WO2011067115A1 - Led lighting module with co-molded metal contacts - Google Patents

Led lighting module with co-molded metal contacts Download PDF

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Publication number
WO2011067115A1
WO2011067115A1 PCT/EP2010/067635 EP2010067635W WO2011067115A1 WO 2011067115 A1 WO2011067115 A1 WO 2011067115A1 EP 2010067635 W EP2010067635 W EP 2010067635W WO 2011067115 A1 WO2011067115 A1 WO 2011067115A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
lighting module
metal contacts
contacts
Prior art date
Application number
PCT/EP2010/067635
Other languages
French (fr)
Inventor
Alessandro Bizzotto
Alessandro Scordino
Thomas Preuschl
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Osram S.P.A. - Societa' Riunite Osram Edison Clerici
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung, Osram S.P.A. - Societa' Riunite Osram Edison Clerici filed Critical Osram Gesellschaft mit beschränkter Haftung
Priority to CN2010800544000A priority Critical patent/CN102667306A/en
Priority to EP10779798.7A priority patent/EP2480817B1/en
Publication of WO2011067115A1 publication Critical patent/WO2011067115A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • an LED lighting module comprising: a printed circuit board, at least one LED connected to said printed circuit board, a supply circuit mounted on said printed circuit board, connector means for electrically connecting said supply circuit to an external power source, and a protective casing made of plastic applied to said printed circuit board.
  • LED modules of the type indicated above are provided with a connector welded to the printed circuit board and arranged to connect the supply circuit electrically to an external power source.
  • a protective casing is applied to the printed circuit board to protect the LEDs and the components of the supply circuit mounted on the printed circuit board .
  • the system according to the prior art suffers from multiple disadvantages .
  • the use of standard connectors means that the protective casing has to be positioned at a height above the printed circuit board equal to or greater than the height of the connector. This can shade the lighting region, and thus reduce the efficiency of the system.
  • a second problem is that in the known systems there is a gap between the protective casing and the connector. If the lighting module is to have a certain International Protection rating, the protective casing must be provided with additional elements (seals, etc.).
  • figure 1 is a partial perspective view of an LED lighting module according to the prior art.
  • FIGS. 2, 3, 4, and 5 are schematic views illustrating embodiments of the system described here.
  • reference 10 is an LED lighting module according to the prior art.
  • the lighting module 10 comprises a printed circuit board 12 to which a plurality of LEDs 14 are connected.
  • the printed circuit board 12 supports a supply circuit made up of a plurality of electrical or electronic components 16 connected to the printed circuit board 12.
  • the LED module 10 according to the prior art comprises a connector 18 for electrically connecting the supply circuit 16 to an external power source.
  • the connector 18 is connected to the printed circuit board 12.
  • the LED module 10 also includes a protective casing 20 made of plastic which encloses the supply circuit components 16.
  • the protective casing 20 has an inner wall 22 which surrounds the LEDs 14 and an outer wall 24 which extends around the outer perimeter of the printed circuit board 12.
  • An optical element 26, such as a reflector, may be connected to the protective casing 20.
  • the casing 20 In the prior art system illustrated in figure 1, the casing 20 must be at a minimum height above the printed circuit board 12 greater than or equal to the height of the connector 18. This can cause shading of the lighting region and partly compromise the efficiency of the module 10. Furthermore, in the prior art lighting module 10 there is a gap 27 between the connector 18 and the protective casing 20. This gap means that the product does not have a good International Protection rating. If it is wished to increase the International Protection rating in a lighting module of the type illustrated in figure 1, seals or similar additional elements must be added to prevent ingress between the connector 18 and the protective casing 20. The system described here replaces the connector 18 with metal contacts co-molded into the protective casing 20.
  • Figures 2-5 illustrate various embodiments of this system. In figures 2-5, elements corresponding to those described above are indicated by the same reference numbers.
  • the plastic protective casing 20 supports a plurality of co-molded metal contacts 28.
  • the co-molded metal contacts 28 are accessible from the outside of the casing 20 and are used to connect the LED module 10 electrically to an external power source.
  • the co-molded metal contacts 28 are connected electrically to the tracks of the printed circuit board 12. This connection can be done in various ways, as illustrated schematically in figures 3, 4, and 5.
  • the co-molded metal contacts 28 are of press-fit type with one end 30 capable of being pressed into the printed circuit board 12.
  • the printed circuit board 12 should be made of FR4, with a thickness of 0.6 mm to 2 mm.
  • the co-molded metal contacts 28 are connected to the printed circuit board 12 by soldering 32. Soldering 32 can be done from the outside of the printed circuit board 12.
  • the contacts 28 may also have an elastic portion (such as a spring) to compensate for tolerances and/or directly to make the contact with the printed circuit board 12.
  • the co-molded metal contacts 28 are connected electrically to the printed circuit board 12 by spring contacts 34.
  • one of the contacts 28 extends through the printed circuit board 12 to form a back-entry contact.
  • the lighting module may also include means for aligning the protective casing 20 and the printed circuit board 12, e.g. threaded fasteners or locating dowels, to ensure reliable contact without the need for further adaptations.
  • the system described here allows a good International Protection rating to be obtained automatically because there is no gap between the connector and the casing.
  • the height of the casing above the printed circuit board can be less than in known systems, which is advantageous for reducing shading effects .

