WO2011120835A1

WO2011120835A1 - Optoelectronic component, housing for same, and method for producing the optoelectronic component

Info

Publication number: WO2011120835A1
Application number: PCT/EP2011/054252
Authority: WO
Inventors: Gertrud KRÄUTER
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2010-03-30
Filing date: 2011-03-21
Publication date: 2011-10-06
Also published as: TWI450421B; DE102010013317A1; DE102010013317B4; TW201208136A

Abstract

The invention relates to housing (1) for an optoelectronic component (7) comprising a main housing part (2) that has a recess (4). The surface of the main housing part is formed at least in the region of the recess (4) at least partially from a composition which contains at least one polyester and a white pigment. The polyester is selected from polymers or copolymers consisting of at least one aromatic dicarboxylic acid and at least one aliphatic or aromatic dihydoxy compound and from polymers or copolymers consisting of at least one non-aromatic dicarboxylic acid and at least one aromatic dihydoxy compound. Said polyester composition at least has a melting point that is greater than or equal to 255 °C. The invention further relates to a semiconductor component comprising such a housing and to a method for producing said component.

Description

description

Optoelectronic component, housing for this and method for producing the optoelectronic component

This patent application claims the priority of German Patent Application 10 2010 013 317.5, the disclosure of which is hereby incorporated by reference. The invention relates to a housing for an optoelectronic component, an optoelectronic component, a

having such a housing, and a method for

Production of such an optoelectronic component. According to the prior art, the housing for

optoelectronic semiconductor components, in particular for light-emitting optoelectronic semiconductor components, in

Usually not sufficiently resistant to aging caused by temperature or electromagnetic radiation. Only ceramic cases usually show no

aging; but these are expensive, have only one

limited reflectivity and can not be so precise

be made as appropriate plastic housing. An object to be solved is therefore to provide a housing for an optoelectronic component, which is characterized by an increased resistance to aging.

This object is achieved by the housing, the optoelectronic component and the method for its preparation according to the independent claims. Subordinate claims

advantageous embodiments. A housing for an optoelectronic component is specified. The optoelectronic component can be, for example, an optoelectronic semiconductor chip. This semiconductor chip can in particular

Radiation-emitting or radiation-detecting or

Be radiation-receiving. For example, the housing may be a housing for at least one

LED chip, at least one laser diode chip and / or act at least one photodiode chip.

In accordance with at least one embodiment, the housing comprises a housing base body which has a recess.

At least in the area of the recess is the

Housing base formed from a composition containing at least one polyester and a white pigment. The composition can also consist of the at least one polyester and the at least one white pigment (and is also referred to below as polyester composition).

The polyester is in this case selected from polymers or

Copolymers consisting of at least one aromatic

Dicarboxylic acid and at least one aliphatic or

aromatic dihydroxy compound are formed (first group of polyesters) or from polymers consisting of at least one non-aromatic dicarboxylic acid and at least one

aromatic dihydroxy compound are formed (second group of polyesters). Also mixtures in the form next to each other

present homopolymers of various such polyesters or juxtaposed different such copolymers are possible, these blends both on mixture with only one of the aforementioned two groups of polyesters as well as mixtures in which at least one component from the first group of polyesters and at least one component may be selected from the second group of polyesters.

The white pigment serves on the one hand, the housing or

To color parts of the housing. On the other hand, by the coloring and the reflectivity and / or

Radiation resistance of the housing can be increased.

