WO2010044307A1 - Illumination optical system, aligner, and process for fabricating device - Google Patents

Illumination optical system, aligner, and process for fabricating device Download PDF

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Publication number
WO2010044307A1
WO2010044307A1 PCT/JP2009/064103 JP2009064103W WO2010044307A1 WO 2010044307 A1 WO2010044307 A1 WO 2010044307A1 JP 2009064103 W JP2009064103 W JP 2009064103W WO 2010044307 A1 WO2010044307 A1 WO 2010044307A1
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Prior art keywords
intensity distribution
surface
light
optical system
pupil
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PCT/JP2009/064103
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French (fr)
Japanese (ja)
Inventor
谷津 修
道男 登
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株式会社ニコン
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Priority to US13692408P priority Critical
Priority to US61/136,924 priority
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Publication of WO2010044307A1 publication Critical patent/WO2010044307A1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane, angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole, quadrupole; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116Off-axis setting using a programmable means, e.g. LCD or DMD

Abstract

An illumination distribution on a surface to be irradiated and a pupil intensity distribution at each point on the surface to be irradiated can be regulated, respectively, to desired distributions.  An illumination optical system, for illuminating the surfaces (M; W) to be irradiated based on the light from a light source (LS), comprises a spatial light modulator (3) having a plurality of optical elements arranged two-dimensionally and controlled individually, a focusing optical system (4) for forming based on the light passed through the spatial light modulator a predetermined light intensity distribution on a surface (5a) providing Fourier transform optically with respect to a surface where the plurality of optical elements are arranged, an optical integrator (5) having a plurality of unit wave front splitting surfaces arranged two-dimensionally on the surface providing Fourier transform, and a control section (CR) for regulating the pupil intensity distribution formed on the illumination pupil to a desired distribution based on the light from the spatial light modulator, and controlling the spatial light modulator in order to regulate the light intensity distribution formed on each of the plurality of unit wave front splitting surfaces, respectively, to a required distribution.

Description

An illumination optical system, exposure apparatus, and device manufacturing method

The present invention is an illumination optical system, exposure apparatus, and a device manufacturing method. More particularly, the present invention relates to a semiconductor device, the present invention relates to an imaging device, a liquid crystal display device, an illumination optical system suitably applicable to exposure apparatus for manufacturing devices such as thin-film magnetic heads by lithography.

In a typical exposure apparatus of this type, light emitted from the light source travels through a fly's eye lens as an optical integrator, the secondary light source (generally illumination pupil as a substantial surface illuminant consisting of a large number of light sources forming a predetermined light intensity distribution) in the. The light intensity distribution on the illumination pupil will be referred to hereinafter as "pupil intensity distribution". Further, the illumination pupil, by the action of the optical system between the illumination pupil and the surface to be illuminated (the mask or wafer in the case of an exposure apparatus), a position such that the irradiated surface is the Fourier transform plane of the illumination pupil It is defined.

Light from the secondary light source are condensed by a condenser lens to superposedly illuminate a mask on which a predetermined pattern is formed. Light transmitted through the mask is imaged on a wafer through a projection optical system, it is on a wafer a mask pattern is projected and exposed (transferred). Pattern formed on the mask is a highly integrated, in order to accurately transfer this microscopic pattern onto the wafer, it is essential to obtain a uniform illuminance distribution on the wafer.

Further, for example, annular or multi-polar shape (dipolar, quadrupolar, etc.) to form a pupil intensity distribution, see the focal technique for improving the depth and resolution has been proposed (Patent Document 1 of the projection optical system ).

US Patent Publication No. 2006/0055834 discloses

A fine pattern of the mask to faithfully transferred onto the wafer, not only by adjusting the pupil intensity distribution into a desired shape, it is necessary to adjust the substantially uniform respective pupil intensity distributions about respective points on the wafer. If there is variation in uniformity of the pupil intensity distributions at respective points on the wafer, and variations in line width of the pattern for each position on the wafer, a desired line width across the fine pattern of the mask to the entire exposure area It can not be transferred onto the wafer. Thus, the fine pattern of the mask to accurately transferred onto the wafer is to adjust the illuminance distribution and the pupil intensity distribution about each point on the wafer on the wafer as a final surface to be illuminated in the desired distribution is important.

The present invention has been made in view of the problems described above, providing an illumination optical system capable of adjusting the pupil intensity distribution about each point of the illuminance distribution and the illuminated surface in the irradiated surface to a desired distribution the interest. Further, the present invention uses an illumination optical system capable of adjusting the pupil intensity distribution about each point on the illuminance distribution and the irradiated surface on the irradiated surface to a desired distribution, under appropriate lighting conditions and an object thereof is to provide an exposure apparatus capable of performing good exposure.

In order to solve the above problems, in the first embodiment of the present invention, in the illumination optical system for illuminating an illumination target surface on the basis of light from a light source,
A spatial light modulator having a plurality of optical elements to be controlled individually are arranged two-dimensionally,
On the basis of the light through the spatial light modulator, a focusing optical system for forming a predetermined light intensity distribution on the array surface and optically a Fourier transform plane of said plurality of optical elements of the spatial light modulator ,
And optical integrator having a plurality of unit wavefront division surface are two-dimensionally arranged on a surface to be the Fourier transform,
With adjusting the pupil intensity distribution formed on the illumination pupil on the basis of light from said spatial light modulator through the light converging optical system and the optical integrator to a required distribution, each of the plurality of unit wavefront division surface said and a control unit for controlling the spatial light modulator in order to adjust the light intensity distribution formed on the predetermined distribution, respectively to provide an illumination optical system according to claim.

In the second embodiment of the present invention, it comprises a first form illumination optical system for illuminating a predetermined pattern, to provide an exposure apparatus, characterized by exposure of the predetermined pattern on a photosensitive substrate.

In a third embodiment of the present invention, an exposure step of using the exposure apparatus of the second embodiment, exposure of the predetermined pattern on the photosensitive substrate,
A developing step of the predetermined pattern is developing the photosensitive substrate that has been transferred, to form a mask layer in a shape corresponding to the predetermined pattern on the surface of the photosensitive substrate,
To provide a device manufacturing method characterized by comprising a processing step of processing the surface of the photosensitive substrate through the mask layer.

The illumination optical system of the present invention, the control unit controls the plurality of optical elements of the spatial light modulator, by appropriately changing the light intensity distribution formed in each unit wavefront dividing surfaces of the optical integrator, the illuminated surface the illuminance distribution formed thereby adjusted to a desired distribution (for example, uniform distribution) can be adjusted to a desired distribution respectively the pupil intensity distribution about each point of the illuminated surface (e.g. uniform distribution) in.

That is, in the illumination optical system of the present invention, it is possible to adjust the pupil intensity distribution about each point of the illuminance distribution and the illuminated surface in the irradiated surface to a desired distribution. As a result, the exposure apparatus of the present invention, by using the illumination optical system capable of adjusting the pupil intensity distribution about each point of the illuminance distribution and the illuminated surface in the irradiated surface to a desired distribution, also the appropriate lighting conditions it can perform good exposure in a can be produced and thus good device.

