WO2011050550A1 - 一种led灯具外壳 - Google Patents

一种led灯具外壳 Download PDF

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Publication number
WO2011050550A1
WO2011050550A1 PCT/CN2009/075953 CN2009075953W WO2011050550A1 WO 2011050550 A1 WO2011050550 A1 WO 2011050550A1 CN 2009075953 W CN2009075953 W CN 2009075953W WO 2011050550 A1 WO2011050550 A1 WO 2011050550A1
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WIPO (PCT)
Prior art keywords
heat
layer
led
heat conductive
led lamp
Prior art date
Application number
PCT/CN2009/075953
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English (en)
French (fr)
Inventor
沈李豪
Original Assignee
Shen Lihao
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Publication date
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Publication of WO2011050550A1 publication Critical patent/WO2011050550A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F21V21/30—Pivoted housings or frames
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to an LED lamp housing, in particular to an LED lamp having a heat dissipation function.
  • LED light-emitting diodes are solid-state semiconductor devices that convert electricity directly into light. Standard LEDs are undergoing a revolution. In order to protect energy and respond to global warming, some states in the United States and other countries have begun to ban the use of incandescent bulbs with low energy efficiency. Various new technologies are being used to replace incandescent bulbs, with compact vacuum fluorescent lamps (CFLs) being the main alternative. Although this CFL lamp consumes only 20% of the incandescent lamp, it contains toxic mercury. In contrast, LED lights provide a more efficient and environmentally friendly solution.
  • CFLs compact vacuum fluorescent lamps
  • LED light source has the advantages of using low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, multi-color illuminating, etc., although with the gradual improvement of white LED luminous efficiency, white LED application
  • the possibilities in the field of lighting are also growing, but to achieve the lumens required for lighting, no matter which method is used, it is subject to the technical problem of having to handle extremely high heat in a very small LED package. Restriction, if the component can not dissipate this heat, in addition to the problem that the various packaging materials will cause product reliability due to the difference in expansion coefficient between each other, the luminous efficiency of the chip will also decrease significantly with the increase of temperature, and cause Significantly shortened service life and improved lumens cost. therefore, How to dissipate the heat in the assembly has become an important issue in current LED applications.
  • the existing heat dissipation methods applied to LEDs generally use a heat sink on the LED to dissipate heat in a manner that increases the heat dissipation area.
  • the higher the power the larger the required heat sink area.
  • the large heat sink can not meet the heat dissipation requirements. Therefore, the heat generation problem of most LEDs is difficult to solve by relying solely on the heat sink, and there is still a large weight and a large volume.
  • a series of questions such as high cost such as the following:
  • Case 1 The technical proposal of the Chinese invention patent disclosed in Patent No. 200410047327. 0 is to first place the LED on the metal body, and then place the LED and the metal body on the heat sink, and the heat sink has a plurality of heat sink fins.
  • This type of passive heat dissipation can meet the heat dissipation requirements when the LED heat is relatively small, but when multiple LEDs are densely arranged or the LED power is relatively large, this heat dissipation method cannot effectively dissipate the LED.
  • Patent CN1807971A (Application No. 200610038143. 7) discloses a heat dissipation structure of a high-power high-brightness illumination lamp.
  • the principle is to use a fan to force convection, so that the heat on the back surface heat sink is quickly dissipated, thereby achieving the purpose of heat dissipation.
  • the life of the fan is limited, and the anti-shock performance and the stability of the work are all far from the LED. Therefore, the LED illuminator using the forced convection of the fan must have a technical bottleneck on the fan, which not only makes the LED itself have a long service life, but also works stably.
  • the advantages are difficult to play, and the LED lights will become complicated in assembly, and the total weight and cost will increase.
