WO2011064180A1 - Lampe à led munie d'un culot à broches pour lampes halogènes ('bipin') - Google Patents

Lampe à led munie d'un culot à broches pour lampes halogènes ('bipin') Download PDF

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Publication number
WO2011064180A1
WO2011064180A1 PCT/EP2010/067966 EP2010067966W WO2011064180A1 WO 2011064180 A1 WO2011064180 A1 WO 2011064180A1 EP 2010067966 W EP2010067966 W EP 2010067966W WO 2011064180 A1 WO2011064180 A1 WO 2011064180A1
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WO
WIPO (PCT)
Prior art keywords
led lamp
led
lamp according
platform
chip
Prior art date
Application number
PCT/EP2010/067966
Other languages
German (de)
English (en)
Inventor
Paul Hartmann
Original Assignee
Tridonic Jennersdorf Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Jennersdorf Gmbh filed Critical Tridonic Jennersdorf Gmbh
Priority to EP10779317A priority Critical patent/EP2504615A1/fr
Publication of WO2011064180A1 publication Critical patent/WO2011064180A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Definitions

  • the invention relates to an LED lamp with at least one LED, which has a lamp base with pins for plugging in usual pen versions for halogen lamps.
  • the LED lamp can be used for example as a low-voltage or 20-volt halogen lamp replacement.
  • the bipin-foot standardization (English: 2 pin, bipin cap of bipin socket) is standard in lamp bases for halogen lamps.
  • Incandescent and halogen lamps are available in various designs. A replacement of the original light source by LED retrofit lamps is increasingly common and available from different manufacturers, mostly based on a bulb size for E14 or E27 sockets.
  • LED retrofit lamps for pencil holders as a substitute for the smaller halogen lamps, especially for halogen pencil lamps
  • sufficient cooling can be achieved via the separate heat sink within the housing of the lamp.
  • this requires a much larger design, or is only possible up to an extremely low light output, if you want to realize the standard small sizes.
  • cooling is a problem if you want to come to even smaller designs, such as those for G4 or G6, 5-pin socket are common, as these consist of only two plugs and a glass bulb (see Fig. 5 b).
  • the supplied electrical power which is in particular conventional AC mains or low-voltage DC, to adapt the operating characteristics of the LED.
  • LED retrofit lamps for DC-DC conversion must be incorporated into the LED retrofit lamps for halogen lamp replacement, which are to be connected directly in the LED, which further aggravates the space problem.
  • Conventional LED retrofit lamps according to the prior art are therefore either too large to be used in accordance with Pin-base lamps designed to fit (Figure 6c), or they provide far too little light output ( Figures 6a, 6b) or both.
  • the invention is therefore based on the object to provide an LED lamp, which ensures effective heat dissipation and electronics for correct operation of the LED lamp in a very limited space.
  • the invention thus relates to an LED lamp with two pins for electrically contacting the LED lamp, comprising at least one platform, which has a substrate with at least one LED chip and at least one cooling element.
  • the at least one LED chip is mounted directly or indirectly on the substrate of the platform.
  • at least one electronic component is integrated, which is part of the electrical circuit that supplies the at least one LED.
  • the at least one cooling element below the at least one platform in the region of Connection pins arranged.
  • the substrate is preferably made of silicon or of ceramic (for example of an LTCC ceramic), in order to ensure integration of components and the best possible heat dissipation.
  • the at least one electronic component is one
  • Circuit component of a DC-DC circuit which converts a DC input voltage into a suitable for the operation of the at least one LED DC voltage.
  • the at least one electronic component is one
  • Circuit component of an AC-DC circuit Circuit component of an AC-DC circuit.
  • the at least one LED has an average radiant power. It may be a light power of at least 0.1 watts, preferably at least 0.2 watts, more advantageously at least 0.4 watts.
  • the recorded electrical power is at least 0.5 watts, preferably at least 1 watts, more preferably at least 2 watts.
  • the at least one LED preferably has a size at which each dimension is less than or equal to 2.8 mm ⁇ 3.4 mm ⁇ 1.15 mm.
  • the platform may have a recess, at least one LED is preferably arranged in recess.
  • the at least one platform may be covered by a glass or plastic bulb.
  • the glass or plastic bulb has optical properties, such as
  • the at least one cooling element can be formed by the two connecting pins, or it can at least partially be used for heat dissipation. For this purpose, they may have reinforcements.
  • connection pins may be formed as pipes for heat dissipation in the interior of the tubes.
  • the at least one cooling element has micro-fluid channels.
  • the LED lamp may have a light sensor and a control circuit. With the help of these can be provided for a constant light intensity of at least one LED.
  • the LED lamp may include a thermal sensor and a control circuit. These are preferably designed to prevent overheating of the LED lamp and to carry out a temperature compensation.
  • the LED lamp can also have multiple platforms.
