WO2010087077A1

WO2010087077A1 - Method for producing optical component, apparatus for producing optical component, and method for producing wafer lens

Info

Publication number: WO2010087077A1
Application number: PCT/JP2009/070746
Authority: WO
Inventors: 斎藤　正; 佐藤　彰
Original assignee: コニカミノルタオプト株式会社
Priority date: 2009-01-30
Filing date: 2009-12-11
Publication date: 2010-08-05
Also published as: JPWO2010087077A1; JP4586940B2

Abstract

Disclosed is a method for producing a wafer lens (1) in which one surface of a glass substrate (3) is provided with a convex lens part (5) that is formed from a photocurable resin (5A). The method for producing a wafer lens (1) comprises: a first dispensing step wherein the photocurable resin (5A) is dropped between the one surface of the glass substrate (3) and a submaster (20) which has a plurality of formation surfaces that have a negative shape corresponding to the optical surface shape of the convex lens part (5); a first imprinting step wherein the photocurable resin (5A) is imprinted on the submaster (20) or the glass substrate (3) by being pressed thereto; a first curing step wherein the photocurable resin (5A) is irradiated with light; and a second curing step wherein the photocurable resin (5A) is heated and cured without separating the submaster (20) from the glass substrate (3) after the first curing step.

Description

Optical component manufacturing method, optical component manufacturing apparatus, and wafer lens manufacturing method

The present invention relates to an optical component manufacturing method, an optical component manufacturing apparatus, and a wafer lens manufacturing method.

Conventionally, in the field of manufacturing optical lenses, a technique for obtaining an optical lens having high heat resistance by providing a lens portion made of a curable resin on a glass substrate has been studied (for example, see Patent Document 1). As an example of a manufacturing method of an optical lens to which this technology is applied, a so-called “wafer lens” in which a plurality of optical members made of a curable resin is provided on the surface of a glass substrate is formed, and then the glass substrate is cut for each lens portion. A method has also been proposed.

As an energy-curable resin that cures the resin by applying energy, for example, a method for manufacturing a wafer lens in the case of using a photo-curable resin will be briefly described. A glass substrate is sucked and fixed by a vacuum chuck device. A resin is dropped or discharged onto the glass substrate (dispensing process). Thereafter, the glass substrate is raised toward the mold placed above, and the resin is pressed against the mold (imprint process). The mold is a light transmissive mold having a lens molding surface, and is held and fixed by a stamp holder.

Then, while maintaining the height position of the glass substrate as it is, the resin filled in the cavity is irradiated with light from above the mold to photocur the resin (exposure process). Thereafter, the resin is released from the mold while the glass substrate is lowered (release process). As a result, a wafer lens having a plurality of optical element portions formed on a glass substrate can be manufactured.

Such a molding process is also used when a molding die for molding an optical element is molded by a similar molding process.

Japanese Patent No. 3926380

Incidentally, it is necessary to cure the resin reliably by applying energy, for example, by light irradiation, but it takes a long time for light irradiation in order to cure the resin reliably. For this reason, there is a problem that the working time in a single manufacturing apparatus becomes long and the manufacturing efficiency is poor.

Also, the wafer lens is a fine optical element, and there is a tendency that high optical characteristics are required corresponding to high resolution, such as when optical elements are formed on both surfaces of a substrate, or when a plurality of wafer lenses are stacked.

Therefore, even when a plurality of fine optical elements are simultaneously imprint-molded with a resin on a glass substrate, the shape variation due to the molding of the individual optical elements, the optical axis shift between the optical elements formed on both surfaces of the substrate, and the light High-precision molding is required so as not to adversely affect optical characteristics such as axis tilt.

The present invention has been made in view of the above circumstances. A wafer lens and a wafer lens that can shorten the light irradiation time to the resin, can surely cure the resin, and can improve the manufacturing efficiency. The first object of the present invention is to provide an optical component manufacturing method and an optical component manufacturing apparatus, such as a molding die for molding a mold.

The present invention also provides a highly accurate molding method that suppresses variation in shape and optical axis misalignment between optical elements formed on a glass substrate, even when simultaneously imprinting a plurality of fine optical elements on a glass substrate. The second object is to provide a manufacturing method using the above.

The method for producing an optical component of the present invention includes:
An optical component manufacturing method in which an optical member made of energetic curable resin is provided on one surface of a substrate,
A dispensing step of dropping or discharging the energetic curable resin between a molding die having a plurality of negative-shaped molding surfaces corresponding to the optical surface shape of the optical member, and one surface of the substrate;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the substrate;
After the imprinting step, a first curing step of applying energy to the energetic curable resin to advance curing;
A second curing step in which energy is given to the energy-curable curable resin to further cure the mold without releasing the mold from the substrate;
It is characterized by providing.

In addition, the method of manufacturing the optical component of the present invention includes
The first curing step is an exposure step of irradiating light as energy,
The second curing step is preferably a heating step for heating.

In addition, the method of manufacturing the optical component of the present invention includes
It is preferable to perform the dispensing step, the imprinting step, and the first curing step under reduced pressure.

In addition, the method of manufacturing the optical component of the present invention includes
The optical component is preferably a wafer lens in which a plurality of optical elements are arranged in a wafer shape.

In addition, the method of manufacturing the optical component of the present invention includes
An optical component manufacturing method in which an optical member made of energy-curable resin is provided on both sides of a substrate,
The energy-curable curable resin is dropped or discharged between a first mold having a plurality of negative-shaped molding surfaces corresponding to the shape of the optical member formed on one surface of the substrate and the one surface of the substrate. A first dispensing step,
A first imprinting step of pressing the energy-curable curable resin against the first mold or the substrate after the first dispensing step;
After the first imprint step, a first curing step of applying energy to the energetic curable resin to advance curing;
In a state where the first mold is not released from the substrate, the first mold and the substrate are inverted,
The energy-curable curable resin is dropped or discharged between a second mold having a plurality of negative-shaped molding surfaces corresponding to the shape of the optical member formed on the other surface of the substrate and the other surface of the substrate. A second dispensing step,
A second imprinting step of pressing the energy-curable curable resin against the second mold or the substrate after the second dispensing step;
After the second imprint step, a second curing step of applying energy to the energetic curable resin to promote curing;
The energy-curable curable resin cured in the first curing step between the first mold and the substrate without releasing the first mold and the second mold from the substrate and the first mold A third curing step for further curing by applying energy to at least one of the energy-curable resins cured in the second curing step between the mold and the substrate;
It is characterized by providing.

