WO2009157544A1 - 電磁波吸収フィルム及びそれを用いた電磁波吸収体 - Google Patents
電磁波吸収フィルム及びそれを用いた電磁波吸収体 Download PDFInfo
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- WO2009157544A1 WO2009157544A1 PCT/JP2009/061728 JP2009061728W WO2009157544A1 WO 2009157544 A1 WO2009157544 A1 WO 2009157544A1 JP 2009061728 W JP2009061728 W JP 2009061728W WO 2009157544 A1 WO2009157544 A1 WO 2009157544A1
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- Prior art keywords
- electromagnetic wave
- film
- wave absorbing
- metal thin
- thin film
- Prior art date
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Definitions
- the present invention relates to an inexpensive electromagnetic wave absorbing film excellent in electromagnetic wave absorbing ability over a wide range of frequencies, and an electromagnetic wave absorber using the same.
- Shield materials that prevent leakage and entry of electromagnetic waves are used in electronic devices and communication devices such as mobile phones and personal computers.
- Currently used shield materials are metal sheets or nets, but they are heavy and bulky, and have the problem of being troublesome to arrange in the casing of the device.
- Japanese Patent Laid-Open No. 9-148782 is a non-conductive linear pattern comprising a plastic film and a first aluminum deposited film formed on one surface thereof.
- a shield material has been proposed that has been etched and a second aluminum vapor-deposited film formed on the other surface and etched into a mesh pattern.
- both the linear pattern and the mesh pattern exemplified in this document are regular, only electromagnetic waves having a specific frequency can be absorbed, and electromagnetic waves having a wide range of frequencies cannot be absorbed without leakage.
- the pattern is formed by etching, the electromagnetic wave absorbing shield material has to be expensive.
- JP-A-11-40980 proposes an electromagnetic shielding material in which a copper vapor deposition layer and a nickel vapor deposition layer are sequentially formed on one surface of a plastic film.
- this electromagnetic shielding material does not have a linear gap in the vapor deposition layer, the electromagnetic wave absorbing ability is low.
- an object of the present invention is to provide an inexpensive electromagnetic wave absorbing film excellent in electromagnetic wave absorbing ability over a wide range of frequencies, and an electromagnetic wave absorber using the same.
- the present inventor has found that when a large number of linear marks are formed on a single-layer or multi-layer metal thin film formed on a plastic film with irregular widths and intervals, electromagnetic waves with a wide range of frequencies can be obtained.
- the present inventors have found that an electromagnetic wave absorbing film exhibiting excellent absorbing ability can be obtained, and have arrived at the present invention.
- the electromagnetic wave absorbing film of the present invention has a plastic film and a single-layer or multi-layer metal thin film provided on at least one surface thereof, and a plurality of substantially parallel and intermittent linear marks are formed on the metal thin film. It is formed with irregular widths and intervals.
- the metal thin film is preferably made of aluminum, copper, nickel or an alloy thereof.
- the width of the linear mark is preferably 90% or more within the range of 0.1 to 1,000 ⁇ m, and preferably 1 to 100 ⁇ m on average.
- the interval between the linear marks is preferably in the range of 0.1 ⁇ m to 5 mm, and preferably 1 to 100 ⁇ m on average.
- the metal thin film may have a large number of fine holes.
- the first electromagnetic wave absorber of the present invention comprises a plurality of electromagnetic wave absorbing films, and the electromagnetic wave absorbing film has a plastic film and a single-layer or multi-layer metal thin film provided on at least one surface thereof.
- a large number of substantially parallel and intermittent linear traces are formed with irregular widths and intervals, and a plurality of the electromagnetic wave absorbing films are arranged so that the orientations of the linear traces are different.
- the plurality of electromagnetic wave absorbing films may have the same kind of metal thin film or different kinds of metal thin films.
- a plurality of flat electromagnetic wave absorbing films are laminated directly or via a dielectric layer.
- the dielectric layer may be an air layer.
- At least one of the plurality of electromagnetic wave absorbing films has a waveform.
- the waveform may be a sinusoidal shape, a continuous arc shape, a continuous U-shape, or the like.
- a honeycomb structure may be formed by a combination of corrugated electromagnetic wave absorbing films.
- the linear trace of the corrugated electromagnetic wave absorbing film may be parallel or perpendicular to the linear trace of the flat electromagnetic wave absorbing film. good.
- An electromagnetic wave absorber has an outermost pair of flat electromagnetic wave absorbing films and at least one corrugated electromagnetic wave absorbing film sandwiched between the flat electromagnetic wave absorbing films, and adjacent to the electromagnetic wave absorber.
- the electromagnetic wave absorbing film is arranged so that the linear traces are almost perpendicular to each other, and the contact part is adhered, so that the anisotropy of the electromagnetic wave absorbing ability is suppressed and the film has self-supporting characteristics.
- the electromagnetic wave absorbing film and an electromagnetic wave reflector are disposed via a dielectric layer
- the electromagnetic wave absorbing film is a plastic film and a single layer provided on at least one surface thereof. Or a plurality of substantially parallel and intermittent linear marks formed at irregular widths and intervals on the metal thin film.
- the electromagnetic wave reflector layer is preferably a metal film or a plastic film on which a metal thin film is formed.
- the thickness of the dielectric layer is preferably in a range including 1 ⁇ 4 of the center wavelength ⁇ of electromagnetic wave noise to be absorbed, for example, in the range of ⁇ / 8 to ⁇ / 2.
- the electromagnetic wave absorbing film of the present invention is excellent in electromagnetic wave absorbing ability over a wide range of frequencies because a large number of linear marks are formed on the metal thin film with irregular widths and intervals.
- the electromagnetic wave absorber of the present invention formed by combining a plurality of electromagnetic wave absorbing films has high electromagnetic wave absorbing ability because electromagnetic waves reflected or transmitted by one electromagnetic wave absorbing film are absorbed by another electromagnetic wave absorbing film.
- an electromagnetic wave absorber in which a plurality of electromagnetic wave absorbing films are arranged so that the orientation of linear traces is different has an advantage that anisotropy of electromagnetic wave absorption is suppressed.
- the electromagnetic wave absorber formed by arranging a plurality of electromagnetic wave absorbing films through a space has excellent heat insulating properties and soundproofing properties in addition to the electromagnetic wave absorbing ability, and is suitable for building materials.