Abstract

An LED lighting module comprising: - a printed circuit board (12), - at least one LED (14) connected to said printed circuit board (12), - a supply circuit (16) mounted on said printed circuit board (12), - a plastic protective casing (20) made of plastic applied to said printed circuit board (12), and - a plurality of metal contacts (28) co-molded into said casing (20) for electrically connecting said supply circuit (16) to an external power source.

Description

LED LIGHTING MODULE WITH CO-MOLDED METAL CONTACTS
DESCRIPTION
Field of the invention
The description refers to an LED lighting module comprising: a printed circuit board, at least one LED connected to said printed circuit board, a supply circuit mounted on said printed circuit board, connector means for electrically connecting said supply circuit to an external power source, and a protective casing made of plastic applied to said printed circuit board.
Description of the prior art
In traditional systems, LED modules of the type indicated above are provided with a connector welded to the printed circuit board and arranged to connect the supply circuit electrically to an external power source. A protective casing is applied to the printed circuit board to protect the LEDs and the components of the supply circuit mounted on the printed circuit board .
The system according to the prior art suffers from multiple disadvantages .
In the first place, the use of standard connectors means that the protective casing has to be positioned at a height above the printed circuit board equal to or greater than the height of the connector. This can shade the lighting region, and thus reduce the efficiency of the system.
A second problem is that in the known systems there is a gap between the protective casing and the connector. If the lighting module is to have a certain International Protection rating, the protective casing must be provided with additional elements (seals, etc.). Object and summary of the invention
It is an object of the invention to overcome the disadvantages outlined above. According to the invention, this object is achieved with an LED lighting module having the features claimed in the claims which follow .
The claims are an integral part of the technical teaching given here in relation to the invention.
Brief description of the accompanying illustrations
The invention will now be described, purely by way of non-restrictive example, with reference to the accompanying illustrations, in which:
figure 1 is a partial perspective view of an LED lighting module according to the prior art, and
figures 2, 3, 4, and 5 are schematic views illustrating embodiments of the system described here.
Detailed description of embodiments
The following description will explain various specific details designed to give an in-depth understanding of the embodiments. The embodiments may be produced without one or more of the specific details, or using other methods, components, materials, etc. In other cases, known structures, materials or operations are not shown or described in detail so as not to obscure various aspects of the embodiments. Reference to "an embodiment" in this description means that a particular configuration, structure or feature described in relation to the embodiment is included in at least one embodiment. Consequently, expressions such as "in an embodiment", which may occur in various places in this description, do not necessarily refer to the same embodiment.
Furthermore, particular shapes, structures or features may be combined as suitable in one or more embodiments. References used herein are purely for convenience and do not therefore define the scope of protection or the coverage of the embodiments . In figure 1, reference 10 is an LED lighting module according to the prior art. The lighting module 10 comprises a printed circuit board 12 to which a plurality of LEDs 14 are connected. The printed circuit board 12 supports a supply circuit made up of a plurality of electrical or electronic components 16 connected to the printed circuit board 12. The LED module 10 according to the prior art comprises a connector 18 for electrically connecting the supply circuit 16 to an external power source. The connector 18 is connected to the printed circuit board 12. The LED module 10 also includes a protective casing 20 made of plastic which encloses the supply circuit components 16. The protective casing 20 has an inner wall 22 which surrounds the LEDs 14 and an outer wall 24 which extends around the outer perimeter of the printed circuit board 12. An optical element 26, such as a reflector, may be connected to the protective casing 20.
