WO2010108612A1 - Optical assembly - Google Patents

Optical assembly Download PDF

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Publication number
WO2010108612A1
WO2010108612A1 PCT/EP2010/001604 EP2010001604W WO2010108612A1 WO 2010108612 A1 WO2010108612 A1 WO 2010108612A1 EP 2010001604 W EP2010001604 W EP 2010001604W WO 2010108612 A1 WO2010108612 A1 WO 2010108612A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical assembly
support body
surface portion
assembly according
mirror
Prior art date
Application number
PCT/EP2010/001604
Other languages
French (fr)
Inventor
Damian Fiolka
Wilfried Clauss
Original Assignee
Carl Zeiss Smt Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Ag filed Critical Carl Zeiss Smt Ag
Priority to CN201080014776.9A priority Critical patent/CN102365565B/en
Priority to JP2012501162A priority patent/JP5639145B2/en
Priority to KR1020117022509A priority patent/KR101353156B1/en
Publication of WO2010108612A1 publication Critical patent/WO2010108612A1/en
Priority to US13/235,750 priority patent/US8964162B2/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08Catadioptric systems
    • G02B17/0892Catadioptric systems specially adapted for the UV
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/18Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective

Definitions

  • the invention relates to an optical assembly, in particular for use in a projection exposure installation for microlithography, for example for EUV microlithography. Furthermore, the invention relates to an illumination optics and a projection optics, in which the optical assembly is used. Fur- therm ore, the invention relates to a projection exposure installation with an optical assembly of this type, a production method for a microstructured or nanostructured component and a component produced by a method of this type.
  • An optical assembly with a mirror body and a support body is known from US 2005/01 1 1067 Al , DE 100 50 125 A l , US 2004/0228012 A l, US 7 158 209 B2 and US 7 068 348 B2.
  • An object of the present invention is to develop an optical assembly of the type mentioned at the outset in such a way that the thermal stability thereof is improved.
  • the difference between the thermal emission coefficient ⁇ m of the modified surface portion and the thermal emission coefficient ⁇ u of the unmodified surface portion may be greater than 10 %, may also be greater than 20 %, may be greater than 50 % and may be greater than 100 %.
  • the ratio between the two emission coefficients may be greater than a factor of 2, may be greater than a factor of 5, may be greater than a factor of 8, may be greater than a factor of 10 and may even be greater than a factor of 15.
  • the at least par- tially thermally separating region between the two support body portions may be a layer of a material partially or completely insulating the two support body portions thermally from one another.
  • the at least partially thermally separating region may also be an evacuated volume between the two support body portions, it being possible for the two support body portions to be mechanically connected to one another at separate locations.
  • the entire optical assembly or components thereof may be accommodated in at least one chamber which can be evacuated.
  • At least one mirror of the optical assembly may be as a facet mirror with a plurality of facets predetermining illumination channels.
  • the optical assembly may have precisely one facet mirror of this type.
  • the emission coefficient of the modified surface portion differs by at least 10 % from the thermal emission coefficient of the unmodified surface portion. This means that by modifying one and the same surface portion, this difference of the thermal emission coefficient is brought about by at least 10 %.
  • the at least one modified surface portion may be a surface portion of an actuator component for displacing the mirror body of the optical assembly.
  • a processed surface portion according to claim 2 can be produced by known processing and in particular by material processing methods, so depending on the processing, a predetermined modified thermal emission coefficient ⁇ m can be finely adjusted.
  • Microstructures according to claim 3 lead to an increase in the modified thermal emission coefficient ⁇ m in comparison to the unmodified thermal emission coefficient ⁇ u , as the surface of the processed surface portion is increased.
  • Microstructures are structures with typical dimensions in the range of micrometers, for example in the range of between 0.5 and 100 mi- crometers. Saw tooth structures, trough structures or microribs may be used as microstructures. In this case, these structures may be arranged spatially periodically. It is, however, possible for the microstructures to be arranged irregularly, i.e. with a statistically varying spacing from one another, wherein, for example, the spacing of adjacent structures may follow a predetermined distribution, which optionally additionally has a direction orientation.
  • Diffractive structures according to claim 4 may lead to an additional reflection efficiency, in particular in wavelengths acting on the mirror, which would otherwise lead to a large heat loading of the mirror.
  • the diffractive structures may be designed for IR-(infrared) wavelengths.
  • Nanostructures according to claim 5 lead to a particularly advantageous enlargement of the surface of the processed surface portion and correspondingly to an enlargement of the modified thermal emission coefficient.
  • Nanostructures are structures with typical dimensions in the range of nanometres, for example in the range between 30 and 500 nanometres. In this case, these structures may be spatially arranged regularly with respect to one another. Alternatively, these structures may also be arranged irregularly, i.e. with a statistically varying spacing from one another, wherein, for example, the spacing of adjacent structures may follow a predetermined distribution, which optionally additionally has a direction orientation.
  • Notches or holes in particular blind holes may be configured in the processed surface portion as an mm- or cm- structure according to claim 6.
  • a surface layer according to claim 7, may selectively be used to increase or reduce the thermal emission coefficient of the processed surface portion.
  • An oxide layer, a varnish, an extraneous substance coating, a glass coating or a metal layer, for example a chromium layer, may be used as the surface layer.
  • the surface layer may differ with respect to its chemical composition from a material covered by the surface layer.
  • a displaceable covering body according to claim 8 allows a variable thermal emission coefficient ⁇ m of the modified surface portion to be predetermined. An adaptation is then possible to the respective heat transmission conditions of the mirror of the optical assembly by a corresponding displacement of the covering body relative to the associated support body portion.
  • the thermal emission coefficient of the covering body can be predetermined by a modified, in particular processed surface portion according to claim 9.
  • Modified surface portions of the two support body portions according to claim 10 increase the number of degrees of freedom to predetermine a thermally stable optical assembly.
  • a radiation body according to claim 12 leads to a further enlargement of the number of degrees of freedom for predetermining a thermally stable optical assembly.
  • the thermal radiation body may be used for cooling or heating.
  • a radiation source for illuminating the optical assembly may be used as the thermal radiation body. In this case, radiation deviating from the useful radiation used for illumination with respect to its wavelength can be used as the thermal radiation.
  • a radiation body with a modified, in particular with a processed surface portion according to claim 13, can be adjusted with regard to its thermal emission coefficient.
  • the temperature difference between the temperatures of the two mirror bodies can be predetermined in an arrangement according to claim 15 by the adjustment of the thermal emission coefficients of the support body portions.
  • a blind hole or pocket structure according to claim 16 offers a further de- gree of freedom for predetermining a thermally stable optical assembly.
  • a pocket structure according to claim 17 allows the adjustment of a predetermined thermal emission of the blind hole or pocket structure.
  • An active temperature control device in particular an active cooling device, represents a further degree of freedom for predetermining a thermally stable optical assembly.
  • a configuration according to claim 20 and 21 has proven successful in practice for the active temperature control device.
  • a coating according to claim 22 is adapted to the respective operating tem- perature of the optical assembly.
  • the coating may, in particular, be designed as an anti-reflex-interference coating.
  • the coating may have an absorbing metal layer, for example a chromium layer. The coating ensures that the heat radiation is highly efficiently discharged from the body carrying modified surface portion at the operating temperature.
  • a modified surface portion according to claim 23 in particular allows a targeted discharge of emitted heat radiation.
  • the modification may in particular be such that a preferred direction of the thermal emission on to another body of the optical assembly occurs, by means of which an efficient heat discharge can then take place.
  • the anisotropy of the thermal emission can also be used to keep the heat radiation away from sensitive components of the optical assembly or their surroundings as far as possible.
  • the at least one modified surface portion may be provided in particular on a rear side of the mirror body remote from the reflection useful surface.
  • the heat radiation from the mirror body via the mirror rear side is then accordingly optimised.
  • All modification variants may be used for the modified surface portion, which were discussed above in connection with the modified support body surface portion.
  • an interference coating or a micro- or nanostructuring, as discussed above, may be used for the modified surface portion of the mirror body.
  • the advantages of an illumination optics according to claim 25, a projection optics according to claim 26, a projection exposure installation 27, a production method according to claim 28 and a microstructured or nanos- gagtured component according to claim 29 correspond to those which were already described above with reference to the optical assembly.
  • the illumi- nation optics may be an EUV illumination optics.
  • the projection optics may be an EUV projection optics.
  • the projection exposure installation may be an EUV projection exposure installation with an EUV radiation source.
  • the illumination optics may have precisely one facet mirror, wherein this facet mirror may be designed as a specular reflector, as known from WO 2004/092844 A2 and from US 2006/0132747 Al.
  • the illumination optics in a further variant may have precisely two facet mirrors, namely a field facet mirror and a pupil facet mirror.
  • the illumination optics may, in total, be constructed with one, with two, with three, with four or with a larger number of mirrors.
