WO2010147555A1

WO2010147555A1 - Hearing aid with two sets of contact pads

Info

Publication number: WO2010147555A1
Application number: PCT/SG2009/000216
Authority: WO
Inventors: Meng Kiang Lim; Chow Lan Stella Yap; Cher Huat Lim; Leep Foong Chew
Original assignee: Siemens Medical Instruments Pte Ltd
Current assignee: Sivantos Pte Ltd
Priority date: 2009-06-17
Filing date: 2009-06-17
Publication date: 2010-12-23
Anticipated expiration: 2011-12-17

Abstract

In an embodiment, a hearing aid (102) is provided. The hearing aid (102) may include a first substrate (104) including a first set of contact pads (106) configured to receive a first set of predetermined signals (108); and at least one second substrate (110) coupled to the first substrate via a joint portion (112), the at least one second substrate including a second set of contact pads (114) configured to receive a second set of predetermined signals; wherein the at least one second substrate may be configured to be movable relative to the first substrate such that the at least one second substrate (110) may overlap with the first substrate (104) so as to allow a change in hearing aid configuration.

Description

HEARING AID WITH TWO SETS OF CONTACT PADS

DESCRIPTION

Embodiments relate to a hearing aid with two sets of contact pads .

A non-programmable hearing aid is a hearing aid which does not include a programming socket or a programming pad. If there is a need to program the non-programmable hearing aid, one may program via a battery contact on the hearing aid, which may be relatively slow.

Programming via the battery contact is adopted as the current dimension of the printed circuit board may only allow up to four mechanical probing pins, thereby rendering the hearing aid suitable for either audio shoe or programming configuration only.

To enable both audio shoe and programming configuration within the hearing aid in a relatively shorter time-frame, there may be a need to increase the dimension of the printed circuit board to include one or more further pads for further programming sockets or pins. This may not be desirable due to an increase in thickness of the hearing aid, for example a behind-the-ear (BTE) hearing aid.

Various embodiments provide an alternative design for the hearing aid which may allow more than one programming configuration in a relatively short time-frame and yet minimize an increase in size or cost.

In various embodiments, a hearing aid, for example a digital hearing aid, may be provided, which may include two sets of contact pads which may allow for both audio shoe and programming configuration in a relatively short time-frame while minimizing an increase in size of the hearing aid. An embodiment relates to a hearing aid, for example a digital hearing aid. The hearing aid may include a first substrate including a first set of contact pads configured to receive a first set of predetermined signals; and at least one second substrate coupled to the first substrate via a joint portion, the at least one second substrate including a second set of contact pads configured to receive a second set of predetermined signals; wherein the at least one second substrate may be configured to be movable relative to the first substrate such that the at least one second substrate may overlap with the first substrate so as to allow a change in hearing aid configuration.

In an embodiment, the first set of contact pads may be configured to receive the first set of predetermined signals so as to allow a first hearing aid configuration.

In an embodiment, the first hearing aid configuration may include a programming pad configuration. The first hearing aid configuration may also include any other hearing aid configurations depending on user and design requirements.

In an embodiment, the first set of predetermined signals may include four signals, such as a ground signal, a data signal, a voltage signal and a clock signal. The first set of predetermined signals may include more than four signals, depending on the hearing aid configuration, user and design requirements .

In an embodiment, the second set of contact pads may be configured to receive the second set of predetermined signals so as to allow a second hearing aid configuration.

In an embodiment, the second hearing aid configuration may include an audio shoe pad configuration. The second hearing aid configuration may also include any other hearing aid configurations depending on user and design requirements. In an embodiment, the second set of predetermined signals may include four signals, such as a ground signal, an audio sense signal, a voltage signal and an audio signal. The second set of predetermined signals may include more than four signals, depending on the hearing aid configuration, user and design requirements .

In an embodiment, the number of contact pads within the first set of contact pads may vary depending on number of signals within the first set of predetermined signals. Similarly, the number of contact pads within the second set of contact pads may vary depending on number of signals within the second set of predetermined signals. The number of contact pads within the first set of contact pads may be the same or different from the number of contact pads within the second set of contact pads. The number of signals within the first set of predetermined signals may be the same or different from the number of signals within the second set of predetermined signals .

In an embodiment, the first substrate may further include a plurality of electronic components. The electronic components may include a microphone for collecting sound waves and a loudspeaker (which may also be referred to as a receiver in the field of hearing aids) but not so limited. The electronic components may include a volume control, tact switches, application-specific integrated circuit (ASIC) , passive and active surface-mount device (SMD) components.

In an embodiment, the first substrate may include a plurality of electronic components while the at least one second substrate may not include a plurality of electronic components. Alternatively, the at least one second substrate may include a plurality of electronic components while the first substrate may not include a plurality of electronic components . Only the first substrate or the at least one second substrate may include a plurality of electronic components. Or both the first substrate or the at least one second substrate may include a plurality of electronic components, with some electronic components positioned on the first substrate and some electronic components positioned on the at least one second substrate depending on user and design requirements.

