WO2011064716A3 - Method for producing at least one cavity in a microelectronic and/or micromechanical structure and a sensor or actuator comprising such a cavity - Google Patents

Method for producing at least one cavity in a microelectronic and/or micromechanical structure and a sensor or actuator comprising such a cavity Download PDF

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Publication number
WO2011064716A3
WO2011064716A3 PCT/IB2010/055362 IB2010055362W WO2011064716A3 WO 2011064716 A3 WO2011064716 A3 WO 2011064716A3 IB 2010055362 W IB2010055362 W IB 2010055362W WO 2011064716 A3 WO2011064716 A3 WO 2011064716A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
actuator
sacrificial layer
cavity
microelectronic
Prior art date
Application number
PCT/IB2010/055362
Other languages
German (de)
French (fr)
Other versions
WO2011064716A2 (en
Inventor
Dirk Zielke
Andreas Hense
Original Assignee
Fachhochschule Bielefeld
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fachhochschule Bielefeld filed Critical Fachhochschule Bielefeld
Publication of WO2011064716A2 publication Critical patent/WO2011064716A2/en
Publication of WO2011064716A3 publication Critical patent/WO2011064716A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936—Releasing the movable structure without liquid etchant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/036—Micropumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Abstract

The invention relates to a method for producing at least one cavity in a microelectronic and/or micromechanical structure using at least one sacrificial layer and to a sensor or actuator produced therewith. The aim of the invention is to provide such a method or such a sensor or actuator, wherein the sacrificial layer has sufficient distance between the structure elements during preparation of the microelectronic and/or micromechanical structure, the sacrificial layer is easy to remove and, moreover, adhesion of the structure elements after removal of the sacrificial layer can be prevented in the simplest manner possible, wherein it should be possible to carry out the method steps at the lowest temperatures possible so as to be able to use polymeric functional layers, for example, for forming a sensor or actuator. The aim is achieved by a method of the type in question and by a sensor or actuator of the type mentioned above, wherein the sacrificial layer is composed of at least one solid matter sublimating below the melting temperature thereof at a sublimation rate of at least 1 nm/h, and wherein the sublimating solid matter has a melting temperature ranging between 18°C and 200°C.
PCT/IB2010/055362 2009-11-25 2010-11-23 Method for producing at least one cavity in a microelectronic and/or micromechanical structure and a sensor or actuator comprising such a cavity WO2011064716A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910044645 DE102009044645A1 (en) 2009-11-25 2009-11-25 Method for producing at least one cavity in a microelectronic and / or micromechanical structure and sensor or actuator having such a cavity
DEDE102009044645.1 2009-11-25

Publications (2)

Publication Number Publication Date
WO2011064716A2 WO2011064716A2 (en) 2011-06-03
WO2011064716A3 true WO2011064716A3 (en) 2011-10-27

Family

ID=43901780

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/055362 WO2011064716A2 (en) 2009-11-25 2010-11-23 Method for producing at least one cavity in a microelectronic and/or micromechanical structure and a sensor or actuator comprising such a cavity

Country Status (2)

Country Link
DE (1) DE102009044645A1 (en)
WO (1) WO2011064716A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20110995A1 (en) * 2011-05-31 2012-12-01 Ione METHOD FOR THE PRODUCTION OF MONOLITHIC THREE-DIMENSIONAL MICROFLUID DEVICES
DE102012200983A1 (en) 2011-12-23 2013-06-27 Continental Automotive Gmbh Sensor element with air pressure measurement
DE102015210659A1 (en) * 2015-06-11 2016-12-15 Robert Bosch Gmbh Method of making a solid electrolyte sensing element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849070A (en) * 1988-09-14 1989-07-18 The United States Of America As Represented By The Secretary Of The Army Process for fabricating three-dimensional, free-standing microstructures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731229A (en) * 1994-06-28 1998-03-24 Nissan Motor Co., Ltd. Method of producing device having minute structure
DE19511340C1 (en) 1995-03-28 1996-10-02 Hans Michael Hangleiter Process for temporarily sealing or solidifying materials
US6140200A (en) * 1998-09-02 2000-10-31 Micron Technology, Inc. Methods of forming void regions dielectric regions and capacitor constructions
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
JP4574145B2 (en) * 2002-09-13 2010-11-04 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Air gap formation
WO2004042797A2 (en) * 2002-11-01 2004-05-21 Georgia Tech Research Corporation Sacrificial compositions, methods of use thereof, and methods of decomposition thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849070A (en) * 1988-09-14 1989-07-18 The United States Of America As Represented By The Secretary Of The Army Process for fabricating three-dimensional, free-standing microstructures

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
GUERIN L J ET AL: "Simple and low cost fabrication of embedded micro-channels by using a new thick-film photoplastic", TRANDUCERS 97. 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS; 16-19 JUNE 1997; CHICAGO, IL, USA; [INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS. DIGEST OF TECHNICAL PAPERS], IEEE, NEW YORK, NY, USA, vol. 2, 16 June 1997 (1997-06-16), pages 1419 - 1422, XP010240751, ISBN: 978-0-7803-3829-6, DOI: DOI:10.1109/SENSOR.1997.635730 *
SERRA N ET AL: "Screen-printed polymer-based microfluidic and micromechanical devices based on evaporable compounds", EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE. PROCEEDINGS OF IMAPS, 15 June 2009 (2009-06-15), pages 1 - 5, XP031534317, ISBN: 978-1-4244-4722-0 *

Also Published As

Publication number Publication date
WO2011064716A2 (en) 2011-06-03
DE102009044645A1 (en) 2011-05-26

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