- the electromagnetic wave absorbing film of the present invention having such characteristics can be manufactured at low cost using a roll having hard fine particles on the surface.
- an electromagnetic wave absorbing film and an electromagnetic wave absorber of the present invention are suitable for use in electronic devices and communication devices such as mobile phones, personal computers and televisions, and inner walls of buildings.
- an electromagnetic wave absorber formed by adhering at least one flat electromagnetic wave absorbing film and at least one corrugated electromagnetic wave absorbing film has excellent heat insulation, soundproofing and self-supporting properties in addition to high electromagnetic wave absorbing ability. Therefore, it is suitable as an electromagnetic wave shielding material for the inner wall of a building.
- FIG. 2 is a partially enlarged plan view showing details of the electromagnetic wave absorbing film of FIG. 1 (a).
- FIG. 2 is an enlarged cross-sectional view showing a portion A in FIG.
- FIG. 2 is an enlarged cross-sectional view showing a portion A ′ in FIG.
- FIG. 3 is a partially enlarged plan view showing details of the electromagnetic wave absorbing film of FIG. 2 (a).
- FIG. 3 is an enlarged sectional view showing a portion B in FIG. 2 (a). It is sectional drawing which shows the electromagnetic wave absorption film by another embodiment of this invention.
- FIG. 5 is an enlarged cross-sectional view showing a portion C in FIG. 4 (a). It is the schematic which shows an example of the apparatus which manufactures the electromagnetic wave absorption film of this invention.
- FIG. 6 is a partially enlarged cross-sectional view showing a state in which the composite film is in sliding contact with the hard particle roll in the apparatus of FIG. 5 (a). It is a perspective view which shows the electromagnetic wave absorber by one Embodiment of this invention. It is a perspective view which shows the electromagnetic wave absorber by another embodiment of this invention. It is a perspective view which shows the electromagnetic wave absorber by another embodiment of this invention. It is sectional drawing which shows the electromagnetic wave absorber by another embodiment of this invention.
- FIG. 13 is an exploded cross-sectional view of FIG. It is a perspective view which shows the electromagnetic wave absorber by another embodiment of this invention. It is a perspective view which shows the electromagnetic wave absorber by another embodiment of this invention. It is a top view which shows the state which has arrange
- Electromagnetic wave absorbing film has a single-layer or multilayer metal thin film on at least one surface of a plastic film.
- the multilayer metal thin film is preferably a two-layer metal thin film, in which case a combination of a magnetic metal thin film and a non-magnetic metal thin film is preferred.
- FIGS. 1 (a) to 1 (d) show an example of a first electromagnetic wave absorbing film in which a single-layer metal thin film 11 is formed on the entire surface of a plastic film 10.
- FIG. A large number of substantially parallel and intermittent line marks 12 are formed on the metal thin film 11 with irregular widths and intervals.
- the resin forming the plastic film 10 is not particularly limited as long as it has sufficient strength, flexibility, and processability as well as insulation.
- polyester polyethylene terephthalate, etc.
- polyarylene sulfide polyphenylene sulfide, etc.
- Polyamide Polyimide, polyamideimide, polyethersulfone, polyetheretherketone, polycarbonate, acrylic resin, polystyrene, polyolefin (polyethylene, polypropylene, etc.), and the like.
- the thickness of the plastic film 10 may be about 10 to 100 ⁇ m.
- the metal forming the metal thin film 11 is not particularly limited as long as it has conductivity, but from the viewpoint of corrosion resistance and cost, aluminum, copper, nickel, cobalt, silver and alloys thereof are preferable, and in particular, aluminum, copper, Nickel and alloys thereof are preferred.
- the thickness of the metal thin film is preferably 0.01 ⁇ m or more. The upper limit of the thickness is not particularly limited, but about 10 ⁇ m is sufficient for practical use. Of course, a metal thin film having a thickness of more than 10 ⁇ m may be used, but the ability to absorb high-frequency electromagnetic waves is hardly changed.
- the thickness of the metal thin film is more preferably 0.01 to 5 ⁇ m, most preferably 0.01 to 1 ⁇ m, and particularly preferably 10 to 100 nm.
- FIGS. 1 (b) and 1 (c) Linear traces
- the micrographs are schematic, and a large number of substantially parallel and intermittent linear traces 12 are irregular on the metal thin film 11. It is formed with a wide width and interval.
- the line marks 12 have various widths W from very thin line marks to very thick line marks, and are irregularly arranged at various intervals I.
- the width W of the linear trace 12 is obtained at a position that intersects the original surface Sur, and the interval I between the adjacent linear traces 12 is obtained at a position that intersects the original surface Sur.
- Some of the linear marks 12 may be partially connected.
- the linear scar 12 includes one that penetrates the metal thin film 11 and reaches the plastic film 10 (one that forms the non-conductive portion 121), and one that is relatively deep and does not penetrate the metal thin film 11 ( Forming the high resistance portion 122).
- the electromagnetic wave absorption film of this invention can absorb the electromagnetic wave of the frequency over a wide range efficiently.
- the width W of the linear mark 12 is 90% or more in the range of 0.1 to 1,000 ⁇ m, and preferably 1 to 100 ⁇ m on average. Outside the above range, the electromagnetic wave absorbing film has low electromagnetic wave absorbing ability. 90% or more of the width W of the linear mark 12 is more preferably in the range of 0.1 to 100 ⁇ m, and most preferably in the range of 0.1 to 20 ⁇ m.
- the average width Wav of the linear marks 12 is preferably 1 to 100 ⁇ m, more preferably 1 to 20 ⁇ m, and most preferably 1 to 10 ⁇ m.
- the interval I between the linear marks 12 is preferably in the range of 0.1 ⁇ m to 5 mm, more preferably in the range of 0.1 to 1,000 ⁇ m, most preferably in the range of 0.1 to 100 ⁇ m, and 0.1 to It is particularly preferred that it is in the range of 20 ⁇ m.
- the average interval Iav between the linear marks 12 is preferably 1 to 100 ⁇ m, more preferably 1 to 20 ⁇ m, and most preferably 1 to 10 ⁇ m.
- the length L of the linear mark 12 is determined by the sliding contact conditions (mainly the relative peripheral speed of the roll and the film and the winding angle ⁇ of the film to the roll), most of the length L is obtained unless the sliding contact conditions are changed. Almost the same (approximately equal to the average length).
