WO2011052941A3 - Etching composition for texturing crystalline silicon-based wafer - Google Patents

Etching composition for texturing crystalline silicon-based wafer Download PDF

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Publication number
WO2011052941A3
WO2011052941A3 PCT/KR2010/007323 KR2010007323W WO2011052941A3 WO 2011052941 A3 WO2011052941 A3 WO 2011052941A3 KR 2010007323 W KR2010007323 W KR 2010007323W WO 2011052941 A3 WO2011052941 A3 WO 2011052941A3
Authority
WO
WIPO (PCT)
Prior art keywords
crystalline silicon
etching composition
based wafer
texturing
texturing crystalline
Prior art date
Application number
PCT/KR2010/007323
Other languages
French (fr)
Other versions
WO2011052941A2 (en
Inventor
Hyung-Pyo Hong
Jae-Youn Lee
Dae-Sung Lim
Seung-Yong Lee
Original Assignee
Dongwoo Fine-Chem Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongwoo Fine-Chem Co., Ltd. filed Critical Dongwoo Fine-Chem Co., Ltd.
Publication of WO2011052941A2 publication Critical patent/WO2011052941A2/en
Publication of WO2011052941A3 publication Critical patent/WO2011052941A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

Disclosed is an etching composition for texturing a crystalline silicon-based wafer, including (A) 0.1 ~ 20 wt% of at least one alkaline compound, (B) 0.1 ~ 50 wt% of at least one cyclic compound having a boiling point of 100 ~ 400°C, and (C) the remainder of water, based on the total weight of the composition.
PCT/KR2010/007323 2009-10-26 2010-10-25 Etching composition for texturing crystalline silicon-based wafer WO2011052941A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20090101698 2009-10-26
KR10-2009-0101698 2009-10-26

Publications (2)

Publication Number Publication Date
WO2011052941A2 WO2011052941A2 (en) 2011-05-05
WO2011052941A3 true WO2011052941A3 (en) 2011-10-27

Family

ID=43922785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007323 WO2011052941A2 (en) 2009-10-26 2010-10-25 Etching composition for texturing crystalline silicon-based wafer

Country Status (2)

Country Link
TW (1) TW201118154A (en)
WO (1) WO2011052941A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014534630A (en) * 2011-10-19 2014-12-18 ドングウー ファイン−ケム カンパニー、 リミテッドＤｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． Texture etching solution composition for crystalline silicon wafer and texture etching method
US8765001B2 (en) 2012-08-28 2014-07-01 Rohm And Haas Electronic Materials Llc Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance
TWI480264B (en) * 2013-04-12 2015-04-11 Daxin Materials Corp Liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element and method of manufacturing the same
CN104911037A (en) * 2015-07-03 2015-09-16 高旭 Cleaning fluid for industrial products

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980024804A (en) * 1996-09-20 1998-07-06 하라 타카시 Resin Etching Solution and Etching Method
KR20050043928A (en) * 2002-09-04 2005-05-11 메르크 파텐트 게엠베하 Etching pastes for silicon surfaces and layers
KR100718527B1 (en) * 2006-04-12 2007-05-16 테크노세미켐 주식회사 Stripper composition for negative photoresist

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980024804A (en) * 1996-09-20 1998-07-06 하라 타카시 Resin Etching Solution and Etching Method
KR20050043928A (en) * 2002-09-04 2005-05-11 메르크 파텐트 게엠베하 Etching pastes for silicon surfaces and layers
KR100718527B1 (en) * 2006-04-12 2007-05-16 테크노세미켐 주식회사 Stripper composition for negative photoresist

Also Published As

Publication number Publication date
TW201118154A (en) 2011-06-01
WO2011052941A2 (en) 2011-05-05

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