  • Fig. 1 schematically shows a projection exposure installation for
  • EUV microlithography an illumination optics and a projection optics being shown in meridional section;
  • Fig. 2 shows in a broken cross section, a detail of an optical assem- bly in the form of a pupil facet mirror with a pupil facet as the mirror with a mirror body, which is carried by a support body with two support body portions;
  • Fig. 3 schematically shows an arrangement of a mirror with a mirror body and a support body with two support body portions in a modified embodiment in comparison to Fig. 2 to show a heat balance;
  • Fig. 4 shows in a graph, a time course of instantaneous temperatures of the mirror body and the two support body portions after the beginning of a useful light impingement of the mirror with useful light;
  • Fig. 5 to 7 show partially in a broken view and highly schematically, further embodiments of optical assemblies
  • Fig. 8 shows, highly enlarged and schematically, a section through a detail of a body with a surface portion which has been modi- fied by the application of an anti-reflex-interference coating with regard to its thermal emission coefficient;
  • Fig. 9 also shows in a highly enlarged, perspective and schematic manner, a surface portion modified by microstructuring.
  • Fig. 1 schematically shows a projection exposure installation 1 for EUV microlithography.
  • the projection exposure installation 1 has an EUV radiation source 2 for producing a useful radiation beam bundle 3.
  • the wave- length of the useful radiation beam bundle 3 is, in particular, between 5 nm and 30 nm.
  • the EUV radiation source 2 may be an LPP source (laser- produced plasma) or a GDPP source (gas discharge-produced plasma).
  • a DUV radiation source may also be used, which, for example produces a useful radiation beam bundle with a wavelength of 193 nm.
  • the useful radiation beam bundle 3 is collected by a collector 4.
  • Corresponding collectors are known, for example, from EP 1 225 481 A, US 2003/0043455 A and WO 2005/015 314 A2.
  • the useful radiation beam bundle 3 firstly propagates through an intermediate focus plane 5 with an intermediate focus Z and then impinges on a field facet mirror 6.
  • the useful radiation beam bundle 3 After reflection on the field facet mirror 6, the useful radiation beam bundle 3 impinges on a pupil facet mirror 7.
  • the useful radiation beam bundle 3 After reflection on the pupil fact mirror 7, the useful radiation beam bundle 3 is firstly reflected on two further mirrors 8, 9. After the mirror 9, the useful radiation beam bundle 3 impinges on a grazing incidence mirror 10. Together with the pupil facet mirror 7, the further mirrors 8 to 10 image field facets of the field facet mirror 6 in an object field 1 1 in an object plane 12 of the projection exposure installation 1. A surface portion to be imaged of a reflecting reticle 13 is arranged in the object field 1 1.
  • a projection optics 15 images the object field 1 1 in an image field 16 in an image plane 17.
  • a substrate 18 in the form of a wafer is arranged there.
  • the reticle 13 and the wafer 18 are carried by a reticle holder 19 and a wafer holder 20.
  • the pupil facet mirror 7 lies in an optical plane, which is optically conjugated to a pupil plane of the projection optics 15.
  • the object field 1 1 is arcuate, the meridional section of the illumination optics 14 shown in Fig. 1 running through axis of mirror symmetry of the object field 1 1.
  • a typical extent of the object field 11 in the plane of the drawing of Fig. 1 is 8 mm.
  • a typical extent of the object field 1 1 is 104 mm perpendicular to the plane of the drawing of Fig. 1.
  • a rectangular object field, for example with a corresponding aspect ratio of 8 mm x 104 mm is also possible.
  • the projection optics 15 is a mirror optics with six mirrors Ml to M6, which are numbered consecutively in Fig. 1 in the order of the imaging beam path of the projection optics 15 between the object field 1 1 and the image field 16 in the image plane 17.
  • An optical axis OA of the projection optics 15 is indicated in Fig. 1.
  • Each of the mirrors 6 to 10 of the illumination optics 14 and Ml to M6 of the projection optics 15 is an optical element with an optical surface which can be acted upon by the useful radiation beam bundle 3.
  • the reticle 13 is also an optical clement of this type.
  • the light source 2, the collector 4 and the spectral filter 4a are accommodated in a source chamber 21 , which can be evacuated.
  • the source chamber 21 has a through-opening 22, for the useful radiation beam bundle 3 in the region of the intermediate focus Z.
  • the illumination optics 14 following the intermediate focus Z and the projection optics 15 and the reticle holder 19 and the wafer holder 20 are accommodated in an illumination/projection optics chamber 23, which can also be evacuated and of which only a wall portion in the region of a chamber corner is shown schematically in Fig. 1.
  • Fig. 2 shows a detail of the pupil facet mirror 7 in the region of a pupil facet, in other words in the region of a mirror 24 with a facet reflection surface 25 for a part beam bundle 25a of the useful radiation beam bundle 3 and with a mirror body 26.
  • the structure of the pupil facet mirror 7 with the pupil facets or mirrors 24 is similar to the structure of a facet mirror, which is described in US 2005/01 1 1067 A l , reference being made to the content thereof.
  • the mirror body 26 has a hemispheric dome portion 27.
  • the reflection surface 25 lies in a plane, which runs through the centre point of the ball predetermined by the dome portion 27.
  • a support rod portion 28 of the mirror body 26 adjoins an apex of the dome portion 27.
  • the mirror body 26 is formed in one piece and, in the embodiment observed, is made of silicon.
  • the support body 30 has a first support body portion 31, which is shown at the top of Fig. 2, and a second support body portion 32, which is shown at the bottom of Fig. 2.
  • the support body portions 31, 32 are made of steel.
  • a layer 33 Arranged between the two support body portions 31 and 32 is a layer 33, which is formed from a material thermally insulating the two support body portions 31, 32 from one another.
  • the layer 33 may be a thermal block or sink.
  • An evacuated volume may also be provided, instead of the layer 33, between the two support body portions 31, 32 for thermal insulation between them.
  • the mirror body 26 Adjacent to the reflection surface 25, the mirror body 26 rests via a first contact portion 34 extending circularly on the dome portion 27 on the first support body portion 31.
  • the first contact portion 34 forms a first thermal contact of the mirror 24 with the support body 30.
  • the mirror body 26 is guided with the support rod portion 28 through a through-bore 35 through the support body 30.
  • the through-bore 35 widens conically in the region of the dome portion 27.
  • the first contact portion 34 is located in this conical widening region.
  • the support rod portion 28 of the mirror body 26 is supported by a plate spring 36, which annularly sur- rounds the support rod portion 28, by means of an annular second contact portion 37 on the second support body portion 32.
  • the second contact portion 37 is a second thermal contact of the mirror 24 with the support body
  • the second contact portion 37 is spaced further apart from the reflec- tion surface 25 than the first contact portion 34.
  • the plate spring 36 is thus supported on a surface 38 of the second support body portion 32 shown at the bottom in Fig. 2.
  • the plate spring 36 is supported via a washer 39 both on a nut 40, which is screwed onto an external thread, not shown in Fig. 2, of the support rod portion 28, and also on the support rod portion 28 itself.
  • a prestressing of the plate spring 36 can be predetermined by the nut 40.
  • the mirror body 26 has a temperature Tl .
  • the first support body portion 31 has a temperature T2.
  • the second support body portion 32 has a temperature T3.
  • the surface 38 of the second support body portion 32 and also a surface 41 surrounding the reflection surface 25 are modified surface portions of the support body portions 31, 32.
  • the modification of the surface portions 38, 41 is such that a thermal emission coefficient ⁇ m of the respective modified surface portion 38, 41 differs from a thermal emission coefficient ⁇ u of another, unmodified surface portion of the respective support body portion
  • the surface modification of the surface portion 38 of the second support body portion 32 is a glass coating 42.
  • the surface modification of the surface portion 41 of the first support body portion 31 is a microstructuring of the surface portion 41.
  • the thermal emission coefficient of the second support body portion 32 is reduced compared to the unmodified thermal emission coefficient.
  • the thermal emission coefficient of the surface portion 41 is increased in comparison to the unmodified surface of the first support body portion 31 by the surface modification of the surface portion 41, in other words by the microstructures 43.
  • the mirror body 26 may be displaceable relative to the support body 30 by means of an actuator, not shown in the drawings, for tilting the reflection surface 25.
  • the surface portion modified to change the thermal emission coefficient may be configured as a portion of an actuator component of this actuator for the mirror body 26.
  • a linear motor with a stator with a linear winding, which is fixed to the mirror body 26 or to the sup- port body 30 and with an actuator pin entering the linear winding of the stator, which is fixed to the respective other component of the mirror 24, in other words to the support body 30 or to the mirror body 26, can be used as an actuator.
  • FIG. 3 in comparison to Fig. 2, highly schematically shows a further embodiment of an optical assembly 29.
  • Components which correspond to those which have already been described above in relation to Figs. 1 and 2, have the same reference numerals and will not be discussed again in detail.
  • a local Cartesian coordinate system of the respective optical assembly 29 is drawn in Figs. 3 ff.
  • the x-axis runs to the right.
  • the y-axis runs perpendicular to the plane of the drawing and into it.
  • the z-axis runs upward.
  • the surface portion 41 of the first support body portion 31 adjacent to the mirror 24 is roughened, in other words carries microstructures 43.
  • a locally varying thermal emission coefficient ⁇ (x 1 , y') results.
  • the surface portion 38 of the second support body portion 32 has a thermal emission coefficient ⁇ (x", y").