- the length of the linear mark 12 is not particularly limited, and may be about 1 to 100 mm in practical use.
- FIGS. 2 (a) to 2 (c) show other examples of the first electromagnetic wave absorbing film.
- many fine holes 13 penetrating the metal thin film 11 are randomly provided in the metal thin film 11.
- the fine holes 13 can be formed by pressing a roll having high-hardness fine particles on the surface against the metal thin film 11.
- the opening diameter D of the fine hole 13 is obtained at the position of the original surface Sur.
- the opening diameter D of the fine holes 13 is preferably 90% or more in the range of 0.1 to 1,000 ⁇ m, and more preferably in the range of 0.1 to 500 ⁇ m.
- the average opening diameter Dav of the fine holes 13 is preferably in the range of 0.5 to 100 ⁇ m, and more preferably in the range of 1 to 50 ⁇ m.
- the upper limit of the average opening diameter Dav is more preferably 20 ⁇ m, and most preferably 10 ⁇ m.
- the average density of the fine holes 13 is preferably 500 / cm 2 or more, and more preferably 1 ⁇ 10 4 to 3 ⁇ 10 5 / cm 2 .
- a plastic protective layer 10 a that covers the linear marks 12 (and the fine holes 13) may be formed on the metal thin film 11.
- the thickness of the protective layer 10a is preferably 10 to 100 ⁇ m.
- the electromagnetic wave absorbing film may be subjected to a number of embossing such as a conical shape and a spherical shape.
- the emboss diameter and depth are each preferably 100 ⁇ m or more, more preferably 150 to 250 ⁇ m.
- the area ratio of embossing is preferably 20 to 60%.
- the characteristic impedance Z of the electromagnetic wave changes greatly according to the distance from the electromagnetic wave source in the vicinity of the electromagnetic wave source, and is the free space characteristic impedance (377 ⁇ ) at a position sufficiently far from the electromagnetic wave source.
- the surface resistance of the electromagnetic wave absorbing film 1 can be adjusted by the material and thickness of the metal thin film 11, the width, interval, length, etc. of the linear marks 12. The surface resistance can be measured by a direct current two-terminal method.
- FIGS. 4 (a) and 4 (b) show an example of the second electromagnetic wave absorbing film of the present invention.
- a composite metal thin film comprising first and second metal thin films 11a and 11b is formed on one surface of a plastic film 10, and one of the first and second metals is a non-magnetic metal and the other is Is a magnetic metal, and a large number of substantially parallel and intermittent linear marks 12 are formed on the entire surface of the composite metal thin film.
- the linear marks 12 may be the same as those shown in FIGS. 1 (a) to 1 (d).
- the magnetic metal examples include nickel, cobalt, chromium, and alloys thereof, and examples of the nonmagnetic metal include copper, silver, aluminum, tin, and alloys thereof. Preferred combinations are nickel and copper or aluminum.
- the thickness of the magnetic metal thin film is preferably 0.01 ⁇ m or more, and the thickness of the nonmagnetic metal thin film is preferably 0.1 ⁇ m or more. The upper limit of the thickness is not particularly limited, but both metal thin films may be about 10 ⁇ m practically. More preferably, the thickness of the magnetic metal thin film is 0.01 to 5 ⁇ m, and the thickness of the nonmagnetic metal thin film is 0.1 to 5 ⁇ m. Similar to the first electromagnetic wave absorbing film, the second electromagnetic wave absorbing film may have the fine holes 13, the plastic protective layer 10a, and the emboss.
- Both the first and second electromagnetic wave absorbing films 1 are vapor deposition methods (vacuum vapor deposition method, sputtering method, physical vapor deposition method such as ion plating method, etc. on at least one surface of the plastic film 10, Or a chemical vapor deposition method such as a plasma CVD method, a thermal CVD method, a photo CVD method, etc.), a metal thin film 11 is formed by a plating method or a foil bonding method. It can be produced by sliding a roll having fine particles of hardness on the surface to form a large number of substantially parallel and intermittent linear marks 12 on the metal thin film 11.
- the linear traces 12 can be formed, for example, by the method described in WO2003 / 091003. As shown in FIGS. 5 (a) and 5 (b), a roll 2 in which a large number of high hardness (for example, Mohs hardness of 5 or more) fine particles (for example, diamond fine particles) having sharp corners are randomly attached to the surface. Further, it is preferable that the side of the metal thin film 11 of the composite film 1 ′ having the metal thin film 11 is brought into sliding contact.
- a large number of high hardness for example, Mohs hardness of 5 or more
- fine particles for example, diamond fine particles
- the width W, the interval I, and the length L of the linear scar 12 are the sliding contact conditions of the composite film 1 ′ and the roll 2 (particle diameter on the roll 2, the peripheral speed of the composite film 1 ′, the peripheral speed of the roll 2) , The tension of the composite film 1 ', the winding distance of the composite film 1' around the roll 2, the rotation direction of the composite film 1 'and the roll 2, etc.).
- 90% or more of the fine particles preferably have a particle size in the range of 1 to 1,000 ⁇ m, more preferably 10 to 100 ⁇ m.
- the fine particles are preferably attached to the roll surface at an area ratio of 50% or more.
- the peripheral speed of the composite film 1 ′ is preferably 5 to 200 m / min, and the peripheral speed of the roll 2 is preferably 10 to 2,000 m / min.
- the tension of the composite film 1 ′ is preferably 0.05 to 5 kgf / cm width.
- the winding distance L (determined by the winding angle ⁇ ) of the composite film 1 ′ around the roll 2 corresponds to the length L of the linear mark 12.
- the rotation direction of the roll 2 and the composite film 1 ′ is preferably opposite.
- a large number of fine holes 13 can be formed in the metal thin film 11 having the linear marks 12 by the method described in Japanese Patent No. 2063411 and the like.
- a first roll (which may be the same as the above-mentioned linear trace forming roll) on which a large number of fine particles having a Mohs hardness of 5 or more having sharp corners adhere to the surface, and a second smooth surface pressed by the first roll.
- the composite film 1 ′ is passed through the gap with the roll at the same speed as the peripheral speed of the first roll with the metal thin film 11 facing the first roll.
- a plastic protective layer 10a is formed by adhering the second plastic film to the metal thin film 11 by a thermal laminating method or the like. can do. Furthermore, the metal thin film 11 is embossed as necessary.
