WO2011124078A1 - 非接触通信装置 - Google Patents

非接触通信装置 Download PDF

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Publication number
WO2011124078A1
WO2011124078A1 PCT/CN2010/079766 CN2010079766W WO2011124078A1 WO 2011124078 A1 WO2011124078 A1 WO 2011124078A1 CN 2010079766 W CN2010079766 W CN 2010079766W WO 2011124078 A1 WO2011124078 A1 WO 2011124078A1
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WO
WIPO (PCT)
Prior art keywords
chip
contact
security
security chip
power
Prior art date
Application number
PCT/CN2010/079766
Other languages
English (en)
French (fr)
Inventor
李蔚
刘以非
石亦欣
罗挺松
Original Assignee
上海复旦微电子集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海复旦微电子集团股份有限公司 filed Critical 上海复旦微电子集团股份有限公司
Priority to EP10849314.9A priority Critical patent/EP2525553A4/en
Priority to US13/639,306 priority patent/US9367713B2/en
Publication of WO2011124078A1 publication Critical patent/WO2011124078A1/zh

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/01Details
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10237Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the reader and the record carrier being capable of selectively switching between reader and record carrier appearance, e.g. in near field communication [NFC] devices where the NFC device may function as an RFID reader or as an RFID tag
    • H04B5/24
    • H04B5/72
    • H04B5/79
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/66Substation equipment, e.g. for use by subscribers with means for preventing unauthorised or fraudulent calling
    • H04M1/667Preventing unauthorised calls from a telephone set
    • H04M1/67Preventing unauthorised calls from a telephone set by electronic means
    • H04M1/675Preventing unauthorised calls from a telephone set by electronic means the user being required to insert a coded card, e.g. a smart card carrying an integrated circuit chip
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M2250/00Details of telephonic subscriber devices
    • H04M2250/04Details of telephonic subscriber devices including near field communication means, e.g. RFID

Definitions

  • Non-contact communication device The present application claims priority to Chinese Patent Application No. 201010149421.2, entitled “Non-contact Communication Device”, filed on Apr. 6, 2010, the entire contents of in.
  • the present invention relates to the field of mobile communication technologies, and more particularly to a contactless communication device. Background technique
  • RFID radio frequency identification
  • NFC Near Field Communication
  • Near field communication technology supports three modes of operation, corresponding to three application modes, namely point-to-point communication function, reader function and card simulation function. Next, explain the three application modes separately.
  • This function can achieve close range between two mobile phone terminals (the short distance of near field communication is usually within 10 cm, for mobile phone terminals, it will be shortened to less than 5 cm due to the influence of antenna area and metal shielding), low speed Data exchange (usually 212 kilobits or 424 kiloseconds), typical applications include electronic business card exchange, calendar synchronization and wireless networking pairing (Bluetooth or wireless broadband Wi-Fi technology).
  • this feature is an auxiliary feature that is not required for the end user and can be developed by the handset terminal manufacturer.
  • This feature allows the mobile terminal to recognize and read external high-frequency electronic tags.
  • a typical application is to identify a smart poster embedded with a high-frequency electronic tag. By extracting the data information in the high-frequency electronic tag, the mobile terminal can obtain a network link and initiate network access.
  • This reader function combines the mobile phone terminal with the electronic tag application. On this basis, it can realize the application of electronic tag logistics management, anti-counterfeiting and traceability of products, or can be combined with future IoT applications. Therefore, The development potential of the function is huge. However, reader-based applications may need to wait for near field communication. After the terminal is popularized, it will be further developed. At this stage, it is still in the early stage of the promotion of near-field communication terminals, and such applications do not play a leading role.
  • This function simulates a mobile phone terminal as a contactless smart card for electronic payment (usually in the form of electronic payment for small on-site such as supermarkets and restaurants), public transportation (in the form of electronic payment for specific industries), electronic access control, and electronic ticketing. (Special application of access control) and other functions.
  • the analog smart card has great convenience: for individual users, it can provide the functions of local inquiry and remote recharge which are not available in the traditional smart card; and for the system user, it can provide new services such as mobile payment. business.
  • the card simulation function should be the dominant application mode, and after the popularization of the near-field communication terminal, other application modes such as the reader function may be further developed. Therefore, in the current research and development of near field communication technology, related applications based on card simulation functions have become a hot topic of research and promotion.
  • the near field communication technology applied to the card simulation function it is essentially a contactless smart card, but the carrier of the smart card has changed, from the previous smart card to the mobile terminal.
  • the implementation of near-field communication uses a two-chip architecture, that is, a non-contact front-end chip.
  • the non-contact front-end chip is used to process the contactless RF interface and communication protocol
  • the security chip is used to handle smart card application and data management.
  • various near-field communication solutions have appeared at home and abroad.
  • NXP provides a typical implementation of a near field communication terminal, which is one of the earliest implementations of near field communication terminals.
  • the near field communication terminal includes a security chip 101, a non-contact front end chip 103, an antenna 105, a host computer chip 107, and user knowledge.
  • SIM Subscriber Identity Module
  • the security chip 101 processes the data storage and security management tasks of the smart card application, and the non-contact front end chip 103 processes the conversion of the S2C signal and the external non-contact signal, and exchanges application data and instructions with the upper computer chip 107. .
  • the security chip 101 and the non-contact front end chip 103 can also adopt a contact IC card interface.
  • this interface is mainly used in the reader mode of near field communication, at this time, the security chip
  • the security chip 101 is a secure access module (Secure Access Module) for readers.
  • the security chip 101 uses a security chip SmartMX manufactured by NXP
  • the non-contact front end chip 103 uses a non-contact front end chip PN511 manufactured by NXP
  • the upper computer chip 107 is a baseband chip.
  • SWP Single Wire Protocol
  • the non-contact communication device implementation includes an SWP SIM card 201, a contactless front end chip 203, an antenna 205, and a host computer chip 207, wherein the SWP SIM card 201 stores both a normal mobile phone SIM card and a second mobile phone SIM card. The information also stores the data information in the security chip. Pin C6 and pin C1 of the SWP SIM card 201 are redefined and connected to the non-contact front end chip 203.
  • the pin C1 is a power supply pin, and the standard power supply (VDD) is originally provided by the upper computer chip 207, and In this solution, the standard power source is supplied to the SWP SIM card 201 through the non-contact front end chip 203; the main reason for performing such processing is that the non-contact front end chip 203 can still be externally in the mode in which the mobile phone is not charged.
  • the non-contact field of the reader ie, the electromagnetic field generated by the external reader
  • Pin C6 as a data pin of the data input/output (SWIO) based on the single-wire protocol technology, exchanges data with the non-contact front-end chip 203.
  • the near-field communication implementation based on the SWP SIM card makes good use of the related technology of the SIM card, and the technical implementation is less difficult.
  • the SWP SIM card in the above implementation mainly corresponds to the near field communication application provided by the telecommunication operator. Due to the different management requirements of different industries, it is difficult to implement multiple near field communication applications across operators and industries.
  • the SWP SIM card needs to upgrade the existing SIM card specification, and the SWP SIM card is required to conform to a "Global Platform Card", that is, a SWP SIM can be stored.
  • a SWP SIM can be stored.
  • This one-card multi-purpose can achieve a variety of non-contact applications, but the feasibility is relatively poor due to many restrictions related to policy and actual operations.
  • dual interface cards such as dual interface SIM card and Secure Digital Memory Card (SD).
  • the dual interface SIM card expands the common SIM card pin from 6 pins to 8 pins, and the additional pins are used to connect the contactless antenna.
  • the additional pins of this 8-pin SIM card conflict with the high-speed pins defined by the ETSI TS 102 600 standard developed by the European Telecommunication Standardization Organization.
  • the dual interface memory card integrates the contactless card in the memory card and expands the two non-contact antenna pins, similar to the dual interface SIM card technology.
  • the dual interface card technology is the most simple method for implementing the contactless smart card function on the mobile terminal, but only one non-contact antenna can be designed on the mobile terminal, the dual interface SIM card, the dual interface memory card and the non-contact front end chip to the antenna Design requirements are different, making it difficult for handset manufacturers to choose which solution to support.
  • the most important point influencing the dual interface card approach is the consistent control of non-contact RF performance. Since the non-contact function of the mobile terminal needs to integrate the chip of the card with the antenna as a whole, in the dual interface solution, the card and the mobile terminal integrated with the non-contact antenna are two independent products, which are respectively manufactured by different suppliers. The non-contact function can only be achieved by the end user installing the two together. In the case of many-to-many matching by the supplier, the consistency of the non-contact RF performance cannot be guaranteed.
  • the mobile terminal in the existing near field communication technology usually adopts a "multiple use technology” or a dual interface card technology.
  • multi-use technology it is difficult to achieve integration of various applications due to different management modes and regulations and policies applicable to different industries; and for dual interface card technology, the non-contact RF performance consistency of the terminal is difficult to control. Therefore, it is necessary to provide a new non-contact communication device to solve the above problems.
  • the problem solved by the present invention is to provide a non-contact communication device, which solves the data security and user management problems caused by a multi-purpose security chip in a contactless application.
  • the present invention provides a contactless communication device, including: a contactless front end chip, a security chip hub, and a security chip set, wherein
  • the security chipset includes more than two security chips for storing and processing non-contact application data;
  • the non-contact front-end chip is configured to implement interaction between the security chip and an external non-contact field;
  • the security chip hub is connected to the non-contact front-end chip and the security chip in the security chipset, and is used for selecting a security chip based on the non-contact application. , the connection between the selected security chip and the non-contact front end chip is realized.
  • the present invention further provides a security chip hub, which is loaded in a contactless communication device, where the security chip hub includes a plurality of contactless application interfaces for connecting the security chip to implement a security chipset. Contacting the connection of the front end chip, wherein the security chip set includes one or more security chips.
  • the present invention has the following advantages:
  • the plurality of security chips can be integrated in the contactless communication terminal or separated from the contactless communication terminal, that is, the contactless communication terminal and the security chip are respectively provided by the mobile phone manufacturer and the operator, and the card is separated.
  • Application mode mobile phone manufacturers can independently complete the development and manufacture of universal contactless communication terminals in a non-customized way, and clarify the division of responsibilities of the industry chain;
  • the present invention also employs a security chip based on a memory card structure having pins compatible with single-wire protocol technology, which enables the contactless communication terminal in a shutdown state to still pass from the non-contact field through the non-contact front-end chip.
  • Inductive power which greatly expands the application of non-contact applications.
  • FIG. 1 is a schematic diagram of an implementation of a prior art contactless communication device
  • FIG. 2 is a schematic diagram of an implementation of a non-contact communication device based on a single-wire protocol technology in the prior art
  • FIG. 3 is a schematic diagram of a first embodiment of the contactless communication device of the present invention
  • Figure 4 is a schematic illustration of a second embodiment of the contactless communication device of the present invention.
  • FIG. 5 is a schematic diagram of a pin of an embodiment of a memory card structure security chip used in the present invention
  • FIG. 6 is a block diagram of a non-contact front end chip of the present invention
  • Figure 7a is a schematic diagram of an embodiment of a power supply unit of the contactless communication device of the present invention
  • Figure 7b is a schematic diagram of another embodiment of a power supply unit of the contactless communication device of the present invention
  • Figure 8 is a signal processing circuit of the contactless communication device of the present invention
  • contactless communication terminals in existing near field communication technologies typically employ a "multiple use” or dual interface card technology.
  • a "multiple use” or dual interface card technology For the one-"multi-use technology, it is difficult to implement multi-application implementation and management across operators; and for dual interface card technology, the non-contact RF performance consistency of the contactless communication terminal is difficult to control.
  • the inventors of the present invention have proposed a novel non-contact front-end chip structure, by providing a security chip hub for switching security chip connections, so that a contactless communication terminal can be To load and simultaneously support a plurality of security chips, the contactless communication terminal and the security chip together constitute a contactless communication device.
  • the security chip hub integrates multiple security chips and then connects with the non-contact front-end chip.
  • Each security chip can exchange data with the non-contact front-end chip for non-contact applications and corresponds to different non-contact applications.
  • This multi-card multi-application mode allows different operators to independently issue security chips, avoiding data security, user management and multiple issue issues caused by multi-card multi-use.