  • a surface 44 of the mirror body 26 shown in Fig. 3 on the right is roughened in portions and carries microstructures 43 there, so a site-dependent thermal emission coeffi- cient ⁇ (y, z) is in turn produced.
  • a thermal residual absorption of the part beam bundle 25a is symbolised in Fig. 3 representing a heat balance by a heat resistor 45 with a temperature T 0 , which is in thermal contact with the mirror body 26 in the region of the reflection surface 25.
  • the first support body portion 31 has a temperature of T J0 .
  • the second support body portion 32 has a temperature of T JU .
  • the mirror body 26 has a temperature T 51 .
  • a heat flow dQ in is introduced via the heat resistor 45 into the mirror body 26.
  • the mirror body 26 emits a heat flow dQ ju via the first contact portion 34 to the first support body portion 31 and a heat flow dQ jo via the second contact portion 37 to the second support body portion 32.
  • the illumination/projection optical chamber 23, associated with the optical assembly 29, may also have microstructures 43 in surface portions 46, 47 (cf Fig. 3), so site-dependent thermal emission coefficients ⁇ (x m , y"') or ⁇ (y 1 , z') are present there.
  • the first support body portion 31 opposing the surface portion 47, has a further surface portion 48 modified by microstruc- turing with microstructures 43.
  • an active cooling device 49 may also be provided to cool or heat an environment outside the chamber 23.
  • the temperature of the wall of the chamber 23 is also therefore site- dependent and may be modelled by a temperature field T M (x, y, z).
  • dT is the temperature change of the respective body
  • dA is the observed surface element
  • dt is the observed time element
  • T is the temperature of the observed body
  • T N is the temperature of the surroundings
  • m is the mass of the observed body
  • c is the heat capacity of the observed body
  • is the Boltzmann constant
  • is the thermal emission coefficient of the observed body.
  • the value of the thermal emission coefficient ⁇ depends on the nature of the respective surface of the observed body.
  • the thermal emission coefficient ⁇ varies for steel, for example, between 0.05 for polished surfaces through to 0.8 for rough or oxidised surfaces.
  • the thermal emission coefficient ⁇ can be varied within a still greater range.
  • the heat flow dQ or ⁇ Q between the mirror body 26 and the two support body portions 31, 32 is proportional to the product of the heat transmission coefficient h and a contact face A of the respective contact portion 34, 37.
  • the product of the heat transmission coefficient h and the contact face A is defined by the heat transmission equations:
  • ⁇ Q J0 is the heat flow toward the first support body portion 31
  • ⁇ Q JU is the heat flow toward the second support body portion 32
  • ⁇ t is the observed time element.
  • A is the respective contact face
  • O is the respective surface
  • the Index "source” designates the heat source, in the example observed, in other words, the heat resistor element 45.
  • Fig. 4 shows the thermal course of the temperatures Ts, of the mirror bodies 26, T J0 of the first support body portion 31 und T JU of the second support body portion 32, in which at the beginning of the time measurement, a thermal load was added.
  • the following load case was calculated:
  • a modification of the surface portions 38, 41, 44 and 46 to 48 mentioned above may also be produced, as an alternative to a microstructuring, by the application of diffractive structures, which are matched to the wavelength of a radiation to be reflected by the mirror 24.
  • the modified surface portions 38, 41, 44 and 46 to 48 may also have nanostructures or mm- or cm- structures, for example notches or holes, in particular blind holes.
  • the processed surface portions 38, 41, 44 and 46 to 48 may also have a surface layer, which differs with respect to its chemical composition from bodies 26, 31, 32 located therebelow.
  • An oxide layer, a varnish or a glass coating, as already described above is possible, for example, as a surface layer.
  • a coating with other extraneous substances is also possible.
  • Fig. 5 in a detail, shows a further variant of an optical assembly 29.
  • Components which correspond to those which have already been described above with reference to Figs. 1 to 4 have the same reference numerals and will not be discussed again in detail.
  • the surface 41 of the first support body portion 31 also has a modified surface portion. This is in thermal contact with a covering body 50 which can be displaced relative to the first support body portion 31.
  • the covering body 50 can be displaced manually or with the aid of a drive not shown in Fig. 5 along a displacement direction (cf 51 in Fig. 5).
  • the covering body 50 has a surface 52 re- mote from the first support body portion 31 with microstructures 43 and a locally varying thermal emission coefficient ⁇ (x, y).
  • the heat flow between the first support body portion 31 and the covering body 50 can be predetermined by the size of a covering face U and there- fore a heat dissipation from the first support body portion 31 varied such that, depending on a temperature Tl of the mirror body 26, the temperature T2 of the first support body portion 31 becomes equal to a temperature of the second support body portion 32 not shown in Fig. 5.
  • the first mirror 53 shown at the top in Fig. 6 has a reflection surface 25 and, opposing this, a contact portion 55, via which the first mirror 53 rests on the first support body portion 31 and is in heat contact therewith.
  • the second mirror 54 shown at the bottom in Fig. 6 has a reflection surface 25 and, opposing this, a contact portion 56, via which the second mirror 54 rests on the second support body portion 32 and is in heat contact therewith
  • the surface 41 of the first support body portion 31 is processed in one por- tion.
  • a blind hole or pocket structure 57 in the form of a blind hole is present, which completely penetrates the first support body portion 31 and the layer 33 for thermal separation between the support body portions 31, 32.
  • a base 58 of the pocket structure 57 is configured in the core of the second support body portion 32 and is processed in such a way that it has microstructures 43.
  • the pocket structure 57 opens via a pocket opening 59 into the surroundings of the support body 30.
  • two lid bodies 60, 61 are used, which can both be displaced independently of one another to close the pocket opening 59 with a predetermined opening width 62 (cf double arrows 63, 64).
  • the lid bodies 60, 61 can in turn be displaced either manually or with the aid of a drive, not shown.
  • a thermal radiation 65 proceeding from the base 58, is effective to a different degree to cool the two support body portions 31, 32.
  • a heat flow from the microstructured base 58 to the outside is all the greater, the greater the opening width 62.
  • the ratio of the heat flow fractions of the two support body portions 31, 32 to the heat transported as a whole via the pocket structure 57 through the opening width 62 can be predetermined by the depth of the pocket structure 57 and the microstructuring 58. Accordingly, the temperatures TO, Tl of the two mirrors 53, 54 can be equalised with one another if necessary.
  • the second support body portion 32 in the embodiment according to Fig. 6, has an active temperature-control device in the form of an active cooling device 66. This is formed by a cooling channel in the second support body portion 32, which is shown in cross section in Fig. 6 and is configured to guide a heat carrier fluid, for example to guide cooling water.
  • the mirror 54 does not rest, as in the embodiment according to Fig. 6, on a side wall of the second support body portion 32, but on its surface 38 shown at the bottom in Fig. 7 via the contact portion 56.
  • the reflection surface 25 of the mirror 53 points to the right and the reflection surface 25 of the mirror 54 points downward.
  • a thermal radiation body 67 Arranged opposing the pocket opening 59 of the pocket structure 57 in the embodiment according to Fig. 7 is a thermal radiation body 67 with a surface portion 68 having microstructures 43 and facing the support body 30.
  • the radiation body 67 is held at a defined temperature T4, so a defined heat radiation flow results between the support body 30 and the radiation body 67, in particular between the radiation body 67 and the support body portion 31 facing it and having the pocket opening 59.
  • Fig. 8 shows a further embodiment of a modified surface portion 69, which can be used instead of the modified surface portions described above to change the thermal emission coefficient of the otherwise unmodified surface.
  • a base body 70 which may, for example, be one of the support body portions 31, 32 or else the mirror body 26 and a structural part of an actuator or a component of an actuator for displacing the mirror body 26, or the thermal radiation body 67, is provided with a coating 71.
  • the coating 71 is a coating, which is designed for a wavelength of thermal radiation, which is a maximum of a thermal emission at an operating temperature of the optical assembly 29, to which the surface portion 69 belongs.
  • the coating 71 may, for example, be configured for an infrared radiation emitted from the bas body 70 in the range of 10 ⁇ m.
  • the coating 71 can be designed as an anti-reflex interference coating made of a dielectric material.
  • Another con- figuration wavelength in the range of, for example between 2.5 ⁇ m and 15 ⁇ m, for example 3 ⁇ m is also possible.
  • An incident heat beam 72 may penetrate the coating 71 practically without loss. This does not only apply to the incident heat beam 72, but conversely also to the heat radiation of the configured wavelength, which is radiated outwardly from the base body 70.
  • the coating 71 is designed as a lambda/quarter layer. The layer thickness of the coating 71 is, in other words, such that heat part beams 75, 76 re- flected on the coating interfaces 73, 74 interfere with one another destructively.
  • the coating 71 in turn carries a thin absorbing metal layer 77, for example a chromium layer.
  • the coating 71 at a working temperature of the base body 70 of about 330 0 C has a layer thickness of about 3 ⁇ m.
  • the surface portion 69 has a thermal emission coefficient, which is only slightly less than 1, for the working temperature.
  • a surface portion can also be modified by applying a dielectric multi-layer system.
  • an anti-reflex interference coating can be provided for a greater wavelength range by a maximum of a thermal emis- sion at a working temperature of the respective base body.
