WO2011128328A3 - Preformed film - Google Patents

Preformed film Download PDF

Info

Publication number
WO2011128328A3
WO2011128328A3 PCT/EP2011/055691 EP2011055691W WO2011128328A3 WO 2011128328 A3 WO2011128328 A3 WO 2011128328A3 EP 2011055691 W EP2011055691 W EP 2011055691W WO 2011128328 A3 WO2011128328 A3 WO 2011128328A3
Authority
WO
WIPO (PCT)
Prior art keywords
preformed film
polymeric
polymeric member
carrier
preformed
Prior art date
Application number
PCT/EP2011/055691
Other languages
French (fr)
Other versions
WO2011128328A2 (en
Inventor
Ciaran Mcardle
Maria Parals Sendin
Terry Sterrett
Original Assignee
Henkel Ag & Co. Kgaa
Henkel Corporation
Henkel Ireland Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa, Henkel Corporation, Henkel Ireland Ltd. filed Critical Henkel Ag & Co. Kgaa
Publication of WO2011128328A2 publication Critical patent/WO2011128328A2/en
Publication of WO2011128328A3 publication Critical patent/WO2011128328A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/71—Resistive to light or to UV
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Abstract

Preformed film (1) comprising a carrier member (2) and a polymeric member (3) attached to the carrier member (2), wherein the polymeric member (3) includes at least one shape memory polymer and wherein the polymeric member (3) has a flatness index of less than 0.02.
PCT/EP2011/055691 2010-04-13 2011-04-12 Preformed film WO2011128328A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32356710P 2010-04-13 2010-04-13
US61/323,567 2010-04-13

Publications (2)

Publication Number Publication Date
WO2011128328A2 WO2011128328A2 (en) 2011-10-20
WO2011128328A3 true WO2011128328A3 (en) 2012-04-19

Family

ID=44280750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/055691 WO2011128328A2 (en) 2010-04-13 2011-04-12 Preformed film

Country Status (2)

Country Link
TW (1) TW201206668A (en)
WO (1) WO2011128328A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9623813B2 (en) * 2013-11-14 2017-04-18 GM Global Technology Operations LLC Fit and finish methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
WO2011128319A1 (en) * 2010-04-13 2011-10-20 Henkel Ag & Co. Kgaa Method for handling a wafer using a support structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7230047B2 (en) 2003-06-25 2007-06-12 Henkel Corporation Reformable compositions
US7226812B2 (en) 2004-03-31 2007-06-05 Intel Corporation Wafer support and release in wafer processing
US8618238B2 (en) 2007-04-20 2013-12-31 GM Global Technology Operations LLC Shape memory epoxy polymers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
WO2011128319A1 (en) * 2010-04-13 2011-10-20 Henkel Ag & Co. Kgaa Method for handling a wafer using a support structure

Also Published As

Publication number Publication date
WO2011128328A2 (en) 2011-10-20
TW201206668A (en) 2012-02-16

Similar Documents

Publication Publication Date Title
USD724357S1 (en) Storage rack
USD719937S1 (en) RFID antenna
USD719936S1 (en) RFID antenna
USD680522S1 (en) Case for electronic device
USD678766S1 (en) Package
USD647622S1 (en) Orthopedic device
USD638884S1 (en) Plastic capsule for crane game
USD649045S1 (en) Label
USD681026S1 (en) Case for electronic device
WO2010019718A3 (en) Carrier nanoparticles and related compositions, methods and systems
WO2012078249A3 (en) High capacity easy release extended use adhesive devices
WO2012006538A8 (en) Deuterated n-ethyl-n-phenyl-1,2-dihydro-4-hydroxy-5-chloro-1-methyl-2-oxoquinoline-3-carboxamide, salts and uses thereof
EP4274326A3 (en) Using a cell as a pathloss or timing reference
WO2010149484A3 (en) Oral care compositions comprising a dye polymer
EP2594608A4 (en) Polycarbonate resin composition, and molded article, film, plate and injection-molded article each comprising same
WO2011085004A3 (en) Photovoltaic cell with benzodithiophene-containing polymer
EP2543688A4 (en) Polymerization fluid, process for production thereof, transparent film made from the polymerization fluid, and transparent electrode
USD699769S1 (en) Mold split insert
ATE547129T1 (en) MULTIMODAL SHAPE MEMORY POLYMERS
EP2133382A4 (en) Polymer, and film or sheet comprising the same
WO2012070774A3 (en) Method for preparing wholly aromatic liquid crystalline polyester amide resin and method for preparing wholly aromatic liquid crystalline polyester amide resin compound
WO2010129316A3 (en) Cosmetic compositions comprising cyanodiphenylacrylates and film forming polymers
WO2015026581A3 (en) Retroreflective sheeting including a low-elastic modulus layer
WO2012027573A3 (en) Biodegradable shape memory polymer
WO2011157656A3 (en) Water-absorbing polymer particles with improved colour stability

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11714035

Country of ref document: EP

Kind code of ref document: A2