  • the security chip in the contactless communication device of the present invention can be integrated in the contactless communication terminal or can be separated from the contactless communication terminal, that is, the contactless communication terminal and the security chip are respectively provided by the handset manufacturer and the operator.
  • the terminal manufacturer can independently complete the development and manufacture of the universal contactless communication terminal in a non-customized manner, and clarify the division of responsibilities of the industry chain.
  • security chips For consumers, they can flexibly select security chips according to their needs to meet different needs.
  • the inventors also provide a security chip based on a memory card structure having interfaces compatible with contactless application technologies, such as single-wire protocol technology, IS07816 protocol technology, or other smart card application interfaces.
  • contactless application technologies such as single-wire protocol technology, IS07816 protocol technology, or other smart card application interfaces.
  • the contactless communication terminal in the off state can still inductively charge from the non-contact field through the non-contact front-end chip and supply power to the security chip, which greatly expands the application. Increased ease of use.
  • the contactless communication terminal of the present invention there are two or more non-contact application interfaces, and two or more security chips can be connected to realize the function of multi-card multi-purpose. Moreover, the contactless application interface that does not connect to the security chip does not affect the use of the security chip connected to other interfaces.
  • the contactless communication terminal may be a mobile phone terminal, or may be other forms of electronic products, such as a portable electronic player. For convenience The following description is made by taking the non-contact communication terminal as a mobile phone terminal as an example, and FIG. 3 is not a schematic diagram of the first embodiment of the contactless communication device of the present invention.
  • the first embodiment of the contactless communication device of the present invention includes: a first security chip 301, a second security chip 302, a contactless front end chip 303, a security chip hub 304, an antenna 305, a power management unit 306, and Host computer chip 307. among them,
  • the first security chip 301 stores data recognized by the user of the same mobile communication as the ordinary mobile phone SIM card, and stores and processes the first contactless application data.
  • the second security chip 302 is configured to store and process the second contactless application data.
  • the first security chip 301 and the second security chip 302 together form a security chipset.
  • the power management unit 306 can be selected to be integrated in the upper computer chip 307, or can be implemented as a separate chip; since the power management unit 306 is integrated in the upper computer chip 307, the solution has high integration. And lower cost, therefore, preferably, the power management unit 306 is integrated in the upper computer chip 307.
  • the contactless communication terminal is a mobile phone terminal. Therefore, the upper core chip 307 can be a baseband chip for data management of mobile communication.
  • the non-contact front-end chip 303 senses power from an external non-contact field and forms a contactless power source, acquires external contactless application data through a contactless field, and provides the contactless power supply and external contactless application data to the security chip hub. 304.
  • the non-contact field refers to an electromagnetic field provided by an external reader/writer of a non-contact application for data transmission.
  • the security chip hub 304 selects the first security chip 301 or the second security chip 302 respectively according to the non-contact application, and provides the selected security chip with the working power source and the external non-contact application data for the contactless application, and
  • the non-contact front-end chip 303 is provided with internal contactless application data stored in the secure chipset.
  • the secure chip hub 304 can be integrated into the contactless front end chip 303 to increase integration, increase reliability, and reduce cost.
  • the contactless communication terminal may determine different contactless applications by user selection, and the user's selection is formed by the upper computer chip 307 and provided to the security chip hub 304; or, the contactless communication terminal is based on The information of the external contactless application determines the different contactless applications.
  • the non-contact front end chip 303 can still induce power from the external non-contact field and provide the first security chip 301 or the second security chip 302 through the secure chip hub 304 for non-contact. Contact the application's working power supply.
  • the non-contact application interface of the security chip hub 304 and the first security chip 301 and the second security chip 302 may adopt an interface supporting the single-wire protocol technology or an interface of the IS07816 technology protocol.
  • the selection of the security chip and its interface is limited, and the contactless application interface supporting the single-wire protocol technology has fewer pins, which is convenient to implement.
  • the non-contact application interface of the security chip hub 304 and the first security chip 301 and the second security chip 302 adopts an interface supporting the single-wire protocol technology, and the following also adopts a contactless application interface supporting the single-wire protocol technology.
  • An example is given, but the scope should not be limited.
  • the security chip hub 304 integrates the power pins PWR1 and PWR2 of the first security chip 301 and the second security chip 302 with the data pins SWI01 and SWI02, and then connects to the non-contact front end chip 303.
  • the power pin PWR1 and the data pin SWI01 constitute a The contactless application interface of the first security chip 301 and a contactless application interface corresponding to the secure chip hub 304.
  • the specific non-contact application is selected first.
  • the second non-contact application corresponding to the second security chip 302 is selected, and the security chip hub 304 is associated with the second security chip 302.
  • the connected power channel and data channel are selected, and the data channel corresponding to the first security chip 302 is turned off, but the power channel is not turned off, that is, the path of the power management unit 306 to the first security chip 301 is kept unchanged.
  • the non-contact communication terminal is brought close to the external non-contact field, and the non-contact front-end chip 303 in the non-contact communication terminal inducts the electric quantity from the external non-contact field and forms a non-contact power source, and acquires the external non-contact application data through the non-contact field. And providing the contactless power supply and external contactless application data to the security chip hub 304. If the contactless communication terminal is in a normal working state, the security chip hub 304 selects the standard power source as the second power chip 302 for the working power of the contactless application, and if the contactless communication terminal is in the off state, the security chip hub 304 selects the non-contact. The power supply acts as its operating power source.
  • the security chip hub 304 exchanges the second non-contact application data acquired from the second security chip 302 with the external non-contact application data acquired from the non-contact front-end chip 303, thereby completing the corresponding non-contact application.
  • the non-contact communication device can also perform conventional data processing based on the contactless application data in the security chip to implement other applications, such as implementing a remote application in combination with a mobile communication function, and utilizing a data processing function of the contactless communication terminal. Implement local query functions, etc.
  • a mobile phone terminal is employed as a contactless communication terminal. Since the secure chipset stores non-contact application data, that is, smart card application data. Therefore, when the user wishes to perform a certain remote security chip data application, the corresponding security chip in the security chipset is first selected. Since the remote communication can use the mobile communication function of the mobile terminal, the mobile terminal is in a normal working state, and the selected security chip uses the standard power supply as its operating power. After that, the selected security chip directly exchanges data with the host computer chip through the general data interface, for example, the IS07816 interface, and completes reading or writing of data in the security chip, thereby realizing the remote application function. In a specific application, the mobile communication function can implement communication with a remote server based on an over-the-air (OTA) technology of the SIM card.
  • OTA over-the-air
  • the remote application function may also be implemented based on a wireless network of the mobile phone terminal. Specifically, after selecting a security chip through the security chip hub 304, the selected security chip passes through the non-contact interface and the non-contact front-end chip. After the 303 is connected, the non-contact front-end chip 303 and the upper-level computer chip 307 exchange data through the host computer interface SWI, and realize communication with the remote server through the connection of the mobile terminal wireless network, thereby completing the remote application function.
  • the mobile phone terminal includes a display unit.
  • the upper computer chip 307 selects the corresponding non-contact stored in the security chipset. Security chip for application data. Thereafter, the upper computer chip 307 reads the data stored in the selected security chip through the universal data interface, and processes the data, and finally presents the data to the user by the display unit.
  • the local query function can also realize the reading of the contactless application data through the contactless interface, that is, the security chip selected by the security chip hub 304 is connected to the non-contact front-end chip 303 through the non-contact interface, and then The non-contact front-end chip 303 and the upper-level machine chip 307 exchange data through the host computer interface SWI, thereby realizing the reading of the non-contact application data.
  • the non-contact communication terminal combined with the non-contact application and other functions can implement various application functions, greatly expanding the use situation of the non-contact application data, and greatly facilitating the user.
  • the security chip can be integrated in the contactless communication terminal or can be separated from the contactless communication terminal, that is, the contactless communication terminal and the security chip are respectively provided by the terminal manufacturer and the operator.
  • the contactless communication terminal and the security chip can be separately provided, and have better flexibility. Therefore, it is preferable to adopt an application mode in which the security chip is separated from the contactless communication terminal.
  • the contactless application interface of the security chip and the contactless communication terminal can support the single wire protocol technology or the IS07816 protocol.
  • an SWP SIM card integrated with a security chip may be used, or a card sticker mode may be adopted, that is, two cards are simultaneously placed in the same deck, one is a normal SIM card, and the other is a normal SIM card.
  • the SWP chip card stores non-contact application data, and uses a pin corresponding to the C6 pin of the SIM card as its data pin and a pin corresponding to the C1 pin as its power pin.
  • the data of the plurality of contactless applications and the data of the mobile communication can be simultaneously stored in one SWP SIM card according to a "multiple use" technical specification.
  • this one-card multi-purpose contactless application is mainly for applications with relatively low security management and business management requirements.
  • applications with strict security requirements and complex management requirements, such as bank cards the use of the one-card multi-purpose SWP SIM card management is inconvenient and the security is relatively poor.
  • the detachable card deck includes, in addition to the SIM card holder, a card holder for loading a memory card, and the memory card is mainly used for data storage. Therefore, with the contactless communication device of the present invention, the memory card holder can also be expanded into an independent contactless application interface to implement other contactless applications other than mobile communication.
  • FIG. 4 is a schematic illustration of a second embodiment of the contactless communication device of the present invention. As shown in FIG. 4, the second embodiment of the contactless communication device of the present invention includes:
  • the first security chip 401 stores data recognized by the user of the same mobile communication as the ordinary mobile phone SIM card, and the first contactless application data.
  • the second security chip 402 is configured to store second contactless application data.
  • the third security chip 406 is configured to store third contactless application data.
  • the first security chip 406 is configured to store third contactless application data.
  • the second security chip 402 and the third security chip 406 together form a security chipset.
  • the upper computer chip 407 is integrated with a power management unit, and the power management unit forms a standard power supply and provides it to the secure chip hub 304.
  • the upper computer chip 407 can be a baseband chip for data management of mobile communication.
  • the non-contact front-end chip 403 senses electric quantity from an external non-contact field and forms a non-contact power source, acquires external non-contact application data through a non-contact field, and connects the non-contact power source and the external non-contact source
  • the data is provided to the secure chip hub 404.
  • the non-contact field refers to an electromagnetic field provided by an external reader/writer of a non-contact application for data transmission.
  • the security chip hub 404 selects the first security chip 401, the second security chip 402 or the third security chip 406 respectively according to the non-contact application, and provides the selected security chip with the working power supply and the external for the contactless application.
  • the application data is contactless and the non-contact front-end chip 403 is provided with internal contactless application data stored in the secure chipset.
  • the security chip hub 404 concentrates the power pins PWR1, PWR2, and PWR3 of the first security chip 401, the second security chip 402, and the third security chip 406, and the data pins SWI01, SWI02, and SWI03. It is then connected to the non-contact front end chip 403.
  • the power pin PWR2 and the data pin SWI02 correspond to the contactless application interface of the first security chip 401.
  • the first security chip 401, the second security chip 402, and the third security chip 406 all adopt a contactless application interface, and are connected to a corresponding interface of the security chip hub 404.
  • the first security chip 401 and the second security chip 402 adopt the structure of the SWP SIM card in the first embodiment of the present invention, and details are not described herein.
  • the third security chip 406 can be pin extended based on prior art SD memory cards or other types of memory card structures to support single wire protocol technology.
  • FIG. 5 is a schematic diagram of a pin of an embodiment of a memory card structure security chip used in the present invention.
  • an embodiment of the memory card structure security chip of the present invention is based on a Micro SD card structure, and in addition to the general-purpose pins on one side of the micro SD card, two extensions are also extended on both sides of the universal pin.
  • the pins are defined as a first pin SWIO and a second pin VDD, respectively.
  • the first pin SWIO is connected to a pin of the non-contact front end chip for non-contact application data transmission, and is used for The non-contact front-end chip performs data exchange
  • the second pin VDD is connected to a power supply pin corresponding to the non-contact front-end chip, and is used to obtain the working power of the security chip.
  • the extended first pin SWIO and the second pin VDD do not affect the use of the ordinary memory function, and when the non-contact front-end chip acquires energy and non-contact in the external non-contact field After contacting the application signal, the memory card structure security chip can perform signal processing and data exchange according to different signals.