  • Case 3 An LED lighting bulb structure with a patent application number of 200820117326. 2, a bulb controller is disposed inside the lamp cap, the bottom surface of the bulb controller is fixed by an upper joint cover, and an inner sleeve is fixed on the bottom surface of the upper joint cover. a heat sink fin assembly and a lower joint cover, a bulb housing with a tray built therein is screwed around the lower joint cover, and a plurality of LED light groups corresponding to the plurality of heat pipes are protruded from the bottom surface of the tray; Thereby, the heat energy generated by the plurality of LED lamp groups is exchanged between the plurality of heat pipes and the heat dissipation fin group to separate the heat and the cold, and the structure can improve the heat dissipation effect.
  • its structure is complicated, it is difficult to assemble, and its overall weight is large, which is not easy to be widely used.
  • the utility model aims to overcome the defects of insufficient heat conduction and heat dissipation of the existing LED lamp housing, and to provide an LED lamp housing with better heat conduction and heat dissipation effect.
  • An LED lamp housing includes a housing for connecting a lamp cap and a lamp cover, the case comprising a heat conductive layer having a concave-convex structure and a paint layer having a heat dissipation function covering the outer side of the heat conductive layer.
  • the heat conducting layer having a concave-convex structure is formed by etching, electrolyzing, stamping or embossing using a heat conductive material, and is wavy, water-shaped or tooth-shaped, and the material thereof may be copper, aluminum or iron. , or stainless steel, or thermally conductive ceramics.
  • the coating layer having a heat-dissipating heat-dissipating function is applied by spraying or printing by an insulating, heat-dissipating polymer material or a ceramic material to which a heat-dissipating heat-dissipating material is added or a conventional PCB board ink to which a heat-conductive material is added.
  • the shell can also be plated on the shell by anodizing; the material and composition are different, and the color of the paint is different.
  • the paint layer can be colored with gold, silver or copper. Aesthetically beautiful colors.
  • the manufacturing method of the LED lamp housing comprises the following steps:
  • the surface of the heat conductive layer is formed into a concave-convex structure by etching, electrolysis, stamping or embossing.
  • Forming the heat conductive layer by means of stretching, forging, stamping, etc. (such as the shape of the bulb casing, PAR lamp housing, street lamp housing, lamp housing, etc.).
  • the color heat-dissipating heat-dissipating paint layer is either plated with a coating layer by anodizing.
  • the heat conductive layer with concave and convex structure made of heat conductive material can protect the LED chip, effectively increase the heat dissipation area of the heat conductive layer, improve the heat dissipation efficiency of the lamp, and prolong the service life of the lamp.
  • the paint layer on the shell is colored, can be gold, silver or copper, this color enriches the visual effect of the appearance of LED lamps.
  • Figure 1 is a schematic view of a light bulb of the present invention.
  • Figure 2 is a schematic illustration of the PAR lamp of the present invention.
  • Figure 3 is a schematic view of a 16 spotlight of the present invention.
  • FIG. 4 is a schematic view of a street lamp of the present invention.
  • Figure 5 is a schematic view of a table lamp of the present invention.
  • the LED bulb shown in FIG. 1 includes a lamp cap 20, a housing 01 and a lamp cover 30.
  • the housing 01 is disposed between the lamp cap 20 and the lamp cover 30 and together with them forms a closed space, which effectively protects the closed space.
  • the housing 01 is divided into a coating layer 02 and a heat conducting layer 04.
  • the heat conducting layer 04 is formed by stamping and drawing an aluminum block, and the outer layer is coated with an insulating, heat-dissipating and heat-dissipating polymer material on the heat conducting layer.
  • the entire housing 01 has a silver-toothed shape.
  • the role of the coating layer 02 is to accelerate the divergence of heat on the heat conducting layer 04, thereby rapidly reducing the temperature in the closed space and avoiding the continued increase in temperature.
  • the structural characteristics of the tooth profile more effectively expand the heat dissipation area and improve the heat dissipation efficiency.
  • the PAR lamp shown in FIG. 2 also includes a lamp cap 20, a housing 01 and a lamp cover 30.
  • the housing 01 is located between the lamp cap 20 and the lamp cover 30, and together with them, encloses a closed space, which effectively protects the closed space.
