made therewith and methods of manufacture

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3723590A (en) * 1971-03-31 1973-03-27 Corning Glass Works Method for terminating an electrical component
US4069083A (en) * 1975-12-22 1978-01-17 Combustion Engineering, Inc. Bonding material and method
US4273728A (en) * 1979-03-14 1981-06-16 E. I. Du Pont De Nemours And Company Polyfluoroallyloxy compounds, their preparation and copolymers therefrom
US4711742A (en) * 1985-05-31 1987-12-08 Allied Corporation Solution processible forms of neutral and electrically conductive poly(substituted heterocycles)
ATE112883T1 (en) * 1986-08-26 1994-10-15 Hoechst Ag SOLUBLE ELECTRICALLY CONDUCTING POLYMERS, PROCESS FOR THEIR PRODUCTION AND THEIR USE.
US5324453A (en) * 1992-08-07 1994-06-28 Neste Oy Electrically conducting polyaniline: method for emulsion polymerization
US6117554A (en) * 1997-05-30 2000-09-12 Poly-Med, Inc. Modulated molecularly bonded inherently conductive polymers on substrates with conjugated multiple lamellae and shaped articles thereof
EP1107261A1 (en) * 1999-12-07 2001-06-13 Walter Dr. Schmid Electrically conductive inorganic polymer
WO2005112144A1 (en) * 2004-05-18 2005-11-24 Merck Patent Gmbh Formulation for ink-jet printing comprising semiconducting polymers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050159580A1 (en) * 2003-03-19 2005-07-21 Xerox Corporation Polythiophenes and devices thereof
US20060131567A1 (en) * 2004-12-20 2006-06-22 Jie Liu Surface modified electrodes and devices using reduced organic materials
WO2007005617A2 (en) * 2005-06-30 2007-01-11 The Regents Of The University Of California Electrically conducting polymer glue, devices made therewith and methods of manufacture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J. OUYANG ET AL: "Conducting Polymer as Transparent Electric Glue", ADVANCED MATERIALS, vol. 18, no. 16, 18 August 2006 (2006-08-18), pages 2141 - 2144, XP055014412, ISSN: 0935-9648, DOI: 10.1002/adma.200502475 *

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US10134501B2 (en) 2018-11-20

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