- electromagnetic wave absorber (1) First electromagnetic wave absorber The first electromagnetic wave absorber is formed by arranging a plurality of the above electromagnetic wave absorbing films so that the orientations of the linear traces are different. Since electromagnetic waves that have not been absorbed by the electromagnetic wave absorbing film are reflected or transmitted, the electromagnetic wave absorbing ability is remarkably improved by adopting a structure that absorbs the electromagnetic waves by another electromagnetic wave absorbing film.
- the electromagnetic wave absorbing film has anisotropy in the electromagnetic wave absorbing ability, so the orientation of the linear trace 12
- anisotropy of electromagnetic wave absorbing ability is suppressed.
- the electromagnetic wave absorber is composed of, for example, two electromagnetic wave absorbing films, it is preferable to arrange the linear traces 12 so as to be substantially orthogonal. Further, when the electromagnetic wave absorber is constituted by three electromagnetic wave absorbing films, it is preferable that the linear traces 12 are arranged so as to intersect at 60 °.
- the combination of electromagnetic wave absorbing films is (1) when all are made of the first electromagnetic wave absorbing film, (2) when all are made of the second electromagnetic wave absorbing film, and (3) are made of the first and second electromagnetic wave absorbing films. Either case is fine.
- the magnetic metal is preferably nickel and the nonmagnetic metal is preferably aluminum or copper. .
- an electromagnetic wave absorbing film having a surface resistance in the direction orthogonal to 12 of 377 to 10,000 ⁇ / ⁇ , preferably 377 to 7,000 ⁇ / ⁇ both electric and magnetic fields can be efficiently absorbed.
- a dielectric layer (air layer) may be provided between a plurality of electromagnetic wave absorbing films.
- the interval between the electromagnetic wave absorbing films is preferably 0.2 to 10 mm, and more preferably 1 to 8 mm.
- FIG. 6 shows an example of an electromagnetic wave absorber having a structure in which a corrugated electromagnetic wave absorbing film 1b is provided between two flat electromagnetic wave absorbing films 1a and 1a.
- the shape and size of the corrugated electromagnetic wave absorbing film 1b may be appropriately set depending on the application.
- the waveform may be a sinusoidal shape, a continuous arc shape, a continuous U-shape, or the like. Since the flat electromagnetic wave absorbing films 1a and 1a and the corrugated electromagnetic wave absorbing film 1b are bonded at the contact points, the electromagnetic wave absorber has a self-supporting property and is used not only for electronic / communication equipment but also for buildings. Is preferred.
- the height h 1 of the corrugation and the interval I 2 are preferably 0.2 to 3 mm when adhering to the housing of an electronic / communication device, and 3 for exhibiting excellent heat insulation and soundproofing when used on the inner wall of a building. ⁇ 10 mm is preferred.
- FIG. 7 shows an example of an electromagnetic wave absorber having a structure in which flat electromagnetic wave absorbing films 1a and corrugated electromagnetic wave absorbing films 1b are alternately laminated. Since this electromagnetic wave absorber has higher self-supporting properties, heat insulating properties, and soundproofing properties than the electromagnetic wave absorber shown in FIG. 6, it is suitable for an inner wall of a building.
- the electromagnetic wave absorbing films 1a and 1b are arranged so that the directions of the linear traces are alternated.
- the orientations of the corrugated electromagnetic wave absorbing films 1b and 1b may be varied.
- the corrugated electromagnetic wave absorbing film 1b may have a U-shaped cross section.
- a plurality of (for example, two) corrugated electromagnetic wave absorbing films 1b and 1b may be disposed between two flat electromagnetic wave absorbing films 1a and 1a.
- a corrugated electromagnetic wave absorbing film 1c joined in a honeycomb shape between flat electromagnetic wave absorbing films 1a and 1a is arranged so that the linear traces of both are almost orthogonal.
- This electromagnetic wave absorber is suitable for building materials and the like because it has excellent heat insulation and soundproofing properties and high self-supporting properties.
- FIGS. 12A and 12B show an electromagnetic wave absorber formed by bonding metal thin films 11 and 11 of two electromagnetic wave absorbing films 1d and 1e.
- Reference numeral 15 denotes an adhesive layer. It is preferable that one of the metal thin films 11 and 11 of the electromagnetic wave absorbing films 1d and 1e is made of a nonmagnetic metal and the other is made of a magnetic metal.
- a part of the plurality of flat electromagnetic wave absorbing films 1a may be replaced with a plastic film having a metal thin film formed on the entire surface.
- FIG. 13 shows an example of the second electromagnetic wave absorber.
- This electromagnetic wave absorber is formed by laminating an electromagnetic wave absorbing film 1 and an electromagnetic wave reflector 16 via a dielectric layer 17.
- the electromagnetic wave absorbing film 1 is disposed on the electromagnetic wave source side.
- the electromagnetic wave reflector 16 is preferably a film-like or mesh-like conductor made of metal or the like, a plastic film on which a metal thin film is formed, or the like.
- the dielectric layer 17 may be not only a dielectric such as a plastic film but also an air layer.
- the thickness of the dielectric layer 17 is preferably in a range including 1/4 of the center wavelength ⁇ of the electromagnetic wave to be absorbed, for example, in the range of ⁇ / 8 to ⁇ / 2.
- FIG. 14 shows another example of the second electromagnetic wave absorber.
- This electromagnetic wave absorber has a configuration in which a plurality of electromagnetic wave absorbing films 1f and a plurality of dielectric layers 17 are alternately laminated, and an electromagnetic wave reflector 16 is provided at the center.
- the linear traces of the electromagnetic wave absorbing film 1f are preferably alternately oriented in different directions (for example, orthogonal directions).
- a part of the plurality of flat electromagnetic wave absorbing films 1a is replaced with an electromagnetic wave reflector 16, and a dielectric layer 17 is provided between the electromagnetic wave absorbing film 1a and the electromagnetic wave reflector 16. It may be provided.