In an embodiment, the first set of contact pads may be electrically connected to the plurality of electronic components directly or via the joint portion. There may be metallic or conductive interconnects or traces, for example copper interconnects connecting the first set of contact pads to the plurality of electronic components. The length and thickness of the copper interconnects may vary depending on user and design requirements.

In an embodiment, the second set of contact pads may be electrically connected to the plurality of electronic components via the joint portion. There may be metallic or conductive interconnects or traces, for example copper interconnects connecting the second set of contact pads to the plurality of electronic components. The length and thickness of the copper interconnects may vary depending on user and design requirements.

In an embodiment, the at least one second substrate may be disposed above or below the first substrate. The at least one second substrate may be positioned such that there may be at least one overlapping portion between the at least one second substrate and the first substrate. The dimension of the overlapping portion may be configured such that the overlapping portion may be at least bigger than the dimension of each of the contact pads within the first set of contact pads or the second set of contact pads and the joint portion.

In an embodiment, the first substrate may be of a same or a different material as the at least one second substrate. In an embodiment, the first substrate may include a rigid material. The first substrate may be ceramics, FR4, FR5.

In an embodiment, the at least one second substrate may include a flexible material. The at least one second substrate may be polyimide or liquid crystal polymer (LCP) .

In an embodiment, the first substrate may be a printed circuit board (PCB) .

In an embodiment, the at least one second substrate may be a flexible printed circuit board.

In an embodiment, the at least one second substrate may be of a same or different dimension as the first substrate depending on user and design requirements. The first substrate may include a length in the range of about 10 to 20 mm and a breadth in the range of about 4 mm to 7 mm. The at least one second substrate may include a length in the range of about 2.5 mm to 4 mm and a breadth in the range of about 4 mm to 7 mm.

In an embodiment, each of the first set of contact pads may include a conductive material.

In an embodiment, each of the second set of contact pads may include a conductive material.

In an embodiment, each of the first set of contact pads may be of a same or different material as each of the second set of contact pads. Each of the first set of contact pads and of the second set of contact pads may be copper. Each of the first set of contact pads and each of the second set of contact pads may include Electroless Nickel Immersion Gold (ENIG) , silver paste, stainless steel or chromium-nickel

(CrNi) . In an embodiment, each of the first set of contact pads may be of a same or different dimension as each of the second set of contact pads. Each of the first set of contact pads or the second set of contact pads may include a length in the range of about 0.5 mm to 5 mm, for example 1 mm and a breadth in the range of about 0.5 mm to 5 mm, typically 1 mm.

In an embodiment, the joint portion may be formed by a hot stamp method or via a conductive adhesive tape.

In an embodiment, the hearing aid may be a behind-the-ear (BTE) hearing aid.

In an embodiment, there may be more than one second substrate. The number of the second substrate depends on the number of required hearing aid configurations.

In an embodiment, the first set of contact pads and the second set of contact pads may be useful for programming the non-programmable hearing aid during in-house manufacturing. This may allow for faster lead time compared to programming the non-programming hearing aid via battery contact. Further, the first set of contact pads and the second set of contact pads may allow the hearing aid to include both the audio shoe and programming configuration while maintaining the thickness of the hearing aid. In addition, the hearing aid may be able to accommodate further configurations besides the audio shoe and programming configuration.

In an embodiment, the hearing aid further includes a battery chamber housing configured to receive a battery.

In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings, in which:

Figure 1 shows a front view of a hearing aid with two sets of contact pads according to an embodiment;

Figure 2 shows an isometric view of a hearing aid with two sets of contact pads according to an embodiment;

Figure 3 shows an exploded side view of a hearing aid with two sets of contact pads according to an embodiment; and

Figure 4 shows a hearing aid with an enlarged view of two sets of contact pads according to an embodiment.

Fig.l, Fig. 2 and Fig. 3 show respective front view, an isometric view and an exploded view of a hearing aid 102 with two sets of contact pads according to an embodiment. By way of example, Fig.l, Fig.2 and Fig.3 show a behind-the-ear

(BTE) hearing aid 102. The hearing aid 102 may include a first substrate 104 including a first set of contact pads

(not shown) configured to receive a first set of predetermined signals; and at least one second substrate 110 coupled to the first substrate 104 via a joint portion (not shown) , the at least one second substrate 110 including a second set of contact pads 114 (shown only in Figs. 2 and 3) configured to receive a second set of predetermined signals; wherein the at least one second substrate 110 may be configured to be movable relative to the first substrate 104 such that the at least one second substrate 110 may overlap with the first substrate 104 so as to allow a change in hearing aid configuration.

Fig.4 shows a hearing aid 102 with an enlarged view of two sets of contact pads 106, 114 according to an embodiment. The hearing aid 102 may include a first substrate 104 including a first set of contact pads 106 configured to receive a first set of predetermined signals 108; and at least one second substrate 110 coupled to the first substrate 104 via a joint portion 112, the at least one second substrate 110 including a second set of contact pads 114 configured to receive a second set of predetermined signals 116; wherein the at least one second substrate 110 may be configured to be movable relative to the first substrate 104 such that the at least one second substrate 110 may overlap with the first substrate 104 so as to allow a change in hearing aid configuration.