The structure of an exposure apparatus according to an embodiment of the present invention is a diagram schematically showing. Is a diagram illustrating the operation of the spatial light modulators in the spatial light modulation unit. It is a partial perspective view of a main part of the spatial light modulator. The two-pole-like light intensity distribution formed on the illumination pupil is a diagram schematically illustrating. Configuration of the entrance surface of the micro fly's eye lens, and a unit wavefront division faces the light incident in response to the pupil intensity distribution of FIG. 4 is a diagram schematically showing. It is a first diagram for explaining the operation of the present embodiment. Is a diagram illustrating a pupil intensity distributions related to the respective points P1, P2, P3 in FIG. 6. It is a second diagram for explaining the operation of the present embodiment. Is a diagram illustrating a pupil intensity distributions related to the respective points P1, P2, P3 in FIG. 8. Is a flowchart showing manufacturing steps of a semiconductor device. It is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display device.

The embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 is a diagram schematically showing a configuration of an exposure apparatus according to an embodiment of the present invention. 1, the Z-axis along the normal direction of the transfer surface of the wafer W being a photosensitive substrate (exposure surface), the Y-axis along a direction parallel to the plane of FIG. 1 in the transfer surface of the wafer W, the wafer W and the X-axis in a direction perpendicular to the plane of FIG. 1 in the transfer plane of the.

Referring to FIG. 1, in the exposure apparatus of the present embodiment, the exposure light from the light source LS (illumination light) is supplied. As a light source LS, or the like can be used KrF excimer laser light source for supplying light of wavelength of ArF excimer laser light source or 248nm supplies light with a wavelength of for example 193 nm. Light emitted from the light source LS, through the beam sending unit 1, incident on the spatial light modulation unit SU. Beam light transmitting unit 1, while converting the light beam having a cross-section of the appropriate size and shape of the incident light beam from the light source LS and guides to the spatial light modulation unit SU, the position change of the light beam incident on the spatial light modulation unit SU and it has a function of correcting the angular variations active.

The spatial light modulation unit SU, space and the spatial light modulator 3 having a plurality of mirror elements that are controlled individually arranged two-dimensionally, the light incident on the spatial light modulation unit SU via the beam sending unit 1 and a light guide member 2 for guiding and light that has passed through the spatial light modulator 3 guided to the optical modulator 3 to a subsequent relay optical system 4. Later detailed configuration and action of the spatial light modulation unit SU. The light emitted from the spatial light modulation unit SU via the relay optical system 4 and enters the micro fly's eye lens (or fly's eye lens) 5.

Relay optical system 4, and the position of the incident surface 5a of a front-side focal position and the spatial light modulator and the position of the array surface of the mirror element 3 is substantially equal and rear focal position and the micro fly's eye lens 5 It is set to be substantially coincident. Therefore, as described later, the light passing through the spatial light modulator 3, the entrance surface 5a of the micro fly's eye lens 5 to form a desired light intensity distribution according to the postures of the mirror elements. Micro fly's eye lens 5 is an optical element consisting of a large number of microscopic lenses with a positive refractive power for example is arrayed vertically and horizontally and densely, made by forming micro lens group by etching of a plane-parallel plate It is.

The micro fly's eye lens, different from the fly's eye lens consisting of lens elements isolated from each other, are integrally formed without a large number of micro lenses (micro refracting surfaces) are isolated from each other. However, the micro fly's eye lens in that the lens elements are arranged vertically and horizontally is an optical integrator of the same wavefront splitting type as the fly's eye lens. Rectangular microscopic refracting surfaces as a unit wavefront dividing surface in the micro fly's eye lens 5, (the shape of an exposure region to be formed and thus on the wafer W) illumination field shape to be formed on the mask M, similar to a rectangular shape it is. As the micro fly's eye lens 5, for example it is also possible to use a cylindrical micro fly's eye lens. Configuration and action of the cylindrical micro fly's eye lens is disclosed, for example, in U.S. Pat. No. 6,913,373.

Micro fly's eye light beam incident on the lens 5 is divided two-dimensionally by many micro lenses, the illumination pupil rear focal plane or in the vicinity thereof, substantially the same light intensity distribution as the illumination field formed by the incident light beam secondary light source having (i.e. pupil intensity distribution) are formed. The light beam from the rear focal plane or the secondary light source formed near the of the micro fly's eye lens 5 is incident on the aperture stop 6 disposed in the vicinity.

Aperture stop 6 has openings having a shape corresponding to the secondary light source formed on or near the rear focal plane of the micro fly's eye lens 5 (light transmitting unit). Aperture stop 6, the illumination optical path removably configured for, and a plurality of aperture stop and switchably configured and having a size and different opening shapes. As an aperture stop for switching method, for example, it can be used such as the well-known turret method and slide method. The aperture stop 6 is disposed in a position substantially conjugate to the entrance pupil plane and the optical projection optical system PL that will be described later, to define the contributing range illumination of the secondary light sources. It is also possible to omit the installation of the aperture stop 6.

Light from the secondary light source limited by the aperture stop 6 through a condenser optical system 7 to superposedly illuminate a mask blind 8. Thus, the mask blind 8 as an illumination field stop is rectangular illumination field according to the shape and focal length of the rectangular microscopic refracting surface of the micro fly's eye lens 5 is formed. The light beam through the rectangular aperture of the mask blind 8 (light transmitting portion) is subjected to a condensing action of imaging optical system 9 to superposedly illuminate the mask M on which a predetermined pattern is formed. That is, the imaging optical system 9 will form an image of the rectangular aperture of the mask blind 8 on the mask M.

The light beam which has passed through the mask M held on the mask stage MS is through the projection optical system PL, to form an image of the mask pattern on the wafer (photosensitive substrate) W held on a wafer stage WS. Thus, the projection while two-dimensionally driving and controlling the wafer stage WS in the optical system PL of the optical axis AX perpendicular to the plane (XY plane), the one-shot exposure or scan exposure while two-dimensionally driving and controlling the turn wafer W by performing, in each exposure region of the wafer W pattern of the mask M is successively exposed.

In this embodiment, the secondary light source formed by the micro fly's eye lens 5 as the light source, a mask M disposed on the irradiated surface of the illumination optical system to Koehler illumination. Therefore, the position where the secondary light source is formed is a position optically conjugate of the aperture stop AS of the projection optical system PL, and can be called a forming surface of the secondary light source and the illumination pupil plane of the illumination optical system. Typically, the optical surface (the surface on which the wafer W is arranged in the case where the illumination optical system is considered, including the face mask M is placed or the projection optical system PL,) with respect to the illumination pupil plane surface to be illuminated becomes a Fourier transform plane. Note that the pupil intensity distribution is a light intensity distribution on the illumination pupil plane or the illumination pupil plane optically conjugate with the plane of the illumination optical system (luminance distribution).

If the number of wavefront divisions by the micro fly's eye lens 5 is relatively large, the global light intensity distribution formed on the entrance surface of the micro fly's eye lens 5, global light intensity distribution of the entire secondary light source (pupil intensity distribution ) and it shows a high correlation. Therefore, it can be referred to as also the pupil intensity distribution for the light intensity distribution on the incident surface and the entrance surface optically conjugate with the plane of the micro fly's eye lens 5. Configuration In the configuration of FIG. 1, the spatial light modulation unit SU, the relay optical system 4, and the micro fly's eye lens 5, a distribution forming optical system for forming a pupil intensity distribution on the illumination pupil of the rearward of the micro fly's eye lens 5 doing.

