WO2011136772A1 - Fluid ejection device - Google Patents
Fluid ejection device Download PDFInfo
- Publication number
- WO2011136772A1 WO2011136772A1 PCT/US2010/032890 US2010032890W WO2011136772A1 WO 2011136772 A1 WO2011136772 A1 WO 2011136772A1 US 2010032890 W US2010032890 W US 2010032890W WO 2011136772 A1 WO2011136772 A1 WO 2011136772A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- ejection device
- fluid ejection
- bottom layer
- recited
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 72
- 239000010409 thin film Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 30
- 230000004888 barrier function Effects 0.000 claims description 25
- 238000002161 passivation Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- CFQCIHVMOFOCGH-UHFFFAOYSA-N platinum ruthenium Chemical compound [Ru].[Pt] CFQCIHVMOFOCGH-UHFFFAOYSA-N 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 5
- 229910000929 Ru alloy Inorganic materials 0.000 claims description 4
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 4
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QBXVTOWCLDDBIC-UHFFFAOYSA-N [Zr].[Ta] Chemical compound [Zr].[Ta] QBXVTOWCLDDBIC-UHFFFAOYSA-N 0.000 claims description 2
- HBCZDZWFGVSUDJ-UHFFFAOYSA-N chromium tantalum Chemical compound [Cr].[Ta] HBCZDZWFGVSUDJ-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000000788 chromium alloy Substances 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 2
- 229940043774 zirconium oxide Drugs 0.000 claims 2
- 229910000599 Cr alloy Inorganic materials 0.000 claims 1
- 229910000629 Rh alloy Inorganic materials 0.000 claims 1
- 229910001347 Stellite Inorganic materials 0.000 claims 1
- 229910001093 Zr alloy Inorganic materials 0.000 claims 1
- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 21
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 230000006378 damage Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 108010053481 Antifreeze Proteins Proteins 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N Oxozirconium Chemical compound [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 101150015730 Prlr gene Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000010952 cobalt-chrome Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- -1 steliite 6B Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080067825.5A CN102947099B (en) | 2010-04-29 | 2010-04-29 | Fluid ejection apparatus |
PCT/US2010/032890 WO2011136772A1 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
US13/641,469 US8684501B2 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
EP10850862.3A EP2563596B1 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
JP2013507928A JP5740469B2 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2010/032890 WO2011136772A1 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011136772A1 true WO2011136772A1 (en) | 2011-11-03 |
Family
ID=44861809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/032890 WO2011136772A1 (en) | 2010-04-29 | 2010-04-29 | Fluid ejection device |
Country Status (5)
Country | Link |
---|---|
US (1) | US8684501B2 (en) |
EP (1) | EP2563596B1 (en) |
JP (1) | JP5740469B2 (en) |
CN (1) | CN102947099B (en) |
WO (1) | WO2011136772A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6366835B2 (en) * | 2014-10-30 | 2018-08-01 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | Printing apparatus and method for manufacturing printing apparatus |
CN107531053B (en) * | 2015-07-15 | 2019-10-18 | 惠普发展公司有限责任合伙企业 | Adherency and insulating layer |
KR102312555B1 (en) * | 2015-07-30 | 2021-10-14 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | Optical co-PCR |
CN108136778B (en) * | 2016-01-20 | 2021-06-08 | 惠普发展公司,有限责任合伙企业 | Energy-saving printing head |
US10654270B2 (en) * | 2016-07-12 | 2020-05-19 | Hewlett-Packard Development Company, L.P. | Printhead comprising a thin film passivation layer |
US20190263125A1 (en) * | 2017-01-31 | 2019-08-29 | Hewlett-Packard Development Company, L.P. | Atomic layer deposition oxide layers in fluid ejection devices |
JP7134752B2 (en) * | 2018-07-06 | 2022-09-12 | キヤノン株式会社 | liquid ejection head |
CN109351549A (en) * | 2018-09-04 | 2019-02-19 | 深圳市中美欧光电科技有限公司 | Glue dripping head, spot gluing equipment and Glue dripping head processing technology |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2545043A1 (en) | 1983-04-30 | 1984-11-02 | Canon Kk | RECORD HEAD BY LIQUID JETS |
US4513298A (en) | 1983-05-25 | 1985-04-23 | Hewlett-Packard Company | Thermal ink jet printhead |
US20020024564A1 (en) * | 2000-07-31 | 2002-02-28 | Teruo Ozaki | Ink jet head substrate, ink jet head, method for manufacturing ink jet head substrate, method for manufacturing ink jet head, method for using ink jet head and ink jet recording apparatus |
US20020060721A1 (en) * | 2000-09-04 | 2002-05-23 | Yoichi Takada | Recording unit and image recording apparatus |
