WO2012001161A1 - A system for grounding in an electronic device - Google Patents
A system for grounding in an electronic device Download PDFInfo
- Publication number
- WO2012001161A1 WO2012001161A1 PCT/EP2011/061150 EP2011061150W WO2012001161A1 WO 2012001161 A1 WO2012001161 A1 WO 2012001161A1 EP 2011061150 W EP2011061150 W EP 2011061150W WO 2012001161 A1 WO2012001161 A1 WO 2012001161A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic board
- ground plane
- footprint
- metallic piece
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Definitions
- the invention relates to the general domain of electronic board assembly. More specifically, the invention relates to a system for grounding in an electronic device.
- Electrical bonding in an electronic device is very important and absolutely necessary to successfully pass the certifications relating to electrostatic discharges and electromagnetic compatibility.
- an electronic device is today a modular system that comprises a motherboard and electronic modules carrying out a specific function. Antenna effects between the motherboard and the superposed module produce particularly disturbing radiation.
- the casing unit of electronic devices today is more and more often made of plastic. Unlike a metallic casing, a plastic casing cannot provide the ground return. The integration of modules on the electronic boards in plastic units is more and more sensitive.
- some functions for example in digital decoders (set top boxes) such as analogue reception of satellite, cable or radio signals or demodulation, are particularly sensitive to electromagnetic radiation and to electrostatic discharges. Modules integrating these functions are protected by a shielding also connected to the grounding.
- the metallic piece is dimensioned such that the wall corresponds to a projection of said closed line defined by one of the at least one footprint of the first electronic board and that the shape of the base corresponds to the shape defined by the closed line, and notable in that the base comprises elements providing a contact with the second electronic board thus electrically connecting the second ground plane with the first ground plane.
- the principle of the invention is to use the flexibility of this first electronic board to implement in it a very simple metallic piece having on its base elements to provide electrical bonding with the superposed electronic board.
- This piece is assembled and soldered in a totally integrated way into the existing assembly line using its contour or vertical wall.
- the footprint used on the board is first of all designed to receive an electronic component, such as metal shielding case, and is reused for grounding purpose when electronic component is not used or implemented on the second electronic board for a given product configuration. Therefore, the shape and dimension of the metallic piece is determined by the footprint for the electronic component originally planned to be used.
- the elements providing a contact with the second electronic board are contact strips.
- the elements providing a contact with the second electronic board are balls.
- the second electronic board is advantageously electrically connected to the first board using for example a connector and pressing upon the contact strips or balls of the metallic piece. The bonding of the electrical grounding is provided by the metallic piece.
- the wall comprises at least two pads in contact with one of the at least one footprints.
- the footprint is continuous, for example in rectangular form, or discontinuous, comprising for example the corners of the rectangle only.
- the rectangle, continuous or not defines the closed line which by projection, perpendicular to the board, determines the shape and dimension of the metallic piece.
- the wall of the metal piece adapted to the footprint is advantageously continuous through the whole length of the perimeter of the base or, according to a variant, for example composed of four pads soldered to the corners of the rectangle forming the footprint.
- a maximum contact surface between the wall and the footprint provides a more efficient bonding.
- the metallic piece is assembled and soldered on the first electronic board.
- the assembly of the component providing the bonding is totally integrated into the existing assembly line.
- the metallic piece also provides the shielding of components positioned between the first electronic board and the metallic piece.
- the shape of the metallic piece comprising a wall defined by vertical projection and a superior base is adapted to cover components on the first board.
- components are soldered onto the surface of the first board positioned under the metallic piece.
- the metallic piece connected to the ground plane, advantageously thus provides a function of electromagnetic protection of components positioned below.
- the system is modular as it enables a second electronic board to be grounded, among a plurality of electronic boards, using a metallic piece, among a plurality of metallic pieces, adapted to a plurality of footprints of the first electronic board.
- this system is particularly well adapted to the constraints of integration and product modularity.
- the footprint intended to connect the first ground plane to a component is a footprint of a shielding component.
- the surface of this footprint is then advantageously increased.
- the system also comprises a shielding component connected onto the second electronic board.
- the shielding component is positioned between said metallic piece and the second electronic board thus electrically connecting the second ground plane with the first ground plane.
- the second electronic board is positioned between said metallic piece and the shielding component. The second electronic board thus comprises a first ground footprint intended to connect the shielding component to the second ground plane and a second ground footprint intended to connect the elements of the base of the metallic piece with the same second ground plane.