  • the expansion interface of an embodiment of the foregoing memory card structure security chip implements a near field communication function based on a single line protocol technology.
  • the advantage of the single line protocol technology is that the near field communication application can be completed without the contactless communication terminal being powered off; At the same time, the non-contact application interface of the security chip is unified into a non-contact application interface of the single-wire protocol technology, which undoubtedly greatly reduces the difficulty in product development of the security chip supplier.
  • the expansion interface of the memory card structure security chip may also be adopted according to a specific embodiment.
  • the S2C interface needs to occupy 2 pins, can not define the power pin like the SWP interface, and can not support the non-contact application of the non-contact communication terminal without power. Therefore, its use has certain limitations.
  • a memory card such as a normal SD memory card, a Micro SDHC memory card, or a Memery Stick Micro memory card can be used, and the scope thereof should not be limited.
  • the contactless communication device of the present invention employs a plurality of security chips to implement a plurality of non-contact application functions.
  • the plurality of security chips only one security chip is connected to the non-contact front-end chip at the same time. Therefore, the selection of the security chip needs to be cut by the power supply in the security chip hub.
  • the change unit determines that after the strobe, the security chip hub selects the data pin of the strobe security chip to complete the data exchange.
  • FIG. 6 is a block diagram of the non-contact front end chip of the present invention.
  • the non-contact front-end chip integrates a security chip hub.
  • the security chip hub can be selected as a separate module or not integrated in the non-contact front-end chip, and the scope thereof should not be limited.
  • the non-contact front-end chip includes a radio frequency circuit 601, a card module 602, a reader/writer module 603, a digital function module 606, a contactless power supply 310, a microcontroller (MCU) 607, and a first cache 604.
  • the modules and interfaces have the same connection and functions as the corresponding modules of the prior art non-contact front-end chip, and are not described herein again. .
  • the non-contact front-end chip further integrates a security chip hub 614.
  • the security chip hub 614 includes a power switching unit 611 and a signal management unit 612.
  • the power switching unit 611 is respectively connected to the power management unit 616 of the upper computer chip 615.
  • the signal management unit 612 is connected to the non-contact front-end chip and the security chipset, respectively,
  • the power switching unit 611 is respectively connected to the non-contact front-end chip and the security chip set for managing the power of the security chipset, based on the working state of the contactless application, the contactless communication device, or based on the non-contact application, to the security chipset
  • the security chip in the middle provides power
  • the signal management unit 612 connects the non-contact front-end chip and the security chip set respectively, selects the security chip based on the non-contact application, and implements data interaction between the non-contact front-end chip and the selected security chip.
  • the above embodiment will be further described below by way of a more specific power switching unit 611 and signal management unit 612 and an example of the operation thereof.
  • the embodiment of the power switching unit 611 is described by taking a security chipset including three security chips as an example, and the application range thereof should not be limited.
  • the power switching unit 611 uses an electronic switch to selectively switch the operating power of the security chip.
  • Figure 7a is a schematic illustration of an embodiment of a power supply unit of a contactless communication device of the present invention.
  • the power supply unit includes: a main power supply unit 701, a voltage stabilization unit 703, and a power supply switching unit 704.
  • the main power supply unit 701 and the voltage stabilization unit 703 are modules for forming a non-contact power supply in the non-contact front end chip.
  • the power switching unit 709 can be integrated with the two units in the same module, where
  • the main power supply unit 701 acquires the energy of the non-contact field or the terminal battery, forms an initial non-contact power source, and supplies it to the voltage stabilizing unit 703.
  • the voltage stabilizing unit 703 performs voltage stabilization processing on the initial contactless power supply to form a contactless power supply and provides the first power switching subunit 705, the second power switching subunit 707, and the third power switching subunit 709, respectively.
  • the power switching unit 704 includes three power switching subunits, that is, a first power switching subunit 705, a second power switching subunit 707, and a third power switching subunit 709.
  • the power switching subunits are all connected to a security chip. Connected; the three-way power switching sub-unit source is different depending on the non-contact application.
  • the first power switching subunit 705 and the second power switching subunit 707 each include an input end of three routing electronic switch control, respectively, and an external host chip integrated with a power management unit, a voltage stabilizing unit 703, and a common voltage terminal.
  • the third power switching subunit includes an input terminal controlled by two routing electronic switches, respectively connected to the voltage stabilizing unit 703 and the common voltage end; the output end of the three power switching unit is connected to the security chip, respectively Provide working power to the corresponding security chip.
  • the working principle of the power unit is:
  • the power supply unit supplies power to the security chip in different ways:
  • the security chip is a SWP SIM card
  • the power supply unit can use the standard power supply provided by the power management unit as the working power of the security chip, or The non-contact power supply provided by the non-contact field serves as the working power source of the security chip; and when the security chip is the memory card structure security chip, the power supply unit only uses the non-contact power supply provided by the non-contact field as the working power source of the security chip.
  • the voltages of the standard power supply and the non-contact power supply provided by the power management unit are not necessarily the same, in order to avoid the instability caused by driving the safety chip with different voltages, especially to avoid the residual charge to the safety chip when the power supply is switched.
  • the effect is that the residual charge needs to be vented through a specific circuit. Therefore, it is necessary to provide a common voltage terminal to the safety chip as its bleeder circuit.
  • the corresponding power switching unit needs to include three inputs, which are a standard power source, a contactless power source, and a common voltage terminal, that is, the first power source switch shown in FIG. 7a.
  • the first power switching subunit 705 connected thereto includes three electronic switches connected in parallel, respectively: connected to a standard power supply provided by the power management unit.
  • a contactless communication terminal For a contactless communication terminal, its working state can be divided into three situations, including a normal working mode, a low power mode (such as a sleep state), and a shutdown mode. Therefore, according to the working state of the contactless communication terminal, the following The operating states of a power switching subunit 705 are separately described (the second power switching subunit 707 is the same as its operating state):
  • the first switch S1 When the request of the non-contact application is not received, the first switch S1 is turned on, the second switch S2 is disconnected from the third switch S3, and the first security chip receives the standard power supply provided by the power management unit as its working power source;
  • the non-contact communication device After the non-contact communication device receives the request of the non-contact application, the non-contact communication device determines the power supply condition of the first security chip, and determines that the first security chip is in a normal working state. At this time, the first switch S1, the first The second switch S2 and the third switch S3 remain in the same state; after the non-contact application processing is completed, the non-contact front-end chip provides a processing result of the non-contact application to the first power switching sub-unit 705, the first switcher The unit 705 still maintains the states of the first switch S1, the second switch S2, and the third switch S3.
  • the low power mode refers to an operating state in which a contactless communication terminal stops supplying power to a majority of modules in its internal circuit in order to reduce power consumption, such as a sleep state.
  • a contactless communication terminal stops supplying power to a majority of modules in its internal circuit in order to reduce power consumption, such as a sleep state.
  • the second switch S2 and the third switch S3 are in an off state, and the first switch S1 is in an on state, but due to The power management unit does not provide a standard power supply, and therefore, the contactless communication device does not supply power to the first security chip.
  • the non-contact front-end chip After receiving the request of the non-contact application, the non-contact front-end chip determines the power supply condition of the first security chip, and after determining that the first security chip is in a low-power state, the non-contact front-end chip first turns off the first switch S1. Then, the second switch S2 is turned on to supply power to the first security chip. At this time, the non-contact front end chip still obtains the electric quantity from the battery and forms a non-contact power supply, and the first safety chip receives the non-contact power supply from the voltage stabilizing unit 703 through the second switch S2 that is turned on as the operating power source. At the same time, the first security chip completes the data interaction with the non-contact front-end chip. After the non-contact application is completed, the second switch S2 is turned off, and the first switch S1 is turned on, but since the non-contact communication device is still in the low power consumption mode, the contactless communication device does not supply power to the first security chip. .
  • the voltage of the non-contact power source may not completely match the voltage of the standard power source.
  • the residual charge needs to be discharged. Therefore, preferably, when the non-contact communication device is switched from the low power consumption mode to the normal operation mode, before the first switch S1 is restored to be turned on, the third switch S3 should be controlled to be turned on briefly, and the third transistor is turned on.
  • the switch S3 causes the residual charge of the first security chip to be discharged through the common voltage terminal, which allows the first security chip to always be in a good power-on and power-off state, avoiding unstable conditions.
  • the non-contact communication device in the off state has no working power, and all the circuits are not charged. Therefore, the first switch S1, the second switch S2, and the third switch S3 are all inactive. .
  • the non-contact front-end chip After receiving the request of the contactless application, the non-contact front-end chip is awakened by the alternating electromagnetic field, after which the non-contact front-end chip detects the battery's power: if the battery still has power, the non-contact front-end chip is obtained from the battery The power is converted to a contactless power supply to the first security chip; and if the battery is dead (or the battery is not installed), the non-contact front-end chip senses energy from the non-contact field and converts it to a contactless power supply Provided to the first security chip. Therefore, the second switch S2 connected to the voltage stabilizing unit is turned on, and the other switches are turned off.
  • the non-contact front-end chip no longer supplies the non-contact power supply, so that all the circuits are not charged, and all the switches are inactive.
  • the first switch S1, the second switch S2, and the third switch S3 may adopt a PMOS transistor structure, wherein a gate of the PMOS transistor serves as a control terminal for controlling an on or off state, and a drain
  • the first security chip and the voltage stabilization unit are respectively connected to the source.
  • the third security chip connected thereto is a security chip of a memory card structure, and the third security chip of the memory card structure includes an expansion pin (the first pin SWIO in FIG. 5 and The second pin VDD). Therefore, the power of the third security chip does not need to be multiplexed with the standard memory card interface power supply. Accordingly, the third power switching subunit 709 does not need to include an electronic switch connected to the standard memory card interface power supply, and only includes The voltage regulator unit 703 is connected to the fourth switch S4 and the fifth switch S5 connected to the common voltage terminal. In addition, the third power switching subunit 709 does not multiplex the power pins in the standard memory card interface in a manner similar to the first power switching subunit 705.
  • the standard memory card interface contains a bidirectional data pin, and if the third security chip receives the contactless power supply as its operating power, it simultaneously When the chip is not powered, the working power of the third security chip leaks to the upper chip through the electric static discharge (ESD) circuit of the bidirectional data pin, and the third security chip cannot work normally.
  • ESD electric static discharge
  • the fourth switch S4 and the fifth switch S5 in the third power switching sub-unit 709 are simultaneously disconnected, and the third security chip does not work;
  • the fourth switch S4 is turned on, and receives the non-contact power supply provided by the voltage stabilization unit 703 as the working power of the third security chip, while the fifth switch S5 remains disconnected;
  • the fourth switch S4 is turned off, and at the same time, the fifth switch S5 is briefly turned on to discharge the residual charge on the third security chip, and then the fifth switch S5 is also restored to the off state.
  • the third power switching subunit 709 may also include only the fourth switch S4 that connects the voltage stabilizing unit 703 and the security chip, and does not include a switch that connects the common voltage terminal and the security chip.
  • the working process is as follows:
  • the fourth switch S4 remains disconnected when the non-contact application request provided by the non-contact front-end chip is not received; after receiving the request of the non-contact application provided by the non-contact front-end chip, the fourth switch S4 is turned on; After the non-contact application operation is completed, the fourth switch S4 is turned off;
  • the non-contact front-end chip After receiving the request of the contactless application, the non-contact front-end chip is woken up by the non-contact field, after which the non-contact front-end chip detects the battery power: if the battery has power, the non-contact front-end chip obtains the power from the battery And converting it to a contactless power supply, after which the fourth switch S4 is turned on, the non-contact front end chip supplies the non-contact power to the third security chip; and if the battery is not powered (or the battery is not installed), The contact front-end chip directly induces energy from the non-contact field, and converts the non-contact field-induced energy into a non-contact power source; and then turns on the fourth switch S4 to supply the non-contact power to the third security chip.
  • the non-contact front-end chip no longer supplies the non-contact power supply, and therefore, all the circuits are not charged, and the fourth switch S4 returns to the inoperative state.
  • FIG. 7b is a schematic illustration of another embodiment of a power supply unit of the contactless communication device of the present invention.
  • the power supply unit includes a main power supply unit 711, a voltage stabilization unit 713, and a power supply switching unit 714. Compared with the power supply unit shown in FIG.
