WO2011021824A3 - 정전척 및 이의 제조 방법 - Google Patents

정전척 및 이의 제조 방법 Download PDF

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Publication number
WO2011021824A3
WO2011021824A3 PCT/KR2010/005408 KR2010005408W WO2011021824A3 WO 2011021824 A3 WO2011021824 A3 WO 2011021824A3 KR 2010005408 W KR2010005408 W KR 2010005408W WO 2011021824 A3 WO2011021824 A3 WO 2011021824A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
manufacturing same
base
insulating layer
electrode layer
Prior art date
Application number
PCT/KR2010/005408
Other languages
English (en)
French (fr)
Other versions
WO2011021824A2 (ko
Inventor
성진일
예경환
오치원
유충렬
Original Assignee
주식회사 코미코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코미코 filed Critical 주식회사 코미코
Priority to CN2010900011162U priority Critical patent/CN203055886U/zh
Priority to JP2012525475A priority patent/JP5421460B2/ja
Publication of WO2011021824A2 publication Critical patent/WO2011021824A2/ko
Publication of WO2011021824A3 publication Critical patent/WO2011021824A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

정전척은 베이스 기재와, 베이스 기재 상에 형성된 비정질의 제1 절연층과, 제1 절연층 상에 형성된 정전기력 발생용 전극층과, 전극층 상에 형성된 유전층을 포함한다. 따라서, 정전척은 누설 전류에 의한 아킹 발생을 억제하고 전기적 특성 및 내구성이 향상된다.
PCT/KR2010/005408 2009-08-21 2010-08-17 정전척 및 이의 제조 방법 WO2011021824A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010900011162U CN203055886U (zh) 2009-08-21 2010-08-17 静电吸盘
JP2012525475A JP5421460B2 (ja) 2009-08-21 2010-08-17 静電チャック及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0077369 2009-08-21
KR1020090077369A KR100997374B1 (ko) 2009-08-21 2009-08-21 정전척 및 이의 제조 방법

Publications (2)

Publication Number Publication Date
WO2011021824A2 WO2011021824A2 (ko) 2011-02-24
WO2011021824A3 true WO2011021824A3 (ko) 2011-07-07

Family

ID=43410233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005408 WO2011021824A2 (ko) 2009-08-21 2010-08-17 정전척 및 이의 제조 방법

Country Status (5)