- the first ground plane, the second ground plane, and the grounding of the shielding component are electrically connected.
- the second electronic board is thus superposed above the metallic piece on either one side or the other indifferently, the side on which the shielding component is connected or the other side thus comprising a footprint intended to connect to the second ground plane.
- the system enables a second electronic board to be grounded on a first board on which only a footprint of the shield component was planned to provide the bonding of the shielding.
- the system does not comprise a shielding component.
- the second electronic board then comprises at least one footprint intended to connect the second ground plane to a component, the at least one footprint of the second electronic board being in contact with the elements of the metallic piece thus connecting the second ground plane with the first ground plane.
- one side is not distinguished with respect to another on the second electronic board.
- the electronic device comprises a plastic casing.
- the electronic device is a decoder.
- the system for grounding according to an embodiment of the invention is particularly well adapted to a system in which the plastic casing can not provide bonding, for example set top boxes
- FIG. 3 shows a metallic piece on an electronic board comprised in the system according to a preferred embodiment
- FIG. 4 shows a metallic piece on an electronic board comprised in the system according to another preferred embodiment
- FIG. 5 shows the different elements comprised in the system according to a preferred embodiment
- FIG. 6 shows the different assembled elements comprised in the system according to a preferred embodiment
- FIG. 7 shows the different elements comprised in the system according to another preferred embodiment.
- Figure 1 shows a footprint 101 on an electronic board 100 comprised in the system according to an embodiment.
- the electronic board is for example the motherboard of an electronic device.
- the different electronic components are assembled and soldered onto this electronic board.
- the footprint 101 defines a close line following, for instance, a rectangular form as represented on figure 1 .
- Figure 2 shows a shielding component 102 on an electronic board 100.
- the shielding is soldered onto the footprint reserved for this purpose on the motherboard.
- the ground plane of the shielding is thus connected to the ground plane of the motherboard.
- grounding an electronic board is not adapted to be soldered on the footprint dedicated to the shielding component, and therefore need a supplementary, non reusable, dedicated footprints.
- the shape and the dimension of the grounding component according to the invention are determined from the footprint while in the prior art, the shape and the form of the footprint is determined by the grounding components.
- FIG. 5 shows the different elements comprised in the system according to a preferred embodiment.
- the system comprises a first electronic board 100, a second electronic board 1 1 1 , a metallic piece 103 providing the bonding between the first and second electronic board.
- the first board is for example a motherboard
- the second electronic board is for example a daughterboard or a module (NIM) implementing an interchangeable or additional function.
- NIM module
- the motherboard comprises the functions of decoding and displaying of television signals.
- a module carries out for example the functions of reception and demodulation (front-end) of signals for satellite, cable or radio transmission.
- the module 1 1 1 thus comprises sensitive components protected by a shielding 102.
- a module implements for example access control functions of different providers.
- a connector 109 on the first board 100 and a connector 1 10 on the second board 1 1 1 provide continuity of logical signals in the system when the two boards are connected.
- Figure 6 shows the different assembled elements comprised in the system according to a preferred embodiment.
- the connectors 109 and 1 10 are assembled, they maintain the second board 1 1 1 on the first board 1 10.
- a base 1 12 helps to maintain the second electronic board 1 1 1 superposed over the first electronic board 1 10.
- the second board 1 1 1 is in contact with the contact strips of the metallic piece 103 soldered onto the first board.
- the shielding component 102 is on one hand assembled on the second board 1 1 1 connected to the second ground plane.
- the shielding component 102 is on the other hand in contact with the contact strips connected to the first ground plane.
- this shielding component 102 and the metallic piece 103 connect the first and second ground planes.
- the invention is not limited to the embodiments previously described.