In addition, the method of manufacturing the optical component of the present invention includes
The first curing step and the second curing step are exposure steps for irradiating light,
The third curing step is preferably a heating step for heating.

In addition, the method of manufacturing the optical component of the present invention includes
The first dispensing step, the first imprinting step, the first curing step, the second dispensing step, the second imprinting step, and the second curing step are preferably performed under reduced pressure.

In addition, the method of manufacturing the optical component of the present invention includes
The optical component is preferably a wafer lens in which a plurality of optical elements are arranged on a wafer.

The optical component manufacturing apparatus of the present invention is
An optical component manufacturing apparatus for manufacturing an optical component in which an optical member made of an energy curable resin is provided on at least one surface of a substrate,
A base on which the substrate is disposed;
A holder that holds and holds a molding die having a plurality of negative-shaped molding surfaces corresponding to the shape of the optical member, with respect to the substrate,
The mold is detachable from the holder,
The mold is attached to the holder, the energy curable resin is filled between one surface of the substrate and the mold, and energy is applied to the energy curable resin to proceed with curing. The mold is removed from the holder in a state where the mold is not released from the substrate.

The optical component manufacturing apparatus of the present invention is
The optical component is preferably a wafer lens in which a plurality of optical elements are arranged on a wafer.

In addition, the method for molding a wafer lens of the present invention,
By placing an energy-curable resin between one surface of the glass substrate supported by the support member and the plurality of optical transfer surfaces of the molding die and press-molding, a negative shape of the optical transfer surface is formed on the glass substrate surface. A wafer lens molding method in which a plurality of optical elements made of energy curable resin having a corresponding shape are formed,
An adjustment step of adjusting the parallelism between the surface of the support member that contacts the glass substrate and the mold;
Placing the glass substrate on the surface of the support member;
A dispensing step of dropping or discharging an energy curable resin between a plurality of optical transfer surfaces of the mold adjusted in the adjustment step and one surface of the glass substrate supported by the support member;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A curing step of applying energy to the energetic curable resin to advance the curing after the imprinting step.

In addition, the method for molding a wafer lens of the present invention,
In the adjusting step, a first surface that abuts each surface and a second surface parallel to the first surface are provided between the surface of the support member and one surface of the mold holding member that holds the mold. It is preferable to carry out by arranging the spacer which has and to contact | abut the surface of the said support member, the 1st surface of the said spacer, the 2nd surface of the said spacer, and one surface of the said mold holding member member, respectively.

In addition, the method for molding a wafer lens of the present invention,
In the adjusting step, a spacer having a first surface that abuts each surface and a second surface parallel to the first surface is disposed between the surface of the support member and one surface of the mold, It is preferable to perform this by bringing the surface of the support member into contact with the first surface of the spacer, the second surface of the spacer, and one surface of the mold.

In addition, the method for molding a wafer lens of the present invention,
By placing and molding the energetic curable resin between one surface of the glass substrate supported by the electrostatic chuck device and a plurality of optical transfer surfaces of the mold held by the mold holding member, the glass A wafer lens molding method in which a plurality of optical elements made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface is formed on one surface of a substrate,
A spacer having a first surface in contact with each surface and a second surface parallel to the first surface between the surface of the electrostatic chuck device on which the glass substrate is disposed and one surface of the mold holding member. A spacer abutting step for abutting the surface of the electrostatic chuck device with the first surface of the spacer, the second surface of the spacer, and one surface of the mold holding member member;
After the spacer contact step, a step of taking out the spacer from between the electrostatic chuck device and the mold holding member;
Placing a glass substrate on the surface of the electrostatic chuck device;
Fixing the mold on one surface of the mold holding member;
A dispensing step of dropping or discharging an energetic curable resin between a plurality of optical transfer surfaces of the mold and one surface of the glass substrate;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A curing step of applying energy to the energetic curable resin to advance the curing after the imprinting step.

In addition, the method for molding a wafer lens of the present invention,
In a state where one surface of the glass substrate is supported by a first mold having a plurality of optical transfer surfaces formed on the molding surface, it is formed on the other surface of the glass substrate and the molding surface of the second mold. An optical element made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface on the glass substrate by arranging and molding the energy curable resin between the plurality of optical transfer surfaces. A method of molding a plurality of formed wafer lenses,
A spacer having a first surface abutting on each molding surface and a second surface parallel to the first surface between the molding surface of the first molding die and the molding surface of the second molding die. A spacer contact step in which the molding surface of the first molding die and the first surface of the spacer, the second surface of the spacer and the molding surface of the second molding die are respectively contacted,
After the spacer contact step, a step of taking out the spacer from between the first and second molding dies,
Placing a glass substrate on the first mold;
A dispensing step of dropping or discharging an energy curable resin between the plurality of optical transfer surfaces of the second mold and one surface of the glass substrate disposed on the first mold;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A curing step of applying energy to the energetic curable resin to advance the curing after the imprinting step.

In addition, the method for molding a wafer lens of the present invention,
Before the spacer contact step, after the dispensing of dropping or discharging the energy curable resin between the plurality of optical transfer surfaces of the first mold and one surface of the glass substrate, the energy curable resin It is preferable to further include an imprinting step of pressing the mold against the mold or the glass substrate.

In addition, the method for molding a wafer lens of the present invention,
In a state where one surface of the glass substrate is supported by a first mold having a plurality of optical transfer surfaces formed on the molding surface, it is formed on the other surface of the glass substrate and the molding surface of the second mold. An optical element made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface on the glass substrate by arranging and molding the energy curable resin between the plurality of optical transfer surfaces. A method of molding a plurality of formed wafer lenses,
Between the surface of the support member in contact with the first mold and the one surface of the mold holding member, a first surface that contacts each of the surfaces and a second surface parallel to the first surface are provided. A spacer contact step in which a spacer is disposed, and the surface of the support member and the first surface of the spacer, and the second surface of the spacer and one surface of the support member are contacted;
After the spacer contact step, a step of taking out the spacer from between the support member and the mold holding member,
Disposing a first mold having a plurality of optical transfer surfaces formed on a molding surface on the support member;
Holding the second mold on the mold holding member;
A dispensing step of dropping or discharging an energy curable resin between the plurality of optical transfer surfaces of the second mold and one surface of the glass substrate disposed on the first mold;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A curing step of applying energy to the energetic curable resin to advance curing after the imprinting step.