US6575563B1 (en) | 2002-08-05 | 2003-06-10 | Lexmark International, Inc. | Power/volume regime for ink jet printers |
KR20050021728A (en) * | 2003-08-25 | 2005-03-07 | 삼성전자주식회사 | Protective layer of ink-jet print head and method of making ink-jet print head having the same |
US20050157089A1 (en) | 2004-01-20 | 2005-07-21 | Bell Byron V. | Micro-fluid ejection device having high resistance heater film |
US20070211117A1 (en) | 2006-03-08 | 2007-09-13 | Canon Kabushiki Kaisha | Liquid discharge head and manufacturing method therefor |
JP2008221710A (en) * | 2007-03-14 | 2008-09-25 | Canon Inc | Ink-jet head |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6491380B2 (en) | 1997-12-05 | 2002-12-10 | Canon Kabushiki Kaisha | Liquid discharging head with common ink chamber positioned over a movable member |
US6341848B1 (en) | 1999-12-13 | 2002-01-29 | Hewlett-Packard Company | Fluid-jet printer having printhead with integrated heat-sink |
US6467864B1 (en) | 2000-08-08 | 2002-10-22 | Lexmark International, Inc. | Determining minimum energy pulse characteristics in an ink jet print head |
US6637866B1 (en) | 2002-06-07 | 2003-10-28 | Lexmark International, Inc. | Energy efficient heater stack using DLC island |
US6607264B1 (en) * | 2002-06-18 | 2003-08-19 | Hewlett-Packard Development Company, L.P. | Fluid controlling apparatus |
US6929349B2 (en) * | 2003-10-14 | 2005-08-16 | Lexmark International, Inc. | Thin film ink jet printhead adhesion enhancement |
US7172268B2 (en) * | 2003-12-26 | 2007-02-06 | Canon Kabushiki Kaisha | Ink jet head, method for driving the same, and ink jet recording apparatus |
KR100555917B1 (en) * | 2003-12-26 | 2006-03-03 | 삼성전자주식회사 | Ink-jet print head and Method of making Ink-jet print head having the same |
US7387370B2 (en) | 2004-04-29 | 2008-06-17 | Hewlett-Packard Development Company, L.P. | Microfluidic architecture |
KR100560721B1 (en) | 2004-08-23 | 2006-03-13 | 삼성전자주식회사 | method of fabricating ink jet head including metal chamber layer and ink jet head fabricated therby |
US7413289B2 (en) * | 2005-12-23 | 2008-08-19 | Lexmark International, Inc. | Low energy, long life micro-fluid ejection device |
JP5145636B2 (en) * | 2005-12-27 | 2013-02-20 | 富士ゼロックス株式会社 | Droplet discharge head and droplet discharge apparatus |
US20080002000A1 (en) * | 2006-06-29 | 2008-01-03 | Robert Wilson Cornell | Protective Layers for Micro-Fluid Ejection Devices and Methods for Depositing the Same |
US20080303855A1 (en) * | 2007-06-07 | 2008-12-11 | Alan Bidwell | Compliant Sealing Materials and Methods For Sealing Nozzles For A Micro-Fluid Ejection Head |
WO2009005489A1 (en) | 2007-06-27 | 2009-01-08 | Lexmark International, Inc. | Protective layers for micro-fluid ejection devices |
KR20110067507A (en) * | 2009-12-14 | 2011-06-22 | 삼성전기주식회사 | Inkjet head assembly |
-
2010
- 2010-04-29 JP JP2013507928A patent/JP5740469B2/en not_active Expired - Fee Related
- 2010-04-29 WO PCT/US2010/032890 patent/WO2011136772A1/en active Application Filing
- 2010-04-29 EP EP10850862.3A patent/EP2563596B1/en not_active Not-in-force
- 2010-04-29 US US13/641,469 patent/US8684501B2/en active Active
- 2010-04-29 CN CN201080067825.5A patent/CN102947099B/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2545043A1 (en) | 1983-04-30 | 1984-11-02 | Canon Kk | RECORD HEAD BY LIQUID JETS |
US4513298A (en) | 1983-05-25 | 1985-04-23 | Hewlett-Packard Company | Thermal ink jet printhead |
US20020024564A1 (en) * | 2000-07-31 | 2002-02-28 | Teruo Ozaki | Ink jet head substrate, ink jet head, method for manufacturing ink jet head substrate, method for manufacturing ink jet head, method for using ink jet head and ink jet recording apparatus |
US20020060721A1 (en) * | 2000-09-04 | 2002-05-23 | Yoichi Takada | Recording unit and image recording apparatus |
US6575563B1 (en) | 2002-08-05 | 2003-06-10 | Lexmark International, Inc. | Power/volume regime for ink jet printers |
KR20050021728A (en) * | 2003-08-25 | 2005-03-07 | 삼성전자주식회사 | Protective layer of ink-jet print head and method of making ink-jet print head having the same |
US20050157089A1 (en) | 2004-01-20 | 2005-07-21 | Bell Byron V. | Micro-fluid ejection device having high resistance heater film |
US20070211117A1 (en) | 2006-03-08 | 2007-09-13 | Canon Kabushiki Kaisha | Liquid discharge head and manufacturing method therefor |
JP2008221710A (en) * | 2007-03-14 | 2008-09-25 | Canon Inc | Ink-jet head |
Also Published As
Publication number | Publication date |
---|---|
US20130044163A1 (en) | 2013-02-21 |
CN102947099B (en) | 2015-11-25 |
JP5740469B2 (en) | 2015-06-24 |
JP2013525153A (en) | 2013-06-20 |
EP2563596A1 (en) | 2013-03-06 |
CN102947099A (en) | 2013-02-27 |
EP2563596A4 (en) | 2014-05-21 |
EP2563596B1 (en) | 2015-07-22 |
US8684501B2 (en) | 2014-04-01 |
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