- the invention is compatible with several modules connected onto the motherboard.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180042261.4A CN103081577B (en) | 2010-07-02 | 2011-07-01 | For the system of ground connection in electronic equipment |
US13/808,003 US9179530B2 (en) | 2010-07-02 | 2011-07-01 | System for grounding in an electronic device |
JP2013517319A JP5938404B2 (en) | 2010-07-02 | 2011-07-01 | System for grounding in electronic equipment |
KR1020137000055A KR101811902B1 (en) | 2010-07-02 | 2011-07-01 | A system for grounding in an electronic device |
EP11729617.8A EP2589269B1 (en) | 2010-07-02 | 2011-07-01 | An electronic device comprising the system for grounding |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1055388 | 2010-07-02 | ||
FR1055388 | 2016-06-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012001161A1 true WO2012001161A1 (en) | 2012-01-05 |
Family
ID=43385126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/061150 WO2012001161A1 (en) | 2010-07-02 | 2011-07-01 | A system for grounding in an electronic device |
Country Status (6)
Country | Link |
---|---|
US (1) | US9179530B2 (en) |
EP (1) | EP2589269B1 (en) |
JP (1) | JP5938404B2 (en) |
KR (1) | KR101811902B1 (en) |
CN (1) | CN103081577B (en) |
WO (1) | WO2012001161A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016028977A1 (en) * | 2014-08-21 | 2016-02-25 | Fci Asia Pte. Ltd | Strain relief assembly for conductive cables |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596996B (en) * | 2016-01-08 | 2017-08-21 | 和碩聯合科技股份有限公司 | Circuit board assembly |
CN106061220B (en) * | 2016-06-20 | 2019-07-02 | 海信集团有限公司 | Electronic device circuitry system architecture and laser cinema equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053468A1 (en) * | 1998-04-30 | 2002-05-09 | Hideo Yumi | Grounding terminal and mounting structure of the same on a printed circuit board |
US20090135576A1 (en) * | 2007-11-28 | 2009-05-28 | Chi Mei Communication Systems, Inc. | Stacking structure of printed circuit board |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694689A (en) | 1971-02-24 | 1972-09-26 | Tektronix Inc | Electron beam deflection apparatus |
JPS53127262U (en) * | 1977-03-18 | 1978-10-09 | ||
JPS622297U (en) * | 1985-06-19 | 1987-01-08 | ||
JPH04284661A (en) * | 1991-03-13 | 1992-10-09 | Toshiba Corp | Semiconductor device |
JP2945760B2 (en) | 1991-08-09 | 1999-09-06 | タンデム コンピューターズ インコーポレイテッド | Electronic assembly with improved ground and electromagnetic interference shielding |
JPH0622297A (en) | 1992-06-29 | 1994-01-28 | Canon Inc | Motion compensation coder |
US5613860A (en) * | 1994-12-14 | 1997-03-25 | Molex Incorporated | Universal grounding clip for card-receiving connector |
JP2951224B2 (en) | 1994-12-26 | 1999-09-20 | 三洋電機株式会社 | Ground connection structure for electronic equipment |
JP3529992B2 (en) * | 1997-09-12 | 2004-05-24 | 株式会社ケンウッド | Ground terminal mounting structure for electronic equipment |
US6149443A (en) | 1997-09-26 | 2000-11-21 | Qualcomm Incorporated | Ground connection apparatus |
US5984697A (en) | 1997-12-03 | 1999-11-16 | Qualcomm Incorporated | Ground clip apparatus for circuit boards |
US6862190B2 (en) * | 2001-01-17 | 2005-03-01 | Honeywell International, Inc. | Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
US6464514B1 (en) | 2001-12-11 | 2002-10-15 | Hon Hai Precision Ind. Co., Ltd. | Card edge connector with grounding pad |
US20040105243A1 (en) * | 2002-10-03 | 2004-06-03 | Kuang-Hua Lee | Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards |
WO2004077898A2 (en) | 2003-02-26 | 2004-09-10 | Wavezero Inc. | Methods and devices for connecting and grounding an emi shield to a printed circuit board |
JP4164520B2 (en) * | 2006-07-26 | 2008-10-15 | 日本圧着端子製造株式会社 | Connector between printed wiring boards |
US7278865B1 (en) | 2006-09-07 | 2007-10-09 | Universal Scientific Industrial Co., Ltd. | Electronic device with a grounding mechanism |
TWM324375U (en) | 2007-05-21 | 2007-12-21 | Universal Scient Ind Co Ltd | Stacked packaging structure for communication module |
TWI347049B (en) | 2007-06-04 | 2011-08-11 | Hon Hai Prec Ind Co Ltd | Electrical card connector |
CN101360390B (en) * | 2007-08-03 | 2011-05-04 | 深圳富泰宏精密工业有限公司 | Stacking construction of printed circuit board |
JP2009111115A (en) | 2007-10-30 | 2009-05-21 | Sharp Corp | Shield case and high-frequency reception device with the same |
KR101400853B1 (en) * | 2007-11-14 | 2014-06-27 | 삼성전자주식회사 | Sim card connector apparatus for the wireless portable terminal |
