WO2009116649A1 - Copper alloy material for electric and electronic components - Google Patents

Abstract

Disclosed is a copper alloy material for electric and electronic components, which is a copper alloy material comprising 0.5-2.5 mass% Co and 0.1-1.0 mass% Si, wherein Co/Si = 3-5 (mass ratio), and the remainder of which is Cu and unavoidable impurities, and which is solution heat-treated at 800-960ºC, and at a temperature (ºC) lower than -122.77X² + 409.99X + 615.74 when the Co content (mass%) is X.

Description

Copper alloy material for electrical and electronic parts

The present invention relates to a copper alloy material applied to electric and electronic parts.

To date, brass (C2600), phosphor bronze (C5191, C5212, C5210), beryllium copper (C17200, C17530), and Corson alloy (C7025) have been used for connectors, terminals, relays, switches, etc. for electronic and electrical equipment. It has been.
In recent years, the frequency of currents used in electronic and electrical equipment in which these are used has increased, and the substantial electrical conductivity has been lowered due to the skin effect. Therefore, high conductivity is also required for materials. . Therefore, originally, brass and phosphor bronze have low conductivity, and the Corson copper alloy shows medium conductivity (EC≈40 to 50% IACS) as a connector material, but higher conductivity is required. Also, it is well known that beryllium copper has medium conductivity but is expensive, and beryllium is an environmentally hazardous substance, so that replacement with another copper alloy or the like is being studied. On the other hand, pure copper (C1100) and Sn-filled copper (C14410), which are highly conductive, have a drawback of low strength. Therefore, a copper alloy having electrical conductivity exceeding that of conventional Corson copper and equivalent tensile strength and bending workability is desired.
The above-mentioned Cxxxx is a type of copper alloy specified by JIS, and% IACS is an abbreviation for international annealed copper standard, and is a unit indicating the conductivity of a material.

Generally, conductivity and strength are contradictory properties, and there are various strengthening methods such as solid solution strengthening, work strengthening, and precipitation strengthening as methods for increasing strength. It is known that it is promising as a method for increasing strength without deteriorating. This precipitation strengthening is performed by high-temperature heat treatment of an alloy added with an element that causes precipitation, so that these elements are dissolved in the copper matrix phase, and then heat-treated at a temperature lower than that temperature to precipitate the dissolved element. It is a technique. For example, beryllium copper, Corson alloy, etc. employ the strengthening method.

Incidentally, in addition to the beryllium copper and the Corson alloy, alloys containing an intermetallic compound of cobalt (Co) and silicon (Si) in copper are also known. In addition, Co and Si that can produce a high-strength, high-conductivity material at a low cost, with a concentration lower than the conventional high-concentration CoSi copper alloy (Co content is 2 to 4 mass%, Si content is 1/4 of the Co content). And a copper alloy containing Mg, Sn, and Zn (see, for example, Patent Document 1).
In the production of the copper alloy described in Patent Document 1, a solution temperature is set high (for example, 950 ° C. in the embodiment of Patent Document 1), and a solid solution is sufficiently dissolved and precipitation hardening is performed by a heat treatment after that.
However, this method results in coarse crystal grains. In the alloy structure, it is known that if the crystal grain size is coarse, the bending workability is poor, and a conventional solution-treated copper alloy cannot obtain good bending workability.
JP-A 63-307232

An object of the present invention is to provide a copper alloy material for electrical and electronic parts, which can be suitably used for a product such as a connector that requires severe bending, and has excellent strength, electrical conductivity, and bending workability.