  • Each of the platforms preferably comprises at least one LED in each case.
  • the platforms are orthogonal or in opposite directions to each other.
  • the LEDs preferably radiate away from each other.
  • the LED lamp has the form and function of a halogen pen.
  • Fig. 1 shows a first embodiment of a
  • LED lamp according to the invention in a front and a side view
  • Fig. 2 shows a second embodiment of a
  • FIG. 3 shows a third embodiment of a
  • LED lamp according to the invention in a front and a side view
  • Fig. 4 shows a fourth embodiment of a
  • Fig. 5a shows one of the prior art
  • Fig. 5b shows one of the prior art
  • Figs. 6a to 6c show LED lamps of the prior art.
  • Fig. 1 shows a first embodiment of an LED lamp 1 according to the invention in a front view (left) and a side view (right).
  • the LED lamp 1 is designed in this embodiment for use as a LED retrofit lamp for halogen pencils.
  • the LED lamp can therefore be supplied with a 12V or 24V DC voltage, which is generated by an external power supply unit.
  • the LED lamp according to the invention can also be realized in other embodiments, such as e.g. as a compact bulb s with screw socket, as used in flashlights, among others.
  • the advantageous effect of the invention namely a space-saving design that integrates the necessary control electronics and ensures efficient heat dissipation, can also be meaningfully used in larger lamps, such as in LED retrofit lamps with E27 screw threads or LED retrofit tubes ,
  • the LED lamp from Fig.l thus has a lamp cap with two pins 7. These serve the electrical power supply of the LED lamp 1. At the same time a mechanical fixation of the LED lamp 1 is ensured via the contacting of the pins 7.
  • the pins can also be designed so that they are suitable for a Baj onettverInstitut.
  • Suitable lamp sockets are in particular those according to the Bipin-foot standardization, which are typical for lamp sockets for halogen lamps, for example.
  • the number refers to the pin distance of 4, 9 or 10mm.
  • the pin spacing may, for example, be between 2 and 20 mm, preferably between 4 and 10 mm.
  • the pin diameter can be between 0.6mm and 1.7mm.
  • the LED lamp 1 on a platform 3. This is preferably mounted on the ends of the two pins 7 and electrically contacted with these suitably.
  • the platform is preferably designed for surface mounting (smt: surface mounted technology) of electronic components and / or for through-hole mounting (tht: through hole technology).
  • surface mounting surface mounted technology
  • tht through hole technology
  • PCB printed circuit board
  • the platform 3 has at least one substrate 9 at least in one area. This is preferably mounted on the platform by surface mounting or through-hole mounting.
  • the entire platform consists of silicon and thus the platform 3 and the silicon substrate 9 are an integral part. In this case, electronic components integrally in the platform by known
  • the substrate may be made of ceramic.
  • the LED lamp has at least one LED chip 4.
  • This can be a LED chip or a variety of Acting LED chips, which together with an additional carrier (not shown), for example, silicon or ceramic, an LED module.
  • the at least one LED 4 can therefore be located on an additional substrate (not shown in FIG. 1).
  • the LED or the LED module 4 can also be mounted directly on the substrate 9 or on the platform 3.
  • the LED is an integral part of the substrate 9.
  • the LED 4 may thus have been grown in face-up orientation on the substrate by known semiconductor technologies.
  • the LED lamp emits white light.
  • a combination of red, green and blue LEDs can be used, which is often called the RGB module.
  • the platform 3 and the silicon substrate 9 are larger in area than the at least one LED 4 and so protrude beyond the LED surface. In this case, as shown in Fig. 1, the platform 3 forms a recess 11 in which the LED 4 is located.
  • the walls 10 of the platform to the left and to the right of the LED 4 are sloping sloping, but may also be rounded or formed vertically.
  • the walls 10 are reflective
  • the recess is preferably deeper than the height of the LED 4.
  • the recess 11 is further filled with a substantially transparent material, such as silicone or other plastic.
  • the transparent material may comprise color conversion agents and / or diffuser particles. It is also possible for the color conversion agents and / or diffuser particles to be incorporated in different layers and / or in horizontally varying concentrations.
  • both bonding wires as indicated in Fig.l, or even a turn-mounting (flip-chip assembly) with Maisierhügel (bumps) can be applied, as is customary in a face-down orientation of the LED.
  • the electrical contacting can also be effected by one or more plated-through holes.
  • the LED 4 also preferably has dimensions that each does not exceed a size of 2.8 mm x 3.4 mm x 1.15 mm. In addition, if possible, it has an average radiation power of at least 0.1 watt, preferably 0.2 watt or more.
  • the LED lamp has at least one, to the LED 4 additional, electronic component.
  • This is preferably integrated in the substrate. It can, however also on, in, or mounted under the platform 3. It is also conceivable that it is arranged in the wall 10 of the carrier plate 3.
  • the electronic component preferably has very small dimensions.
  • the electronic component is an electronic component that is part of the control circuit of the LED 4.