The recess according to the present embodiment is particularly adapted to be received

at least one optoelectronic component is suitable. The recess may, for example, laterally limiting

Have side walls, which arranged in a housing

Optoelectronic component laterally surrounded. The

Sidewalls can be perpendicular to the surface of the

Be aligned recess, but usually they will be at least partially formed obliquely, so that the

Recess z. B. has a trough-shaped geometry. The side walls of the recess can in particular be designed such that they generate the one produced in the semiconductor component

reflect electromagnetic radiation or electromagnetic radiation received by the semiconductor device, d. H. during operation of the component, the side walls

reflect incident electromagnetic radiation. In particular, the white pigment is required for this reflection. The incident electromagnetic radiation may be electromagnetic radiation having a wavelength from the spectral range of UV radiation to

Spectral range of infrared radiation act, in particular in this case is radiation with a wavelength <490 nm to call. Frequently the wavelength of the radiation will not extend to the range <390 nm. The reflective ones

Sidewalls may, for example, be annular (e.g. circular or oval) may be formed; but there are also rectangular basic shapes and mixed forms conceivable. In the finished optoelectronic semiconductor component surrounded the

reflective side walls of the recess usually an example optoelectronic semiconductor device frame-like.

The polyester compositions used for the housing have at least a melting point of> 255 ° C. Often the polyesters will have a melting point of 260 ° C. The melting point here is the curve maximum of the curve determined by means of DSC (Differential Scanning Calorimetry), in which the heat flow is plotted against the temperature. In the following, for polyester compositions having a plurality of melting points, reference is made to a melting point of> 255 ° C., which is usually the melting point of the higher melting constituent.

The fact that the housing is formed at least in the region of the recess made of polyester, according to the invention

found that a very good yellowing resistance, especially in the action of blue light and

simultaneously increased temperature is achieved. It has been observed that the polyamide which is normally used according to the prior art already shows marked aging phenomena at the irradiated sites even at relatively short irradiation with blue light at 120 ° C. If the housing in the region of the recess, on the other hand, is formed of polyester, then under similar irradiation conditions

Aging phenomena not observed. The aging phenomena may occur ^¬ <490 nm wavelengths of light in particular. In order to also allow a simple soldering of the electrical component in on a substrate, the polyester mixture has at least a melting point, which is at 255 ° C or above. It has been shown that in polyesters corresponding to such specifications, a sufficient

Dimensional stability is given, which is a soldering of the

Semiconductor device also made possible by means of a lead-free solder. It thus remains to be seen that through the case

Polyester not only (due to the relatively low price of polyester), the production cost can be lowered; Rather, the improved

Resistance to aging increases the lifetime of the housing and thus of the entire optoelectronic component, due to the good dimensional stability of the housing at elevated temperatures, the desired quality is maintained even when used for the production of lead-free soldering.

In order to further increase the stability of the housing, the thermoplastic can also be crosslinked and then not only has an increased mechanical stability, but also an increased chemical stability. For example, crosslinking of alkylene groups of the polyester can be effected by means of .beta.-radiation. The aliphatic components of

However, polyesters can not only be saturated but also unsaturated, with the unsaturated aliphatic

Components can be used in particular when networking is to take place in the not by means of

Radiation but chemically crosslinked. It may therefore be contained in the polyester composition, an additive, by means of which a chemical crosslinking of the polyester can be done. However, it was found that - even when using lead-free soldering - a

Crosslinking of the polyester is usually not required and even without crosslinking sufficient dimensional stability is ensured.

According to a further embodiment, the polyester composition comprises a further one in addition to the white pigment

Filler. The polyester composition can also consist of the at least one polyester, the white pigment and the further filler. To call are as fillers

in particular glass fibers, glass beads and mineral

Fillers and mixtures of two or all of these

Materials. Also cellulose fibers and mixtures of

Cellulose fibers with one or more of the aforementioned

Materials may be suitable. The mineral filler may be a filler in fiber, powder or platelet form. As mineral fillers in particular wollastonite, chalk (calcium carbonate) or talc can be used. By using mineral fillers, the polyester composition usually forms one

particularly smooth surface; Thus, a particularly smooth exterior housing surface and inner surface is obtained. By the said further fillers, in particular if at least partially fibrous materials are used, the dimensional stability of the housing can be significantly increased when heated. In addition, the mechanical properties are generally improved. For example, the stability of the housing against tensile and

Shear stresses improved. As fibrous materials are in addition to fiber, in particular non-respirable mineral To call materials such as wollastonite, which can serve as a substitute for glass fiber.