  • the structure and function of the main power supply unit 711 and the voltage stabilizing unit 713 are the same as those of the main power supply unit 701 and the voltage stabilizing unit 703 in FIG. 7a, and will not be described again; only the power switching unit 714 has Different.
  • the power switching unit 714 includes three power switching subunits, that is, a first power switching subunit 715, a second power switching subunit 717, and a third power switching subunit 719.
  • the three-way power switching sub-units adopt the same circuit structure as the first power switching sub-unit 705 in FIG. 7a, that is, each power-switching sub-unit includes an input terminal of three routing electronic switch controls, which are respectively integrated with the external connection.
  • the upper computer chip of the power management unit, the voltage stabilizing unit 713 and the common voltage terminal are connected, and each power switching subunit supplies working power to a connected security chip through its output end.
  • each power switching subunit in the power switching unit 714 can be connected to the security chip of the SWP SIM card structure or to the security chip of the memory card structure.
  • the power switching subunit connected to the SWP SIM card security chip operates in the same manner as the first power switching subunit 705 in Fig. 7a.
  • the working mode is also the same as that of the first power switching subunit 705 in FIG. 7a, that is, the power switching subunit having three input terminals can integrate the external power management.
  • the upper computer chip, the voltage stabilizing unit 713 or the common voltage end of the unit is connected with the memory card structure security chip; this enables the memory card structure security chip to obtain the working power when the non-contact application is not performed, and improves the safety of the non-contact communication device. Chip compatibility.
  • the interface of the signal management unit is completely compatible with the signals of the prior art non-contact application, such as the signal of the single-wire protocol technology (SWP signal).
  • SWP signal its definition and description can refer to ETSI TS 102 613 3 ⁇ 43 ⁇ 4, which is not described here, only describes the signals required to realize bidirectional communication between the contactless front-end chip and the security chip.
  • the single-wire protocol technology defines two kinds of signals, respectively: the first signal SIG1 is a signal sent by the non-contact front-end chip to the security chip, and the RZ-encoded voltage is used to represent the logic signal. 1 and logic signal 0; and second signal SIG2 is the signal sent by the security chip to the non-contact front-end chip, which uses current load modulation to represent logic 1 and 0. Therefore, when the non-contact front end signal receives the data signal supplied from the security chip, it is necessary to demodulate the current load modulated second signal SIG2 provided by the security chip.
  • Figure 8 is a schematic illustration of a signal processing circuit of the contactless communication device of the present invention.
  • the signal processing circuit includes a digital function module and a signal management unit, wherein the digital function module is the digital function module 606 in FIG. 6 (for convenience of explanation, the figure is not shown)
  • the second buffer includes a timer, a state control unit, a register, a TFIFO, an RFIFO, a frame coding unit, a coded CRC (Cyclic Redundancy Check) calculation unit, a frame decoding unit, a decoding CRC calculation unit, and a bit coding unit.
  • the digital function module can maintain the same connection mode and function as the prior art, and the only change is that The state control unit needs to form different control signals according to different non-contact applications, and the control signals are used to select corresponding security chips.
  • the signal management unit includes a voltage output unit 801 and a voltage input unit 803, wherein
  • the voltage output unit 801 includes three parallel voltage output sub-units, and each of the voltage output sub-units corresponds to a one-way security chip, and the data output by the SWP digital module (ie, the aforementioned RZ-encoded first signal SIG1) is provided to Security chip
  • the voltage input unit 803 includes a selection unit 805 and a current detecting unit 807.
  • the selection unit 805 receives a current signal output by the multi-channel security chip (ie, the aforementioned second signal SIG2 using current load modulation), and is provided according to the state control unit.
  • the control signal selects a current signal, and supplies the selected current signal to the current detecting unit 807; the current detecting unit converts the current signal into a voltage signal and supplies the signal to the digital function module.
  • the non-contact communication device of the invention solves the problem of cross-industry cooperation in the construction of the near field communication application environment, and different operators can independently issue security chips separated from the contactless communication terminals, thereby avoiding data security and users brought by multi-card multi-use. Management and other issues.
  • the contactless communication device of the present invention enables a contactless communication terminal to load a plurality of security chips; the security chip can support a single-wire protocol technology, which enables the contactless communication terminal in the shutdown state to still complete the contactless application, which It greatly expands the application of non-contact applications.

Abstract