  • the electronic component is an ESD protection diode.
  • the component is part of the drive circuit of the LED 4.
  • the at least one electronic component is at least indirectly electrically contacted with the pins 7 (not shown in Fig.l).
  • suitable means may be used, such as a via.
  • the drive circuit Based on the fact that the LED lamp 1 is supplied with a low-voltage DC input voltage, the drive circuit thus performs a DC-DC conversion, in which the current and voltage parameters of the supply voltage are adjusted so that they are suitable for operating the LED 4 are. It is also possible that the electronic component is an integrated circuit. It is also conceivable that an ASIC, a microcontroller or a hybrid solution is used.
  • the LED lamp with DC voltage, for example, 1.2 V or 3.6 V, powered by a battery.
  • the at least one electrical component may also be a sensor.
  • a light sensor comes into consideration. This can be used to detect the ambient light intensity and / or the luminous intensity of the LED lamp 1.
  • the electronic component can now have a control loop. With the help of the feedback signal of the light sensor and the control circuit so a compensation of the luminous intensity of the LED lamp can be effected in which, for example, a constant luminous intensity of the LED lamp or a constant ambient light intensity is ensured.
  • the LED lamp has means for communicating.
  • the LED lamp additionally has a communication interface, for example a radio interface, wherein it may be located on the substrate or on the carrier board.
  • a central control unit provides the user with information about the lighting system consisting of the at least one LED lamp 1 and the central control unit, and, in addition, control, for example the intensity of the illumination, can be made via the central control unit ,
  • the senor may also be a temperature sensor.
  • the control circuit shown above is also designed to perform a temperature compensation, by means of the feedback signal of the temperature sensor, a favorable operating temperature of the LED 4 can be ensured and / or overheating of the LED lamp 1, for example by dimming the luminous intensity or by emergency shutdown, be prevented.
  • the LED lamp is not on a halogen lamp replacement
  • Low voltage DC voltage is supplied, limited, but the LED lamp can also be designed as a bulb replacement. In this case, it is necessary to rectify and reduce a line AC voltage. It is conceivable to integrate electronic components of the AC / DC converter into the platform 3 and / or the substrate 9. It is also possible to use transformer chips integrated into the platform 3 and / or the substrate 9 for this purpose.
  • a high-voltage AC LED in the LED lamp, which can be operated directly, for example, to 110V AC or 230V AC.
  • the LED lamp, or at least the platform 3 is protected by a translucent cover 2, which preferably has a pear, ball or lens shape.
  • the cover may be made of glass, ceramic or a plastic.
  • the cover preferably completely encloses the platform with the elements therein, such as the LED 4, the substrate 9 and the electronic component 5, so that only the connection pins 7 are exposed.
  • the cover can be either clear, ie transparent, or matt. For the latter case, the use of diffuser particles in the cover or a diffuser are conceivable.
  • the cover has further optical properties, such as a lens characteristic.
  • the Cover may be structured, for example, the surface may be structured so that emitted light is directed in a certain direction or by a diffuser effect more homogeneous light is generated.
  • parts of the lamp may form a reflector.
  • the reflective property can also be perceived by an additional reflector in which the platform is suitably embedded.
  • the reflector can be mounted inside the lamp cover, or outside.
  • the LED lamp 1 still has one or more cooling elements 6. These serve to dissipate the heat generated by the LED 4 and by the electrical component 5, and thus to ensure an optimum operating temperature of the LED lamp 1, in which overheating is avoided.
  • two cooling elements 6 are formed by the pins 7.
  • the pins are thus used in addition to their original function in an advantageous manner for cooling the LED lamp.
  • This use of the pins is particularly useful because the pins touch the surface area and so efficiently dissipate heat from this. It is also conceivable that they touch the substrate 9 areally.
  • an additional plate of highly heat-conductive material for example of metal or ceramic
  • a heat dissipation via the walls 10 can take place. For this they can be covered, for example, with a metal layer.
  • each pin 7 can once again have a reinforcement 12 below the cover 2, these reinforcements are to be isolated from each other electrically.
  • the reinforcements may be formed as platelets which lie flush against the cover 3.
  • connection pins 7 are designed as heat pipes.
  • the terminal pins so hollow chambers, through which the heat can escape.
  • the cooling element for example, have micro-fluid channels.
  • the hollow chambers of the pins 7 can be used.
  • the liquid is preferably agitated.
  • the channels should form a circuit in which the liquid circulates.
  • FIG. 2 shows a second embodiment of an LED lamp according to the invention in a front and a side view.