If glass fibers are used, they may for example have an average length of 200 to 400 μm and an average diameter of 6 to 15 μm. When a fibrous further filler, e.g. Wollastonite, used, so this example, a

average length of 50 to 500 μιη and one

average diameter of 5 to 50 ym own.

According to one embodiment, the cumulative proportion of white pigment and the further filler is from 25 to 60% by weight, based on the polyester composition (i.e.

for example, for a composition consisting of white pigment, filler and polyester, 40 to 75 wt .-% polyester present). Such filler / white pigment components lead to housings with particularly good dimensional stability

at the same time good mechanical properties and

Processing properties. If the filler / white pigment content is increased too much, then optionally one

undesirable increased brittleness. Particularly good results in terms of dimensional stability and brittleness are usually achieved when the filler / white pigment content is 40 to 50 wt .-%. As stated above, is a high proportion

fibrous materials advantageous. For example, more than 25% but also more than 50% of the cumulative amount of white pigment and further filler may be fibrous material.

The cumulative view of white pigments and other fillers seems therefore to be appropriate since especially when using similarly shaped white pigments and other fillers - the effect of

White pigment and filler is similar to the dimensional stability. Considering the proportions of white pigment and others

Filler isolated, so the proportion of white pigment

(based on the total composition) in particular up to 25 wt .-% amount; Often the proportion will be at most about 20% by weight. The proportion of the further filler is usually up to 35 wt .-% (based on the

GesamtSusammensetzung) and z. B. between 10 and 35

Wt .-% amount; Frequently, the share of the others

Filler below 25 wt .-% are.

According to a further embodiment, in the

Composition contains one polyester

Degree of crystallization of at least 30%, in particular

at least 40%, often at least 50%. Of the

The degree of crystallization can be determined by means of

Density measurement of the polyester composition or the housing produced therefrom are determined. If the polyester component of the composition for the housing has a higher degree of crystallinity, this means that the polymer composition is dimensionally stable above the glass transition temperature. (The proportion of Undefined melted shares is thus reduced and thus also the proportion of components / areas at a temperature below the application

defined melting temperature "melt"). In addition to the

Use of white pigments and other fillers, therefore, the dimensional stability can be further increased if a particularly high degree of crystallization is present in the polyester composition. As a rule, the polyester composition according to the application is semicrystalline, ie it contains crystalline and also amorphous regions. amorphous Areas can be useful if networking the

Polyester composition is intended. In particular, the amorphous areas lead to a stronger

Networking. But crystalline areas also lead without

Networking for improved dimensional stability.

An increase in the degree of crystallization can be achieved, for example, if an injection molding process is used to produce the housing and the processed polyester composition is cooled slowly or by adding a nucleating agent. In addition, the degree of crystallization can be influenced by the polyester component or components are selected accordingly. For example, a polyester based on isophthalic acid building blocks generally has a lower degree of crystallinity than a polyester based on terephthalic acid building blocks. Furthermore, by appropriately selected Dihydoxyverbindungen the

Are increased degree of crystallization. So z. B.

Polybutylene terephthalate usually a higher

Degree of crystallization as polyethylene terephthalate. Even without special measures to increase the

The degree of crystallization can be achieved with polybutylene terephthalate 40-50% and with polyethylene terephthalate 30-40%.

According to a further embodiment, the polyester composition has a melting range with respect to the melting point of> 255 ° C, which has a width of at most 30 ° C, in particular at most 20 ° C, often also 15 ° C or less. Contains the composition several

Components having a melting point at 255 ° C are referred to in terms of the melting range for the component most strongly represented by weight. The width of the fusion region according to this embodiment can be determined as the difference between the extrapolated initial temperature and the extrapolated final temperature of the melting process, the two extrapolated temperatures

can be determined by a tangent through the two inflection points of the curve obtained by DSC (in which the heat flow is plotted against the temperature) in

Melting range is set and the intersections with a corresponding curve, as it would be present without the presence of a melting point. A particularly narrow melting range leads to an increased

Dimensional stability is achieved; In particular, it is important that the interval between extrapolated

Initial temperature and melting point (i.e., the minimum curve) is particularly small, that is, very few

Melting processes take place below the actual melting point.