Referring to FIG. 2, the light guide member 2 in the spatial light modulation unit SU has the form of a triangular prism shaped prism mirror extending for example in the X direction. Light from the light source LS having passed through the beam sending unit 1 is reflected by the first reflecting surface 2a of the light guide member 2, and is incident on the spatial light modulator 3. The light modulated by the spatial light modulator 3 is reflected by the second reflecting surface 2b of the light guide member 2, it is guided to the relay optical system 4.

The spatial light modulator 3, as shown in FIGS. 2 and 3, the main body 3a and the driving unit for individually driving and controlling the attitude of the mirror elements SE having a plurality of mirror elements SE arranged two-dimensionally and a 3b. For simplicity of explanation and illustration, the body 3a of FIGS. 2 and 3, the spatial light modulator 3 illustrates a configuration example in which a 4 × 4 = 16 mirror elements SE, in practice 16 It has a much larger number of mirror elements SE than.

Referring to FIG. 2, among the group of light beams incident on the first reflecting surface 2a of the light guide member 2 along the optical axis AX direction parallel light rays L1 to mirror element SEa of the plurality of mirror elements SE, light L2 is incident to a mirror element SEb different from the mirror element SEa. Similarly, light rays L3 are mirror elements SEa, mirror element SEc different and SEb, light L4 is respectively incident on mirror element SEd different from the mirror elements SEa ~ SEc. Mirror elements SEa ~ SEd provide spatial modulations set according to the position on the light L1 ~ L4.

In the spatial light modulator 3, all criteria of the state where the reflecting surface is set along one plane (XY plane) of the mirror element SE (hereinafter, referred to as "reference state"), the direction parallel to the optical axis AX as the light beam incident along the, after being reflected by the respective mirror elements SE of the spatial light modulator 3 is reflected toward the direction substantially parallel to the optical axis AX by the second reflecting surface 2b of the light guide member 2 It is configured. The surface in which a plurality of mirror elements SE of the spatial light modulator 3 is arranged is positioned in the front focal position or near the relay optical system 4.

Therefore, the light is reflected a predetermined angular distribution given by the mirror elements SEa ~ SEd of the spatial light modulator 3 forms a predetermined light intensity distribution SP1 ~ SP4 on the entrance surface 5a of the micro fly's eye lens 5. In other words, the relay optical system 4, the angle of mirror elements SEa ~ SEd of the spatial light modulator 3 is provided to the emitted light, on the incident surface 5a is far field region of the spatial light modulator 3 (Fraunhofer diffraction region) It is converted into position.

Thus, the relay optical system 4, based on the light through the spatial light modulator 3, SEQ surface optically a Fourier transform plane of the mirror elements SE of the spatial light modulator 3, i.e. the micro fly's eye lens 5 of the entrance surface 5a constitute a condensing optical system which forms a predetermined light intensity distribution. Light intensity distribution of the secondary light source micro fly's eye lens 5 is formed (pupil intensity distribution) will distribution spatial light modulator 3 and the relay optical system 4 corresponding to the light intensity distribution formed on the entrance surface 5a.

The spatial light modulator 3, as shown in FIG. 3, the number of minute mirror elements SE that are regularly and two-dimensionally arranged along a plane in a state where the reflective surface is the upper surface of the planar shape which is a movable multi-mirror that contains. Each mirror element SE is movable and an inclination of the reflecting surface, i.e. the inclination angle and inclination direction of the reflecting surface is controlled independently by a drive unit 3b that operates in accordance with a command from the control unit CR. Each mirror element SE is that the a parallel two-way to the reflective surface two orthogonal directions (e.g. X and Y directions) as a rotation axis, rotated by continuously or discretely desired rotation angle it can. That is, it is possible to control the inclination of the reflective surface of each mirror element SE in two dimensions.

Incidentally, in the case of discretely rotating the reflective surface of each mirror element SE, the rotation angle plurality of states (eg, ..., -2.5 °, -2.0 °, ... 0 degrees, + 0. 5 degrees ... +2.5 degrees, ...) is good to switching control at. In Figure 3 but the outer shape indicates a square mirror elements SE, the outer shape of the mirror element SE is not limited to a square. However, it can be in terms of light utilization efficiency, and alignable shape so that the clearance between the mirror element SE is reduced (closest packing possible shapes). From the viewpoint of light utilization efficiency, it can be minimized to the distance between the two mirror elements SE adjacent.

In the present embodiment, it is used as the spatial light modulator 3, the spatial light modulator to the orientation of the mirror elements SE, for example arranged two-dimensionally changed continuously, respectively. Such spatial light modulators, e.g. Kohyo 10-503300 JP and European Patent Publication No. 779530 discloses corresponding thereto, JP 2004-78136 JP and U.S. Patent No. 6,900 corresponding thereto, 915, JP-T-2006-524349 JP and U.S. Patent No. 7,095,546 discloses corresponding thereto, and can be used spatial light modulator disclosed in JP 2006-113437. It is also possible to control so as to have discretely a plurality of stages two-dimensionally arrayed direction of the plurality of mirror elements SE.

Thus, the spatial light modulator 3, by the action of the driving unit 3b that operates in response to a control signal from the control unit CR, the posture of the mirror elements SE are changed respectively, each mirror element SE are each predetermined direction It is set. Light reflected at respective predetermined angles by the mirror elements SE of the spatial light modulator 3 forms the desired light intensity distribution on the entrance surface 5a of the micro fly's eye lens 5, and thus of the micro fly's eye lens 5 side focal plane or illumination pupil near (position aperture stop 6 is disposed) to form a pupil intensity distribution having a desired shape and size. Further, aperture stop 6 optically conjugate different illumination pupil position, i.e., the pupil position and pupil position of the projection optical system PL of the imaging optical system 9 (position aperture stop AS is disposed), the desired pupil intensity distribution is formed.

In the exposure apparatus, in order to and faithfully transferred with high accuracy the pattern of the mask M to the wafer W, it is important to perform exposure under an appropriate illumination condition according to pattern characteristics. In the present embodiment, as means for forming a light intensity distribution variably on the illumination pupil, and a spatial light modulator 3 the orientation of the mirror elements SE are changed individually. Therefore, it is possible by the action of the spatial light modulator 3, the pupil intensity distribution formed on the illumination pupil (and hence the illumination condition) freely and quickly changed.

However, when the illuminance distribution and the pupil intensity distribution about each point on the wafer W in the final surface to be illuminated and is on the wafer W is not adjusted to a desired distribution (for example, uniform distribution) of the mask M a fine pattern It can not be transferred accurately on the wafer W. Therefore, the present embodiment, the illuminance distribution measuring unit 10 for measuring the illuminance distribution on the image plane of the projection optical system PL, the pupil intensity distribution in a pupil plane of the projection optical system PL on the basis of the light through the projection optical system PL the pupil intensity distribution measuring unit 11 which measures a control unit for controlling the attitude of the plurality of optical elements SE of the measurement results and the pupil intensity distribution measuring unit 11 the spatial light modulator 3 on the basis of the measurement results of the illuminance distribution measuring unit 10 and a CR.