- Example 1 On one side of a biaxially stretched polyethylene terephthalate (PET) film [thickness: 12 ⁇ m, dielectric constant: 3.2 (1 MHz), dielectric loss tangent: 1.0% (1 MHz), melting point: 265 ° C., glass transition temperature: 75 ° C.] An aluminum layer having a thickness of 0.05 ⁇ m was formed by a vacuum vapor deposition method to produce a composite film. Using the apparatus shown in FIGS. 5 (a) and 5 (b), the aluminum layer of the composite film 1 ′ was brought into sliding contact with the roll 2 on which diamond fine particles having a particle size distribution of 50 to 80 ⁇ m were electrodeposited under the following conditions. .
- a high-frequency oscillator 5 having a transmitting antenna 50 and a high-frequency receiver 6 having a receiving antenna 60 are arranged so that the antennas 50 and 60 face each other with a spacing d of 50 mm.
- a test piece (15 cm ⁇ 15 cm) of the electromagnetic wave absorbing film 1 was placed between 50 and 60.
- a signal with a frequency of 200 to 3,250 MHz was transmitted from the transmitting antenna 50 with an output of 2.5 mW, and the intensity of the received signal was measured.
- the results are shown in FIG.
- the strength of the received signal when the electromagnetic wave absorbing film 1 is not disposed between the antennas 50 and 60 is indicated by a dotted line (blank).
- Example 2 The same electromagnetic wave absorption film as Example 1 was produced except having provided the fine hole.
- the average opening diameter of the fine holes was 3 ⁇ m, and the average density was 5 ⁇ 10 4 holes / cm 2 .
- the surface resistance of this electromagnetic wave absorbing film was 900 ⁇ / ⁇ and 15 ⁇ / ⁇ in the direction perpendicular to and parallel to the linear marks, respectively.
- FIG. 18 shows the electromagnetic wave absorption ability measured in the same manner as in Example 1.
- Example 3 An electromagnetic wave absorber in which the electromagnetic wave absorbing films of Examples 1 and 2 are arranged in parallel at an interval of 5.0 mm so that the orientation of the linear traces is almost orthogonal to each other is used with the electromagnetic wave absorbing film of Example 1 on the antenna 50 side.
- the antenna was placed between the antennas 50 and 60, and the electromagnetic wave absorbing ability was evaluated in the same manner as in Example 1. The results are shown in FIG.
- Example 4 A flat electromagnetic wave absorbing film A produced in the same manner as in Example 1 except that the peripheral speed of the roll was set to 200 m / min (surface resistance was 200 ⁇ / ⁇ and 10 ⁇ / ⁇ in the direction perpendicular to and parallel to the linear trace, respectively. ⁇ ) was joined to the electromagnetic wave absorbing film B (period: 5 mm, amplitude: 2.5 mm) of Example 1 formed into a sine wave shape so that the orientations of the linear traces were almost orthogonal to each other, and shown in FIG. An electromagnetic wave absorber was produced. The electromagnetic wave absorbing ability of this electromagnetic wave absorber is shown in FIG.
- Example 5 An electromagnetic wave absorbing film was produced in the same manner as in Example 1 except that a polybutylene terephthalate (PBT) film (melting point: 220 ° C., glass transition temperature: 22 ° C.) having a thickness of 20 ⁇ m was adhered to the aluminum layer by a thermal laminating method. A conical embossing process was performed on the PBT film side of the electromagnetic wave absorbing film. The emboss diameter, depth and area ratio were 200 ⁇ m, 200 ⁇ m and 40%, respectively. The electromagnetic wave absorbing ability of this electromagnetic wave absorbing film is shown in FIG.
- PBT polybutylene terephthalate
- Example 6 A circumferential speed of roll 2 is set to 200 m / on a composite film in which a 0.6 ⁇ m thick copper layer and a 0.2 ⁇ m thick nickel layer are formed on one surface of a 16 ⁇ m thick biaxially stretched PET film by vacuum deposition.
- a linear mark was formed in the same manner as in Example 1 except that the minute mark was used.
- the linear trace and surface resistance of the obtained electromagnetic wave absorbing film are as follows.
- Range of width W 0.5-5 ⁇ m Average width Wav: 2 ⁇ m Spacing I range: 0.5 to 5 ⁇ m Average interval Iav: 2 ⁇ m Average length Lav: 5mm Surface resistance: 150 ⁇ / ⁇ (in the direction perpendicular to the line marks) : 5 ⁇ / ⁇ (direction parallel to the linear marks) The electromagnetic wave absorbing ability of this electromagnetic wave absorbing film is shown in FIG.
- Example 7 An electromagnetic wave absorbing film was produced in the same manner as in Example 6 except that the thickness of the nickel layer was 0.3 ⁇ m and the peripheral speed of the roll 2 was 300 m / min.
- the surface resistance of the electromagnetic wave absorbing film was 150 ⁇ / ⁇ and 10 ⁇ / ⁇ in the direction perpendicular to and parallel to the linear marks, respectively.
- the electromagnetic wave absorbing ability of this electromagnetic wave absorbing film is shown in FIG.