According to a further embodiment, the polyester composition for the housing has as polyester a blend of at least two homopolymers, wherein the proportion of the

Component or components having a melting point of at least 255 ° C, at least 40 wt .-%,

in particular at least 60 wt .-%, for example, more than 70 wt .-% (based on the total amount of polyester). According to this embodiment, at least two homopolymeric polyesters in each case according to the definition of the main claim next to each other, but usually only one of these homopolymers the default

met with respect to the melting point of> 255 ° C and the other homopolymer has a lower melting point. As a rule, there are no other polymers than the aforementioned polyesters in the blend; in individual cases but can also a blend with another polymer can be used. In that at least 50% by weight of the refractory

Polyester, it is ensured that -. B. at the temperatures of the lead-free soldering - a

sufficient dimensional stability is ensured. The

Dimensional stability can be further improved if at least 70% by weight of the high-melting point polyester is contained.

Often, however, is a lower melting polyester

makes sense, considering certain characteristics

Processing or durability, or even if an increase in the degree of crystallization is intended. For example, the slightly longer alkylene chain in the polybutylene terephthalate compared to

Polyethylene terephthalate has a better crystallization tendency, gives more balanced mechanical properties

(especially in terms of stiffness, strength, toughness, water absorption and shrinkage behavior) and also a better chemical resistance. In addition, the slightly longer alkylene chain in polybutylene terephthalate ensures better processability of the polyester mixture (or blends).

The setting of balanced mechanical properties is also relevant in terms of the lifetime of the product

Component and also with regard to the generated scrap.

If, due to the poorer mechanical properties (eg during cooling), stresses develop in the housing, this can be done, for example, by As lead to the delamination of a lead frame contained in the housing or cracks in the polymer, as for example in polyamide housings

is observable. The abovementioned mixtures of homopolymers (polymer blends) can be prepared, for example, by coextrusion of the two or

several homopolymers based on the polyester blend are produced.

According to another embodiment, the

Dihydroxy compounds and the dicarboxylic acids for the

Polyester or copolyester or the two or more polyesters of the blend of homopolymers selected as follows: The hydroxy groups of the aliphatic dihydroxy compounds are connected via a (CH ₂ ) _n ~ group with n = 2 to 6, in particular n = 2 to 4; The carboxylate groups of the non-aromatic dicarboxylic acid are connected via a (CH ₂ ) _n ~ group with n = 0 to 6, in particular n = 0 to 4.

As aromatic dicarboxylic acids come in particular

Terephthalate (ie the polyesters are then polyalkylene terephthalates). They contain an aromatic ring which is substituted with two carboxylate groups. The carboxylate groups may in this case in particular in the para ^¬ position to each other but also in the meta position to each other. The aromatic ring may also carry further substituents, for. As halogen atoms such as chlorine or bromine and

Alkyl groups, for example, methyl, ethyl, propyl and

Butyl groups). It may also contain several of these substituents. Due to the easier accessibility, however, the aromatic dicarboxylic acid is usually

be unsubstituted. Also to be mentioned as dicarboxylic acids, the 2, 6-naphthalenedicarboxylic acid and isophthalic acid. As non-aromatic dicarboxylic acids are in particular

Dicarboxylic acids which are connected via an unbranched (CH ₂ ) _n ~ group. Basically, too

branched substituted chains possible. As aliphatic Didydroxyverbindungen diols having two to six carbon atoms are used, in particular 1,2-etanediol, 1, 3-propanediol, 1, 4-butanediol and the like. Particular examples of non-aromatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid adipic acid and sebacic acid.