Illuminance distribution measuring unit 10, according to well-known configuration, monitoring illuminance distribution on the image plane of the projection optical system PL. Pupil intensity distribution measuring unit 11 includes, for example, a CCD image sensor having a pupil position and optically imaging surface disposed at a position conjugate of the projection optical system PL, and the image plane of the projection optical system PL (i.e. the surface to be illuminated) pupil intensity distribution about each point of the upper monitoring (light rays incident on each point pupil intensity distribution formed on the pupil plane of the projection optical system PL). The detailed configuration and action of the pupil intensity distribution measuring unit 11 is able to see US Patent Publication No. 2008/0030707 discloses.

In the following description, to facilitate understanding of the effects of the present embodiment, the illumination pupil of or near the rear focal plane of the micro fly's eye lens 5, the two elliptical shape as shown in FIG. 4 substantial surface light source (hereinafter, simply referred to as "surface light source") dipolar pupil intensity distribution (secondary light source) 20 is assumed to be formed consisting of 20a and 20b. Further, simply referred to as "illumination pupil" in the following description shall refer to the illumination pupil of or near the rear focal plane of the micro fly's eye lens 5.

Referring to FIG. 4, dipolar pupil intensity distribution 20 formed on the illumination pupil has a pair of surface light source 20a and 20b spaced in the Z direction across the optical axis AX. Light forming the dipolar pupil intensity distribution 20, as shown in FIG. 5, of a number of rectangular micro lenses 5b which are arrayed vertically and horizontally and densely of the micro fly's eye lens 5, the hatching in FIG. incident on the plurality of micro lenses 5ba subjected. However, in FIG. 5, for clarity of the drawing, are considerably less expressed than the actual number of rectangular micro lenses 5b forming the micro fly's eye lens 5.

Thus, the micro fly's eye lens 5, SEQ surface optically the surface to be the Fourier transform two-dimensionally arrayed a plurality of unit wavefront division face of the mirror elements SE of the spatial light modulator 3 (each constitute the optical integrator having an entrance surface of the micro lens 5b). A plurality of unit wavefront division surfaces which are two-dimensionally arranged micro-fly's eye lens 5 are each optically conjugate with the mask M is illuminated surface (hence the wafer W).

In the range where the effect of the present embodiment, the two-dimensionally arrayed a plurality of unit wavefront dividing plane of the micro fly's eye lens 5, array surface of the mirror elements SE of the spatial light modulator 3 and the optical from the surface to be Fourier transform it may be disposed defocused located. Furthermore, to the extent that the effect of the present embodiment, the two-dimensionally arrayed a plurality of unit wavefront dividing plane of the micro fly's eye lens 5, optically conjugate with the mask M is irradiated plane (wafer W) it may be arranged at a position defocused from the surface.

Figure 6 is a diagram for explaining the operation of the present embodiment. In Figure 6, in order to facilitate understanding of the description, a number of micro lenses 5b forming the micro fly's eye lens 5, four micro lenses is light corresponding to the dipolar pupil intensity distribution 20 entering and 5ba, light shows and one microlens 5bb not incident. Further, the intensity distribution along the YZ plane of the light incident on the four microlenses 5ba, represent by hatched areas. Here, the intensity of light is large incident as location height of Y-direction is large hatched region.

In the present embodiment, the spatial light modulator 3, has a much greater number of mirror elements SE than the number of micro lenses 5b forming the micro fly's eye lens 5, it is possible to change its attitude individually. Therefore, by the action of the spatial light modulator 3, freely changing the light intensity distribution formed on the entrance surface 5a of the micro fly's eye lens 5, and thus the incident surface of the micro lens 5b of the micro fly's eye lens 5 (that is, each the intensity distribution of light incident on a unit wavefront division face) can be changed freely.

In the example shown in FIG. 6, + intensity distribution of light incident on the two micro lenses 5ba in the Z direction is the same as each other, the light intensity distribution of the incident on the two micro lenses 5ba in the -Z direction is the same as each other is there. Also, + and intensity distribution of the light Z incident direction side of the two micro lenses 5ba, the intensity distribution of light incident on the two micro lenses 5ba the -Z direction, which is symmetrical with respect to the optical axis AX.

Specifically, + the light intensity distribution incident on the two micro lenses 5ba the Z direction, + intensity is largest in the Z direction of the end, the strength is minimum at the center position along the Z-direction, + Z direction side of the intensity toward the central position strength towards the end of the -Z direction from the monotonously decreases and the center position is monotonously increased from the end. In this case, the position of the mask M (and hence the wafer W) and optically conjugate with the mask blind 8 is a surface to be illuminated, substantially uniform illuminance distribution intensity distribution of light incident on the four microlenses 5ba is superimposed There is formed.

Light exposure area on the wafer W (in the case of scanning exposure of the still exposure region) reaches the central point in, that the light reaching the center point P1 of the opening of the mask blind 8, as indicated by a broken line in FIG. 6, a four smallest light intensity passing through the center position of the micro lens 5ba. Accordingly, as shown in the middle drawing of FIG. 7, two-pole-shaped light intensity distribution of light reaching the center point P1 is formed on the illumination pupil, i.e. the pupil intensity distribution 21 related to the center point P1, + Z direction side of the surface light source 21a to each other equal to the light intensity of the light intensity and the -Z direction side of the surface light source 21b, and the light intensity is relatively small.

Light arriving at one peripheral point along the Y direction from the center point in the exposure area on the wafer W, i.e., of the light reaching the peripheral points P2 in the + Z direction side of the opening of the mask blind 8, the + Z direction side 2 relatively great light, the light from the two micro lenses 5ba the -Z direction side view of one of the intensity passing through the end of the -Z direction as the light is shown by thin solid lines in FIG. 6 from the small lenses 5ba 6 among the largest light intensity passing through the end of the -Z direction as indicated by a thick solid line. Thus, as shown on the left side of FIG. 7, two-pole-like light intensity light reaching the peripheral points P2 is formed on the illumination pupil distribution, that is, in the pupil intensity distribution 22 related to the peripheral points P2, + Z direction side of the surface light source light intensity of 22a is relatively large, the light intensity of the -Z direction side of the surface light source 22b is the largest.

From the center point in the exposure area on the wafer W light reaching the other peripheral points along the Y-direction, i.e. out of the light reaching the peripheral point P3 on the -Z direction side of the opening of the mask blind 8, + Z direction side of the the light from the two micro lenses 5ba a largest light intensity passing through the + Z direction side of the end, as indicated by the bold solid line in FIG. 6, the light from the two micro lenses 5ba the -Z direction Fig 6 medium is a relatively large light intensity passing through the + Z direction side of the end, as indicated by a thin solid line. Thus, as shown on the right side of FIG. 7, two-pole-like light intensity light reaching the peripheral point P3 are formed on the illumination pupil distribution, that is, in the pupil intensity distribution 23 related to the peripheral points P3, + Z direction side of the surface light source light intensity of 23a is the largest, the light intensity of the -Z direction side of the surface light source 23b is relatively large.

Thus, in the example shown in FIGS. 6 and 7, the pupil intensity distribution for a given point P2 on the irradiated surface 8 as the first pupil intensity distribution, and the predetermined on the illuminated surface 8 1 another point different from the point P2 to (P1 or P3) about the pupil intensity distribution to the second pupil intensity distribution, the light intensity distribution formed on each of the plurality of unit wavefront division plane of two or more and it has a light intensity distribution.