According to the present invention, the following means are provided:
(1) A copper alloy containing 0.5 to 2.5 mass% of Co, 0.1 to 1.0 mass% of Si, and Co / Si = 3 to 5 (mass ratio), with the balance being Cu and inevitable impurities The material was solution-treated at a temperature Ts (° C.) lower than −122.77X ² + 409.99X + 615.74 when the Co content (mass%) is X when the temperature is 800 ° C. or higher and 960 ° C. or lower. Copper alloy material for electrical and electronic parts,
(2) Co is contained at 0.5 to 2.5 mass%, Si at 0.1 to 1.0 mass%, and Co / Si = 3 to 5 (mass ratio), and further Cr, Mg, Mn, Sn, V A copper alloy material containing 0.01 to 1.0 mass% of one or more selected from the group consisting of Al, Fe, Ni, Ti, and Zr, with the balance being Cu and inevitable impurities, Electrical and electronically characterized by being solution-treated at a temperature Ts (° C.) lower than −94.643X ² + 329.999X + 67.0.09 when the Co content (mass%) is X when the temperature is not less than 960 ° C. and not more than 960 ° C. Copper alloy material for parts,
(3) The yield stress is 500 MPa or more and less than 650 MPa, the conductivity is 60% IACS or more, and the value (R / t) indicating the bending workability is less than 0.5 (1) or (2 ) Copper alloy material for electrical and electronic parts, and (4) yield stress is 650 MPa or more, conductivity is 50% IACS or more, and the value (R / t) indicating bending workability is less than 1.5 The copper alloy material for electrical and electronic parts according to item (1) or (2),
(5) Yield stress is 500 MPa or more and less than 650 MPa, conductivity is 60% IACS or more, and the value (R / t) indicating bending workability is both in the sample parallel to the rolling direction and the sample perpendicular to the rolling direction. The copper alloy material for electrical and electronic parts according to (1) or (2), wherein the copper alloy material is 1.2 or less,
(6) The yield stress is 650 MPa or more, the conductivity is 50% IACS or more, and the value (R / t) indicating the bending workability is 1. for both the sample parallel to the rolling direction and the sample perpendicular to the rolling direction. The copper alloy material for electrical and electronic parts as set forth in (1) or (2), which is 5 or less.
Here, the value (R / t) indicating the bending workability means that a sample with a plate width w = 10 (mm) of each plate thickness is taken out from the test material, and the surface is lightly rubbed with a metal polishing powder. After removing the wire, W-bending is performed so that the angle inside the bend is 90 °, [1] bending (GW) for a sample parallel to the rolling direction, and [2] bending for a sample perpendicular to the rolling direction. (BW) means a value R / t obtained by dividing the smallest bending radius R (mm) at which fine cracks do not occur by the sample plate thickness t (mm). In the present invention, the bending workability is evaluated by this value R / t.

The copper alloy material for electrical and electronic parts of the present invention is a copper alloy material excellent in strength, conductivity, and bending workability. The copper alloy material for electrical and electronic parts of the present invention can be suitably used for products with severe bending work such as connectors.
These and other features and advantages of the present invention will become more apparent from the following description.

A preferred embodiment of the alloy composition of the copper alloy material of the present invention will be described in detail below. The copper alloy material of the present invention is a copper alloy material having a specific shape, for example, a plate material, a strip material, a wire material, a rod material, a foil, and the like, and can be used for any electric / electronic component. Is not particularly limited, for example, suitable for connectors, terminal materials, etc., particularly high frequency relays and switches for which high conductivity is desired, or connectors, terminal materials and lead frames for automobiles Used.

In the copper alloy composition of the present invention, Co and Si are essential components. Co and Si in the copper alloy mainly form precipitates of Co ₂ Si intermetallic compounds to improve strength and conductivity.
Co is 0.2 to 2.5 mass%, preferably 0.3 to 2.0 mass%, more preferably 0.5 to 1.6 mass%, and Si is 0.1 to 1.0 mass%, preferably 0.1 It is -0.7 mass%, More preferably, it is 0.1-0.5 mass%. The reason for such definition is that, as described above, these mainly form precipitates of intermetallic compounds of Co ₂ Si and contribute to precipitation strengthening. If the Co content is less than 0.5 mass%, the precipitation strengthening amount is small, and if it exceeds 2.5 mass%, the effect is saturated. Further, the optimum addition ratio from the stoichiometric ratio of this compound was Co / Si≈4.2, and the addition amount of Si was determined so as to be within this range. It is preferable to adjust so as to be in the range of 0.0 to 5.0, more preferably 3.2 to 4.5. Hereinafter, Si and Co may be referred to as “additive element I”.
In the case of the copper alloy having the above composition, the solution treatment temperature Ts (° C.) is 800 ° C. or more and 960 ° C. or less, and when the Co content (mass%) is X, −122.77X ² + 409.99X + 615 The temperature is lower than 74 (° C.).