According to the present invention, the energy curable resin is dropped and imprinted, and further irradiated with light, and then heated and cured without releasing the mold from the substrate. Even if it is a case where it does not harden | cure reliably, it can be hardened | cured reliably with an oven etc. separately at the time of a heating process. Therefore, the light irradiation time can be shortened, the work in the apparatus can be shortened, and as a result, the manufacturing efficiency can be improved. Moreover, according to this invention, the manufacturing method which shape | molds a highly accurate optical element on a glass substrate irrespective of the parallelism of a glass substrate can be provided.

It is a perspective view which shows schematic structure of a wafer lens. It is drawing which shows schematic structure of a wafer lens manufacturing apparatus. It is a perspective view which shows schematic structure of a submaster. It is a perspective view which shows schematic structure of the master of a submaster. It is a block diagram for demonstrating schematically the control structure of a wafer lens manufacturing apparatus. It is a part of manufacturing process of a wafer lens, and shows a process of performing parallel alignment using a reference spacer. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of dripping resin on one side of a glass substrate. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of pressing a glass substrate against a submaster and irradiating light. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of removing a submaster from a stamp holder. It is a part of manufacturing process of a wafer lens, and shows a process of performing parallel alignment using a reference spacer. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of dripping resin to the other surface of a glass substrate. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of pressing a glass substrate against a submaster and irradiating light. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of removing a submaster from a stamp holder. It is drawing which is a part of manufacturing process of a wafer lens, and shows the process of releasing a sub master of both surfaces from a glass substrate.

Next, a preferred embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the wafer lens 1 has a circular glass substrate 3 and a plurality of convex lens portions 5. The glass substrate 3 is an example of a substrate. A plurality of convex lens portions 4 and 5 are arranged in an array on the front and back surfaces of the glass substrate 3 (see FIG. 14). The convex lens portions 4 and 5 may have a fine structure such as a diffraction groove or a step on the surface of the optical surface.

In the present embodiment, it is a photo-curing resin, preferably a UV-curing resin, but is not limited thereto. That is, any resin that cures by applying energy (heat, light, etc.) may be used. In addition, as the said photocurable resin, an acrylic resin, an allyl ester resin, etc. can be used, for example, These resin can be reaction-hardened by radical polymerization. As another photocurable resin, for example, an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization. On the other hand, the thermosetting resin can be cured by addition polymerization such as silicon in addition to the above radical polymerization and cationic polymerization.

The convex lens portions 4 and 5 are formed of

resins

4A and 5A (see FIG. 14).

Resins

4A and 5A are photocurable resins. As the photocurable resin, for example, an acrylic resin or an allyl ester resin can be used, and these resins can be reaction-cured by radical polymerization. As another photocurable resin, for example, an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization.

Next, the wafer lens manufacturing apparatus 30 used when manufacturing the wafer lens 1 will be described.

As shown in FIG. 2, the wafer lens manufacturing apparatus 30 has a base 32. An opening 32a is formed in the upper part of the base 32, and a plate-like lid 321 is provided in the opening 32a so as to close the opening 32a. The lid portion 321 is light transmissive and is preferably formed of, for example, quartz glass.

The inside of the base 32 closed by the lid portion 321 is decompressed by a decompression mechanism 322 or the like. Specifically, the pressure is preferably reduced to 10 ⁻² MPa or less.

Further, a protrusion 34 protruding inward is formed on the upper portion of the base 32. Three guides 36 are erected at a predetermined interval between the bottom of the base 32 and the protrusion 34 (note that only two guides are shown in FIG. 2). The guide 36 is attached to the base 32 and the protruding portion 34 by flange portions. As a result, the base 32 and the projecting portion 34 can be attached with orthogonality. A stage 40 is provided between the guides 36. A slide guide 42 is formed on the stage 40, and a guide 36 passes through the slide guide 42.

Also, on the base 32 and below the stage 40, an elevating actuator 120 for elevating the stage 40 is provided. A shaft 122 is connected to the lift actuator 120.

A support portion 48 that protrudes inward is also formed below the stage 40 above the base 32. A height gauge 124 that measures the distance between the upper surface of the support portion 48 and the lower surface of the stage 40 is provided on the support portion 48.

On the stage 40, three geared motors 50 are provided at predetermined intervals (only two geared motors are shown in FIG. 2). A shaft 52 is connected to the geared motor 50. An XY stage 62 and a θ stage 64 are sequentially provided above the geared motor 50.

A load cell 44 is provided between the geared motor 50 and the lower surface of the XY stage 62. The tip of the shaft 52 is in contact with the load cell 44 by the weight of the XY stage 62. In the wafer lens manufacturing apparatus 30, the shaft 52 extends and contracts in the vertical direction by the operation of the geared motor 50, and accordingly, the XY stage 62 can move in the vertical direction.

Further, three height gauges 126 for measuring the distance between the upper surface of the stage 40 and the lower surface of the XY stage 62 are provided on the stage 40 at predetermined intervals (only two height gauges are shown in FIG. 2). ).

The XY stage 62 is movable on the XY plane (two-dimensional plane) above the load cell 44 and the height gauge 126. The θ stage 64 can be rotated with its central portion as a rotation axis.

An electrostatic chuck device (base) 70 is installed on the XY stage 62 and the θ stage 64. The electrostatic chuck device 70 applies a voltage to a metal electrode provided therein to generate positive and negative charges on the upper surface of the electrostatic chuck device 70 and the glass substrate 3 on the electrostatic chuck device 70. The glass substrate 3 is supported and fixed.

The stamp holder 80 is fixed to the upper part of the base 32. A light transmissive sub master 20 (first molding die) is fixed to the stamp holder 80. At the end of the stamp holder 80, the outer peripheral edge of the sub-master 20 is fitted, and a claw 82, a ring, or the like that holds the outer peripheral edge detachably is attached. The sub master 20 is fixed to the stamp holder 80 by mechanically holding the outer peripheral edge of the sub master 20 with a claw or a ring. The attachment / detachment mechanism between the stamp holder 80 and the sub master 20 is not limited to the above-described configuration as long as the sub master 20 can be detachably held with respect to the stamp holder 80.

A light source 90 is provided above the sub master 20. Light can be emitted toward the sub-master 20 by turning on the light source 90.

As shown in FIG. 3, the sub master 20 is mainly composed of a molding part 22 and a base material 26. A plurality of cavities 24 (concave portions), which are optical transfer surfaces, are formed in an array in the molding portion 22. The surface (molding surface) shape of the cavity 24 is a negative shape corresponding to the convex lens portion 5 in the wafer lens 1, and is recessed in a substantially hemispherical shape in FIG.