In the example shown in FIGS. 6 and 7 above, in other words, the first setting step of setting a first target pupil intensity distribution is a target of the pupil intensity distribution for a given point P2 on the irradiated surface, the and a second setting step of setting a second target pupil intensity distribution is a target of the pupil intensity distribution for different another point (P1 or P3) to the irradiation predetermined point on plane P2. Here, the pupil intensity distribution for a given point P2 and the first target pupil intensity distribution, and another 1 point the pupil intensity distribution related (P1 or P3) to the second target pupil intensity distribution on the illumination pupil with adjusting the pupil intensity distribution formed, is the light intensity distribution formed on each of the plurality of unit wavefront division faces were respectively adjusted.

In this case, a first compartment step of partitioning in accordance with first target pupil intensity distribution to the plurality of unit wavefront division surface, the light intensity of the position corresponding to the predetermined point in the first target pupil intensity distribution is defined a first light intensity calculation step of calculating a respective second compartment step of partitioning in accordance with the second target pupil intensity distribution to the plurality of unit wavefront division surface, the further the second target pupil intensity distribution is defined second light intensity calculation step and a predetermined point P2 and another point calculated by the first and second light intensity calculation step of calculating a light intensity at a position corresponding to one point each (P1 or P3) based on the light intensity of the position corresponding to may be a step of calculating the light intensity distribution to be formed into a plurality of unit wavefront division faces, respectively.

Next, in the example shown in FIG. 8, with a light having a same distribution as the intensity distribution of light that is incident on the two micro lenses 5ba of the FIG. 6 + Z direction side in the -Z direction side of the micro lens 5ba, FIG and applying light having a same distribution as the intensity distribution of light that is incident on the two micro lenses 5ba the -Z direction in the + Z direction side of the micro lens 5ba in 6. Similar to the example shown in FIG. 6 in the example shown in FIG. 8, the position of the mask M (and hence the wafer W) and optically conjugate with the mask blind 8 is a surface to be illuminated, and enters the 4 micro lenses 5ba substantially uniform illuminance distribution intensity distribution of the light is superimposed is formed.

The light reaching the center point P1 of the opening of the mask blind 8, as indicated by a broken line in FIG. 8, the smallest light intensity passing through the center position of the four micro-lenses 5ba. Accordingly, as shown in the middle drawing of FIG. 9, the pupil intensity distribution 21 related to the center point P1, with each other equal to the light intensity of the + Z direction side of the surface light source 21a of the light intensity and the -Z direction side of the surface light source 21b, the light intensity is relatively small.

Among the light reaching the peripheral point P2 of the aperture of the mask blind 8, the intensity of + light from two micro lenses 5ba the Z direction passes through the end of the -Z direction as indicated by the thick solid line in FIG. 8 most a big light, the light from the two micro lenses 5ba the -Z direction is a relatively large light intensity passing through the end of the -Z direction as indicated by the thin solid line in FIG. 8. Thus, as shown on the left side of FIG. 9, the pupil intensity distribution 22 related to the peripheral points P2, + light intensity in the Z direction of the surface light source 22a is the largest, the light intensity of the -Z direction side of the surface light source 22b is compared target large.

Among the light reaching the peripheral point P3 of the aperture of the mask blind 8, the intensity + light from the two micro lenses 5ba the Z direction is passing through the + Z direction side of the end, as indicated by a thin solid line in FIG. 8 relatively a big light, the light from the two micro lenses 5ba the -Z direction is the largest light intensity passing through the + Z direction side of the end, as indicated by the bold solid line in FIG. 8. Thus, as shown on the right side of FIG. 9, the pupil intensity distribution 23 related to the peripheral points P3, + light intensity in the Z direction of the surface light source 23a is relatively large, the light intensity of the -Z direction side of the surface light source 23b is most large.

Incidentally, for example, referring to FIG. 6, the optical ideal state, if the intensity distribution of light incident on the four microlenses 5ba is and equal and uniform, uniform illuminance distribution is formed at the position of the mask blind 8 it is understood that also uniform illuminance distribution on the wafer W is thus the final surface to be illuminated is formed. Also, in the pupil intensity distributions 21, 22, 23 related to the respective points P1, P2, P3 of the aperture of the mask blind 8, the planar light source 21a, 21b, 22a, 22b, 23a, that the light intensity of 23b are equal to each other It is understood. That is, the pupil intensity distribution about each point in the aperture of the mask blind 8 is uniform, also respectively uniform pupil intensity distribution about each point in the exposure area on the thus wafer W.

However, in the actual optical system, be set uniform and equal to each other the intensity distribution of light incident on the desired microlens 5ba, for various reasons, uniform illuminance distribution and the mask at the position of the mask blind 8 blind 8 It can not necessarily obtain a uniform pupil intensity distributions with respect to each point in the opening of. Furthermore, even if it is possible to obtain a uniform pupil intensity distribution with respect to a uniform illuminance distribution and the points at the location of the mask blind 8, for each point in the exposure area on the uniform illuminance distribution and the wafer W on the wafer W It can not necessarily obtain a uniform pupil intensity distribution.

This means that in actual optical system, which means that in order to obtain a uniform illuminance distribution on the wafer W, it is required to adjust, for example, in the required distribution is not uniform illuminance distribution at the position of the mask blind 8 ing. Further, required to be adjusted to obtain a uniform pupil intensity distributions with respect to each point in the exposure area on the wafer W, for example, the required distribution is not uniform pupil intensity distribution about each point in the aperture of the mask blind 8 which means that is.

Referring to FIGS. 6-9, in this embodiment, by appropriately changing the intensity distribution of the light incident on the incident surface of the micro lens 5b of the micro fly's eye lens 5 using the spatial light modulator 3, the mask while maintaining the illuminance distribution formed in the position of the blind 8 substantially uniformly, it is understood that it is possible to adjust the pupil intensity distributions about the points P1, P2, P3 within the aperture of the mask blind 8 independently . Further, by appropriately changing the intensity distribution of the light incident on the incident surface of the micro lens 5b (each unit wavefront division face), while adjusting the illuminance distribution formed in the position of the mask blind 8 into a desired profile, it is easily deduced that the pupil intensity distribution about each point in the aperture of the mask blind 8 may be adjusted to a desired distribution.

That is, in this embodiment, the control unit CR controls the posture of the mirror elements SE of the spatial light modulator 3 individually, the light is formed in each of the plurality of unit wavefront dividing plane of the micro fly's eye lens 5 by appropriately changing the intensity distribution, adjusting the illumination intensity distribution formed in the exposure area on the wafer W at the position optically conjugate with the position of the mask blind 8 (or illumination area on the mask M) in the desired distribution and while it is possible to adjust the pupil intensity distribution about each point in the (illumination area on the mask or M) exposure area on the wafer W to a desired distribution, respectively. Thus, the control unit CR is configured to adjust the pupil intensity distribution formed on the illumination pupil on the basis of light from the spatial light modulator 3 through the relay optical system 4 and the micro fly's eye lens 5 to a required distribution has the function of controlling the spatial light modulator 3 in order to adjust the light intensity distribution, each being formed of a plurality of unit wavefront dividing plane of the micro fly's eye lens 5 to a required distribution respectively.

Specifically, in this embodiment, the control unit CR controls the posture of the mirror elements SE of the spatial light modulator 3 on the basis of the measurement result of the measurement results and the pupil intensity distribution measuring unit 11 of the illuminance distribution measuring unit 10 by, as well as adjusting the illumination intensity distribution formed in the exposure area on the wafer W located at the image plane position of the projection optical system PL to a desired distribution (for example, uniform distribution), each point in the exposure area on the wafer W it can light incident to adjust the respective desired distribution pupil intensity distribution formed on the pupil position of the projection optical system PL (e.g. a uniform distribution) in.