It is preferable to add one or more of Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and Zr to the copper alloy of the present invention, and the amount thereof is 0.01 to 1.0 mass%. Hereinafter, this Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and Zr may be referred to as “additive element II”.
If the additive amount of additive element II is less than 0.01% mass, the effect of addition is small, and if it exceeds 1.0 mass%, <1> the conductivity is significantly reduced in solid solution elements such as Mg, Mn, and Sn. <2> For elements that promote precipitation, such as Cr, V, Al, Fe, Ni, Ti, and Zr, the solution temperature of the solution decreases due to the decrease in strength due to precipitation other than aging or the increase in the solid solution temperature. This is because of the rise, and <3> Cr, Mg, Al, Ti, and Zr are difficult to cast due to significant oxidation.

Of these additive elements II, Cr, Ni, and Fe replace a part of Co in the main precipitation phase to form a Co—χ—Si compound (χ = Cr, Ni, Fe) to improve strength. There is a work to make.
Mg, Mn, and Sn have a function of strengthening the copper alloy by dissolving in the copper matrix. Mg and Mn also have an effect of improving hot workability.
V, Al, Ni, Ti, and Zr form a compound together with Co and Si to strengthen and suppress the coarsening of crystal grains.

A preferred method for producing a copper alloy material according to the present invention comprises the following steps. That is, melt casting → reheat treatment → hot rolling → cold rolling → solution treatment → aging heat treatment → final cold rolling → strain relief annealing. Aging heat treatment and final cold rolling may be performed in reverse order. Further, the final strain relief (low temperature) annealing may be omitted.

In the present invention, the solution treatment before the final rolling is performed at 800 ° C. or higher and 960 ° C. or lower.
Further, the solution treatment temperature Ts (° C.) is lower than −122.77X ² + 409.99X + 615.74 when the Co content (mass%) is X when the additive element II is not included. Temperature (° C.).
On the other hand, the solution treatment temperature Ts (° C.) is -94.643X ² + 329.99X + 677 when the Co content (mass%) is X when the additive element II is included in the above content. The temperature (° C.) is lower than 0.09.
The crystal grain size in the copper alloy material is determined by the heat treatment at this temperature.

In the present invention, it is preferable to perform rapid cooling (quenching) at a cooling rate of 50 ° C./second or more from the solution heat treatment temperature Ts. If the cooling rate during this cooling is too low, the elements dissolved at the high temperature may cause precipitation.
Thus, particles (compounds) that precipitate during cooling at a cooling rate that is too low (for example, at a cooling rate lower than 50 ° C./second) are non-coherent precipitates that do not contribute to strength. In addition, this inconsistent precipitate contributes as a nucleation site when a matched precipitate (Coherent Precipitate) is formed in the next aging heat treatment step, and promotes the precipitation of that portion, which may adversely affect the characteristics. is there.
Therefore, the cooling rate is preferably 50 ° C./second or more, more preferably 80 ° C./second or more, further preferably 100 ° C./second or more, and the fastest possible cooling rate within the practical upper limit. Is desirable.
In addition, this cooling rate means the average cooling rate from high temperature solution heat treatment temperature to 300 degreeC. Since a large tissue change does not occur at a temperature lower than 300 ° C., the cooling rate to this temperature may be appropriately controlled.