The molding part 22 is formed of a resin 22A. As the resin 22A, a resin having good releasability, particularly a transparent resin is preferable. It is excellent in that it can be released without applying a release agent. As the resin 22A, any of a photocurable resin, a thermosetting resin, and a thermoplastic resin may be used.

Even if the base material 26 is inferior in strength only by the molding part 22 of the sub master 20, the strength of the sub master 20 is increased by sticking the base material 26 to the molding part 22, and can be molded many times. It is a backing material.

The base material 26 may be made of a material different from that of the molding part 22 or may be integrally made of the same material as that of the molding part 22. When the base material 26 is made of a material different from that of the molding part 22, any material having smoothness such as quartz, silicone wafer, metal, glass, resin, ceramics and the like may be used. Constructing the base material 26 integrally with the same material as the molding part 22 means that the sub-master 20 is substantially constituted only by the molding part 22.

Here, the “submaster 20” is a first mold for molding the “convex lens portion 5”, and the “submaster 20B” shown in FIG. 12 is a second mold for molding the “convex lens portion 4”. It is a mold and distinguishes these. The “submaster 20B” basically has the same configuration and material as the “submaster 20”, and the surface shape of the cavity 24 is only a negative shape corresponding to the convex lens portion 4. Description is omitted.

In addition, in manufacturing the wafer lens 1 (forming the convex lens portion 5), the sub master 20 of FIG. 3 is mainly used, but in addition to this, the master 10 of FIG. 4 is also used. That is, the master 10 is a mother die used when the sub master 20 is manufactured, and the sub master 20 is a molding die used when the wafer lens 1 (convex lens portion 5) is molded. The sub-master 20 is used a plurality of times to mass-produce the wafer lens 1, and is different from the master 10 in the purpose of use, the frequency of use, and the like.

As shown in FIG. 4, the master 10 has a plurality of convex portions 14 formed in an array with respect to a rectangular parallelepiped base portion 12. The convex portion 14 is a portion corresponding to the convex lens portion 5 of the wafer lens 1 and protrudes in a substantially hemispherical shape. The outer shape of the master 10 may be a quadrangle or a circle as shown in FIG.

The surface (molding surface) shape of the convex portion 14 is a positive shape corresponding to the optical surface shape of the convex lens portion 5 that is molded and transferred onto the glass substrate 3.

As the material of the master 10, when an optical surface shape is created by machining such as cutting or grinding, metal or metal glass can be used. The classification includes ferrous materials and other alloys. Examples of the iron system include hot dies, cold dies, plastic dies, high-speed tool steel, general structural rolled steel, carbon steel for mechanical structure, chromium / molybdenum steel, and stainless steel. Among them, plastic molds include pre-hardened steel, quenched and tempered steel, and aging treated steel. Examples of pre-hardened steel include SC, SCM, and SUS. More specifically, the SC system is PXZ. SCM systems include HPM2, HPM7, PX5, and IMPAX. Examples of the SUS system include HPM38, HPM77, S-STAR, G-STAR, STAVAX, RAMAX-S, and PSL. Examples of the iron-based alloy include JP-A-2005-113161 and JP-A-2005-206913. As the non-ferrous alloys, copper alloys, aluminum alloys and zinc alloys are well known. Examples include the alloys disclosed in JP-A-10-219373 and JP-A-2000-176970. PdCuSi, PdCuSiNi, etc. are suitable as metallic glass materials because they have high machinability in diamond cutting and less tool wear. Amorphous alloys such as electroless and electrolytic nickel phosphorous plating are also suitable because they have good machinability in diamond cutting. These highly machinable materials may constitute the entire master 10 or may cover only the surface of the optical transfer surface, in particular, by a method such as plating or sputtering.

As shown in FIG. 5, the lift actuator 120, height gauge 124, load cell 44, height gauge 126, geared motor 50, XY stage 62, θ stage 64, electrostatic chuck device 70 (electrostatic mechanism), stamp holder 80, and light source 90 are controlled. It is connected to the device 100. The control device 100 controls the operation of these members. Particularly in the present embodiment, the control device 100 controls the operation (lifting amount) of the lifting actuator 120 based on the output value of the height gauge 124, or the operation (rotation amount) of the geared motor 50 based on the output values of the height gauge 126 and the load cell 44. Or to control.

Subsequently, a method for manufacturing the wafer lens 1 using the wafer lens manufacturing apparatus 30 will be described.

As shown in FIG. 6, first, the XY stage 62, the θ stage 64, and the electrostatic chuck device 70 are parallelized with respect to the stamp holder 80 using the reference spacer 130.

The reference spacer 130 has a plate shape whose upper and lower surfaces are parallel to each other. In parallel running, the reference spacer 130 is disposed on the electrostatic chuck device 70, the lifting actuator 120 is operated by the control device 100 to extend the shaft 122 upward, and the stage 40 is moved upward. The upper surface 130 a of the outer peripheral edge of 130 is brought into contact with the stamp holder 80. In this case, the control device 100 controls the operation of the lifting actuator 120 based on the output value of the height gauge 124, and moves the stage 40 to a predetermined height position. Further, the XY stage 62 and the θ stage 64 are controlled, and the geared motor 50 is also controlled based on the output values of the load cell 44 and the height gauge 126, so that the contact surface 80a (reference spacer 130) of the stamp holder 80 with the reference spacer 130 is controlled. The parallelism between the upper surface of the electrostatic chuck device 70 and the upper surface of the electrostatic chuck device 70, the equal load on the electrostatic chuck device 70, the distance between the upper surface of the stage 40 and the XY stage 62, and the like are also kept constant. After performing parallel alignment in this way, the control device 100 operates the lifting actuator 120 to contract the shaft 122 downward and take out the reference spacer 130.

Normally, it is possible to arrange parallel spacers by placing a similar spacer between the substrate on which the energy curable resin for the optical element is directly dispensed by molding, but the glass substrate used as a wafer lens is several mm. It is very thin as follows, and there are concerns about chipping and cracking due to contact with spacers, etc., and there is also a problem that the substrate itself is easily warped, and in addition to handling, the flatness of the substrate itself is not high. .

On the other hand, since the refractive index of the resin of the optical element to be molded and the refractive index of the glass substrate are not significantly different, when considering as a hybrid optical system of the substrate and the optical element, the optical surface of the optical element of the substrate in this The tilt with respect to the optical axis is not a big problem.

Therefore, it is possible to use the surface of the electrostatic chuck device that supports the molding die for molding the optical element on one surface when performing the glass substrate or double-sided molding, rather than performing parallel projection based on the glass substrate. In the case of performing the above, it is possible to avoid the problem that the entire mold is tilted and the molding is tilted with respect to the cured resin.