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Abstract
Description
本発明の電磁波吸収フィルムは、プラスチックフィルムの少なくとも一面に単層又は多層の金属薄膜を有する。多層の金属薄膜としては二層構造の金属薄膜が好ましく、その場合磁性金属薄膜と非磁性金属薄膜との組合せが好ましい。
図1(a)~(d)は、プラスチックフィルム10の一面全体に単層構造の金属薄膜11が形成された第一の電磁波吸収フィルムの一例を示す。金属薄膜11には、実質的に平行で断続的な多数の線状痕12が不規則な幅及び間隔で形成されている。
プラスチックフィルム10を形成する樹脂は、絶縁性とともに十分な強度、可撓性及び加工性を有する限り特に制限されず、例えばポリエステル(ポリエチレンテレフタレート等)、ポリアリーレンサルファイド(ポリフェニレンサルファイド等)、ポリアミド、ポリイミド、ポリアミドイミド、ポリエーテルサルフォン、ポリエーテルエーテルケトン、ポリカーボネート、アクリル樹脂、ポリスチレン、ポリオレフィン(ポリエチレン、ポリプロピレン等)等が挙げられる。プラスチックフィルム10の厚さは10~100μm程度で良い。
金属薄膜11を形成する金属は導電性を有する限り特に限定されないが、耐食性及びコストの観点からアルミニウム、銅、ニッケル、コバルト、銀及びこれらの合金が好ましく、特にアルミニウム、銅、ニッケル及びこれらの合金が好ましい。金属薄膜の厚さは0.01μm以上が好ましい。厚さの上限は特に限定的でないが、実用的には10μm程度で十分である。勿論、10μm超の金属薄膜を用いても良いが、高周波数の電磁波の吸収能はほとんど変わらない。金属薄膜の厚さは0.01~5μmがより好ましく、0.01~1μmが最も好まし、10~100 nmが特に好ましい。
顕微鏡写真を図式化した図1(b)及び図1(c)から明らかなように、金属薄膜11に多数の実質的に平行で断続的な線状痕12が不規則な幅及び間隔で形成されている。なお説明のために、線状痕12の深さを実際より誇張している。線状痕12は非常に細い線状痕から非常に太い線状痕まで種々の幅Wを有するとともに、種々の間隔Iで不規則に配列している。線状痕12の幅Wは元の表面Surと交差する位置で求め、隣接する線状痕12の間隔Iは元の表面Surと交差する位置で求める。線状痕12の中には部分的に連結したものがあっても良い。また線状痕12には、金属薄膜11を貫通してプラスチックフィルム10に達したもの(非導通部121を形成しているもの)と、比較的深くて金属薄膜11を貫通していないもの(高抵抗部122を形成しているもの)とがある。このように線状痕12が不規則な幅W及び間隔Iで形成されているので、本発明の電磁波吸収フィルムは広範囲にわたる周波数の電磁波を効率良く吸収することができる。
図2(a)~図2(c)は第一の電磁波吸収フィルムの別の例を示す。この例では、金属薄膜11に線状痕12の他に、金属薄膜11を貫通する多数の微細穴13がランダムに設けられている。微細穴13は、表面に高硬度微粒子を有するロールを金属薄膜11に押圧することにより形成することができる。図2(c)に示すように、微細穴13の開口径Dは元の表面Surの位置で求める。微細穴13の開口径Dは90%以上が0.1~1,000μmの範囲内にあるのが好ましく、0.1~500μmの範囲内にあるのがより好ましい。また微細穴13の平均開口径Davは0.5~100μmの範囲内にあるのが好ましく、1~50μmの範囲内にあるのがより好ましい。平均開口径Davの上限は20μmがさらに好ましく、10μmが最も好ましい。微細穴13の平均密度は500個/cm2以上であるのが好ましく、1×104~3×105個/cm2であるのがより好ましい。
図3に示すように、金属薄膜11の上に、線状痕12(及び微細穴13)を覆うプラスチック保護層10aを形成しても良い。保護層10aの厚さは10~100μmが好ましい。
電磁波吸収能を向上するために、電磁波吸収フィルムに円錐状、球面状等の多数のエンボスを施しても良い。エンボスの直径及び深さはそれぞれ100μm以上が好ましく、150~250μmがより好ましい。エンボスの面積率は20~60%が好ましい。
電磁波吸収フィルム1の電磁波反射係数SCは、式:SC=(R-Z)/(R+Z)[ただしZは入射する電磁波の特性インピーダンス(Ω)であり、Rは電磁波吸収フィルム1の表面抵抗(Ω/□)である]により表され、R=Zだと0である。電磁波の特性インピーダンスZは、電磁波源の近傍では電磁波源からの距離に応じて大きく変化し、電磁波源から十分に遠い位置では自由空間の特性インピーダンス(377Ω)である。従って、電磁波吸収フィルム1を電磁波源の近傍に配置する場合、Zにできるだけ近くなるようにRを調整し、電磁波源から十分に遠い位置に配置する場合、Rを自由空間の特性インピーダンスにできるだけ近づける。電磁波吸収フィルム1の表面抵抗は、金属薄膜11の材料及び厚さ、線状痕12の幅、間隔、長さ等により調整することができる。表面抵抗は直流二端子法で測定することができる。
図4(a)及び図4(b)は本発明の第二の電磁波吸収フィルムの一例を示す。この電磁波吸収フィルムでは、プラスチックフィルム10の一面に第一及び第二の金属の薄膜11a,11bからなる複合金属薄膜が形成されており、第一及び第二の金属の一方が非磁性金属で他方が磁性金属であり、複合金属薄膜に多数の実質的に平行で断続的な線状痕12が全面的に形成されている。線状痕12は図1(a)~図1(d)に示すものと同じで良い。磁性金属としてニッケル、コバルト、クロム又はこれらの合金が挙げられ、非磁性金属として銅、銀、アルミニウム、錫又はこれらの合金が挙げられる。好ましい組合せはニッケルと銅又はアルミニウムである。磁性金属薄膜の厚さは0.01μm以上が好ましく、非磁性金属薄膜の厚さは0.1μm以上が好ましい。厚さの上限は特に限定的でないが、両金属薄膜とも実用的には10μm程度で良い。より好ましくは、磁性金属薄膜の厚さは0.01~5μmであり、非磁性金属薄膜の厚さは0.1~5μmである。第一の電磁波吸収フィルムと同様に、第二の電磁波吸収フィルムも、微細穴13、プラスチック保護層10a及びエンボスを有しても良い。
第一及び第二の電磁波吸収フィルム1のいずれも、プラスチックフィルム10の少なくとも一面に蒸着法(真空蒸着法、スパッタリング法、イオンプレーティング法等の物理蒸着法、又はプラズマCVD法、熱CVD法、光CVD法等の化学気相蒸着法)、めっき法又は箔接合法により金属薄膜11を形成し、得られた複合フィルムの金属薄膜11の側に多数の高硬度の微粒子を表面に有するロールを摺接させ、もって金属薄膜11に多数の実質的に平行で断続的な線状痕12を形成することにより製造することができる。