一种非接触通信装置,包括非接触前端芯片、安全芯片集线器及安全芯片组,其中:所述安全芯片组包含有两个以上的安全芯片,用于存储和处理非接触应用数据;所述非接触前端芯片用于实现所述安全芯片与外部非接触场的交互;所述安全芯片集线器与非接触前端芯片和安全芯片组中的安全芯片相连,用于基于非接触应用选择安全芯片,实现被选择的安全芯片与非接触前端芯片的连通。本发明的非接触通信装置基于多卡多用的应用模式,不同运营商可以独立发行与非接触通信终端相分离的安全芯片,避免了因一卡多用带来的数据安全、用户管理等问题。

Description

非接触通信装置 本申请要求于 2010 年 4 月 6 日提交中国专利局、 申请号为 201010149421.2 , 发明名称为 "非接触通信装置"的中国专利申请的优先权, 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及移动通信技术领域, 更具体地, 本发明涉及一种非接触通信装 置。 背景技术
近年来, 随着射频识别 (RFID )技术的迅速发展, 电子支付已深入日常生 活的方方面面。 电子支付通常采用诸如信用卡、 公交卡等智能卡的形式, 实现 支付功能。 电子支付给人们的日常生活带来了极大的便利,特别是在固定营业 场所, 所述基于智能卡的电子支付业务已经形成了成熟的技术与稳定的市场。 随着电子支付应用的进一步发展, 将智能卡应用与移动通讯设备结合的需 求开始显现: 人们希望智能卡可以具有显示功能, 以便随时查询卡片中存储的 数据信息; 同时, 人们还希望智能卡具有通讯功能, 可以与智能卡系统的后台 服务器进行即时通讯, 实现例如电子钱包的远程充值等功能。 换言之, 人们希 望能够将智能卡集成到手机中, 利用手机强大的通信及数据处理能力, 完成诸 如电子支付、 电子标签识别等业务。
2004年, 一种将非接触智能卡、 非接触智能卡读写器与手机终端结合在一 起的近场通讯( Near Field Communication , NFC )技术引起了市场的广泛关注。 对于近场通讯技术, 电信运营商、银行组织以及终端设备供应商都投入了极大 的热情, 并深入开展了相关的开发工作。 经过几年的技术开发及标准化工作, 场通讯技术的产品仍然未能够进入市场。
由于近场通讯采用的技术均是相对成熟且经过市场验证的技术, 符合近场 通讯技术相关标准及规范的芯片产品也已相继发布, 因此, 就近场通讯技术而 言, 其推广应用并不存在明显的技术障碍。 事实上, 采用近场通讯技术的移动 终端产品迟迟未有突破性进展的根源还是其业务模式的定位问题。
近场通讯技术支持三种工作模式, 分别对应于三种应用模式, 即点对点通 信功能、 读写器功能以及卡片模拟功能。 接下来, 分别对这三种应用模式进行 说明。
首先分析点对点通信功能。 该功能可以在两个手机终端之间实现近距离 (近场通讯的近距离通常是指 10厘米以内, 对于手机终端, 受天线面积与金 属屏蔽的影响, 会缩短到 5厘米以内) 、 低速率 (通常是 212千位秒或 424 千位秒)的数据交换, 其典型应用包括电子名片交换、 日程表同步和无线组网 配对(蓝牙或无线宽带 Wi-Fi技术)。 目前而言, 该功能是辅助性功能, 对最 终用户而言并非必需功能, 可以由手机终端制造商主导开发。
继续分析读写器功能。 该功能可以让手机终端识别和读取外部的高频电子 标签。其典型应用是识别嵌入有高频电子标签的智能海报,通过提取高频电子 标签中的数据信息, 手机终端可以获取网络链接并启动网络访问。这种读写器 功能将手机终端与电子标签应用相结合,在此基础上, 可以实现电子标签物流 管理、产品的防伪溯源等应用,或者还可以与将来的物联网应用相结合, 因此, 该功能的发展潜力巨大。但是,基于读写器功能的应用可能需要等待近场通讯 终端普及之后, 才会得到进一步的发展。 而现阶段仍处于近场通讯终端推广的 早期, 此种应用并不起主导作用。
最后分析卡片模拟功能。 该功能将手机终端模拟成一张非接触智能卡, 用 以实现电子支付(通常是指超市、餐饮等小额现场的电子支付形式)、公交(属 于特定行业的电子支付形式)、 电子门禁、 电子票务(门禁的特殊应用)等功 能。 借助于手机终端, 这种模拟的智能卡有着极大的便利性: 对于个人用户, 可以提供传统智能卡不具备的本机查询、远程充值等处理功能; 而对于系统用 户, 可以提供移动支付等新型服务业务。
可以看出, 在近场通讯终端发展的早期阶段, 卡片模拟功能应该是主导的 应用模式, 而在近场通讯终端普及之后,诸如读写器功能的其他应用模式才有 可能得到进一步的发展。 因此, 在目前近场通讯技术的研发过程中, 基于卡片 模拟功能的相关应用已成为了研究与推广的热点。
对于应用于卡片模拟功能的近场通讯技术, 其本质上仍是一个非接触智能 卡, 只是智能卡的载体发生了变化, 由先前的智能卡变为了手机终端。 从结构 化的角度出发, 近场通讯的实现方案采用双芯片架构, 即非接触前端芯片
( ContactLess Front, CLF ) 与安全芯片 ( Security Element, SE ) 。 其中, 非 接触前端芯片用于处理非接触射频接口与通信协议,安全芯片用于处理智能卡 应用与数据管理。 围绕着卡片模拟功能的实现, 国内外出现了多种近场通讯的 解决方案。
恩智浦 (NXP )公司提供了一种典型的近场通讯终端的实现方案, 该方案 也是近场通讯终端最早的实现方案之一。如图 1所示, 所述近场通讯终端包括 安全芯片 101、 非接触前端芯片 103、 天线 105、 上位机芯片 107以及用户识 另1 J ( Subscriber Identity Module, SIM )卡 109; 所述安全芯片 101通过 S2C ( Sigln-SigOut-Connection )接口 ( ECMA-373NFC接口 )与非接触前端芯片
103进行连接并实现数据的双向传输。 其中, 所述安全芯片 101处理智能卡应 用的数据存储与安全管理任务, 所述非接触前端芯片 103处理 S2C信号与外 部非接触信号的转换工作, 并与上位机芯片 107进行应用数据及指令的交换。 所述安全芯片 101与非接触前端芯片 103还可以采用接触式 IC卡接口
( IS07816 ) , 这种接口主要应用于近场通讯的读写器模式, 此时, 安全芯片
101为读写器的安全模组卡(Secure Access Module )。 在实际应用中, 所述安 全芯片 101采用恩智浦公司制造的安全芯片 SmartMX, 所述非接触前端芯片 103采用恩智浦公司制造的非接触前端芯片 PN511 , 所述上位机芯片 107为基 带芯片。
近场通讯终端实现的支付、 公交、 门禁、 防伪等一系列新兴应用给电信运 营商带来了无限商机,是未来手机和智能卡产业的重要发展趋势。相关组织还 提供了一种单线协议技术( Single Wire Protocol, SWP ) 的近场通讯实现方案。 这种实现方案将 SIM卡与安全芯片合二为一, 利用重新定义的 SIM卡的引脚 与非接触前端芯片进行通信, 以实现近场通讯功能。
图 2是现有技术基于单线协议技术的非接触通信装置实现方案的示意图。 如图 2所示, 所述非接触通信装置实现方案包括 SWP SIM卡 201、 非接触前 端芯片 203、 天线 205以及上位机芯片 207, 其中, 所述 SWP SIM卡 201既存 储有普通手机 SIM卡的信息,还存储有安全芯片中的数据信息。所述 SWP SIM 卡 201的引脚 C6与引脚 C1被重新定义并与非接触前端芯片 203进行连接。 所述引脚 C1为电源引脚, 原先由上位机芯片 207提供标准电源(VDD ) , 而 在该方案中, 所述标准电源通过非接触前端芯片 203之后再提供给 SWP SIM 卡 201 ; 进行这种处理的主要原因是为了在手机不带电的模式下, 非接触前端 芯片 203仍可以从外部读写器的非接触场(即外部读写器产生的电磁场)中感 应电荷并向 SWP SIM卡 201提供工作电源。 而引脚 C6则作为基于单线协议 技术的数据输入输出 (SWIO ) 的数据引脚, 与非接触前端芯片 203进行数据 交换。
这种基于 SWP SIM卡的近场通讯实现方案很好的利用了 SIM卡的相关技 术, 技术实现难度较低。 然而, 上述实现方案中的 SWP SIM卡主要对应于电 信运营商提供的近场通讯应用, 受限于不同行业管理要求的不同,很难实现跨 运营商、 跨行业的多种近场通讯应用。
针对所述近场通讯多种应用的需求, SWP SIM卡需要对现有 SIM卡规格 进行升级, 要求 SWP SIM卡符合一"" ^多用技术规范( Global Platform Card ) , 即一张 SWP SIM可以存储多种具体应用所需的数据信息, 以应对不同的应用 需求。这种一卡多用可以实现多种非接触应用的功能,但由于涉及到政策及实 际运营的诸多限制, 可行性相对较差。
与上述基于 SWP SIM卡的近场通讯方案相对应的, 市场上还出现了基于 双界面卡的移动支付解决方案, 如双界面 SIM卡和双界面存储卡(Secure Digital Memory Card, SD ) 。 所述双界面 SIM卡将普通的 SIM卡引脚由 6针 扩充为 8针, 附加的引脚用于连接非接触天线。 但这种 8针 SIM卡的附加引 脚与欧洲电信标准化组织制定的 ETSI TS 102 600标准定义的高速引脚相沖 突。所述双界面存储卡是将非接触卡集成在存储卡中, 并扩充两个非接触天线 引脚, 与双界面 SIM卡技术类似。 双界面卡技术是在手机终端上实现非接触智能卡功能的最筒单方法, 但是 在手机终端上只能设计一个非接触天线, 双界面 SIM卡、 双界面存储卡和非 接触前端芯片对天线的设计要求又不相同,使得手机制造商选择支持哪种方案 时困难重重。对双界面卡方案影响最重要的一点是非接触射频性能的一致性控 制。由于手机终端的非接触功能需要将卡片的芯片与天线合成一个整体才能实 现, 而双界面方案中, 卡片和集成非接触天线的手机终端是两个独立的产品, 分别由不同的供应商生产制造,只有在最终用户将两者安装在一起才能实现非 接触功能,在供应商多对多匹配的情况下, 非接触射频性能的一致性是无法保 证的。
综上所述, 现有近场通讯技术中的手机终端通常采用一"" ^多用技术或双界 面卡技术。 对于所述一"" ^多用技术, 受限于不同行业应用的不同管理模式、 法 规政策, 难以实现各种应用的整合; 而对于双界面卡技术, 终端的非接触射频 性能一致性难以控制, 因此, 有必要提供一种新的非接触通信装置, 以解决上 述问题。
发明内容
本发明解决的问题是提供了一种非接触通信装置, 解决了一卡多用的安全 芯片在进行非接触应用时引起的数据安全及用户管理问题。
为解决上述问题, 本发明提供了一种非接触通信装置, 包括: 非接触前端 芯片、 安全芯片集线器及安全芯片组, 其中,
所述安全芯片组包含有两个以上的安全芯片, 用于存储和处理非接触应用 数据; 所述非接触前端芯片用于实现所述安全芯片与外部非接触场的交互; 所述安全芯片集线器与非接触前端芯片和安全芯片组中的安全芯片相连, 用于基于非接触应用选择安全芯片,实现被选择的安全芯片与非接触前端芯片 的连通。
可选的,本发明还提供了一种安全芯片集线器,装载于非接触通信装置中, 所述安全芯片集线器包含有多个用于连接安全芯片的非接触应用接口,以实现 安全芯片组与非接触前端芯片的连接, 其中, 所述安全芯片组包含有一个或多 个安全芯片。
与现有技术相比, 本发明具有以下优点:
1.通过设置用于切换安全芯片连接的安全芯片集线器, 使得一个非接触通 信终端可以装载并同时支持多个安全芯片,而且所述多个安全芯片对应于不同 的非接触应用;
2. 所述多个安全芯片既可以集成在非接触通信终端中,也可以与非接触通 信终端分离, 即非接触通信终端与安全芯片分别由手机制造商和运营商提供, 对于机卡分离的应用模式,手机制造商能够以非定制方式独立完成通用的非接 触通信终端的开发和制造, 明确了产业链的职责分工;
3. 本发明还采用了基于存储卡结构的安全芯片,所述安全芯片具有兼容单 线协议技术的引脚,这使得处于关机状态的非接触通信终端仍可以通过非接触 前端芯片从非接触场中感应电量, 这大大扩展了非接触应用的应用场合。
附图说明 在此要求保护和 /或描述的发明创造将进一步结合示范性实施例进行阐述。 这些示范性实施例将参照附图具体阐述。 这些实施例将不构成对本发明的限 制, 其中在多个附图中有相近的标号代表相似的结构, 其中:
图 1是现有技术的非接触通信装置一种实现方案的示意图;
图 2是现有技术基于单线协议技术的非接触通信装置实现方案的示意图; 图 3是本发明的非接触通信装置第一实施例的示意图;
图 4是本发明的非接触通信装置第二实施例的示意图;
图 5是本发明采用的存储卡结构安全芯片一个实施例的引脚示意图; 图 6是本发明的非接触前端芯片的模块示意图;
图 7a是本发明非接触通信装置的电源单元一实施方式的示意图; 图 7b是本发明非接触通信装置的电源单元另一实施方式的示意图; 图 8是本发明非接触通信装置的信号处理电路的示意图。
具体实施方式
在下面的描述中阐述了很多具体细节以便于充分理解本发明, 但是本发明 还可以采用其他不同于在此描述的其它方式来实施,因此本发明不受下面公开 的具体实施例的限制。
正如背景技术部分所述, 现有近场通讯技术中的非接触通信终端通常采用 一"" ^多用技术或双界面卡技术。对于所述一"" ^多用技术,难以实现跨运营商的 多应用实施及管理; 而对于双界面卡技术, 非接触通信终端的非接触射频性能 一致性难以控制。