CN101282594B (en) * | 2008-04-10 | 2013-06-05 | 苏州敏芯微电子技术有限公司 | Encapsulation structure for Micro-electromechanical microphone with two-sided mounting-pasted electrode |
JP5125773B2 (en) | 2008-05-30 | 2013-01-23 | 富士通株式会社 | Electronic equipment and ground connection structure |
US8483785B2 (en) * | 2009-03-26 | 2013-07-09 | Kyocera Corporation | Mobile electronic device providing impact resistance to electronic component |
EP2764760A4 (en) * | 2011-10-04 | 2015-09-16 | Sierra Wireless Inc | Electronic components accommodated by a cavity of the current pcm or by a cavity of the adjacent pcm to minimize height of cavities |
US10091918B2 (en) * | 2012-12-11 | 2018-10-02 | Qualcomm Incorporated | Methods and apparatus for conformal shielding |
-
2011
- 2011-07-01 CN CN201180042261.4A patent/CN103081577B/en active Active
- 2011-07-01 KR KR1020137000055A patent/KR101811902B1/en active IP Right Grant
- 2011-07-01 JP JP2013517319A patent/JP5938404B2/en active Active
- 2011-07-01 WO PCT/EP2011/061150 patent/WO2012001161A1/en active Application Filing
- 2011-07-01 US US13/808,003 patent/US9179530B2/en active Active
- 2011-07-01 EP EP11729617.8A patent/EP2589269B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053468A1 (en) * | 1998-04-30 | 2002-05-09 | Hideo Yumi | Grounding terminal and mounting structure of the same on a printed circuit board |
US20090135576A1 (en) * | 2007-11-28 | 2009-05-28 | Chi Mei Communication Systems, Inc. | Stacking structure of printed circuit board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016028977A1 (en) * | 2014-08-21 | 2016-02-25 | Fci Asia Pte. Ltd | Strain relief assembly for conductive cables |
US10033136B2 (en) | 2014-08-21 | 2018-07-24 | Fci Usa Llc | Strain relief assembly for conductive cables |
Also Published As
Publication number | Publication date |
---|---|
JP2013532389A (en) | 2013-08-15 |
KR20130089228A (en) | 2013-08-09 |
KR101811902B1 (en) | 2018-01-25 |
CN103081577A (en) | 2013-05-01 |
CN103081577B (en) | 2016-06-08 |
US9179530B2 (en) | 2015-11-03 |
US20130114180A1 (en) | 2013-05-09 |
EP2589269A1 (en) | 2013-05-08 |
JP5938404B2 (en) | 2016-06-22 |
EP2589269B1 (en) | 2020-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5335147A (en) | EMI shield apparatus and methods | |
CN103037671B (en) | Structure for stacking printed board assemblies in electronic device | |
EP2526749B1 (en) | Rf interference suppressor | |
US8520405B2 (en) | Shield case and image display device | |
US8444439B2 (en) | Connector mounting apparatus having a bracket with recesses abutting resisting tabs of a member received therein | |
KR101676672B1 (en) | Fixing device for shield can | |
US6985366B2 (en) | EMC shield and housing for electronic components | |
US9179530B2 (en) | System for grounding in an electronic device | |
CN105896023A (en) | Antenna bunching buckle device, electronic device and bunching method | |
KR20160106071A (en) | Dual-height rf tuner shield | |
US9244488B2 (en) | Display device | |
US9788412B2 (en) | Techniques and arrangements for multiple component grounding | |
US20130279127A1 (en) | Electronic device with shield for receiving digital card | |
WO2014076998A1 (en) | Grounding gasket and electronic apparatus | |
CN104199200B (en) | Circuit board installation fixing structure and liquid crystal display device | |
US9692192B2 (en) | Multi connector, wiring method thereof and display apparatus having the same | |
US9313934B2 (en) | Dispensible electrical gasket, electronic module having dispensible electrical gasket, and method of fabricating same | |
CN206192974U (en) | Gas sensor module based on buckle structure shell | |
KR20150086012A (en) | Shield can assembly and electronic device having it | |
US20110215975A1 (en) | Satellite antenna connection | |
US8242361B2 (en) | Tuner housing | |
JPH1097880A (en) | Capacitor box for connector | |
US20130063906A1 (en) | Circuit board assembly and electronic device with circuit board | |
US20130003323A1 (en) | Conductive gasket holder | |
JP2006310965A (en) | Digital broadcast receiver |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180042261.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11729617 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011729617 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2013517319 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20137000055 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13808003 Country of ref document: US |