線状痕12は、例えばWO2003/091003号に記載されている方法により形成することができる。図5(a)及び図5(b)に示すように、鋭い角部を有する多数の高硬度(例えば、モース硬度5以上)の微粒子(例えば、ダイヤモンド微粒子)が表面にランダムに付着したロール2に、金属薄膜11を有する複合フィルム1’の金属薄膜11の側を摺接させるのが好ましい。線状痕12の幅W、間隔I及び長さLは、複合フィルム1’とロール2の摺接条件(ロール2上の微粒子の粒径、複合フィルム1’の周速、ロール2の周速、複合フィルム1’の張力、複合フィルム1’のロール2への巻き付き距離、複合フィルム1’及びロール2の回転方向等)により決まる。従って、微粒子の90%以上は1~1,000μmの範囲内の粒径を有するのが好ましく、10~100μmがより好ましい。微粒子はロール面に50%以上の面積率で付着しているのが好ましい。複合フィルム1’の周速は5~200 m/分が好ましく、ロール2の周速は10~2,000 m/分が好ましい。複合フィルム1’の張力は0.05~5kgf/cm幅が好ましい。複合フィルム1’のロール2への巻き付き距離L(巻回角度θにより決まる)は線状痕12の長さLに相当する。ロール2と複合フィルム1’の回転方向は逆であるのが好ましい。
特許第2063411号等に記載の方法により線状痕12を有する金属薄膜11に多数の微細穴13を形成することができる。例えば、鋭い角部を有するモース硬度5以上の多数の微粒子が表面に付着した第一ロール(上記線状痕形成用ロールと同じで良い)と、第一ロールに押圧された平滑面の第二ロールとの間隙に、金属薄膜11を第一ロールの側にして、第一ロールの周速と同じ速度で複合フィルム1’を通過させる。また複合フィルム1’に線状痕12、及び必要に応じて微細穴13を形成した後、第二のプラスチックフィルムを熱ラミネート法等で金属薄膜11に接着することにより、プラスチック保護層10aを形成することができる。さらに、必要に応じて金属薄膜11にエンボス加工を施こす。
(1) 第一の電磁波吸収体
第一の電磁波吸収体は、複数枚の上記電磁波吸収フィルムを線状痕の配向が異なるように配置してなる。電磁波吸収フィルムで吸収されなかった電磁波は反射又は透過するので、別の電磁波吸収フィルムにより吸収する構造にすることにより、電磁波吸収能は著しく向上する。また線状痕12と直交する方向の表面抵抗が線状痕12と平行な方向の表面抵抗より大きいために、電磁波吸収フィルムは電磁波吸収能に異方性を有するので、線状痕12の配向が異なるように複数の電磁波吸収フィルムを配置することにより、電磁波吸収能の異方性を抑制する。電磁波吸収体を例えば二枚の電磁波吸収フィルムにより構成する場合、それぞれの線状痕12がほぼ直交するように配置するのが好ましい。また電磁波吸収体を三枚の電磁波吸収フィルムにより構成する場合、それぞれの線状痕12が60°で交差するように配置するのが好ましい。
図13は第二の電磁波吸収体の一例を示す。この電磁波吸収体は、電磁波吸収フィルム1と電磁波反射体16とを誘電体層17を介して積層してなる。電磁波吸収フィルム1は電磁波源側に配置される。電磁波反射体16は、金属等からなるフィルム状、メッシュ状等の導電体や、金属薄膜を形成したプラスチックフィルム等であるのが好ましい。誘電体層17は、プラスチックフィルムのような誘電体のみならず、空気層でも良い。誘電体層17の厚さは、吸収すべき電磁波の中心波長λの1/4を含む範囲、例えばλ/8~λ/2の範囲とするのが好ましい。
二軸延伸ポリエチレンテレフタレート(PET)フィルム[厚さ:12μm、誘電率:3.2(1 MHz)、誘電正接:1.0%(1 MHz)、融点:265℃、ガラス転移温度:75℃]の一面に、真空蒸着法により厚さ0.05μmのアルミニウム層を形成し、複合フィルムを作製した。図5(a)及び図5(b)に示す装置を用い、粒径の分布が50~80μmのダイヤモンド微粒子を電着したロール2に複合フィルム1’のアルミニウム層を下記条件で摺接させた。
複合フィルム1’の進行速度:10 m/分
ロール2の周速: 350 m/分
複合フィルム1’の張力: 0.1 kgf/cm幅
フィルムの巻回角度θ: 30°
幅Wの範囲:0.5~5μm
平均幅Wav:2μm
間隔Iの範囲:2~10μm
平均間隔Iav:5μm
平均長さLav:5mm
微細穴を設けた以外実施例1と同じ電磁波吸収フィルムを作製した。微細穴の平均開口径は3μmであり、平均密度は5×104 個/cm2であった。この電磁波吸収フィルムの表面抵抗は、線状痕と垂直な方向及び平行な方向でそれぞれ900Ω/□及び15Ω/□であった。実施例1と同様に測定した電磁波吸収能を図18に示す。
実施例1及び2の電磁波吸収フィルムを線状痕の配向がほぼ直交するように5.0 mmの間隔で平行に配置してなる電磁波吸収体を、実施例1の電磁波吸収フィルムをアンテナ50側にして、アンテナ50,60間に配置し、実施例1と同様にして電磁波吸収能を評価した。結果を図19に示す。
ロールの周速を200 m/分とした以外実施例1と同様にして作製した平坦な電磁波吸収フィルムA(表面抵抗は線状痕と垂直な方向及び平行な方向でそれぞれ200Ω/□及び10Ω/□)を、正弦波状に成形した実施例1の電磁波吸収フィルムB(周期:5 mm、振幅:2.5 mm)と、両者の線状痕の配向がほぼ直交するように接合し、図8に示す電磁波吸収体を作製した。この電磁波吸収体の電磁波吸収能を図20に示す。
熱ラミネート法により厚さ20μmのポリブチレンテレフタレート(PBT)フィルム(融点:220℃、ガラス転移温度:22℃)をアルミニウム層に接着した以外実施例1と同様にして、電磁波吸収フィルムを作製した。この電磁波吸収フィルムのPBTフィルム側に円錐状のエンボス加工を施した。エンボスの直径、深さ及び面積率はそれぞれ200μm、200μm及び40%であった。この電磁波吸収フィルムの電磁波吸収能を図21に示す。
厚さ16μmの二軸延伸PETフィルムの一面に真空蒸着法によりそれぞれ厚さ0.6μmの銅層及び厚さ0.2μmのニッケル層を形成してなる複合フィルムに、ロール2の周速を200 m/分とした以外実施例1と同様の方法で線状痕を形成した。得られた電磁波吸収フィルムの線状痕及び表面抵抗は以下の通りである。
幅Wの範囲:0.5~5μm
平均幅Wav:2μm
間隔Iの範囲:0.5~5μm
平均間隔Iav:2μm
平均長さLav:5mm
表面抵抗:150Ω/□(線状痕と垂直な方向)
:5Ω/□(線状痕と平行な方向)
この電磁波吸収フィルムの電磁波吸収能を図22に示す。
ニッケル層の厚さを0.3μmとし、ロール2の周速を300 m/分とした以外実施例6と同様にして、電磁波吸収フィルムを作製した。この電磁波吸収フィルムの表面抵抗は、線状痕と垂直な方向及び平行な方向でそれぞれ150Ω/□及び10Ω/□であった。この電磁波吸収フィルムの電磁波吸収能を図23に示す。
Claims (9)
- プラスチックフィルムと、その少なくとも一面に設けた単層又は多層の金属薄膜とを有し、前記金属薄膜に多数の実質的に平行で断続的な線状痕が不規則な幅及び間隔で形成されていることを特徴とする電磁波吸収フィルム。
- 請求項1に記載の電磁波吸収フィルムにおいて、前記金属薄膜がアルミニウム、銅、ニッケル又はこれらの合金からなることを特徴とする電磁波吸収フィルム。
- 請求項1又は2に記載の電磁波吸収フィルムにおいて、前記線状痕の幅は90%以上が0.1~1,000μmの範囲内にあって、平均1~100μmであり、前記線状痕の間隔は0.1μm~5mmの範囲内にあって、平均1~100μmであることを特徴とする電磁波吸収フィルム。