针对上述问题, 本发明的发明人提出了一种新型非接触前端芯片结构, 通 过设置用于切换安全芯片连接的安全芯片集线器,使得一个非接触通信终端可 以装载并同时支持多个安全芯片,所述非接触通信终端与安全芯片共同构成了 非接触通信装置。所述安全芯片集线器将多路的安全芯片集中后再与非接触前 端芯片连接,每路安全芯片均可以与非接触前端芯片进行非接触应用的数据交 换, 并对应于不同的非接触应用。这种多卡多用的应用模式使得不同的运营商 可以独立发行安全芯片,避免因一卡多用带来的数据安全、用户管理及多次发 行的问题。
本发明的非接触通信装置中的安全芯片既可以集成在非接触通信终端中, 也可以与非接触通信终端分离,即非接触通信终端与安全芯片分别由手机制造 商和运营商提供。对于机卡分离的应用模式, 终端制造商能够以非定制方式独 立完成通用的非接触通信终端的开发和制造, 明确了产业链的职责分工。 而对 于消费者而言, 可以根据各自需要灵活的选取安全芯片, 以满足不同的需求。
此外, 发明人还提供了一种基于存储卡结构的安全芯片, 所述安全芯片具 有兼容非接触应用技术的接口, 例如单线协议技术、 IS07816协议技术或其他 智能卡应用的接口。 特别的, 对于支持单线协议技术的安全芯片, 处于关机状 态的非接触通信终端仍可以通过非接触前端芯片从非接触场中感应电荷,并向 所述安全芯片供电, 这大大扩展了应用场合, 提高了使用便利。
为使本发明的上述目的、 特征和优点能够更加明显易懂, 下面结合附图对 本发明的具体实施方式做详细的说明。 需要说明的是,对于本发明的非接触通 信终端,其包含有两个以上的非接触应用接口,可以连接两个以上的安全芯片, 以实现多卡多用的功能。 并且, 不连接安全芯片的非接触应用接口也并不影响 其他接口连接的安全芯片的使用。在实际应用中, 所述非接触通信终端可以为 手机终端, 也可以是其他形式的电子产品, 例如便携电子播放器等。 为了便于 说明, 下面均以所述非接触通信终端为手机终端为例进行说明, 不应限制其范 图 3是本发明的非接触通信装置第一实施例的示意图。 如图 3所示, 本发 明的非接触通信装置第一实施例包括: 第一安全芯片 301、第二安全芯片 302、 非接触前端芯片 303、 安全芯片集线器 304、 天线 305、 电源管理单元 306以 及上位机芯片 307。 其中,
所述第一安全芯片 301存储有与普通手机 SIM卡相同的移动通信的用户识 别的数据, 并存储与处理第一非接触应用数据。
所述第二安全芯片 302用于存储并处理第二非接触应用数据。 所述第一安 全芯片 301与第二安全芯片 302共同构成了安全芯片组。 依据具体实施例的不同, 所述电源管理单元 306可以选择集成在上位机芯片 307中, 也可以作为独立的芯片实现; 由于电源管理单元 306集成在上位机芯 片 307的方案具有较高的集成度和较低的成本, 因此, 优选的, 所述电源管理 单元 306集成在上位机芯片 307中。
在具体实施例中, 所述非接触通信终端为手机终端, 因此, 所述上位机芯 片 307可以为基带芯片, 用于移动通信的数据管理。
所述非接触前端芯片 303从外部非接触场中感应电量并形成非接触电源, 通过非接触场获取外部非接触应用数据,并将所述非接触电源及外部非接触应 用数据提供给安全芯片集线器 304。 所述非接触场是指由非接触应用的外部读 写器提供的用于数据传输的电磁场。 所述安全芯片集线器 304基于非接触应用的不同, 分别选择第一安全芯片 301或第二安全芯片 302 , 向被选择的安全芯片提供用于非接触应用的工作电 源及外部非接触应用数据,并向非接触前端芯片 303提供安全芯片组中存储的 内部非接触应用数据。依据具体实施例的不同, 所述安全芯片集线器 304可以 集成在非接触前端芯片 303中, 以提高集成度, 提高可靠性并降低成本。
在具体实施例中, 非接触通信终端可以通过使用者选择确定不同的非接触 应用,所述使用者的选择通过上位机芯片 307形成指令并提供给安全芯片集线 器 304; 或者, 非接触通信终端基于外部非接触应用的信息自行确定不同的非 接触应用。 此外, 在非接触通信终端不带电的状态下, 非接触前端芯片 303 仍可以从外部非接触场中感应电量并通过安全芯片集线器 304向第一安全芯 片 301或第二安全芯片 302提供用于非接触应用的工作电源。
依据具体实施例的不同, 所述安全芯片集线器 304与第一安全芯片 301及 第二安全芯片 302的非接触应用接口可以采用支持单线协议技术的接口或 IS07816技术协议的接口。但由于在一个非接触通信终端上使用了多个安全芯 片, 安全芯片及其接口的选择余地较为有限, 而支持单线协议技术的非接触应 用接口具有较少的引脚, 其实现较为方便, 因此, 优选的, 所述安全芯片集线 器 304与第一安全芯片 301及第二安全芯片 302的非接触应用接口均采用支持 单线协议技术的接口,下文中也均以支持单线协议技术的非接触应用接口为例 进行说明, 但不应限制其范围。
仍如图 3所示, 所述安全芯片集线器 304将第一安全芯片 301与第二安全 芯片 302的电源引脚 PWR1、 PWR2与数据引脚 SWI01、 SWI02集中后再与 非接触前端芯片 303连接, 所述电源引脚 PWR1与数据引脚 SWI01即构成了 第一安全芯片 301的非接触应用接口,以及与安全芯片集线器 304对应的一个 非接触应用接口。
下面对所述非接触通信装置进行非接触应用的一种工作过程进行说明。 非接触通信终端使用者希望进行非接触应用时, 先选择具体的非接触应 用, 例如第二安全芯片 302对应的第二非接触应用被选择, 则安全芯片集线器 304中与第二安全芯片 302相连接的电源通道及数据通道被选定, 而第一安全 芯片 302对应的数据通道被关闭,但电源通道并不关闭, 即保持电源管理单元 306至第一安全芯片 301的通路不变。
之后, 将非接触通信终端接近外部非接触场, 所述非接触通信终端中的非 接触前端芯片 303从外部非接触场中感应电量并形成非接触电源,通过非接触 场获取外部非接触应用数据,并将所述非接触电源及外部非接触应用数据提供 给安全芯片集线器 304。 如果非接触通信终端处于正常工作状态, 则安全芯片 集线器 304选择标准电源作为第二安全芯片 302用于非接触应用的工作电源, 如果非接触通信终端处于关机状态,则安全芯片集线器 304选择非接触电源作 为其工作电源。
接着, 安全芯片集线器 304对从第二安全芯片 302中获取的第二非接触应 用数据与从非接触前端芯片 303获取的外部非接触应用数据进行交换,从而完 成相应的非接触应用。
由于在同一时刻安全芯片集线器 304仅选择一个安全芯片与非接触前端芯 片 303进行数据交换, 因此, 不同的非接触应用之间并不会发生沖突。 在实际应用过程中, 所述非接触通信装置还可以基于安全芯片中的非接触 应用数据进行常规数据处理, 实现其他应用, 例如结合移动通信功能实现远程 应用, 利用非接触通信终端的数据处理功能实现本地查询功能等。
下面以远程应用和本地查询为例, 筒要说明其他应用的工作过程。
远程应用功能:
在这种应用场合下, 采用手机终端作为非接触通信终端。 由于安全芯片组 中存储有非接触应用数据, 即智能卡应用数据。 因此, 当使用者希望进行某一 远程的安全芯片数据应用时, 首先选定安全芯片组中对应的安全芯片。 由于远 程通信可以使用手机终端的移动通信功能, 因此, 所述手机终端处于正常工作 状态, 被选择的安全芯片使用标准电源作为其工作电源。 之后, 被选择的安全 芯片直接通过通用数据接口, 例如 IS07816接口与上位机芯片进行数据交换, 完成安全芯片中数据的读出或写入, 从而实现远程应用功能。 在具体应用中, 所述移动通信功能可以基于 SIM卡的空中下载技术( Over The Air, OTA ) 实 现与远程服务器的通讯。
此外,所述远程应用功能还可以基于手机终端的无线网络实现,具体而言: 通过安全芯片集线器 304选定某一安全芯片后,被选定的安全芯片即通过非接 触接口与非接触前端芯片 303连接,之后, 所述非接触前端芯片 303与上位机 芯片 307通过上位机接口 SWI进行数据交换, 并通过手机终端无线网络的连 接实现与远程服务器的通讯, 从而完成远程应用功能。
本地查询功能:
仍以手机终端为例, 所述手机终端包含有显示单元。 当使用者希望进行非 接触应用数据的查询时,上位机芯片 307选定安全芯片组中存储有相应非接触 应用数据的安全芯片。之后, 所述上位机芯片 307通过通用数据接口读取所述 被选定安全芯片中存储的数据, 并对该数据进行处理, 最终由显示单元提示给 使用者。
与远程应用功能相类似, 所述本地查询功能也可以通过非接触接口实现非 接触应用数据的读取,即安全芯片集线器 304选定的安全芯片通过非接触接口 与非接触前端芯片 303连接, 之后, 所述非接触前端芯片 303与上位机芯片 307通过上位机接口 SWI进行数据交换, 从而实现非接触应用数据的读取。
可以看出, 所述结合有非接触应用及其他功能的非接触通信终端可以实现 多种应用功能,大大扩展了非接触应用数据的使用场合,极大的方便了使用者。
依据具体实施例的不同, 所述安全芯片既可以集成在非接触通信终端中, 也可以与非接触通信终端分离,即非接触通信终端与安全芯片分别由终端制造 商和运营商提供。对于机卡分离的应用模式, 非接触通信终端与安全芯片可以 分别提供, 具有较好的灵活性, 因此, 优选的, 采用安全芯片与非接触通信终 端分离的应用模式。所述安全芯片与非接触通信终端的非接触应用接口可以支 持单线协议技术或 IS07816协议。
对于所述支持单线协议技术的安全芯片,可以采用集成有安全芯片的 SWP SIM卡, 也可以采用卡贴模式, 即在同一个卡座里同时放置两张卡片, 一张为 普通 SIM卡, 另一张为超薄的 SWP贴片卡。 所述 SWP贴片卡存储有非接触 应用数据, 其利用卡座上与 SIM卡的 C6引脚对应的引脚作为其数据引脚, 以 及 C1引脚对应的引脚作为其电源引脚。
进一步的, 对于所述 SWP SIM卡, 仍可以遵循一"" ^多用的技术规范, 在 一张 SWP SIM卡中同时存储多种非接触应用的数据, 以及移动通信的数据。 但这种一卡多用中的非接触应用主要是针对安全管理和商务管理要求相对较 低的应用。 对于安全要求严格、 管理要求复杂的应用, 如银行卡, 采用所述一 卡多用的 SWP SIM卡管理较为不便, 安全性也相对较差。
在非接触通信终端中, 可分离卡片卡座除了 SIM卡座外, 还包括用于装载 存储卡的卡座, 所述存储卡主要用于数据存储。 因此, 对于本发明的非接触通 信装置, 所述存储卡卡座也可以扩展为一个独立的非接触应用接口, 实现除移 动通信外的其他非接触应用。
图 4是本发明的非接触通信装置第二实施例的示意图。 如图 4所示, 本发 明的非接触通信装置第二实施例包括:
第一安全芯片 401、 第二安全芯片 402、 第三安全芯片 406、 非接触前端芯 片 403、 天线 405、 安全芯片集线器 404以及上位机芯片 407。 其中,
所述第一安全芯片 401存储有与普通手机 SIM卡相同的移动通信的用户识 别的数据, 以及第一非接触应用数据。
所述第二安全芯片 402用于存储第二非接触应用数据。
所述第三安全芯片 406用于存储第三非接触应用数据。 所述第一安全芯片
401、 第二安全芯片 402以及第三安全芯片 406共同构成了安全芯片组。
所述上位机芯片 407集成有电源管理单元, 所述电源管理单元形成标准电 源并提供给安全芯片集线器 304。 在具体实施例中, 所述上位机芯片 407可以 为基带芯片, 用于移动通信的数据管理。
所述非接触前端芯片 403从外部非接触场中感应电量并形成非接触电源, 通过非接触场获取外部非接触应用数据,并将所述非接触电源及外部非接触应 用数据提供给安全芯片集线器 404。 所述非接触场是指由非接触应用的外部读 写器提供的用于数据传输的电磁场。
所述安全芯片集线器 404基于非接触应用的不同, 分别选择第一安全芯片 401、 第二安全芯片 402或第三安全芯片 406, 向被选择的安全芯片提供用于 非接触应用的工作电源及外部非接触应用数据,并向非接触前端芯片 403提供 安全芯片组中存储的内部非接触应用数据。
仍如图 4所示, 所述安全芯片集线器 404将第一安全芯片 401、 第二安全 芯片 402及第三安全芯片 406的电源引脚 PWR1、 PWR2、 PWR3与数据引脚 SWI01、 SWI02、 SWI03集中后再与非接触前端芯片 403连接。 所述电源引 脚 PWR2与数据引脚 SWI02即对应于第一安全芯片 401的非接触应用接口。
在具体实施例中, 所述第一安全芯片 401、 第二安全芯片 402以及第三安 全芯片 406均采用了非接触应用接口,与安全芯片集线器 404的对应接口实现 连接。其中, 所述第一安全芯片 401与第二安全芯片 402采用了与本发明第一 实施例中 SWP SIM卡的结构, 在此不再赘述。
而所述第三安全芯片 406可以基于现有技术的 SD存储卡或其他类型的存 储卡结构进行引脚扩展, 以支持单线协议技术。
图 5是本发明采用的存储卡结构安全芯片一个实施例的引脚示意图。
如图 5所示,本发明的存储卡结构安全芯片的一个实施例基于 Micro SD卡 结构, 除了 Micro SD卡一侧边缘的通用引脚外, 还在所述通用引脚两侧扩展 了两个引脚, 分别定义为第一引脚 SWIO与第二引脚 VDD。 其中, 所述第一 引脚 SWIO与非接触前端芯片的用于非接触应用数据传输的引脚相连,用于与 非接触前端芯片进行数据交换, 而所述第二引脚 VDD与非接触前端芯片对应 的电源引脚相连, 用于获取安全芯片的工作电源。