As described above, in the illumination optical system of this embodiment (1 to 11), the final illuminance distribution and the pupil intensity distribution about each point in the exposure area on the wafer W on the wafer W to be irradiated surface desired it can be adjusted in the distribution. Accordingly, the exposure apparatus of the present embodiment (1 ~ 11, MS, PL, WS), adjusting the pupil intensity distribution about each point in the exposure area on the illuminance distribution and the wafer W on the wafer W to a desired distribution using an illumination optical system (1-11), which can, under an appropriate illumination condition according to the microscopic pattern of the mask M can perform good exposure, overall thus exposing a fine pattern of the mask M region it can be transferred accurately onto the wafer W at a desired line width across the.

In the above embodiment, the optical path between the spatial light modulation unit SU and the micro fly's eye lens 5, the relay optical system 4 as a condensing optical system which serves as a Fourier transform lens is arranged. However, without having to be limited to this, instead of the relay optical system 4, the afocal optical system, the conical axicon system, it is also possible to place an optical system including the variable magnification optical system. Optical system of this type is disclosed in WO 2005 / 076045A1 pamphlet, and U.S. Patent Application Publication No. 2006 / 0170901A corresponding thereto.

In the above description, modified illumination pupil intensity distribution of dipolar on the illumination pupil is formed, namely an example of dipole illumination, it describes the effects of the present invention. However, without being limited to dipole illumination, for example annular illumination pupil intensity distribution of the annular is formed, in such multi-polar illumination pupil intensity distribution of the other plurality polar shape other than two-pole shape is formed even against, it is clear that it is possible to obtain the same effect by applying the same manner the present invention.

In the above description, as an optical integrator of wavefront division type, the lens element as an example the micro fly's eye lens 5 is two-dimensionally arranged in a matrix, which describes the effects of the present invention. However, even with respect to the cylindrical micro fly's eye lens disclosed in U.S. Patent No. 6,913,373, it is clear that it is possible to obtain the same effect by applying the same manner the present invention.

When applying the cylindrical micro fly's eye lens, the cylindrical micro fly's eye lens, the refractive surfaces of the plurality of cylindrical profile that is aligned in a first direction transverse to the optical axis (the first cylindrical lens group) because as a configuration having a refracting surface of a plurality of cylindrical profile that is aligned in a second direction perpendicular to the first direction across the optical axis (second cylindrical lens group), the first and of those so that the unit wavefront division surface by the second cylindrical lens group is defined.

In the above embodiment, as an optical integrator, but using the micro fly's eye lens 5, instead, it may be used internal reflection type optical integrator (typically a rod type integrator). In this case, a front-side focal position on the rear side of the relay optical system 4 is arranged a condenser lens so as to coincide with the rear focal position of the relay optical system 4, the back focal point or near the after the condenser lens incident end is disposed a rod type integrator to be positioned. At this time, the exit end of the rod type integrator is the position of the mask blind 8. When using a rod type integrator, downstream of the imaging optical system 9 of the rod-type integrator can be a position optically conjugate with the position of the aperture stop AS of the projection optical system PL is referred to as the illumination pupil plane. Also, the position of the entrance surface of the rod type integrator, this means that the virtual image of the secondary light source on the illumination pupil plane is formed, also referred to as illumination pupil plane the position and the position optically conjugate with the position can.

Here, the plane perpendicular to the street light axis position where the front focal position of the back focal point and the condensing lens matches of the relay optical system 4, a plurality of unit wavefront division in the case of using the micro fly's eye lens 5 surface corresponds to the two-dimensionally arrayed surface. Therefore, even when a rod type integrator, by controlling the light intensity distribution in the plane passing through the rear focal position of the relay optical system 4 in accordance with the embodiments described above, to obtain the same effect as the above-described embodiment can.

In the above description, as a spatial light modulator having a plurality of optical elements that are controlled individually arranged two-dimensionally, two-dimensionally arrayed a plurality of reflecting surfaces of the orientation: (angle inclination) are used individually controllable spatial light modulator. However, without having to be limited to this, for example, it can also be used two-dimensionally arrayed a plurality of reflecting surfaces of the height (position) can individually controllable spatial light modulator. Such spatial light modulators, for example, Japanese Unexamined 6-281869 Patent Publication and US Patent No. 5,312,513 discloses corresponding thereto, and U.S. Patent No. corresponding publications and this Patent Kohyo 2004-520618 disclosed in Figure 1d of 6,885,493 JP may be used a spatial light modulator. These spatial light modulators, it is possible to apply the same action as a diffractive surface on the incident light by forming a two-dimensional height distribution. Incidentally, the spatial light modulator having a plurality of reflecting surfaces which are arranged two-dimensionally as described above, and U.S. Patent No. 6,891,655 publication corresponding to, for example, Kohyo 2006-513442 discloses and this, JP-T publications and thereto No. 2005-524112 or according to the disclosure of U.S. Patent Publication Application No. 2005/0095749 corresponding thereto.

In the above description, but by using a reflective spatial light modulator having a plurality of mirror elements, without being limited thereto, are disclosed for example in U.S. Pat. No. 5,229,872 transmission type spatial light modulator may be used.

In the above embodiment, instead of the mask, it is possible to use a variable pattern forming device which forms a predetermined pattern on the basis of predetermined electronic data. Use of such a variable pattern forming device can minimize influence on synchronization accuracy even when the pattern surface is placed vertically. The variable pattern forming device can be used, a DMD (Digital Micromirror Device) including a plurality of reflective elements driven based on a predetermined electronic data. Exposure apparatus using DMD, for example Japanese Patent Application Laid-open No. 2004-304135, disclosed in U.S. Patent Publication No. 2007/0296936 corresponding to International Patent Publication No. WO2006 pamphlet and this. Besides the reflective spatial light modulator of a non-emission type like the DMD, it may be a transmission type spatial light modulator may be used a self-emission type image display device. Incidentally, it may be used also variable pattern forming device even when the pattern surface is set horizontal.

Now, in the embodiment described above, although substantially uniformly adjust each pupil intensity distributions at respective points on the surface to be illuminated, the predetermined distribution is not uniform pupil intensity distributions at respective points on the surface to be illuminated it may be adjusted to. It may also be adjusted to different predetermined distribution respectively the pupil intensity distributions at respective points on the surface to be illuminated. For example, the exposure apparatus and the line width error due to non-uniformity of the pupil intensity distribution itself, the coating and developing apparatus (coater developer) and heating / cooling apparatus such as exposure apparatus used in combination with the exposure apparatus in photolithography process in order to correct the line width error due to devices other than it may be adjusted to different predetermined distribution respectively the pupil intensity distributions at respective points on the surface to be illuminated.

As described later, in the photolithography process in a manufacturing process of a semiconductor device, after forming a photoresist (photosensitive material) film on the surface of the object to be processed such as a wafer, to which the circuit pattern is exposed, the further development forming a resist pattern by performing. The photolithography process, the coating and developing apparatus having a developing unit for developing the wafer after the resist coating unit and the exposure for performing resist coating on the wafer or the like and (coater developer), provided integrally continuous to the device It is performed by the obtained exposure apparatus.