The aromatic dihydroxy compound is in particular 1,4-dihydroxybenzene (hydroquinone) and derivatives thereof. As substituents are basically the same

Substituents as above for the aromatic

To name dicarboxylic acids. The polyesters according to the present application can easily be formed by reacting the dicarboxylic acids, the corresponding esters or other esters

Derivatives with the corresponding dihydroxy compounds are prepared in a conventional manner.

To obtain particularly colorless polyester (or nach

Filling with the white pigment especially "white" polyester), the polycondensation between dihydroxy compound and dicarboxylic acid should be carried out at the lowest possible temperatures. The polycondensation can, for example, at 180 ° C to

280 ° C, in particular 220 ° C to 260 ° C, are performed.

As a polyester should be particularly mentioned

Polyethylene terephthalate, polybutylene terephthalate,

Polyethylene naphthalate and polybutylene naphthalate and, in the case of polymer blends, mixtures of said polymers

with each other or mixtures with other polyesters. As stated above, an essential aspect of the housing according to the application is its dimensional stability. As a measure of the dimensional stability, the Vicat

Softening temperature according to DIN ISO 306 and ASTM D1525 are performed by means of which it can be shown that the dimensional stability increases with increasing filler / white pigment content (within the limits defined above) the dimensional stability. The Vicat softening temperature is the temperature at which a given indenter has penetrated 1 mm deep vertically into the specimen under a certain force. For example, be on this

Studies on polyethylene terephthalate

/ Polybutylene terephthalate polymer blends referenced. The Vicat softening temperature can also be used for samples with

different degree of crystallinity can be determined.

According to one embodiment of the housing, the

Housing body at least in the region in which it is formed from the polyester composition according to the application, for a UV radiation or visible radiation

Reflectivity of> 80%. That is, for at least one wavelength in the range of UV radiation and visible radiation, the reflectivity of the region formed from the polyester composition is> 80%. she can

especially> 90% and even> 92%. Due to its particular resistance to short-wave radiation, in particular the reflectivity for wavelengths <490 nm in the aforementioned ranges is important. According to one embodiment, the housing of the present application is formed from at least two sub-areas, of which a first sub-area comprises the polyester composition according to the application and as a rule consists thereof. in the As a rule, the electrical connections for the semiconductor component will also be arranged in the housing and in the region of the recess (eg in the form of a leadframe). The first subregion will extend in particular to the region of the recess, as a rule also in the region of the recess

Interface between recess and electrical connections.

The second part can also be a polyester

include or consist of; but it may also be formed from a polyamide or comprise another common, used for housing material or consist thereof.

It is essential, however, that the region on which radiation from the radiation-emitting component can impinge or radiation which is detected by the component impinges freely or substantially free of the material of the second

Subarea is. For example, essentially free can mean that the respective outer surfaces (or the

Interfaces to the electrical connections) to a

Area fraction of at most 10%, in particular at most 5%, are covered with the material of the second subarea. The second portion of the housing may also include a material having a melting point higher than the at least one melting point of the polymer composition.

in particular as far as the area of the electrical connections (outside the area of the recess) is concerned.

The materials of the first and the second sub-area can in particular cohesively or positively

be connected to each other. For example, one is

positive connection by undercuts

feasible if the last one applied

Sub-area is applied for example by means of an injection molding or transfer molding process. A cohesive Connection can be realized by suitable choice of the materials of the first and the second portion or by means of an adhesive. In many cases, the housing according to the present

Registration but have only a single sub-area; d. H. the housing will be formed entirely of the polymer composition according to the present application. The housing may be made of the polyester composition, for example

exist (and can next to the electrical connections

exhibit) ; it can be the polyester composition in the

Single case but only included.

According to one embodiment of the housing or of the polyester composition, this comprises as white pigment, in particular, an achromatic inorganic pigment having a high content

Refractive index of preferably> 1.45 and often> 1.75. The white pigment can do at least one of the following

Materials include: titanium dioxide (especially anatase

and / or rutile), lithopone, barium sulfate, zinc oxide,

Zinc sulfide, zirconia, boron nitride, alumina,

Aluminum nitride.