在所述存储卡结构安全芯片工作过程中, 扩展的第一引脚 SWIO与第二引 脚 VDD并不影响普通存储功能的使用, 而当非接触前端芯片获取外部非接触 场中的能量及非接触应用信号后,所述存储卡结构安全芯片即可根据信号的不 同进行信号处理及数据交换。
上述存储卡结构安全芯片的一个实施例的扩展接口基于单线协议技术实 现近场通讯功能,这种单线协议技术的优点在于可以在非接触通信终端不带电 的情况下仍可以完成近场通讯应用; 同时,将所述安全芯片的非接触应用的接 口均统一为单线协议技术的非接触应用接口,这无疑大大降低了安全芯片供应 商的产品开发难度。
依据具体实施例的不同, 所述存储卡结构安全芯片的扩展接口还可以采用
S2C接口, 但所述 S2C接口需要占用 2个引脚, 无法像 SWP接口定义出电源 引脚, 不能支持非接触通信终端不带电状况下的非接触应用, 因此, 其使用有 一定的局限性。
对于所述存储卡结构的安全芯片,除了可以采用 Micro SD卡结构外,还可 以采用普通 SD存储卡、 Micro SDHC存储卡、 Memery Stick Micro存储卡等存 储卡, 不应限制其范围。
正如前文所述, 本发明的非接触通信装置采用多个安全芯片实现多种非接 触应用功能。对于所述多个安全芯片, 同一时刻仅有一个安全芯片与非接触前 端芯片相连, 因此,所述安全芯片的选择需要通过安全芯片集线器中的电源切 换单元确定, 在选通后, 安全芯片集线器再选择被选通安全芯片的数据引脚, 完成数据的交换。
图 6是本发明的非接触前端芯片的模块示意图。 所述非接触前端芯片集成 了安全芯片集线器, 在具体应用中, 所述安全芯片集线器作为独立的模块, 也 可以选择不集成在非接触前端芯片中, 不应限制其范围。
如图 6所述, 所述非接触前端芯片包含有射频电路 601、 卡片模块 602、 读写器模块 603、数字功能模块 606、 非接触电源 310、微控制器( MCU ) 607、 第一緩存 604、 第二緩存 608、 测试模块 605、 上位机接口 609、 IS07816接口 及其他接口 613 , 这些模块及接口与现有技术非接触前端芯片的对应模块具有 相同的连接方式及功能, 在此不再赘述。
此外, 所述非接触前端芯片还集成了安全芯片集线器 614, 所述安全芯片 集线器 614包括电源切换单元 611与信号管理单元 612,所述电源切换单元 611 分别连接上位机芯片 615中电源管理单元 616提供的标准电源、安全芯片组与 非接触前端芯片的非接触电源 610; 所述信号管理单元 612分别连接非接触前 端芯片与安全芯片组, 其中,
所述电源切换单元 611 , 分别连接非接触前端芯片与安全芯片组, 用于管 理安全芯片组的电源, 基于非接触应用、 非接触通信装置的工作状态, 或者基 于非接触应用, 向安全芯片组中的安全芯片提供电源;
所述信号管理单元 612, 分别连接非接触前端芯片与安全芯片组, 基于非 接触应用选择安全芯片,并实现非接触前端芯片与被选择安全芯片之间的数据 交互。 下面通过一个更加具体的电源切换单元 611及信号管理单元 612及其工作 过程的举例, 对于上述实施例作进一步的说明。 其中, 所述电源切换单元 611 的实施例以包含三个安全芯片的安全芯片组为例进行说明,不应限制其应用范 围。
首先说明电源切换单元 611的具体实施方式, 所述电源切换单元 611采用 电子开关对安全芯片的工作电源进行选择切换。
图 7a是本发明非接触通信装置的电源单元一实施方式的示意图。
如图 7a所示, 所述电源单元包括: 主电源单元 701、 稳压单元 703及电源 切换单元 704, 所述主电源单元 701与稳压单元 703是非接触前端芯片中形成 非接触电源的模块,所述电源切换单元 709可以与这两个单元集成于同一模块 中, 其中,
所述主电源单元 701获取非接触场或终端电池的能量, 形成初始非接触电 源并提供给稳压单元 703。
所述稳压单元 703对初始非接触电源进行稳压处理, 形成非接触电源并分 别提供给第一电源切换子单元 705、 第二电源切换子单元 707及第三电源切换 子单元 709。
所述电源切换单元 704包括三路电源切换子单元, 即第一电源切换子单元 705、 第二电源切换子单元 707、 第三电源切换子单元 709, 所述电源切换子单 元均与一个安全芯片相连;依据非接触应用的不同, 所述三路电源切换子单元 源。 所述第一电源切换子单元 705、 第二电源切换子单元 707均包含有三路由 电子开关控制的输入端, 分别与外接的集成有电源管理单元的上位机芯片、稳 压单元 703以及公共电压端相连,而所述第三电源切换子单元包含有两路由电 子开关控制的输入端, 分别与稳压单元 703及公共电压端相连; 所述三路电源 切换单元的输出端与安全芯片相连, 分别向对应的安全芯片提供工作电源。
所述电源单元的工作原理为:
对于不同结构的安全芯片, 电源单元向安全芯片供电的方式有所不同: 所 述安全芯片为 SWP SIM卡时, 电源单元可以将电源管理单元提供的标准电源 作为安全芯片的工作电源,也可以将非接触场提供的非接触电源作为安全芯片 的工作电源; 而所述安全芯片为存储卡结构安全芯片时, 电源单元仅基于非接 触场提供的非接触电源作为安全芯片的工作电源。
此外, 由于电源管理单元提供的标准电源与非接触电源的电压并不一定完 全相同, 为了避免不同电压驱动安全芯片所产生的不稳定情况,特别是避免工 作电源切换时残余电荷对安全芯片的不良影响,需要将所述残余电荷通过特定 的回路泄放掉, 因此, 需要向安全芯片提供公共电压端作为其泄放回路。
由上述说明可知, 对于采用 SWP SIM卡结构的安全芯片, 与其对应的电 源切换单元需包含三路输入, 分别为标准电源、 非接触电源以及公共电压端, 即图 7a所示的第一电源切换子单元 705与第二电源切换子单元 707; 而对于 采用存储卡结构的安全芯片, 由于不需要标准电源驱动, 与其对应的电源切换 单元只需包含两路输入, 分别为非接触电源与公共电压端。
下面对电源切换子单元的工作过程进行说明。 由于第二电源切换子单元 707的电路结构及工作状态与第一电源切换子单 元 705相同,因此下面仅以第一电源切换子单元 705的工作过程为例进行说明, 但不应限制其范围。
仍如图 7a所示, 对于采用 SWP SIM卡结构的第一安全芯片, 与其相连的 第一电源切换子单元 705包括 3个并联连接的电子开关, 分别是: 与电源管理 单元提供的标准电源相连的第一开关 S1 , 与稳压单元 703提供的非接触电源 相连的第二开关 S2, 以及与公共电压端相连的第三开关 S3。
对于非接触通信终端而言, 其工作状态可以分为三种情况, 包括正常工作 模式、 低功耗模式(例如休眠状态)以及关机模式, 因此下面依据非接触通信 终端工作状态的不同, 对第一电源切换子单元 705的工作状态分别进行说明 (第二电源切换子单元 707与其工作状态相同) :
正常工作模式
在未接收到非接触应用的请求时, 第一开关 S1导通、 第二开关 S2与第三 开关 S3断开, 第一安全芯片接收电源管理单元提供的标准电源作为其工作电 源;
当非接触通信装置接收到非接触应用的请求后, 非接触通信装置对第一安 全芯片的供电情况进行判断,确定所述第一安全芯片处于正常工作状态,此时, 第一开关 Sl、 第二开关 S2以及第三开关 S3保持状态不变; 在非接触应用处 理完成后,非接触前端芯片提供非接触应用完成的处理结果给所述第一电源切 换子单元 705, 所述第一切换子单元 705仍保持第一开关 Sl、 第二开关 S2及 第三开关 S3的状态不变。
低功耗模式 所述低功耗模式是指非接触通信终端为了降低功耗而停止向其内部电路 中的多数模块供电的工作状态, 例如休眠状态。对于处于低功耗模式的非接触 通信装置, 在未接收到非接触应用的请求时, 所述第二开关 S2、 第三开关 S3 处于断开状态, 第一开关 S1处于导通状态, 但由于电源管理单元不提供标准 电源, 因此, 非接触通信装置并不向第一安全芯片供电。
在接收到非接触应用的请求后, 非接触前端芯片对第一安全芯片的供电情 况进行判断,确定所述第一安全芯片处于低功耗状态之后, 非接触前端芯片先 关断第一开关 S1 , 再打开第二开关 S2对第一安全芯片供电。 此时, 非接触前 端芯片仍从电池中获取电量并形成非接触电源,第一安全芯片即通过导通的第 二开关 S2从稳压单元 703接收所述非接触电源并作为其工作电源。 同时, 第 一安全芯片完成与非接触前端芯片的数据交互。 当所述非接触应用完成后, 第 二开关 S2断开,第一开关 S1导通,但由于非接触通信装置仍处于低功耗模式, 因此, 非接触通信装置并不向第一安全芯片供电。
在具体应用中, 所述非接触电源的电压与标准电源的电压可能不完全匹 配, 为了防止电源切换过程中残余电荷对安全芯片工作状态的影响, 需要将所 述残余电荷泄放掉。 因此, 优选的, 所述非接触通信装置由低功耗模式向正常 工作模式转换时,在第一开关 S1恢复导通之前,应控制第三开关 S3短暂导通, 所述导通的第三开关 S3使得第一安全芯片的残余电荷通过公共电压端泄放 掉, 这使得第一安全芯片可以始终处于良好的上电和下电状态,避免不稳定情 况出现。
关积 4莫式 在未接收到非接触应用的请求时, 处于关机状态的非接触通信装置没有工 作电源, 所有电路均不带电, 因此, 第一开关 Sl、 第二开关 S2以及第三开关 S3均处于不工作状态。
在接收到非接触应用的请求后,非接触前端芯片被交变电磁场唤醒,之后, 所述非接触前端芯片检测电池的电量: 如果电池仍有电, 则非接触前端芯片从 所述电池中获取电量, 并将其转换为非接触电源提供给第一安全芯片; 而如果 电池无电(或未安装电池), 则非接触前端芯片从非接触场中感应能量, 并将 其转换为非接触电源提供给第一安全芯片。 因此, 与稳压单元相连的第二开关 S2导通, 其他开关断开。
在完成非接触应用的数据交换后, 由于非接触通信装置离开非接触场, 非 接触前端芯片不再提供非接触电源, 因此, 所有电路均不带电, 所有开关也均 处于不工作状态。
在具体实施例中,所述第一开关 Sl、第二开关 S2以及第三开关 S3可以采 用 PMOS晶体管结构, 其中, PMOS晶体管的栅极作为控制导通或断开状态 的控制端, 而漏极与源极则分别连接第一安全芯片与稳压单元。
对于第三电源切换子单元 709 , 与其相连的第三安全芯片为存储卡结构的 安全芯片, 所述存储卡结构的第三安全芯片包含有扩展引脚(图 5中的第一引 脚 SWIO与第二引脚 VDD ) 。 因此, 第三安全芯片的电源不需要和标准存储 卡接口电源复用引脚,相应的, 第三电源切换子单元 709中无需包含与标准存 储卡接口电源相连的电子开关,其中只包含有与稳压单元 703相连的第四开关 S4以及与公共电压端相连的第五开关 S5。此外,所述第三电源切换子单元 709 不以类似第一电源切换子单元 705的方式复用标准存储卡接口中的电源引脚 连接到上位机芯片的电源管理单元,这种处理的另一优点在于可以避免以下状 况: 标准存储卡接口包含有双向数据引脚,如果第三安全芯片接收非接触电源 作为其工作电源而同时上位机芯片又不带电时,所述第三安全芯片的工作电源 会经由双向数据引脚的静电放电保护(Electric Static Discharge, ESD )电路向 上位机芯片漏电, 导致第三安全芯片无法正常工作。
下面再对第三电源切换子单元 709的工作过程作筒要说明。
通常状态下, 即非接触通信终端在未接收到非接触应用时, 第三电源切换 子单元 709中的第四开关 S4与第五开关 S5同时断开, 第三安全芯片不工作; 当非接触通信终端接收到非接触应用的请求后, 第四开关 S4打开, 接收由稳 压单元 703提供的非接触电源作为第三安全芯片的工作电源, 同时第五开关 S5保持断开; 当所述非接触应用结束后, 第四开关 S4断开, 同时, 第五开关 S5短暂打开, 将第三安全芯片上的残余电荷泄放掉, 之后, 第五开关 S5也恢 复断开状态。
可选的, 所述第三电源切换子单元 709也可以仅包含连接稳压单元 703与 安全芯片的第四开关 S4, 而不包含有连接公共电压端与安全芯片的开关。 对 于采用这种电路结构的电源切换子单元, 其工作过程如下:
1. 正常工作模式
在未接收到非接触前端芯片提供的非接触应用请求时, 第四开关 S4保持 断开; 在接收到非接触前端芯片提供的非接触应用的请求后, 第四开关 S4导 通; 在所述非接触应用操作完成后, 所述第四开关 S4断开;
2. 关机模式 在关机模式时, 非接触通信终端没有工作电源, 所有电路均不带电, 因此, 第四开关 S4处于不工作状态。
在接收到非接触应用的请求后, 非接触前端芯片被非接触场唤醒, 之后, 所述非接触前端芯片检测电池的电量: 如果电池有电, 则非接触前端芯片从所 述电池中获取电量, 并将其转换为非接触电源, 之后, 导通第四开关 S4, 非 接触前端芯片将所述非接触电源提供给第三安全芯片; 而如果电池无电(或未 安装电池), 则非接触前端芯片直接从非接触场中感应能量, 并将所述非接触 场感应的能量转换为非接触电源; 之后导通第四开关 S4, 将所述非接触电源 提供给第三安全芯片。
在完成非接触应用的数据交换后, 由于非接触通信装置离开非接触场, 非 接触前端芯片不再提供非接触电源, 因此, 所有电路均不带电, 第四开关 S4 回复不工作状态。