In this invention, in order to implement | achieve the characteristic of the copper alloy material of the said composition suitably, solution temperature is prescribed | regulated.
In the present invention, the crystal grain size is preferably 20 μm or less, more preferably 10 μm or less. The reason is that when the crystal grain size exceeds 20 μm, the grain boundary density is low due to the coarse grain size, and it is assumed that the workability deteriorates because the bending stress cannot be sufficiently absorbed. Although there is no restriction | limiting in particular in the minimum of a crystal grain diameter, Usually, it is 3 micrometers or more. The “crystal grain size” is a value measured based on JIS-H0501 (cutting method) described later.
The “size of the precipitate” here is an average size of the precipitate determined by the method described later.

In one preferred embodiment of the copper alloy material for electric and electronic parts of the present invention, the yield stress is 500 MPa or more and less than 650 MPa, the conductivity is 60% IACS or more, and the bending workability (R / t) is less than 0.5. It has characteristics. Here, the bending workability (R / t) of less than 0.5 means that the R / t value is less than 0.5 by bending at least a sample parallel to the rolling direction, and is parallel to the rolling direction. It is preferred that the R / t value be less than 0.5 for both the bending of a simple sample and the bending of a sample perpendicular to the rolling direction.
In another preferred embodiment of the copper alloy material for electric and electronic parts of the present invention, the yield stress is 650 MPa or more, the conductivity is 50% IACS or more, and the bending workability (R / t) is 1.5. It has the characteristics of less than. Here, the bending workability (R / t) of less than 1.5 means that the R / t value is less than 1.5 by bending at least a sample parallel to the rolling direction, and is parallel to the rolling direction. It is preferred that the R / t value is less than 1.5 for both the bending of a simple sample and the bending of a sample perpendicular to the rolling direction.
In another preferred embodiment of the copper alloy material for electrical and electronic parts of the present invention, the yield stress is 500 MPa or more and less than 650 MPa, the conductivity is 60% IACS or more, and a value indicating bending workability (R / t) has a characteristic of 1.2 or less (more preferably 1.0 or less, more preferably 0.6 or less) in both the bending for the sample parallel to the rolling direction and the bending for the sample perpendicular to the rolling direction. It is what you have.
In another preferred embodiment of the copper alloy material for electric and electronic parts according to the present invention, the yield stress is 650 MPa or more, the conductivity is 50% IACS or more, and the value (R / t) indicates bending workability. However, it has a characteristic of 1.5 or less (more preferably 1.2 or less) in both the bending of the sample parallel to the rolling direction and the bending of the sample perpendicular to the rolling direction.
As described above, the copper alloy material of the present invention having high conductivity, high strength, and excellent bending workability can be suitably used for electrical and electronic parts such as connectors that involve severe bending work.

Next, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

(Reference Example 1)
Alloys (Nos. 1 to 9) containing the components shown in Table 1 and the balance being Cu and inevitable impurities were melted in a high-frequency melting furnace, and these were cast at a cooling rate of 10 to 30 ° C./second, An ingot having a length of 180 mm, a width of 30 mm, and a height of 110 mm was obtained.
The obtained ingot was held at 1000 ° C. for 30 minutes and then processed to a thickness of 12 mm by hot rolling. After hot rolling, quenching was performed quickly with water cooling, and after surface chamfering to a thickness of about 10 mm for removal of the oxide film on the surface, it was processed by cold rolling. Thereafter, for the purpose of solution and recrystallization, heat treatment was performed while maintaining the temperature at 950 ° C. for 30 seconds, and quenching was quickly performed with water cooling.
At that time, the rate of temperature increase from room temperature to the maximum temperature was in the range of 10 to 50 ° C./second, and the cooling rate was in the range of 30 to 200 ° C./second.
Thereafter, the surface oxide film was removed, and cold rolling was performed as necessary. This also serves as acceleration of work hardening and precipitation hardening in the heat treatment of the next step.
Next, a heat treatment was performed at 525 ° C. for 120 minutes for the purpose of aging precipitation. In this case, the rate of temperature rise from room temperature to the maximum temperature is in the range of 3 to 25 ° C./min. When the temperature is lowered, the temperature is 300 ° C., which is sufficiently lower than the temperature range considered to affect precipitation. Until then, cooling was performed within the range of 1 ° C./min to 2 ° C./min in the furnace.
After the aging heat treatment, cold rolling was performed so that the plate thickness was reduced by 20%. Thicknesses of 0.10 mm, 0.15 mm, 0.20 mm, and 0.25 mm were prepared for each alloy.
Next, heat treatment was performed at 350 ° C. for 30 minutes. In this case, the rate of temperature rise from room temperature to the maximum temperature is in the range of 3 to 25 ° C./min. When the temperature is lowered, the temperature is 300 ° C., which is sufficiently lower than the temperature range considered to affect precipitation. Until then, cooling was performed within the range of 1 ° C./min to 2 ° C./min in the furnace.