- 請求項1~3のいずれかに記載の電磁波吸収フィルムにおいて、前記金属薄膜がさらに多数の微細な穴を有することを特徴とする電磁波吸収フィルム。
- 複数枚の電磁波吸収フィルムからなる電磁波吸収体であって、前記電磁波吸収フィルムはプラスチックフィルムと、その少なくとも一面に設けた単層又は多層の金属薄膜とを有し、前記金属薄膜に多数の実質的に平行で断続的な線状痕が不規則な幅及び間隔で形成されており、複数の前記電磁波吸収フィルムは前記線状痕の配向が異なるように配置されていることを特徴とする電磁波吸収体。
- 請求項5に記載の電磁波吸収体において、複数枚の前記電磁波吸収フィルムの少なくとも1枚が波形であることを特徴とする電磁波吸収体。
- 請求項6に記載の電磁波吸収体において、最外側の一対の平坦な電磁波吸収フィルムと、前記平坦な電磁波吸収フィルムに挟まれた少なくとも一枚の波形の電磁波吸収フィルムとを有し、隣接する電磁波吸収フィルムは線状痕がほぼ直交するように配置されているとともに、接触部が接着されており、もって電磁波吸収能の異方性が抑制されているとともに自己支持性を有することを特徴とする電磁波吸収体。
- 少なくとも一枚の電磁波吸収フィルムと電磁波反射体とが誘電体層を介して配置され、前記電磁波吸収フィルムはプラスチックフィルムと、その少なくとも一面に設けた単層又は多層の金属薄膜とを有し、前記金属薄膜に多数の実質的に平行で断続的な線状痕が不規則な幅及び間隔で形成されていることを特徴とする電磁波吸収体。
- 請求項8に記載の電磁波吸収体において、前記電磁波反射体層が金属フィルム又は金属薄膜を形成したプラスチックフィルムであることを特徴とする電磁波吸収体。
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Cited By (8)
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WO2010093027A1 (ja) * | 2009-02-13 | 2010-08-19 | Kagawa Seiji | 線状痕付き金属薄膜-プラスチック複合フィルム及びその製造装置 |
US20110268925A1 (en) * | 2009-12-25 | 2011-11-03 | Seiji Kagawa | Composite electromagnetic-wave-absorbing film |
JP2011258715A (ja) * | 2010-06-08 | 2011-12-22 | Seiji Kagawa | 透明電磁波吸収フィルム |
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US9238351B2 (en) | 2009-02-13 | 2016-01-19 | Seiji Kagawa | Composite film of linearly-scratched, thin metal film and plastic film, and its production apparatus |
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JP4685977B2 (ja) * | 2009-02-13 | 2011-05-18 | 清二 加川 | 線状痕付き金属薄膜−プラスチック複合フィルム及びその製造装置 |
WO2010093027A1 (ja) * | 2009-02-13 | 2010-08-19 | Kagawa Seiji | 線状痕付き金属薄膜-プラスチック複合フィルム及びその製造装置 |
US9616640B2 (en) | 2009-02-13 | 2017-04-11 | Seiji Kagawa | Composite film of linearly-scratched, thin metal film and plastic film, and its production apparatus |
US20110268925A1 (en) * | 2009-12-25 | 2011-11-03 | Seiji Kagawa | Composite electromagnetic-wave-absorbing film |
US9326433B2 (en) * | 2009-12-25 | 2016-04-26 | Seiji Kagawa | Composite electromagnetic-wave-absorbing film |
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JP2012099665A (ja) * | 2010-11-02 | 2012-05-24 | Seiji Kagawa | 電磁波吸収体 |
JP5726903B2 (ja) * | 2010-12-27 | 2015-06-03 | 加川 清二 | 近傍界電磁波吸収体 |
WO2012090586A1 (ja) * | 2010-12-27 | 2012-07-05 | Kagawa Seiji | 近傍界電磁波吸収体 |
CN103718664A (zh) * | 2011-07-26 | 2014-04-09 | 加川清二 | 具有高散热性的电磁波吸收薄膜 |
CN103718664B (zh) * | 2011-07-26 | 2017-03-08 | 加川清二 | 具有高散热性的电磁波吸收薄膜 |
JP6023845B1 (ja) * | 2015-04-28 | 2016-11-09 | 加川 清二 | 電磁波吸収吸音パネル |
Also Published As
Publication number | Publication date |
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CN102067743B (zh) | 2014-02-19 |
CN102067743A (zh) | 2011-05-18 |
JPWO2009157544A1 (ja) | 2011-12-15 |
KR101572459B1 (ko) | 2015-11-27 |
TWI439224B (zh) | 2014-05-21 |
JP5038497B2 (ja) | 2012-10-03 |
KR20110033107A (ko) | 2011-03-30 |
EP2299795A4 (en) | 2012-12-19 |
EP2299795A1 (en) | 2011-03-23 |
TW201021688A (en) | 2010-06-01 |
EP2299795B1 (en) | 2014-01-01 |
US20110031008A1 (en) | 2011-02-10 |
US8598470B2 (en) | 2013-12-03 |
HK1151178A1 (en) | 2012-01-20 |
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