In the prior art system illustrated in figure 1, the casing 20 must be at a minimum height above the printed circuit board 12 greater than or equal to the height of the connector 18. This can cause shading of the lighting region and partly compromise the efficiency of the module 10. Furthermore, in the prior art lighting module 10 there is a gap 27 between the connector 18 and the protective casing 20. This gap means that the product does not have a good International Protection rating. If it is wished to increase the International Protection rating in a lighting module of the type illustrated in figure 1, seals or similar additional elements must be added to prevent ingress between the connector 18 and the protective casing 20. The system described here replaces the connector 18 with metal contacts co-molded into the protective casing 20. Figures 2-5 illustrate various embodiments of this system. In figures 2-5, elements corresponding to those described above are indicated by the same reference numbers.
Referring to figure 2, the plastic protective casing 20 supports a plurality of co-molded metal contacts 28. The co-molded metal contacts 28 are accessible from the outside of the casing 20 and are used to connect the LED module 10 electrically to an external power source. On the inside of the protective casing 20 the co-molded metal contacts 28 are connected electrically to the tracks of the printed circuit board 12. This connection can be done in various ways, as illustrated schematically in figures 3, 4, and 5.
In the embodiment illustrated in figure 3, the co-molded metal contacts 28 are of press-fit type with one end 30 capable of being pressed into the printed circuit board 12. In this version the printed circuit board 12 should be made of FR4, with a thickness of 0.6 mm to 2 mm. In the embodiment illustrated in figure 4 the co-molded metal contacts 28 are connected to the printed circuit board 12 by soldering 32. Soldering 32 can be done from the outside of the printed circuit board 12. The contacts 28 may also have an elastic portion (such as a spring) to compensate for tolerances and/or directly to make the contact with the printed circuit board 12.
In the embodiment illustrated in figure 5 the co-molded metal contacts 28 are connected electrically to the printed circuit board 12 by spring contacts 34.
In the embodiment illustrated in figure 5, one of the contacts 28 extends through the printed circuit board 12 to form a back-entry contact.
In general, the lighting module may also include means for aligning the protective casing 20 and the printed circuit board 12, e.g. threaded fasteners or locating dowels, to ensure reliable contact without the need for further adaptations.
The system described here allows a good International Protection rating to be obtained automatically because there is no gap between the connector and the casing. The height of the casing above the printed circuit board can be less than in known systems, which is advantageous for reducing shading effects .
Clearly, without departing from the principle of the invention, the details of construction and the embodiments may vary, even significantly, compared with those illustrated here purely by way of non-restrictive example without thereby departing from the scope of the invention as defined in the accompanying claims .

Claims

An LED lighting module comprising:
a printed circuit board (12),
at least one LED (14) connected to said printed circuit board ( 12 ) ,
a supply circuit (16) mounted on said printed circuit board ( 12 ) ,
connector means for electrically connecting said supply circuit (16) to an external power source, and
a protective casing (20) made at least partly of plastic or any other insulating material applied to said printed circuit board (12),
which module is characterized in that said connector means comprise a plurality of metal contacts (28) co-molded into said protective casing (20) .
The lighting module as claimed in claim 1, characterized in that said co-molded metal contacts (28) are "press-fit" contacts having ends (30) pressed into said printed circuit board (12) .
The lighting module as claimed in claim 1, characterized in that said co-molded metal contacts (28) are soldered to said printed circuit board (12) .
The lighting module as claimed in claim 1, characterized in that said co-molded metal contacts (28) are connected electrically to the printed circuit board (12) by means of spring contacts (34).
The lighting module as claimed in claim 1, characterized in that at least one of said contacts (2< extends through said printed circuit board (12) .
The lighting module as claimed in claim 1, characterized in that at least one of the contacts (28) has an elastic portion for compensation for tolerances.
The lighting module as claimed in claim 1, characterized in that said lighting module comprises means for aligning said protective casing (20) and said printed circuit board (12) .
PCT/EP2010/067635 2009-12-04 2010-11-17 Led lighting module with co-molded metal contacts WO2011067115A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800544000A CN102667306A (en) 2009-12-04 2010-11-17 Led lighting module with co-molded metal contacts
EP10779798.7A EP2480817B1 (en) 2009-12-04 2010-11-17 Led lighting module with co-molded metal contacts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTO2009A000959 2009-12-04
ITTO20090959 2009-12-04