Alloy no. Yield stress (YS), tensile strength (TS), and electrical conductivity (EC) were measured for the alloy materials 1 to 8 having a plate thickness of 0.20 mm by the following methods. The results are shown in Table 3. Alloy No. Regarding the alloy material No. 9, since the hot rolling due to crystallization and excessive precipitation was difficult and the final product could not be produced, the following measurement was not performed.
Yield stress and tensile strength measurement method: Two test pieces of JIS Z2201-5 cut out parallel to the rolling direction were measured in accordance with JIS Z2241, and the average value (MPa) was determined.
Note that the yield method was followed by the offset method. That is, the proof stress in the case of permanent elongation 0.2% was calculated using the formula of σ _0.2 = F _0.2 / A ₀ . Here, σ: Yield strength calculated by the offset method (N / mm ² ), F: A relationship diagram between the force and the amount of elongation was obtained using an extensometer, and the elongation axis corresponding to the specified permanent elongation (ε%) A parallel line is drawn from the upper point to the straight line portion in the initial stage of the test, and the force indicated by the point where the line intersects the diagram is obtained.
Conductivity measurement method: Specific resistance was measured by a four-terminal method in a constant temperature bath maintained at 20 ° C. (± 0.5 ° C.) to calculate conductivity (% IACS). The distance between terminals was 100 mm.

In this test, only strength and electrical conductivity were evaluated, so the processing temperature was 950 ° C. (Step F in Table 2 above) at which sufficient strength was obtained.
Alloy No. 1 satisfying the composition range defined in the present invention. From 1 to 5, an alloy material with excellent balance between strength and electrical conductivity was obtained.
On the other hand, Alloy No. with too little Co and Si content. In No. 6, precipitation hardening became small and strength was insufficient.
In addition, the alloy No. No. 9 was difficult to manufacture because product deterioration due to excessive oxide formation during dissolution, excessive precipitation, and ingot reheat cracking and hot rolling became difficult. Further, since a large amount of expensive Co is used, the alloy material is inferior in cost competitiveness.
Example of alloy No. in a range other than Co / Si = 3-5 In Nos. 7 and 8, the Co and Si solid solution elements that did not precipitate increased, resulting in a significant decrease in conductivity.

Example 1
The same as in Reference Example 1 except that an alloy containing the components shown in Table 4 and the balance consisting of Cu and inevitable impurities was used and the solution treatment temperature was changed to the temperatures of Steps A to H shown in Table 2. Thus, alloy materials of Invention Examples 1 to 3, 10 to 16, and Comparative Examples 1 to 3, and 18 to 22 were obtained. In addition, alloy no. 1-3 are alloy Nos. Shown in Table 1. It has the same composition as 1-3. In addition, Alloy No. 10 to 12 are alloy Nos. Shown in Table 1 and Table 4, respectively. 1 to 3 with Cr added within the specified range. Nos. 13 to 16 are alloy Nos. Shown in Tables 1 and 4. 3, Mg (No. 13), Sn (No. 14), Cr and Mg (No. 15), Cr and Ti (No. 16) are added within the prescribed ranges. Comparative Example Alloy Nos. 18 to 22 are alloy Nos. Shown in Tables 1 and 4. 3, Cr (No. 18), Ti (No. 19), Mg (No. 20), Sn (No. 21), Zr (No. 22) are added beyond the prescribed ranges. .