  • the housing 01 is divided into a coating layer 02 and a heat conducting layer 04.
  • the heat conducting layer 04 is formed by stamping and drawing copper, and the outer layer is coated with a material mixed with a conventional PCB board ink and a heat conductive material.
  • the heat conducting layer 04 is formed such that the entire casing 01 has a copper-colored watermark shape.
  • the role of the coating layer 02 is to accelerate the divergence of heat on the heat conducting layer 04, thereby rapidly reducing the temperature in the closed space and avoiding the continued increase in temperature.
  • the structural feature of the watermark shape more effectively expands the heat dissipation area and improves the heat dissipation efficiency.
  • the housing 01 of the MR16 spotlight shown in Fig. 3 is wavy
  • the housing 01 of the street lamp shown in Fig. 4 is The tooth-tooth shape
  • the housing 01 of the lamp shown in Fig. 5 is water-shaped.
  • the shape of the housing on these LED lamps is different, but the composition is the same, and they are divided into a thermal conductive layer 04 and a coating layer 02, but The materials and processing methods used are different, and the shape of the housing 01 can also be designed into different shapes depending on the specific situation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

一种 LED灯具外壳
技术领域 本实用新型涉及一种 LED灯具外壳， 尤指一种具有散热功能的 LED灯具外 说
壳。 书
背景技术
LED发光二极管， 是一种固态的半导体器件， 它可以直接把电转化为光， 标 准电灯正在经历一场革命。 出于保护能源和应对全球气候变暖的考虑， 美国一 些州和其它一些国家开始禁止使用低能效的白炽灯泡。 各种新技术正纷纷被用 于替换白炽灯泡， 其中紧凑型真空荧光灯 (CFL)是主要替代方案。 尽管这种 CFL 灯的功耗仅为白炽灯的 20%， 但却含有有毒物质汞。 相比之下， LED灯可以提供 更高效和更环保的解决方案。
LED光源具有使用低压电源、 耗能少、 适用性强、 稳定性高、 响应时间短、 对环境无污染、 多色发光等优点， 虽然说随着白光 LED发光效率的逐步提高， 将白光 LED应用在照明领域的可能性也越来越大， 但要达到照明所需要的流明 数， 无论是使用何种方法， 都会因为必须在极小的 LED封装中处理极高的热量 这一技术难题而受限制， 若组件无法散去这些热量， 除了各种封装材料会由于 彼此间膨胀系数的不同而产生产品可靠性的问题外， 芯片的发光效率还会随着 温度的上升而明显下降， 并造成其使用寿命明显缩短及流明造价提高。 因此， 如何散去组件中的热量， 成为目前 LED应用的重要课题。