As a particle size of non-fibrous white pigments, in particular particle sizes of 200 to 500 nm (measured by sieving method) make sense, since such particles

are particularly suitable for high reflectivity and also the advantageous properties in terms of

To ensure dimensional stability of the present thermoplastic composition.

According to a further embodiment, the housing is injection molded according to the present application. By means of a Injection molding process cost-effective high quantities can be produced in very good quality. In addition, in the

Injection molding process, the cooling rate of the polymer melt can be easily adjusted so that the degree of crystallization can be easily influenced.

In the injection molding process, the pressure is often in a range of 1000 to 1500 bar. About the pressure is

For example, it ensures that the sprayed material is pushed through the device at a sufficient speed. It is also ensured by the pressure that the mold, in which the material is injected for the housing, also completely and without outer and inner recesses is filled with the material. Should a crosslinker be contained in the compressed mass, the high speed can also prevent it from happening

premature crosslinking reactions due to elevated temperatures. It is further specified an optoelectronic component. The optoelectronic component comprises a housing, as indicated in at least one of the embodiments described here or at least one of the embodiments described here. That is, all for the case

described features are also disclosed for the optoelectronic device. The optoelectronic component further comprises at least one optoelectronic component,

in particular a radiation-emitting semiconductor chip, such as a light-emitting diode chip or a

Laser diode chip. The at least one radiation emitting

Semiconductor chip is arranged in the recess of the housing body. The at least one radiation emitting

Semiconductor chip, for example, on the bottom surface of the Recess attached and be electrically connected. The housing can do so in addition to the housing body and the

Coatings, for example, electrically conductive

Have connection points, the z. B. by multi-component injection molding with at least one other component of

Housing are mechanically firmly connected.

Finally, a method for producing an optoelectronic component, as described above, is also provided. Here, first, the housing for the

optoelectronic component formed, wherein the housing has a recess whose surface at least

Partly formed from the application according to the polyester composition. The housing usually contains a first and a second connection point, which is for electrical

Contacting a in the component (and in the recess) arranged optoelectronic device serve. During the molding of the housing, the first and the second connection point are wrapped with the polyester composition, in particular extrusion-coated (for example by means of a

Injection molding or transfer molding process), whereby the finished housing is obtained.

In a further step, the optoelectronic component is introduced into the recess of the housing in such a way that it is connected to the first and the second electrical

Connection point is connected. Connecting the

Component is usually done by gluing.

Subsequently, the component can be arranged, for example, on a support, for example a circuit board, so that an electrically conductive connection between the support and

optoelectronic component takes place, wherein a soldering process for producing the electrically conductive compound Can be used, in particular a soldering process using a lead-free solder.

With the composition according to the application it is possible, in particular lead-free soldering for soldering the

optoelectronic device to use, although this relatively high temperatures prevail. During soldering, the connection points or the leadframe may briefly be exposed to temperatures of up to 300 ° C. If the polyester composition meets the specifications according to the application, but this can be tolerated for a short time, without the dimensional stability is lost. So it was

observed that at least in the area of the connection points, a temperature can be tolerated for a short time, which is well above the determined melting temperature of the

used polyester composition lies.

Is the wrapping of the first and the second

Junction by means of an injection molding process, so this has the advantage that the injection molding tool due to the / the relatively low melting points of the polyester composition only to relatively low temperatures of, for example, 80 to 100 ° C must be heated. In the case of the polyamides used according to the prior art, significantly higher temperatures are required, so that a costly heating of the tools is required.

In the following, the housing described here, the optoelectronic component described here and the method described here for producing a

Optoelectronic component described with reference to embodiments and the accompanying figures. Figures 1 and 2 show side views of

Embodiments of described here

Optoelectronic components with embodiments of housings described herein, which may be prepared by means of methods described herein.

Figures 3 and 4 show DSC spectra from here

described polymer compositions for here

described housing.