  • the embodiment is identical to that of Fig.l, in which case the LED lamp has two platform 3. These are arranged adjacent to each other. The recesses 11 of the two platform 3 are aligned so that the emitted light shines in the opposite direction. Thus, in a very compact structure, a high luminosity can be achieved with a larger beam angle of the LED lamp 1.
  • the two platforms 3 are covered by a cover 2 having the characteristics described above.
  • the connection pins 7, which form the conductors for the power supply of the LED lamp 1, are arranged between the two carrier boards in order to supply both with electric current. If the terminal pins 7 extend over the entire length of the two platform 3, as shown in Figure 2, a heat dissipation can be increased by these advantageously.
  • the platform 3 has all the features as shown in the description of Fig.l. It is conceivable, however, that only one platform has one or more electronic components 5 with which all LEDs of both platforms are operated or regulated. In addition, both platforms can be integrally formed. This could be done, for example, by means of a surface mounting board (smt: surface mounted technology) realize that is equipped on both sides. It is also conceivable that both platforms are integrally formed and have only one substrate. This could then have all LEDs 4 of the LED lamp, which are oriented in the opposite direction, as well as the electronic component.
  • a cooling element 6 is further shown, which is an independent of the pins 7 part. This may represent a passive and / or an active cooling element as described above. Preferably, the cooling element fills the entire space below the cover 2 from. Furthermore, it is advantageous if it includes the two pins 7 so as to dissipate the radiant heat through them. As indicated in Figure 2 in the front view, the cooling element can also surround the two platforms laterally. Thus, the heat dissipation is increased and yet the beam angle of the light is not limited.
  • the cooling element may have a surface structure which increases the surface and thus the heat dissipation.
  • the LED lamp can also have a plurality of cooling elements 6, these being separated from one another by louvers. Thus, the heat dissipation can also be increased.
  • Fig. 3 shows a third embodiment of a
  • LED lamp according to the invention in a front and a side view.
  • the embodiment is identical to that of Figure 2, which additionally has a third platform 13 here.
  • the latter is located above the other two platforms 13. It is aligned orthogonal to the two platforms.
  • the LED Lamp three main emission direction, namely to the left, right and above.
  • the luminosity and the beam angle of the LED lamp 1 can therefore be further increased.
  • the two pins 7 are extended so far that they contact the third platform 13.
  • they may extend over the entire lands of the third platform 13, of course, being electrically isolated from each other.
  • the LED lamp 1 can thus have a gap between the individual platform 3, 13, which are at least partially, but advantageously completely, filled by the connecting pins, these of course being electrically insulated from one another.
  • the connection pins in the region of the gap can have planar shapes.
  • the cooling element 6, as shown in the front view in Figure 3, can again enclose the two platform laterally. It is also conceivable that it will be further extended and thus also surrounds at least part of the third platform 13.
  • Fig. 4 shows a fourth embodiment of an LED lamp according to the invention in a front and a side view.
  • the embodiment is identical to that of Figure 3, wherein in this embodiment, the LED lamp 1 five platforms 3, 13 has. These are accordingly oriented orthogonal to each other in five different directions, ie to the left, right, front, back and top.
  • the space between the platforms can be used for electronic components and for means for heat removal, for example the connection pins 7 and / or the separate cooling element 6. It can also be shaped as a cube, which has the shape and features of the platform 3, 13 on 5 sides.
  • the cooling element 6 may consist of a plastic and / or of a semiconductor material such as silicon.
  • the cooling element 6 is located only in the area below the platform. It is conceivable, however, that it also extends into the angular ranges between the individual platforms. It can only form a layer, for example of a metal, or completely fill the space in the angle ranges.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne une lampe à LED (1) munie de deux broches de raccordement (7) pour la mise en contact électrique de la lampe à LED (1), ladite lampe à LED comprenant au moins une plateforme (3) qui présente un substrat en silicium (9) comportant au moins une LED (4) et au moins un élément de refroidissement (6). La ou les LED (4) sont montées directement ou indirectement sur le substrat de silicium (9) de la plateforme (3). Au moins un composant électronique (5) qui fait partie du circuit électrique alimentant la ou les LED (4) est intégré dans la ou les plateformes (3), de préférence dans le substrat de silicium (9). Par ailleurs, le ou les éléments de refroidissement (6) sont placés sous la ou les plateformes (3) dans la zone des broches de raccordement (7).
PCT/EP2010/067966 2009-11-25 2010-11-23 Lampe à led munie d'un culot à broches pour lampes halogènes ('bipin') WO2011064180A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10779317A EP2504615A1 (fr) 2009-11-25 2010-11-23 Lampe à led munie d'un culot à broches pour lampes halogènes ('bipin')