现有的应用于 LED 上的散热方法一般都是在 LED 上加散热体， 以增大散 热面积的方式散热。 功率越大， 所需的散热片面积就越大， 有时很大的散热体 都满足不了散热需求， 所以大多数 LED 的发热问题单一依靠散热片难以解决， 并且还存在着大重量、 大体积、 成本较高等一系列问题， 举例说明如下：
案例一： 专利号为 200410047327 . 0 的中国发明专利公开的技术方案是 先将 LED 设置在金属体上， 再将 LED 和金属体设置于散热座上， 散热座上有 多个散热鳍脚。 这类被动散热的方案在 LED 发热比较小的情况下还可以满足散 热要求， 但是当多个 LED 密集排列或 LED 功率比较大的时候， 这种散热方式就 不能有效地对 LED 进行散热了。
案例二： 专利 CN1807971A (申请号 200610038143 . 7 ) 又公开了大功率 高亮度照明灯的散热结构， 其原理是利用风扇强制对流， 使其背面散热器上的 热量快速散发， 从而达到散热的目的。 然而风扇的寿命有限， 且防震性能和工 作稳定性能都与 LED存在巨大的差距， 因此， 使用风扇强制对流的 LED照明灯 必然在风扇上存在技术瓶颈， 不仅使 LED 本身的寿命长、 工作稳定等优势难以 发挥， 还会造成 LED灯在装配上变得复杂， 总重量及成本增加。
案例三： 专利申请号为 200820117326. 2的一种 LED 照明灯泡结构， 在灯 头内部设置有一灯泡控制器， 该灯泡控制器底面以一上接合盖固定， 在上接合 盖底面固定有一内部套设至少一支热导管的散热鳍片组及一下接合盖， 在该下 接合盖外周旋接一内置有托盘的灯泡壳体， 并在托盘底面外伸有对应多个热导 管的多个 LED 灯组； 藉此， 使多个 LED 灯组产生的热能， 经由多个热导管与 散热鳍片组的热冷交换， 让冷热分离， 此种结构虽然可以提高一定的散热效果, 但其结构复杂， 不易装配而且整体重量较大， 不易广泛应用。
实用新型内容
本实用新型的目的在于： 克服现有 LED灯具外壳导热散热性不足的缺陷， 提供一种导热散热效果更好的 LED灯具外壳。
本实用新型解决上述技术问题所采用的技术方案为：
一种 LED灯具外壳， 包括用于连接灯头和灯罩的壳体， 所述壳体包括具有 凹凸结构的导热层和导热层外侧覆盖的具有导热散热功能的涂料层。
具有凹凸结构的所述导热层是利用导热材料通过蚀刻、 电解、 冲压或压花 的方式制成的， 为波浪形、 水紋形或轮齿形， 其材质可为铜、 或铝、 或铁、 或 不锈钢、 或导热陶瓷。
具有导热散热功能的所述涂料层是由绝缘的、 易导热散热的高分子材料或 添加有导热散热材料的陶瓷材料或添加有导热材料的传统 PCB制板油墨通过喷 涂或印刷的方式涂覆于壳体上的， 也可通过阳极处理的方式镀于壳体上； 材料 及成分配置不同， 得出的涂料的颜色就不同， 由此， 涂料层可具有金色、 银色 或铜色等用于增强外观美感的颜色。
所述的一种 LED灯具外壳的制作方法， 包括如下步骤：
①按照传统印刷工艺的制作方法在未成型的灯具外壳的壳体上进行印刷或 涂布、 曝光、 显影的操作。
②通过蚀刻、 电解、 冲压或压花等方式使导热层表面形成凹凸结构。
③运用拉伸、 锻造、 冲压等方式使导热层成型 （如灯泡外壳、 PAR灯外壳、 路灯外壳、 台灯外壳等形状）。
④在导热层的外表面上通过喷涂、 电泳或印刷的方式涂覆一层具有不同颜 色的导热散热涂料层或是通过阳极处理的方式镀上涂料层。
相对于现有技术， 本实用新型具有如下有益效果：
1、 采用导热材料制成的具有凹凸结构的导热层， 即能保护 LED芯片， 又有 效地增大了导热层的散热面积， 提高了灯具的散热效率， 进而延长了灯具的使 用寿命。
2、 在导热层的外表面涂覆一层具有导热散热功能的涂料层， 当 LED照明灯 具的温度快速升高时， 该涂料层可迅速将导热层上的热量导出并散发到空气中, 进而提高了外壳的散热率和产品的可靠性。
3、 壳体上的涂料层是具有颜色的， 可为金色、 银色或铜色， 此颜色丰富了 LED灯具外观的视觉效果。 附图说明：