The same, similar or equivalent elements are provided in the figures with the same reference numerals. The figures and the proportions of the elements shown in the figures with each other are not to scale

consider. Rather, individual elements can do better

Representability and / or exaggerated for better understanding.

FIG. 1 shows an optoelectronic component according to the application in schematic cross section. This comprises a housing 1, which comprises the polyester composition according to the application. In the illustrated embodiment, the entire housing 1 is formed from the polymer composition. The entire housing 1 therefore has a very high resistance to electromagnetic radiation, in particular> 390 nm, in particular blue radiation. The housing 1 also has a recess 4, in which the optoelectronic component 7 is arranged. The

Optoelectronic component 7 is connected on its underside both mechanically and electrically conductively to the first connection point 6a and via a bonding wire 8 to the second electrical connection point 6b. The inside of the housing 1, which faces the recess 4, is as Reflector formed. The recess 4 is filled with a potting 3, for example, on the

Radiation exit surface may be formed as a lens 5. The potting may also contain radiation-converting particles, in particular in the case of radiation-emitting optoelectronic components, which correspond to those of the optoelectronic component

Components emitted primary radiation in one

Convert secondary radiation, especially shorter wavelength. Radiation-converting particles can also be applied to others

Position be arranged in the beam path of the primary radiation (for example in the form of a converter plate).

In connection with this application, the potting, which is located in the recess 4 of the housing 1, not to be regarded as part of the housing, but only as part of the optoelectronic device as a whole.

FIG. 2 shows an embodiment which largely corresponds to the exemplary embodiment according to FIG. However, the component has a two-part housing construction. In the region of the recess 4 there is a first portion 2a of the housing 1, which is formed from the polyester composition according to the application. The rest

Housing body 2b is made of a different material

(at least one other polyester or polyester mixture or from a higher melting polymer). The

"First subregions" 2a of the polyester composition and the remaining housing base 2b can be connected to each other by means of a two-component injection molding. As a polyester composition, for example, a blend of polyetylene terephthalate and polybutylene terephthalate

be used. FIG. 3 shows the DSC spectrum of the application according to the application

used pure polyethylene terephthalate, which additionally contains about 20 to 25 wt .-% titanium dioxide and about 20 to 25 wt .-% further fillers. The DSC spectrum can be next to the

Melting point 20 (259 ° C) also the extrapolated

Initial temperature (248 ° C) and the extrapolated

Final temperature (264 ° C) are taken at the intersection points 21 and 22 of the design lines 23, 24 and 25 used for the determination and the resulting width of the melting range of 16 ° C. With regard to the melting range, the following exact characteristics were obtained: integral

518.37 mJ (normalized 33, 23 μg ^"1 ); onset 248, 28 ° C; peak 258.93 ° C; final set 263.79 ° C; left limit 228.58 ° C; right limit 269.92 ° C Figure 4 shows the DSC spectrum of an application according to the application

used polymer blends with about 60 wt .-%

Polyethylene terephthalate and about 40% by weight

Polybutylene terephthalate. The polymer blend is by means of

Coextrusion has been obtained and additionally contains about 20-25 wt .-% titanium dioxide and about 20 - 25 wt .-% more

Fillers. In addition to the melting point 20 (259 ° C), the extrapolated initial temperature (247 ° C) and the extrapolated final temperature (263 ° C) can be assigned to the DSC spectrum

Intersections 21 and 22 of the used for the determination

Design lines 23, 24 and 25 are taken and the resulting width of the melting range of 16 ° C. With respect to the melting range of polyethylene terephthalate, the following exact characteristics were obtained: integral 362, 82 mJ (normalized 24.51 μg ^"1 ); onset 246, 77 ° C; peak 258.69 ° C; final set 263.46 ° C; left limit 230.63 ° C; right limit 270.04 ° C Regarding the melting range of

Polybutylene terephthalate was given the following exact characteristics: integral 180, 52 mJ (normalized 12.20 Jg ^-1 ); Onset 212.16 ° C; Peak 222.21 ° C; Final set 227.06 ° C; left limit 204.06 ° C; right limit 230.41 ° C.