Country Link
JP (1) JP5421460B2 (ko)
KR (1) KR100997374B1 (ko)
CN (1) CN203055886U (ko)
TW (1) TWI459500B (ko)
WO (1) WO2011021824A2 (ko)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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KR20120069069A (ko) * 2010-12-20 2012-06-28 (주)제니스월드 태양전지 화학기상증착장치 기판 운송용 트레이의 가공방법
KR101981766B1 (ko) * 2011-06-02 2019-05-23 어플라이드 머티어리얼스, 인코포레이티드 정전기 척 aln 유전체 수리
CN102610476B (zh) * 2012-03-12 2015-05-27 中微半导体设备(上海)有限公司 一种静电吸盘
KR101974386B1 (ko) * 2012-03-21 2019-05-03 주식회사 미코 정전척
CN103794445B (zh) * 2012-10-29 2016-03-16 中微半导体设备(上海)有限公司 用于等离子体处理腔室的静电夹盘组件及制造方法
CN104797979B (zh) * 2013-01-22 2018-04-17 Asml荷兰有限公司 静电夹具
US20140318455A1 (en) * 2013-04-26 2014-10-30 Varian Semiconductor Equipment Associates, Inc. Low emissivity electrostatic chuck
JP6104075B2 (ja) * 2013-06-28 2017-03-29 日本特殊陶業株式会社 真空吸着装置およびその製造方法
JP6120702B2 (ja) * 2013-06-28 2017-04-26 日本特殊陶業株式会社 真空吸着装置およびその製造方法
KR101385950B1 (ko) * 2013-09-16 2014-04-16 주식회사 펨빅스 정전척 및 정전척 제조 방법
US10497598B2 (en) 2014-02-07 2019-12-03 Entegris, Inc. Electrostatic chuck and method of making same
CN105448794B (zh) * 2014-08-13 2019-07-19 北京北方华创微电子装备有限公司 一种托盘及承载装置
US10325800B2 (en) * 2014-08-26 2019-06-18 Applied Materials, Inc. High temperature electrostatic chucking with dielectric constant engineered in-situ charge trap materials
US10020218B2 (en) * 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
CN107768300B (zh) * 2016-08-16 2021-09-17 北京北方华创微电子装备有限公司 卡盘、反应腔室及半导体加工设备
KR101694754B1 (ko) * 2016-09-08 2017-01-11 (주)브이앤아이솔루션 정전척 및 그 제조방법
CN108346611B (zh) * 2017-01-24 2021-05-18 中微半导体设备(上海)股份有限公司 静电吸盘及其制作方法与等离子体处理装置
KR102066271B1 (ko) * 2017-04-18 2020-01-14 단국대학교 천안캠퍼스 산학협력단 정전척 실링방법
JP6967944B2 (ja) * 2017-11-17 2021-11-17 東京エレクトロン株式会社 プラズマ処理装置
JP7401266B2 (ja) 2018-12-27 2023-12-19 東京エレクトロン株式会社 基板載置台、及び、基板処理装置
CN111383986A (zh) * 2018-12-27 2020-07-07 东京毅力科创株式会社 基板载置台及基板处理装置
WO2020182637A1 (en) * 2019-03-13 2020-09-17 Asml Holding N.V. Electrostatic clamp for a lithographic apparatus
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
KR102130442B1 (ko) * 2019-09-16 2020-07-06 주식회사 제스코 모바일 글래스 척의 제조 방법, 그에 따라 제조된 모바일 글래스 척 및 스마트폰의 모바일 패널을 모바일 글래스와 접합하는 방법
CN111900117A (zh) * 2019-12-31 2020-11-06 苏州芯慧联半导体科技有限公司 一种静电卡盘
KR102332730B1 (ko) * 2020-01-13 2021-12-01 (주)티티에스 정전척의 재생 방법
US11646216B2 (en) * 2020-10-16 2023-05-09 Applied Materials, Inc. Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
US11955360B2 (en) * 2020-12-24 2024-04-09 Tocalo Co., Ltd. Electrostatic chuck and processing apparatus
CN116262666B (zh) * 2022-12-29 2024-05-17 浙江省冶金研究院有限公司 一种氮化铝基陶瓷复合材料的制备方法及其在静电吸盘上的应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283607A (ja) * 1996-04-08 1997-10-31 Sumitomo Osaka Cement Co Ltd 静電チャック
JPH10116888A (ja) * 1996-07-19 1998-05-06 Applied Materials Inc 静電チャックとその製造方法
JPH10154745A (ja) * 1996-11-26 1998-06-09 Hitachi Ltd 静電吸着装置
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
JP2005057234A (ja) * 2003-07-24 2005-03-03 Kyocera Corp 静電チャック

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TW236709B (ko) * 1993-03-09 1994-12-21 Toto Ltd
US6529362B2 (en) * 1997-03-06 2003-03-04 Applied Materials Inc. Monocrystalline ceramic electrostatic chuck
US6215640B1 (en) * 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
KR20020046214A (ko) * 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
TW502368B (en) * 2001-11-06 2002-09-11 Duratek Inc Electrostatic chuck and method for manufacturing the same
TWI236084B (en) * 2003-03-20 2005-07-11 Duratek Inc Method for manufacturing an electrostatic chuck

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283607A (ja) * 1996-04-08 1997-10-31 Sumitomo Osaka Cement Co Ltd 静電チャック
JPH10116888A (ja) * 1996-07-19 1998-05-06 Applied Materials Inc 静電チャックとその製造方法
JPH10154745A (ja) * 1996-11-26 1998-06-09 Hitachi Ltd 静電吸着装置
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
JP2005057234A (ja) * 2003-07-24 2005-03-03 Kyocera Corp 静電チャック

Also Published As

Publication number Publication date
TWI459500B (zh) 2014-11-01
WO2011021824A2 (ko) 2011-02-24
TW201120988A (en) 2011-06-16
JP2013502721A (ja) 2013-01-24
JP5421460B2 (ja) 2014-02-19
KR100997374B1 (ko) 2010-11-30
CN203055886U (zh) 2013-07-10

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