Then, such coating and developing processing apparatus, for example, after forming a resist film on the wafer, or the development heat treatment apparatus and a cooling apparatus for performing heat treatment such as heat treatment or cooling treatment to the wafer before and after treatment It has. Here, or not a uniform resist film thickness in the wafer plane, those in the case where the temperature distribution within the wafer or not uniform in the heat treatment, the wafer is line width uniformity of the distribution of the shot area W it may exhibit different properties depending on the position of the shot area above. Further, as the mask a resist pattern described above, even in an etching apparatus for etching a film to be etched in the lower layer of the resist pattern, if the temperature distribution in the wafer plane is not uniform, the line width uniformity of the shot area distribution may exhibit different properties depending on the position of the shot area on the wafer W.

Such coating and developing apparatus or the positional variation of the line width uniformity of the distribution of the shot area by the shot area on the wafer due to etching apparatus or the like, the error distribution somewhat stable that do not depend on shot position within the wafer ( We have a systematic error distribution). Thus, in an exposure apparatus according to an embodiment described above, by adjusting to different predetermined distribution respectively the pupil intensity distributions at respective points on the surface to be illuminated, the variations in line width uniformity of the distribution of the shot area it is possible to correct.

The exposure apparatus of the above embodiment, the various subsystems, including each constituent element recited in the claims of the present application so that the predetermined mechanical accuracy, the optical accuracy, manufactured by assembling It is. To ensure these respective precisions, performed before and after the assembling include the adjustment for achieving the optical accuracy for various optical systems, an adjustment to achieve mechanical accuracy for various mechanical systems, the various electrical systems adjustment for achieving the electrical accuracy is performed. The steps of assembling the various subsystems into the exposure apparatus includes various subsystems, the mechanical interconnection, electrical circuit wiring connections, and the piping connection of the air pressure circuit. Before the process of assembling the exposure apparatus from the various subsystems, there are also the processes of assembling each individual subsystem. After completion of the assembling the various subsystems into the exposure apparatus, overall adjustment is performed and various kinds of accuracy as the entire exposure apparatus are secured. The manufacturing of the exposure apparatus is preferably performed in a clean room in which temperature and cleanliness are controlled.

The following will describe a device manufacturing method using the exposure apparatus according to the above-described embodiment. Figure 10 is a flowchart showing manufacturing steps of a semiconductor device. As shown in FIG. 10, in the manufacturing process of a semiconductor device, a metal film is deposited on the wafer W as a substrate of a semiconductor device (step S40), and coated with a photoresist which is a photosensitive material on the vapor-deposited metal film (step S42). Subsequently, using the projection exposure apparatus of the above embodiment, a pattern formed on a mask (reticle) M, is transferred to each shot area on the wafer W (step S44: exposure step), the wafer W after completion of the transfer development, that is, the development of the photoresist on which the pattern is transferred performed in (step S46: development step).

Thereafter, a resist pattern made on the surface of the wafer W as a mask in step S46, processing such as etching is carried out to the surface of the wafer W (step S48: processing step). Here, the resist pattern, a photoresist layer is uneven in a shape corresponding to the pattern transferred is generated by the projection exposure apparatus of the above embodiment, what the recess penetrates the photoresist layer it is. In step S48, the surface of the wafer W through the resist pattern. The processing carried out in step S48, the example includes at least one film-forming, such as etching or metal film on the surface of the wafer W. In step S44, the projection exposure apparatus of the above embodiment, the wafer W coated with the photoresist, performing a transfer of the pattern as a photosensitive substrate or plate P.

Figure 11 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display device. As shown in FIG. 11, the manufacturing steps of the liquid crystal device, a pattern forming step (step S50), the color filter formation step (step S52), a cell assembly step (step S54), and a module assembly step (step S56). In the pattern forming process of the step S50, on a glass substrate coated with a photoresist as a plate P, and form a predetermined pattern such as a circuit pattern and an electrode pattern using a projection exposure apparatus of the above embodiment. The pattern forming step, an exposure step of transferring a pattern to a photoresist layer by using the projection exposure apparatus of the above embodiment, development of the plate P on which the pattern is transferred, i.e. development of the photoresist layer on the glass substrate was carried out, it contains a developing step to produce a photoresist layer in a shape corresponding to the pattern, a processing step of processing the surface of the glass substrate through the developed photoresist layer.

In the color filter forming step of step S52, R (Red), G (Green), B of sets of three dots corresponding to (Blue) are arrayed in a matrix, or R, G, 3 pieces of the B a stripe set of filters forming the color filters arrayed in the horizontal scanning direction. The cell assembly step of step S54, to assemble a liquid crystal panel (liquid crystal cell), using the glass substrate on which the predetermined pattern has been formed in step S50, and the color filter formed in step S52. Specifically, to form a liquid crystal panel by injecting liquid crystal between the glass substrate and the color filter. The module assembly step of step S56, to the liquid crystal panel assembled in step S54, to attach various components such as electric circuits and backlights for display operation of the liquid crystal panel.

Further, the present invention Without being limited to the application to an exposure apparatus for manufacture of semiconductor devices, Ya prismatic crystal display element formed on a glass plate, or an exposure apparatus of a plasma display or the like for the display device , the imaging device (CCD etc.), micromachines, thin film magnetic heads, and can be widely applied to an exposure apparatus for manufacture of various devices such as a DNA chip. Furthermore, the present invention is a mask in which the mask pattern of the various devices are formed (photomask, reticle, etc.) in the manufacture using a photolithography process, it can also be applied to the exposure step (exposure apparatus).

In the embodiment described above, ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm) but, without being limited thereto, other suitable laser light source , for example, it is also possible to apply the present invention to such an F 2 laser light source for supplying laser light of wavelength 157 nm.

Further, applied in the above embodiments, techniques filled with medium (typically a liquid) having a refractive index greater than 1.1 optical path between the projection optical system and the photosensitive substrate, a so-called immersion method it may be. In this case, as a method that meets the liquid in the optical path between the photosensitive substrate and the projection optical system, and method is locally filled with the liquid as disclosed in International Publication No. WO99 / ​​99/49504 pamphlet, JP-A a stage holding a substrate to be exposed, as disclosed in 6-124873 discloses the technique of moving in a liquid tank, a predetermined depth on a stage as disclosed in JP-a-10-303114 the liquid bath is formed, it can be employed as method of holding the substrate therein. In the above embodiment, it is also possible to apply the so-called polarization illumination method disclosed in U.S. Publication No. 2006/0170901 and No. 2007/0146676.

The aforementioned embodiment was the application of the present invention to the illumination optical system for illuminating a mask (or wafer) in an exposure apparatus, without being limited thereto, the non-mask (or wafer) it is also possible to apply the present invention for general illumination optical system for illuminating the irradiation surface.