  • the multi-layer system may have two dielectric layers, three dielectric layers, four dielectric layers, five dielectric layers or else more dielectric layers, for example ten dielectric layers or an even larger number of dielectric layers.
  • Fig. 9 shows a further embodiment of a modified surface portion 78, which can be used instead of the above-described modified surface portions to change the thermal emission coefficient of the otherwise unmodified surface.
  • Components which in the following description of the embodiment according to Fig. 9 correspond to those which have already been described above with reference to Figs. 1 to 8, have the same reference numerals and are not described again in detail.
  • the surface potion 78 is modified in such a way that a thermal emission that is anisotropic with respect to its direction from the modified surface portion 78 results.
  • An outstanding heat beam 79 emitted from the surface portion 78 is shown in Fig. 9.
  • the direction of the heat beam 79, proceeding from a norma! vector 80 of the surface portion 78 can be given via polar angles ⁇ , ⁇ , proceeding from an origin O in Fig. 9.
  • the surface portion 78 has rib structures extending from a base body 81 in the form of microribs 82.
  • Each of the microribs 82 has a height extent H over an upper side 83 of the base body 81 of 20 ⁇ m. Adjacent ones of the microribs 82 follow one another at a period P of about 10 ⁇ m. A spacing A of about 5 ⁇ m is present between two adjacent ones of the microribs 82. The spacing A may be in a range of between 3 ⁇ m and 7 ⁇ m.
  • a Cartesian xyz-coordinates system is drawn in Fig. 9.
  • the upper side 83 extends parallel to the xyz-plane.
  • the normal vector 80 extends parallel to the z-axis.
  • the origin O lies in the xy-plane.
  • the angle ⁇ is measured here proceeding from the normal vector 80.
  • the angle ⁇ is measured in the xy-plane proceeding from the x-axis.
  • the microribs Depending on the operating temperature of the base body 81, for which the thermal emission from this is to be maximised by the microribs 82, the microribs have a height H in the range between 0.5 ⁇ m and 100 ⁇ m.
  • the spacing A may, depending on the operating temperature or design tempera- ture, vary in the range between 0.5 ⁇ m and 50 ⁇ m.
  • the period P may vary in the range of between 1 ⁇ m and 100 ⁇ m.
  • a rib cross section of the microribs 82 may, as shown in Fig. 9, be rectangular.
  • the cross section of the microribs 82 in such a way that the rib thickness is constant over a large part of the height extent H of the microribs 82 and upper end faces of the microribs 28 are rounded.
  • the microribs 82 applied to the base body 81 lead to the increase of a thermal emission coefficient of the base body 81 from an unmodified value of, for example, 0.4 in a base body 81 having no microribs to a thermal emission coefficient of, for example, 0.7 or 0.8. Because of the course of the rib structures 82 along the x-direction, a preferred direction or a pre- ferred plane of the thermal emission in the radiation directions is produced with ⁇ in the range around 0° and in the range around 180°. With these radiation directions (0° ⁇ ⁇ ⁇ 90°), no shading effect of the microribs 82 is produced for the radiated heat radiation.
  • This anisotropy of the thermal emission of the unmodified surface portion 78 can be used to direct the heat radiation emitted by the surface portion 78 in a targeted manner, for example to another heat-dissipating body, for example to the radiation body 67 of the configuration according to Fig. 7.
  • the surface portions 69 and/or 78 of the configuration in Figs. 8 and 9 may be other surface portions of the mirror body 26, in other words surface portions thereof with the exception of the reflection surface 25, or surface portions of the support body 30.
  • Fig. 1 Various variants of the optical assemblies described above with the aid of Figs. 2 to 7 are indicated in Fig. 1.
  • the mirrors 6, 7, 8, 9, 10, Ml , M2, M4 and M6 are configured with mirror bodies or support bodies with surface portions modified according to the above.
  • the mirrors 6 and M2 also in each case have a covering body 50 in accordance with the configuration according to Fig. 5.

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Abstract

An optical assembly (29) has at least one mirror (24) with a mirror body (26). The latter is carried by a support body (30), which has a first support body portion (31) and a second support body portion (32). An at least thermally separating region (33) is arranged between the two support body portions (31, 32). At least one surface portion (38, 41) of at least one of the support body portions (31, 32) or of a body thermally coupled thereto is modified in such a way that a thermal emission coefficient εm of the modi- fied surface portion (38, 41) differs from a thermal emission coefficient εu of the unmodified surface portion by at least 10 %. The result is an optical assembly, in which an improved thermal stability is achieved by the prede¬ termining of the thermal emission coefficients.

Description

Optical Assembly
This application claims the benefit under 35 U.S.C. 119(e)(l) of U.S. Provisional Application No. 60/163929, filed on March 27, 2009.
The invention relates to an optical assembly, in particular for use in a projection exposure installation for microlithography, for example for EUV microlithography. Furthermore, the invention relates to an illumination optics and a projection optics, in which the optical assembly is used. Fur- therm ore, the invention relates to a projection exposure installation with an optical assembly of this type, a production method for a microstructured or nanostructured component and a component produced by a method of this type.
An optical assembly with a mirror body and a support body is known from US 2005/01 1 1067 Al , DE 100 50 125 A l , US 2004/0228012 A l, US 7 158 209 B2 and US 7 068 348 B2.
An object of the present invention is to develop an optical assembly of the type mentioned at the outset in such a way that the thermal stability thereof is improved.
This object is achieved according to the invention by an optical assembly with the features disclosed in claim 1 and by an optical assembly with the features disclosed in claim 24.
It was recognised according to the invention that by the modification of at least one~surface"portion of one of the support body portions, the possibility is provided of influencing a temperature difference between the two sup- port body portions. This temperature difference may be minimised, in particular, so that, for example, a thermally induced "bimetal effect" cannot occur. This bimetal effect can occur when the mirror body is in contact with the first support body portion and the second support body portion via a mechanical heat bridge. As a result, the possibility results of providing an optical assembly which is thermally improved with regard to its stability by means of the modification of the at least one surface portion. The difference between the thermal emission coefficient εm of the modified surface portion and the thermal emission coefficient εu of the unmodified surface portion may be greater than 10 %, may also be greater than 20 %, may be greater than 50 % and may be greater than 100 %. The ratio between the two emission coefficients may be greater than a factor of 2, may be greater than a factor of 5, may be greater than a factor of 8, may be greater than a factor of 10 and may even be greater than a factor of 15. The at least par- tially thermally separating region between the two support body portions may be a layer of a material partially or completely insulating the two support body portions thermally from one another. The at least partially thermally separating region may also be an evacuated volume between the two support body portions, it being possible for the two support body portions to be mechanically connected to one another at separate locations. The entire optical assembly or components thereof may be accommodated in at least one chamber which can be evacuated. At least one mirror of the optical assembly may be as a facet mirror with a plurality of facets predetermining illumination channels. The optical assembly may have precisely one facet mirror of this type. The emission coefficient of the modified surface portion differs by at least 10 % from the thermal emission coefficient of the unmodified surface portion. This means that by modifying one and the same surface portion, this difference of the thermal emission coefficient is brought about by at least 10 %. The at least one modified surface portion may be a surface portion of an actuator component for displacing the mirror body of the optical assembly.
A processed surface portion according to claim 2, can be produced by known processing and in particular by material processing methods, so depending on the processing, a predetermined modified thermal emission coefficient εm can be finely adjusted.
Microstructures according to claim 3 lead to an increase in the modified thermal emission coefficient εm in comparison to the unmodified thermal emission coefficient εu, as the surface of the processed surface portion is increased. Microstructures are structures with typical dimensions in the range of micrometers, for example in the range of between 0.5 and 100 mi- crometers. Saw tooth structures, trough structures or microribs may be used as microstructures. In this case, these structures may be arranged spatially periodically. It is, however, possible for the microstructures to be arranged irregularly, i.e. with a statistically varying spacing from one another, wherein, for example, the spacing of adjacent structures may follow a predetermined distribution, which optionally additionally has a direction orientation.
Diffractive structures according to claim 4 may lead to an additional reflection efficiency, in particular in wavelengths acting on the mirror, which would otherwise lead to a large heat loading of the mirror. In particular, the diffractive structures may be designed for IR-(infrared) wavelengths. Nanostructures according to claim 5 lead to a particularly advantageous enlargement of the surface of the processed surface portion and correspondingly to an enlargement of the modified thermal emission coefficient. Nanostructures are structures with typical dimensions in the range of nanometres, for example in the range between 30 and 500 nanometres. In this case, these structures may be spatially arranged regularly with respect to one another. Alternatively, these structures may also be arranged irregularly, i.e. with a statistically varying spacing from one another, wherein, for example, the spacing of adjacent structures may follow a predetermined distribution, which optionally additionally has a direction orientation.
Notches or holes, in particular blind holes may be configured in the processed surface portion as an mm- or cm- structure according to claim 6.
A surface layer according to claim 7, may selectively be used to increase or reduce the thermal emission coefficient of the processed surface portion. An oxide layer, a varnish, an extraneous substance coating, a glass coating or a metal layer, for example a chromium layer, may be used as the surface layer. The surface layer may differ with respect to its chemical composition from a material covered by the surface layer.