以上即为电源切换单元 704的工作过程, 需要说明的是, 对于多路非接触 应用接口的电源切换单元 704 , 只有被选中的一路非接触应用接口会在需要时 进行开关状态的切换, 而未被选中的非接触应用接口的开关状态并不受影响。 图 7b是本发明非接触通信装置的电源单元另一实施方式的示意图。 如图 7b所示, 所述电源单元包括主电源单元 711、 稳压单元 713及电源切换单元 714。 与图 7a示出的电源单元相比, 主电源单元 711与稳压单元 713的结构与 功能与图 7a中的主电源单元 701及稳压单元 703相同, 不再赘述; 仅电源切 换单元 714有所不同。 具体而言, 所述电源切换单元 714包括三路电源切换子单元, 即第一电源 切换子单元 715、 第二电源切换子单元 717以及第三电源切换子单元 719。 所 述三路电源切换子单元均采用与图 7a中第一电源切换子单元 705相同的电路 结构, 即每一电源切换子单元均包含有三路由电子开关控制的输入端, 分别与 外接的集成有电源管理单元的上位机芯片、 稳压单元 713以及公共电压端相 连, 而每一电源切换子单元通过其输出端向相连的一个安全芯片提供工作电 源。
由于采用了相同的电路结构, 在实际应用中, 所述电源切换单元 714中的 每一电源切换子单元可以与 SWP SIM卡结构的安全芯片连接, 也可以与存储 卡结构的安全芯片连接。 对于与 SWP SIM卡结构安全芯片连接的电源切换子 单元, 其工作方式与图 7a中第一电源切换子单元 705相同。 而对于与存储卡 结构安全芯片连接的电源切换子单元, 其工作方式也与图 7a中第一电源切换 子单元 705相同,即具有三路输入端的电源切换子单元可以将外接的集成有电 源管理单元的上位机芯片、稳压单元 713或公共电压端与存储卡结构安全芯片 相连; 这使得存储卡结构安全芯片在未进行非接触应用时也可以获得工作电 源, 提高了非接触通信装置对安全芯片的兼容性。
接下来, 再说明信号管理单元的具体实施方式, 所述信号管理单元用于选 择安全芯片, 并实现非接触前端芯片与安全芯片的双向数据传输。
由于本发明的非接触通信装置是对原有非接触应用接口进行扩展得到的, 因此,信号管理单元的接口完全兼容现有技术的非接触应用的信号, 例如单线 协议技术的信号(SWP信号)。 对于所述 SWP信号, 其定义与说明可以参考 ETSI TS 102 613 ¾¾, 在此不再赘述, 仅就实现非接触前端芯片与安全芯片 双向通讯所需信号进行说明。
为了实现非接触前端芯片与安全芯片的双向通讯, 单线协议技术定义了两 种信号, 分别为: 第一信号 SIG1为非接触前端芯片向安全芯片发送的信号, 其采用 RZ编码的电压表示逻辑信号 1和逻辑信号 0; 而第二信号 SIG2则为 安全芯片向非接触前端芯片发送的信号,其采用电流负载调制表示逻辑 1和 0。 因此, 当非接触前端信号接收安全芯片提供的数据信号, 需要将安全芯片提供 的电流负载调制的第二信号 SIG2进行解调。
图 8是本发明非接触通信装置的信号处理电路的示意图。
如图 8所示,所述信号处理电路包括数字功能模块与信号管理单元两部分, 其中, 所述数字功能模块即为图 6中的数字功能模块 606 (为了便于说明, 图 中未示出第二緩存), 包含有计时器、状态控制单元、寄存器、 TFIFO、 RFIFO、 帧编码单元、编码 CRC (循环冗余码校验)计算单元、 帧解码单元、解码 CRC 计算单元以及位编码单元。 由于每次进行非接触应用时, 只有一张安全芯片与 非接触前端芯片进行通讯, 因此,所述数字功能模块可以保持与现有技术相同 的连接方式与功能基本不变,唯一的变化是,状态控制单元需要依据非接触应 用的不同, 形成不同的控制信号, 所述控制信号用于选定对应的安全芯片。
而所述信号管理单元包括电压输出单元 801与电压输入单元 803两部分, 其中,
所述电压输出单元 801包括三路并联的电压输出子单元, 每一路的电压输 出子单元对应于一路安全芯片,将 SWP数字模块输出的数据 (即前述采用 RZ 编码的第一信号 SIG1 )提供给安全芯片; 所述电压输入单元 803包括选择单元 805与电流检测单元 807, 所述选择 单元 805接收多路安全芯片输出的电流信号(即前述采用电流负载调制的第二 信号 SIG2 ) , 并依据状态控制单元提供的控制信号选择一路电流信号, 并将 所述选定的电流信号提供给电流检测单元 807; 所述电流检测单元将所述电流 信号转换为电压信号后, 提供给数字功能模块。
本发明的非接触通信装置解决了近场通讯应用环境建设的跨行业合作问 题, 不同运营商可以独立发行与非接触通信终端相分离的安全芯片,避免因一 卡多用带来的数据安全、 用户管理等问题。 此外, 本发明的非接触通信装置使 得一个非接触通信终端可以装载多个安全芯片;所述安全芯片可以支持单线协 议技术, 这使得处于关机状态的非接触通信终端仍可以完成非接触应用, 这大 大扩展了非接触应用的应用场合。
本发明虽然已以较佳实施例公开如上, 但其并不是用来限定本发明, 任何 本领域技术人员在不脱离本发明的精神和范围内,都可以利用上述揭示的方法 和技术内容对本发明技术方案做出可能的变动和修改, 因此, 凡是未脱离本发 改、 等同变化及修饰, 均属于本发明技术方案的保护范围。

Claims

权 利 要 求
1. 一种非接触通信装置, 其特征在于, 包括: 非接触前端芯片、 安全芯 片集线器及安全芯片组, 其中, 所述安全芯片组包含有两个以上的安全芯片, 用于存储和处理非接触应 用数据; 所述非接触前端芯片用于实现所述安全芯片与外部非接触场的交互; 所述安全芯片集线器与非接触前端芯片和安全芯片组中的安全芯片相 连, 用于基于非接触应用选择安全芯片, 实现被选择的安全芯片与非接触前端 芯片的连通。
2. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述非接触前端 芯片还用于从外部非接触场获取电源,通过所述安全芯片集线器提供给被选择 的安全芯片。
3. 如权利要求 1或 2所述的非接触通信装置, 其特征在于, 所述安全芯 片集线器通过非接触前端芯片连接至非接触通信装置的电源管理单元,将所述 电源管理单元提供的电源输出至安全芯片。
4. 如权利要求 3所述的非接触通信装置, 其特征在于, 所述安全芯片集 线器包括: 电源切换单元,分别连接电源管理单元、非接触前端芯片与安全芯片组, 用于管理安全芯片组的电源,依据非接触通信装置的状态向被选择的安全芯片 提供电源; 信号管理单元, 分别连接非接触前端芯片与安全芯片组, 用于实现非接 触前端芯片与被选择的安全芯片之间的交互。
5. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片集 线器通过非接触前端芯片连接至非接触通信装置的上位机芯片,基于来自上位 机芯片的指令选择安全芯片。
6. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片连 接至非接触通信装置的上位机芯片,所述上位机芯片通过与安全芯片进行的数 据交互来实现常规数据处理。
7. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片集 线器包括: 所述电源切换单元, 分别连接非接触前端芯片与安全芯片组, 用于管理 安全芯片组的电源, 基于非接触应用、 非接触通信装置的工作状态, 或者基于 非接触应用, 向安全芯片组中的安全芯片提供电源; 所述信号管理单元, 分别连接非接触前端芯片与安全芯片组, 基于非接 触应用选择安全芯片,并实现非接触前端芯片与被选择安全芯片之间的数据交 互。
8. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片集 线器与安全芯片采用支持单线协议技术、 IS07816协议或常用智能卡接口实现 连接。
9. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片包
10. 如权利要求 9所述的非接触通信装置, 其特征在于, 所述存储卡结 构安全芯片包含有两个扩展引脚, 分别为第一引脚与第二引脚; 其中, 所述第 一引脚用于与安全芯片集线器进行非接触应用的数据交换;所述第二引脚用于 获取电源。
11. 如权利要求 1所述的非接触通信装置, 其特征在于, 所述安全芯片 集线器集成于非接触前端芯片中。
12. 如权利要求 5或 6所述的非接触通信装置, 其特征在于, 所述上位 机芯片为基带芯片。
13. 一种安全芯片集线器, 装载于非接触通信装置中, 其特征在于, 所 述安全芯片集线器包含有多个用于连接安全芯片的非接触应用接口,以实现安 全芯片组与非接触前端芯片的连接, 其中, 所述安全芯片组包含有一个或多个 安全芯片。
14. 如权利要求 13所述的安全芯片集线器, 其特征在于, 所述安全芯片 集线器包括电源切换单元与信号管理单元, 其中, 所述电源切换单元, 分别连接非接触前端芯片与安全芯片组, 用于管理 安全芯片组的电源, 基于非接触应用、 非接触通信装置的工作状态, 或者基于 非接触应用, 向安全芯片组中的安全芯片提供电源; 所述信号管理单元, 分别连接非接触前端芯片与安全芯片组, 基于非接 触应用选择安全芯片,并实现非接触前端芯片与被选择安全芯片之间的数据交 互。
15. 如权利要求 14所述的安全芯片集线器, 其特征在于, 所述非接触通 信装置还包含有电源管理单元, 所述电源切换单元还连接至电源管理单元, 并 基于非接触通信装置的工作状态、 非接触应用向被选择的安全芯片提供电源。
16. 如权利要求 15所述的安全芯片集线器, 其特征在于, 所述电源切换 单元包括有多个电源切换子单元, 每个电源切换子单元对应于一个安全芯片, 其中, 所述电源切换子单元包括三个并联连接的电子开关, 分别为连接电源管 理单元与安全芯片的第一开关、连接非接触前端芯片与安全芯片的第二开关以 及连接公共电压端与安全芯片的第三开关。
17. 如权利要求 16所述的安全芯片集线器, 其特征在于, 所述电源切换 子单元基于非接触通信装置工作状态的信号,控制所述电源切换子单元中的电 子开关的导通或关闭状态; 其中, 所述非接触通信装置工作状态为正常工作模式: 所述第一开关导通, 第二开关及第三开关断开, 电源切换子单元选择电 源管理单元提供的标准电源作为相连的安全芯片的工作电源;非接触前端芯片 提供的非接触应用的请求不影响所述第一开关、 第二开关及第三开关的状态; 所述非接触通信装置工作状态为低功耗模式: 在未接收到非接触前端芯片提供的非接触应用的请求时,第一开关导通, 第二开关与第三开关断开,但低功耗状态下通过第一开关的电源未给安全芯片 提供电源; 在收到非接触前端芯片提供的非接触应用的请求后, 所述第一开关 断开, 之后第二开关导通, 第三开关保持断开, 电源切换子单元选择非接触前 端芯片提供的电源作为相连的安全芯片的工作电源;在接收到非接触前端芯片 提供的非接触应用完成的处理结果后, 第二开关断开, 第三开关短暂导通, 所 后, 导通第一开关并断开第三开关; 所述非接触通信装置工作状态为关机模式: 在所述非接触通信装置未进入非接触场时, 非接触前端芯片不带电; 在 进入非接触场后, 非接触前端芯片感应非接触场而上电, 并判断非接触场携带 的非接触应用请求, 之后, 第一开关与第三开关断开, 第二开关导通, 电源切 换子单元选择非接触前端芯片提供的电源作为相连的安全芯片的工作电源;在 非接触应用操作完成后, 所述非接触通信装置离开非接触场, 非接触前端芯片 无法继续获取电量, 第一开关、 第二开关以及第三开关均处于不工作状态。
18. 如权利要求 14所述的安全芯片集线器, 其特征在于, 所述电源切换 单元包括有多个电源切换子单元, 每个电源切换子单元对应于一个安全芯片, 其中, 所述电源切换子单元包括连接非接触前端芯片与安全芯片的第四开关。
19. 如权利要求 18所述的安全芯片集线器, 其特征在于, 所述电源切换 子单元基于非接触应用请求控制电子开关的导通或关闭状态, 其中, 所述非接触通信装置工作状态为正常工作模式: 在未接收到非接触前端芯片提供的非接触应用请求时, 第四开关保持断 开; 在接收到非接触前端芯片提供的非接触应用的请求后, 第四开关导通; 在 所述非接触应用操作完成后, 所述第四开关断开; 所述非接触通信装置工作状态为关机模式: 在未进入非接触场时, 非接触前端芯片不带电; 在所述非接触通信装置 进入非接触场后, 非接触前端芯片感应非接触场而上电, 并判断非接触场携带 的非接触应用请求, 之后, 第四开关导通, 电源切换子单元选择非接触前端芯 片提供的电源作为相连的安全芯片的工作电源; 在非接触应用操作完成后, 所 述非接触通信装置离开非接触场, 非接触前端芯片无法继续获取电量, 第四开 关处于不工作状态。
20. 如权利要求 14所述的安全芯片集线器, 其特征在于, 所述信号管理 单元包括输出单元与输入单元, 其中, 所述输出单元包括两路以上并联连接的输出子单元, 每一路的输出子单 元对应于一路安全芯片,将非接触前端芯片输出的非接触应用数据提供给安全 芯片; 所述输入单元包括选择单元与电流检测单元, 所述选择单元接收安全芯 片组输出的电流信号,并依据非接触前端芯片的状态控制单元提供的控制信号 选择一路电流信号, 并将所述选定的电流信号提供给电流检测单元; 所述电流 检测单元将所述电流信号转换为电压信号后,提供给非接触前端芯片的数字功 能模块。
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