That is, in this way, the reference spacer 130 is used in advance so that the contact surface 80a of the stamp holder 80 and the upper surface of the electrostatic chuck device 70 are paralleled, so that it is higher than the parallel projection based on the glass substrate. An accurate wafer lens 1 can be manufactured.

Further, in this embodiment, since it is possible to perform paralleling before installing the glass substrate 3 and the submaster 20, it is not necessary to perform paralleling whenever necessary to install these members, and the number of processes is simplified. Can be achieved.

Further, in this embodiment, the process of adjusting the parallelism between the contact surface of the stamp holder and the upper surface of the electrostatic chuck device is described. However, when optical elements are formed on both surfaces of the glass substrate, static Since there is a case where a mold that is not released from the back surface of the glass substrate is placed instead of the upper surface of the electric chuck device, in that case, the molding surface between the mold and the contact surface of the stamp holder The parallelism may be adjusted by adjusting the parallelism between the upper surface of the electrostatic chuck device as a support member for supporting the molding die and the contact surface of the stamp holder.

In this embodiment, the parallelism between the molding surface of the sub master 20 and the upper surface of the electrostatic chuck device can be substantially maintained by abutting and holding the sub master 20 on the abutting surface of the stamp holder 80. The contact surface accuracy at the contact surface is ensured.

As shown in FIG. 7, the sub-master 20 is fixed to the stamp holder 80 by the above attachment / detachment mechanism, and the glass substrate 3 is installed to the electrostatic chuck device 70, and the glass substrate 3 is sucked and fixed by electrostatic suction. . Thereafter, a predetermined amount of resin 5A is dropped on the glass substrate 3 by a dispenser (not shown) or the like (first dispensing step).

In a state where the resin 5A is dropped on the glass substrate 3, as shown in FIG. 8, the position of the glass substrate 3 is controlled to move the glass substrate 3 to a predetermined position with respect to the sub master 20, and the glass substrate 3 is moved to the predetermined position. (1st imprint process).

Specifically, the lift actuator 120 is operated to extend the shaft 122 upward, and the stage 40 is moved upward. In this case, the control device 100 controls the operation of the lifting actuator 120 based on the output value of the height gauge 124, and moves the stage 40 to a predetermined height position.

In the wafer lens manufacturing apparatus 30, the height position of the stage 40 to be moved is set in advance in the control apparatus 100, and the electrostatic chuck apparatus 70 reaches the reference position S (see FIG. 7). When the electrostatic chuck device 70 reaches the reference position S, the operation of the elevating actuator 120 is stopped (position control process).

As a result, the resin 5A gradually spreads upon receiving the pressure of the glass substrate 3, and is filled in the cavity 24 of the submaster 20 as shown in FIG. Thereafter, with the stage 40 held at a position corresponding to the reference position S, the light source 90 is turned on, and the resin 5A is irradiated with light for a predetermined time via the light-transmitting sub-master 20, thereby curing the resin 5A to some extent. Advance. (First curing step: exposure step).

Here, when the resin 5A is cured (during or after the resin 5A is cured), if the stage 40 is held at a predetermined height position, the glass substrate 3 is not damaged even if the resin 5A is cured and contracted. There is a possibility that the resin 5A does not follow the shrinkage and distortion is generated inside the resin 5A, or the surface shape of the cavity 24 is not sufficiently transferred to the resin 5A.

Therefore, in this embodiment, when the light source 90 is turned on for a certain period of time and a certain amount of light is irradiated to the resin 5A, the pressure of the glass substrate 3 against the sub master 20 is controlled to a predetermined pressure by controlling the pressure of the glass substrate 3. Hold.

Specifically, the geared motor 50 is operated to extend the shaft 52 upward, and the XY stage 62, the θ stage 64, and the electrostatic chuck device 70 are moved upward. In this case, the control device 100 controls the operation of the geared motor 50 based on the output value of the load cell 44, and moves the stage 40 upward while maintaining the pressing force of the stage 40 against the sub master 20 at a predetermined pressure.

In the wafer lens manufacturing apparatus 30, the pressing force against the sub master 20 of the XY stage 62, the θ stage 64, and the electrostatic chuck apparatus 70 is preset in the control apparatus 100, and the control apparatus 100 is based on the output value received from the load cell 44. The operation of the geared motor 50 is controlled, and the pressing force with respect to the XY stage 62, the θ stage 64, and the sub master 20 of the electrostatic chuck device 70 is held at a predetermined pressure (pressure control step).

The control device 100 also controls the XY stage 62 and the θ stage 64 based on the output values of the load cell 44 and the height gauge 126, the parallelism between the glass substrate 3 and the sub master 20, the uniform load on the resin 5A, and the stage 40. The distance between the upper surface of the XY stage 62 and the XY stage 62 is also kept constant.

Thereafter, the light source 90 is turned off and the light irradiation to the resin 5A is stopped. In addition, you may stop the light irradiation with respect to 5A of resin before the said pressure control process.

As shown in FIG. 9, the sub master 20 is removed from the stamp holder 80 by releasing the fixing by the attaching / detaching mechanism without releasing the sub master 20 from the glass substrate 3. Then, the shaft 122 of the lift actuator 120 is contracted downward, and the stage 40 is moved downward.

As shown in FIG. 10, the new submaster 20B is fixed to the stamp holder 80 by the attaching / detaching mechanism, and the wafer lens 1 with the submaster 20 attached is turned upside down so that the electrostatic chuck device 70 is mounted. Install in. Then, the glass substrate 3 is sucked and fixed by electrostatic suction.

Thereafter, the sub-master 20 is paralleled to the sub-master 20B using the reference spacer 131. The reference spacer 131 has upper and lower surfaces parallel to each other, and a hole 131a is formed so that the glass substrate 3 is disposed inside. In paralleling, the glass substrate 3 is placed on the upper surface of the sub-master 20 so that the glass substrate 3 is disposed in the hole 131a. And the raising / lowering actuator 120 is operated by the control apparatus 100, the shaft 122 is extended upwards, and the stage 40 is moved upwards. In this case, the control device 100 controls the operation of the lifting actuator 120 based on the output value of the height gauge 124, and moves the stage 40 to a predetermined height position. Further, the XY stage 62 and the θ stage 64 are controlled, and the geared motor 50 is also controlled based on the output values of the load cell 44 and the height gauge 126, so that the upper surface which is the molding surface of the submaster 20 and the molding surface of the submaster 20B are controlled. The parallelism with a certain lower surface, the uniform load on the glass substrate 3, the distance between the upper surface of the stage 40 and the XY stage 62, etc. are also kept constant. After performing parallel alignment in this way, the control device 100 operates the lifting actuator 120 to contract the shaft 122 downward and take out the reference spacer 131.