1 beam light transmitting unit 2 the light guide member 3 spatial light modulator 4 relay optical system 5 micro fly's eye lens 7 condenser optical system 8 mask blind 9 imaging optical system 10 illuminance distribution measuring unit 11 the pupil intensity distribution measuring unit LS light source SU space light modulation unit CR controller M mask PL projection optical system W wafer

Claims (17)

  1. In the illumination optical system for illuminating an illumination target surface on the basis of light from a light source,
    A spatial light modulator having a plurality of optical elements to be controlled individually are arranged two-dimensionally,
    On the basis of the light through the spatial light modulator, a focusing optical system for forming a predetermined light intensity distribution on the array surface and optically a Fourier transform plane of said plurality of optical elements of the spatial light modulator ,
    And optical integrator having a plurality of unit wavefront division surface are two-dimensionally arranged on a surface to be the Fourier transform,
    With adjusting the pupil intensity distribution formed on the illumination pupil on the basis of light from said spatial light modulator through the light converging optical system and the optical integrator to a required distribution, each of the plurality of unit wavefront division surface an illumination optical system, characterized in that said and a control unit for controlling the spatial light modulator in order to adjust the light intensity distribution to a desired distribution respectively formed.
  2. The illumination optical system according to claim 1, wherein the plurality of unit wavefront division surface are respectively the surface to be illuminated and optically conjugate.
  3. The illuminance distribution measuring unit for measuring the illuminance distribution on the illuminated surface,
    Further comprising a pupil intensity distribution measuring unit for measuring the pupil intensity distribution about each point on the surface to be illuminated,
    Claim wherein the control unit, which based on the illuminance distribution measuring unit of the measuring result and the pupil intensity distribution measuring unit of the measurement result, and controls the attitude of said plurality of optical elements of the spatial light modulator the illumination optical system according to 1 or 2.
  4. The spatial light modulator includes a plurality of mirror elements which are arranged two-dimensionally, any of claims 1 to 3, characterized in that it has a driving unit for individually driving and controlling the orientation of the mirror elements of the plurality of or illumination optical system according to item 1.
  5. The drive unit includes an illumination optical system according to claim 4, characterized in that is continuously or discretely vary the orientation of said plurality of mirror elements.
  6. Claim used in combination with the projection optical system for forming an illumination target surface optically conjugate with the plane, the illumination pupil which is a aperture stop optically conjugate with the position of the projection optical system the illumination optical system according to any one of 1 to 5.
  7. Said pupil intensity distribution for a given point on the surface to be illuminated as the first pupil intensity distribution, and the other pupil intensity distributions related to a second point different from the predetermined point on the surface to be illuminated as the pupil intensity distribution, in any one of claims 1 to 6 wherein the plurality of unit wavefront division plane light intensity distribution formed on each is characterized in that two or more kinds of light intensity distribution the illumination optical system according.
  8. Further comprising a pupil intensity distribution measuring unit for measuring the pupil intensity distribution about each point on the surface to be illuminated,
    Wherein the control unit, the pupil intensity distribution for a given point on the pupil intensity distribution measuring portion and the irradiated surface measured by the first pupil intensity distribution, and measured by the pupil intensity distribution measurer wherein to the second pupil intensity distribution pupil intensity distribution related to another point different from the predetermined point on the illuminated surface, to control the attitude of the plurality of optical elements of the spatial light modulator the illumination optical system according to claim 7, characterized in that.
  9. An illumination optical system according to any one of claims 1 to 8 for illuminating a predetermined pattern, exposure apparatus, characterized by exposure of the predetermined pattern on a photosensitive substrate.
  10. An apparatus according to claim 9, characterized in that it comprises a projection optical system for forming an image of the predetermined pattern on the photosensitive substrate.
  11. The illuminance distribution measuring unit measures the illuminance distribution on the image plane of the projection optical system,
    The pupil intensity distribution measuring unit, an exposure apparatus according to claim 10, characterized in that to measure the pupil intensity distribution in a pupil plane of the projection optical system based on light via the projection optical system.
  12. Using the exposure apparatus according to any one of claims 9 to 11, an exposure step of exposing the predetermined pattern onto the photosensitive substrate,
    A developing step of the predetermined pattern is developing the photosensitive substrate that has been transferred, to form a mask layer in a shape corresponding to the predetermined pattern on the surface of the photosensitive substrate,
    Device manufacturing method characterized by comprising a processing step of processing the surface of the photosensitive substrate through the mask layer.
  13. On the basis of light from a light source incorporated in the illumination optical system for illuminating an illumination target surface, a control method for controlling a spatial light modulator having a plurality of optical elements that are controlled individually arranged two-dimensionally,
    A focusing optical system for forming a predetermined light intensity distribution on the array surface and optically a Fourier transform plane of said plurality of optical elements of the spatial light modulator, the two-dimensionally arranged on a surface to be the Fourier transform a first adjustment step of adjusting the pupil intensity distribution formed on the illumination pupil on the basis of light from said spatial light modulator through the optical integrator to a desired distribution with a plurality of unit wavefront division surface which is,
    Control method characterized by comprising a second adjusting step for adjusting the light intensity distribution formed on each of the plurality of unit wavefront division surface to a required distribution respectively.
  14. The method according to claim 13, characterized in that to perform said second adjusting step and the first adjusting step simultaneously.
  15. A first setting step of setting a first target pupil intensity distribution is a target of the pupil intensity distribution for a given point on the surface to be illuminated,
    And a second setting step of setting a second target pupil intensity distribution is a target of the pupil intensity distribution related to another point different from the predetermined point on the surface to be illuminated,
    In the first and second adjusting step, said a predetermined first target pupil intensity distribution pupil intensity distribution related to one point, and the pupil intensity distribution related to the further point to said second target pupil intensity distribution to, as well as adjusting the pupil intensity distribution formed on the illumination pupil, according to claim 13 or 14, characterized in that for adjusting the light intensity distribution, each being formed on the plurality of unit wavefront division face each control method.
  16. A first compartment step of partitioning in accordance with the first target pupil intensity distribution to the plurality of unit wavefront division face,
    A first light intensity calculation step of calculating the light intensity of the position corresponding to the predetermined point in the first target pupil intensity distribution which is the partition, respectively,
    A second compartment step of partitioning in accordance with the second target pupil intensity distribution to the plurality of unit wavefront division face,
    A second light intensity calculation step of calculating a light intensity at a position corresponding to the further point in the second target pupil intensity distribution which is the partition, respectively,
    Based on the light intensity at a position corresponding to said predetermined point and said further point, which is calculated by the first and second light intensity calculation process, the light intensity to be formed on the plurality of unit wavefront division surface the method according to claim 15, characterized in that it comprises a step of calculating the distribution, respectively.
  17. In the illumination optical system for illuminating an illumination target surface on the basis of light from a light source,
    A spatial light modulator having a plurality of optical elements to be controlled individually are arranged two-dimensionally,
    On the basis of the light through the spatial light modulator, a focusing optical system for forming a predetermined light intensity distribution on the array surface and optically a Fourier transform plane of said plurality of optical elements of the spatial light modulator ,
    And optical integrator having a plurality of unit wavefront division surface are two-dimensionally arranged on a surface to be the Fourier transform,
    An illumination optical system characterized by comprising a control unit for controlling said spatial light modulator in accordance with the control method according to any one of claims 13 to 16.
PCT/JP2009/064103 2008-10-15 2009-08-10 Illumination optical system, aligner, and process for fabricating device WO2010044307A1 (en)

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TWI463273B (en) * 2011-05-06 2014-12-01 Zeiss Carl Smt Gmbh Illumination system of a microlithographic projection exposure apparatus
WO2017050360A1 (en) * 2015-09-23 2017-03-30 Carl Zeiss Smt Gmbh Method of operating a microlithographic projection apparatus and illuminations system of such an apparatus

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