WO2011002149A3 - Cmp polishing pad with pores formed therein, and method for forming pores - Google Patents

Cmp polishing pad with pores formed therein, and method for forming pores

Info

Publication number
WO2011002149A3
WO2011002149A3 PCT/KR2010/002729 KR2010002729W WO2011002149A3 WO 2011002149 A3 WO2011002149 A3 WO 2011002149A3 KR 2010002729 W KR2010002729 W KR 2010002729W WO 2011002149 A3 WO2011002149 A3 WO 2011002149A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
cmp
pores
polishing
pad
formed
Prior art date
Application number
PCT/KR2010/002729
Other languages
French (fr)
Korean (ko)
Other versions
WO2011002149A2 (en )
WO2011002149A9 (en )
Inventor
김칠민
Original Assignee
서강대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0066Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/0084Texturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Abstract

The present invention relates to a CMP polishing pad with pores formed therein, wherein the pores are formed in the CMP polishing pad using a laser by setting the focal point of the laser beam inside the CMP polishing pad. When pores are formed in a CMP polishing pad according to the method for forming pores of the present invention, a CMP polishing pad having excellent slurry-retaining characteristics can be manufactured because the polishing pad has a low hardness. Also, by forming pores through laser processing, the size and arrangement of pores can be freely controlled, such that the uniformity of CMP processing can be improved, and custom CMP polishing pads can be manufactured in accordance with the material to be CMP processed or with the process type.
PCT/KR2010/002729 2009-07-01 2010-04-30 Cmp polishing pad with pores formed therein, and method for forming pores WO2011002149A9 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20090059841A KR101177497B1 (en) 2009-07-01 2009-07-01 Chemical mechanical polishing pad with pore and method of making pore
KR10-2009-0059841 2009-07-01

Publications (3)

Publication Number Publication Date
WO2011002149A2 true WO2011002149A2 (en) 2011-01-06
WO2011002149A3 true true WO2011002149A3 (en) 2011-03-10
WO2011002149A9 true WO2011002149A9 (en) 2011-04-28

Family

ID=43411539

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002729 WO2011002149A9 (en) 2009-07-01 2010-04-30 Cmp polishing pad with pores formed therein, and method for forming pores

Country Status (2)

Country Link
KR (1) KR101177497B1 (en)
WO (1) WO2011002149A9 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101706313B1 (en) * 2014-08-05 2017-02-13 부산대학교 산학협력단 Micro-porous Structure and Method for Manufacturing the Same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082288A1 (en) * 1999-05-03 2004-04-29 Applied Materials, Inc. Fixed abrasive articles
US20070173187A1 (en) * 2001-02-08 2007-07-26 Inha Park Chemical mechanical polishing pad with micro-holes
US20080146129A1 (en) * 2006-12-08 2008-06-19 Makoto Kouzuma Fast break-in polishing pad and a method of making the same
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082288A1 (en) * 1999-05-03 2004-04-29 Applied Materials, Inc. Fixed abrasive articles
US20070173187A1 (en) * 2001-02-08 2007-07-26 Inha Park Chemical mechanical polishing pad with micro-holes
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US20080146129A1 (en) * 2006-12-08 2008-06-19 Makoto Kouzuma Fast break-in polishing pad and a method of making the same

Also Published As

Publication number Publication date Type
WO2011002149A2 (en) 2011-01-06 application
KR20110002313A (en) 2011-01-07 application
WO2011002149A9 (en) 2011-04-28 application
KR101177497B1 (en) 2012-08-27 grant

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