In this way, by performing parallel projection between the upper surface of the sub-master 20 and the lower surface of the sub-master 20B with the reference spacer 131 in advance, compared with the parallel projection between the stamp holder and the electrostatic chuck as shown in FIG. As a result, the wafer lens 1 can be manufactured with higher accuracy because the molding surfaces of the molding die to be actually molded are parallel to each other.

In the above description, the stamp holder and the electrostatic chuck shown in FIG. 6 are paralleled, and the submasters 20 and 20B are further paralleled as shown in FIG. 10 as an example. However, the present invention is not necessarily limited to this.

That is, only the stamp holder reference parallel configuration shown in FIG. 6 and the description thereof, or only the configuration of the molds parallel reference shown in FIG. 10 and the description description may be performed.

In particular, the paralleling step is a labor-intensive work, but when focusing on optical performance such as decentering and tilting of corresponding upper and lower optical elements such as double-sided molding, the configuration shown in FIG. It is preferable to adopt the configuration shown in FIG. 6 in order to minimize the work involved in taking out and perform the molding work efficiently.

Thereafter, as shown in FIG. 11, a predetermined amount of resin 4A is dropped onto the glass substrate 3 by a dispenser (not shown) or the like (second dispensing step).

In this state, as shown in FIG. 12, the position of the glass substrate 3 is controlled, the glass substrate 3 is moved to a predetermined position with respect to the sub master 20B, and the glass substrate 3 is held at the predetermined position (second imprint process). ).

More specifically, as in the above-described position control step of FIG. 8, the lift actuator 120 is operated to extend the shaft 122 upward and move the stage 40 upward. Also in this case, the control device 100 controls the operation of the elevating actuator 120 based on the output value of the height gauge 124, and moves the stage 40 to a predetermined height position (position control process).

As a result, the resin 4A gradually receives the pressure of the glass substrate 3 and spreads to fill the cavity 24B of the sub master 20B. Thereafter, the light source 90 is turned on while the stage 40 is held at a position corresponding to the reference position, and as shown in FIG. 12, the resin 4A is irradiated with light for a predetermined time via the light-transmitting sub master 20B. 4A curing is advanced to some extent. (Second curing step: exposure step).

Here, when the resin 4A is cured (during or after the resin 4A is cured), the resin 4A also undergoes curing shrinkage as in the case of the resin 5A described above. Therefore, when the light source 90 is turned on for a certain period of time and a certain amount of light is irradiated onto the resin 4A, the pressure of the glass substrate 3 is controlled to a predetermined pressure by controlling the pressure of the glass substrate 3.

Specifically, as in the pressure control step of FIG. 8 described above, the geared motor 50 is operated to extend the shaft 52 upward, and the XY stage 62, θ stage 64, and electrostatic chuck device 70 are moved upward. In this case, the control device 100 controls the operation of the geared motor 50 based on the output value of the load cell 44, and moves the stage 40 upward while maintaining the pressing force of the stage 40 against the sub master 20 at a predetermined pressure (pressure control process). ).

The control device 100 also controls the XY stage 62 and the θ stage 64 based on the output values of the load cell 44 and the height gauge 126, the parallelism between the glass substrate 3 and the sub master 20B, the uniform load on the resin 4A, and the stage 40. The distance between the upper surface of the XY stage 62 and the XY stage 62 is also kept constant.

Thereafter, the light source 90 is turned off and the light irradiation to the resin 5A is stopped. The light irradiation on the resin 4A may be stopped before the pressure control step in FIG.

As shown in FIG. 13, the sub-master 20B is removed from the stamp holder 80 by releasing the fixing by the above-described attaching / detaching mechanism without releasing the sub-master 20B from the glass substrate 3. Then, the shaft 122 of the lift actuator 120 is contracted downward, and the stage 40 is moved downward.

Thereafter, as shown in FIG. 14, the wafer lens 1 is taken out from the wafer lens manufacturing apparatus 30 with the

sub masters

20 and 20B attached. Then, the

resin

4A, 5A is completely cured by post-curing in an oven or the like and cured by heating (third curing step: heating step).

Finally, the

sub masters

20 and 20B are released (release process).

Thus, the wafer lens 1 having the convex lens portions 4 and 5 formed on the front and back surfaces of the glass substrate 3 is formed.

In this embodiment, the resin is completely cured by the third curing step, but the present invention is not necessarily limited to this. That is, you may perform the hardening process which advances hardening further after releasing from the

submasters

20 and 20B. As a result, the curing step can be separated into a plurality of steps, so that it is possible to reduce a sudden change in optical characteristics of the resin.

According to the above embodiment, the

resins

4A and 5A are dropped (first and second dispensing steps), imprinted (first and second imprinting steps), and irradiated with light (first and second curing). After the process, the sub-master 20, 20B is heat-cured in a state where it is not released from the glass substrate 3 (in this embodiment, the third curing process is applicable, but in another embodiment, the second curing process is applicable in some cases. Therefore, even if the

resins

4A and 5A are not reliably cured when irradiated with light, they can be taken out from the wafer lens manufacturing apparatus 30 and reliably heat-cured separately in an oven or the like. Therefore, it is possible to shorten the light irradiation time performed in the wafer lens manufacturing apparatus 30 and to shorten the work in the wafer lens manufacturing apparatus 30. As a result, manufacturing efficiency can be improved.

Since the first and second dispensing processes, the first and second imprint processes, and the first and second curing processes are performed under reduced pressure, entrainment of bubbles in the

resins

4A and 5A, and the resins in the

sub masters

20 and 20B Generation of unfilled portions of 4A and 5A can be prevented. Furthermore, in the first and second curing steps, oxygen inhibition to the resin can be prevented, and the resin can be reliably cured. As a result, a highly accurate wafer lens 1 can be obtained.

Further, in the stage before light irradiation with respect to the resin 5A, the electrostatic chuck device 70 is raised to the reference position S based on the output value of the height gauge 124 and held at the reference position S, and the position of the glass substrate 3 is controlled. On the other hand, in the stage after the light irradiation to the resin 5A, the pressing force of the stage 40 on the sub master 20 is held at a predetermined pressure based on the output value of the load cell 44, and the glass substrate 3 is pressure controlled (load control). That is, the control of the glass substrate 3 is switched from the position control to the pressure control before and after the light irradiation to the resin 5A.