The first set of contact pads 106 may be configured to receive the first set of predetermined signals 108 so as to allow a first hearing aid configuration. Each of the contact pads within the first set of contact pads 106 may be arranged adjacent to each other in a single column but not so limited. The first hearing aid configuration may include a programming pad configuration. The first set of predetermined signals 108 may include four signals, namely a ground signal (GND) , a data signal (NDATA) , a voltage signal (VCC) and a clock signal (NCLOCK) .

The second set of contact pads 114 may be configured to receive the second set of predetermined signals 116 so as to allow a second hearing aid configuration. Each of the contact pads within the second set of contact pads 114 may be arranged adjacent to each other in a single column but not so limited. The first set of contact pads 106 may be positioned slightly displaced from the second set of contact pads 114 when the first substrate 104 may overlap with the at least one second substrate 110. This may mean that each contact pad within the first set of contact pads 106 may not be exactly overlapping with each contact pad within the second set of contact pads 114. The second hearing aid configuration may include an audio shoe pad configuration. The second set of predetermined signals 116 may include four signals, namely a ground signal (GND) , an audio sense signal (Audio Sense) , a voltage signal (VCC) and an audio signal. Some of the signals within the first set of predetermined signals 108 may be the same as the signals within the second set of predetermined signals 116 but not so limited. This may depend on the hearing aid configuration.

The first substrate 104 may further include a plurality of electronic components (not shown) . Each contact pad within the first set of contact pads 106 may be electrically connected to one or more of the plurality of electronic components directly via the metallic interconnects (not shown) or via the joint portion 112. Each contact pad within the second set of contact pads 114 may be electrically connected to one or more of the plurality of electronic components via the joint portion 112.

The at least one second substrate 110 may be disposed above the first substrate 104. The first substrate 104 may be of a same or a different material as the at least one second substrate 110. The first substrate 104 may include a rigid material and the at least one second substrate 110 may include a flexible material. The first substrate 104 may be a printed circuit board and the at least one second substrate 110 may be a flexible printed circuit board. The at least one second substrate 110 may be of a same or different dimension as the first substrate 104 depending on user and design requirements.

Each of the first set of contact pads 106 may include a conductive material. Each of the second set of contact pads 114 may include a conductive material. Each of the first set of contact pads 106 may be of a same or different material as each of the second set of contact pads 114. Each of the first set of contact pads 106 may be of a same or different dimension as each of the second set of contact pads 114.

The joint portion 112 may be formed by a hot stamp method or via a conductive adhesive tape such that the first substrate 104 may be securely adhered onto the at least one second substrate 110. While the invention has been particularly shown and described with reference to specific embodiments, it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is thus indicated by the appended claims and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced.

Claims

1. A hearing aid, comprising:

a first substrate comprising a first set of contact pads configured to receive a first set of predetermined signals; and

at least one second substrate coupled to the first substrate via a joint portion, the at least one second substrate comprising a second set of contact pads configured to receive a second set of predetermined signals;

wherein the at least one second substrate is configured to be movable relative to the first substrate such that the at least one second substrate overlaps with the first substrate so as to allow a change in hearing aid configuration.

2. The hearing aid of claim 1,

wherein the first set of contact pads is configured to receive the first set of predetermined signals so as to allow a first hearing aid configuration.

3. The hearing aid of claim 2,

wherein the first hearing aid configuration comprises a programming pad configuration.

4. The hearing aid of any one of claims 1 to 3,

wherein the first set of predetermined signals comprises a ground signal, a data signal, a voltage signal and a clock signal .

5. The hearing aid of any one of claims 1 to 4, wherein the second set of contact pads is configured to receive the second set of predetermined signals so as to allow a second hearing aid configuration.

6. The hearing aid of claim 5,

wherein the second hearing aid configuration comprises an audio shoe pad configuration.

7. The hearing aid of any one of claims 1 to 6,

wherein the second set of predetermined signals comprises a ground signal, an audio sense signal, a voltage signal and an audio signal.

8. The hearing aid of any one of claims 1 to 7,

wherein the first substrate further comprises a plurality of electronic components.

9. The hearing aid of claim 8,

wherein the first set of contact pads is electrically connected to the plurality of electronic components directly or via the joint portion.

10. The hearing aid of claim 8 or 9,

wherein the second set of contact pads is electrically connected to the plurality of electronic components via the joint portion.

11. The hearing aid of any one of claims 1 to 10,

wherein the at least one second substrate is disposed above the first substrate.

12. The hearing aid of any one of claims 1 to 11, wherein the first substrate is of a same or a different material as the at least one second substrate.

13. The hearing aid of any one of claims 1 to 12,

wherein the at least one second substrate is of a same or different dimension as the first substrate.

14. The hearing aid of any one of claims 1 to 13,

wherein the joint portion is formed by a hot stamp method.

15. The hearing aid of any one of claims 1 to 14,

wherein the hearing aid is a behind-the-ear hearing aid.