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102009055814.4 2009-11-25
DE102009055814 2009-11-25
DE102010000738A DE102010000738A1 (de) 2009-11-25 2010-01-08 LED-Lampe mit Stiftsockel für Halogenlampen (Bipin)
DE102010000738.2 2010-01-08

Publications (1)

Publication Number Publication Date
WO2011064180A1 true WO2011064180A1 (fr) 2011-06-03

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Country Link
EP (1) EP2504615A1 (fr)
DE (1) DE102010000738A1 (fr)
WO (1) WO2011064180A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010031008A1 (de) * 2010-07-06 2012-01-12 Osram Gesellschaft mit beschränkter Haftung LED-Leuchte

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028971A1 (fr) * 1997-05-15 1999-06-10 Cis Institut Für Mikrosensorik Composant electronique hybride et procede permettant de le produire
DE202007003679U1 (de) * 2007-03-09 2007-05-16 Hong Kuan Technology Co., Ltd., Sinjhuang City Leuchtdiodenlampe
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DE202007003679U1 (de) * 2007-03-09 2007-05-16 Hong Kuan Technology Co., Ltd., Sinjhuang City Leuchtdiodenlampe
EP1988577A1 (fr) 2007-04-30 2008-11-05 LEXEDIS Lighting GmbH Module DEL à plateforme de silicium
EP2083210A1 (fr) * 2008-01-23 2009-07-29 Civilight Shenzhen Semiconductor Lighting Co., Ltd Lampe à DEL

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