Therefore, even if the resin 5A undergoes curing shrinkage due to light irradiation to the resin 5A, the resin 5A can be forcibly pressed against the cavity 24 of the submaster 20 at a constant pressure following the volume change of the resin 5A. it can. As a result, it is possible to suppress the occurrence of distortion inside the resin 5A or the insufficient transfer of the surface shape of the cavity 24 to the resin 5A, and the transfer from the cavity 24 of the submaster 20 to the resin 5A. It is possible to suppress the deterioration of the property.

Furthermore, in the wafer lens manufacturing apparatus 30, since the

sub masters

20 and 20B are detachably held with respect to the stamp holder 80, the

sub masters

20 and 20B can be easily detached from the stamp holder 80. Therefore, the wafer lens 1 can be taken out from the wafer lens manufacturing apparatus 30 without releasing the sub-masters 20 and 20B, and can be reliably heat-cured separately in an oven or the like. It leads to shortening.

In addition, this invention is not limited to the said embodiment, In the range which does not change the summary, it can change suitably.

For example, in the above-described embodiment, an example in which the resinous convex lens portions 4 and 5 are formed from the sub-masters 20 and 20B has been described. It is also applicable when forming

In the above embodiment, the inside of the wafer lens manufacturing apparatus 30 is depressurized and the exposure process is performed under reduced pressure. However, it may be performed in the atmosphere.

Further, although the convex lens portions 4 and 5 are provided on the front and back surfaces of the glass substrate 3, the convex lens portion may be provided only on one surface. In this case, the first dispensing step, the first imprinting step, and the first curing step are performed as shown in FIGS. 6 to 8, and the submaster 20 is removed from the stamp holder 80 as shown in FIG. The wafer lens 1 is taken out from the wafer lens manufacturing apparatus 30 without releasing the mold 20. Then, the resin may be completely cured by heating and irradiation as in the third curing step.

It should be noted that the curing process after attaching / detaching the submaster from the stamp holder 80 is not necessarily a different kind of curing process from the curing process before attaching / detaching, and may be the same kind of curing process with the same or different irradiation conditions.

Also, the installation position of the glass substrate 3 and the installation position of the sub master 20 may be reversed. Although not shown in detail, the sub master 20 is sucked and fixed to the electrostatic chuck device 70, while the glass substrate 3 is held by the stamp holder 80. Then, the resin 5A is dropped on the sub master 20, and the resin 5A is filled in the cavity 24 by moving the sub master 20 side upward against the glass substrate 3 and pressing it. Next, the resin 4A is dropped onto the other surface (the surface opposite to the resin 5A) of the glass substrate 3 with light irradiation without releasing the sub master 20. Thereafter, the resin 4A is filled into the cavity 24B by moving the glass substrate 3 side upward against the sub-master 20B newly attached to the stamp holder 80 and pressing it. Thereafter, the wafer lens 1 is taken out from the apparatus 30 with light irradiation without releasing the

sub masters

20 and 20B, and the

resins

4A and 5A are heated and cured by an oven or the like.

Further, in the position control process, the position control and pressure control of the glass substrate 3 may be executed simultaneously. That is, when the glass substrate 3 is moved to a predetermined position, the pressure of the glass substrate 3 is controlled to keep the pressing force of the glass substrate 3 against the sub master 20 below a predetermined pressure.

Specifically, in addition to the control device 100 controlling the movement of the stage 40 based on the output value of the height gauge 124, the output value of the load cell 44 is always referred to, and the operation of the geared motor 50 is controlled to control the sub-stage of the stage 40. The pressing force on the master 20 is kept below a predetermined pressure. In this case, it is possible to prevent the resin 5A from being loaded more than necessary, and the deformation of the sub master 20 can be reliably prevented.

In the pressure control process, the operation of the geared motor 50 may be controlled in real time based on the output value of the load cell 44. That is, with a certain pressing force preset for the control device 100 as a threshold value, when the control device 100 receives the output value of the load cell 44 and the output value exceeds the threshold value, the geared motor 50 is operated. When the output value of the load cell 44 becomes less than the threshold value, the operation of the geared motor 50 is resumed.

DESCRIPTION OF SYMBOLS 1 Wafer lens 3 Glass substrate 4, 5

Convex lens part

4A,

5A Resin

20,

20B Sub master

24, 24B Cavity 30 Wafer lens manufacturing apparatus 62 XY stage 64 (theta) stage 70 Electrostatic chuck apparatus 80 Stamp holder 82 Claw

