WO2011061111A3 - Method for producing silver-containing structures, products comprising silver-containing structures and use of the same - Google Patents

Method for producing silver-containing structures, products comprising silver-containing structures and use of the same Download PDF

Info

Publication number
WO2011061111A3
WO2011061111A3 PCT/EP2010/067272 EP2010067272W WO2011061111A3 WO 2011061111 A3 WO2011061111 A3 WO 2011061111A3 EP 2010067272 W EP2010067272 W EP 2010067272W WO 2011061111 A3 WO2011061111 A3 WO 2011061111A3
Authority
WO
WIPO (PCT)
Prior art keywords
silver
substrate
containing structures
composition
chemical
Prior art date
Application number
PCT/EP2010/067272
Other languages
German (de)
French (fr)
Other versions
WO2011061111A2 (en
Inventor
Volker Arning
Jürgen STEIGER
Original Assignee
Evonik Degussa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa Gmbh filed Critical Evonik Degussa Gmbh
Publication of WO2011061111A2 publication Critical patent/WO2011061111A2/en
Publication of WO2011061111A3 publication Critical patent/WO2011061111A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Abstract

The present invention relates to a method for producing a silver-containing structure of at least one chemical silver compound, comprising the steps: a) providing a substrate, b) applying a composition containing the chemical silver compound on the substrate, c) optionally drying the substrate coated with the composition, and d) converting at least a part of the composition containing the chemical silver compound on the substrate into a silver-containing structure, wherein the chemical silver compound is silver lactate and the conversion is carried out by i) exposing the part of the silver lactate-containing composition, which is to be converted, on the substrate to a radiation selected from an electromagnetic radiation and an electron radiation and ii) supplying thermal energy to the entire coated substrate. The invention further relates to electric and electronic products comprising said silver-containing structures and to the use of said silver-containing structures.
PCT/EP2010/067272 2009-11-19 2010-11-11 Method for producing silver-containing structures, products comprising silver-containing structures and use of the same WO2011061111A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009053943.3 2009-11-19
DE102009053943A DE102009053943A1 (en) 2009-11-19 2009-11-19 Process for the production of silver-containing structures, the silver-containing structures and their use

Publications (2)

Publication Number Publication Date
WO2011061111A2 WO2011061111A2 (en) 2011-05-26
WO2011061111A3 true WO2011061111A3 (en) 2012-03-01

Family

ID=43902003

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/067272 WO2011061111A2 (en) 2009-11-19 2010-11-11 Method for producing silver-containing structures, products comprising silver-containing structures and use of the same

Country Status (3)

Country Link
DE (1) DE102009053943A1 (en)
TW (1) TW201132794A (en)
WO (1) WO2011061111A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043668B4 (en) 2010-11-10 2012-06-21 Evonik Degussa Gmbh Process for producing indium oxide-containing layers, indium oxide-containing layers produced by the process and their use
PL234389B1 (en) * 2017-12-04 2020-02-28 Akademia Gorniczo Hutnicza Im Stanislawa Staszica W Krakowie Device and method for conducting photochemical reaction in a displaceable meniscus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5517338A (en) * 1992-10-20 1996-05-14 Monsanto Company Composite mirrors
JPH10312715A (en) * 1997-05-13 1998-11-24 Sumitomo Osaka Cement Co Ltd Transparent conductive film and its manufacture
US20080020572A1 (en) * 2006-07-20 2008-01-24 Xerox Corporation Electrically conductive feature fabrication process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2461338C (en) * 2001-10-05 2011-12-20 Superior Micropowders, Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5517338A (en) * 1992-10-20 1996-05-14 Monsanto Company Composite mirrors
JPH10312715A (en) * 1997-05-13 1998-11-24 Sumitomo Osaka Cement Co Ltd Transparent conductive film and its manufacture
US20080020572A1 (en) * 2006-07-20 2008-01-24 Xerox Corporation Electrically conductive feature fabrication process

Also Published As

Publication number Publication date
TW201132794A (en) 2011-10-01
WO2011061111A2 (en) 2011-05-26
DE102009053943A1 (en) 2011-05-26

Similar Documents

Publication Publication Date Title
WO2009157727A3 (en) Conductive paste composition and method of preparing electrode using the same
MX2009005369A (en) Process for preparation of alkoxys i lan es.
WO2010127764A3 (en) Method for contacting a semiconductor substrate
UA100712C2 (en) Method for producing an enamelled steel substrate
EP2458031A4 (en) Chromium- and fluorine-free chemical conversion treatment solution for metal surfaces, metal surface treatment method, and metal surface coating method
WO2012094436A3 (en) Electronic components on paper-based substrates
JP2010045353A5 (en)
WO2010043414A3 (en) Fluorescence collector and use thereof
WO2012138186A3 (en) Silver paste composition for forming an electrode, and method for preparing same
WO2010115213A3 (en) Corrosion-resistant anodes, devices including the anodes, and methods of using the anodes
WO2011054611A3 (en) Method for the self-assembly of electrical, electronic or micromechanical components on a substrate
WO2009041660A1 (en) Substrate for solar cell and solar cell
WO2007147184A3 (en) Method for producing photoactive layers and components comprising said layer(s)
JP2012251241A5 (en)
WO2012011023A3 (en) Dye solar cell with improved stability
WO2011092017A8 (en) Method for producing a coated item by means of texture etching
EP2442367A3 (en) Improved method for forming metal contacts
WO2008129979A1 (en) Organic el device
WO2011061111A3 (en) Method for producing silver-containing structures, products comprising silver-containing structures and use of the same
WO2010051789A3 (en) Method for producing an organic radiation-emitting component and organic radiation-emitting component
WO2008096728A1 (en) Process for producing superconducting oxide material
WO2009145442A3 (en) Apparatus for forming metal thin film and method for forming metal thin film using same
WO2011107094A3 (en) Solar cell having dielectric back reflective coating and method for the production thereof
MX2012001151A (en) Method for producing coating having desired gloss value.
WO2010093622A3 (en) Substrate for semiconductor device and method for its manufacture

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10775831

Country of ref document: EP

Kind code of ref document: A2