For the obtained alloy materials of Invention Examples 1 to 3, 10 to 16 and Comparative Examples 1 to 3, 18 to 22, as in Reference Example 1, yield stress (YS), tensile strength (TS), and Conductivity (EC) was measured. Further, the crystal grain size (GS) and bending workability (R / t) were measured based on the following methods. The results are shown in Table 5.
Grain size measurement method: After the cross section perpendicular to the rolling direction of the test piece is polished to a mirror surface by wet polishing and buffing, the polished surface is corroded with a solution of chromic acid: water = 1: 1 for several seconds, A photograph was taken at a magnification of 400 to 1000 times using the next electron image, and the average crystal grain size (μm) of the cross section was measured according to the cutting method of JIS-H-0501. The cross section was measured by a cross section in the rolling direction.
Bending workability evaluation: After removing the oxide film by lightly rubbing the surface of the specimen with a plate width w = 10 (mm) of each thickness with metal polishing powder, the angle inside the bending becomes 90 °. Such W-bending was performed in two types: bending for a sample parallel to the rolling direction (GOOD WAY: hereinafter GW) and bending for a sample perpendicular to the rolling direction (BAD WAY: hereinafter BW). Regarding the evaluation of bending, it was evaluated by R / t, which is a value obtained by dividing the smallest bending radius R at which no fine cracks occur by the sample plate thickness t.

In Invention Examples 1 to 3 in Table 5, when the solution treatment temperature Ts (° C.) is 800 ° C. or more and 960 ° C. or less and the Co content (mass%) is X, −122.77X ² +409 The temperature (° C.) is lower than .99X + 615.74. For this reason, it was possible to maintain a particle size of less than 20 μm and to obtain a copper alloy material having an excellent balance of strength, conductivity, and bendability.
Specifically, the yield stress was 500 MPa or more and less than 650 MPa, the electrical conductivity was 60% IACS or more, and the value (R / t) indicating bending workability was 1.0 or less for both GW and BW. In addition, there is an example in which the value (R / t) indicating bending workability is 0.6 or less for both GW and BW, and even less than 0.5, and the balance of strength, conductivity, and bendability is excellent. It was found that a copper alloy material was obtained.
On the other hand, even with the same composition, when the heat treatment at the temperature shown in Comparative Examples 1 to 3 is performed, the strength is equal to or higher than that of Examples 1 to 3, but the grain size becomes coarse, and Bending workability was inferior to Invention Examples 1 to 3. Moreover, the value (R / t) which shows bending workability showed the tendency to be inferior in BW rather than GW.
As shown in Table 5, in Comparative Example 3, in the treatment in which the solution temperature was lower than specified, a structure that did not recrystallize remained (shown in Table 5 as no crystal grain size value (−)), and In the treatment in which the solution temperature is higher than the specified value, the crystal grains are coarsened, and none of the good bending workability, which is a problem, can be maintained.