Claims

An optical component manufacturing method in which an optical member made of energetic curable resin is provided on one surface of a substrate,
A dispensing step of dropping or discharging the energetic curable resin between a molding die having a plurality of negative-shaped molding surfaces corresponding to the optical surface shape of the optical member, and one surface of the substrate;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the substrate;
After the imprinting step, a first curing step of applying energy to the energetic curable resin to advance curing;
A second curing step in which energy is given to the energy-curable curable resin to further cure the mold without releasing the mold from the substrate;
An optical component manufacturing method comprising:
The first curing step is an exposure step of irradiating light as energy,
The method of manufacturing an optical component according to claim 1, wherein the second curing step is a heating step of heating.
3. The method of manufacturing an optical component according to claim 1, wherein the dispensing step, the imprinting step, and the first curing step are performed under reduced pressure.
4. The method of manufacturing an optical component according to claim 1, wherein the optical component is a wafer lens in which a plurality of optical elements are arranged in a wafer shape.
An optical component manufacturing method in which an optical member made of energy-curable resin is provided on both sides of a substrate,
The energy-curable curable resin is dropped or discharged between a first mold having a plurality of negative-shaped molding surfaces corresponding to the shape of the optical member formed on one surface of the substrate and the one surface of the substrate. A first dispensing step,
A first imprinting step of pressing the energy-curable curable resin against the first mold or the substrate after the first dispensing step;
After the first imprint step, a first curing step of applying energy to the energetic curable resin to advance curing;
In a state where the first molding die is not released from the substrate, the first molding die and the substrate are reversed, and a negative molding surface corresponding to the shape of the optical member formed on the other surface of the substrate is formed. A second dispensing step of dropping or discharging the energetic curable resin between a plurality of second molds and the other surface of the substrate;
A second imprinting step of pressing the energy-curable curable resin against the second mold or the substrate after the second dispensing step;
After the second imprint step, a second curing step of applying energy to the energetic curable resin to promote curing;
The energy-curable curable resin cured in the first curing step between the first mold and the substrate without releasing the first mold and the second mold from the substrate and the first mold A third curing step for further curing by applying energy to at least one of the energy-curable resins cured in the second curing step between the mold and the substrate;
An optical component manufacturing method comprising:
The first curing step and the second curing step are exposure steps for irradiating light,
The method for manufacturing an optical component according to claim 5, wherein the third curing step is a heating step of heating.
The first dispensing step, the first imprinting step, the first curing step, the second dispensing step, the second imprinting step, and the second curing step are performed under reduced pressure. A method for producing the optical component according to 5 or 6.
The method of manufacturing an optical component according to any one of claims 5 to 7, wherein the optical component is a wafer lens in which a plurality of optical elements are arranged on a wafer.
An optical component manufacturing apparatus for manufacturing an optical component in which an optical member made of an energy curable resin is provided on at least one surface of a substrate,
A base on which the substrate is disposed;
A holder that holds and holds a molding die having a plurality of negative-shaped molding surfaces corresponding to the shape of the optical member, with respect to the substrate,
The mold is detachable from the holder,
The mold is attached to the holder, the energy curable resin is filled between one surface of the substrate and the mold, and energy is applied to the energy curable resin to proceed with curing. An optical component manufacturing apparatus, wherein the molding die is removed from the holder without releasing the molding die from the substrate.
10. The optical component manufacturing apparatus according to claim 9, wherein the optical component is a wafer lens in which a plurality of optical elements are arranged on a wafer.
By placing an energy-curable resin between one surface of the glass substrate supported by the support member and the plurality of optical transfer surfaces of the molding die and press-molding, a negative shape of the optical transfer surface is formed on the glass substrate surface. A wafer lens molding method in which a plurality of optical elements made of energy curable resin having a corresponding shape are formed,
An adjustment step of adjusting the parallelism between the surface of the support member that contacts the glass substrate and the mold;
Placing the glass substrate on the surface of the support member;
A dispensing step of dropping or discharging an energy curable resin between a plurality of optical transfer surfaces of the mold adjusted in the adjustment step and one surface of the glass substrate supported by the support member;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A method of manufacturing a wafer lens comprising: a curing step of applying energy to the energetic curable resin to advance curing after the imprinting step.
The adjusting step includes a first surface that abuts each of the surfaces and a second surface parallel to the first surface between the surface of the support member and one surface of the mold holding member that holds the mold. And a spacer having a first surface, a first surface of the spacer, a second surface of the spacer, and one surface of the mold holding member member. Item 12. A method for producing a wafer lens according to Item 11.
In the adjusting step, a spacer having a first surface that abuts each surface and a second surface parallel to the first surface is disposed between the surface of the support member and one surface of the mold, 12. The method of manufacturing a wafer lens according to claim 11, wherein the wafer lens is manufactured by bringing the surface of the support member into contact with the first surface of the spacer, the second surface of the spacer, and one surface of the mold.
By placing and molding the energetic curable resin between one surface of the glass substrate supported by the electrostatic chuck device and a plurality of optical transfer surfaces of the mold held by the mold holding member, the glass A wafer lens molding method in which a plurality of optical elements made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface is formed on one surface of a substrate,
A spacer having a first surface in contact with each surface and a second surface parallel to the first surface between the surface of the electrostatic chuck device on which the glass substrate is disposed and one surface of the mold holding member. A spacer abutting step for abutting the surface of the electrostatic chuck device with the first surface of the spacer, the second surface of the spacer, and one surface of the mold holding member member;
After the spacer contact step, a step of taking out the spacer from between the electrostatic chuck device and the mold holding member;
Placing a glass substrate on the surface of the electrostatic chuck device;
Fixing the mold on one surface of the mold holding member;
A dispensing step of dropping or discharging an energetic curable resin between a plurality of optical transfer surfaces of the mold and one surface of the glass substrate;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A method of manufacturing a wafer lens comprising: a curing step of applying energy to the energetic curable resin to advance curing after the imprinting step.
In a state where one surface of the glass substrate is supported by a first mold having a plurality of optical transfer surfaces formed on the molding surface, it is formed on the other surface of the glass substrate and the molding surface of the second mold. An optical element made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface on the glass substrate by arranging and molding the energy curable resin between the plurality of optical transfer surfaces. A method of molding a plurality of formed wafer lenses,
A spacer having a first surface abutting on each molding surface and a second surface parallel to the first surface between the molding surface of the first molding die and the molding surface of the second molding die. A spacer contact step in which the molding surface of the first molding die and the first surface of the spacer, the second surface of the spacer and the molding surface of the second molding die are respectively contacted,
After the spacer contact step, a step of taking out the spacer from between the first and second molding dies,
Placing a glass substrate on the first mold;
A dispensing step of dropping or discharging an energy curable resin between the plurality of optical transfer surfaces of the second mold and one surface of the glass substrate disposed on the first mold;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A method of manufacturing a wafer lens comprising: a curing step of applying energy to the energetic curable resin to advance curing after the imprinting step.
Before the spacer contact step, after the dispensing of dropping or discharging the energy curable resin between the plurality of optical transfer surfaces of the first mold and one surface of the glass substrate, the energy curable resin The method of manufacturing a wafer lens according to claim 15, further comprising an imprinting step of pressing the mold against the mold or the glass substrate.
In a state where one surface of the glass substrate is supported by a first mold having a plurality of optical transfer surfaces formed on the molding surface, it is formed on the other surface of the glass substrate and the molding surface of the second mold. An optical element made of energy curable resin having a shape corresponding to the negative shape of the optical transfer surface on the glass substrate by arranging and molding the energy curable resin between the plurality of optical transfer surfaces. A method of molding a plurality of formed wafer lenses,
Between the surface of the support member that contacts the first mold and one surface of the mold holding member, a first surface that contacts each of the surfaces and a second surface that is parallel to the first surface are provided. A spacer contact step in which a spacer is disposed, and the surface of the support member and the first surface of the spacer, and the second surface of the spacer and one surface of the support member are contacted;
After the spacer contact step, a step of taking out the spacer from between the support member and the mold holding member,
Disposing a first mold having a plurality of optical transfer surfaces formed on a molding surface on the support member;
Holding the second mold on the mold holding member;
A dispensing step of dropping or discharging an energy curable resin between the plurality of optical transfer surfaces of the second mold and one surface of the glass substrate disposed on the first mold;
After the dispensing step, an imprint step of pressing the energy curable resin against the mold or the glass substrate;
A method of manufacturing a wafer lens comprising: a curing step of applying energy to the energetic curable resin to advance curing after the imprinting step.