图 1 是本实用新型之灯泡的示意图。
图 2 是本实用新型之 PAR灯的示意图。
图 3 是本实用新型之 16射灯的示意图。
图 4 是本实用新型之路灯的示意图。
图 5是本实用新型之台灯的示意图。
图中：
01— 壳体， 02—涂料层，
04— 导热层， 20—灯头， 30—灯罩。 具体实施方式: 下面将结合附图对具体实施方式加以说明：
如图 1所示的 LED灯泡， 包括灯头 20、 壳体 01和灯罩 30， 壳体 01处在灯 头 20和灯罩 30之间， 并与它们共同围成一闭合空间， 该闭合空间有效地保护 了处于其内部的 LED芯片。其中，壳体 01分为涂料层 02和导热层 04，导热层 04 是由铝块经过冲压和拉伸制成的， 外层则由绝缘的、 易导热散热的高分子材料 涂覆于导热层 04上制成， 使得整个壳体 01呈银色的轮齿形。 当 LED芯片开始 工作， 其产生的热量的一部分会聚集在上述的闭合空间内， 致使空间内的温度 升高，升高的温度将会通过由导热层 04和涂料层 02组成的壳体 01传递到外界， 其中， 涂料层 02的作用是加速导热层 04上热量的发散， 从而迅速降低了闭合 空间内的温度， 避免了温度的继续升高。 此轮齿形的结构特点更有效地扩大了 其散热面积， 提高了散热效率。
如图 2所示的 PAR灯， 也包括灯头 20、 壳体 01和灯罩 30， 壳体 01处在灯 头 20和灯罩 30之间， 并与它们共同围成一闭合空间， 该闭合空间有效地保护 了处于其内部的 LED芯片。其中，壳体 01分为涂料层 02和导热层 04，导热层 04 是由铜经过冲压和拉伸制成的， 外层则由传统 PCB制板油墨和导热材料混合而 成的材料涂覆于导热层 04上制成， 使得整个壳体 01呈铜色的水紋形。 当 LED 芯片开始工作， 其产生的热量的一部分会聚集在上述的闭合空间内， 致使空间 内的温度升高， 升高的温度将会通过由导热层 04和涂料层 02组成的壳体 01传 递到外界， 其中， 涂料层 02的作用是加速导热层 04上热量的发散， 从而迅速 降低了闭合空间内的温度， 避免了温度的继续升高。 此水紋形的结构特点更有 效地扩大了其散热面积， 提高了散热效率。
如图 3所示的 MR16射灯的壳体 01为波浪形， 图 4所示的路灯的壳体 01为 轮齿形， 图 5所示的台灯的壳体 01为水紋形， 这些 LED灯上的壳体形状虽然不 同， 但其组成结构是一样的， 都分为导热层 04和涂料层 02， 只是其使用材料和 加工方法不一样而已， 并且壳体 01的形状也可根据具体情况设计成不同形状。
当然， 以上的实施例只是在于说明而不是限制本实用新型， 以上所述仅是 本实用新型的较佳实施例， 故凡依本实用新型申请范围所述的方法所做的等效 变化或修饰， 均包括于本实用新型申请范围内。

Claims

权 利 要 求 书
1、 一种 LED灯具外壳， 包括用于连接灯头和灯罩的壳体， 其特征在于： 所 述壳体包括具有凹凸结构的导热层和导热层外侧覆盖的具有导热散热功能的涂 料层。
2、 根据权利要求 1所述的一种 LED灯具外壳， 其特征在于： 具有凹凸结构 的所述导热层， 是由导热材料制成的， 为波浪形、 或水紋形、 或轮齿形。
3、 根据权利要求 2所述的一种 LED灯具外壳， 其特征在于： 所述导热材料 的材质为铜、 或铝、 或铁、 或不锈钢、 或导热陶瓷。
4、 根据权利要求 1所述的一种 LED灯具外壳， 其特征在于： 具有导热散热 功能的所述涂料层是具有颜色的， 为金色、 或银色、 或铜色。
PCT/CN2009/075953 2009-10-26 2009-12-24 一种led灯具外壳 WO2011050550A1 (zh)

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CN107701949A (zh) * 2017-10-27 2018-02-16 中山市修本照明有限公司 一种灯具外壳及其制作方法和灯具
CN109587300A (zh) * 2018-12-05 2019-04-05 科立视材料科技有限公司 一种装饰色导热涂层结构及其制备方法

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