The invention is not limited to the description with reference to the embodiments. Rather, the includes

Invention every new feature as well as every combination of

Features, which includes in particular any combination of features in the claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

1. housing (1) for an optoelectronic component (7) with

a housing base (2) having a recess (4),

- wherein the surface of the housing base body (2) is at least partially formed in the region of the recess (4) from a composition containing at least one polyester and a white pigment,

- wherein the polyester is selected from polymers or

Copolymers of at least one aromatic dicarboxylic acid and at least one aliphatic or aromatic

Dihydoxyverbindung and from polymers or copolymers of at least one non-aromatic dicarboxylic acid and

at least one aromatic dihydoxy compound

- Wherein the composition has at least a melting point greater than or equal to 255 ° C.

2. Housing according to claim 1,

in which the composition contains a further filler in addition to the white pigment.

3. Housing according to claim 2,

in which the further filler fiberglass, glass beads,

Cellulose fiber and / or a mineral filler.

4. Housing according to claim 2 or 3,

in which the cumulative proportion of white pigment and further filler is from 25 to 60% by weight, in particular 40-50% by weight, based on the composition.

5. Housing according to one of the preceding claims,

in which the polyester contained in the composition Has degree of crystallization of at least 30%, in particular at least 40%.

6. Housing according to one of the preceding claims,

in which the composition has, with respect to the melting point of greater than or equal to 255 ° C, a melting range which has a maximum width of 20 ° C, in particular not more than 10 ° C.

7. Housing according to one of the preceding claims,

wherein the polyester is a blend of at least two

Homopolymer is and the proportion of the component having a melting point greater than or equal to 255 ° C at least 40 wt .-%, in particular at least 60 wt .-%, based on the

Total amount of the polyester is.

8. Housing according to one of the preceding claims,

in which the hydroxy groups of the aliphatic

Dihydroxy compound via a (CH ₂ ) _n ~ group with n = 2 to 6, in particular n = 2 to 4, or the carboxylate groups of the non-aromatic dicarboxylic acid over a (CH ₂ ) _n ~ group with n = 0 to 6, in particular n = 0 to 4, are connected.

9. Housing according to one of the preceding claims,

where the polyester is selected from

Polyethylene terephthalate, polybutylene terephthalate,

Polyethylene naphthalate, polybutylene naphthalate and mixtures of these polymers.

10. Housing according to one of the preceding claims,

in which at least the surface of the housing base body having the recess is formed completely from the composition.

11. Housing according to the preceding claim,

wherein the white pigment comprises at least one or more of the following materials: titanium dioxide, in particular

Rutile or anatase, lithopone, barium sulfate, zinc oxide,

Zinc sulfide, alumina, boron nitride, zirconia.

12. Housing according to one of the preceding claims,

in which the housing base body (2) is injection-molded.

13. Optoelectronic component with

- A housing (1) according to one of the preceding claims, and

at least one optoelectronic component (7),

in particular a radiation-emitting semiconductor chip, wherein

- The at least one optoelectronic component (7) is arranged in the recess of the housing base body.

14. Method for producing an optoelectronic

Component according to the previous claim with the following

steps:

A) molding a housing (1) for the optoelectronic component (7) with a recess (4), wherein the surface of the housing base body (2) at least in the region of

Recess (4) is at least partially formed from a composition containing a polyester and a white pigment, wherein a first and a second connection point (6a, 6b) arranged for electrically contacting an optoelectronic component (7) in the recess (4) is, is wrapped with the composition, is in particular encapsulated;

B) introducing the optoelectronic component (7) into the recess and connecting the optoelectronic component (7) to the first and second electrical connection points (6a, 6b).

15. Method according to the preceding claim,

in addition, a step C) takes place in which the component obtained in step B) is soldered to a carrier by means of a soldering process, in particular using a lead-free solder.