WO2011072056A3 - Composition comprising alkoxy group containing polymers, an aloxysilyl group containing reactant and a transesterification catalyst. sealant and adhesive made by transesterification process - Google Patents
Composition comprising alkoxy group containing polymers, an aloxysilyl group containing reactant and a transesterification catalyst. sealant and adhesive made by transesterification process Download PDFInfo
- Publication number
- WO2011072056A3 WO2011072056A3 PCT/US2010/059536 US2010059536W WO2011072056A3 WO 2011072056 A3 WO2011072056 A3 WO 2011072056A3 US 2010059536 W US2010059536 W US 2010059536W WO 2011072056 A3 WO2011072056 A3 WO 2011072056A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ingredient
- alkoxy groups
- alkoxy group
- group containing
- lower alkoxy
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0617—Polyalkenes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0625—Polyacrylic esters or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/065—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/0657—Polyethers
Abstract
A method for modifying cure speed of a condensation reaction curable involves converting the higher alkoxy groups on ingredient (A) to lower alkoxy groups (such as methoxy groups) using ingredients (B) and (C). Ingredient (A) is a substrate (polymer) having an average, per molecule, of at least two higher alkoxy group functionalized silyl end-blocking groups. Ingredient (B) is a reactant having lower alkoxy groups bonded to silicon. Ingredient (C) is a transesterification catalyst. It is thought that the higher alkoxy groups on ingredient (A) cure too slowly to be practical for many moisture curable sealants and adhesives. As used herein, the term higher alkoxy group means an alkoxy group having more carbon atoms than the lower alkoxy group on ingredient (B). By exchanging some or all of the higher alkoxy groups on ingredient (A) with lower alkoxy groups from ingredient (B), it is thought that cure speed of a sealant or adhesive composition can be increased. Furthermore, it may be possible to control cure speed of the composition by varying the amount of lower alkoxy groups present. And, it may be possible to control physical properties, such as modulus, by varying the amounts of ingredients (A) and (B) relative to each other.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26752709P | 2009-12-08 | 2009-12-08 | |
US61/267,527 | 2009-12-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011072056A2 WO2011072056A2 (en) | 2011-06-16 |
WO2011072056A3 true WO2011072056A3 (en) | 2011-07-28 |
Family
ID=44012390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/059536 WO2011072056A2 (en) | 2009-12-08 | 2010-12-08 | Cure rate control for alkoxysilyl-end-blocked polymers |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2011072056A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110088161A (en) * | 2016-12-20 | 2019-08-02 | 瓦克化学股份公司 | Method for producing the polymer of organic oxygroup silicyl sealing end |
WO2018141614A1 (en) * | 2017-01-31 | 2018-08-09 | Basf Se | Oxidic silicon particle dispersion in polyol |
EP3645609B1 (en) * | 2017-06-26 | 2021-04-21 | Dow Silicones Corporation | Isocyanate-functional silicone-polyether copolymer, silicone-polyether-urethane copolymer formed therewith, sealants comprising same, and related methods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002068501A2 (en) * | 2001-02-23 | 2002-09-06 | Henkel Loctite Corporation | Mixed alkoxysilyl functional polymers |
EP1746133A1 (en) * | 2004-05-07 | 2007-01-24 | Kaneka Corporation | Curable composition improved in adhesiveness |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2624778C3 (en) | 1975-06-03 | 1980-07-03 | Ricoh Co., Ltd., Tokio | Ink ejection head |
US4889903A (en) | 1988-08-03 | 1989-12-26 | Basf Corporation | Fast-cure polyurethane sealant composition containing titanium ester accelerators |
US4962076A (en) | 1988-11-28 | 1990-10-09 | Dow Corning Corporation | Silicone sealants having reduced color |
WO1990006958A1 (en) | 1988-12-14 | 1990-06-28 | Bramite Limited | Silicone modified polyurethanes |
US5051455A (en) | 1990-01-16 | 1991-09-24 | Dow Corning Corporation | Adhesion of silicone sealants |
US5053442A (en) | 1990-01-16 | 1991-10-01 | Dow Corning Corporation | Low modulus silicone sealants |
DE69419830T2 (en) | 1993-06-11 | 2000-02-17 | Three Bond Co Ltd | Wet or anaerobic crosslinkable and photocrosslinkable silicone compositions |
JP3495864B2 (en) | 1995-12-28 | 2004-02-09 | キヤノン株式会社 | Ink jet head using sealing material and ink jet device equipped with the ink jet head |
GB9800611D0 (en) | 1998-01-14 | 1998-03-11 | Hudson & Co Whistles Ltd J | Whistle |
GB2338239A (en) | 1998-06-12 | 1999-12-15 | Schlegel Uk Ltd | Polyurethane foam compositions |
JP3444199B2 (en) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | Thermal conductive silicone rubber composition and method for producing the same |
EP1101167B1 (en) | 1998-07-24 | 2006-04-12 | Sun Microsystems, Inc. | Method and apparatus for achieving deterministic memory allocation response in a computer system |
GB0708347D0 (en) | 2007-05-01 | 2007-06-06 | Dow Corning | Polymer compositions |
-
2010
- 2010-12-08 WO PCT/US2010/059536 patent/WO2011072056A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002068501A2 (en) * | 2001-02-23 | 2002-09-06 | Henkel Loctite Corporation | Mixed alkoxysilyl functional polymers |
EP1746133A1 (en) * | 2004-05-07 | 2007-01-24 | Kaneka Corporation | Curable composition improved in adhesiveness |
Also Published As
Publication number | Publication date |
---|---|
WO2011072056A2 (en) | 2011-06-16 |
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