A displaceable covering body according to claim 8 allows a variable thermal emission coefficient εm of the modified surface portion to be predetermined. An adaptation is then possible to the respective heat transmission conditions of the mirror of the optical assembly by a corresponding displacement of the covering body relative to the associated support body portion. The thermal emission coefficient of the covering body can be predetermined by a modified, in particular processed surface portion according to claim 9.
Modified surface portions of the two support body portions according to claim 10 increase the number of degrees of freedom to predetermine a thermally stable optical assembly.
An arrangement with various modified emission coefficients εm according to claim 1 1 has corresponding advantages.
A radiation body according to claim 12 leads to a further enlargement of the number of degrees of freedom for predetermining a thermally stable optical assembly. The thermal radiation body may be used for cooling or heating. A radiation source for illuminating the optical assembly may be used as the thermal radiation body. In this case, radiation deviating from the useful radiation used for illumination with respect to its wavelength can be used as the thermal radiation.
A radiation body with a modified, in particular with a processed surface portion according to claim 13, can be adjusted with regard to its thermal emission coefficient.
The advantages of the at least one modified surface portion particularly come to the fore in the mirror body arrangement according to claim 14.
The temperature difference between the temperatures of the two mirror bodies can be predetermined in an arrangement according to claim 15 by the adjustment of the thermal emission coefficients of the support body portions.
A blind hole or pocket structure according to claim 16 offers a further de- gree of freedom for predetermining a thermally stable optical assembly.
A pocket structure according to claim 17 allows the adjustment of a predetermined thermal emission of the blind hole or pocket structure.
The same applies to a radiation body according to claim 18.
An active temperature control device according to claim 19, in particular an active cooling device, represents a further degree of freedom for predetermining a thermally stable optical assembly.
A configuration according to claim 20 and 21 has proven successful in practice for the active temperature control device.
A coating according to claim 22 is adapted to the respective operating tem- perature of the optical assembly. The coating may, in particular, be designed as an anti-reflex-interference coating. In addition, the coating may have an absorbing metal layer, for example a chromium layer. The coating ensures that the heat radiation is highly efficiently discharged from the body carrying modified surface portion at the operating temperature.
A modified surface portion according to claim 23 in particular allows a targeted discharge of emitted heat radiation. The modification may in particular be such that a preferred direction of the thermal emission on to another body of the optical assembly occurs, by means of which an efficient heat discharge can then take place. The anisotropy of the thermal emission can also be used to keep the heat radiation away from sensitive components of the optical assembly or their surroundings as far as possible.
In an optical assembly according to claim 24, the at least one modified surface portion may be provided in particular on a rear side of the mirror body remote from the reflection useful surface. The heat radiation from the mirror body via the mirror rear side is then accordingly optimised. All modification variants may be used for the modified surface portion, which were discussed above in connection with the modified support body surface portion. In particular, an interference coating or a micro- or nanostructuring, as discussed above, may be used for the modified surface portion of the mirror body.
The advantages of an illumination optics according to claim 25, a projection optics according to claim 26, a projection exposure installation 27, a production method according to claim 28 and a microstructured or nanos- tructured component according to claim 29 correspond to those which were already described above with reference to the optical assembly. The illumi- nation optics may be an EUV illumination optics. The projection optics may be an EUV projection optics. The projection exposure installation may be an EUV projection exposure installation with an EUV radiation source. The illumination optics may have precisely one facet mirror, wherein this facet mirror may be designed as a specular reflector, as known from WO 2004/092844 A2 and from US 2006/0132747 Al. The illumination optics in a further variant may have precisely two facet mirrors, namely a field facet mirror and a pupil facet mirror. The illumination optics may, in total, be constructed with one, with two, with three, with four or with a larger number of mirrors. Embodiments of the invention will be described in more detail below with the aid of the drawings, in which:
Fig. 1 schematically shows a projection exposure installation for
EUV microlithography, an illumination optics and a projection optics being shown in meridional section;
Fig. 2 shows in a broken cross section, a detail of an optical assem- bly in the form of a pupil facet mirror with a pupil facet as the mirror with a mirror body, which is carried by a support body with two support body portions;
Fig. 3 schematically shows an arrangement of a mirror with a mirror body and a support body with two support body portions in a modified embodiment in comparison to Fig. 2 to show a heat balance;
Fig. 4 shows in a graph, a time course of instantaneous temperatures of the mirror body and the two support body portions after the beginning of a useful light impingement of the mirror with useful light;
Fig. 5 to 7 show partially in a broken view and highly schematically, further embodiments of optical assemblies;
Fig. 8 shows, highly enlarged and schematically, a section through a detail of a body with a surface portion which has been modi- fied by the application of an anti-reflex-interference coating with regard to its thermal emission coefficient; and
Fig. 9 also shows in a highly enlarged, perspective and schematic manner, a surface portion modified by microstructuring.
Fig. 1 schematically shows a projection exposure installation 1 for EUV microlithography. The projection exposure installation 1 has an EUV radiation source 2 for producing a useful radiation beam bundle 3. The wave- length of the useful radiation beam bundle 3 is, in particular, between 5 nm and 30 nm. The EUV radiation source 2 may be an LPP source (laser- produced plasma) or a GDPP source (gas discharge-produced plasma). Alternatively, for example a DUV radiation source may also be used, which, for example produces a useful radiation beam bundle with a wavelength of 193 nm.
The useful radiation beam bundle 3 is collected by a collector 4. Corresponding collectors are known, for example, from EP 1 225 481 A, US 2003/0043455 A and WO 2005/015 314 A2. After the collector 4 and graz- ing reflection on a spectral filter 4a the useful radiation beam bundle 3 firstly propagates through an intermediate focus plane 5 with an intermediate focus Z and then impinges on a field facet mirror 6. After reflection on the field facet mirror 6, the useful radiation beam bundle 3 impinges on a pupil facet mirror 7.
After reflection on the pupil fact mirror 7, the useful radiation beam bundle 3 is firstly reflected on two further mirrors 8, 9. After the mirror 9, the useful radiation beam bundle 3 impinges on a grazing incidence mirror 10. Together with the pupil facet mirror 7, the further mirrors 8 to 10 image field facets of the field facet mirror 6 in an object field 1 1 in an object plane 12 of the projection exposure installation 1. A surface portion to be imaged of a reflecting reticle 13 is arranged in the object field 1 1.
The mirrors 6 to 10, and in a further sense, also the collector 4, belong to an illumination optics 14 of the projection exposure installation 1.
A projection optics 15 images the object field 1 1 in an image field 16 in an image plane 17. A substrate 18 in the form of a wafer is arranged there. The reticle 13 and the wafer 18 are carried by a reticle holder 19 and a wafer holder 20. The pupil facet mirror 7 lies in an optical plane, which is optically conjugated to a pupil plane of the projection optics 15.
The object field 1 1 is arcuate, the meridional section of the illumination optics 14 shown in Fig. 1 running through axis of mirror symmetry of the object field 1 1. A typical extent of the object field 11 in the plane of the drawing of Fig. 1 is 8 mm. A typical extent of the object field 1 1 is 104 mm perpendicular to the plane of the drawing of Fig. 1. A rectangular object field, for example with a corresponding aspect ratio of 8 mm x 104 mm is also possible.
The projection optics 15 is a mirror optics with six mirrors Ml to M6, which are numbered consecutively in Fig. 1 in the order of the imaging beam path of the projection optics 15 between the object field 1 1 and the image field 16 in the image plane 17. An optical axis OA of the projection optics 15 is indicated in Fig. 1. Each of the mirrors 6 to 10 of the illumination optics 14 and Ml to M6 of the projection optics 15 is an optical element with an optical surface which can be acted upon by the useful radiation beam bundle 3. The reticle 13 is also an optical clement of this type.
The light source 2, the collector 4 and the spectral filter 4a are accommodated in a source chamber 21 , which can be evacuated. The source chamber 21 has a through-opening 22, for the useful radiation beam bundle 3 in the region of the intermediate focus Z. Accordingly, the illumination optics 14 following the intermediate focus Z and the projection optics 15 and the reticle holder 19 and the wafer holder 20 are accommodated in an illumination/projection optics chamber 23, which can also be evacuated and of which only a wall portion in the region of a chamber corner is shown schematically in Fig. 1.
Fig. 2 shows a detail of the pupil facet mirror 7 in the region of a pupil facet, in other words in the region of a mirror 24 with a facet reflection surface 25 for a part beam bundle 25a of the useful radiation beam bundle 3 and with a mirror body 26.
The structure of the pupil facet mirror 7 with the pupil facets or mirrors 24 is similar to the structure of a facet mirror, which is described in US 2005/01 1 1067 A l , reference being made to the content thereof.
The mirror body 26 has a hemispheric dome portion 27. The reflection surface 25 lies in a plane, which runs through the centre point of the ball predetermined by the dome portion 27. A support rod portion 28 of the mirror body 26 adjoins an apex of the dome portion 27. The mirror body 26 is formed in one piece and, in the embodiment observed, is made of silicon. A support body 30, which carries the mirror 24 and of which only that detail is shown in Fig. 2, which belongs to the mirror 24 shown, also belongs to the optical assembly 29 having the mirror 24 with the mirror body 26. More detail with regard to the arrangement of the large number of mirrors 24, which build up the pupil facet mirror, in the support body 30, can be inferred from US 2005/01 1 1067 Al .
