WO2011149494A3 - System and method for enhanced heat transfer using nanoporous textured surfaces - Google Patents

System and method for enhanced heat transfer using nanoporous textured surfaces Download PDF

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Publication number
WO2011149494A3
WO2011149494A3 PCT/US2010/060337 US2010060337W WO2011149494A3 WO 2011149494 A3 WO2011149494 A3 WO 2011149494A3 US 2010060337 W US2010060337 W US 2010060337W WO 2011149494 A3 WO2011149494 A3 WO 2011149494A3
Authority
WO
WIPO (PCT)
Prior art keywords
nanostructures
nanoporous
heat exchange
heat transfer
exchange surface
Prior art date
Application number
PCT/US2010/060337
Other languages
French (fr)
Other versions
WO2011149494A2 (en
Inventor
Terry J. Hendricks
Chih-Hung Chang
Daniel R. Palo
Brian K. Paul
Original Assignee
Battelle Memorial Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Memorial Institute filed Critical Battelle Memorial Institute
Publication of WO2011149494A2 publication Critical patent/WO2011149494A2/en
Publication of WO2011149494A3 publication Critical patent/WO2011149494A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system and method for heat dissipation are disclosed. The system includes a heat exchange surface with raised hydrophilic nanoporous nanostructures disposed adjacent a central core upon a substrate. The raised nanoporous nanostructures define channels, interconnected pathways, and voids within the nanoporous nanostructures. The nanoporous nanostructures have additional surface irregularities upon the nanostructures themselves. The nanostructures are formed by depositing metal oxides or other materials upon a substrate using a Microreactor Assisted Nanomaterial Deposition (MAND) process. The method includes contacting the heat exchange surface with a heat transfer liquid that forms a preselected contact angle when placed on the heat exchange surface.
PCT/US2010/060337 2010-02-19 2010-12-14 System and method for enhanced heat transfer using nanoporous textured surfaces WO2011149494A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/709,266 2010-02-19
US12/709,266 US20110203772A1 (en) 2010-02-19 2010-02-19 System and method for enhanced heat transfer using nanoporous textured surfaces

Publications (2)

Publication Number Publication Date
WO2011149494A2 WO2011149494A2 (en) 2011-12-01
WO2011149494A3 true WO2011149494A3 (en) 2012-06-21

Family

ID=44475507

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/060337 WO2011149494A2 (en) 2010-02-19 2010-12-14 System and method for enhanced heat transfer using nanoporous textured surfaces

Country Status (2)

Country Link
US (1) US20110203772A1 (en)
WO (1) WO2011149494A2 (en)

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WO2011162849A2 (en) * 2010-04-01 2011-12-29 The Board Of Regents Of The Nevada System Of Higher Education, On Behalf Of The University Of Nevada, Reno Device having nano-coated porous integral fins
WO2012050639A1 (en) * 2010-10-14 2012-04-19 Micropyretics Heaters International, Inc. Antibiofilm nanoporous nanostructures and method to produce same
CN103588164A (en) * 2013-10-08 2014-02-19 上海交通大学 Copper-silver micro-nano multi-stage structure super-hydrophobic surface and production method thereof
JP6461361B2 (en) * 2015-09-14 2019-01-30 三菱電機株式会社 Cooler, power conversion device, and cooling system
US10100411B2 (en) * 2016-02-12 2018-10-16 Iowa State University Research Foundation, Inc. Supernucleating multiscale copper surfaces for high performance phase change heat transfer
EP3610217B1 (en) * 2017-04-14 2020-10-07 Sabanci Üniversitesi Heat exchanger with enhanced heat transfer surfaces
CA3069884A1 (en) * 2017-07-27 2019-01-31 Oxford Nanosystems Ltd Heat exchange element with microstructured coating and process for production
CN114127503A (en) * 2019-07-20 2022-03-01 尼蓝宝股份有限公司 Heat exchanger and system thereof
CN113782452A (en) * 2021-08-30 2021-12-10 北京航空航天大学 Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface

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US20050238810A1 (en) * 2004-04-26 2005-10-27 Mainstream Engineering Corp. Nanotube/metal substrate composites and methods for producing such composites
US20060151153A1 (en) * 2005-01-07 2006-07-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system

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WO2001040545A1 (en) * 1999-12-03 2001-06-07 Caterpillar Inc. Patterned hydrophilic-oleophilic metal oxide coating and method of forming
US20050238810A1 (en) * 2004-04-26 2005-10-27 Mainstream Engineering Corp. Nanotube/metal substrate composites and methods for producing such composites
US20060151153A1 (en) * 2005-01-07 2006-07-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system

Also Published As

Publication number Publication date
WO2011149494A2 (en) 2011-12-01
US20110203772A1 (en) 2011-08-25

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