Publications (1)

Publication Number Publication Date
WO2011067115A1 true WO2011067115A1 (en) 2011-06-09

Family

ID=42269498

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/067635 WO2011067115A1 (en) 2009-12-04 2010-11-17 Led lighting module with co-molded metal contacts

Country Status (3)

Country Link
EP (1) EP2480817B1 (en)
CN (1) CN102667306A (en)
WO (1) WO2011067115A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013186366A1 (en) * 2012-06-14 2013-12-19 Osram Gmbh Illuminating device and streetlight comprising said illuminating device
WO2014026876A1 (en) * 2012-08-14 2014-02-20 Osram Gmbh Lighting module and cover thereof
WO2014146879A1 (en) * 2013-03-20 2014-09-25 Osram Gmbh Optoelectronic assembly and method for producing an optoelectronic assembly

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US20030030745A1 (en) * 2001-08-08 2003-02-13 Timothy Meek Integrated camera and illumination device
WO2005056269A2 (en) * 2003-12-09 2005-06-23 G.L.I. Global Light Industries Gmbh Method for the production of light-emitting semiconductor diodes on a printed circuit board, and illumination units comprising an integrated circuit board
US7000478B1 (en) * 2005-01-31 2006-02-21 Texas Instruments Incorporated Combined pressure and temperature transducer
US20070201225A1 (en) * 2006-02-27 2007-08-30 Illumination Management Systems LED device for wide beam generation
WO2008024761A2 (en) * 2006-08-21 2008-02-28 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
WO2008115983A1 (en) * 2007-03-19 2008-09-25 Lumination Llc Sealed lighting units
WO2009057433A1 (en) * 2007-10-31 2009-05-07 Nippon Seiki Co., Ltd. Synthetic resin molded article and display device provided with the same

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JPH07220780A (en) * 1993-12-29 1995-08-18 Whitaker Corp:The Surface installation type connector
US7281818B2 (en) * 2003-12-11 2007-10-16 Dialight Corporation Light reflector device for light emitting diode (LED) array
CN101299503A (en) * 2007-04-30 2008-11-05 卢润侨 Electronic apparatus power supply output end structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030030745A1 (en) * 2001-08-08 2003-02-13 Timothy Meek Integrated camera and illumination device
WO2005056269A2 (en) * 2003-12-09 2005-06-23 G.L.I. Global Light Industries Gmbh Method for the production of light-emitting semiconductor diodes on a printed circuit board, and illumination units comprising an integrated circuit board
US7000478B1 (en) * 2005-01-31 2006-02-21 Texas Instruments Incorporated Combined pressure and temperature transducer
US20070201225A1 (en) * 2006-02-27 2007-08-30 Illumination Management Systems LED device for wide beam generation
WO2008024761A2 (en) * 2006-08-21 2008-02-28 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
WO2008115983A1 (en) * 2007-03-19 2008-09-25 Lumination Llc Sealed lighting units
WO2009057433A1 (en) * 2007-10-31 2009-05-07 Nippon Seiki Co., Ltd. Synthetic resin molded article and display device provided with the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013186366A1 (en) * 2012-06-14 2013-12-19 Osram Gmbh Illuminating device and streetlight comprising said illuminating device
CN103511906A (en) * 2012-06-14 2014-01-15 欧司朗股份有限公司 Lighting device and street lamp comprising lighting device
WO2014026876A1 (en) * 2012-08-14 2014-02-20 Osram Gmbh Lighting module and cover thereof
WO2014146879A1 (en) * 2013-03-20 2014-09-25 Osram Gmbh Optoelectronic assembly and method for producing an optoelectronic assembly

Also Published As

Publication number Publication date
EP2480817B1 (en) 2017-04-19
EP2480817A1 (en) 2012-08-01
CN102667306A (en) 2012-09-12

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