The support body 30 has a first support body portion 31, which is shown at the top of Fig. 2, and a second support body portion 32, which is shown at the bottom of Fig. 2. The support body portions 31, 32 are made of steel. Arranged between the two support body portions 31 and 32 is a layer 33, which is formed from a material thermally insulating the two support body portions 31, 32 from one another. The layer 33 may be a thermal block or sink. An evacuated volume may also be provided, instead of the layer 33, between the two support body portions 31, 32 for thermal insulation between them.
Adjacent to the reflection surface 25, the mirror body 26 rests via a first contact portion 34 extending circularly on the dome portion 27 on the first support body portion 31. The first contact portion 34 forms a first thermal contact of the mirror 24 with the support body 30.
The mirror body 26 is guided with the support rod portion 28 through a through-bore 35 through the support body 30. The through-bore 35 widens conically in the region of the dome portion 27. The first contact portion 34 is located in this conical widening region. On the side opposing the conical widening portion of the through-bore 35, the support rod portion 28 of the mirror body 26 is supported by a plate spring 36, which annularly sur- rounds the support rod portion 28, by means of an annular second contact portion 37 on the second support body portion 32. The second contact portion 37 is a second thermal contact of the mirror 24 with the support body
30. The second contact portion 37 is spaced further apart from the reflec- tion surface 25 than the first contact portion 34.
On the support body side, the plate spring 36 is thus supported on a surface 38 of the second support body portion 32 shown at the bottom in Fig. 2.
On the opposing side, the plate spring 36 is supported via a washer 39 both on a nut 40, which is screwed onto an external thread, not shown in Fig. 2, of the support rod portion 28, and also on the support rod portion 28 itself. A prestressing of the plate spring 36 can be predetermined by the nut 40.
The mirror body 26 has a temperature Tl . The first support body portion 31 has a temperature T2. The second support body portion 32 has a temperature T3. With a thermal loading of the reflection surface 25, in particular by residual absorption of the part beam bundle 25a, Tl > T2 > T3 generally applies.
The surface 38 of the second support body portion 32 and also a surface 41 surrounding the reflection surface 25 are modified surface portions of the support body portions 31, 32. The modification of the surface portions 38, 41 is such that a thermal emission coefficient εm of the respective modified surface portion 38, 41 differs from a thermal emission coefficient εu of another, unmodified surface portion of the respective support body portion
31, 32 by at least 10 %. The surface modification of the surface portion 38 of the second support body portion 32 is a glass coating 42. The surface modification of the surface portion 41 of the first support body portion 31 is a microstructuring of the surface portion 41.
By means of the surface modification of the surface portion 38, in other words by the glass coating 42, the thermal emission coefficient of the second support body portion 32 is reduced compared to the unmodified thermal emission coefficient.
The thermal emission coefficient of the surface portion 41 is increased in comparison to the unmodified surface of the first support body portion 31 by the surface modification of the surface portion 41, in other words by the microstructures 43.
Basically, the mirror body 26 may be displaceable relative to the support body 30 by means of an actuator, not shown in the drawings, for tilting the reflection surface 25. The surface portion modified to change the thermal emission coefficient may be configured as a portion of an actuator component of this actuator for the mirror body 26. A linear motor with a stator with a linear winding, which is fixed to the mirror body 26 or to the sup- port body 30 and with an actuator pin entering the linear winding of the stator, which is fixed to the respective other component of the mirror 24, in other words to the support body 30 or to the mirror body 26, can be used as an actuator.
Fig. 3, in comparison to Fig. 2, highly schematically shows a further embodiment of an optical assembly 29. Components, which correspond to those which have already been described above in relation to Figs. 1 and 2, have the same reference numerals and will not be discussed again in detail. If necessary, a local Cartesian coordinate system of the respective optical assembly 29 is drawn in Figs. 3 ff. In Fig. 3, the x-axis runs to the right. The y-axis runs perpendicular to the plane of the drawing and into it. The z-axis runs upward.
In the optical assembly 29 according to Fig. 3, the surface portion 41 of the first support body portion 31 adjacent to the mirror 24 is roughened, in other words carries microstructures 43. A locally varying thermal emission coefficient ε (x1, y') results. The surface portion 38 of the second support body portion 32 has a thermal emission coefficient ε (x", y").
In addition, in the embodiment according to Fig. 3, a surface 44 of the mirror body 26 shown in Fig. 3 on the right is roughened in portions and carries microstructures 43 there, so a site-dependent thermal emission coeffi- cient ε (y, z) is in turn produced.
A thermal residual absorption of the part beam bundle 25a is symbolised in Fig. 3 representing a heat balance by a heat resistor 45 with a temperature T0, which is in thermal contact with the mirror body 26 in the region of the reflection surface 25.
The first support body portion 31 has a temperature of TJ0. The second support body portion 32 has a temperature of TJU. The mirror body 26 has a temperature T51.
A heat flow dQin is introduced via the heat resistor 45 into the mirror body 26. The mirror body 26 emits a heat flow dQju via the first contact portion 34 to the first support body portion 31 and a heat flow dQjo via the second contact portion 37 to the second support body portion 32.
The illumination/projection optical chamber 23, associated with the optical assembly 29, may also have microstructures 43 in surface portions 46, 47 (cf Fig. 3), so site-dependent thermal emission coefficients ε (xm, y"') or ε (y1, z') are present there. The first support body portion 31 , opposing the surface portion 47, has a further surface portion 48 modified by microstruc- turing with microstructures 43.
Outside the illumination/projection chamber 23, an active cooling device 49 may also be provided to cool or heat an environment outside the chamber 23. The temperature of the wall of the chamber 23 is also therefore site- dependent and may be modelled by a temperature field TM (x, y, z).
To calculate a heat balance, firstly the heat radiation of the various bodies of the optical assembly 29 over the surface thereof is observed, which is proportional to the fourth power of the temperature and the emission coefficient. There applies:
dT=l/m/c*σ*ε( T4 - TN 4)*dA*dt (1)
In this case:
dT is the temperature change of the respective body, dA is the observed surface element, dt is the observed time element, T is the temperature of the observed body, TN is the temperature of the surroundings, m is the mass of the observed body, c is the heat capacity of the observed body, σ is the Boltzmann constant ε is the thermal emission coefficient of the observed body.
The value of the thermal emission coefficient ε depends on the nature of the respective surface of the observed body. The thermal emission coefficient ε varies for steel, for example, between 0.05 for polished surfaces through to 0.8 for rough or oxidised surfaces. By means of a corresponding coating, for example by means of the glass coating 42, the thermal emission coefficient ε can be varied within a still greater range.
The heat flow dQ or ΔQ between the mirror body 26 and the two support body portions 31, 32 is proportional to the product of the heat transmission coefficient h and a contact face A of the respective contact portion 34, 37. The product of the heat transmission coefficient h and the contact face A is defined by the heat transmission equations:
ΔQJ0= (h*A)J0*(TSl - TJ0)*Δt (2)
ΔQJU = (h*A)JU*(TSl - TJU)*Δt (3)
Here:
ΔQJ0 is the heat flow toward the first support body portion 31 , ΔQJU is the heat flow toward the second support body portion 32, Δt is the observed time element. Together with equation (1), the heat balance can be written as:
V11 '"Vsource V -1 O " A Si/ ' V11 ^"VjO V A Si " Ajo/ " V11 ^VjuV A Si " -iju>/ " ^-» °Si "V 1 Si "
TsN^^s^ msΛcs^ΔTs/Δt (4)
(h*A)J0*(TSl - TJ0) - σ*εsteel*(TJ0 4 - TN 4)*OJO = mJ0*CJ0*ΔTJ0/Δt (5)
(h*A)JU*(TSl - TJU) - σ*ε steel* (Tju " TN )*OJU : mJU*CJU*ΔTJU/Δt (6)
Here:
A is the respective contact face, O is the respective surface, the Index "source" designates the heat source, in the example observed, in other words, the heat resistor element 45.
Fig. 4 shows the thermal course of the temperatures Ts, of the mirror bodies 26, TJ0 of the first support body portion 31 und TJU of the second support body portion 32, in which at the beginning of the time measurement, a thermal load was added. The following load case was calculated:
mJ0= 0, 13 kg OJO=0,005 m2 cJ0= c(steel) = 477 J/kg/K mJU = 0,14 kg OJU=0,007 m2 cJU = c(steel) = 477 J/kg/K mSl = 0,007 kg OSl=0,001 m2 cSl= c(silicon) = 700 J/kg/K
(h*A)JO = 0,05 J/K/sec (h*A)JU = 0,01 J/K/sec εSl= 0.2
£steei, top = 0.15*5.5 (thermal emission coefficient in the surface portion 41 because of the microstructuring 43) εsteei, bottom = 0.15 (unstructured surface 38 of the second support body por- tion 32)
As a result, (cf Fig. 4) a temperature course is produced, in which after about 3 hours, the temperatures Tj0, Tj11 of the two support body portions 31, 32 have equalised except for about IK. A thermal delay of the support body 30 is then minimal. An impairment of an image-guiding effect of the pupil facet mirror 7 is then minimal.