In Invention Examples 10 to 16 in Table 5, one or more of Cr, Mg, Mn, Sn, V, Zn, Al, Fe, Nb, Ni, Ti, and Zr are added (that is, the total amount of the additive element II is 0.01). -14.63% X ² + 329.9999 + 677.09 when the solution treatment temperature Ts (° C.) is 800 ° C. or more and 960 ° C. or less and the Co content (mass%) is X. Lower temperature (° C). For this reason, the particle size could be reduced to 20 μm or less by heat treatment at the same high temperature as in Reference Example 1, and had the same strength as Reference Example 1 and excellent bending workability. .
Specifically, for a sample having a yield stress of 500 MPa or more and less than 650 MPa and an electrical conductivity of 60% IACS or more, the value (R / t) indicating bending workability is 1.2 or less for both GW and BW. became. In addition, there was an example in which the value (R / t) indicating the bending workability was 1.0 or less, further 0.6 or less, and further less than 0.5 for both GW and BW. In addition, for a sample having a yield stress of 650 MPa or more and a conductivity of 50% IACS or more, the value (R / t) indicating the bending workability is 1.5 or less for both GW and BW, and further 1.2. It became the following. Thus, it was found that a copper alloy material having an excellent balance of strength, conductivity, and bendability was obtained.
Even when only Co and Si are added by the means of Reference Example 1 and the grain size can be controlled to 20 μm or less, further refinement of crystal grains can be promoted by adding the above metal, and superior bending properties Can be obtained.
On the other hand, in Comparative Examples 18 to 22 in which the amount of additive element II added exceeds 1%, the formation of oxide during casting and the difficulty of manufacturability due to excessive precipitation during high-temperature heat treatment occur. Further, in Comparative Example 21 in which the addition amount of the additive element II exceeds 1%, when the solid solution element is added, the conductivity is greatly lowered and the yield stress is less than 650 MPa, but the value of R / t is 1 in BW. .2 and was inferior in bending workability. Moreover, the value (R / t) which shows bending workability showed the tendency which is inferior in BW rather than GW.

The copper alloy material for electrical and electronic parts of the present invention includes connectors and terminal materials for electrical and electronic equipment, particularly high frequency relays and switches for which high conductivity is desired, or connectors and terminal materials for automobiles, etc. It is suitably used for electrical and electronic parts such as lead frames.

While this invention has been described in conjunction with its embodiments, we do not intend to limit our invention in any detail of the description unless otherwise specified and are contrary to the spirit and scope of the invention as set forth in the appended claims. I think it should be interpreted widely.

This application claims priority based on Japanese Patent Application No. 2008-074650 filed in Japan on March 21, 2008, which is hereby incorporated herein by reference. Capture as part.

Claims (6)

1. A copper alloy material containing 0.5 to 2.5 mass% of Co, 0.1 to 1.0 mass% of Si, and Co / Si = 3 to 5 (mass ratio), with the balance being Cu and inevitable impurities. And a solution treatment at a temperature Ts (° C.) lower than −122.77X ² + 4099.99X + 615.74 when the Co content (mass%) is X when the temperature is 800 ° C. or more and 960 ° C. or less. Copper alloy material for electrical and electronic parts.
2. Co containing 0.5 to 2.5 mass%, Si containing 0.1 to 1.0 mass%, and Co / Si = 3 to 5 (mass ratio), and further Cr, Mg, Mn, Sn, V, Al, A copper alloy material containing 0.01 to 1.0 mass% of one or more selected from the group consisting of Fe, Ni, Ti, and Zr, with the balance being Cu and inevitable impurities, 800 ° C. or higher and 960 ° C. Copper for electrical and electronic parts, characterized by a solution treatment at a temperature Ts (° C.) lower than −94.643X ² + 329.99X + 677.09 when the Co content (mass%) is X. Alloy material.
3. The yield stress is 500 MPa or more and less than 650 MPa, the electrical conductivity is 60% IACS or more, and the value (R / t) indicating the bending workability is less than 0.5. Copper alloy material for electrical and electronic parts.
4. 3. The electric / electronic apparatus according to claim 1, wherein the yield stress is 650 MPa or more, the electrical conductivity is 50% IACS or more, and the value (R / t) indicating bending workability is less than 1.5. Copper alloy material for parts.
5. The yield stress is 500 MPa or more and less than 650 MPa, the conductivity is 60% IACS or more, and the value (R / t) indicating the bending workability is 1.2 in both the sample parallel to the rolling direction and the sample perpendicular to the rolling direction. The copper alloy material for electric and electronic parts according to claim 1 or 2, wherein:
6. The yield stress is 650 MPa or more, the conductivity is 50% IACS or more, and the value (R / t) indicating the bending workability is 1.5 or less in both the sample parallel to the rolling direction and the sample perpendicular to the rolling direction. The copper alloy material for electrical and electronic parts according to claim 1 or 2, wherein the copper alloy material is provided.