A modification of the surface portions 38, 41, 44 and 46 to 48 mentioned above may also be produced, as an alternative to a microstructuring, by the application of diffractive structures, which are matched to the wavelength of a radiation to be reflected by the mirror 24. Instead of microstructures 43, the modified surface portions 38, 41, 44 and 46 to 48 may also have nanostructures or mm- or cm- structures, for example notches or holes, in particular blind holes. The processed surface portions 38, 41, 44 and 46 to 48 may also have a surface layer, which differs with respect to its chemical composition from bodies 26, 31, 32 located therebelow. An oxide layer, a varnish or a glass coating, as already described above is possible, for example, as a surface layer. A coating with other extraneous substances is also possible.
Fig. 5, in a detail, shows a further variant of an optical assembly 29. Components which correspond to those which have already been described above with reference to Figs. 1 to 4 have the same reference numerals and will not be discussed again in detail.
In the optical assembly 29 according to Fig. 5, the surface 41 of the first support body portion 31 also has a modified surface portion. This is in thermal contact with a covering body 50 which can be displaced relative to the first support body portion 31. The covering body 50 can be displaced manually or with the aid of a drive not shown in Fig. 5 along a displacement direction (cf 51 in Fig. 5). The covering body 50 has a surface 52 re- mote from the first support body portion 31 with microstructures 43 and a locally varying thermal emission coefficient ε (x, y).
The heat flow between the first support body portion 31 and the covering body 50 can be predetermined by the size of a covering face U and there- fore a heat dissipation from the first support body portion 31 varied such that, depending on a temperature Tl of the mirror body 26, the temperature T2 of the first support body portion 31 becomes equal to a temperature of the second support body portion 32 not shown in Fig. 5.
With the aid of Fig. 6, a further embodiment of an optical assembly 29 will be described below. Components, which correspond to those which have already been described above with reference to Figs. 1 to 5, have the same reference numerals and will not be discussed again in detail.
In the embodiment according to Fig. 6, instead of a mirror, which rests via two contact portions on the two support body portions 31, 32 of the support body, two mirrors 53, 54 are provided. The first mirror 53 shown at the top in Fig. 6 has a reflection surface 25 and, opposing this, a contact portion 55, via which the first mirror 53 rests on the first support body portion 31 and is in heat contact therewith.
The second mirror 54 shown at the bottom in Fig. 6 has a reflection surface 25 and, opposing this, a contact portion 56, via which the second mirror 54 rests on the second support body portion 32 and is in heat contact therewith
The surface 41 of the first support body portion 31 is processed in one por- tion. In the processed portion, a blind hole or pocket structure 57 in the form of a blind hole is present, which completely penetrates the first support body portion 31 and the layer 33 for thermal separation between the support body portions 31, 32. A base 58 of the pocket structure 57 is configured in the core of the second support body portion 32 and is processed in such a way that it has microstructures 43. The pocket structure 57 opens via a pocket opening 59 into the surroundings of the support body 30.
To close the pocket opening 59, two lid bodies 60, 61 are used, which can both be displaced independently of one another to close the pocket opening 59 with a predetermined opening width 62 (cf double arrows 63, 64). The lid bodies 60, 61 can in turn be displaced either manually or with the aid of a drive, not shown.
Depending on the size of the opening width 62 adjusted by the two lid bod- ies 60, 61, a thermal radiation 65, proceeding from the base 58, is effective to a different degree to cool the two support body portions 31, 32. A heat flow from the microstructured base 58 to the outside is all the greater, the greater the opening width 62. The ratio of the heat flow fractions of the two support body portions 31, 32 to the heat transported as a whole via the pocket structure 57 through the opening width 62 can be predetermined by the depth of the pocket structure 57 and the microstructuring 58. Accordingly, the temperatures TO, Tl of the two mirrors 53, 54 can be equalised with one another if necessary.
The second support body portion 32 in the embodiment according to Fig. 6, has an active temperature-control device in the form of an active cooling device 66. This is formed by a cooling channel in the second support body portion 32, which is shown in cross section in Fig. 6 and is configured to guide a heat carrier fluid, for example to guide cooling water.
A further embodiment of an optical assembly 29 is described below with the aid of Fig. 7. Components which correspond to those which have al- ready been discussed with reference to Figs. 1 to 6, have the same reference numerals and will not be described again in detail.
In the embodiment according to Fig. 7, the mirror 54 does not rest, as in the embodiment according to Fig. 6, on a side wall of the second support body portion 32, but on its surface 38 shown at the bottom in Fig. 7 via the contact portion 56. In the embodiment according to Fig. 7, the reflection surface 25 of the mirror 53 points to the right and the reflection surface 25 of the mirror 54 points downward.
Arranged opposing the pocket opening 59 of the pocket structure 57 in the embodiment according to Fig. 7 is a thermal radiation body 67 with a surface portion 68 having microstructures 43 and facing the support body 30. The radiation body 67 is held at a defined temperature T4, so a defined heat radiation flow results between the support body 30 and the radiation body 67, in particular between the radiation body 67 and the support body portion 31 facing it and having the pocket opening 59.
Fig. 8 shows a further embodiment of a modified surface portion 69, which can be used instead of the modified surface portions described above to change the thermal emission coefficient of the otherwise unmodified surface. Components which, in the following description of the embodiment according to Fig. 8 correspond to those which have already been described above with reference to Figs. 1 to 7 have the same reference numerals and will not be described again in detail.
A base body 70, which may, for example, be one of the support body portions 31, 32 or else the mirror body 26 and a structural part of an actuator or a component of an actuator for displacing the mirror body 26, or the thermal radiation body 67, is provided with a coating 71. The coating 71 is a coating, which is designed for a wavelength of thermal radiation, which is a maximum of a thermal emission at an operating temperature of the optical assembly 29, to which the surface portion 69 belongs. The coating 71 may, for example, be configured for an infrared radiation emitted from the bas body 70 in the range of 10 μm. The coating 71 can be designed as an anti-reflex interference coating made of a dielectric material. Another con- figuration wavelength in the range of, for example between 2.5 μm and 15 μm, for example 3 μm is also possible. An incident heat beam 72 may penetrate the coating 71 practically without loss. This does not only apply to the incident heat beam 72, but conversely also to the heat radiation of the configured wavelength, which is radiated outwardly from the base body 70. The coating 71 is designed as a lambda/quarter layer. The layer thickness of the coating 71 is, in other words, such that heat part beams 75, 76 re- flected on the coating interfaces 73, 74 interfere with one another destructively.
The coating 71 in turn carries a thin absorbing metal layer 77, for example a chromium layer. The coating 71 at a working temperature of the base body 70 of about 3300C has a layer thickness of about 3 μm.
The surface portion 69 has a thermal emission coefficient, which is only slightly less than 1, for the working temperature.
Instead of a dielectric single layer system as in the embodiment according to Fig. 8, a surface portion can also be modified by applying a dielectric multi-layer system. As a result, an anti-reflex interference coating can be provided for a greater wavelength range by a maximum of a thermal emis- sion at a working temperature of the respective base body. The multi-layer system may have two dielectric layers, three dielectric layers, four dielectric layers, five dielectric layers or else more dielectric layers, for example ten dielectric layers or an even larger number of dielectric layers.
Fig. 9 shows a further embodiment of a modified surface portion 78, which can be used instead of the above-described modified surface portions to change the thermal emission coefficient of the otherwise unmodified surface. Components which in the following description of the embodiment according to Fig. 9 correspond to those which have already been described above with reference to Figs. 1 to 8, have the same reference numerals and are not described again in detail.
The surface potion 78 is modified in such a way that a thermal emission that is anisotropic with respect to its direction from the modified surface portion 78 results. An outstanding heat beam 79 emitted from the surface portion 78 is shown in Fig. 9. The direction of the heat beam 79, proceeding from a norma! vector 80 of the surface portion 78 can be given via polar angles θ, φ, proceeding from an origin O in Fig. 9.
The surface portion 78 has rib structures extending from a base body 81 in the form of microribs 82. Each of the microribs 82 has a height extent H over an upper side 83 of the base body 81 of 20 μm. Adjacent ones of the microribs 82 follow one another at a period P of about 10 μm. A spacing A of about 5 μm is present between two adjacent ones of the microribs 82. The spacing A may be in a range of between 3 μm and 7 μm.
To illustrate position relationships, a Cartesian xyz-coordinates system is drawn in Fig. 9. The upper side 83 extends parallel to the xyz-plane. The normal vector 80 extends parallel to the z-axis.
The origin O lies in the xy-plane. The angle θ is measured here proceeding from the normal vector 80. The angle φ is measured in the xy-plane proceeding from the x-axis.
Depending on the operating temperature of the base body 81, for which the thermal emission from this is to be maximised by the microribs 82, the microribs have a height H in the range between 0.5 μm and 100 μm. The spacing A may, depending on the operating temperature or design tempera- ture, vary in the range between 0.5 μm and 50 μm. The period P may vary in the range of between 1 μm and 100 μm. A rib cross section of the microribs 82 may, as shown in Fig. 9, be rectangular. A saw tooth cross section, a triangular cross section, a trapezoidal cross section or a continuously extending cross section, in other words, a cross section approaching a sinusoidal function of the microribs 82 is pos- sible. In addition it is possible to configure the cross section of the microribs 82 in such a way that the rib thickness is constant over a large part of the height extent H of the microribs 82 and upper end faces of the microribs 28 are rounded.
The microribs 82 applied to the base body 81 lead to the increase of a thermal emission coefficient of the base body 81 from an unmodified value of, for example, 0.4 in a base body 81 having no microribs to a thermal emission coefficient of, for example, 0.7 or 0.8. Because of the course of the rib structures 82 along the x-direction, a preferred direction or a pre- ferred plane of the thermal emission in the radiation directions is produced with φ in the range around 0° and in the range around 180°. With these radiation directions (0° < θ < 90°), no shading effect of the microribs 82 is produced for the radiated heat radiation. In the case of radiation directions like the direction of the heat beam 79 with φ in the region around 90° or in the region around 270°, above an angle θ of for example 45°, in other words in the case of flat radiation angles perpendicular to the microribs 82, a substantial part of the heat radiation is shaded by the rib structures 82.
This anisotropy of the thermal emission of the unmodified surface portion 78 can be used to direct the heat radiation emitted by the surface portion 78 in a targeted manner, for example to another heat-dissipating body, for example to the radiation body 67 of the configuration according to Fig. 7. The surface portions 69 and/or 78 of the configuration in Figs. 8 and 9 may be other surface portions of the mirror body 26, in other words surface portions thereof with the exception of the reflection surface 25, or surface portions of the support body 30.
Various variants of the optical assemblies described above with the aid of Figs. 2 to 7 are indicated in Fig. 1. The mirrors 6, 7, 8, 9, 10, Ml , M2, M4 and M6 are configured with mirror bodies or support bodies with surface portions modified according to the above. The mirrors 6 and M2 also in each case have a covering body 50 in accordance with the configuration according to Fig. 5.

Claims

Claims
1. Optical assembly (29) with at least one mirror (24; 53, 54) with a mirror body (26) - which is carried by a support body (30), which has
— a first support body portion (31),
- a second support body portion (32), wherein an at least partially thermally separating region (33) is arranged between the two support body portions (31, 32), - wherein at least one surface portion (38, 41, 44, 46 to 48, 52, 68) of at least one of the support body portions (31, 32) or of a body (23, 50, 67) thermally coupled thereto is locally modified in such a way that a thermal emission coefficient εm of the modified surface portion (38, 41, 44, 46 to 48, 52, 68) differs from a thermal emission coefficient εu of the unmodified surface portion by at least 10 percent.
2. Optical assembly according to claim 1, characterised in that the modified surface portion (38, 41, 44, 46 to 48, 52, 68) has a surface changed by processing.
3. Optical assembly according to claim 2, characterised in that the processed surface portion (38, 41, 44, 46 to 48, 52, 68) has microstructures (43).
4. Optical assembly according to claim 2 or 3, characterised in that the processed surface portion (38, 41, 44, 46 to 48, 52, 68) has diffractive structures, which are matched to the wavelength of a radiation (25a) to be reflected by the mirror (24; 53, 54).
5. Optical assembly according to claim 1 or 2, characterised in that the processed surface portion (38, 41, 44, 46 to 48, 52, 68) has nanostruc- tures.
6. Optical assembly according to claim 1 or 2, characterised in that the processed surface portion (38, 41, 44, 46 to 48, 52, 68) has mm- or cm- structures.
7. Optical assembly according to claim 1 or 2, characterised in that the modified surface portion (38, 41, 44, 46 to 48, 52, 68) has a surface layer (42), which differs from the support body therebelow with re- spect to its chemical composition.
8. Optical assembly according to claim 1, characterised in that the modified surface portion (41) is in thermal contact with at least one covering body (50), which can be displaced relative to the support body portion (31), which has the modified surface portion (41), so the thermal emission coefficient εm of the modified surface portion (41) is dependent on the relative position of the covering body (50). to the support body portion (31), which has the modified surface portion (41).
9. Optical assembly according to claim 8, characterised in that the covering body (50) has at least one surface portion (52) modified to change the thermal emission coefficient.
10. Optical assembly according to any one of claims 1 to 9, characterised in that at least one surface portion (38, 41) both of the first support body portion (31) and of the second support body portion (32) is modified in such a way that a thermal emission coefficient εm of the proc- essed surface portions (38, 41) differs from a thermal emission coefficient εu of unprocessed surface portions of the two support body portions (31, 32) by at least 10 percent.
1 1. Optical assembly according to claim 10, characterised in that a ther- mal emission coefficient εm of the processed surface portion (41) of the first support body portion (31) differs from a thermal emission coefficient εm of the processed surface portion (38) of the second support body portion (32) by at least 10 percent.
12. Optical assembly according to any one of claims 1 to 1 1, characterised in that at least one thermal radiation body (23; 67) with a predetermined heat radiation flow to at least one other body (26, 31 , 32) of the optical assembly is present.
13. Optical assembly according to claim 12, characterised in that the thermal radiation body (23, 67) has at least one surface portion (46, 47; 68) modified to change the thermal emission coefficient.
14. Optical assembly according to any one of claims 1 to 13, character- ised in that the mirror body (26) adjacent to a reflection surface (25) of the mirror (24) rests via a first contact portion (34) on the first support body portion (31) and via a second contact portion (37), which is spaced further apart from the reflection surface (25) than the first contact portion (34), on the second support body portion (32).
15. Optical assembly according to any one of claims 1 to 13, character- ised in that at least one mirror (53, 54) of its own, which exclusively rests on the support body portion (31, 32) associated with it via a contact portion (55, 56), is associated with each of the support body portions (31, 32).
16. Optical assembly according to any one of claims 2 to 15, characterised in that the processed surface portion is configured as a pocket structure (57), which completely passes through one of the support body portions (31) and the at least partially thermally separating region (33) located in between and which opens via a pocket opening (59) into surroundings of the support body (30).
17. Optical assembly according to claim 16, characterised by at least one lid body (60, 61), which is displaceably configured to close the pocket opening (59) with a predetermined opening width (62).
18. Optical assembly according to claim 16 or 17, characterised in that at least one thermal radiation body (67) with a predetermined heat radiation flow to the support body portion (31) having the pocket opening (59) is arranged opposing the pocket opening (59).
19. Optical assembly according to any one of claims 1 to 18, characterised by an active temperature control device (49; 66) for influencing the temperature of at least one of the support body portions (31, 32).
20. Optical assembly according to claim 19, characterised in that the active temperature control device (66) is configured for temperature control by a heat carrier fluid.
21. Optical assembly according to claim 20, characterised in that the active temperature control device (66) is configured as at least one temperature control channel in one of the support body portions (32) for heat carrier fluid guidance.
22. Optical assembly according to any one of claims 1 to 21, characterised in that the modified surface portion (69) is configured as a coating for a wavelength, which corresponds to a maximum of a thermal emission at an operating temperature of the optical assembly.
23. Optical assembly according to any one of claims 1 to 21, characterised in that the modified surface portion (78) is modified in such a way that a thermal emission, which is anisotropic with respect to its direction, from the modified surface portion (69) results.
24. Optical assembly (29) with at least one mirror (24; 53, 54) with a mirror body (26) with a reflection useful surface (25) and other surface portions (69; 78), wherein at least one of the other surface portions (69; 78) is locally modified in such a way that a thermal emission coefficient εm of the modified surface portion (69; 78) differs from a thermal emission coefficient εu of the unmodified surface portion by at least 10 %.
25. Illumination optics (14) with at least one optical assembly (29) according to any one of claims 1 to 24.
26. Projection optics (15) with at least one optical assembly (29) according to any one of claims 1 to 24.
27. Projection exposure installation (1) with a radiation source (2) for producing a useful radiation beam bundle (3), - with an illumination optics (14) for illuminating an object field
(11) in an object plane (12), with a projection optics (15) for imaging the object field (1 1) into an image field (16) in an image plane (17), characterised by an optical assembly (29) according to any one of claims 1 to 24.
28. Method for producing structured components comprising the following steps: providing a wafer (18), on which, at least partially, a layer of a light-sensitive material is applied, providing a reticle (13) which has structures to be imaged, providing a projection exposure installation (1) according to claim
27, projecting at least a part of the reticle (13) onto a region of the layer of the wafer (18) with the aid of the projection exposure installation (1).
29. Microstructured or nanostructured component, produced by a method according to claim 28.
PCT/EP2010/001604 2009-03-27 2010-03-13 Optical assembly WO2010108612A1 (en)

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US13/235,750 US8964162B2 (en) 2009-03-27 2011-09-19 Optical assembly

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DE102009014701A1 (en) 2010-09-30
CN102365565B (en) 2015-11-25
CN102365565A (en) 2012-02-29
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US20120019799A1 (en) 2012-01-26
KR101353156B1 (en) 2014-01-22

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